JP2009081456A - Working system for substrate and component control program used therefor - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To smoothly control a working head, which is one kind of components provided in a working system for substrates. <P>SOLUTION: A memory chip 128 is mounted to the working head 26a which is a specific component device, and the working head ID and type are stored therein, and a control module 18 recognizes the working head. On the other hand, a substrate kind corresponding model having information on the substrate kind corresponding the arrangement and the kind of a circuit board is prepared to check whether or not the working head matches the type of the model. When an inappropriate working head is arranged, the information is reported to an operator. The judgement is made when the kind of substrate to handle is changed and the working head is exchanged. In addition, an information concerning the arrangement status of the working head is stored in advance, and in the case where the system is restarted, the judgement can be also made on the basis of the stored information. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an on-board work system that performs work on a circuit board in electronic circuit assembly or the like, such as an electronic component mounting system, and more particularly, to management of various component devices provided in the system.

  An electronic circuit is a circuit board such as a printed circuit board attached with a circuit component such as an electronic component. In assembling the electronic circuit, various types of board work are performed. The substrate work is performed by a substrate work machine including a substrate holding device that holds a circuit board, a substrate work device that performs work on the circuit board held by the substrate holding device, and the like. For example, a component mounter, which is a type of substrate work machine, takes a substrate holding device that holds a circuit board, a component supply device that supplies a circuit component to be mounted, and a circuit component supplied from the component supply device to hold the substrate Various component devices such as a component mounting device that is mounted on the surface of a circuit board held by the device are arranged and configured. In such an on-board work machine, it has begun to be proposed to increase its versatility, for example, as described in the following patent document, various components to be deployed can be detached, and the form of work, work Depending on the type of circuit board to be subjected to the above, it is considered to provide an appropriate one.

JP 2001-111300 A

Problems to be solved by the invention, problem solving means and effects

  However, when various component devices are detachable and can be arbitrarily deployed, the detachment work is performed by the operator. For example, an inappropriate component device may be deployed due to misunderstanding of the operator. There is. In addition, when the component device is replaced, it is assumed that the operation is performed without knowing that the component device has been replaced. In such a case, there is a possibility that the working machine cannot be operated or an inappropriate work is performed. In other words, the substrate work machine in which the component device can be attached / detached has such problems and requires some management of the component device.

  Accordingly, the present invention has been made in order to easily manage the component devices that can be detached in the on-board work system in which any of the component devices is removable. This problem is solved by the above-mentioned substrate-to-board working system and component device management program. As with the claims, each aspect is divided into sections, each section is numbered, and is described in a form that cites the numbers of other sections as necessary. This is for the purpose of facilitating understanding of the present invention, and should not be construed as limiting the technical features described in the present specification and the combinations thereof to those described in the following sections. . In addition, when a plurality of items are described in one section, it is not always necessary to employ the plurality of items together. It is also possible to select and employ only some items.

  In addition, if the relationship between each of the following items and the claims is shown, the combination of the items (1) and (3) corresponds to claim 1, and the technical term of item (6) is added to claim 1. What added the feature added claim 2 to claim 2, added technical feature of claim (10) to claim 2, added claim 3 to claim 3, and added limitation to claim 3 regarding “judgment regarding aptitude head type”. In the present invention, the technical feature of (11) is added to claim 4 to claim 3 or claim 4 to claim 5 to claim 5 or any one of claims 3 to 5 (12). The technical feature of claim 7 is added to claim 6, and any one of claims 2 to 6 is added with the technical feature of (7). What added the technical feature of (8) to any one of Claim 7 is set to Claim 8, to any one of Claims 2 to ( The technical feature of (1) is added to claim 9, and (1) to (9) is added with a limitation on "type of work head". Further, a limitation on “type of mounting head” added to claim 10 corresponds to claim 11 respectively. Moreover, what added the technical feature of the (3) term to the (21) term is equivalent to Claim 12.

(1) A plurality of component devices such as one or more substrate holding devices that hold circuit boards and one or more substrate work devices that perform operations on circuit boards held by the one or more substrate holding devices are provided. A board-to-board working system,
One or more of the plurality of component devices include a specific component device that has an individual information recording medium that records its own individual information and is detachably mounted at a predetermined deployment location in the system. ,
A system for working with a substrate, wherein the system includes a component device recognition unit for recognizing a specific component device arranged based on individual information recorded on the individual information recording medium.

  In the system according to the aspect described in this section, the component device that is made removable is assumed to have its own individual information, and the individual device is acquired to recognize the component device. Since the deployed component device can be recognized, it is possible to easily manage the component device and hence the system.

  The substrate work system according to the aspect of this section may include a substrate work machine that includes the substrate holding device and the substrate work device and exists independently. In that case, it may be an embodiment including only one substrate work machine, or an embodiment including a plurality of substrate work machines each including a substrate holding device and a substrate work device, for example, in an extreme case An aspect in which the line is a system may be used. The board-to-board operation performed by this system is not particularly limited, and is a solder printing operation for printing cream solder on the surface of the circuit board, and an adhesive for fixing circuit components to the surface of the circuit board. Various operations such as an agent application operation, a component mounting operation for mounting circuit components on the surface of the circuit board, and an inspection operation for inspecting the operation results of these operations may be used. Moreover, this system may perform only one type of these various types of operations, or may perform a plurality of types of operations.

  The component device includes a substrate holding device, a substrate working device, and the like, but may be a lower device that constitutes the substrate holding device, the substrate working device, and the like. For example, when the substrate working apparatus includes a working head and a head moving device that moves the working head, each of the working head and the head moving device can be treated as a constituent device. Conversely, the component device may be a higher-level device configured by a combination of the substrate holding device, the anti-substrate enforcement device, and the like. For example, when a plurality of work modules including a substrate holding device and an on-board work device are arranged to constitute one on-board work machine, the work module can also be handled as a constituent device. That is, as long as it is a device that constitutes a part of the system, it can be a component device regardless of its upper and lower order.

  The specific component device is at least a part of the plurality of component devices. The specific component device may be detachable in the system, for example, it may be detachable from a main body unit such as a base portion of the substrate working machine or another component device. “Removable” means that it can be easily mounted / removed, for example, can be mounted / removed without using a tool. In short, if the specific component is relatively small, it is desirable that it can be attached and detached with a single touch. Further, the specific component device may be exchangeable with another specific component device of the same type, or may be exchangeable with a different type of specific component device.

  The individual information recorded by the individual information recording medium included in the specific component device is not particularly limited. For example, device ID information indicating the ID of the specific component device, format information indicating the type, type, etc., specification information indicating the shape, dimensions, position of the component, quantity of the component, etc., degree of failure, Various information such as status information indicating the status such as work accuracy can be included. The recording medium is not particularly limited. For example, a memory element such as a ROM or a RAM, or a dip switch that is electrically connected and can acquire information recorded by it. The information may be acquired by visual and optical means such as a barcode and 2D code (also called QR code), and has a wireless communication function such as a tag chip. Various recording media and recording media using magnetism can be used. According to the type of the individual information recording medium possessed by the specific component device, means capable of acquiring the individual information possessed by the recording medium may be provided in the system.

  The concept of recognition of a specific component device includes recognizing what a specific component device is deployed. For example, it includes recognizing the device ID, format, specifications, status, etc. of a specific component device deployed at a specific deployment location. As a recognition method, for example, in addition to the method of recognizing by reading individual information from the individual information recording medium, some processing is performed on the read individual information or by using the individual information as a clue. The method of recognizing by performing can be adopted. From the viewpoint of automatic recognition, it is desirable that the component device recognition unit for recognizing the specific component device is mainly a computer, and includes a reading device for reading individual information from the individual information recording medium. It is desirable that The component device recognition unit may be provided at any location within the system. For example, when the system includes a control device that controls the entire system, the component device recognition unit may be provided in the control device, and the control device that controls a specific component device to be recognized is In the case of being provided in any other specific component device, an aspect provided in any other specific component device may be employed.

(2) The board-to-board working system according to item (1), wherein the one or more board-to-board working apparatuses include a part mounting apparatus for mounting circuit components on a circuit board, and the system functions as a part mounting system.

  The component mounting operation is a complicated task among the board-to-board operations, and the component mounting system that implements the component mounting operation requires various types of components. In view of such a situation, a component mounting system that performs a component mounting operation has a large profit by recognizing a component device.

(3) The one or more counter-to-substrate work apparatuses include a work head that performs a main work of the counter-board work, and a work head moving device that moves the work head. The board-to-board working system according to (1) or (2).

  A mode in which the work head is included in the specific component device is the mode described in this section. A system having an on-board work apparatus in which work heads can be variously changed according to work types is a highly versatile system. The work head is a component that performs the main work in the substrate work apparatus, and includes, for example, a work head that is moved relative to the circuit board. The head moving device may be, for example, an XY robot type moving device or the like, but is not limited to one that moves the working head itself, and may be a relative moving device that relatively moves the working head and the circuit board. . Aspects that can be exchanged with work heads of the same configuration and modes that can be exchanged with work heads of different configurations are also included in the aspects described in this section. As an aspect that can be exchanged with work heads having different configurations, it is possible to adopt an aspect in which work heads of different types of work are exchanged. For example, the working head may be exchanged between a mounting head, an adhesive application head, an inspection head, and the like, and the substrate working apparatus may function as a component mounting apparatus, an adhesive application apparatus, or an inspection apparatus. When the substrate working apparatus is a component mounting apparatus, the working head is a mounting head, and the mounting head generally includes a component holding device such as a suction nozzle. As an aspect relating to the mounting head, for example, it is possible to adopt an aspect in which a mounting head including a mechanism for raising and lowering the device, a mechanism for rotating the device, and the like together with their drive sources is detachable.

