JP5963873B2 - Production plan decision system - Google Patents

Description

  The present invention relates to a technique for determining a production plan in a production line for producing component mounting boards and the like.

  2. Description of the Related Art A component mounting line that mounts components such as electronic components on a substrate to produce a component mounting substrate produces the component mounting substrate by sequentially executing component mounting in a plurality of component mounting apparatuses arranged side by side. The production plan in this type of component mounting line determines that the cycle time for producing the component mounting board is within the set time. In the past, studies have been made on how to shorten the cycle time, and efficiency has been demanded.

  For example, in Patent Document 1, the arrangement order of component cassettes and component tapes for supplying components to be mounted on a component mounting apparatus is determined, and the mounting order of components is determined so as not to waste time as much as possible. Thus, a technique capable of realizing improvement in cycle time has been proposed.

JP 2002-50900 A

  However, if the cycle time of the cream solder printing device or the reflow furnace arranged before and after the component mounting apparatus is longer than the cycle time of the component mounting apparatus, the component mounting apparatus becomes a bottleneck in manufacturing the component mounting board. Not. For this reason, not only the effort of shortening the cycle time in the component mounting apparatus is wasted, but also the power consumption of the component mounting apparatus that is operating to shorten the cycle time in the component mounting apparatus is increased. there were.

  This invention is made | formed in view of such a situation, and it aims at providing the technique which can reduce the power consumption of a component mounting apparatus.

  The invention according to claim 1, which has been made to solve the above-described problem, is a production plan determination system in a component mounting apparatus that mounts a plurality of components on a board by a plurality of component mounting machines, each of the component mounting machines. An error rate acquisition means for acquiring a component mounter error rate that is an error rate of the component, and a component that selects one or more of the component mounters from all the component mounters based on the component mounter error rate Selection means for executing mounting machine selection processing; component mounting machine cycle time acquisition means for acquiring a component mounting machine cycle time that is a cycle time of each of the component mounting machines after execution of the component mounting machine selection processing; and the component mounting An external cycle time acquisition means for acquiring an external cycle time which is a cycle time of at least one of the pre-process and post-process of the apparatus, and Means, as the longest cycle time of each said component mounting machine cycle time does not exceed the device outside the cycle time, selects the minimum of the component mounter from among each said component mounting machine.

  In this way, the selection means selects the minimum component mounter from among the component mounters so that the longest cycle time of each component mounter cycle time does not exceed the cycle time outside the apparatus. Thereby, since the minimum component mounting machine is selected, the power consumption of a component mounting apparatus can be reduced. In addition, since the component mounting apparatus after the component mounter is selected does not become a bottleneck in the component mounting line, the production efficiency of the component mounting line does not deteriorate.

  In addition, since the number of component mounters that operate is reduced, the work range of the worker is reduced in the work such as replenishment of parts to each component supply device of each component mounter, and the work amount of the worker can be reduced. it can.

  If the selection means excludes a component mounter with a high error rate from the selection targets, the component mounter with a high error rate is not operated, and therefore the occurrence of defective products can be suppressed. In addition, since the operation of the component mounter with a high error rate is stopped, the component mounter can be maintained.

  According to a second aspect of the present invention, in the first aspect, when the longest cycle time among the component mounter cycle times after the execution of the component mounter selection process is shorter than the cycle time outside the apparatus, the error The rate acquisition unit acquires a component element error rate that is an error rate of a plurality of elements constituting the component mounter, and the selection unit selects one of all the elements based on the component element error rate. Or an element selection process for selecting a plurality of the elements, and the component mounter cycle time acquisition means acquires a component mounter cycle time that is a cycle time of each of the component mounters after the element selection process is executed, The selecting means selects the longest cycle time among the component mounting machines so that the longest cycle time of the component mounting machines does not exceed the cycle time outside the apparatus. Selecting the elements of the limit.

  In this way, the selection means selects the minimum element from each element so that the longest cycle time of each component mounter cycle time does not exceed the cycle time outside the apparatus. Thereby, since the minimum element is selected, the power consumption of the component mounting apparatus can be reduced. In addition, since the component mounting apparatus after the minimum elements are selected does not become a bottleneck in the component mounting line, the production efficiency of the component mounting line does not deteriorate.

