JP6526808B2 - Mounting management device - Google Patents

Description

  The present invention relates to a mounting management device.

  DESCRIPTION OF RELATED ART Conventionally, the mounting management apparatus which manages the component mounting apparatus which picks up the components supplied from the component supply apparatus and mounts it in a board | substrate is known. As such a mounting management apparatus, one which displays an OEE (Overall Equipment Efficiency) defined by SEMI (Semiconductor Equipment and Materials International) is known (for example, Patent Document 1). OEE is a rough indicator of productivity. If OEE decreases, it can be determined that the availability (operating status) of the device, the performance of the device, or the quality (quality) is the cause of the decrease in productivity, but specifically which one is the decrease in productivity It is necessary to confirm the individual indicators to determine whether it is a factor of

JP 2012-330707 A

  By the way, in the component mounting apparatus, after producing a single type of component mounted substrate, when producing another single type of component mounted substrate, replace the component supply device or replace the nozzle for picking up the component. Work (setup change) occurs. In the case of high-mix low-volume production, when the time required for such setup change (plan change time) is increased, the downtime of the apparatus is increased and the productivity is reduced. In that case, there is a demand to make the downtime as short as possible. On the other hand, when mass-producing certain types of substrates, productivity may be improved if the cycle time per substrate is shortened as much as possible even if the setup change time is long. In that case, there is a demand for shortening the cycle time as much as possible. The cycle time varies depending on the recipe (production program). OEE reflects the length of down time, but does not reflect the quality of the recipe. Therefore, the index which also added the quality of the recipe was calculated | required.

  The present invention has been made to solve the above-mentioned problems, and its main object is to provide an indicator that involves both the length of downtime and the quality of the recipe.

The implementation management device of the present invention is
In a mounting management apparatus that manages a component mounting apparatus that picks up a component supplied from a component supply apparatus and mounts the component on a substrate,
Storage means for storing a formula for calculating a production index including recipe productivity of the component mounting apparatus and an element of downtime of the component mounting apparatus;
A control unit that calculates the production index based on the calculation formula and displays it on a display unit after the component mounting apparatus has produced a predetermined number of single type component mounted boards;
Is provided.

  In the mounting management apparatus according to the present invention, after the component mounting apparatus has produced a predetermined number of single-type component mounted boards, a formula for calculating a production index including recipe productivity of the component mounting apparatus and an element of downtime of the component mounting apparatus. The production index is calculated based on and displayed on the display means. The factors of downtime include, for example, at least one of setup change time, part waiting time, maintenance time, device error time, and the like. This production index is an index that involves both the length of downtime and the quality of the recipe. Therefore, the operator can determine the productivity of the component mounting apparatus by analyzing the one production index, including both the length of the downtime and the quality of the recipe productivity.

  In the mounting management apparatus of the present invention, the recipe productivity is a value calculated using a cycle time required for the component mounting apparatus to produce the single type of component mounted substrate, and the component mounting apparatus The ratio of the theoretical fastest cycle time to the cycle time of the recipe currently applied to the component mounting apparatus may be used. The cycle time is the time from when the substrate enters the component mounting apparatus to when it comes out. This makes it possible to quantify recipe productivity relatively easily. Here, the fastest cycle time may be, for example, the cycle time under the best conditions considering only production of a single type of component mounted substrate. Since the recipe applied to the component mounting device is generally created under the condition of considering producing another type of component mounted substrate back and forth, its cycle time is longer than the fastest cycle time. become longer.

  In the mounting management apparatus of the present invention, the recipe productivity is a value calculated using the number of productions of the single type of component mounted substrate per unit time by the component mounting apparatus, It may be a ratio between the standard value of the number of production per unit time of the device and the number of production per unit time of the recipe given to the component mounting device this time. Also in this way, it is possible to quantify the recipe productivity relatively easily. The standard value of the production number per unit time may be, for example, a value described in the catalog of the component mounting apparatus or a value according to the IPC standard. The number of productions per unit time of the recipe is a condition that takes into consideration the unique conditions of the board (combination of types of parts used, mounting positions of individual parts, etc.) and production of another type of part mounted board before and after Because it is a numerical value below, it becomes smaller than the standard value.