(4) The one or more on-board working apparatuses include a component mounting apparatus for mounting circuit components on a circuit board, and the system includes a component supply apparatus for supplying circuit components mounted by the component mounting apparatus. The board work system according to any one of (1) to (3), wherein the component supply device is a specific component device.

  In the case of a system that performs a component mounting operation including a component mounting device, a component supply device that supplies circuit components is often provided. Specifically, the component supply device may employ a bulk feeder, a tray-type component supply device, etc., including a tape feeder that supplies components from circuit component taping (tape of electronic components). it can. Since various types of circuit components are mounted on one circuit board, in a system for performing a component mounting operation, a large number of component supply devices are provided according to the type of the circuit board, and the circuit board to be operated Since the deployment contents of the component supply device are changed every time the type of the component is changed, the actual benefit of recognizing the component supply device as the specific component device is great.

(5) The system
A plurality of substrate work modules including at least one of the one or more substrate holding devices and at least one of the one or more substrate work devices are arranged in a line according to the order of work. Configured,
5. The substrate work system according to any one of items (1) to (4), wherein the substrate work module is the specific component device.

  For example, a system in which a plurality of work modules can be exchanged with respect to one base can be changed and exchanged in units of modules, so that the system is extremely versatile. In such a case, the actual benefit from recognizing the work module is great.

(6) The system includes a deployment state propriety determination unit that determines the propriety of the deployment state of the specific component device that is deployed based on the recognition result of the component device recognition unit (1) to (5) The board | substrate working system in any one of claim | items.

  If it is possible to determine the suitability of the deployment state of the specific component device, for example, loss due to an inappropriate component device being deployed can be avoided, and it is easy to prevent erroneous work and maintain work accuracy. In determining whether or not the deployment state is appropriate, for example, it is determined whether or not the specific component device being deployed itself is defective or malfunctioning, and whether or not the type and type of the specific component device being deployed is different. Various suitability determinations such as suitability determination based on the fact that the specific component device is not deployed at an appropriate deployment location are included. Although not the mode described in this section, it is possible to adopt a mode in which the work program executed by the system is changed based on the recognition result by the component device recognition unit. Further improvement in the versatility of the work system can be expected.

(7) The deployment status suitability determination unit
If any of the specific configuration devices that have been deployed is detached from the system and another specific configuration device is installed at the deployed location, the deployment status of the specific configuration device that has been deployed The on-board work system according to item (6), further including a device mounting time determination unit that determines suitability.

  The aspect described in this section includes an aspect in which, for example, when any specific component device is replaced, it is determined whether the replaced new specific component device is appropriate. When the specific component device is forced to be replaced for some reason, it becomes a mode in which work loss can be prevented in advance.

(8) The deployment status suitability determination unit
When the operation is started after the system is stopped, it has an operation start time determination unit for determining the suitability of a specific component device that is deployed, as described in (6) or (7). Work system.

  The mode described in this section includes a mode of confirming the deployment state of the specific component device when the system is turned on, for example, at the start of operation of the factory or at the start of operation after a break. Even when the component device is made recognizable, it is assumed that the component device cannot be recognized, for example, when the system is turned off. More specifically, when a component device is replaced while the power is not turned on, the system cannot recognize the fact of the replacement. Even in such a case, it is possible to prevent work loss by determining whether or not the specific component device deployed at the time of power-on is appropriate.

(9) The deployment status suitability determination unit
Any of (6) to (8), which has a board type change judgment section that judges the suitability of a specific component device that is deployed when the type of circuit board targeted by the system is changed The board-to-board working system described in 1.

  In general, an on-board work system performs an on-board work on a circuit board by operating according to a work program. The work program varies depending on the type of circuit board. For example, when the circuit board to be worked is changed, or when a so-called setup change is performed, the work program for the changed circuit board is selected and executed. Is done. The on-board work system described in this section includes a mode of determining whether or not the specific component device is appropriate at the time of such a change of stage. At the time of setup change, it is expected that many specific component devices will be changed, exchanged, etc., and there is a high possibility that the component devices to be installed will be mistaken. Therefore, the merit of determining suitability at that time is great.

(10) The system includes a proper deployment information storage unit that stores proper deployment information related to a proper deployment state of a specific component device to be deployed,
The deployment state suitability determination unit determines suitability of the deployment state of the specific component device deployed based on the proper deployment information stored in the proper deployment information storage unit (6) to (9) The on-board working system according to any one of (9).

  If the proper deployment status of the specific component device being deployed is recognized, it is possible to easily determine the suitability by comparing the recognized appropriate deployment status with the deployment status of the recognized specific configuration device. Is possible.

(11) The counter board according to (10), wherein the appropriate deployment information storage unit includes a current deployment information storage unit that stores current deployment information related to a deployment state of a specific component device currently deployed as the proper deployment information. Work system.

  In the aspect described in this section, for example, when it is determined that the current deployment state is appropriate, the state is stored as the appropriate deployment state, and a new deployment is performed based on the stored state. A mode for determining the suitability of the state is included. For example, it is suitable for the determination described above when the specific component device is replaced, the determination when the power is turned on again, and the like.

(12) The board type-corresponding deployment in which the proper deployment information storage unit stores board type-corresponding deployment information relating to the deployment state of the specific component device determined in correspondence with the type of circuit board to be worked as the proper deployment information. The on-board working system according to (10) or (11), comprising an information storage unit.

  In the aspect described in this section, for example, based on a work program executed by the system to perform work, information on an appropriate deployment state of the specific configuration device is created, and the deployment state is created based on the created information. The mode which judges the propriety of is included. This is particularly effective for the determination made when the type of the circuit board to be worked is changed as described above.

(21) A plurality of component devices such as one or more substrate holding devices that hold circuit boards and one or more substrate work devices that perform operations on circuit boards held by the one or more substrate holding devices are provided. A program executed by a computer for managing a deployed component device in a board-to-board system configured as described above,
One or more of the plurality of component devices include a specific component device that has an individual information recording medium that records its own individual information and is detachably mounted at a predetermined deployment location in the system. And
A component device recognition step for recognizing a specific component device deployed based on the individual information recorded in the individual information recording medium;
A configuration management program for a board work system, comprising: a deployment status suitability determination step that determines whether a deployment status of a specific configuration device deployed based on a recognition result in the configuration device recognition step.

  According to the configuration device management program described in this section, it is possible to easily perform the suitability of the configuration status of the configuration device, avoid a loss caused by an inappropriate configuration device being deployed, and prevent errors in the on-board work system. It is easy to prevent work and maintain work accuracy. Since it overlaps with the said description, detailed description is abbreviate | omitted. The management program can be implemented in the form of combining the technical features described in paragraphs (2) to (5) and (7) to (10) in this section. Benefit from technical features.

(31) A recording medium on which the component device management program for a substrate-working system according to item (21) is recorded so as to be readable by a computer.

  As described above, the management program recorded on the recording medium described in this section is based on the technical features described in the items (2) to (5) and (7) to (10). It can implement in the aspect combined with the term.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. The present invention is by no means limited to the following embodiments, and includes, in addition to the following embodiments, the aspects described in the above section [Problems to be Solved by the Invention, Problem Solving Means and Effects]. The present invention can be implemented in various modifications and improvements based on the knowledge of those skilled in the art.

<Configuration of substrate working system, etc.>
FIG. 1 is an overall perspective view of a substrate working system 10 according to an embodiment of the present invention. The substrate-based work system 10 includes a base module 12, a plurality of work modules 14 arranged adjacent to and in alignment with each other on the base module 12, and the base module 12 and the work module 14 being separated from each other. And a control module 18 as a system control device for controlling the entire system. In this embodiment, two types of work modules 14a and 14b are provided. A plurality (seven) of work modules 14a, which is one of the two types of work modules 14a and 14b, are provided, but they have substantially the same configuration in terms of hardware except for a work head described later. It is supposed to be. On the other hand, the other work module 14b is a twin-type work module having a structure in which two work modules 14a are connected. Hereinafter, two types of work modules are collectively referred to as a work module 14 unless otherwise specifically described. The working modules 14 are arranged in the direction in which the circuit boards are conveyed. In the description of the substrate work system 10, the direction in which the work modules 14 are arranged is referred to as the left-right direction, and the direction perpendicular thereto is referred to as the front-rear direction. That is, the left front in the figure is the front, that is, the front side of the substrate work system 10, and the right rear is the rear, that is, the back side. Further, the left side of the work system 10 with respect to the substrate is the upstream side and the right side is the downstream side, and the circuit board is transported from the work module 14 located on the left side toward the work module 14 located on the right side. Then, the substrate work in each work module 14 is sequentially executed.

  The on-board working system 10 can also be considered as being configured by a single on-board working machine. In other words, each work module 14 arranged in the on-board work system 10 is assumed to have a function as a on-board work system. Although each of 14 can be considered as an on-board working system, in this embodiment, the on-board working system 10 is handled as an assembly of work modules 14. Each work module 14 can also be equipped with a work head such as an adhesive application head and an inspection head. However, in order to simplify the explanation, in this embodiment, circuit parts such as electronic parts are used as work heads. Only a mounting head for mounting is mounted. Accordingly, the work module 14 is a mounting module, and the substrate work system 10 is a component mounting system. In the following description, when focusing on component mounting, the on-board work system 10 is called the component mounting system 10 and the work module 14 is called the mounting module 14, and these names may be used properly.