  If the selection unit excludes an element with a high error rate from the selection target, an element with a high error rate is not operated, so that the occurrence of defective products can be suppressed. In addition, since the operation of an element with a high error rate is stopped, the element can be maintained.

It is explanatory drawing of a component mounting line. It is a perspective view of a component mounting machine. It is a block diagram of a production plan determination system. It is a flowchart of the production plan determination process which is a program which a production plan determination system performs. It is explanatory drawing of the process which selects the component mounting machine to operate | move. It is a flowchart of the component mounting machine selection process which is a subroutine of a production plan determination process. It is a flowchart of the element selection process which is a subroutine of a production plan determination process. It is explanatory drawing of the process which selects the element to operate.

(Component mounting line)
Hereinafter, embodiments of the present invention will be described with reference to the drawings. As shown in FIG. 1, the component mounting line 1000 includes a cream solder printer 1, a cream solder inspection device 2, a component mounting device 3, a reflow furnace 4, and a reflow inspection device 5, which are arranged in this order. The substrate is sequentially conveyed by the conveying devices (not shown) through the devices 1 to 5 constituting the component mounting line 1000 described above.

  The cream solder printer 1 is an apparatus that prints cream solder on a substrate. The cream solder inspection apparatus 2 is an apparatus that inspects whether or not the cream solder printed on the substrate in the cream solder printer 1 is properly printed.

  The component mounting apparatus 3 includes a plurality of component mounters 100A to 100F. Components such as electronic components are sequentially mounted on the substrate by the component mounting machines 100A to 100F. Specific configurations of the component mounters 100A to 100F will be described in detail later.

  The reflow furnace 4 melts the cream solder printed on the substrate by heating the substrate on which the cream solder is printed and the component is mounted, and the lead of the component is bonded to the pattern formed on the substrate with the cream solder. Is.

  The reflow inspection apparatus 5 is an apparatus for inspecting whether or not the lead is properly bonded to the pattern in the reflow furnace 4.

(Component mounting machine)
Next, the component mounter 100 will be described with reference to FIG. In the following description, the substrate transport direction is referred to as the X-axis direction, the direction perpendicular to the X-axis direction in the horizontal plane is referred to as the Y-axis direction, and the direction perpendicular to the X-axis direction and the Y-axis direction is referred to as the Z-axis. It is called a direction. A plurality of component mounting machines 100A to 100F shown in FIG. 1 are arranged in series in the X-axis direction to constitute a component mounting apparatus 3 (shown in FIG. 1). Each of the component mounting machines 100 </ b> A to 100 </ b> F includes a board transfer device 10, a component supply device 20, and a component mounting device 40.

  The component supply device 20 includes a plurality of slots 22 and a plurality of feeders 21 that are detachably attached to the slots 22. A plurality of slots 22 are provided in series in the X-axis direction in the component supply apparatus 20. A reel 23 is detachably held on the feeder 21. The reel 23 is wound with a tape (not shown) in which a large number of parts are accommodated in a row at intervals.

  A sprocket (not shown) is rotatably supported in the feeder 21. The outer peripheral portion of the sprocket engages with a feed hole formed in the tape. The feeder 21 is provided with a motor (not shown) that is a drive source for rotating the sprocket.

  The tape wound around the reel 23 is sent out one pitch at a time by the rotation of the sprocket. Then, the components accommodated in the tape are sequentially supplied to the component supply position 21 a provided at the tip of the feeder 21. The component supplied to the component supply position 21a is sucked by a suction nozzle 47 of a component mounting device 40 described later and mounted on the substrate positioned at the component mounting position by the substrate transport device 10.

  The substrate transfer device 10 includes transfer devices 11 and 12. A pair of guide rails 13 a and 13 b are provided on the carrier 41 and 12 on the base 41 of the component mounting device 40, respectively. Further, the conveying devices 11 and 12 are provided with a pair of unillustrated conveyor belts that support and convey the substrates guided by the guide rails 13a and 13b, respectively. In addition, the substrate transport apparatus 10 is provided with an unillustrated clamp device that lifts and clamps the substrate transported to a predetermined position.

