JP5473465B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus that supplies electronic components to be mounted in a transport lane in a mounting apparatus having a plurality of transport lanes.

  Component supply to a conventional electronic component mounting apparatus is performed by storing electronic components necessary for a substrate to be mounted in advance in a component supply apparatus in which a tape feeder and a component tray are arranged. With the diversification of market needs, there is a need for high-mix low-volume production with different parts to be mounted even if the boards are the same.・ Manufacturing system is being developed.

  However, in the automatic board assembly process, the changeover operation for changing the type of board (board assembly) to be produced is performed by, for example, three serial electronic component mounting machines 100 as shown in FIG. In order to switch the assembly of the A board created up to the B board assembly to the assembly of the B board, the board transfer lane 102 of the electronic component mounting machine (the center mounting machine in FIG. 12) is stopped, the production is interrupted, and the parts An operator manually changes the type of parts of the supply device 104. As the number of products is changed, the number of product switching increases, and there is a problem that a loss such as production interruption or human intervention occurs every time the setup change work is performed.

  Therefore, automatic setup change is considered in the electronic component mounting machine, and according to Patent Document 1 as a mode for performing such automatic setup change, data such as the number of boards to be produced, the production plan of parts to be assembled, or a barcode is preliminarily stored. The electronic component mounter itself takes over from the computer and judges that the production plan has been completed by an arbitrary setup change trigger (production quantity or barcode), and changes the data and adjusts the transfer rail width. It was decided.

  In Patent Document 1, since the electronic component mounting machine has a production plan and data, and the electronic component mounting machine itself performs the setup change, the load on the host computer is reduced, and the host computer, the electronic component mounting machine, It is possible to reduce the exchange of signals during the period and shorten the setup change time.

JP-A-4-56398

  However, in Patent Document 1, a changeover operation for the next production is performed by determining completion of a production plan by an arbitrary changeover trigger (production number or barcode). Therefore, after the production plan is completed, it takes time to prepare electronic parts and the like necessary for the next production plan, and there is a possibility that the production of the board is stopped.

  In addition, a plurality of types of electronic components are mounted on one substrate, and mounting is completed by a plurality of mounting processes. In this respect as well, in Patent Document 1, since the type of component is not switched step by step for each mounting process, the next type of board assembly is maintained until the last mounting process is completed for the previous type of board assembly. It is necessary to stop production.

  In addition, in the production of substrates, even if the types of substrates are the same, there are many cases where the types of substrate assemblies are switched by changing only the types of electronic components to be mounted, and such cases are not considered at all.

  In addition, electronic components mounted on a board include common parts that are commonly used for multiple boards and dedicated parts that are used only for specific boards. There is no need to rearrange, and it is more efficient to change only the dedicated parts.

  In addition, in the mounting line, there is one that smoothly performs substrate supply and electronic component supply by providing a plurality of rows of substrate transport lanes, and performs mounting work efficiently without waiting time. No particular component supply method is provided when such a plurality of rows of substrate transport lanes are provided.

  The present invention has been made in view of the above-described conventional problems, and is an apparatus for efficiently supplying and mounting electronic components of a type suitable for the type of board assembly in a mounting line having a plurality of rows of transfer lanes. In particular, it is an object of the present invention to provide an electronic component mounting apparatus that can efficiently perform a setup change operation for changing the type of substrate assembly without time loss.

In order to solve the above-described problem, the structural feature of the invention according to claim 1 is that a substrate transport device that transports a substrate and carries it in and out of the mounting position, and a component that is collected and loaded into the mounting position. In an electronic component mounting apparatus provided with a component transfer device that is mounted on a substrate and creates a substrate assembly, a component carrier that accommodates a component of a type suitable for the type of the substrate assembly is conveyed to correspond to the mounting position. A carrier conveying device for carrying in and out of the pick-up position; and an identification member storing information indicating the type of the board assembly prepared by mounting the component housed in the component carrier on the substrate. , and having said read reading information stored in the identification member device of the component carrier to be introduced into the carrier transport device, and for identifying identification device a type of the substrate assembly, wherein the component A control device for operating the component transfer device so as to create a type of substrate assembly that is collected from the component carrier and loaded onto the substrate loaded into the mounting position and identified by the identification device; That is.

The structural feature of the invention according to claim 2 is that a substrate transfer device that transfers a substrate and carries it in and out of a plurality of mounting positions, and a component that is arranged along the substrate transfer device and collects and carries the components to the mounting position In an electronic component mounting apparatus provided with a plurality of component transfer devices that are sequentially mounted on a printed circuit board to create a substrate assembly, a component of a type that is arranged in parallel with the substrate transfer device and that matches the type of the substrate assembly A carrier conveying device that conveys the accommodated component carrier and carries it in and out of a sampling position corresponding to the mounting position, and the component that is provided in the component carrier and accommodated in the component carrier is mounted on the substrate and created. information indicating the type of the substrate assembly has a reading device reading the information stored in the identification element of the component carrier to be introduced stored identification member, and the carrier transport device, An identification device for identifying the type of board assembly, and the carrier transport device is operated so as to carry the loaded component carrier into the sampling position, and the component is removed from the component carrier carried into the sampling position. And a control device that operates the component transfer device so as to create a type of board assembly that is collected and mounted on the board that has been loaded into the mounting position and identified by the identification apparatus. .

  According to a third aspect of the present invention, in the second aspect of the present invention, the sampling position is provided in parallel with each of the mounting positions in the carrier transfer device, and the control device includes the substrate and the component. The substrate transfer device and the carrier transfer device are operated synchronously so that the carrier is carried in / out in synchronization with each of the mounting positions and the sampling position in parallel with each of the mounting positions, and is loaded into each of the sampling positions. Each component transfer device is configured to collect the components from the component carrier, and sequentially mount the components on the substrates carried into the parallel mounting positions to identify the types of substrate assemblies identified by the identification device. And a control device to be operated.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, a component supply device that supplies a plurality of types of components to be mounted on the substrate is connected to the component transfer device. The control device is provided on a base so that a component of a type suitable for the type of the board assembly identified by the identification device is collected from the component supply device and mounted on the substrate carried into the mounting position. And operating the component transfer device.

The structural feature of the invention according to claim 5 is that, in any one of claims 1 to 4, the identification member accommodates the type of the component accommodated in the carrier and each type of component. In addition, information for correlating the position of the carrier is stored.

A structural feature of the invention according to claim 6 is the carrier filling device according to any one of claims 1 to 5 , wherein the component carrier is filled with a component of a type suitable for the type of the substrate assembly, and A component carrier loading device for loading a component carrier filled with components from a carrier filling device to the carrier conveying device is provided, and the control device supplies a component of a type suitable for the type of the board assembly according to a production plan. And actuating the carrier filling device to fill.

A structural feature of the invention according to claim 7 is that, in any one of claims 1 to 6 , the carrier transport device is configured to be capable of transporting the substrate.

According to an eighth aspect of the present invention, in any one of the first to sixth aspects, the component carrier is a tray, and the carrier transport device is a tray transport device that transports the tray exclusively. That is.