  FIG. 2 is an enlarged view of a portion where the two mounting modules 14a are arranged, and the right mounting module 14a is shown with an exterior plate or the like removed. As shown in this figure, each mounting module 14a includes a frame 20 that functions as a module housing, and various components arranged on the frame 20. For example, a plurality of tape feeders (hereinafter sometimes abbreviated as “feeders”) 22 that are arranged side by side as component supply devices and supply circuit components one by one at a predetermined component supply position, and circuit boards It has a conveyor unit 24 and a work head 26 as a substrate holding device that has a function to convey and fixes and holds a circuit board at a predetermined work position, and moves the work head 26 in the work area. And a substrate working apparatus 28 that causes the substrate 26 to perform the substrate work. In the present embodiment, the work head 26 is a mounting head 26 that holds and takes out the circuit components supplied from the feeder 22 and mounts the circuit components on a circuit board fixed to the conveyor unit 24. The device 28 functions as a mounting device. In the following description, when focusing on component mounting, the work head 26 is referred to as the mounting head 26, and the substrate working device 28 is referred to as the mounting device 28.

  The mounting module 14a includes a component camera (CCD camera) mainly functioning as a component imaging device between a group of a plurality of feeders 22 (hereinafter sometimes referred to as “feeder group”) 30 and the conveyor unit 24. 32), a nozzle stocker 34 as a component holding device storage device for storing a suction nozzle which is a component holding device described later, and a nozzle tip height detector 36 used in a calibration process described later. Has been deployed. Further, each mounting module 14a has a module control device 38 for controlling itself, and the module control device 38 operates while controlling each of the above devices. Each of the mounting modules 14a is provided with an operation / display panel 40 as an input / output device in the upper part. This operation / display panel 40 is connected to the module control device 38, and an operator input for various commands, information, etc. Is received, and information on the status of the mounting module 14 and its components is displayed.

  As shown in FIG. 3, each of the plurality of feeders 22 is roughly divided into a feed mechanism unit 42 and a reel holding unit 44. The reel holding unit 44 holds a reel 48 around which a circuit component taping (in the case of an electronic component, sometimes called electronic component taping) 46 is wound. The feed mechanism section 42 has a drive source therein, and the taping 46 extending from the reel 48 is fed by the feed mechanism section 42 at a component holding pitch corresponding to the operation of the mounting apparatus 28, and the cover tape is The circuit components are supplied one by one at the component supply position.

  The feeder 22 further includes a memory chip 50 as an individual information storage medium for recording its own unique information. The memory chip 50 can be connected to the module control device 38 by attaching the feeder 22 to a feeder support table 52 provided in the actual frame 20. Connection of these wirings is performed with one touch by a connector not shown. The feeder support table 52 includes a plurality of slots, which are locations where the feeders 22 are arranged, and one feeder 22 is installed in one of the slots. Any feeder 22 can be mounted in any slot, and the memory chip 50 is connected to the module control device 38 for each slot in which the feeder 22 is mounted. The memory chip 50 is a RAM chip backed up by a battery, and various information can be rewritten. In the present embodiment, the memory chip 50 stores feeder ID information related to the ID of the feeder 22. The memory chip may include information on the format of the feeder 22, information on the type of taping, information on the feed pitch and suction offset amount, and the like. In addition, a dip switch or an ID chip may be provided as an individual information storage medium instead of a memory chip. Since the feeder and taping are well-known mechanisms and configurations, the description here is to this extent.

  As shown in FIG. 4, the conveyor unit 24 mainly includes a conveyor device, and includes two conveyor devices, a front conveyor 60 and a rear conveyor 62. Each of the front conveyor 60 and the rear conveyor 62 includes two opposed conveyor rails 64, 66, 68, and 70, and the conveyor belts 64, 66, 68, and 70 are conveyor belts (not shown). The circuit board 71 is supported by the conveyor belt and is transferred around the motor 72. The conveyor unit 24 is provided in each of the plurality of mounting modules 14 a, and each of the conveyor units 24 is positioned on a straight line in the component mounting system 10. The conveyor units 24 of the respective mounting modules 14a can transport the circuit board 71 in cooperation with each other. That is, these conveyor units 24 constitute a board transfer device in the component mounting system 10. The conveyor rails 66, 68, and 70 other than the conveyor rail 64 can be moved in the front-rear direction by a conveyor width adjusting motor 74. The conveyor width can be freely adjusted, and the front conveyor 60, the rear conveyor 62, By using only one of these, it is possible to transport a circuit board having a large width.

  The circuit board 71 transferred to the work area by controlling and driving the conveyor motor 72 is stopped at the work position that is the set stop position. The conveyor unit 24 has a circuit board support plate (hereinafter sometimes abbreviated as “support plate”) 76 that can be moved up and down by a lifting device (not shown) at the lower portion. The support pins to be omitted are provided so as to be changeable to arbitrary positions. When the support plate 76 is raised, the circuit board 71 is raised by being supported by the support pins, and the engagement with the conveyor belt is released. At the same time, the circuit board 71 is fixed at the working position by being sandwiched between a part of the conveyor rails 64, 66, 68, and 70 and the support pins. To release the fixation, the support plate 76 may be lowered. With such a configuration, the conveyor unit 24 functions as a substrate holding device in the mounting module 14a.

  As shown in FIG. 5, the mounting apparatus 28 includes a mounting head 26 and a head moving device (functioning as a mounting head moving device) 80 that moves the mounting head 26 along substantially one plane in the work area. Composed. The head moving device 80 is a kind of relative moving device that relatively moves the mounting head 26 and the circuit board 71 held by the conveyor unit 24. The mounting head 26 will be described in detail later. The head moving device 80 is an XY robot type moving device, and includes a Y slide device 82 that moves the mounting head 26 in the front-rear direction and an X slide device 84 that moves the mounting head 26 in the left-right direction. The Y slide device 82 is provided on a beam 86 that forms a part of the frame 20, and moves the Y slide 90 along the Y guide 92 via a ball screw mechanism by driving a Y axis motor 88. The X slide device 84 is provided on the Y slide 90 and moves the X slide 96 along the X guide 98 via a ball screw mechanism by driving an X axis motor 94. The mounting head 26 is structured to be attached to the X slide 96. Since the mechanism relating to the mounting / demounting of the mounting head 26 with respect to the X slide 96 is not directly related to the present invention, the description is omitted. The mounting head 26 is moved by the head moving device 80 across the feeder group 30 and the circuit board 71 fixed in the conveyor unit 24. The X slide 96 is provided with a mark camera (which is a CCD camera) 100 below the X slide 96. The mark camera 100 mainly functions as a board imaging device and images a reference mark or the like attached to the surface of the circuit board 71. The mark camera 100 is moved together with the mounting head 26 by a head moving device 80.

<Configuration of working head>
In the present embodiment, the mounting head 26 that is a work head can be attached to and detached from the head moving device 80, and can be selected and attached from a plurality of different structures. That is, the mounting device 28 can replace the mounting head 26 with a different type. FIG. 6 shows three mounting heads 26a, 26b, and 26c as examples of work heads that can be mounted. Briefly describing each, the mounting head 26a shown in FIG. 6A is a mounting head of a type that includes a plurality (eight) of mounting units 110 each having a generally shaft shape, and rotates them in an index manner. The operation of the mounting head 26a will be briefly described. The mounting unit 110 has a suction nozzle 112 as a component holding device that sucks and holds circuit components at the lower end thereof. With the mounting head 26 a positioned above the feeder group 30, one of the mounting units 110 is lowered, and the suction nozzle 112 of the mounting unit 110 holds the circuit components supplied at the component supply position of the feeder 22. The circuit component is taken out. The mounting units 110 are intermittently rotated, and each mounting unit 110 sequentially takes out circuit components. With each mounting unit 110 holding circuit components, the mounting head 26 a is moved above the circuit board 71 fixedly held by the conveyor unit 24. Above the circuit board 71, one mounting unit 110 located at a position lowered when taking out the components is lowered, and the circuit components held by the mounting unit 110 are placed on the surface of the circuit board 71. The mounting units 110 are intermittently rotated, and the circuit components held by the mounting units 110 are sequentially placed on the circuit board 71. The mounting head 26a is a mounting head that performs such an operation, and is a mounting head suitable for high-speed mounting of relatively small circuit components. Although illustration is omitted, there are some mounting heads of the same type as the mounting head 26a that have different numbers of mounting units.

  A mounting head 26c shown in FIG. 6C is a mounting head equipped with one mounting unit 110. The mounting unit 110 is moved up and down above the feeder 22 and above the circuit board, so that the feeder 22 and the circuit board 71 are connected to each other. One circuit component is mounted in one round trip. Although the mounting head 26c has a relatively slow mounting speed, the mounting head 26c can also be equipped with a relatively large suction nozzle 112, and can mount large circuit parts or specially shaped circuit parts. Head. The mounting head 26b shown in FIG. 6B is a mounting head having two mounting units 110, and is a mounting head having intermediate characteristics of the mounting head 26a and the mounting head 26c. Of the two mounting units 110, the front mounting unit 110 has a plurality of suction nozzles 112 arranged radially around an axis perpendicular to the axis of the mounting unit 110. The nozzle to be used can be selected by being rotated around its axis. The mounting module 14a can be mounted with one module arbitrarily selected from the mounting head described above according to the mode of mounting work. 2 and 5, the mounting head attached to the head moving device is the mounting head 26a.