  In this board conveying device 10, a board on which a component is mounted is carried to a part mounting position in the X-axis direction by a conveyor belt while being guided by guide rails 13a and 13b. The board conveyed to the component mounting position is positioned and clamped at the component mounting position by the clamp device.

  As shown in FIG. 1, the component mounting apparatus 40 includes a guide rail 42, a Y-axis slide 43, a Y-axis servo motor 44, an X-axis slide 45, an X-axis servo motor (not shown), a suction nozzle 47, and a component mounting head 48. have.

  The guide robot 42, the Y-axis slide 43, and the Y-axis servo motor 44 constitute a Y robot. The guide rail 42 is mounted on the base 41 in the Y direction and is disposed above the substrate transfer device 10 and the component supply device 20. The Y-axis slide 43 is provided so as to be movable along the guide rail 42 in the Y-axis direction. The Y-axis slide 43 is moved in the Y-axis direction by a ball screw mechanism having a ball screw connected to the output shaft of the Y-axis servo motor 44.

  An X robot is composed of the X axis slide 45 and the X axis servo motor. The X-axis slide 45 is provided on the Y-axis slide 43 so as to be movable in the X-axis direction. The Y-axis slide 43 is provided with an X-axis servo motor. The X-axis slide 45 is moved in the X-axis direction by a ball screw mechanism (not shown) connected to the output shaft of the X-axis servomotor.

  A component mounting head 48 is provided on the X-axis slide 45. As shown in FIG. 8, the component mounting head 48 holds a plurality of suction nozzles 47 in a detachable manner. The suction nozzle 47 sucks parts.

(Production plan decision system)
Next, the production plan determination system 500 of this embodiment will be described with reference to FIG. As shown in FIG. 3, the production plan determination system 500 includes a CPU 501, a RAM 502, a storage unit 503 configured by a ROM, a nonvolatile memory, and the like, an input / output interface 504, and a notification device 506. These are connected to each other via a bus. The CPU 501 executes a program corresponding to the flowcharts shown in FIGS. 4, 6, and 7. The RAM 502 temporarily stores variables necessary for executing the program. The storage unit 503 stores the program.

  An operation unit 505 and a notification device 506 are connected to the input / output interface 504. The operation unit 505 is for an operator to operate the production plan determination system 500. The operation unit 505 includes a key board, a pointing device such as a mouse, a touch panel, and the like. The notification device 506 notifies the worker of the result determined by the production plan determination system 500. The notification device 506 includes a display and a speaker.

  The input / output IF 504 is communicably connected to the cream solder printer 1, the cream solder inspection device 2, the component mounting apparatuses 100 </ b> A to 100 </ b> F, the reflow furnace 4, and the reflow inspection device 5. The input / output IF 504 acquires a “cycle time” to be described later from each of the devices 1 to 5 configuring the component mounting line 1000, and acquires an “error rate” to be described later from each of the component mounting equipment 100A to 100F.

(Outline of production plan determination method)
The time from when a substrate is carried into each device 1 to 5 constituting the substrate mounting line 1000 until it is carried out is referred to as “cycle time” of each device 1 to 5. The “cycle time” of each device 1 to 5 varies depending on each device 1 to 5.

  The “cycle time” of each of the component mounters 100A to 100F also varies depending on the component mounters 100A to 100F. However, the “cycle time” of the component mounting apparatus 3 is the longest “cycle time” among the “cycle times” of the component mounting machines 100A to 100F. This is because the component mounters 100A to 100F having the longest “cycle time” become a bottleneck when the components are sequentially transported to the component mounters 100A to 100F.

  That is, even if the mounting of the component on the board by the component mounting machine 100 with a short “cycle time” is completed, if the “cycle time” of the next component mounting machine 100 is long, the next component mounting machine 100 This is because before the board is transferred, the next component mounter 100 must wait for the board to be transferred.

  As shown in FIG. 1, the “cycle time” of the cream solder printer 1 and the cream solder inspection apparatus 2 that are the pre-process of the component mounting apparatus 3, the reflow furnace 4 and the reflow inspection apparatus that are the post-process apparatuses of the component mounting apparatus 3 The “cycle time” of 5 is constant regardless of the type of component mounting board to be produced, and is determined in advance.