  According to the first aspect of the present invention, a component carrier containing components suitable for the type of board assembly is put into the carrier carrying device, carried into the sampling position, and put into the carrier carrying device by the carrier carrying device. The type of the board assembly to be created by mounting the components contained in the component carrier is identified by the identification device, and the control unit transfers the component so as to create the identified type of board assembly based on the identified information. Activate the loading device.

Therefore, even when creating a new type of board assembly, the type of board assembly is identified based on the component carrier carried into the sampling position, and the types of parts necessary for board assembly are available. The operation of assembling the substrate can be performed quickly and reliably. In particular, if you use the same type of board and switch only parts to another type to create a different type of board assembly, you only need to change to the production program for that type of board assembly. It is possible to proceed with the mounting operation with high efficiency without causing a loss time for setup change such as stop, and it is possible to reduce the production cost.
Further, the information on the identification member in which the information indicating the type of the board assembly is stored is read by the reading device, and the control device operates the component transfer device based on this information. Then, when the type of the board assembly is changed, the information on the changed type of the board assembly is read from the identification member of the component carrier by the reading device so as to create the identified type of board assembly. The production program of the control device is switched to activate the component transfer device. By switching the production program, the part whose type has been changed is mounted on the board by the component transfer device, and the board assembly whose type has been changed is created. As described above, since the type of the board assembly is changed using the identification member provided on the carried component carrier as a trigger, the parts necessary for creating the identified type of board assembly are always available. In this state, the type of board assembly can be automatically and quickly switched in the electronic component mounting apparatus.

According to the second aspect of the present invention, even in a mounting apparatus having a plurality of mounting positions and a plurality of component transfer devices, the components housed in the component carrier carried into each sampling position are mounted by the carrier transport device. The type of the board assembly to be created is identified by the identification device, and the component transfer device is operated by the control unit so as to create the identified type of board assembly. Therefore, when switching to create a different type of board assembly from the type of board assembly that has been created so far, it is necessary to create a type of board assembly that can be changed at any of multiple mounting positions. It is possible to quickly and reliably perform the process of creating a board assembly in a state where all the parts are present. Therefore, it is possible to smoothly switch the types of board assemblies to be created step by step at each mounting position without time loss such as production stop.
Further, the information on the identification member in which the information indicating the type of the board assembly is stored is read by the reading device, and the control device operates the component transfer device based on this information. Then, when the type of the board assembly is changed, the information on the changed type of the board assembly is read from the identification member of the component carrier by the reading device so as to create the identified type of board assembly. The production program of the control device is switched to activate the component transfer device. By switching the production program, the part whose type has been changed is mounted on the board by the component transfer device, and the board assembly whose type has been changed is created. As described above, since the type of the board assembly is changed using the identification member provided on the carried component carrier as a trigger, the parts necessary for creating the identified type of board assembly are always available. In this state, the type of board assembly can be automatically and quickly switched in the electronic component mounting apparatus.

  According to the invention of claim 3, the component carrier is carried into each sampling position in synchronization with the board being carried into the mounting position, and the components housed in the component carrier carried into each sampling position are mounted. The type of the board assembly to be created is identified by the identification device, and each component transfer device is operated by the control device so as to create the identified type of board assembly. Therefore, even when switching to a different type of board assembly from the previously created type of board assembly, the different types of boards used for the different types of boards to be switched and the different types of board assemblies are different. The parts are transferred to the mounting position and the sampling position in synchronization with the parts being aligned. In this way, it is possible to quickly and reliably create a board assembly with the board and components used in the board assembly always in place, and another type of board assembly without time loss such as production stop. You can start creating.

  According to a fourth aspect of the present invention, a component supply device that supplies a plurality of types of components is provided on a base with respect to the component transfer device, and is of a type suitable for the type of board assembly identified by the identification device. The component is mounted on the substrate that is collected from the component supply apparatus and carried to the mounting position. For this reason, even when there are many types of components used for mounting, the components can be efficiently supplied from the component supply device. In particular, by supplying common parts that are commonly mounted on multiple types of boards from a component supply device, and transporting dedicated parts that are used only for each type of board assembly by a component carrier, various board assemblies Therefore, necessary components can be efficiently mounted on the circuit board.

According to the fifth aspect of the present invention, the identification member stores information associating the types of the components accommodated in the component carrier with the positions where the components of each type are accommodated in each component carrier. Thereby, at each housing position of the component carrier, it is possible to easily grasp whether or not the component is stored and the type of the stored component. Therefore, the components to be mounted can be reliably collected by the component transfer apparatus and can be quickly mounted on the substrate.

According to the sixth aspect of the present invention, the carrier filling device fills the component carrier with parts of a type suitable for the type of the board assembly according to the production plan, and the component carrier filled with the components is conveyed by the component carrier loading device. Inserted into the device. Therefore, the opportunity to intervene human hands to prepare parts that match the board assembly type is reduced, and the parts of the type that match the board assembly type are automatically and quickly supplied, A board assembly can be created.

According to the seventh aspect of the invention, the component carrier transfer device is configured to be able to transfer the substrate. Therefore, flexible and efficient production can be performed by transporting the substrate or the component carrier according to the type or amount of the substrate assembly to be produced.

According to the eighth aspect of the present invention, the component carrier conveying device is a tray conveying device that conveys the component tray exclusively. Therefore, it can be set as the conveyance apparatus of the simple structure of conveying a component tray, and the cost of an installation can be aimed at.

The top view of the electronic component mounting apparatus of 1st Embodiment which concerns on this invention. Schematic which shows the structure of a 1st electronic component mounting machine. The perspective view which shows a components tray. The perspective view which shows a tray pallet. The schematic diagram which shows the state which conveys a board | substrate and a component tray synchronizing. The schematic diagram which shows the aspect which supplies an electronic component to several board | substrates from one component tray as 2nd Embodiment. The figure which shows the state which started preparation of the board | substrate assembly of the type B of 2nd Embodiment. The figure which shows immediately before switching from the kind A to the board assembly of the kind B. The figure which shows the state switched to preparation of the board assembly of the type B. The schematic diagram which shows the aspect which is one electronic component mounting machine as 3rd Embodiment. The figure which shows other embodiment which abbreviate | omitted the component supply apparatus. The figure which shows a prior art example.

(First embodiment)
A first embodiment of an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic component mounting apparatus 2 includes a first electronic component mounting machine 18, a second electronic component mounting machine 20, and a third electronic component mounting machine 22 arranged in series. The electronic component mounters 18, 20, and 22 are provided with a component tray transfer lane (carrier transfer device) 36 and a substrate transfer lane (substrate transfer device) 38, respectively. A component tray filling device (carrier filling device) 8 and a component tray loading device (carrier loading device) 12 are disposed upstream of the first electronic component mounting machine 18 and aligned with the component tray transport lane 36. Has been. Further, on the upstream side of the first electronic component mounting machine 18 and the side aligned with the board transport lane 38, the board supply device 14 and the printing machine 16 are disposed. The operation of the component tray filling device 8, the component tray loading device 12, the substrate supply device 14, the printing machine 16, and the electronic component mounting machines 18, 20, and 22 is controlled by a control device 24. The control device 24 receives a production program and production information based on the production plan. As production programs, for example, NC programs in each electronic component mounting machine 18, 20, 22 (which components are to be mounted in which order), arrangement programs in the component tray filling device 8 (how components are arranged in the component trays) Production information includes a component library (data related to the shape of each component) and board data (data related to the shape of each substrate).

