CN117581648A - Component mounting system and component mounting method - Google Patents

Abstract

The component mounting method calculates a correction value at the time of mounting a component on a substrate based on substrate inspection information including at least positional deviation information of the component mounted on the substrate, mounts the component on the substrate based on the correction value, calculates a post-correction evaluation value in the case of mounting the component on the substrate using the correction value based on the substrate inspection information, calculates a pre-correction evaluation value in the case of assuming that the component is mounted on the substrate without using the correction value based on the substrate inspection information and the correction value, and determines whether or not the correction value is used at the time of mounting based on the post-correction evaluation value and the pre-correction evaluation value.

Description

Component mounting system and component mounting method

Technical Field

The present disclosure relates to a component mounting system and a component mounting method for mounting a component on a substrate.

Background

As a component mounting system for mounting a component on a substrate, a component mounting system is provided with an inspection device for inspecting a mounting state such as a positional deviation of a component mounted on the substrate by the component mounting device, and a correction value for mounting the component on the substrate is calculated based on an inspection result of the inspection device, and the component mounting device mounts the component on the substrate based on the correction value (for example, patent document 1). The system described in patent document 1 discloses: the display is performed based on the inspection result and the correction value so that the corrected evaluation value and the evaluation value assuming that no correction is performed can be compared, whereby the correction effect due to the feedback of the inspection result can be grasped.

Prior art literature

Patent literature

Patent document 1: JP-A2017-139364

Disclosure of Invention

The component mounting system of the present disclosure includes: a correction value calculation unit that calculates a correction value when a component is mounted on a substrate, based on substrate inspection information including at least positional deviation information of the component mounted on the substrate; a component mounting section that mounts the component to the substrate based on the correction value; a calculating unit that calculates an evaluation value indicating mounting accuracy at the time of mounting of the component mounting unit based on the board inspection information and the correction value; and a determination unit that calculates, as the evaluation values, a post-correction evaluation value in a case where the component is mounted on the substrate using the correction value and a pre-correction evaluation value in a case where the component is mounted on the substrate assuming that the correction value is not used, the determination unit determining whether or not the correction value is used at the time of mounting based on the post-correction evaluation value and the pre-correction evaluation value.

In the component mounting method of the present disclosure, a correction value at the time of mounting a component on a substrate is calculated based on substrate inspection information including at least positional deviation information of the component mounted on the substrate, the component is mounted on the substrate based on the correction value, a post-correction evaluation value at the time of mounting the component on the substrate using the correction value is calculated based on the substrate inspection information and the correction value, a pre-correction evaluation value at the time of assuming that the component is mounted on the substrate without using the correction value is calculated based on the substrate inspection information and the correction value, and the suitability of use of the correction value at the time of mounting is determined based on the post-correction evaluation value and the pre-correction evaluation value.

According to the present disclosure, good mounting accuracy can be obtained for various components mounted on a substrate.

Drawings

Fig. 1 is a structural explanatory diagram of a component mounting system of an embodiment of the present disclosure.

Fig. 2 is a plan view showing a configuration of a main portion of a component mounting device provided in a component mounting system according to an embodiment of the present disclosure.

Fig. 3 is a side view showing the structure of a main portion of a component mounting apparatus according to an embodiment of the present disclosure.

Fig. 4 is a structural explanatory view of a main portion of a mounting head and a component supply portion of a component mounting apparatus according to an embodiment of the present disclosure.

Fig. 5 is a block diagram showing the structure of a control system of a component mounting system according to an embodiment of the present disclosure.

Fig. 6 is an explanatory diagram of the positional deviation amount of the component calculated in the inspection apparatus according to the embodiment of the present disclosure.

Fig. 7A is a plan view showing an example of the shape of a component mounted on a substrate in the component mounting apparatus of an embodiment of the present disclosure.

Fig. 7B is a side view showing an example of the shape of a component mounted on a substrate in the component mounting apparatus of an embodiment of the present disclosure.

Fig. 8 is a diagram illustrating evaluation values calculated in the component mounting system according to an embodiment of the present disclosure.

Fig. 9 is a diagram illustrating a relationship between a post-correction evaluation value and a pre-correction evaluation value calculated in the component mounting system according to an embodiment of the present disclosure.