  However, the “cycle time” of each of the component mounting machines 100A to 100F constituting the component mounting apparatus 3 varies depending on the component mounting board to be produced. When any one or more of the component mounters 100A to 100F are stopped to produce a component mount board, all the “cycle times” of the component mounters 100A to 100F that are operating are all This is longer than when the component mounting machines 100A to 100F are operated.

  When one or more of the “elements” (for example, the suction nozzle 47) constituting each component mounting machine 100A to 100F are stopped to produce a component mounting board, each of the component mounting machines 100A to 100F The “cycle time” is longer than when all “elements” are operated.

  As shown in FIG. 1, among the devices constituting the component mounting line 1000, the “cycle time” of each of the devices 1, 2, 4, 5 except the component mounting device 3 (hereinafter referred to as “external cycle time” as appropriate). The longest “cycle time” (hereinafter abbreviated as “bottleneck cycle time”) (15 seconds in the example of FIG. 1) is the “cycle time” (in the example of FIG. 1) of the component mounting apparatus 3. 6 seconds), even if the operation of any one or more of the component mounting machines 100A to 100F is stopped, the “cycle time” of the component mounting apparatus 3 does not exceed the “bottleneck cycle time”. The production efficiency of the component mounting line 1000 does not decrease.

  Similarly, even if one or more of the “elements” constituting each of the component mounting machines 100A to 100F are stopped, as long as the “cycle time” of the component mounting apparatus 3 does not exceed the “bottleneck cycle time”, The production efficiency of the component mounting line 1000 does not decrease. The present invention has been made based on such knowledge. Details will be described below.

(Production plan decision processing)
The “production plan determination process”, which is a program executed by the production plan determination system 500, will be described below using the flowchart of FIG. When the operator starts the “production plan determination process” by operating the operation unit 505, the program proceeds to S1.

  In S <b> 1, the production plan determination system 500 executes “component mounter selection process” for selecting the minimum product mounters 100 </ b> A to 100 </ b> F to be operated. This “component mounter selection process” will be described below with reference to the flowchart shown in FIG.

  When the “component mounter selection process” starts, in S11, the production plan determination system 500 acquires the “external cycle time” of each of the devices 1, 2, 4, and 5. When S11 ends, the program proceeds to S12.

  In S12, the production plan determination system 500 acquires the “error rate” of each of the component mounters 100A to 100F. The “error rate” is a total ratio of errors such as component adsorption errors and component mounting errors in the component mounting machines 100A to 100F. When S12 ends, the program proceeds to S13.

  In S13, the production plan determination system 500 calculates the “cycle time” of the component mounting apparatus 3 (executes optimization of the component mounting apparatus 3). Specifically, as shown in FIG. 5A, the production plan determination system 500 excludes component mounters 100A to 100F whose “error rate” is larger than a predetermined value. Then, the production plan determination system 500 calculates each “cycle time” of the remaining component mounters 100A to 100F on the assumption that only the remaining component mounters 100A to 100F are operating. The production plan determination system 500 sets the longest “cycle time” among the “cycle times” of the remaining component mounting machines 100 </ b> A to 100 </ b> F as the “cycle time” of the component mounting apparatus 3. When S13 ends, the program proceeds to S14.

  In S <b> 14, when the production plan determination system 500 determines that the “cycle time” of the component mounting apparatus 3 does not exceed the “bottleneck cycle time” that is the longest “cycle time” of the “external cycle time”. (S14: YES), the program proceeds to S21. If it is determined that the “cycle time” of the component mounting apparatus 3 exceeds the “bottleneck cycle time” (S14: NO), the program proceeds to S23.