  In the substrate supply device 14, the substrates S before mounting are stocked in a state of being stacked and stacked for each type, and the necessary substrates S are supplied from the substrate supply device 14 to the printing machine 16 that performs screen printing. ing.

  On the upstream side of the component tray filling device 8, a component and component tray warehouse 5 is provided. The parts and parts tray warehouse 5 is divided into two upper and lower stages, and an upper part has a parts storage part 5a for storing electronic parts P, and a lower part has a part tray storage part 5b for storing a part tray 26 as a part carrier. Yes. The component storage unit 5a has a feeder device (not shown) that is divided into the same types, stores the components P, and takes out the stored electronic components P so as to be collected. The component tray storage unit 5b has a plurality of storage shelves (not shown) in which component trays 26 to be described later are stored, and the component trays 26 are stored in the respective storage shelves. The plurality of storage shelves are unitized, and an unillustrated elevating mechanism for raising and lowering the entire unitized storage shelves is provided. By this lifting mechanism, the outlet of each storage shelf is aligned with the transfer surface of the input conveyor 12 described later, and the component tray 26 is carried out. The component tray 26 is fixed and stored in a tray pallet 34 as will be described later.

  The component tray filling device 8 is provided with a Y beam 13 extending in the Y direction, and the Y beam 13 is placed on an X direction rail (not shown) and is movable in the X direction. A slider portion 15 is provided on the Y beam 13 so as to be movable in the Y direction. The slider unit 15 includes a component suction head 9. The component tray filling device 8 is configured such that the component suction head 9 can move in the X direction when the Y beam 13 moves in the X direction. The component suction head 9 is an existing technology that holds the component P by suction with negative pressure air. The movement of the Y beam 13 in the X direction is driven by an X-axis servo motor (not shown) via a ball screw (not shown). The movement of the slider portion 15 in the Y direction is driven by a Y-axis servo motor (not shown) via a ball screw (not shown). These servo motors are controlled by the control device 24. The component tray filling device 8 picks up the electronic component P from the component storage unit 5a and accommodates the electronic component P picked up in the component tray 26 supplied from the component tray storage unit 5b.

  Below the Y beam 13 of the component tray filling device 8, a loading conveyor 12 is provided as a component tray loading device (component carrier loading device). The input conveyor 12 extends in the transport direction (X direction), and each has a pair of guide frames (not shown) and a belt conveyor extending in parallel with the guide frames.

  The component tray 26 housed in the component tray storage unit 5b is attached with an RFID tag, which will be described later, and is pulled out onto the input conveyor 12 and positioned at a predetermined filling position on the input conveyor 12. Electronic components (components) P of a type suitable for the type of board assembly created based on the production plan are sequentially taken out by the feeder device to the sampling unit of the feeder device. The component P taken out by the sampling unit is sucked by the component suction head 9 of the component tray filling device 8 and accommodated in the component tray 26. At that time, the component tray filling device 8 accommodates the electronic component P in a predetermined accommodation position of the component tray 26. As shown in FIG. 3, the component tray 26 is provided with a plurality of grid-like cavities 28, and these cavities 28 correspond to the above-mentioned predetermined accommodation positions, and each of them has an electronic component P. It is to be accommodated. In the present embodiment, the component is the electronic component P. However, the present invention is not limited to this. For example, a shield component that protects the electronic component P may be used.

  As described above, when the electronic component P of a type suitable for the type of the board assembly is accommodated in the component tray 26, the RFID tag (Radio Frequency IDentification) 30 as an identification member attached to the component tray 26 includes: Data such as the type of the board assembly to be created, the housing position, the type of parts, the number of parts, and the like are written by the first read / write head 29 provided on the input conveyor 12. At this time, each cavity 28 (accommodating position in the component carrier) and each type of electronic component P accommodated in the cavity 28 are associated with each other and recorded in the RFID tag 30. For example, in FIG. 3, each cavity 28 is given a number of (1) to (9) in a row, and symbols (A) to (E) are given to a column to define the accommodation position as a matrix. If it is, it is recorded that the component P1 is accommodated in (A1) to (A5). Similarly, it is recorded that the component P2 is accommodated in (A6) to (A9) and the component P3 is accommodated in (B1) to (B3).

  The component tray 26 is fixed on a tray pallet 34 having a plate shape and dimensions similar to those of the substrate S as shown in FIG. The component tray 26 fixed to the tray pallet 34 is stored in the component tray storage portion 5b.

  The printing machine 16 includes a positioning unit that holds the substrate S by a clamper (not shown), and a screen mask (not shown) is disposed above the positioning unit. Each screen mask is configured by mounting a mask plate on a holder (not shown). A squeegee unit (not shown) is disposed on the screen mask so as to be reciprocally movable in the horizontal direction. In a state in which the substrate S is in contact with the lower surface of the screen mask, paste-like cream solder is supplied onto the mask plate, and the squeegee constituting the squeegee unit is slid on the mask plate, thereby forming a screen mask. Cream solder is printed on the substrate S through the provided pattern holes. In the printing machine 16, the claim solder is printed on the conveyed board S, and is carried out to the board conveyance lane 38 of the first electronic component mounting machine 18 in the next process.

  As shown in FIG. 1, in the electronic component mounting apparatus 2, a first electronic component mounting machine 18, a second electronic component mounting machine 20, and a third electronic component mounting machine 22 are arranged in series from the upstream side. Configured as a unit. As shown in FIG. 2, the first electronic component mounting machine 18 includes a component tray transport lane 36 for transporting the component tray 26, and a substrate transport lane for transporting the substrate S to the carry-in position and positioning it at a predetermined mounting position JP. 38 and a component transfer apparatus having a component mounting head 42 provided on a moving table 40 supported so as to be movable in the X direction (conveying direction) and the Y direction (direction perpendicular to the X direction) with respect to the base 39. 44, a substrate recognition camera (CCD camera) 46 provided on the moving table 40, a component tray transport lane 36, a substrate transport lane 38, a component transfer device 44, a substrate recognition camera 46, and the like. 24.

  The component tray transport lanes 36 are not shown in the figure, but are arranged alongside guide rails extending in the X direction (transport direction) to convey the component tray 26 to the positioned sampling position PP. And a supporting frame for supporting the loaded component tray 26. The second read / write head 32 is disposed at the entrance of the component tray conveyance lane 36. The RFID tag 30 can be read and written by the second read / write head 32. The RFID tag 30 and the second read / write head 32 constitute an identification device.

  The substrate transfer lanes 38 are not shown in the drawings, but are arranged along the guide rails extending in the X direction (transfer direction) and carry the substrate S to the position where the substrate S is positioned. A support frame that supports the substrate S, an elevating device that raises the supported substrate S to the mounting position JP to be mounted, and a clamp device that clamps the substrate S at the mounting position JP are provided.

