JP5697438B2 - Mounting system - Google Patents

Description

  The present invention relates to a mounting system.

  As one type of mounting system, one disclosed in Patent Document 1 is known. As shown in the prior art of Patent Document 1, in the production of a multi-chip board, in order to leave a production history of each circuit on each split board (which part of which circuit is mounted where) It is necessary to attach an identification code to each circuit, read it for each circuit before production, and leave the read identification code, the component, and the mounting location as a history when mounting the component. In this conventional method, since it is necessary to read all the identification codes attached to each divided board, when the number of divided boards (number of circuits) is large, the time required for reading increases, resulting in an increase in production time. It had the problem that it ended up.

  To solve this problem, as shown in FIGS. 1 to 4 of Patent Document 1, “in the production history management of the circuits on the individual divided substrates 11 to 14 obtained by dividing the multi-sided substrate 10, A board identification code 20 is attached to the multi-sided board, and a circuit identification code 22 including a part of the board identification code is attached to each split board. When mounting a component, the board is not read without reading the individual circuit identification code. Only the identification code is read, the board identification code, the component, and the mounting location are left as a history, and the history information at the time of component mounting can be retrieved from the circuit identification code even after separation into individual split boards. Is disclosed.

  As another type of mounting system, one disclosed in Patent Document 2 is known. As shown in FIG. 3 of Patent Document 2, “a temporary ID is assigned to each child board in step S10, and traceability information is stored while electronic components are mounted on each child board in steps S11 and S12. After steps S11 and S12 have been completed for each child board, the temporary ID is replaced with the identification ID in steps S14 and S15, and a two-dimensional code representing this identification ID is printed on each child board. " .

JP 2007-42934 A JP 2008-282964 A

  In the mounting system described in Patent Document 1, when the circuit identification code 22 is a seal type, if the circuit identification code 22 is installed incorrectly, there is a problem in that it is impossible to trace the product history.

  Further, in the mounting system described in Patent Document 2, although the identification number of the sub board is printed after the component mounting operation is completed, it is possible to suppress the occurrence of a mounting error and the like, but a printing device is separately required, and the mounting system is enlarged. There is a problem of high cost.

  The present invention has been made to solve the above-described problems. The product history can be reliably traced, and the parent divided into a plurality of sub-boards can be obtained without increasing the size and cost of the mounting system. An object of the present invention is to suppress the production time of the entire mounting system by efficiently reading the identification number of the sub board when mounting on the board.

In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that the substrate transport that is provided on the base and transports the parent substrate that is divided into a plurality of sub-substrates and is positioned and supported at the component mounting position. A parent that is divided into a plurality of sub-boards that are supported by the device and movably supported in two directions of the X and Y directions and that are supplied by the component supply device and are positioned and supported at the component mounting position. An electronic component mounting machine comprising: a component transfer device mounted on a substrate; and an imaging device that images the parent substrate supported so as to be movable in two directions, X and Y, with respect to the base. An electronic component mounting system in which a plurality of units are arranged in series along a direction and a component is mounted on a parent board by a plurality of electronic component mounting machines, and each sub board is attached to each of a plurality of sub boards. Child board identification code to identify and multiple units Selected child mounter share a short electronic component mounting apparatus of sharing mounting time required for mounting components performed among the read representative electronic component mounting apparatus, a plurality of child boards by the imaging device of the reading charge electronic component mounting apparatus A control device that reads the attached sub board identification code, and at the start of production, the control device selects the electronic component mounting machine in charge of reading based on the assumed shared mounting time, and reads the electronic component mounting machine in charge On the other hand, after the start of production, the reading responsible electronic component mounting machine is selected on the basis of the actually measured shared mounting time, and the reading board electronic component mounting machine is provided with the child board identifying code. An implementation system characterized by having it read .

The feature in construction of the invention according to claim 2, Oite to claim 1, the controller is to be read by sharing the daughter board identification code to a plurality imaging device for an electronic component mounting apparatus .