Fig. 10 is a diagram illustrating an example of a post-correction evaluation value and a pre-correction evaluation value calculated in the component mounting system of an embodiment of the present disclosure.

Fig. 11A is a plan view showing an example of a component in which positional deviation is likely to become large if the correction value calculated in the component mounting system of an embodiment of the present disclosure is used.

Fig. 11B is a side view showing an example of a component in which positional deviation is likely to become large if the correction value calculated in the component mounting system of an embodiment of the present disclosure is used.

Fig. 12 is a flowchart of a component mounting method in a component mounting system of an embodiment of the present disclosure.

Detailed Description

However, the following are known: when the correction value is fed back from the inspection result to perform component mounting due to variations in the shape and the appearance of the component, the mounting state is no longer stable. Therefore, there is room for further improvement in order to obtain good mounting accuracy for various components mounted on the substrate.

Accordingly, an object of the present disclosure is to provide a component mounting system and a component mounting method that can obtain good mounting accuracy for various components mounted on a substrate.

Hereinafter, an embodiment of the present disclosure will be described in detail using the accompanying drawings. The configuration, shape, and the like described below are examples for explanation, and can be appropriately changed according to specifications of the component mounting system, the management computer, the component mounting apparatus, and the inspection apparatus. Hereinafter, the same reference numerals are given to corresponding elements in all drawings, and redundant description is omitted. In fig. 2 and a part to be described later, an X axis (left-right direction in fig. 2) in the substrate conveyance direction and a Y axis (up-down direction in fig. 2) orthogonal to the substrate conveyance direction are shown as 2 axes orthogonal to each other in the horizontal plane. In fig. 3 and a part to be described later, a Z axis (vertical direction in fig. 3) is shown as a height direction orthogonal to a horizontal plane. Fig. 4 and a part to be described later show a θ direction which is a direction of rotation in which the Z axis is a rotation axis.

First, the structure of the component mounting system 1 is explained with reference to fig. 1. Fig. 1 is a structural explanatory view of the component mounting system 1. The component mounting system 1 has a function of mounting components on a substrate to produce a mounted substrate. The component mounting system 1 includes a solder printing device M1, component mounting devices M2, M3, and an inspection device M4. These devices are connected to the management computer 3 via the communication network 2. The component mounting devices M2 and M3 included in the component mounting system 1 are not limited to 2, but may be 1, or 3 or more.

The solder printing apparatus M1 prints paste solder for joining components on a substrate to be mounted by screen printing. Fig. 2 is a plan view showing a configuration of a main portion of the component mounting device (M2 or M3) included in the component mounting system 1. The component mounting devices M2 and M3 each perform a component mounting operation in which the component mounting section 12 takes out a component from the component supply section 7 and transfers the component to the board 6 on which the paste solder for component bonding is printed. The inspection device M4 inspects the mounting state of the components on the board 6 mounted with the components by the component mounting devices M2 and M3 by using the inspection camera 32 (see fig. 5), detects the positional deviation state of the components from the normal position, and the like, and determines whether the mounted board is good or not. The management computer 3 has both the production line management function and the following functions: the suitability of the use of the correction values in the component mounting devices M2, M3 is determined based on the positional deviation information of the component acquired by the inspection device M4 and the correction values used in the component mounting devices M2, M3.

Next, the respective configurations of the component mounting devices M2, M3 will be described with reference to fig. 2, 3. Fig. 3 is a side view showing the structure of a main portion of the component mounting device (M2 or M3). Fig. 3 schematically shows a part of each of the component mounting apparatuses M2 and M3 in fig. 2. The component mounting device (M2 or M3) has a function of performing a mounting operation of mounting the component supplied from the component supply unit on the substrate 6. In fig. 2, a substrate transport mechanism 5 is disposed along the X axis at the center of the base 4. The substrate conveyance mechanism 5 conveys the substrate 6 conveyed from the upstream side to the mounting operation position and performs positioning and holding. The substrate conveyance mechanism 5 conveys the substrate 6 on which the component mounting operation is completed downstream.