  A Y-direction beam 48 extending in the Y direction is provided above the component tray conveyance lane 36 and the substrate conveyance lane 38, and the Y-direction beam 48 is placed on an X-direction rail (not shown) so as to be movable in the X direction. It has become. A moving table 40 is provided in the Y direction beam 48 so as to be movable in the Y direction. The moving table 40 holds a component transfer device 44 having a component mounting head 42 and a substrate recognition camera 46. The component transfer device 44 and the substrate recognition camera 46 move a Y-direction beam 48 in the X direction. By doing so, it is configured to be movable in the X direction. The movement of the Y direction beam 48 in the X direction is driven by an X direction linear guide (not shown) and an X axis servo motor (not shown) via a ball screw (not shown). The movement of the movable table 40 in the Y direction is driven by a Y direction linear guide (not shown) and a Y axis servo motor (not shown) via a ball screw (not shown). These servo motors are controlled by the control device 24.

  The component transfer device 44 is supported by a support base (not shown) attached to the movable table 40, and is supported by the support base so as to be movable up and down in the Z direction perpendicular to the X direction and the Y direction, and by a servo motor (not shown). The component mounting head 42 is driven up and down, and is composed of a suction nozzle (not shown) protruding downward from the component mounting head 42. The suction nozzle is formed in a cylindrical shape and holds the electronic component P by suction at the lower end. The picking and mounting operations of the component transfer device 44 are controlled by the control device 24. When the electronic component P accommodated in the component tray 26 is taken out for mounting on the substrate S by the component transfer device 44, the type and number of the electronic components P taken out and the accommodation position (cavity 28) taken out. Etc. are recorded in the memory of the control device 24. As a result, the number and types of electronic components P that can be used in the next process are grasped, and when the electronic components P to be used remain, the electronic components P are supplied from the same component tray 26 in the next process.

  On one side of the first electronic component mounting machine 18 (lower side in FIG. 2), a component supply device 52 is arranged alongside the board conveyance lane 38, and these component supply devices 52 are mainly small electronic components. It is configured to supply a configured tape feeder supply component, and is configured with a large number of cassette-type feeders 54 that can be attached and detached. In the present embodiment, a common electronic component P used in common for several types of board assemblies is supplied from the component supply device 52. The cassette type feeder 54 holds a supply reel (not shown) around which a long and narrow tape in which electronic parts P are sealed at a predetermined pitch is wound. The tape is pulled out from the supply reel at a predetermined pitch, and the electronic component P is released from the encapsulated state and sequentially fed into a component take-out portion (not shown).

  A component recognition camera (not shown) is provided between the substrate transport lane 38 and the component supply device 52, and electronic components (tape feeder supply component and component tray supply component) sucked by the suction nozzle by the component recognition camera. P is imaged and it is determined whether the electronic component P is of a type suitable for the type of the board assembly, whether the suction state is good, whether there is a defective portion of the component itself, or the like.

  Note that the second read / write head 32 is not provided for the configuration of the second electronic component mounter 20 and the third electronic component mounter 22 on the downstream side of the first electronic component mounter 18. Unlike the first electronic component mounting machine 18, the other configurations are the same, and thus the same reference numerals are given and description thereof is omitted.

  Although the reflow furnace is not shown in the drawings, the substrate transfer mechanism (not shown) that holds the substrate S on which the electronic component P is mounted and transfers the substrate S along a predetermined transfer path, and heat-treats the substrate S. A plurality of unillustrated heating units and an unillustrated cooling unit for cooling the substrate S heated by the heating unit are provided. The substrate transport mechanism includes a set of guide rails (not shown) extending in the transport direction, and transports the substrate S by a belt (not shown) provided in the guide rails. A plurality of unillustrated blowing nozzles constituting the heating unit are arranged in one row above and below the belt of the substrate transport mechanism. On the downstream side of the heating unit, a cooling unit (not shown) having two nozzles (not shown) on the upper and lower sides is provided. While passing through the heating unit and the cooling unit, the substrate S on which the electronic component P is mounted is heated while forming a predetermined temperature profile, and is cooled by the cooling unit on the outlet side of the substrate transport mechanism. The cooled substrate S is stored in a state where it is stacked on a plurality of support shelves provided horizontally facing the substrate storage device. When the empty component tray 26 is conveyed, it is stored in a component tray storage device (not shown) without passing through a reflow furnace.

  The operation of the electronic component mounting apparatus 2 of the embodiment configured as described above will be described below with reference to the drawings. As an outline of the operation, the substrate S is supplied from the substrate supply device 14 and the component tray 26 is separately supplied from the component tray filling device 8 to the respective transfer lanes, and is loaded into the first electronic component mounting machine 18. And the component tray 26 are conveyed synchronously.

  First, the substrate S will be described. As shown in FIG. 1, the substrate S supplied from the substrate supply device 14 is screen-printed by the printer 16, and the screen-printed substrate S is carried into the substrate transport lane 38 of the first electronic component mounting machine 18. Is done.

  On the other hand, the component tray 26 is carried into the input conveyor 12 from the component tray storage portion 5 b and is positioned at a filling position on the input conveyor 12. The component tray 26 accommodates electronic components P of a type that matches the type of board assembly taken out from the component storage unit 5a to the sampling unit of the feeder device by the component suction head 9 of the component tray filling device 8. The component tray 26 in which the electronic component P is accommodated is conveyed to the component tray conveyance lane 36 of the first electronic component mounting machine 18 by the input conveyor 12.

  In the component tray transport lane 36 of the first electronic component mounter 18, the component tray 26 is transported in synchronization with the transport of the substrate S. Here, for example, as shown in FIG. 5, in the electronic component mounting apparatuses 18, 20, and 22, the component tray transport lane 36 accommodates the type of electronic component P that is suitable for the type A board assembly. The component tray 26 of the specified PA is transported, the electronic component P is supplied from the component tray 26 of the specified PA to the substrate S, and a new type B substrate assembly is added to the component tray transport lane 36. The case where the component tray 26 of the specification PB in which the compatible electronic component P is accommodated will be described. When the component tray 26 in which the electronic component P having the specification PB is accommodated is loaded into the first electronic component mounter 18 in synchronization with the loading of the substrate S3, the second electronic component mounter 20 is loaded onto the substrate S2. A dedicated electronic component P for the type A board assembly is supplied from the component tray 26 of the specification PA, and the common electronic component P is supplied from the component supply device 52, and is mounted on the third electronic component mounting machine 22. The electronic component P is supplied and mounted on the substrate S1 from the component tray 26 of the specification PA and the component supply device 52, respectively.

  When the component tray 26 of the specification PB is carried into the first electronic component mounter 18, the recording data of the RFID tag 30 is read by the second read / write head 32 at the entrance of the component tray transport lane 36, The recorded data of the RFID tag 30 is identified as relating to a new type B board assembly, and the production program in the first electronic component mounting machine 18 is changed. The component tray 26 is moved to the sampling position PP by the component tray conveyance lane 36 of the first electronic component mounting machine 18 and positioned. On the other hand, the substrate S3 is transported by the substrate transport lane 38 of the first electronic component mounting machine 18, and the substrate S3 supported by the support frame (not shown) is lifted by the lifting device to the mounting position JP of the rising end. It is held by a clamping device. Note that two fiducial marks (not shown) provided on the substrate S are read by the substrate recognition camera 46, and a position where the electronic component P is mounted is determined based on these marks. Meanwhile, the component tray 26 of the substrate S2 and the specification PA is conveyed to the second electronic component mounting machine 20, and the component tray 26 of the substrate S1 and the specification PA is conveyed to the third electronic component mounting machine 22.