  A more detailed configuration of the mounting head will be described with reference to FIG. 7, taking the mounting head 26a as an example. FIG. 7 shows the head cover removed. The mounting head 26a includes a plurality of, more specifically, eight mounting units 110, and each mounting unit 110 holds a suction nozzle 112, which is a circuit component holding device, at the tip. Although not shown, each of the suction nozzles 112 is connected to negative pressure air and a positive pressure air passage via a positive / negative pressure selective supply device, and holds and holds the circuit components at the tip portion with a negative pressure. The circuit components held by the positive pressure are supplied to be detached. The mounting unit 110 having a generally axial shape is held on the outer peripheral portion of the unit holder 114 that rotates intermittently at an equiangular pitch so that the axial direction is the vertical direction. In addition, each mounting unit 110 can rotate and can move in the axial direction, that is, can be moved up and down. The unit holding body 114 is driven by a unit holding body rotating device 118 having a holding body rotating motor 116 which is an electric motor (servo motor with encoder) as a driving source, and intermittently rotates by an angle equal to the arrangement angle pitch of the mounting unit 110. The mounting unit 110 is intermittently rotated by being (also referred to as index rotation). In a unit lifting / lowering station that is one stop position of the mounting unit 110 in intermittent rotation (the station positioned at the forefront), the mounting unit 110 positioned at that station is a unit lifting / lowering motor 120 that is an electric motor (servo motor with encoder). Is lifted and lowered by a unit lifting and lowering device 122 having a drive source. The operation of taking out the circuit components from the feeder 22 and the operation of mounting the circuit components on the circuit board 71 held by the conveyor unit 24 are performed by the mounting unit 110 located in this lifting / lowering station. Is lowered a predetermined distance. Further, each mounting unit 110 is rotated by a unit rotation device 126 having a unit rotation motor 124 as an electric motor (servo motor with encoder) as a drive source for the purpose of adjusting the mounting direction of the suctioned and held circuit components. Be made. The plurality of mounting units 110 have a structure that can rotate all at once. The above is the main configuration of the mounting head 26a.

  The structures of the mounting heads 26b and 26c, which are other mounting heads, are the same, but there is a difference in structure depending on the configuration. If only the difference is demonstrated, the mounting head 26c is a thing of the structure provided with only one mounting unit 110, and does not have the unit holding body rotating apparatus 118 with which the mounting head 26a is provided. Further, the mounting head 26b has two mounting units 110 and they can be moved up and down independently, and thus has two unit lifting devices 122. Furthermore, in one mounting unit 110, A nozzle selection device for selecting the suction nozzle 112 is provided.

  In the present embodiment, the work module 14 can be provided with various work heads 26, but all the work heads 26 have the same structure regarding the mounting mechanism. It can be detached with a single touch, and an arbitrary work head 26 can be mounted with a single touch. Further, the work head 26 can be controlled by the module control device 38 in a mounted state. For this reason, power lines, control lines, and the like for various drive sources provided in the working head 26 are connected to the head moving device 80, but these wirings are also connected by a single touch with a connector (not shown). . Further, the work head 26 includes a memory chip 128 as an individual information storage medium for recording its own unique information, and this memory chip 128 can also be connected to the module control device 38. The memory chip 128 is a RAM chip backed up by a battery, and various information can be rewritten. In the memory chip 128, individual information regarding the head ID, the format, and the like is recorded. The use of the stored information will be described later.

<Another aspect of work module>
The other work module 14b will be described. As shown in FIG. 8, the work module 14b is configured as if two sub-modules 140 including substantially the same components as those of the work module 14a are incorporated in one frame 138. This is a twin type work module. Each of the submodules 140 includes an operation / display panel 40 and a submodule control device 142, and can be controlled independently of each other. The work module 14b also has a common control device that is connected to the two submodule control devices 142 and controls the two submodules 140 in an integrated manner. The constituent devices, operations, and the like of each submodule 140 are the same as those of the work module 14a, and a description thereof will be omitted here.

  FIG. 9 shows a block diagram relating to the control of the work module 14b. As shown in FIG. 9, the two submodule control devices 142 are connected to a common common control device 144, and execute the operations of the two submodules 140 in cooperation with each other under the control of the common control device 144. be able to. In the figure, one of the two submodule control units 142 is described in detail, and the other is omitted. Since the sub-module control device 142 has substantially the same configuration as the module control device 38 of the mounting module 14a described later, the description will be given later. In the work module 14 b, communication with other work modules 14 and the control module 18 is performed by the common control device 144. The work module 14a will be described later. In the twin-type work module 14b, the common control device 144 is provided with information on the format, information on the format, status information on the sub-module 140 that the machine itself has, and the like. Individual information is stored.

  The two operation / display panels 40 in the work module 14b are characteristic. Similar to the operation / display panel 40 of the work module 14a, each operation / display panel 40 displays information about the submodule 140 provided therein, and can input an operation regarding the submodule 140 provided therein. . Therefore, for example, in the case of a setup change or the like, each submodule 140 can be operated independently in order to cause each submodule 140 to perform another work or the like. Therefore, although it is one work module 14b, it can be handled in the same way as two work modules connected. On the contrary, by selecting the mode, each operation / display panel 40 can function as an operation panel as a common operation of the two submodules 140. As a simple example, it is possible to perform operations such as starting and stopping the mounting work from any operation / display panel.

<Base module configuration and work module deployment>
FIG. 10 shows a perspective view of the base module 12. The base module 12 is configured so that eight basic width work modules can be provided. Since the mounting module 14a has a basic width, eight units can be arranged, and the twin type mounting module 14b has a module width twice the basic width, so that four units can be arranged. Note that the base module is divided into four sections, and the mounting module 14b cannot be deployed across the two sections. Inside the base main body 150 of the base module 12, a common device for the work module 14, a power supply unit as a common device, a piping device from an external positive pressure and negative pressure air source, and the like are provided. A driving force supply unit that supplies driving force to the module 14 is configured. In addition, although not shown in the drawing, the base main body 150 is also provided with control signals between the work modules 14 and with the control module 18, communication cables for exchanging information, terminals thereof, and the like. .

  In addition, an opening is provided in the top plate of the base body 150 for each section in the upper part near the front part, and the carrier tape of the taping 46 discharged from the feeder 22 is provided inside the base body 150 that communicates with the opening. A tape recovery container 152 for recovering the top cover tape or the like is provided. The tape collection container 152 is used when the work module to be deployed is a mounting module. Although not described, the mounting module 14 is provided with a cutter device that cuts a carrier tape or the like, and is configured so that the arbitrarily cut carrier tape or the like is discharged to the tape collection container 152. A tape recovery device that is a shared device of the mounting module 14 is configured including the opening, the tape recovery container 152, and the like. In addition, although illustration is abbreviate | omitted, those collect | recovered tapes can be taken out of the base module 12. FIG.

  As shown in FIG. 10, on the upper part of the base module 12, a rail row 156 is provided in which a plurality of guide rails 154 are arranged in a straight line. Specifically, four rail rows 156 are provided for one section, and 16 rail rows 156 are provided for the entire base module. Explaining one section, the left and right outer rail rows 156 are each composed of two guide rails 154 when viewed from the front, and the inner two rows of rail rows 156 each have three guide rails. 154. The four rail rows 156 are arranged in parallel to each other. The four rail rows 156 can be divided into two rail pairs 158. The two rail pairs 158 are equally spaced from each other in the rail rows 156 constituting each rail pair 158. When the work modules 14a having the basic width are arranged side by side in one section, the rail pair 158 constituted by the right two rail rows 156 is related to the right work module 14a, and the left two rail rows 156 are arranged. The rail pair 158 constituted by the above is related to the left work module 14a. When the work module 14b having a width twice the basic width is arranged in one section, the left and right outer rail rows 156 are related to the work module 14b. These configurations are the same in the four sections.

  Further, a stopper 160 as a locking member for locking the work module 14 is provided on the upper part of the base module 12, one at the rear of the upper part and in the middle of each of the two rail pairs 158. When the work module 14 is moved along the guide rail 154, a contact member (not shown) provided on the work module 14 comes into contact with the stopper 160, and further movement of the work module 14 to the rear is prohibited. Is done. Further, a fixing device 162 for fixing the work module 14 in cooperation with the stopper 160 is provided on the base module 12. The fixing device 162 includes an urging device having a cylinder device as an urging force generating device, and engages with a part of the work module 14 in a state where the abutting member is in contact with the stopper 160 and moves it backward. The contact state of the contact member with the stopper 160 is maintained and the work module 14 is prevented from moving forward.

  When the fixing by the fixing device 162 is released and the work module 14 is moved forward along the device track, the work module 14 can be moved so as to overhang from the base module 12, but when the movement distance is large The work module 14 may fall from the base module 12. Therefore, the system 10 is provided with a table device 164 on which at least a part of the work module 14 can be placed. FIG. 11 shows the table device 164 and the usage state of the table device 164. The table device 164 has a width that is slightly larger than the width in the left-right direction of the work module 14 (width in the circuit board transfer direction), is substantially the same as the length in the front-rear direction of the mounting module work, and is substantially the same as the top surface of the base module 12. It is mainly composed of a base 166 having an upper surface of the same height. Two guide rails 168 having the same cross-sectional shape as the above-described guide rail 154 are provided on the upper surface of the base portion 166. The two guide rails 168 are arranged in parallel with each other, and the distance between them is equal to the distance between the two rail rows 156 constituting the one rail pair 158. The table device 164 is configured so that each of the two guide rails 168 extends a pair of rail rows 156 with which the work module 14 to be moved is engaged. Positioned and positioned beside the front.

  After arranging the table device 164, the fixing device 162 described above is operated to release the work module 14, and the work module 14 is moved forward. A part of the work module 14 is placed on the table device 164 in a state where a certain distance is moved. In this state, a part of the moved work module 14 is shifted forward with respect to the other work module 14 adjacent to the work module 14, so that work such as maintenance and adjustment can be easily performed. That is, the table device 164 functions as an auxiliary base module in the system 10. Then, by moving the work module 14 further forward, the work module 14 is transferred to the table device 164. FIG. 11 shows this transferred state. Note that the state indicated by the alternate long and short dash line in FIG. 11 is a state in which a part of the work module 14 is placed on the table device 164. In a state where the work module 14 is transferred to the table device 164, the work module 14 is separated from the base module 12. The above description with reference to FIG. 11 relates to the work module 14 whose module width is the basic width. Although detailed description is omitted, in the case of the work module 14 having a module width twice the basic width such as the mounting module 14b, a table device corresponding to the width is prepared.