The component supply units 7 are disposed on both sides (front side and rear side) of the substrate transport mechanism 5. A plurality of tape feeders 8 are arranged along the X axis in each component supply section 7. The tape feeder 8 advances the carrier tape formed with the pockets accommodating the components at a pitch in a direction (tape feed direction) from the outside of the component supply section 7 toward the substrate conveying mechanism, thereby supplying the components to the component adsorbing position where the components are adsorbed by the mounting head 11 of the component mounting section 12.

In fig. 2 and 3, a Y-axis stage 9 having a linear drive mechanism is disposed along the Y-axis at both ends in the X-axis on the upper surface of the base 4. 2 (front side, rear side) cross members 10 each having a linear driving mechanism are movably coupled to the Y-axis stage 9 along the Y-axis. The beam 10 is arranged along the X-axis. In each of the 2 beams 10, a mounting head 11 is freely provided to move along the X axis. The mounting head 11 includes a plurality (here, 8) of suction units 11a that suck the holding member D and can be lifted. Suction nozzles 11b for sucking and holding the component D are provided at the lower end portions of the suction units 11a, respectively.

In fig. 2, the mounting head 11 is moved in the horizontal direction (X-axis direction, Y-axis direction) by driving the Y-axis stage 9 and the cross beam 10. Thus, each of the 2 mounting heads 11 sucks and takes out the component D by the suction nozzle 11b from the component suction position of the tape feeder 8 arranged in the corresponding component supply section 7, and mounts the component D on the mounting point of the substrate 6 positioned in the substrate conveying mechanism 5. That is, the Y-axis stage 9, the cross member 10, and the mounting head 11 constitute a component mounting portion 12 for mounting the component D on the substrate 6.

In fig. 2 and 3, a component recognition camera 13 is disposed between the component supply unit 7 and the substrate transport mechanism 5. When the mounting head 11 from which the component D is taken out from the component supply section 7 moves above the component recognition camera 13, the component recognition camera 13 captures an image of the component D held by the suction nozzle 11b. The holding state of the component D is identified based on the imaging result. The head camera 14 is mounted on the board 10a on which the mounting head 11 is mounted. The head camera 14 moves integrally with the mounting head 11.

By the movement of the mounting head 11, the head camera 14 moves above the substrate 6 positioned by the substrate conveying mechanism 5, and images a substrate mark (not shown) provided on the substrate 6. The position of the substrate 6 is identified based on the imaging result. The head camera 14 moves above the component suction position of the tape feeder 8, and picks up an image of the component D stored in the carrier tape near the component suction position. The status of the supplied component D is identified based on the imaging result. In the component mounting operation of the mounting head 11 on the substrate 6, the mounting position is corrected in consideration of the imaging result of the component D of the component recognition camera 13 and the imaging result of the substrate position of the head camera 14.

In fig. 2, touch panels 15 are provided on the front and rear sides of the component mounting devices M2 and M3, respectively, at positions where an operator performs an operation. The touch panel 15 displays various information on a display portion thereof, and an operator performs data input and an operation of the component mounting device (M2 or M3) using an operation button or the like displayed on the display portion.

In fig. 3, the component supply section 7 is provided with a carriage 16 in a state where a plurality of tape feeders 8 are provided in advance on a feeder base 16 a. A plurality of grooves equipped with the tape feeder 8 are formed in the feeder base 16 a. The tape feeders 8 equipped to the carriage 16 are managed based on the positions of the equipped slots and the positions (front side, rear side) of the carriage 16 equipped to the component mounting apparatus (M2 or M3). A tape reel 18 is held by the carriage 16, and stores the carrier tape 17 holding the component D in a wound state. The carrier tape 17 pulled out from the tape reel 18 is pitch-fed to the component adsorbing position by a tape feeding mechanism (not shown) built in the tape feeder 8.

Next, the structure of the mounting head 11 will be described with reference to fig. 4. Fig. 4 is a structural explanatory view of the main parts of the mounting head 11 and the component supply portion 7 of the component mounting apparatus (M2 or M3). The mounting head 11 includes a plurality of suction units 11a, and each suction unit 11a includes a driving mechanism (not shown). By driving the driving mechanism, the shaft 11c provided with the suction nozzle 11b at the lower end portion is lifted (arrow a), and the shaft 11c is rotated, whereby the suction nozzle 11b is rotated in the θ direction (arrow b) with the suction nozzle axis AN as the rotation axis.