  Then, in the first electronic component mounting machine 18, the X-axis servo motor and the Y-axis servo motor are driven by the production program changed in the control device 24, and the component mounting head 32 performs electronic control from the component tray 26. The component P is sucked and mounted on the substrate S3 held at the mounting position JP. As described above, in the first electronic component mounter 18, the type of the board assembly is identified by the RFID tag 30 provided on the component tray 26, and the electronic component P and the board for creating a new type B board assembly are provided. Since the mounting can be started immediately after S3 is complete, the production can be continued without any loss time such as a production stop. At this time, necessary electronic components P are selected and sucked from the cavities (accommodating positions) 28 set by the matrix of the component tray 26 of the specification PB. Further, the common electronic component P is supplied from the component supply device 52, and is attached to the substrate S3 that is attracted by the component mounting head 32 and held at the mounting position JP.

  When the electronic component P stored in the component tray 26 of the specification PB is used for mounting, the cavity 28 that has been taken out and emptied or the cavity of the component tray 26 of the remaining electronic component P (accommodating position) 28 is sent to the control device 24 as a data signal and recorded in the memory. When the completion of the mounting in the first electronic component mounting machine 18 is transmitted as a signal to the control device 24, the production program of the second electronic component mounting machine 20, which is the next process, is a type B board assembly. It is changed to the one to which the electronic component P for creating is mounted.

  In this case, the record data in which the type and number of used electronic components are changed may be written in the RFID tag 30. However, in this case, since writing is performed by another read / write head, the third and fourth read / write heads are required in each of the electronic component mounting machines 20 and 22. In addition, while the electronic component P is mounted on the substrate S3 from the component tray 26 having the specification PB on the substrate S3 in the first electronic component mounting machine 18, a new substrate (not shown) is printed by the printer 16, and the type The electronic component P used to create the board assembly B is accommodated in the component tray 26 by the component tray filling device 8. As a result, preparations for loading the substrate S and the component tray 26 into the substrate conveyance lane 38 and the component tray conveyance lane 36 of the first electronic component mounting machine 18 are made.

  Subsequently, even when the component tray 26 is carried into the component tray transport lane 36 in the second electronic component mounter 20, the first electronic component mounter 18 is supplied from the component tray 26 of the specification PB and partially The board S3 on which the electronic component P is mounted is carried into the board conveyance lane 38 in synchronization with the loading of the component tray 26. Also in the second electronic component mounting machine 20, the component tray 26 is positioned at the sampling position PP, and the substrate S3 is positioned at the mounting position JP. At this time, the substrate tray S2 and the component tray 26 of the specification PA are loaded into the mounting position JP and the sampling position PP of the third electronic component mounting machine 22, respectively, and a mounting operation for creating a type A substrate assembly on the substrate S2. Will continue.

  The board S3 carried into the second electronic component mounter 22 is received by the substrate recognition camera (CCD camera) 46 in the second electronic component mounter 20 and the type, number, and accommodation of the electronic components P in the component tray 26. The position and the like are confirmed and collated with the data of the control device 24. As a result of the collation, if the content of the confirmation by the board recognition camera 46 is different, the data of the control device 24 is rewritten. It should be noted that if the result of the collation does not match, the operator may be contacted and the operator's visual confirmation may be made.

  Similarly to the first electronic component mounting machine 18, the electronic component P is supplied and mounted from the component tray 26 of the specification PB and the component supply device 52 to the board S3 based on the changed production program. In the second electronic component mounting machine 20, even when a new type B board assembly is made, the board S3 for creating a new type B board assembly and the component tray 26 of the new specification PB are synchronized. Therefore, the type of board assembly can be switched smoothly step by step. The control device 24 mounts the component on the basis of the information on the electronic component P already mounted on the substrate S3 by the first electronic component mounting machine 18 and the information on the electronic component P remaining in the specific accommodation position of the component tray 26. The head 42 is operated, and the electronic component P accommodated in the component tray 26 or the component supply device 52 having the specification PB is selected and mounted on the substrate S3. Then, when it is transmitted to the control device 24 that the mounting of the electronic component P for creating the type B board assembly in the second electronic component mounting machine 20 is completed, the third step, which is the next step, is further performed. The production program of the electronic component mounting machine 22 is changed to one that creates a type B board assembly.

  Similarly, in the third electronic component mounting machine 22, the component tray 26 of the specification PB and the substrate S3 are carried in synchronously, and positioned and mounted at the sampling position PP and the mounting position JP, respectively.

  When the mounting of the electronic component P for creating the type B board assembly in the third electronic component mounting machine 22 is completed, the substrate S3 on which the electronic component P is mounted is based on the temperature profile in a reflow furnace (not shown). After being heated and melting the solder, it is cooled and the electronic component P is mounted on the substrate S3. The substrate S3 that has been mounted is stored in a substrate storage device (not shown). On the other hand, the component tray 26 emptied by using the stored electronic component P is transported without being heated in the reflow furnace, stored in the component tray storage device, and stored and collected. Is sent to the upstream side of the electronic component mounting apparatus 2 so that a new electronic component P is accommodated and reused.

  According to the electronic component mounting apparatus 2 described above, the component tray 26 containing the component P suitable for the type of board assembly is carried into the sampling position PP by the component tray transport lane 36, and is input to the entrance of the component tray transport lane 36. The type of board assembly is identified by reading the RFID tag 30 provided on the carried-in component tray 26 by the provided second read / write head 32, and based on the information identified by the control device 24. The component transfer device 44 is operated so that the component P is mounted on the substrate S.

  Therefore, even when newly creating a different type of board assembly, the type of board assembly is identified by the RFID tag 30 of the component tray 26 into which the component tray 26 is carried into the sampling position PP, and the sampling position PP is always obtained. The assembly of the substrate S can be performed quickly and reliably in a state where the types of electronic components P (component tray 26 of the specification PB) necessary for substrate assembly are complete. In particular, when only the electronic component P is switched to a different type of electronic component P using the same type of substrate S, it is only necessary to change the production program to a production program or the like of the identified type B substrate assembly. Therefore, it is possible to work with high efficiency without causing a loss time for setup change such as production stop, and the production cost can be reduced.

  Further, when a large amount of the same type of components P (particularly large components that need to be supplied by the component tray 26) is mounted on the substrate, it is necessary for mounting the substrate S by the component tray 26 transferred to the component tray transfer lane 36. Since the parts P can be continuously supplied, non-stop supply of the parts P can be realized.