<Control devices, etc.>
The on-board work system 10 includes a module control device 38 (a sub-module control device 142 and a common control device 144 in the case of a twin-type mounting module 14b) disposed in each work module 14 in order to control each work module 14. The work module 14 is controlled by a control module 18 as a work machine control device that controls each work module 14 in an integrated manner, and a part that forms the center of work control exists in each module control device 38. FIG. 12 is a block diagram relating to the control of the module control device 38, focusing on the portion closely related to the present invention, taking the mounting module 14a as an example. Since the sub-module control device 142 in the twin-type mounting module 14b is similarly configured, the description of the sub-module control device 142 in FIG. 9 is substituted for the following description. 9 and 12 are block diagrams when the mounting head 26a is mounted as a work head.

  The module control device 38 is a control device mainly composed of a computer 180. The computer 180 includes a PU (processing unit) 182, a ROM 184, a RAM 186, an input / output interface 188, and a bus 190 that connects them to each other. Have. Each input / output interface 188 is connected to each feeder 22, the conveyor unit 24, the head moving device 80, and the mounting head 26 a, which are arranged as a feeder group 30, via a drive circuit 192. In addition, the component camera 32 and the mark camera 100 are connected to the input / output interface 188 via the control circuit 194, and imaging data obtained by them is taken in via the image processing unit 196 that performs image processing. An operation / display panel 40 and an external storage device 198 mainly composed of a hard disk are also connected to the input / output interface 188. The substrate-based work system 10 is configured such that each of the plurality of work modules 14 exchanges various signals to operate, and therefore, the other work modules 14 are connected to the input / output interface 188 via the communication circuit 200. Is connected. In addition, the control module 18 serving as a host of the module control device 38 is also connected via the communication circuit 200, and communication of signals, information, and the like is possible between them. That is, each work module 14 and the control module 18 are connected to each other by the LAN 202. The external storage device 198 stores a basic operation program of the work module 14, application programs such as a mounting program corresponding to the circuit board 71, various data related to the circuit board 71, circuit components, and the like. At the time of work, necessary ones are transferred to the RAM 186 and stored, and mounting work is performed based on the stored contents of the RAM 186. Further, the memory chips 50 and 128 included in the feeder 22 and the work head 26 are also connected to the input / output interface 188 so that information can be exchanged with the module control device 38. In the mounting module 14a, individual information such as its own module ID, format, and status is stored in the RAM 186.

  The control module 18, which is a system control device, is not shown in the block diagram, but is mainly a computer including a PU, ROM, RAM, an input / output interface, etc., an external storage device, an input device such as a keyboard, and an output device such as a display. And has a communication function for exchanging various signals and data with each work module 14, plays a role of managing each work module 14 in an integrated manner, and is necessary for the substrate work system 10. It also plays a role as a database of various data. A mounting program or the like for each work module 14 is distributed from the control module 18. Further, as will be described below, the control module 18 also has a function of performing communication between the substrate work system 10 and the outside.

  FIG. 13 schematically shows a state where the substrate work system 10 is arranged in the factory. In the figure, three counter-to-board working systems 10 of the same type are arranged. Each of the on-board work systems 10 is connected so as to be able to exchange information with each other, and is connected to a management computer 204 having a database function regarding various data so as to be able to exchange information with each other. These on-board work system 10 and management computer 204 are also connected by a LAN 206. The management computer 204 has a database function related to a work program corresponding to the circuit board 71, a database function related to specifications of various circuit components, and the like. The management computer 204 also has a function as a configuration device management device that manages a specific configuration device described later. As information closely related to the present invention, defect information (a kind of status information) relating to the work module 14, the work head 26, the feeder 22, and the like is stored, and which reel 22 holds which circuit component in which feeder 22. Component information indicating whether or not the component is mounted is stored in a format in which the feeder ID and the circuit component type are associated with each other.

<Component mounting work>
The component mounting operation by one mounting module 14a (one sub-module 140 in the twin type mounting module 14b) to which the mounting head 26 is mounted will be briefly described. As the mounting head 26, an index type mounting head 26a is mounted.

  First, the circuit board 71 transferred from the upstream side is stopped at the set work position in the work area by the conveyor unit 24. At that position, the stopped circuit board 71 is fixed by the conveyor unit 24 by raising the circuit board support plate 76 by the lifting device. Next, the mark camera 100 is moved above the reference mark attached to the circuit board 71 by the head moving device 80 and images the reference mark. A shift in the holding position of the held circuit board 71 is detected from the imaging data.

  Next, the mounting head 26a is moved above the feeder group 30, and the circuit components are sucked and held by the suction nozzle 112 in accordance with the set extraction order. Specifically, the mounting unit 110 located in the lifting station is positioned above the component extraction position of the feeder 22 that supplies the circuit components to be held, and the mounting unit 110 is lowered at that position. A negative pressure is supplied to the suction nozzle 112 held at the tip, and the circuit component is sucked and held. Then, the mounting unit 110 is intermittently rotated, and a similar component extraction operation for the next mounting unit is performed. In this manner, component extraction operations (in many cases, eight times) are sequentially performed on the mounting unit 110 included in the mounting head 26a.

  Next, the mounting head 26 a holding the circuit component is moved above the component camera 32. At that position, the component camera 32 images the held circuit component within one field of view. A shift in the holding position of each circuit component is detected from the obtained imaging data. Subsequently, the mounting head 26 is moved to above the circuit board 71, and the held circuit components are placed on the surface of the circuit board 71 in accordance with the set mounting order. Specifically, first, the mounting unit 110 located in the unit lifting / lowering station is positioned above an appropriate placement position. At this time, the movement position of the mounting head 26a is optimized based on the detected holding position deviation amount of the circuit board 71 and the holding position deviation amount of the circuit component. At that position, the mounting unit 110 is lowered by a predetermined distance, positive pressure is supplied to the suction nozzle 112, and the held circuit component is placed on the surface of the circuit board 71. Subsequently, the mounting unit 110 is intermittently rotated, and a similar placement operation regarding the next mounting unit 110 is performed. In this manner, component mounting operations are sequentially performed on the mounting unit 110 that holds circuit components. Prior to the lowering of the mounting unit 110 in the mounting operation of each mounting unit 110, the mounting direction set for the circuit components held by the mounting unit 110 and the detected circuit board holding position deviation amount Based on the amount of displacement of the holding position of the circuit component, it is rotated to an appropriate rotational position, thereby optimizing the placement direction of the circuit component.

  The mounting head 26a is reciprocated between the feeder group 30 and the circuit board 71 until the mounting of all scheduled circuit components is completed, and the component extraction operation and the component placement operation are repeatedly performed. After all the circuit components have been mounted, the support plate 76 of the conveyor unit 24 is lowered by the lifting device, and the fixed holding of the circuit board 71 is released. The circuit board 71 is transferred downstream by the conveyor unit 24. In this way, the component mounting work by the mounting module 14 scheduled on the circuit board 71 is completed.

  In the component mounting system 10 in which a plurality of such mounting modules 14 are arranged, the component mounting work by all the mounted modules 14 is completed, and the component mounting by the component mounting system 10 on one circuit board 71 is completed. . As described above, in the component mounting system 10, the circuit boards 71 are sequentially transported sequentially from the upstream side to the downstream side over each of the plurality of mounting modules 14, and the mounting work determined for each of the plurality of mounting modules 14 is performed. The component is mounted by executing it. Then, a plurality of circuit boards 71 are successively carried into the upstream mounting module 14, so that each circuit board 71 is mounted one after another, and the circuit board 71 that has been mounted from the downstream mounting module 14 is completed. Are carried out one after another. For loading and unloading the circuit board 71 to and from the component mounting system 10, a loading machine mainly including a conveyor device is arranged beside the most upstream mounting module 14, and the unloading machine is placed beside the most downstream one. Arrange them and do them.

<Circuit board>
In the present embodiment, the component mounting operation for the circuit board 71 as shown in FIG. 14 is performed. The circuit board 71 is a so-called multi-board, and is a collection of four child boards, each of which is a partition area in the circuit board 71. Specifically, four unit substrate portions 210 each having a rectangular shape, each of which is a sub-substrate, are arranged in the substrate transport direction, and the substrate portions {1}, { 2}, {3}, {4} are numbered and arranged. Each of the four unit substrate portions 210 constitutes the same circuit, and the same component is mounted on the same mounting position of each unit substrate portion 210.

  The circuit board 71 is provided with two types of reference marks. One of them is an overall reference mark (hereinafter abbreviated as “overall mark”) 212 located at a diagonal position (lower right and upper left in the figure) of the circuit board 71, and this overall mark 212 is imaged by the mark camera 100. By doing so, the displacement of the position of the circuit board 71 when it is fixedly held is detected from the imaging data. The other reference mark is a unit substrate part reference mark (hereinafter abbreviated as “individual mark”) 214 attached to a diagonal position for each unit substrate part 210, and functions as a kind of local mark. This mark serves as a reference for the component mounting position in the portion 210. Due to an error in circuit board manufacture, the relative position of each unit board 210 to the whole mark 212 varies slightly. Since the individual mark 214 is a reference mark for a relatively narrow region, mounting work with high positional accuracy is possible by using the individual mark 214 as a reference.

  Further, a bad mark 216 indicating that any one of the unit substrate portions 210 is defective may be attached to the circuit board 71. The bad mark 216 is attached to a certain position on each unit substrate unit 210. In the drawing, a bad mark 216 is attached to the third substrate portion {3} from the right (downstream side). The unit board part 210 to which the bad mark 216 is attached is prevented from performing a mounting operation.