According to the invention according to claim 1 configured as described above, a plurality of electronic component mounting machines are arranged in series along the conveyance direction of the main board, and components are mounted on the main board divided into a plurality of sub boards. In an electronic component mounting system that is shared by a plurality of electronic component mounting machines, the control device reads the shared mounting time required for mounting the component that is shared among the multiple electronic component mounting machines, and mounts the electronic component in charge This is selected as a machine , and the child board identification codes attached to the plurality of child boards are read by the imaging device of the short electronic component mounting machine of the electronic component mounting machine in charge of reading. As a result, when the shared mounting time of each electronic component mounting machine is long or short, the electronic component mounting machine having a long shared mounting time can be dedicated to component mounting without reading the child board identification code. Furthermore, the electronic component mounting machine with a short shared mounting time can mount the components and read the child board identification code. That is, an electronic component mounter with a short shared mounting time after component mounting is completed can read the child board identification code using the time until the electronic component mounter with a long shared mounting time completes component mounting. . Therefore, when mounting on a parent board that is divided into multiple child boards, it is efficient to read the identification number of the child board with an electronic component mounter that has a short shared mounting time without causing an increase in the size and cost of the mounting system. By performing well, the production time of the entire mounting system can be suppressed. Further, when the slave board identification code is a seal type, even if the seal is incorrectly attached, the code can be recorded in association with the slave board, and even if the seal is not attached, the slave board is treated as defective. Therefore, when the child board identification code can be read reliably, the child board identification code and the child board to which the code is attached can be recorded in association with each other, so that the product history can be traced reliably.
Furthermore, at the start of production, the control device selects a reading electronic component mounting machine based on the assumed shared mounting time, and causes the reading electronic component mounting machine to read the slave board identification code. Selects a reading charge electronic component mounting machine based on the actually measured shared mounting time, and causes the reading charge electronic component mounting machine to read the child board identification code. Thus, after the start of production, the identification number of the child board can be read more efficiently by determining the electronic component mounting machine that reads the child board identification code according to the actual mounting state.

According to the invention of claim 2 constructed as described above, Oite to claim 1, the controller to read and share the daughter board identification code to a plurality imaging device for an electronic component mounting apparatus. Thereby, since the sub board identification code can be read not only by one electronic component mounting machine but also by a plurality of electronic component mounting machines, the identification number of the sub board can be read more efficiently.

1 is a schematic diagram showing an electronic component mounting system according to the present invention. It is a top view which shows the parent board | substrate shown in FIG. It is a perspective view which shows the whole structure of the electronic component mounting machine shown in FIG. It is a fragmentary perspective view which shows the imaging device shown in FIG. It is a functional block diagram which shows the electronic component mounting machine shown in FIG. It is a functional block diagram which shows the host computer shown in FIG. It is a flowchart showing the program run in the control part shown in FIG. It is a figure for demonstrating selection of the reading charge electronic component mounting machine.

  Hereinafter, an embodiment of an electronic component mounting system according to the present invention will be described. FIG. 1 shows an outline of the electronic component mounting system A, FIG. 2 is a diagram showing a parent board on which the electronic component is mounted in the electronic component mounting system A, and FIG. 3 is an overall structure of the electronic component mounting machine. Is shown. FIG. 3 shows a state in which two electronic component mounting machines are mounted on one frame.

  The electronic component mounting system A is configured by arranging a plurality of electronic component mounting machines 20, that is, four first to fourth electronic component mounting machines 11 to 14 in this embodiment in series along the conveyance direction of the parent substrate S. Has been. The electronic component mounting system A performs mounting of electronic components (components) on the parent substrate S by sharing with each electronic component mounting machine 20 (first to fourth electronic component mounting machines 11 to 14).

  The electronic component mounting system A further includes a carry-in shift device 15, a carry-out shift device 16, a local network (hereinafter referred to as LAN) 17, and a host computer 18. The carry-in shift device 15 is arranged upstream of the first electronic component mounting machine 11 and carries the parent substrate S into the first electronic component mounting machine 11. The carry-out shift device 16 is arranged downstream of the fourth electronic component mounting machine 14 and carries out the parent substrate S from the fourth electronic component mounting machine 14. The LAN 17 connects the control devices 80 of the electronic component mounting machines 11 to 14 and the host computer 18 so that they can communicate with each other.