  In S <b> 21, the production plan determination system 500 reduces the “error rate” for excluding the component mounting machines 100 </ b> A to 100 </ b> F compared with the previous “cycle time” calculation process of the component mounting apparatus 3, and The component mounters 100A to 100F having an “error rate” larger than a predetermined value are excluded. Then, the production plan determination system 500 calculates each “cycle time” of the remaining component mounters 100A to 100F on the assumption that only the remaining component mounters 100A to 100F are operating. Then, since the number of component mounters 100A to 100F that operate is reduced as compared with the previous “cycle time” calculation process of the component mounter 3, each “cycle time” of the remaining component mounters 100A to 100F is longer. Become. As a result, the “cycle time” of the component mounting apparatus 3 becomes longer. When S21 ends, the program proceeds to S22.

  In S22, when the production plan determination system 500 determines that the “cycle time” of the component mounting apparatus 3 exceeds the “bottleneck cycle time” (S22: YES), the program proceeds to S23, and the component mounting apparatus 3 When it is determined that the “cycle time” does not exceed the “bottleneck cycle time” (S22: NO), the program is returned to S21.

  In S <b> 23, as shown in FIG. 5B, the production plan determination system 500 excludes the component mounting machines 100 </ b> A to 100 </ b> F from the “cycle time” calculation process of the previous component mounting apparatus 3. After increasing the “error rate”, the component mounters 100A to 100F having the “error rate” larger than a predetermined value are excluded. Then, the production plan determination system 500 calculates each “cycle time” of the remaining component mounters 100A to 100F on the assumption that only the remaining component mounters 100A to 100F are operating. Then, compared to the previous “cycle time” calculation process of the component mounting apparatus 3, the number of component mounting machines 100A to 100F that operate is increased, so that each “cycle time” of the remaining component mounting machines 100A to 100F is shortened. As a result, the “cycle time” of the component mounting apparatus 3 is shortened. When S23 ends, the program proceeds to S24.

  In S24, if the production plan determination system 500 determines that the “cycle time” of the component mounting apparatus 3 does not exceed the “bottleneck cycle time” (S24: YES), the program proceeds to S25, and the component mounting apparatus When it is determined that the “cycle time” of 3 exceeds the “bottleneck cycle time” (S24: NO), the program is returned to S23.

  In S25, the production plan determination system 500 selects the combination of the component mounters 100A to 100F determined as YES in S24 as the minimum component mounters 100A to 100F to be operated, and stores them in the storage unit 503. When S25 ends, the “component mounter selection process” ends, and the program proceeds to S2 in FIG.

  In S2, the production plan determination system 500 executes “element selection processing” for selecting the minimum “element” to be operated for the component mounting machines 100A to 100F selected in S1. This “element selection process” will be described with reference to the flowchart shown in FIG.

  When the “element selection process” starts, in S52, the production plan determination system 500 acquires the “error rate” of each “element” constituting each of the component mounters 100A to 100F. In this embodiment, as shown in FIG. 8, the “element” is the suction nozzle 47, and the “error rate” is a suction error rate at the suction nozzle 47. When S52 ends, the program proceeds to S53.

  In S53, the production plan determination system 500 calculates the “cycle time” of the component mounting apparatus 3. Specifically, as shown in FIG. 8A, the production plan determination system 500 excludes the suction nozzles 47 whose “error rate” is larger than a predetermined value and operates the remaining suction nozzles 47. Each “cycle time” of each of the component mounting machines 100A to 100F selected in S25 of FIG. 6 is calculated. Note that if the number of suction nozzles 47 to be operated is reduced to mount components on the board, the “cycle time” of each of the component mounting machines 100A to 100F becomes longer. The production plan determination system 500 sets the longest “cycle time” among the “cycle times” of the remaining component mounting machines 100 </ b> A to 100 </ b> F as the “cycle time” of the component mounting apparatus 3. When S53 ends, the program proceeds to S54.

  In S54, if the production plan determination system 500 determines that the “cycle time” of the component mounting apparatus 3 does not exceed the “bottleneck cycle time” (S54: YES), the program proceeds to S61, and the component mounting apparatus When it is determined that the “cycle time” of 3 exceeds the “bottleneck cycle time” (S54: NO), the program proceeds to S63.