Next, the structure of the control system of the component mounting system 1 will be described with reference to fig. 5. Fig. 5 is a block diagram showing the structure of the control system of the component mounting system 1. Here, description will be made centering on a function of judging whether or not the correction values in the component mounting devices M2, M3 are suitable for use based on the positional deviation information of the component D mounted on the substrate 6 and the correction values used at the time of mounting, among the functions of the component mounting system 1. The management computer 3, the component mounting devices M2, M3, and the inspection device M4 are connected to each other via the communication network 2. The component mounting devices M2 and M3 each include a mounting control device 20, a substrate transport mechanism 5, a tape feeder 8, a component mounting section 12, a component recognition camera 13, a head camera 14, and a touch panel 15. The installation control device 20 includes an installation storage unit 21, an installation control unit 22, and an installation communication unit 23.

The installation communication unit 23 transmits and receives data to and from the inspection device M4 and the management computer 3 via the communication network 2. The installation storage unit 21 is a storage device that stores installation data 21a, correction value information 21b, correction suitability information 21c, and the like. The mounting data 21a includes information such as the type of the production machine (board name) of the mounting board, the type of the component D mounted on the board 6 (component name), the mounting position (XY coordinates), the mounting direction (θ direction), the mounting position of the tape feeder 8 for supplying the component D, and the mounting position of the suction nozzle 11b.

The correction value information 21b is transmitted from the inspection device M4, and stores the correction value calculated by the inspection device M4 by imaging the component D mounted on the substrate 6, when the component D is mounted on the substrate 6. In the correction suitability information 21c, suitability information as to whether or not to use the correction value when the component D is mounted on the substrate 6 is stored for each type of the component D.

In fig. 5, the mounting control section 22 controls the tape feeder 8, the component mounting section 12, the component recognition camera 13, the head camera 14 based on the mounting position, the mounting direction, the correction value contained in the correction value information 21b, the suitability information of the correction value contained in the suitability information 21c, and the like contained in the mounting data 21a, thereby mounting the component D on the substrate 6. That is, the component mounting section 12 corrects the position of the mounting head 11 based on the correction value contained in the correction value information 21b in addition to the position of the substrate 6 imaged by the head camera 14 and the position of the component D held by the suction nozzle 11b imaged by the component recognition camera 13, thereby mounting the component D on the substrate 6. At this time, the component mounting section 12 uses the correction value for the component D designated as "fit" in the fit/unfit information contained in the correction fit/unfit information 21c, and does not use the correction value for the component D designated as "unfit", thereby mounting the component D on the substrate 6.

In fig. 5, the inspection apparatus M4 includes an inspection control device 30, a substrate conveyance mechanism 31, an inspection camera 32, and an inspection camera movement mechanism 33. The inspection control device 30 includes an inspection storage unit 34, an inspection control unit 35, an identification processing unit 36, a correction value calculation unit 37, and an inspection communication unit 38. The inspection communication unit 38 transmits and receives data to and from the component mounting devices M2 and M3 and the management computer 3 via the communication network 2. The inspection storage unit 34 is a storage device, and stores inspection data 34a and the like. The inspection data 34a includes a production machine type name (board name) of the mounted board, a type (component name) of a component mounted on the board 6, a mounting position (XY coordinates), a mounting direction (θ direction), a failure determination value, and the like.

The inspection control unit 35 controls the substrate conveyance mechanism 31 to convey the mounted substrate 6 conveyed from the upstream component mounting device M3 to the inspection position, hold the substrate in position, and convey the substrate 6 subjected to the inspection downstream. The inspection control unit 35 controls the inspection camera moving mechanism 33 based on the inspection data 34a so that the inspection camera 32 is sequentially moved to a position above the mounting position of the substrate 6 held at the inspection operation position, and the inspection camera 32 picks up an image of the component D mounted on the substrate 6.