  As shown in FIG. 2, the parent substrate S is a substrate that is divided into a plurality of child substrates Sa. A parent substrate identification code Ms for identifying the parent substrate S is attached to the parent substrate S in an area outside the range of the child substrate Sa. The wiring pattern of the sub board Sa is the same, and the electronic components mounted on each sub board Sa are also the same. The child board Sa is assigned with a child board identification code Msa for identifying the child board Sa. The parent board identification code Ms and the child board identification code Msa are indicated by, for example, a bar code or a two-dimensional code, and may be a label type (seal type) or a type printed (engraved) directly by a laser or the like. . The sub board Sa is separated from the main board S after the mounting of the electronic components is completed.

  As shown in FIG. 3, the electronic component mounting machine 20 is a so-called double track conveyor type electronic component mounting machine, and includes a substrate transfer device 30, a backup device 40, a component supply device 50, a component transfer device 60, and an imaging device 70. And a control device 80.

  The board transfer device 30 is provided on the base 21 and transfers the parent board S to be positioned and supported at the component mounting position. The component mounting position is a position where the parent substrate S is positioned and fixed in order to mount an electronic component on the parent substrate S.

  The substrate transport device 30 transports the parent substrate S in a predetermined direction (X direction in FIG. 3), and includes first and second conveyors 31 and 32 assembled in parallel to each other on the base 21. .

  As shown in FIG. 3, the first conveyor 31 includes first and second guide rails 31 a and 31 b that extend in the transport direction and are arranged to face each other in parallel. The rails 31a and 31b guide the parent substrate S in the transport direction. The first conveyor 31 is provided with first and second conveyor belts (not shown) provided in parallel to each other immediately below the first and second guide rails 31a and 31b. The first and second conveyor belts support the parent substrate S from below and transport it in the transport direction.

  The first guide rail 31a and the first conveyor belt of the first conveyor 31 are elongated first extending in the X-axis direction with both ends fixed to the upper ends of a pair of fixed support frames 31e whose lower ends are fixed to the base 21. It is attached to the attachment frame 31f. Further, the second guide rail 31b and the second conveyor belt of the first conveyor 31 are arranged on the upper end of a moving support frame 31g fixed to a slider 31k movable on a pair of rails 22 having lower ends fixed to the base 21. The both ends are fixed to an elongated second mounting frame 31h extending in the X-axis direction. As a result, the second guide rail 31b moves and moves along the direction (Y direction) perpendicular to the transport direction together with the second conveyor belt directly below, so that the first conveyor 31 is connected to the parent substrate S to be transported. The conveyor width can be changed according to the substrate width.

  The second conveyor 32 differs from the first conveyor 31 only in that the first attachment frame 32f is movable, and has the same structure as the first conveyor 31. That is, as shown in FIG. 3, the second conveyor 32 includes first and second guide rails 32 a and 32 b that extend in the transport direction and are arranged in parallel with each other. The two guide rails 32a and 32b guide the parent substrate S in the transport direction. The second conveyor 32 is provided with first and second conveyor belts (not shown) provided in parallel to each other immediately below the first and second guide rails 32a and 32b. The first and second conveyor belts support the parent substrate S and transport it in the transport direction.

  As shown in FIG. 3, the first guide rail 32 a and the first conveyor belt of the second conveyor 32 are fixed to a slider 32 k that is movable on a pair of rails 22 whose lower ends are fixed to the base 21. The frame 32e is attached to an elongated first attachment frame 32f extending in the X-axis direction with both ends fixed to the upper end of the frame 32e. Further, the second guide rail 32b and the second conveyor belt of the first conveyor 31 are arranged on the upper end of a moving support frame 32g fixed to a slider 32k movable on a pair of rails 22 having lower ends fixed to the base 21. The both ends are fixed to an elongated second mounting frame 32h extending in the X-axis direction. As a result, the first and second guide rails 32a and 32b are moved and fixed in the direction (Y direction) perpendicular to the conveying direction together with the first and second conveyor belts directly below, so that the second conveyor 32 is The conveyor width can be changed corresponding to the substrate width of the parent substrate S to be transferred.

  The backup device 40 is positioned on and fixed to the parent substrate S provided on the base 21 and transported to the component mounting position in cooperation with the substrate transport device 30. The backup device 40 pushes up and clamps (positions and supports) the parent substrate S transported to the component mounting position by the substrate transport device 30.