  Further, a two-dimensional code (also called “two-dimensional bar code”, “2D code”, “QR code”, etc.) 218 as a board ID indicator is attached to the circuit board 71. The two-dimensional code 218 is attached to the circuit board 71 by attaching a label to which the two-dimensional code 218 is attached to the surface of the circuit board 71. The two-dimensional code 218 is picked up by the mark camera 100, and the picked-up data is subjected to image processing to recognize the board ID of the circuit board 71 to which the two-dimensional code 218 is attached. The two-dimensional code 218 is attached to a corner portion on the downstream front side (lower right in the figure) of the circuit board 71, and the position from the downstream end and the position from the front end of the circuit board 71 are the same for any board type. It is assumed to be constant. Note that in the circuit board 71 used for work in the present embodiment, one of the two whole marks 212 is positioned in the vicinity of the two-dimensional code 218 so that they are within one field of view of the mark camera 100. Yes.

<Utilization of substrate ID>
The system 10 is configured to include a plurality of mounting modules 14. Among them, the mounting module 14 disposed on the most upstream side recognizes the board ID and is mounted on the other downstream side. 14 performs the mounting operation using the information. As described above, the respective mounting modules 14 are connected to each other by the LAN 202, and various data are exchanged. The mounting module 14 on the most upstream side is set differently from the other mounting modules 14 for the board ID recognition work.

  The operation by the mounting module 14 arranged at the most upstream will be briefly described. Loading of the circuit board 71 from the loading machine (not shown) to the mounting module 14 on the most upstream side is started. Since it is unclear what circuit board 71 is carried in, the conveyor width of the mounting module 14 follows the width of the conveyor of the carry-in machine so that any width of the circuit board 71 may be carried in. It is supposed to be a method. Although detailed explanation is omitted, a photoelectric sensor is provided at the upstream end of the conveyor rails 64, 66, 68, and 70 so that the position of the downstream end of the conveyor rail of the carry-in machine can be detected. The position of the conveyor rails 64, 66, 68, and 70 is aligned at the time of loading.

  Next, the circuit board 71 is stopped at the board ID recognition position. As described above, the two-dimensional code 218 as the board ID indicator is attached to the circuit board 71 at a fixed position in any circuit board from the downstream end and the front end. 71 is transferred by a certain short distance from the position at the time of entering the conveyor unit 24 and stopped. Next, the two-dimensional code 218 is imaged by the mark camera 100 with the circuit board 71 stopped at the board ID recognition position. Then, image processing is performed on the imaging data, and the board ID of the circuit board 71 is acquired.

  The acquired board ID is transmitted to the control module 18. The control module 18 receives work information necessary for the work of the circuit board 71 using the board ID as a key. The necessary work information includes, for example, board type dependency information such as a board type corresponding to the board ID, a board shape, and a mounting program name.

  Further, the most upstream mounting module 14 also has a function as a substrate individual information recognition device. Based on the work information, the board individual information recognition work is performed when the mounting work is performed. Specifically, in the mounting operation, the whole mark 212 attached to the circuit board 71 is imaged by the mark camera 100, and further, the individual mark 214 attached to each unit board unit 210 is imaged by the mark camera 100. Is done. Subsequently, the captured image data is subjected to image processing, and the positional displacement of each unit substrate unit 210 with respect to the circuit substrate 71 as area-specific relative position information, specifically, each unit substrate unit in the circuit substrate coordinates defined by the overall mark 212 The displacement amount of the position 210 is acquired. Further, the mark camera 100 captures an image of a place where the bad mark 216 may be attached. When the bad mark 216 is added, the image processing is performed to acquire the board part number of the unit board part that cannot be mounted as the work necessity information for each area. Information including the unit board part position deviation amount and the unmountable unit board part number is transmitted to the control module 18 as board individual information regarding each circuit board 71.

  The board type dependency information and the individual board information are distributed by the control module 18 to each of the downstream mounting modules 14. Although detailed description is omitted, the downstream mounting modules 14 except the most upstream mounting module 14 use these pieces of information to capture only the two-dimensional code 218 indicating the board ID and the entire mark 212. Can be implemented. That is, it recognizes the board ID of the circuit board 71 that performs the work, transmits the board ID to the control module 18, receives the board individual information stored linked to the board ID from the control module 18, and receives the received board. Work is performed based on the individual information. This speeds up work.

<Automatic recognition of component devices and judgment of suitability>
In the present embodiment, when the component device management program is executed in the control module 18, a specific component device among the various component devices deployed and mounted is recognized, and the suitability of the specific component device is determined. . In the present embodiment, the mounting module 14, the mounting head 26, and the feeder 22 are specified components, and specifically, based on the type of the circuit board 71, the ID, format, The location, etc., the ID, type, etc. of the mounting head 26 mounted on each mounting module 14 and the ID, type, deployment location, etc. of the feeder 22 attached to each mounting module 14 are recognized, and their deployment status is determined. It is determined whether it is appropriate. The component device management program is composed of a plurality of programs that perform different processes depending on the execution timing. In the present embodiment, the board type change executed when the type of the circuit board 71 that is the work target is changed. Time processing program, component device replacement processing program that is executed when the component device is replaced for some reason, and operation start processing that is executed when the system operation is temporarily stopped and then restarted These programs are stored in the control module 18. FIG. 23 shows a control block diagram centering on the control module 18, and the following description will be made with reference to this control block diagram as appropriate.

i) Substrate Type Change Processing FIG. 15 shows a flowchart of the substrate type change processing program. The processing when changing the substrate type will be described with reference to this flowchart. When the type of the circuit board 71 is changed, first, in step S1 (hereinafter abbreviated as S1; the same applies to other steps), the board type of the specific component device is determined based on the type of the circuit board 71. A corresponding model is created. This model is a kind of board type corresponding deployment information as aptitude deployment information. Specifically, a mounting program corresponding to the type of circuit board is read from the mounting program storage unit 232 of the RAM 230 of the control module 18 shown in FIG. 23, and a board type corresponding model is created based on the contents of the mounting program. The information is stored in the board type corresponding deployment information storage unit 236 of the deployment information storage unit 234. Specifically, as shown in the table of FIG. 21, the model corresponding to the board type indicates which type of work module 14 should be deployed at which deployment location, and the work module 14 deployed at which deployment location. The type of work head 26 to be deployed and the work module 14 deployed at which deployment location are created by setting which circuit component is to be supplied from which slot. Settings regarding these specific component devices are performed with reference to predetermined data described in a predetermined part of the mounting program. For example, in the model shown in the figure, the deployment locations of the mounting module 14 are defined in order from the upstream side as [1], [2], [3], and the deployment location [1] located most upstream among them is The implementation program named [PBO1] is executed, and when executing the implementation program, the implementation module 14 of the format [001] should be deployed, and the implementation head 26 of the format [01a] should be mounted on it. Set to be. Further, for the feeder 22 in the mounting module 14, [CCP1258], [CCR3311], [AFG0505]. . . The feeder 22 that holds the circuit component with the name (type) is set to be deployed.

  Next, the steps after S2 of this program will be roughly described. First, in S2, mounting module processing is performed. In the mounting module process, the mounting module 14 at the selected deployment location is recognized, and whether or not the mounting module 14 is appropriate is determined. In S3, it is instructed to repeatedly execute S2 until the processing of S2 is completed for all the mounting modules 14. Next, in S <b> 4, mounting head processing is performed on the mounting head 26 deployed in the selected mounting module 14. In the mounting head process, the mounting head 26 mounted on the mounting module 14 is recognized, and whether or not the mounting head 26 is appropriate is determined. In S5, it is instructed to repeatedly execute S4 until the processing of S4 is completed for the mounting heads 26 provided in all the mounting modules 14. Next, in S6, feeder processing is performed for the slot that is the selected deployment location. In the feeder process, the feeder 22 installed in the selected slot is recognized, and whether or not the feeder is appropriate is determined. In S7, it is instructed to repeatedly execute S6 until the processing in S6 is completed for all the feeders 22.

  As will be described later, an appropriateness flag is set for each specific component device, and if the selected specific component device is inappropriate in S2, S4, and S6, the appropriateness flag becomes unsuitable. Has been. After the process related to each specific component device is performed, in S8, it is determined whether or not one of the appropriateness flags of each specific component device is in an inappropriate state, that is, the deployment state of the specific component device in the system. Whether or not is appropriate is asked. If the inappropriate flag is not set for any specific component device, the determination in S8 is NO, and the process proceeds to S9, where the provisionally registered ID of the specific component device currently deployed as described later is confirmed and registered. The information is the current deployment information. As shown in FIG. 22, the current deployment information is information in which each deployment location is associated with the ID of the specific component device currently deployed, and the current deployment information in the aptitude deployment information storage unit 234 shown in FIG. Stored in the storage unit 238. If the suitability flag of any specific component device is in an inappropriate state in S8, the location of the specific component device, the type of the device, and the like are displayed on the display of the control module 18 in S10. The operator is informed that the device is not properly deployed. That is, S8 is one form of the deployment status suitability determination step, and in S8, the deployment status of the specific component device in the entire system is determined. Details of each of the mounting module process in S2, the mounting head process in S4, and the feeder process in S6 will be described below for each process.

  The mounting module processing of S2 is performed by executing a mounting module processing routine shown in the flowchart of FIG. First, in S11, the module individual information stored in the RAM 186 of the module control device 38 of the mounting module 14 deployed in the selected deployment location (or the RAM of the common control device 144) is acquired, thereby implementing the mounting. Module 14 is recognized. That is, this step is a kind of component device recognition step. The module individual information is unique information related to the mounting module 14, and specifically includes information such as a module ID indicating the ID of the mounting module 14 and a module format indicating the format.