  In the implementation management device of the present invention, it is preferable that the calculation formula includes the availability used for OEE as an element of the downtime. Further, it is preferable that the calculation formula includes at least one of performance and quality used for OEE. In this way, although this production index is a new index, it is easily accepted widely by many producers because it uses elements used for OEE, which is widely used.

BRIEF DESCRIPTION OF THE DRAWINGS Schematic explanatory drawing of the component mounting system 1. FIG. FIG. 2 is a perspective view of the component mounting machine 10; The enlarged view of the rotary head 36. FIG. FIG. Flow chart of a new production index notification routine. Explanatory drawing of the time parameter relevant to production. The graph which shows the relationship between the jobs 1-3 and a new production index. The graph which shows the relationship between the jobs 1-3 and OEE.

  Preferred embodiments of the invention are described below with reference to the drawings. 1 is a schematic explanatory view of the component mounting system 1, FIG. 2 is a perspective view of the component mounter 10, FIG. 3 is an enlarged view of the rotary head 36, and FIG. 4 is a perspective view of the reel 42. In the present embodiment, the left-right direction (X axis), the front-rear direction (Y axis), and the up-down direction (Z axis) are as shown in FIG. 1 and FIG.

  As shown in FIG. 1, the component mounting system 1 includes a plurality of component mounters 10 that form the mounting line 2 and a mounting management device 80 that manages the production of a substrate. In the component mounting system 1, each component mounter 10 mounts a component on a substrate 12 carried in from the upstream side, and carries out the substrate 12 after component mounting.

  As shown in FIG. 2, the component mounting machine 10 includes a substrate transfer device 18, a head unit 34, a part camera 39, a feeder 40, a feeder setting table 60, and a mounting controller 70.

  The substrate transfer device 18 is provided with support plates 20, 20 provided at intervals in the front and back of FIG. 2 and extending in the left-right direction, and conveyor belts 22, 22 provided on opposing surfaces of both support plates 20, 20 (see FIG. Only one is shown in 1). The conveyor belts 22, 22 are endlessly wound around drive wheels and driven wheels provided on the left and right of the support plates 20, 20. The substrates 12 are placed on the top surfaces of the pair of conveyor belts 22 and conveyed from left to right. The substrate 12 is supported by a plurality of support pins 23 erected on the back surface side.

  The head unit 34 is detachably attached to the front surface of the X-axis slider 26. The head unit 34 has a handle 35 on the front side for the operator to grasp during replacement work. The X-axis slider 26 is slidably attached to a pair of upper and lower guide rails 28, 28 provided on the front surface of the Y-axis slider 30 and extending in the left-right direction. The Y-axis slider 30 is slidably attached to a pair of left and right guide rails 32, 32 extending in the front-rear direction. The head unit 34 moves in the left-right direction as the X-axis slider 26 moves in the left-right direction, and moves in the front-rear direction as the Y-axis slider 30 moves in the front-rear direction. Each slider 26, 30 is driven by a drive motor (not shown). The head unit 34 has a rotary head 36 having a plurality of suction nozzles 38, as shown in FIG. The suction nozzle 38 uses pressure to suction a component to the tip of the nozzle or separates a component sucked to the tip of the nozzle. The suction nozzle 38 can be adjusted in height by a Z-axis motor (not shown) mounted on the head unit 34. The suction nozzle 38 is appropriately replaced according to the type and size of the parts. In addition, the rotary head 36 is appropriately replaced by a rotary head provided with different numbers of suction nozzles or a head provided with one suction nozzle.

  The parts camera 39 is installed between the feeder setting table 60 and the substrate transfer device 18 and at the approximate center of the length in the left-right direction so that the imaging direction is upward. The parts camera 39 picks up a part sucked by the suction nozzle 38 passing above it, and outputs an image obtained by the shooting to the mounting controller 70.