  The backup device 40 includes a substrate support unit 41 that supports the parent substrate S and a lifting device (not shown) that lifts and lowers the substrate support unit 41. The substrate support unit 41 includes a rectangular backup plate 41a having a large number of planting holes 41a1 formed on the upper surface, and a backup pin which is a support unit that is planted so as to be inserted into and removed from the planting hole 41a1 and supports the parent substrate S. (Not shown). The lifting device is composed of an air cylinder, and includes a rod (not shown) in which the four corners of the backup plate 41a are detachably assembled, and a cylinder body (not shown) for moving the rod back and forth.

  The component supply device 50 is provided on one side of the substrate transport device 30 on the base 21 and supplies electronic components to be mounted on the parent substrate S. The component supply device 50 includes a large number of detachable cassette feeders (component supply cassettes) 51 arranged in parallel. The cassette type feeder 51 includes a main body 51a, a supply reel 51b provided at the rear of the main body 51a, and a component take-out part 51c provided at the tip of the main body 51a. An elongated tape (not shown) in which electronic components are enclosed at a predetermined pitch is wound and held on the supply reel 51b. This tape is pulled out at a predetermined pitch by a sprocket (not shown), and the electronic component is released from the enclosed state. The components are sequentially sent to the component take-out portion 51c. The component supply device 50 is not only a cassette type but also a tray type in which electronic components are arranged on a tray.

  The component transfer device 60 is supported above the devices 30, 40, and 50 so as to be movable in two directions of the X direction and the Y direction with respect to the base 21. The component transfer device 60 mounts the electronic component supplied by the component supply device 50 on the parent substrate S that is attracted and held (collected) by the mounting head 64 and positioned and supported at the component mounting position by the substrate transport device 30. (Implement.

  In this embodiment, the component transfer device 60 is of the XY robot type and includes a Y-direction moving slider 62 that is moved in the Y direction by a Y-axis servomotor 61. The Y-direction moving slider 62 is provided with an X-direction moving slider 63 that is moved in a horizontal X direction orthogonal to the Y direction by an X-axis servomotor (not shown). Mounted on the X-direction moving slider 63 is a mounting head 64 that is supported so as to be able to move up and down in the Z direction perpendicular to the X direction and the Y direction and that is controlled by a servo motor via a ball screw. The mounting head 64 is provided with a suction nozzle 65 (see FIG. 1) that protrudes downward from the mounting head 64 and that holds electronic components by suction.

  The imaging device 70 is supported by the base 21 so as to be movable in two directions of the X direction and the Y direction, and images the parent substrate S. In the present embodiment, the imaging device 70 is attached to the X-direction moving slider 63 together with the mounting head 64 as shown in FIG. The imaging device 70 images the substrate in order to recognize the substrate position (for example, a fiducial mark provided on the substrate). The imaging device 70 includes a light 71 and a camera 72. The light 71 is arranged to irradiate downward. The camera 72 is arranged with the lens facing downward.

  The control device 80 includes a microcomputer (not shown), and the microcomputer includes an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected through a bus. The CPU controls the mounting of electronic components on the board by executing a predetermined program. The RAM temporarily stores variables necessary for executing the program, and the ROM stores the program.

  As shown in FIG. 5, the control device 80 includes an input device 81, an imaging device 70, a communication device 82, a storage device 83, a substrate transfer device 30, a backup device 40, a component supply device 50, a component transfer device 60, and an output. A device 84 is connected. The input device 81 includes a start switch for starting operation of the electronic component mounting machine 20, a stop switch for stopping the operation, and the like (see FIG. 3). The communication device 82 is connected to an external device and inputs / outputs data with each other, and is connected to the host computer 18 via the LAN 17. The storage device 83 is a system program for controlling the entire electronic component mounting machine 20, a control program for individually controlling each element of the apparatus on the system program, a production program transmitted from the host computer 18, and the electronic component mounting machine. Stores information on whether or not the electronic component mounting machine reads the child board identification code Msa. The output device 84 displays status information and warnings of the electronic component mounting machine 20.

  The host computer 18 creates an optimized production program for each electronic component mounting machine 20, controls the operation of each electronic component mounting machine 20, and controls production information (for example, each electronic component mounting machine 20). , And the electronic component mounting machine 20 that reads the child board identification number is selected. The mounting time is the time required to mount the electronic components per board, and is the last from the time when the first electronic component is mounted on the parent substrate S positioned and fixed at the component mounting position. This is the time until the completion of mounting the electronic component.