In fig. 5, the recognition processing unit 36 performs recognition processing on the captured image of the inspection camera 32, and calculates the positional deviations Δx, Δy, and Δθ (see fig. 6) of the component D mounted on the substrate 6 from the normal mounting position N. If the calculated positional deviation amounts Δx, Δy, and Δθ exceed the failure determination values included in the inspection data 34a, the recognition processing unit 36 determines that the component D is defective in mounting. The recognition processing unit 36 creates board inspection information 41b including positional deviation information (positional deviation amounts Δx, Δy, Δθ) of the component D mounted on the board 6 and the result of determining whether the mounted board is good or not for each board 6, and transmits the information to the management computer 3. The management processing device 40 of the management computer 3 stores the received substrate inspection information 41b in the management storage unit 41.

Here, an example of a method for calculating the amounts of positional deviation Δx, Δy, and Δθ of the component D mounted on the substrate 6 by the recognition processing unit 36 from the normal mounting position N will be described with reference to fig. 6. Fig. 6 is an explanatory diagram of the positional deviation amount of the component D calculated in the inspection apparatus M4. The inspection control unit 35 images the component D mounted on the board 6 at a position where the imaging center of the inspection camera 32 coincides with the normal mounting position N of the component D. The recognition processing unit 36 performs recognition processing on the captured image to detect the center position C of the mounted component D. Then, the recognition processing unit 36 calculates the amount of positional deviation Δx in the X-axis direction and the amount of positional deviation Δy in the Y-axis direction from the difference between the center position C (Δx, Δy) and the attachment position N (0, 0). Further, the recognition processing unit 36 calculates the inclination of the component D in the θ direction as the positional deviation amount Δθ.

In fig. 5, the correction value calculating unit 37 calculates correction values used when the component mounting devices M2 and M3 mount the component D on the substrate 6 based on the positional deviation amounts Δx, Δy, and Δθ of the component D calculated by the recognition processing unit 36. The correction value calculation unit 37 creates correction value information including the calculated correction value, and transmits the correction value information to the component mounting devices M2 and M3 and the management computer 3. The mounting control device 20 of each of the component mounting devices M2, M3 stores the received correction value information as the correction value information 21b in the mounting storage section 21. The management processing device 40 of the management computer 3 stores the received correction value information as correction value information 41c in the management storage unit 41.

Here, a method of calculating the correction values (Xc, yc) by the correction value calculating unit 37 will be described with reference to fig. 9. Fig. 9 is a diagram illustrating a relationship between the post-correction evaluation value and the pre-correction evaluation value calculated in the component mounting system 1. First, the correction value calculating unit 37 calculates the average center position Cn (Xn, yn) of the component D from the positional deviations Δx, Δy, Δθ of a given number (for example, 30 pieces) included in the substrate inspection information 41b of the substrate 6 on which the component D is mounted without using the correction value. The average center position Cn (Xn, yn) corresponds to the amount of positional deviation caused by an element that cannot be eliminated in correcting the mounting position in consideration of the positional deviation of the component D held by the suction nozzle 11b and the holding position deviation of the substrate position during component mounting. Therefore, the correction value calculating unit 37 calculates the correction values (Xc (xc= -Xn), yc (yc= -Yn)) from the average center position Cn (Xn, yn) so that the center of the component D coincides with the mounting position N (0, 0) (arrow c).

In addition, when the latest correction value (Xc, yc) is calculated from the substrate inspection information 41b of the substrate 6 using the correction value (Xc 1, yc 1), the correction value calculating unit 37 calculates the latest correction value (Xc (xc=xc1-Xn), yc (yc=yc 1-Yn)) from the correction value (Xc 1, yc 1) used and the average center position C0 (Xn, yn) calculated from the substrate inspection information 41 b. In this way, the correction value calculating unit 37 calculates the correction value (Xc, yc) at the time of mounting the component D on the substrate 6 based on the substrate inspection information 41b including at least the positional deviation information (positional deviation amounts Δx, Δy, Δθ) of the component D mounted on the substrate 6.

In fig. 5, the management processing device 40 of the management computer 3 includes a management storage unit 41, a calculation unit 42, a determination unit 43, a setting unit 44, an input unit 45, a display unit 46, and a management communication unit 47. The input unit 45 is an input device such as a keyboard, a touch panel, or a mouse, and is used for inputting operation commands and data. The display unit 46 is a display device such as a liquid crystal panel, and displays various information including various screens such as an operation screen for performing an operation of the input unit 45. The management communication unit 47 is a communication interface, and transmits and receives signals and data to and from the component mounting devices M2 and M3 and the inspection device M4 via the communication network 2.