  In addition, in the electronic component mounting apparatuses 18, 20, and 22 including the total three mounting positions JP and the total three component transfer devices 44 as in the present embodiment, the first electronic component mounting machine 18 includes When the component tray 26 is carried into the collection position PP, the type of the substrate assembly to be created is identified by the identification devices 30 and 32 at the entrance of the component tray conveyance lane 36, and the substrate S is based on the identified information. The component transfer device 44 is operated so that the component P is mounted on the device. Therefore, at the time of switching to create the type B board assembly by changing the electronic component P from the type A board assembly produced so far, the change is made at any mounting position JP where the board S is transported. The electronic components P necessary for creating the type B board assembly to be produced can be brought in a complete state, and the type of board assembly to be created is stepwise at each mounting position JP without time loss such as production stop. It can be switched and installed smoothly.

  The type of board assembly to be created is identified at the entrance of the component tray transport lane 36 of the first electronic component mounter 18 by the RFID tag 30 provided on the component tray 26. Then, the component tray 26 is carried into the collection position PP in synchronization with the board S being carried into the mounting position JP. Therefore, even when the board S and the component P are changed from the type A board assembly that has been created so far and switched to a different type B board assembly, the board assembly of type B can be switched. Since the substrate S to be used and the electronic component P used for the substrate S are synchronously conveyed to the mounting position JP and the sampling position PP in each of the electronic component mounting machines 18, 20, and 22, respectively, the type is The boards S and the parts P to be switched are always aligned, so that it is possible to start producing different types of board assemblies without time loss such as production stop.

  In addition, since the component supply device 52 for supplying a plurality of types of components P is provided on the base 39 with respect to the component transfer device 44, the components can be efficiently used even when there are many types of components P used for mounting. Supply can be made. In particular, a common electronic component P that is commonly mounted on a plurality of types of substrates S is supplied from the component supply device 52, and a dedicated component P that is mounted only on a specific type of substrate S is conveyed by the component tray 26. Thus, the necessary parts P can be efficiently mounted on the substrate S.

  Further, the information of the RFID tag 30 in which the information indicating the type of the board assembly is stored is read by the second read / write head 32, and the control device 24 operates the component transfer device 44 based on this information. When the type of the board assembly is changed, the component tray 26 having the changed information in the RFID tag 30 is carried in, and the changed information is read by the read / write head 32 so that the production program or the like is executed. Switch. By switching the production program or the like, the part whose type has been changed is mounted on the board S by the component transfer device 24, and a board assembly whose type has been changed is created. As described above, since the type of the board assembly is changed by using the RFID tag 30 provided on the component tray 26 that has been carried in as a trigger, the electronic component mounting apparatuses 18, 20, and 22 need to be manually operated. The type of board assembly can be switched automatically and accurately.

  The RFID tag 30 stores information that associates the type of the component P accommodated in the component tray 26 with the position where each type of component P is accommodated in each component tray 26. As a result, it is possible to easily grasp the presence or absence of the component P and the type of the component P accommodated at each accommodation position of the component tray 26. Therefore, the component P to be mounted can be reliably collected by the component transfer device 44 and can be quickly mounted on the substrate S, and the necessity of additional supply of the component P can be determined.

  Also, the component tray filling device 8 fills the component tray 26 with a component P of a type that matches the type of board assembly according to the production plan, and the component tray 26 filled with the component P is filled with the first electronic component by the input conveyor 12. It is carried into the component tray conveyance lane 36 of the mounting machine 18. For this reason, the opportunity to intervene to prepare the parts is reduced, and the board assembly is created by automatically and quickly supplying the parts P of the type that matches the board assembly type. be able to.

  The component tray conveyance lane 36 is a tray conveyance device that conveys the component tray 26 exclusively. Therefore, it is possible to provide a conveyance device having a simple structure that conveys the component tray 26, and the cost of the equipment can be reduced.

  In the present embodiment, the component tray 26 is transported exclusively for the component tray transport lane 36, but the substrate S may be transported. By enabling the substrate S to be transported, for example, when only the small electronic component P is used for mounting, when the component tray 26 is not required to be transported, the substrate S is transported in the component tray transport lane. To do. This eliminates the need for the component tray transport lane 36 to be idle, thereby enabling effective use of the equipment. Thus, flexible and efficient production can be performed by conveying the component tray 26 or the board S according to the type and amount of the board assembly to be produced.

  In the component tray filling device 8, the electronic component P is stored in the component tray 26, and this is loaded into the component tray transport lane 36 of the first electronic component mounting machine 18 by the loading conveyor 12. Without limitation, for example, a component tray storage warehouse for storing the component tray 26 in which the electronic component P is stored by the component tray filling device 8 is provided for each type, and the first electronic component is supplied from the component tray storage warehouse by the input conveyor 12. You may make it carry in to the mounting machine 18. FIG. As a result, it is possible to pre-stock component trays that contain electronic components of a type that is compatible with the types of board assemblies that are frequently used, and to prevent shortage of electronic components and supply delay to improve production efficiency. it can.

(Second Embodiment)
Next, a second embodiment of the electronic component mounting apparatus according to the present invention will be described below. In this embodiment, since the configuration of the apparatus is the same as that of the first embodiment, the same reference numerals are given and description thereof is omitted. In the present embodiment, the component tray 26 and the substrate S are not carried in and out in synchronism to create a substrate assembly, but the electronic component P is supplied from one component tray 26 to three substrates S. This is different from the first embodiment in that a board assembly is produced. The switching state from the creation of the type A board assembly to the creation of the type B board assembly in this embodiment will be described with reference to FIGS. In this case, the substrates S1 to S6 to be mounted are all the same type of substrate S. First, the board S1 is used for several kinds of board assemblies from the component supply device 52 in the first electronic component mounting machine 18 transported first and the second electronic component mounting machine 20 transported subsequently. Common electronic components P are supplied and mounted. Then, in the third electronic component mounting machine 22 transported next, as shown in FIG. 6, a specification in which a type of electronic component P suitable for creation of a type A board assembly is accommodated in the substrate S1. The electronic component P is supplied from the component tray 26 of the PA, the common electronic component P is supplied from the component supply device 52, and each is mounted by a component transfer device (not shown).

  Then, after the common electronic component P is supplied from the component supply device 52 and mounted in the first electronic component mounting machine 18, the substrate S2 is mounted on the second electronic component mounting machine 20 as shown in FIG. The common electronic component P is supplied from the component supply device 52 and is mounted by a component transfer device (not shown). Further, a common electronic component P is mounted on the substrate S3 from the component supply device 52 of the first electronic component mounting machine 18 by a component transfer device (not shown).