  As shown in FIG. 6, the host computer 18 includes a control unit 18 a (control device), and a communication unit 18 b connected to the control unit 18 a is connected to each electronic component mounting machine 20 via the LAN 17. . The control unit 18a includes a microcomputer (not shown), and the microcomputer includes an input / output interface, a CPU, a RAM, and a ROM (all not shown) connected through a bus. The CPU executes a predetermined program to execute control that controls the operation of each electronic component mounting machine 20. The RAM temporarily stores variables necessary for executing the program, and the ROM stores the program.

  An input unit 18c, an output unit 18d, a rewritable storage unit 18e, an electronic component mounting machine registration processing unit 18f, an electronic component mounting machine production control unit 18g, and an information capturing unit 18h are connected to the control unit 18a. . The input unit 18c is used by an operator to input necessary information and data. The output unit 18d displays and prints various states related to control. The storage unit 18e stores information related to the operation status acquired from each electronic component mounting machine 20, for example, the number of components consumed, the number of components used per board, the mounting time (production time) per board, and the planned number of sheets to be produced. The number of produced boards, production management information, production history, and the like are stored. The electronic component mounting machine registration processing unit 18f performs a registration process when changing the line organization of each electronic component mounting line that is comprehensively managed by the host computer 18. The changed latest line knitting data is stored in the storage unit 18e. The electronic component mounting machine production control unit 18g controls the operation of each electronic component mounting machine 20 in an integrated manner (in cooperation). The information fetching unit 18h includes information on the state (operation status) of each electronic component mounting machine 20 (for example, the number of parts consumed, the number of parts used per board, the mounting time per board, the planned number of boards, The number of substrates produced).

  Next, the operation of the electronic component mounting system A configured as described above will be described with reference to the flowchart of FIG.

  The host computer 18 creates a production program for each electronic component mounting machine 20. Specifically, when there is an instruction to create a production program, the control unit 18a of the host computer 18 determines “YES” in step 102 and creates a production program in step 104. When there is no production program creation instruction, the control unit 18a repeats the determination of “NO” in step 102.

  In step 104, the control unit 18a optimizes the mounting order, the arrangement position of the component supply feeder, and the like in order to minimize the shared mounting time of each electronic component mounting machine 20 based on the input information and input data by the operator. To create a production program. Further, the control unit 18a sets the electronic component mounting machine 20 having the shortest of the divided mounting times of the calculated electronic component mounting machine 20 as the electronic component mounting machine 20 in charge of reading the child board identification code Msa. Select.

  When the selection of the electronic component mounting machine responsible for creating the production program and reading the child board identification code Msa (hereinafter referred to as the reading electronic component mounting machine) is completed, the control unit 18a determines “YES” in step 106. In step 108, the previously created production program is transmitted to each electronic component mounting machine 20. Further, in step 110, the control unit 18a transmits to the reading electronic component mounting machine an instruction to read the slave board identification code Msa in addition to the production program.

  Each electronic component mounting machine 20 mounts electronic components based on the received production program. The electronic component mounting machine 20 designated as the reading electronic component mounting machine further reads the sub board identification codes Msa of all the sub boards Sa by the imaging device 70 after mounting the electronic parts to be mounted. The order of the mounting process and the slave board identification code reading process may be the mounting process first or the reading process first.

  Each electronic component mounting machine 20 reads the identification code Ms of the parent substrate S when mounting is started. The electronic component mounter 20 associates the parent board identification code Ms with information such as the mounted electronic component mounter (identification code of the electronic component mounter itself) and the mounted electronic component, and stores the related information. The data is stored in the device 83 and transmitted to the host computer 18. Each electronic component mounting machine 20 measures the shared mounting time actually required for mounting the electronic component, and transmits the measured shared mounting time to the host computer 18.

  The reading electronic component mounting machine further associates the parent board identification code Ms with the separately read child board identification code Msa, stores the related information in the storage device 83, and transmits it to the host computer 18.