  The feeder 40 rotatably holds the reels 42. As shown in FIG. 4, a tape 44 is wound around the reel 42. The tape 44 is formed with a plurality of recesses 46 aligned along the longitudinal direction of the tape 44. The components P are accommodated in the respective recesses 46. These parts P are protected by a film 48 covering the surface of the tape 44. A component suction position is defined in the feeder 40. The component suction position is a design-designated position at which the suction nozzle 38 suctions the component P. Each time the tape 44 is fed backward by a predetermined amount by the feeder 40, the components P accommodated in the tape 44 are sequentially disposed to the component suction position. The component P which has reached the component suction position is in a state in which the film 48 is peeled off, and is suctioned by the suction nozzle 38. The width of the tape 44 increases as the size of the component P increases, the width of the reel 42 increases as the width of the tape 44 increases, and the width of the feeder 40 increases as the width of the reel 42 increases. Therefore, the feeder 40 has various widths depending on the size of the part P.

  Although not shown, the feeder setting table 60 has a plurality of slots on the top surface. The slot is a groove extending along the Y axis. Rails (not shown) provided on the lower surface of the feeder 40 are inserted into the slots. Among the feeders 40, the narrow one occupies only one slot of the feeder set table 60, while the wide one occupies a plurality of slots.

  As shown in FIG. 2, the mounting controller 70 is configured as a microprocessor centered on a CPU, and includes a ROM for storing processing programs, an HDD for storing various data, a RAM used as a work area, and the like. These are electrically connected via a bus (not shown). The mounting controller 70 is connected to a feeder controller (not shown) of the feeder 40 and a mounting management device 80 so as to be capable of bi-directional communication. In addition, the mounting controller 70 is connected to be able to output control signals to the substrate transfer device 18, the X-axis slider 26, the Y-axis slider 30, the Z-axis motor, etc. It is done. For example, based on the recipe (production program) received from the mounting management device 80, the mounting controller 70 picks up the component P by the suction nozzle 38 from the component supply tape sent out to the component supply position by each feeder 40 The substrate transfer device 18, the X-axis slider 26, the Y-axis slider 30, the Z-axis motor and the like are controlled so as to be sequentially mounted on the upper predetermined position. Further, the mounting controller 70 determines whether or not a component is adsorbed by the suction nozzle 38 based on the image captured by the part camera 39, and determines the shape, size, adsorption position, etc. of the component.

  As shown in FIG. 1, the mounting management device 80 is a microprocessor that mainly has the CPU 81, and includes a ROM 82 for storing processing programs, an HDD 83 for storing substrate production programs, etc., and a RAM 84 used as a work area. . These are electrically connected via a bus (not shown). An input signal is input to the mounting management apparatus 80 from an input device 85 such as a mouse or a keyboard, and an image signal to the display 86 is output from the mounting management apparatus 80.

  Next, a new production index notification routine performed by the mounting management device 80 of the component mounting system 1 configured as described above will be described. FIG. 5 is a flowchart of a new production index notification routine. This routine is executed automatically or in response to the operator's activation request when the implementation line 2 has processed all the plurality of jobs. Hereinafter, the case where the mounting line 2 processes the jobs 1 to 3 will be described as an example, and this example will be described as appropriate. In job 1, 1000 pieces of component-mounted boards A of a single type are manufactured, and in job 2, 100 pieces of component-mounted boards B of a single type other than job 1 are manufactured. It is assumed that one hundred other component-mounted boards C of a single kind are manufactured. The component mounted boards A to C are substrates of different types, combinations, and numbers of parts to be mounted.