The management storage unit 41 is a storage device that stores production data 41a, substrate inspection information 41b, correction value information 41c, corrected information 41d, pre-correction information 41e, and the like. The production data 41a includes information such as the type of production machine (board name) for mounting the board, the type of component D mounted on the board 6 (component name), the size of the component D, the mounting position (XY coordinates), the mounting direction (θ direction), information for specifying the component mounting devices M2 and M3 (component mounting sections 12) for mounting the component D, the mounting position of the tape feeder 8 for supplying the component D, and the mounting position of the suction nozzle 11b.

In fig. 5, the calculating unit 42 calculates a corrected evaluation value in the case of mounting the component D on the substrate 6 using the correction values (Xc, yc) based on the positional deviation amount Δx in the X-axis direction and the positional deviation amount Δy in the Y-axis direction (hereinafter referred to as "positional deviation amounts Δx, Δy") among the positional deviation amounts Δx, Δy, Δθ included in the substrate inspection information 41b, and stores the corrected evaluation value as corrected information 41D in the management storage unit 41. The calculation unit 42 calculates a pre-correction evaluation value assuming that the component D is mounted on the substrate 6 without using the correction values (Xc, yc) based on the positional deviation amounts Δx and Δy included in the substrate inspection information 41b and the correction value used when the component D is mounted on the substrate 6 by the component mounting unit 12 included in the correction value information 41c, and stores the pre-correction evaluation value as pre-correction information 41e in the management storage unit 41.

Here, a method for calculating the corrected evaluation value by the calculating unit 42 will be described with reference to fig. 7A, 7B, and 8. Fig. 7A and 7B are a top view and a side view, respectively, showing examples of shapes of components mounted on the substrate in the component mounting devices M2 and M3. Fig. 8 is a diagram illustrating evaluation values calculated in the component mounting system 1. The calculating unit 42 calculates the average value μ and the standard deviation σ for each type of the component D based on the amount of positional deviation Δx in the X-axis direction of the given number of pieces (for example, 30 pieces) included in the substrate inspection information 41b of the substrate 6 using the correction values (Xc, yc). Next, the calculating unit 42 calculates the process capability index Cpk (cpk= ((T/2) - |μ|) 3 σ) as a corrected evaluation value based on the reference width T calculated by the widths W1, W2 (see fig. 7A and 7B) of the electrode Db of the component D and the calculated average μ and standard deviation σ. Similarly, the calculating unit 42 calculates the process capability index Cpk as a corrected evaluation value in the Y-axis direction from the position deviation Δy in the Y-axis direction and the reference width T. The process capability index Cpk is an index that decreases the deviation (increases the process capability) as the characterization value increases.

Here, the widths W1, W2 of the electrode Db of the component D are described with reference to fig. 7A and 7B. In fig. 7A and 7B, a patch member such as a resistor or a capacitor is described as a member D. Fig. 7A is a top view from above in a state where the component D is mounted on the substrate 6, and fig. 7B is a side view from the side in a state where the component D is mounted on the substrate 6. The member D includes electrodes Db at both ends (left and right) of the main body Da. Here, the width of the electrode Db in the direction in which the 2 electrodes Db are arranged is defined as a width W2, and the width of the electrode Db in the direction orthogonal to the direction in which the 2 electrodes Db are arranged is defined as a width W1.

When the component D is mounted on the substrate 6 with the direction in which the 2 electrodes Db are arranged being the direction of the X-axis direction of the substrate 6, the reference width T (t= (2/3) ×w2) for evaluating the amount of positional deviation Δx in the X-axis direction is calculated from the width W2 of the electrodes Db. Further, a reference width T (t= (2/3) ×w1) for evaluating the positional deviation amount Δy in the Y-axis direction is calculated from the width W1 of the electrode Db.