  The host computer 18 periodically acquires production information including actual shared mounting time from each electronic component mounting machine 20. When the actual shared mounting time is acquired, the control unit 18a determines “YES” in step 112, and determines whether or not the reading responsible electronic component mounting machine needs to be changed in step 114. The host computer 18 determines “NO” in step 112 and repeatedly executes step 112 until a new shared mounting time is acquired from each electronic component mounting machine 20.

  Specifically, the control unit 18a reads and selects the electronic component mounting machine 20 having the shortest of the acquired actual shared mounting times as the electronic component mounting machine in charge. When the electronic component mounting whose actual shared mounting time is the shortest has been changed, the control unit 18a determines that the reading responsible electronic component mounting machine needs to be changed. Then, it is determined that it is not necessary to change the reading electronic component mounting machine. The change includes not only changing to a different electronic component mounting machine but also changing the number of electronic component mounting machines.

  This is due to the following reason. The shared mounting time assumed when the production program is created is the shared mounting time (cycle time) in the case of production in an ideal situation. However, in the case of actual production with an electronic component mounting machine, there are cases in which production cannot be performed in the shared mounting time assumed due to various factors. Therefore, as described above, at the start of production, the reading responsible electronic component mounting machine is selected based on the assumed shared mounting time, and the reading responsible electronic component mounting machine is caused to read the slave board identification code Msa. On the other hand, after the start of production, the reading electronic component mounting machine is selected based on the actual shared mounting time, and the reading electronic component mounting machine is caused to read the slave board identification code Msa.

  The various factors described above will be described below. In the operation of sucking a component from the component tape, performing image processing, and mounting the component, for example, the suction nozzle 65 or the feeder 51 that sends the component tape is insufficiently maintained, and the component cannot be sucked or is correct If the suction cannot be performed at the position, an error occurs in the image processing. If the component cannot be picked up, the operation of picking up the component is performed again. When such an operation that cannot be predicted in advance is performed, production cannot be performed in accordance with the cycle time that is assumed in advance. In addition, even when a part breaks out and the operator replaces the part, the production cannot be performed according to the cycle time assumed in advance. The cycle time assumed in advance is a theoretical value that assumes a case where no unexpected state has occurred.

  An example is given and explained in detail. For example, as shown in FIG. 8, when the production time is 30 seconds, 10 seconds, 20 seconds, and 15 seconds for each of the first to fourth electronic component mounting machines 11 to 14 when the production program is created. The second electronic component mounting machine 12 having the shortest mounting time of 10 seconds is selected as the reading electronic component mounting machine. The selected second electronic component mounting machine 12 reads all the sub-board identification codes Msa. Thereby, in the second electronic component mounting machine 12, the total number (for example, 16 sheets) of reading the sub board identification code Msa in the shared mounting time of the sub board identification code Msa in the reading time per unit quantity (for example, 1 second). ) Is added to the child board identification code reading time (for example, 16 seconds), which is the cycle time. Therefore, the cycle time of the second electronic component mounting machine 12 is 26 seconds obtained by adding the child board identification code reading time of 16 seconds to the shared mounting time of 10 seconds. The cycle time of the second electronic component mounting machine 12 is the first electronic component having the longest mounting time among the first, third, and fourth electronic component mounting machines 11, 13, and 14 that only mount components. It is shorter than the mounting time (30 seconds) of the mounting machine 11.

  Thereafter, when the shared mounting time of the first to fourth electronic component mounting machines 11 to 14 changes to 30 seconds, 15 seconds, 15 seconds, and 10 seconds at time t1, the mounting time is 10 seconds, which is the shortest. The fourth electronic component mounting machine 14 is selected as the reading electronic component mounting machine. That is, since the electronic component mounting machine 20 having the shortest mounting time has been changed from the second electronic component mounting machine 12 to the fourth electronic component mounting machine 14, the reading electronic component mounting machine is also changed from the second electronic component mounting machine 12 to the fourth electronic component mounting machine 12. The electronic component mounter 14 is changed.

  Further, after that, at time t2, when the shared mounting times of the first to fourth electronic component mounting machines 11 to 14 change to 30 seconds, 20 seconds, 15 seconds, and 13 seconds, the mounting time is 13 seconds. The fourth electronic component mounting machine 14 that is the shortest is selected as the reading electronic component mounting machine. That is, the electronic component mounter 20 with the shortest mounting time is the same as the fourth electronic component mounter 14, and therefore the electronic component mounter in charge of reading remains the fourth electronic component mounter 14.