  Next, as shown in FIG. 7, the component tray transport lane 36 of the first electronic component mounting machine 18 has a specification PB in which an electronic component P of a type suitable for the type of board assembly of type B is accommodated. The component tray 26 is carried in, and the substrate S4 is carried into the substrate conveyance lane 38 of the first electronic component mounting machine 18. The RFID tag 30 attached to the component tray 26 is read by the second read / write head 32 provided at the entrance of the first electronic component mounting machine 18, and the electronic component P conforming to the type B board assembly is read. Is identified as the component tray 26 of the specification PB accommodated, and a signal is transmitted to a control device (not shown) to switch to a production program for creating a type B board assembly. In the first electronic component mounting machine 18, the common electronic component P is collected from the component supply device 52 by the component transfer device (not shown) and mounted on the substrate S4. At this time, with the component tray transfer lane 36 of the third electronic component mounting machine 22 stopped, the substrate transfer lanes 38 of the respective electronic component mounting machines 18, 20, and 22 are operated to reflow the substrate S1 downstream. While being carried out to the process, the substrates S2 and S3 are respectively moved to the second and third electronic component mounting machines 20 and 22 on the downstream side. In the present embodiment, since the electronic component P is supplied from the component tray 26 of the specification PB and mounted by the component transfer device is performed by the third electronic component mounting machine 22, the first electronic In the component mounter 18, only the common electronic component P is mounted. In parallel with the operation of the first electronic component mounter 18, in the second electronic component mounter 20, the common electronic component P is collected from the component supply device 52 and mounted on the board S3. In the third electronic component mounting machine 22, the electronic component P is sampled and mounted from the component tray 26 of the specification PA, and the common electronic component P is sampled from the component supply device 52 and mounted on the substrate S 2. The Then, when it is transmitted to the control device 24 that the mounting of the electronic component P for creating the type B board assembly in the first electronic component mounting machine 18 is completed, the second electronic component mounting machine 20 The production program is switched. In addition, whenever the component tray 26 and the board | substrate S are conveyed and moved to the predetermined position of each electronic component mounting machine 18,20,22, the movement is recognized and recorded on the memory of the control apparatus 24. FIG.

  Next, as shown in FIG. 8, in a state where the component tray transport lane 36 of the third electronic component mounting machine 22 is stopped, the other component tray transport lane 36 and the substrate transport lane 38 are operated, and the substrate S3. The component tray 26 of S4 and specification PB is moved to the electronic component mounting machines 20 and 22 on the downstream side, respectively. Then, the substrate S5 is carried into the first electronic component mounting machine 18. In the second electronic component mounting machine 20, the common electronic component P is collected from the component supply device 52 and mounted on the substrate S4. In the third electronic component mounting machine 22, the electronic component P is collected and mounted from the component tray 26 of the specification PA, and the common electronic component P is collected and mounted from the component supply device 52 on the board S 3. . Then, when it is transmitted to the control device 24 that the mounting of the type electronic component P for creating the type B board assembly in the second electronic component mounting machine 20 is completed, the third electronic component mounting machine In 22, the production program is switched to one that mounts the type electronic component P for creating the type B board assembly.

  Next, as shown in FIG. 9, the component tray transport lane 36 of the second electronic component mounting machine 20 and the third electronic component mounting machine 22, the first electronic component mounting machine 18, and the second electronic component mounting. The machine 20 and the board conveyance lane 38 of the third electronic component mounting machine 22 are operated to move the component tray 26 and the boards S3 to S5 one downstream. At this time, the substrate S3 is unloaded from the third electronic component mounting machine 22 and loaded into the next reflow process. The substrate S6 is carried into the substrate conveyance lane 38 of the first electronic component mounting machine 18. In the third electronic component mounting machine 22, the electronic component P is collected from the component tray 26 having the specification PB and mounted on the substrate S 4, and the common electronic component P is collected and mounted from the component supply device 52. At this time, in the second electronic component mounter 20, the common electronic component P is mounted on the substrate S5, and in the first electronic component mounter 18, the common electronic component P is mounted on the substrate S6. Is done. Since the subsequent steps are the same as those in the first embodiment, description thereof will be omitted.

  Thus, when the first electronic component mounting machine 18 is loaded with the component tray 26 of the specification PB in which the electronic component P of the type suitable for the type B substrate assembly is accommodated, the substrate assembly to be created is produced. The electronic component P that is mounted in stages for each of the electronic component mounting machines 18, 20, and 22 is changed from the type of electronic component P that matches the type A board assembly to the type B board assembly. It is possible to switch to a compatible electronic component P as necessary. Therefore, the specification of the board assembly can be switched smoothly without taking any production stop time for the setup change, and the working efficiency can be improved.

(Third embodiment)
Next, a third embodiment of the electronic component mounting apparatus according to the present invention will be described below. As shown in FIG. 10, the electronic component mounting apparatus according to the present embodiment is not a unit formed by a plurality of electronic component mounting machines, but a single electronic component mounting machine 60, and a substrate recognition camera 46 as an identification device. Thus, the second embodiment is different from the first embodiment in that the two-dimensional code tags 62 and 64 provided on the component tray 26 and the substrate S are read. Since other configurations are the same as those of the first embodiment, description thereof is omitted.

  When the component tray 26 is carried into the electronic component mounting machine, the board recognition camera 46 identifies the type of board assembly by the two-dimensional code 62 written on the component tray 26. At the same time, the two-dimensional code 62 of the component tray 26 and the two-dimensional code 64 of the substrate S are read by the substrate recognition camera 46 to determine whether each is a regular component tray 26 and the substrate S that conform to the production plan. Check. Note that the data recorded in the two-dimensional code tag 62 cannot be rewritten with the two-dimensional code, but the type of electronic component accommodated in the component tray 26 can be rewritten by rewriting the data in the memory of the control device 24.・ The number, accommodation position, type of board assembly, etc. can be managed.

  This identification result is transmitted as a signal to the control device 24, and the control device 24 creates the type of board assembly identified by the component transfer device 44. Even in this case, when the component tray 26 for creating different types of board assemblies is loaded into the component tray transport lane 36 of the electronic component mounting machine 60, the production program is switched to change the different types of boards. Since the assembly can be created, the type of the substrate assembly can be switched without taking any downtime for the setup change, and the working efficiency can be improved.

  In the above embodiment, the component tray transport lane 36 and the substrate transport lane 38 are arranged in one row. However, the present invention is not limited to this. For example, two rows of substrate transport lanes and one row of component trays are transported. It may have a lane.

  In addition, the transport lane is a single lane of only the component tray transport lane, and the substrate and the components mounted on the substrate are accommodated and transported in the component tray transported in the transport lane to create a substrate assembly. It may be. By transporting the substrate together with the components in the component tray in this manner, it is effective for producing a substrate assembly using a thin and small substrate.

  Moreover, although the component tray 26 which accommodated the electronic components P and PB shall be carried on the tray pallet 34, it is not limited to this, For example, the dimension (dimension of a X direction and a Y direction) of component tray itself is set. You may form with the same dimension as the board | substrate S conveyed to a board | substrate conveyance lane. This makes it possible to supply components using existing equipment such as a substrate supply device.

  Further, although the component carrier is the component tray 26, the present invention is not limited to this. For example, a component feeder in which components are three-dimensionally accommodated may be used.

  In the first and second embodiments, the identification device is the RFID tag 30 and the second read / write head 32 provided on the component tray. In the third embodiment, the substrate recognition camera 46 in the electronic component mounting apparatus 20 is used. However, the present invention is not limited to this. For example, in the component tray filling device 8, the control device 24 is made to identify which type of board assembly each component tray is used to create, and the identified component tray is The production program or the like may be changed so as to switch the type of board assembly to be created by being carried into the electronic component mounting apparatus 2. Specifically, for example, virtual transport positions corresponding to the respective transport positions of the electronic component mounting apparatus are allocated in the memory of the control device 24, and different types of electronic components are accommodated in a certain virtual transport position. It is set so that the production program is switched when the delivered component tray arrives. When the component tray identified at each actual transport position is transported, the arrival at the corresponding virtual transport position is recorded in the control device, and production is performed when arrival at the predetermined virtual transport position is confirmed. Switch programs.