  When the new production index notification routine is started, the CPU 81 of the mounting management device 80 acquires a time parameter related to production of each job (step S100). For example, time parameters related to production are acquired for each of the jobs 1 to 3. Here, as shown in FIG. 6, the time parameters are production time, waiting time, engineering time, planned downtime, unplanned downtime and unplanned time, which are determined based on SEMI. The production time includes the time for mounting the component on the substrate and the loading time. The waiting time includes idle time, switch waiting time, waiting time for preceding process, and waiting time for following process. The engineering time is undefined (zero) in the present embodiment. Planned downtime includes parts waiting time, maintenance time, and setup change time. The setup change time is the time required for the work of attaching a feeder, a nozzle, or the like used for the job to each mounter 10 before starting the job. Unplanned downtime includes equipment error time. Unplanned time includes device off time and connection off time. Also, the production time is the sum of the production time and the waiting time. Equipment up time is the sum of manufacturing time and engineering time. The equipment downtime is the sum of planned downtime and unplanned downtime. The operating time is the sum of the device up time and the device down time. The total time is the sum of uptime and unplanned time.

  Subsequently, the CPU 81 calculates OEE of each job (step S200). For example, OEE is calculated for each of the jobs 1 to 3. Specifically, the CPU 81 calculates availability, performance and quality using equations (1) to (3), and then calculates OEE using equation (4). Here, the job cycle time refers to the time required for one board to enter the first mounter 10 of the mounting line 2 to move out of the final mounter 10, and the job cycle time in calculation is The job cycle time is the time obtained by simulation. The number of non-defective products refers to the number of productions minus the number of defective products (for example, the number of boards on which components are not properly mounted). For the waiting time, production time, total time and unplanned time, the values acquired in step S100 are used.

  Subsequently, the CPU 81 calculates recipe productivity of each job (step S300). For example, recipe productivity is calculated for each of the jobs 1 to 3. Specifically, the CPU 81 calculates the recipe productivity using the equation (5). Here, the fastest cycle time does not consider other jobs when mounting components on a substrate in one component mounter 10, that is, commonality of feeders with other jobs, commonality of suction nozzles, etc. The cycle time when mounting components under the best conditions without consideration. The cycle time is the time required for one substrate to enter and exit from one component mounter 10. The recipe is set to a condition lower than the best condition in consideration of other jobs, that is, commonality of feeder with other jobs, commonality of suction nozzles, etc., in mounting components on a board. Be done. Therefore, the cycle time of the recipe is the cycle time when the component is mounted under the condition. The recipe refers to a production program that defines what kind of feeder 40 is to be placed in each part mounting machine 10, where on the feeder setting stand 60, what kind of suction nozzle 38 is attached to the rotary head 36, etc. Say. When calculating the recipe productivity, the CPU 81 calculates the recipe productivity of the mounting machine having a bottleneck, ie, the mounting machine with the longest longest cycle time among the plurality of component mounting machines 10 constituting the mounting line 2.

  The suction nozzle 38 sucks the component supplied from the feeder 40, passes above the part camera 39, and then moves to a predetermined position of the substrate 12 to mount the component there. Therefore, the distance and time for the suction nozzle 38 to move are shorter as the feeder 40 is closer to the parts camera 39 and longer as the distance is longer. Taking this point into consideration, in job 1, if jobs 2 and 3 are not considered, feeder 40 for supplying the largest number of component types mounted on one substrate 12 is set to be closest to parts camera 39. It is considered best to set the feeder 40 of the part type so as to be farther from the part camera 39 as the number of mounted parts decreases. Further, in the job 1, if the jobs 2 and 3 are not considered, it is considered best to attach only the suction nozzle 38 used for the job 1 to the rotary head 36. The same applies to jobs 2 and 3. The fastest cycle time is the cycle time when mounting a component under these best conditions.