  In S <b> 61, the production plan determination system 500 lowers the “error rate” for excluding the suction nozzle 47 and compares the “error rate” with respect to the “cycle time” calculation process of the previous component mounting apparatus 3. Are excluded from the suction nozzle 47. Then, the production plan determination system 500 calculates each “cycle time” of each of the component mounting machines 100A to 100F selected in S25 of FIG. 6 when the remaining suction nozzle 47 is operated. Then, compared with the “cycle time” calculation process of the previous component mounting apparatus 3, the number of suction nozzles 47 that operate is reduced, and thus each “cycle time” of the component mounting machines 100 </ b> A to 100 </ b> F becomes longer. As a result, the “cycle time” of the component mounting apparatus 3 becomes longer. When S61 ends, the program proceeds to S62.

  In S62, when the production plan determination system 500 determines that the “cycle time” of the component mounting apparatus 3 exceeds the “bottleneck cycle time” (S62: YES), the program proceeds to S63, and the component mounting apparatus 3 If it is determined that the “cycle time” does not exceed the “bottleneck cycle time” (S62: NO), the program is returned to S61.

  In S <b> 63, as shown in FIG. 8B, the production plan determination system 500 compares the “cycle time” calculation process of the component mounting apparatus 3 with the “error rate” for excluding the suction nozzle 47. And the suction nozzle 47 whose “error rate” is larger than a predetermined value is excluded. Then, the production plan determination system 500 calculates each “cycle time” of each of the component mounting machines 100A to 100F selected in S25 of FIG. 6 when the remaining suction nozzle 47 is operated. Then, compared to the previous “cycle time” calculation process of the component mounting apparatus 3, the number of suction nozzles 47 that operate is increased, and thus each “cycle time” of the component mounting machines 100 </ b> A to 100 </ b> F is shortened. As a result, the “cycle time” of the component mounting apparatus 3 is shortened. When S63 ends, the program proceeds to S64.

  In S <b> 65, the production plan determination system 500 selects the combination of the suction nozzles 47 determined as YES in S <b> 64 as the minimum suction nozzle 47 to be operated, and stores it in the storage unit 503. When S65 ends, the “element selection process” ends, and the process proceeds to S3 in FIG.

  In S <b> 3, the production plan determination system 500 notifies the selected component mounters 100 </ b> A to 100 </ b> F selected in S <b> 1 and the suction nozzle 47 selected in S <b> 2 using the notification device 506. When S3 ends, the “production plan determination process” ends.

  As described above, when the “production plan determination process” is executed, the minimum component mounters 100A to 100F are selected so as not to exceed the “bottleneck cycle time”, and each selected component mounter 100A is further selected. The minimum suction nozzle 47 is selected at ~ 100F.

(Effect of this embodiment)
As is clear from the above description, the production plan determination system 500 (selecting means) executes the “component mounter selection process” shown in FIG. 6 to determine the “cycle time” of each of the component mounters 100A to 100F. Among the actual components 100A to 100F, the “cycle time” of the component mounting apparatus 3 that is the longest “cycle time” does not exceed the longest “bottleneck cycle time” of the “non-device cycle time”. The minimum component mounters 100A to 100F are selected. Thereby, since the minimum component mounting machines 100A to 100F to be operated are selected, the power consumption of the component mounting apparatus 3 can be reduced. Further, the component mounting apparatus 3 after the component mounting machines 100A to 100F are selected does not become a bottleneck in the component mounting line 1000, and the production efficiency of the component mounting line 1000 does not deteriorate.

  In addition, since the number of component mounting machines 100A to 100F that operate is reduced, the work range of the worker is reduced in the work such as replenishment of parts to the component supply devices 20 of the component mounting machines 100A to 100F. The amount of work can be reduced.

  In addition, since the production plan determination system 500 excludes the component mounters 100A to 100F having a high “error rate” from the selection targets, the component mounters 100A to 100F having a high “error rate” are not operated. Generation of non-defective products can be suppressed. In addition, since the operation of the component mounters 100A to 100F having a high “error rate” is stopped, the component mounters 100A to 100F can be maintained.

  Further, the production plan determination system 500 is configured so that the “cycle time” of the component mounting apparatus 3 does not exceed the “bottleneck cycle time” in the “element selection process” shown in FIG. The minimum suction nozzle 47 is selected from among them. Thereby, since the minimum suction nozzle 47 is selected, the power consumption of the component mounting apparatus 3 can be reduced. Further, since the component mounting apparatus 3 after the minimum suction nozzle 47 is selected does not become a bottleneck in the component mounting line 1000, the production efficiency of the component mounting line 1000 does not deteriorate.