  Further, after that, at time t3, when the shared mounting times of the first to fourth electronic component mounting machines 11 to 14 change to 30 seconds, 20 seconds, 20 seconds, and 20 seconds, the mounting time is the shortest. There are three electronic component mounting machines 20 including second to fourth electronic component mounting machines 12 to 14. In this case, the electronic component mounter in charge of reading is not determined to be only one having the shortest mounting time, but may be equally distributed to a plurality of components. In addition, you may make it attach the weight of sharing rather than equal. For example, the second to fourth electronic component mounting machines 12 to 14 read the child board identification code Msa by sharing 5, 5, and 6, respectively. Even in this case, the cycle times of the second to fourth electronic component mounting machines 12 to 14 are 25 seconds, 25 seconds, and 26 seconds, and the cycle time of the first electronic component mounting machine 11 exceeds 30 seconds. Absent.

  Further, after that, at time t4, when the shared mounting times of the first to fourth electronic component mounting machines 11 to 14 all change to 25 seconds, the electronic component mounting machine 20 with the shortest mounting time is 1 to 4 electronic component mounting machines 11 to 14. In this case, the electronic component mounter in charge of reading is not determined to be only one with the shortest mounting time, but may be equally distributed to all. For example, each of the first to fourth electronic component mounting machines 11 to 14 is caused to read each of the six child board identification codes Msa. In this case, the cycle time of each electronic component mounting machine 20 is 31 seconds. For example, when reading of the child board identification code Msa is concentrated only on one electronic component mounting machine 20 (25 seconds (mounting time) ) +16 seconds (reading time) = 41 seconds), the cycle time of the electronic component mounting system A can be shortened.

  Since the electronic component mounting machine with the longest cycle time is the rate-determining process of the electronic component mounting system A among the electronic component mounting machines 20, if the cycle time of the electronic component mounting machine with the longest cycle time is shortened, the electronic component mounting machine 20 This is because the cycle time as the mounting system A can be shortened. The cycle time of the electronic component mounting machine is the actual working time of the electronic component mounting machine, which includes the mounting time and the reading time.

When the host computer 18 determines in step 114 that it is necessary to change the electronic component mounter in charge of reading, in step 116, the host computer 18 instructs to change the electronic component mounter in charge of reading. Specifically, when the host computer 18 determines that the electronic component mounting machine 20 that reads the child board identification code Msa needs to be changed, the host computer 18 reads the electronic component mounting machine 20 that has been newly read. An instruction to stop reading is sent to the electronic component mounting machine 20 that has been read so far. If it is not necessary to change the reading electronic component mounting machine, the host computer 18 determines “NO” in step 114 and returns the program to step 112.
Upon receiving the change instruction, the reading electronic component mounting machine reads the child board identification code Msa until the next change instruction.

  If the host computer 18 receives the completion of production from all the electronic component mounting machines 20, the host computer 18 determines “YES” in step 118 and ends the program. Further, the host computer 18 determines “NO” in step 118 and returns the program to step 112 until production completion is received from all the electronic component mounting machines 20.

  As is clear from the above description, in the present embodiment, a plurality of electronic component mounting machines 20 are arranged in series along the conveyance direction of the parent substrate S, and the parent substrate S is divided into a plurality of child substrates Sa. In the electronic component mounting system A in which mounting of the electronic components is performed by a plurality of electronic component mounting machines 20, the control unit 18 a (control device) of the host computer 18 is allocated among the plurality of electronic component mounting machines 20. Then, the sub board identification code Msa attached to the plurality of sub boards Sa is read by the imaging device 70 of the electronic component mounting machine 20 having a short shared mounting time required for mounting the parts. As a result, if the shared mounting time of each electronic component mounting machine 20 is long or short, the electronic component mounting machine 20 having a long shared mounting time should be dedicated to mounting the electronic component without causing the child board identification code Msa to be read. Can do. Furthermore, the electronic component mounting machine 20 with a short shared mounting time can mount the electronic component and read the child board identification code Msa. That is, the electronic component mounter with the short shared mounting time after the component mounting is completed can read the child board identification code Msa using the time until the electronic component mounter with the long shared mounting time completes the component mounting. it can. Therefore, when mounting on the parent substrate S divided into the plurality of child substrates Sa, the electronic component mounting machine 20 with a short shared mounting time does not cause an increase in size and cost of the mounting system A, and the child substrate Sa is identified. By efficiently reading the number, the production time of the entire mounting system A can be suppressed. Further, when the child board identification code Msa is a seal type, even if the seal is incorrectly attached, the code can be recorded in association with the child board Sa, and even if the seal is not attached, the child board is treated as defective. Therefore, when the child board identification code Msa can be read reliably, the child board identification code Msa and the child board Sa to which the code is attached can be recorded in association with each other, so that the product history can be traced reliably.