  Next, in S12, the aptitude module format that is the format of the module to be deployed at the selected deployment location is read out from the board type correspondence model created in S1 described above. That is, the module format associated with the selected deployment location is read from the module related information storage unit 240 of the board type corresponding deployment information storage unit 236 shown in FIG. In the next step S13, module failure information indicating whether or not the installed mounting module 14 is a defective module is read from the management computer 204 as the component device management apparatus using the acquired module ID as a key. Next, in S14, whether or not the mounting module 14 is appropriate is determined. Specifically, the determination is made based on the aptitude module format and defect information from the management computer 204. That is, this step is a kind of deployment state suitability determination step. If the format of the mounting module 14 does not match the appropriate module format or is a defective module, the determination in S14 is NO, and the process proceeds to S15, where the appropriateness flag of the mounting module 14 is set to an inappropriate state, and the mounting is performed. Module processing ends.

  On the other hand, if the format of the mounting module 14 matches the suitability module format and is not a defective module, the determination in S14 is YES, and the process proceeds to S16 where the suitability flag is set to an appropriate state. In S17, the module ID is provisionally registered in the above-described current deployment information storage unit 238 in association with the deployment location. Specifically, for example, according to FIG. 22, if the module 14 is the deployment location [1], its ID [M1215] is provisionally registered.

  Next, in S <b> 18, it is determined whether or not the mounting module 14 is positioned at the uppermost stream of the substrate work system 10. If the mounting module 14 is located on the most upstream side, that is, if it corresponds to the deployment location [1], the determination in S18 is YES, and the process proceeds to S19 where the most upstream setting is performed. Specifically, the most upstream corresponding control program is selectively applied as the control program of the mounting module 14 so that the above-described individual board information recognition operation is executed. On the other hand, when the mounting module 14 is not positioned on the most upstream side, the determination in S18 is NO, and the process proceeds to S20 where the setting of being out of the most upstream is performed. For the mounting module 14 outside the most upstream, a control program corresponding to the most upstream outside is selected and applied as a control program so as to perform work using the board individual information acquired by the mounting module 14 at the most upstream. In this way, the processing for one mounting module 14 is completed.

  The mounting head processing in S4 is performed by executing a mounting head processing routine shown in a flowchart in FIG. First, in S21, the selected deployment location, that is, the mounting head 26 of the selected mounting module 14 is recognized. Specifically, the head ID and head type of the mounting head 26 are changed to the memory chip of the mounting head 26. 128 is acquired from the module control device 38 (or the common control device 144). That is, S21 is a kind of component device recognition step. Next, in S22, an appropriate head type that is a head type to be deployed at the selected deployment location is read out from the stored substrate type correspondence model. That is, the head type associated with the selected mounting module 14 is read from the head related information storage unit 242 of the board type corresponding deployment information storage unit 236 shown in FIG. In the next S23, head defect information indicating whether or not the installed mounting head 26 is a defective head is read from the management computer 204 as the component management apparatus using the acquired head ID as a key. Next, in S24, the suitability of the mounting head 26 is determined. That is, S24 is a kind of deployment state suitability determination step. Specifically, if the type of the mounting head 26 does not match the appropriate head type or is a defective head, the determination in S24 is NO, and the process proceeds to S25, where the appropriateness flag is set to an inappropriate state.

  On the other hand, when the type of the mounting head 26 matches the appropriate head type and is not a defective head, the determination in S24 is YES, and the process proceeds to S26 where the appropriateness flag is set to an appropriate state. Next, in S27, the head ID of the mounting head is provisionally registered in the above-described current deployment information storage unit 238 in association with the mounting module 14 that is the deployment location. Specifically, for example, according to FIG. 22, if the mounting head 26 is deployed in the mounting module 14 at the deployment location [1], its ID [H0022] is provisionally registered. Subsequently, calibration processing is executed in S28. Although specific description is omitted, the calibration process is a process for adjusting and confirming the position of the mounting head 26 in the operation operation, specifically, the position command value in order to deal with the mounting error of the mounting head 26. It is. When the mounting head 26 is mounted on the head moving device 80, the actual position of the mounting unit 100 with respect to the theoretical design position varies depending on the manufacturing error of each mounting head 26 and the like. The calibration process is, for example, a process for performing a mounting operation in consideration of the variation. In the case of the mounting head 26a, for example, the rotation center of the unit holding body 114, the rotation center of each unit 110, the holding height of the unit, and the like are measured, and based on those values, the mounting unit 110 in the mounting operation is related. The position command value is adjusted. As described above, the mounting head process for one mounting head 26 is completed.

  The feeder process in S6 is performed by executing a feeder process routine shown in the flowchart of FIG. First, in S31, information on the ID and format of the feeder 22 arranged in the selected slot is read from the memory chip 50 of the feeder 22, and the feeder 22 recognizes the information by acquiring the information. Is done. That is, S31 is a kind of component device recognition step. Next, in S32, management device information is read from the management computer 204 as the component device management device. Specifically, using the acquired feeder ID as a key, feeder failure information indicating whether or not the feeder 22 is a defective feeder, and a circuit wound around a reel 48 attached to the feeder 22 Read component information related to the type of component. In the present embodiment, a barcode indicating the type of circuit component held by the reel 48 is affixed to the reel body in advance, and when the reel 48 is set on the feeder 22, the barcode is read, By recognizing the ID of the feeder 22, component information in a format in which the type of circuit component held by the reel 48 and the ID of the feeder 22 are associated with each other is stored in the management computer 204. Therefore, if the feeder ID is used as a key, it is possible to recognize the type of the circuit component supplied by the deployed feeder 22, and thus the type of the circuit component supplied in the selected slot.

  Next, in S33, the type of circuit component to be supplied is read from the board type corresponding model. That is, the data related to the appropriate circuit component that is the circuit component to be supplied that is associated with the selected slot is read from the feeder related information storage unit 244 of the board type corresponding deployment information storage unit 236 shown in FIG. . In subsequent S34, it is determined whether or not the feeder 22 is appropriate. S34 is a type of deployment status suitability determination step. If the feeder 22 is a defective feeder or the circuit component supplied from the feeder 22 does not match the appropriate circuit component, the determination in S34 is NO and the process proceeds to S35, where the suitability flag is set to an inappropriate state. .

  On the other hand, if the feeder 22 is not a defective feeder and the circuit component supplied from the feeder 22 matches the appropriate circuit component, the determination in S34 is YES, and the process proceeds to S36 where the appropriateness flag is in the appropriate state. It is said. In S37, the feeder ID is temporarily registered in the above-described current deployment information storage unit 238 in association with the slot number that is the deployment location. Specifically, according to FIG. 22, for example, if the slot 1 of the mounting module 14 deployed in the deployment location [1], [FA1015] that is the ID of the feeder 22 deployed in the slot is provisionally registered. It is. As described above, the feeder process for the selected slot is completed.

ii) Processing at the time of component device replacement Next, processing when one of the specific component devices is replaced will be described. In this embodiment, the system 10 is removed when any of the mounting module 14, the mounting head 26, and the feeder 22 is removed from the deployment location during operation, that is, while the power is turned on. It is designed to automatically recognize the deployment location. Specifically, a switch is provided at each deployment location, and an OFF signal is output when those specific component devices are removed. In addition, the switch outputs an ON signal when any specific component device is mounted at any location. The control module 18 monitors these signals. If an ON signal is detected after an OFF signal is detected at the same deployment location, the control module 18 recognizes that the specific component device at the deployment location has been replaced, and performs this replacement. Perform time processing. In the present embodiment, it is performed at the time of replacement. However, the following processing can be performed only by the ON signal, that is, at the time when some specific component device is mounted, regardless of the OFF signal. . In other words, the following component device replacement process is an aspect of the component device mounting process.

  FIG. 19 is a flowchart showing the processing program for component device replacement. As described above, this program is executed when it is detected that any one of the specific component devices has been replaced. First, in S41, the exchanged specific component device is recognized. In accordance with the above-described method, the ID and the format of the replacement configuration device that is the newly deployed specific configuration device are acquired for the deployment location where the replacement of the specific configuration device is recognized. S41 is also a kind of component device recognition step. Next, in S42, it is asked whether or not the replacement component device is the mounting module 14. If the replacement component device is the mounting module 14, the determination in S42 is YES, and the mounting module processing routine shown in FIG. 16 is executed for the mounting module 14 in S43. If the replacement component device is not the mounting module 14, the determination in S42 is NO and the process proceeds to S44. In S44, it is asked whether the replacement component device is the mounting head 26 or not. When the replacement component device is the mounting head 26, the determination in S44 is YES and the process proceeds to S45, and the mounting head processing routine shown in FIG. On the other hand, if the replacement component device is not the mounting head 26, the determination in S44 is NO and the process proceeds to S46. In S46, it is asked whether or not the exchange configuration device is the feeder 22. When the replacement component device is the feeder 22, the determination in S46 is YES, and the process proceeds to S47, and the feeder processing routine shown in FIG. On the other hand, if the replacement component device is not the feeder 22, the determination in S46 is NO and the process proceeds to S48.

  In S48, it is determined whether or not the suitability flag of the replacement component apparatus is in an inappropriate state as a result of the above processing being performed on the replacement component apparatus. If it is determined as inappropriate, the determination in S48 is YES, and the process proceeds to S49, in which the replaced replacement component device is inappropriate and displayed on the display of the control module 18 to notify the operator. . On the other hand, if the state is not inadequate, the determination in S48 is NO and the process proceeds to S50, where the registration of the ID of the replacement component device is confirmed. In the current deployment information storage unit 238, the registration of the ID of the newly installed replacement component apparatus is confirmed. This completes one execution of the program. When a plurality of component devices are exchanged together, the component device replacement processing program is executed for each of the exchange component devices.

iii) Processing at the time of starting operation Next, processing when the power supply is turned on and the operation is started again after the power to the substrate working system 10 is once turned off and stopped. When the system 10 is turned off and the specific component device is replaced, the fact of the replacement cannot be recognized. In consideration of this, the process at the start of actual operation is performed for the purpose of checking the deployment status of the specific component device when the power is turned on.