  In addition, since the production plan determination system 500 excludes the suction nozzle 47 having a high error rate from the selection target, the suction nozzle 47 having a high “error rate” is not operated, so that the generation of defective products can be suppressed. it can. In addition, since the operation of the suction nozzle 47 having a high “error rate” is stopped, the suction nozzle 47 can be maintained.

(Other embodiments)
In the embodiment described above, the production plan determination system 500, via the input / output interface 504, “cycle time outside the apparatus”, “cycle time” of each of the component mounting machines 100A to 100F, and each of the component mounting machines 100A to 100F. The “error rate” and the “error rate” of each suction nozzle 47 are acquired. However, when the operator operates the operation unit 505, “cycle time outside the apparatus”, “cycle time” of each of the component mounting machines 100A to 100F, “error rate” of each of the component mounting machines 100A to 100F, and each suction In the embodiment, the “error rate” of the nozzle 47 is input to the production plan determination system 500. In the case of this embodiment, the input / output interface 504 may not be communicably connected to the devices 1 to 5.

  In the embodiment described above, the “element” selected in the “element selection process” shown in FIG. However, the “element” to be selected is not limited to this, and may be, for example, the feeder 21, the transport apparatuses 11 and 12, the component mounting head 48, and the like. Needless to say, technical ideas are applicable.

  In the embodiment described above, the component mounting line 1000 includes the devices 1 and 2 in the pre-process of the component mounting apparatus 3 and the devices 4 and 5 in the post-process of the component mounting apparatus 3. However, even if the component mounting line 1000 includes only one of the devices 1 and 2 in the previous process of the component mounting device 3 and the devices 4 and 5 in the subsequent process of the component mounting device 3, There is no problem.

  DESCRIPTION OF SYMBOLS 1 ... Cream solder printer (pre-process apparatus), 2 ... Cream solder inspection apparatus (pre-process apparatus), 3 ... Component mounting apparatus, 4 ... Reflow furnace (post process apparatus), 5 ... Reflow inspection apparatus (post process apparatus), DESCRIPTION OF SYMBOLS 11 ... Conveying device (element), 12 ... Conveying device (element), 20 ... Component supply device (element), 47 ... Adsorption nozzle (element), 48 ... Component mounting head (element), 100A-100F ... Component mounting machine, 500 ... Production plan determination system (selection means, component mounter cycle time acquisition means, external cycle time acquisition means), 1000 ... component mounting line

Claims (2)

A production plan determination system in a component mounting apparatus that mounts a plurality of components on a substrate by a plurality of component mounting machines,
Error rate acquisition means for acquiring a component mounter error rate that is an error rate of each of the component mounters;
A selection means for executing a component mounter selection process for selecting one or a plurality of the component mounters from all the component mounters based on the component mounter error rate;
Component mounter cycle time acquisition means for acquiring a component mounter cycle time that is a cycle time of each of the component mounters after the component mounter selection process is executed,
An external cycle time acquisition means for acquiring an external cycle time which is a cycle time of at least one of a pre-process and a post-process of the component mounting apparatus;
The selection means selects a minimum of the component mounters from the component mounters so that the longest cycle time of the component mounter cycle times does not exceed the cycle time outside the apparatus. Decision system. In claim 1,
When the longest cycle time of each of the component mounter cycle times after executing the component mounter selection process is shorter than the cycle time outside the apparatus,
The error rate acquisition means acquires a component element error rate, which is an error rate of a plurality of elements constituting the component mounter,
The selection means performs an element selection process for selecting one or a plurality of the elements from all the elements based on the component error rate,
The component mounter cycle time acquisition means acquires a component mounter cycle time that is a cycle time of each of the component mounters after the element selection process is executed,
The said selection means is the production plan determination system which selects the said minimum element from each said element so that the longest cycle time among each said component mounting machine cycle time may not exceed the said apparatus outside cycle time.

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