  Further, as described above, when the cycle time of each electronic component mounting machine 20 changes during production, changing the electronic component mounted by the electronic component mounting machine 20 is the cassette type feeder of the component supply device 50. This can be done by resetting 51. However, in order to reset the cassette-type feeder 51 that has been set once before production, production must be stopped, and it is not realistic considering the time for setup change. On the other hand, unlike the operation of resetting the cassette type feeder 51, the step of reading the sub board identification code Msa can be easily changed without taking time for the change even during production. For this reason, even if the cycle time of each electronic component mounting machine 20 is changed, it is possible to efficiently cope with the change of the cycle time only by changing the reading electronic component mounting machine.

  In addition, the control unit 18a actually measures the shared mounting time required to mount the components performed by each electronic component mounting machine 20, and the imaging device of the electronic component mounting machine 20 in which the measured actual shared mounting time is short. The slave board identification code Msa is read by 70. Thereby, the identification number of the child board Sa can be read more efficiently by determining the electronic component mounting machine 20 that reads the child board identification code Msa according to the actual mounting state.

  Further, the control unit 18a can cause the imaging device 70 of the plurality of electronic component mounting machines 20 to read the child board identification code in a shared manner. Thereby, since the sub board identification code can be read not only by one electronic component mounting machine 20 but also by a plurality of electronic component mounting machines 20, reading of the identification number of the sub board can be performed more efficiently.

  DESCRIPTION OF SYMBOLS 11-14 ... 1st-4th electronic component mounting machine, 18 ... Host computer, 18a ... Control part (control apparatus), 20 ... Electronic component mounting machine, 30 ... Board | substrate conveyance apparatus, 40 ... Backup apparatus, 50 ... Component supply Device: 60 ... Component transfer device, 65 ... Mounting nozzle, 70 ... Imaging device, 80 ... Control device, A ... Electronic component mounting system, Ms ... Parent board identification code, Msa ... Sub board identification code, S ... Parent board, Sa: Sub board.

Claims (2)

A substrate transport device that is provided on a base and transports a main board divided into a plurality of sub-boards and positions and supports the base board at a component mounting position, and supports the base so as to be movable in two directions, the X direction and the Y direction. A component transfer device that picks up the components supplied by the component supply device and mounts them on the mother board divided into the plurality of child boards positioned and supported at the component mounting position, and the X direction with respect to the base And a plurality of electronic component mounters arranged in series along the conveyance direction of the parent substrate, and an imaging device that images the parent substrate and is supported so as to be movable in two directions of Y and Y. An electronic component mounting system in which mounting of the component is performed by the plurality of electronic component mounting machines,
A sub board identification code for identifying each sub board attached to each of the plurality of sub boards;
The electronic component mounting machine having a short shared mounting time required for mounting the component performed in the shared manner among the plurality of electronic component mounting machines is selected as a reading electronic component mounting machine, and the imaging of the reading electronic component mounting machine is performed. A control device that causes the device to read a child board identification code attached to the plurality of child boards ,
The control device, at the start of production, selects the reading electronic component mounting machine based on the assumed shared mounting time, and causes the reading electronic component mounting machine to read the child board identification code, After starting production, the electronic component mounter in charge of reading is selected based on the actually measured shared mounting time, and the electronic component mounter in charge of reading is made to read the slave board identification code system. Oite to claim 1, wherein the control device mounting system for causing read by sharing the child board identification code to the plurality the imaging device of the electronic component mounting apparatus.

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