  On the other hand, since Jobs 1 to 3 are processed in this order, the feeder 40 and the suction nozzle 38 are reattached, ie, setup change is performed so as to be the best condition of the job before each job is processed. Replacement time (a factor of downtime) will be long. As a result, even if the time required to process each job is short, the time required to process all the jobs 1 to 3 may be rather long. This tendency is particularly pronounced when the production quantity of each job is small and the number of jobs is large. In consideration of such setup change time, for example, when processing job 1, it is better to attach the suction nozzle 38 used in jobs 2 and 3 and not used in job 1 to the rotary head 36 from the beginning There is a case. In addition, when processing job 1, it may be better to dispose a feeder 40 for supplying a component type with a high mounting frequency in jobs 2 and 3 near the parts camera 39. That is, considering jobs 1 to 3, the recipe may be set by adopting a condition that is not the best for each job. In that case, the cycle time of the recipe is longer than the fastest cycle time, but the time required to process all the jobs 1 to 3 may be short. The recipe productivity of equation (5) does not exceed 1 because the recipe cycle time is longer than the fastest cycle time. The fastest cycle time and the cycle time of the recipe can also be measured, or can be obtained by simulation if the performance of the component mounting machine 10 is known.

  Subsequently, the CPU 81 calculates a new production index of each job, and displays the result on the display 86 (step S400). Specifically, the CPU 81 calculates a new production index using Expression (6). Also, the CPU 81 displays the result on the display 86 in a graph as shown in FIG. 7, for example. The display method of the new production index is not limited to the graph, and may be displayed, for example, in a list.

  Next, how to use the new production index is explained. It is assumed that the results shown in Table 1 below are obtained for Jobs 1 to 3. If OEE which is a conventional index is graphed, it will become like FIG. The operator who sees this determines that the productivity for the jobs 2 and 3 is low, but it is not necessary to improve the job 1 in particular. However, when a new production index in which the recipe productivity is added is graphed, it becomes as shown in FIG. The operator who sees this determines that improvement is necessary including job 1. That is, the operator can appropriately determine the necessity of improvement of each job only by confirming the new production index instead of confirming various factors.

  By the way, in addition to the new production index, the CPU 81 displays numerical values of various elements (availability, performance, quality, recipe productivity, etc.) on the display 86 as shown in Table 1. The format for displaying numerical values is not limited to the tabular format, and may be, for example, a graph. The operator confirms the numerical values of these factors for the job that it is determined that improvement is necessary based on the new production index, and specifically determines where to improve. From Table 1, for job 1, it is determined that it is necessary to improve the recipe productivity, and changes in the recipe are considered. With regard to job 2, it is determined that the availability needs to be improved, and improvements such as abnormal stop of the device (improvement of the device downtime) are considered. For job 3, it is judged that improvement of performance is necessary, and improvement of delay due to re-suction (recovery) of parts due to suction error of parts or defect of suction parts is considered (improvement of manufacturing time).

  Here, the mounting management device 80 of this embodiment corresponds to the mounting management device of the present invention, the feeder 40 corresponds to the component supply device, the component mounter 10 corresponds to the component mounting device, and the HDD 83 corresponds to the storage means. The CPU 81 corresponds to a control unit.

  According to the mounting management apparatus 80 of the present embodiment described above, after the component mounter 10 has produced a predetermined number of single-type component-mounted boards, the recipe productivity of the component mounter 10 and the downtime of the component mounter 10 The new production index including the elements of and is calculated and displayed on the display 86. This new production index is an index that involves both the length of downtime and the quality of the recipe. Therefore, the operator can determine the productivity of the mounter 10 by analyzing the one new production index, including both the length of the down time and the quality of the recipe productivity.

  Also, the recipe productivity is a value calculated using the cycle time required for the component mounter 10 to produce a single type of component-mounted substrate, and the theoretical fastest cycle time of the component mounter 10 It is the ratio to the cycle time of the recipe given to the component mounting machine this time. Therefore, it is possible to quantify recipe productivity relatively easily.

  Furthermore, the formula for recipe productivity includes all of availability, performance, and quality used for OEE as an element of downtime. Therefore, although this new production index is a new index, it is easy to be widely accepted by many producers because it uses elements used for OEE, which is widely used.

  Furthermore, OEE and recipe productivity may produce contradictory results, or they may produce interlocking results. Since the new production index is an index that judges OEE and recipe productivity comprehensively, the operator can use this new production index to check the overall productivity while changing production conditions or production conditions. it can.