  FIG. 20 is a flowchart showing the operation start time processing program. When the on-board work system 10 starts operation, first, in S51, the specific configuration apparatus before the operation of the on-board work system 10 is registered is registered from the current deployment information storage unit 238 of the control module 18. The registered ID is read out. Next, in S52, according to the above-described method, the IDs of the specific component devices that are currently deployed are acquired and the specific component devices are recognized. As described above, the IDs of all the specific component devices stored in the memory chips 50 and 128 and the RAM 186 are read out. Next, in S53, it is determined whether or not the registered ID and the recognized ID for each specific component device match each other. That is, S53 is a step of determining the suitability of the deployment state based on the current deployment information. If the registered IDs and the acquired IDs for all the specific component devices match each other, it is determined that the replacement has not been performed while the operation is stopped, and the determination in S53 is NO, and this The routine execution ends. On the other hand, if a specific component device that does not match the registration ID is deployed (including a case where a specific component device is newly deployed at a vacant deployment location), the determination in S53 is YES. Proceeding to S54, the fact that one of the specific component devices has been replaced while the operation is stopped, and the type and location of the specific component device are displayed on the display of the control module 18 to notify the operator. . In the subsequent S55, the specific component device is instructed to execute the component device replacement processing program shown in FIG. 19, and the replacement processing related to the specific component device is performed. This is the end of the execution of this program. In the present embodiment, the suitability determination based on the current deployment information is performed in the operation start time process, but instead of this aspect, the suitability determination based on the board type correspondence model is performed in the same manner as the previous board type change process. You may do it.

iv) Functional Block Diagram In the present embodiment, the processing related to automatic recognition and suitability determination of a specific component device of the on-board work system 10 is performed by executing the component device management program in the control module 18 as described above. . The configuration of the control module 18 relating to this processing will be described from a functional aspect. FIG. 23 shows a functional block diagram of the control module 18.

  The control module 18 mainly has two processing units for automatic recognition and suitability determination processing of a specific component device. One of them is a component device recognition unit 250. The component device recognition unit 250 includes a module-related information recognition unit 252 that performs the mounting module recognition process in S11 and a head-related information recognition unit that performs the mounting head recognition process in S21. 254 and a feeder-related information recognition unit 256 that performs the feeder recognition processing of S31. The replacement component device recognition process in S41 and each component device recognition process in S52 are also executed by the component device recognition unit 250, and based on the individual information of the memory chips 50 and 128, the module control device 38, and the like, Recognize specific component devices.

  The control module 18 includes a deployment state suitability determination unit 260 (hereinafter abbreviated as a suitability determination unit) as another processing unit. The suitability determination unit 260 includes a substrate type change determination unit 262 that executes the substrate type change processing program, a device mounting time determination unit 264 that executes the component device replacement processing program, and the operation start time processing program. An operation start time determination unit 266 to be executed is included. The deployment state suitability determination unit 260 makes a determination based on information stored in the suitability deployment information storage unit 234 of the RAM 230, defect information stored in the management computer 204 functioning as a specific component device management apparatus, and the like.

1 is a perspective view showing an overall configuration of a substrate working system that is an embodiment of the present invention. It is a perspective view which shows the structure of the work module which comprises an on-board work system. It is a front view which shows the feeder arrange | positioned by the work module. It is a perspective view which shows the conveyor unit arrange | positioned by the work module. It is a perspective view which shows the board | substrate working apparatus arrange | positioned at the work module. It is a perspective view which shows some things of the mounting head which can be mounted in a substrate working apparatus. It is a perspective view which shows one thing among the mounting heads which can be equipped. It is a perspective view which shows the structure of another work module which comprises an on-board work system. It is a block diagram regarding control of the sub-module control device arranged in the work module of FIG. It is a perspective view which shows the base module which comprises a board | substrate work system. It is a perspective view which shows the use condition of the table apparatus currently prepared for the substrate working system, and the table apparatus. It is a block diagram regarding control of the module control apparatus arranged in the work module of FIG. It is a schematic diagram which shows a mode that the substrate work system is arrange | positioned in the factory. It is a figure showing typically a circuit board used for work in a substrate work system of an embodiment. It is a flowchart which shows the processing program at the time of the board | substrate type change performed when the kind of circuit board is changed among component apparatus management programs. It is a flowchart which shows the mounting module process routine performed by the board | substrate kind change process program. It is a flowchart which shows the mounting head process routine performed by the board | substrate kind change process program. It is a flowchart which shows the feeder process routine performed by the board | substrate kind change process program. It is a flowchart which shows the processing program at the time of the component apparatus replacement | exchange performed when a specific component apparatus is replaced | exchanged among component apparatus management programs. It is a flowchart which shows the processing program at the time of an operation start performed when an on-board work system starts operation among component apparatus management programs. It is a table which shows the data memorize | stored in the board | substrate type corresponding | compatible arrangement | positioning information storage part. It is a table which shows the data memorize | stored in the present deployment information storage part. It is a functional block diagram for demonstrating the function of a control module regarding a component apparatus management process.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10: Board | substrate work system 14: Work module 18: Control module 22: Feeder 24: Conveyor unit 26: Work (mounting) head 38: Module control device 46: Circuit component taping 50: Memory chip 71: Circuit board 80: Head movement Device 100: Mark camera 128: Memory chip 142: Submodule control device 144: Common control device 180: Computer 182: PU 184: ROM 186: RAM 188: I / O interface 190: Bus 200: Communication circuit 202: LAN 204: Management Computer 206: LAN 210: Unit board unit 212: Whole mark 214: Individual mark 216: Bad mark 218: Two-dimensional code 230: RAM 232: Mounting program storage unit 234: Aptitude deployment information storage unit 36: Board type corresponding deployment information storage unit 238: Current deployment information storage unit 240: Module related information storage unit 242: Head related information storage unit 244: Feeder related information storage unit 250: Component device recognition unit 252: Module related information recognition unit 254: Head related information recognition unit 256: Feeder related information recognition unit 260: Deployment state suitability determination unit 262: Substrate type change determination unit 264: Device mounting time determination unit 266: Operation start time determination unit

Claims (12)

A substrate holding device for holding a circuit board;
An apparatus for performing work on a circuit board held by the substrate holding device, including a work head for performing a main work of the work, and a work head moving device for moving the work head. A board-to-board working system comprising a board-to-board working device configured,
The working head has an individual information recording medium for recording its own individual information, and is a specific component device that is detachably mounted at a predetermined deployment location in the system,
The system according to claim 1, further comprising: a component device recognition unit for recognizing the work head provided as the specific component device based on the individual information recorded on the individual information recording medium.   2. The pair according to claim 1, wherein the system includes a deployment state suitability determination unit configured to determine suitability of a deployment state of the work head deployed as the specific configuration device based on a recognition result of the configuration device recognition unit. Board work system. The system includes a proper deployment information storage unit that stores proper deployment information related to a proper deployment state of the work head deployed as the specific configuration device,
The deployment state suitability determination unit determines suitability of the deployment state of the work head deployed as the specific component device based on the proper deployment information stored in the proper deployment information storage unit. The board | substrate work system of Claim 2. The proper deployment information storage unit stores an appropriate head format that is a head format to be deployed as the proper deployment information,
The deployment state suitability determination unit is configured to determine whether the working head deployed as the specific configuration device matches the proper head format based on the stored suitability head format. Item 4. The substrate work system according to Item 3.   The said appropriate deployment information storage part has the present deployment information storage part which memorize | stores the present deployment information regarding the deployment state of the said working head currently deployed as said specific component apparatus as said proper deployment information. The board-to-board working system described in 1. The appropriate deployment information storage unit is determined corresponding to the type of circuit board to be worked, and the board type corresponding deployment information regarding the deployment state of the work head deployed as the specific component device is The on-board working system according to claim 3, further comprising a board type corresponding deployment information storage unit that stores the deployment information.   When the work head deployed as the specific component device is detached from the system, and another work head designated as the specific component device is attached to the deployed location where the deployment state suitability determination unit is separated from the system 7. The on-board working system according to claim 2, further comprising a device mounting time judging unit that judges whether or not the working head is in a deployed state.   The operation start determination unit that determines whether or not the work head deployed as the specific component device is appropriate when the deployment state suitability determination unit starts operation after the system is stopped. 8. The substrate work system according to any one of claims 2 to 7.   A board type change determination unit that determines whether the work head deployed as the specific component device is appropriate when the deployment state suitability determination unit is changed in the type of the circuit board that is the work target of the system. 9. The substrate work system according to any one of claims 2 to 8.   The work apparatus for the substrate includes, as the work head, (a) a mounting head for mounting circuit components, (b) an adhesive application head for applying an adhesive to the circuit board, and (c) an inspection head. It is possible to mount one selected from the inspection heads to function as one of the component mounting device, the adhesive application device, and the inspection device according to the selected one. The to-board working system according to any one of claims 1 to 9, which is configured. The working head is a mounting head for mounting circuit components;
The substrate working apparatus includes, as its mounting head, (a) one mounting unit having a component holding device that generally has a shaft shape and sucks and holds a circuit component at its lower end, and (b) the mounting unit. The on-board working system according to any one of claims 1 to 10, wherein one device selected from a plurality of devices can be mounted. (A) A board holding device that holds a circuit board, and (B) a device that performs work on the circuit board held by the board holding device, and (B-1) is the main body of the work. In order to manage the work head in a board-to-board working system comprising: a work head that performs work; and a work head moving device that includes (B-2) a work head moving device that moves the work head. A program executed by a computer,
The working head has an individual information recording medium for recording its own individual information, and is a specific component device that is detachably mounted at a predetermined deployment location in the system,
A component device recognition step for recognizing the work head provided as the specific component device based on the individual information recorded on the individual information recording medium;
A deployment state suitability determination step for judging suitability of a deployment state of the work head deployed as the specific configuration device based on a recognition result of the component device recognition unit. Configuration device management program.

Images