  In the above embodiment, the substrate recognition camera is a CCD camera. However, the present invention is not limited to this. For example, a CMOS sensor or a line sensor camera may be used.

  In the first embodiment, the electronic component P is supplied from one component tray 26 to one substrate S, and one component is supplied to three substrates S in the second embodiment. Although the electronic components are supplied from the tray 26, the present invention is not limited to this. For example, the electronic components may be supplied from the three component trays 26 to one substrate S. Specifically, for example, one substrate S is stopped at the mounting position JP of the third electronic component mounting machine 22, and three component trays 26 are mounted on the first to third electronic component mountings respectively. First, the electronic components P are mounted on the substrate S from the component tray 26 in the third electronic component mounting machine 22. Next, in a state where the substrate S is stopped by the third electronic component mounting machine 22, the component tray 26 is carried from the second electronic component mounting machine 20 to the sampling position PP of the third electronic component mounting machine 22, The electronic component P is mounted on the substrate S from the loaded component tray 26. In the following, the component tray 26 in the first electronic component mounting machine 18 is sequentially carried into the sampling position PP of the third electronic component mounting machine 22 and the same mounting is performed. In this way, in the third electronic component mounting machine 22, many types of electronic components P can be mounted on one substrate S, and a substrate assembly can be created in one place as in so-called cell production. Can be completed.

  In addition, the second read / write head 32 for reading the RFID tag 30 is provided at one place of the entrance of the component tray transport lane 36 of the first electronic component mounter 18, but the present invention is not limited to this. In addition to the one electronic component mounting machine 18, the second electronic component mounting machine 20 and the third electronic component mounting machine 22 may be provided at the entrance of the component tray conveyance lane 36, respectively. In this way, for example, the read / write head in the second electronic component mounting machine 20 can rewrite and record information on the RFID tag 30 for the electronic components used in the first electronic component mounting machine 18. it can. This eliminates the need for the control device 24 to manage and control all data such as grasping various types of data and exchanging confirmation signals, reducing the load on the control device, enabling quick calculation work, and improving work efficiency. Can be increased.

  In the above embodiment, the common electronic component P is supplied by the component supply device 52. However, the present invention is not limited to this. For example, as shown in FIG. . As a result, the facility can be simplified, and the facility cost can be reduced. 11 is different from the first embodiment only in that there is no component supply device, and the other configurations are the same, and thus the same reference numerals are given and description thereof is omitted.

  DESCRIPTION OF SYMBOLS 2 ... Electronic component mounting apparatus, 8 ... Carrier filling apparatus (component tray filling apparatus), 10 ... Component carrier input apparatus (conveyance table), 12 ... Component carrier input apparatus (input conveyor), 18 ... Electronic component mounting apparatus (1st Electronic component mounting machine), 20 ... electronic component mounting apparatus (second electronic component mounting machine), 22 ... electronic component mounting apparatus (third electronic component mounting machine), 24 ... control device, 26 ... component carrier (components) Tray), 30... Identification device / identification member (RFID tag), 32. Identification device / reading device (second read / write head), 36... Carrier conveyance device / component tray conveyance device (component tray conveyance lane), 38. Substrate transfer device (substrate transfer lane), 44... Component transfer device, 46... Identification device (substrate recognition camera), 52... Component supply device, 60. Dimensions code tag), JP ... mounting position, P ... parts (electronic parts), PP ... sampling position, S ... substrate.

Claims (8)

In an electronic component mounting apparatus provided with a substrate transfer device that transfers a substrate and carries it in and out of a mounting position, and a component transfer device that collects components and mounts them on the substrate transferred to the mounting position and creates a substrate assembly ,
A carrier transport device for transporting a component carrier containing a component of a type suitable for the type of the substrate assembly and carrying it in and out of a sampling position corresponding to the mounting position;
An identification member that is provided on the component carrier and stores information indicating the type of the substrate assembly that is created by mounting the component housed in the component carrier on the substrate, and the component that is input to the carrier transport device An identification device that reads information stored in the identification member of a component carrier and identifies the type of the board assembly;
A control device for operating the component transfer device so as to create a substrate assembly of the type identified by the identification device by collecting the component from the component carrier and mounting the component on the substrate carried into the mounting position; ,
An electronic component mounting apparatus comprising: A substrate transport device that transports a substrate to and from a plurality of mounting positions, and a component that is arranged along the substrate transport device, collects components, and sequentially mounts on the substrate that is transported to the mounting position to create a substrate assembly. In an electronic component mounting apparatus provided with a plurality of component transfer devices,
A carrier conveying device arranged in parallel with the substrate conveying device to convey a component carrier containing components of a type suitable for the type of the substrate assembly, and to carry in and out of the sampling position corresponding to the mounting position;
An identification member that is provided on the component carrier and stores information indicating the type of the substrate assembly that is created by mounting the component housed in the component carrier on the substrate, and the component that is input to the carrier transport device An identification device that reads information stored in the identification member of a component carrier and identifies the type of the board assembly;
The carrier conveying device is operated so as to carry the loaded component carrier into the collection position, and the components are collected from the component carrier carried into the collection position, and the substrate is carried into the mounting position. A control device for operating the component transfer device to create a type of board assembly mounted and identified by the identification device;
An electronic component mounting apparatus comprising: In Claim 2, in the carrier conveying device, the sampling position is provided in parallel with each mounting position,
The control device operates the substrate transfer device and the carrier transfer device synchronously so that the substrate and the component carrier are loaded and unloaded in synchronization with the mounting positions and the sampling positions parallel to the mounting positions. The components are picked up from the component carriers carried into the picking positions and sequentially mounted on the boards carried into the parallel mounting positions to create a type of board assembly identified by the identification device. A control device for operating each component transfer device,
An electronic component mounting apparatus comprising: In any one of Claims 1-3, the component supply apparatus which supplies several types of components mounted in the said board | substrate is provided in the base with respect to the said component transfer apparatus,
The control device picks up a component of a type suitable for the type of board assembly identified by the identification device from the component supply device and mounts the component on the substrate loaded into the mounting position. An electronic component mounting apparatus characterized by operating the electronic component. 5. The information according to claim 1, wherein the identification member stores information that associates the type of the component accommodated in the carrier with the position of the carrier in which each type of component is accommodated. An electronic component mounting apparatus characterized by comprising: 6. The carrier filling device according to any one of claims 1 to 5 , wherein the component carrier is filled with a component of a type suitable for the type of the substrate assembly, and the component carrier filled with the component is removed from the carrier filling device. A component carrier input device is provided for input to the carrier conveying device.
The electronic device mounting apparatus, wherein the control device operates the carrier filling device so as to fill the component carrier with a component of a type suitable for the type of the board assembly according to a production plan. In any one of claims 1 to 6, wherein the carrier transport device, the electronic component mounting apparatus characterized by being configured to convey the substrate. In any one of claims 1 to 6, wherein the component carrier is a tray, the carrier transport device, the electronic component mounting apparatus which is a tray transfer device for transferring the tray only.

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