  It is needless to say that the present invention is not limited to the above-mentioned embodiment at all, and can be implemented in various modes within the technical scope of the present invention.

  In the above-described embodiment, the new production index is the product of OEE and recipe productivity, but the new production index may be the product of OEE availability and recipe productivity. Alternatively, the new production index may be the product of OEE performance and recipe productivity, or may be the product of OEE availability and OEE performance and recipe productivity. Further, not only the product but also a sum or a ratio (fraction) may be used.

  In the embodiment described above, the recipe productivity of the bottleneck component mounter 10 among the plurality of component mounters 10 constituting the mounting line 2 is used as the recipe productivity of each job. You may use sex. In that case, the recipe productivity is determined by using the time from when the substrate enters the first component mounter 10 of the mounting line 2 to when the substrate comes out from the last component mounter 10 as cycle time. In this way, the productivity of the mounting line 2 can be determined.

Although the recipe productivity is calculated using equation (5) in the embodiment described above, it may be calculated using equation (5 ') below. In Formula (5 '), CPH is chip per hour and shows the number of chips produced per hour. The CPH of the standard is a CPH in a catalog, an IPC standard, or the like. Also in this case, it is possible to quantify the recipe productivity relatively easily.
Recipe productivity = (CPH of recipe) / (CPH of standard) ... (5 ')

  Although the case where a new production index is displayed on display 86 was illustrated in the embodiment mentioned above, it may notify by sound instead or in addition to it.

  The present invention is applicable to a mounting management device that manages a component mounting device that picks up components supplied from a component supply device and mounts the components on a substrate.

DESCRIPTION OF SYMBOLS 1 component mounting system, 2 mounting lines, 10 component mounting machines, 12 substrates, 18 substrates conveyance apparatus, 20 support plates, 22 conveyor belts, 23 support pins, 26 X axis sliders, 28 guide rails, 30 Y axis sliders, 32 guides Rails, 34 head units, 35 handles, 36 rotary heads, 38 suction nozzles, 39 parts cameras, 40 feeders, 42 reels, 44 tapes, 46 recesses, 48 films, 60 feeder set bases, 70 mounting controllers, 80 mounting management devices, 81 CPU, 82 ROM, 83 HDD, 84 RAM, 85 input devices, 86 display.

Claims (4)

In a mounting management apparatus that manages a component mounting apparatus that picks up a component supplied from a component supply apparatus and mounts the component on a substrate,
Storage means for storing a formula for calculating a production index including recipe productivity of the component mounting apparatus and an element of downtime of the component mounting apparatus;
A control unit that calculates the production index based on the calculation formula and displays it on a display unit after the component mounting apparatus has produced a predetermined number of single type component mounted boards;
Equipped with
The recipe productivity is a value calculated using the cycle time required for the component mounting apparatus to produce the single type of component mounted substrate, and is the theoretical fastest cycle time of the component mounting apparatus The ratio to the cycle time of the recipe applied to the component mounting apparatus this time,
Implementation management device. In a mounting management apparatus that manages a component mounting apparatus that picks up a component supplied from a component supply apparatus and mounts the component on a substrate,
Storage means for storing a formula for calculating a production index including recipe productivity of the component mounting apparatus and an element of downtime of the component mounting apparatus;
A control unit that calculates the production index based on the calculation formula and displays it on a display unit after the component mounting apparatus has produced a predetermined number of single type component mounted boards;
Equipped with
The recipe productivity is a value calculated using the number of productions in which the component mounting apparatus produces the single type of component mounted substrate per unit time, and the production number per unit time of the component mounting apparatus The ratio between the standard value of and the number of productions per unit time of the recipe currently applied to the component mounting apparatus,
Implementation management device. The formula includes the availability used for OEE as an element of the downtime.
Implementation management apparatus according to claim 1 or 2. The formula includes at least one of performance and quality used for OEE.
The mounting management apparatus according to any one of claims 1 to 3 .

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