Next, a method for calculating the pre-correction evaluation value by the calculating unit 42 will be described with reference to fig. 9. First, the calculating unit 42 calculates, for all the components D, the estimated center position Cb (Δxb, Δyb) before correction in the case where the components D are mounted on the substrate 6 without using the correction values (Xc, yc) using the same board inspection information 41b as the calculation of the corrected evaluation values. Specifically, the calculating unit 42 calculates the estimated center position Cb (Δxb, Δyb) before correction based on the positional deviation amounts Δx, Δy contained in the board inspection information 41b and the correction value (Xc, yc) used when the component mounting unit 12 contained in the correction value information 41c mounts the component D on the board 6.

That is, the calculating unit 42 calculates the (arrow e) position at which the correction value (Xc, yc) is subtracted from the center position C (Δx, Δy) of the component D mounted on the substrate 6 as the estimated center position Cb before correction (Δxb=Δx-Xc, Δyb=Δy-Yc). Then, the calculating unit 42 calculates the average value μb and the standard deviation σb for each type of the component D based on the calculated expected center position Cb (Δxb, Δyb) before correction for the predetermined number of pieces.

In fig. 9, the calculating unit 42 then calculates the process capability index Cpkb (cpkb= ((T/2) - |μb|) and 3σb) as the pre-correction evaluation value based on the reference width T and the calculated average μ and standard deviation σ. That is, the calculating unit 42 calculates the assumed positional deviation amounts (Δxb, Δyb) when the correction value (Xc, yc) is not used, based on the positional deviation amounts Δx, Δy in the horizontal direction (X-axis direction and Y-axis direction) obtained from the substrate inspection information 41b using the correction value (Xc, yc) of the 1 st component (component D) and the correction amount (Xc, yc) in the horizontal direction obtained from the correction value (Xc, yc) of the 1 st component, and calculates the pre-correction evaluation value (process capability index Cpkb) of the 1 st component.

In this way, the calculating unit 42 subtracts the correction values (Xc, yc) used when the component mounting unit 12 mounts the component D on the substrate 6 from the substrate inspection information 41b (the positional deviation amounts Δx, Δy) to calculate the pre-correction evaluation value (the process capability index Cpkb). That is, the post-correction evaluation value and the pre-correction evaluation value are evaluation values (process capability index Cpk, process capability index Cpkb) that characterize the mounting accuracy at the time of mounting of the component mounting portion 12, which are calculated based on the substrate inspection information 41b and the correction values (Xc, yc).

In fig. 5, the judgment section 43 judges whether or not the correction value (Xc, yc) at the time of mounting is suitable for use, based on the post-correction evaluation value and the pre-correction evaluation value. Specifically, the determination unit 43 determines to use the correction value (Xc, yc) when both the post-correction evaluation values (process capability index Cpk) in the X-axis direction and the Y-axis direction are equal to or greater than the pre-correction evaluation value (process capability index Cpkb) (as appropriate). Further, the determination unit 43 determines that the correction value (Xc, yc) is not used (unsuitable) when either of the post-correction evaluation values (process capability index Cpk) in the X-axis direction and the Y-axis direction is smaller than the pre-correction evaluation value (process capability index Cpkb).

Here, the meaning of comparing the evaluation value after correction (process capability index Cpk) and the evaluation value before correction (process capability index Cpkb) will be described. The process capability index Cpk is an index that decreases with a larger characterization value. Therefore, when the post-correction evaluation value (process capability index Cpk) is equal to or greater than the pre-correction evaluation value (process capability index Cpkb), it is expected that the positional deviation of the component D becomes smaller by using the correction values (Xc, yc) at the time of mounting. On the other hand, when the post-correction evaluation value (process capability index Cpk) is smaller than the pre-correction evaluation value (process capability index Cpkb), it is expected that the positional deviation will be rather large when the correction values (Xc, yc) are used at the time of installation.

In this way, the calculating unit 42 calculates the post-correction evaluation value (process capability index Cpk) and the pre-correction evaluation value (process capability index Cpkb) for each type of the component D, and the judging unit 43 judges whether or not the correction value (Xc, yc) is suitable for use for each type of the component D. The calculation unit 42 may calculate the post-correction evaluation value (process capability index Cpk) and the pre-correction evaluation value (process capability index Cpkb) for each type of the component D and for each component mounting unit 12. In this case, the judging section 43 judges whether or not the correction value (Xc, yc) is suitable for use, for each type of component D and for each component mounting section 12. Thus, even when the same type of component D is alternately mounted on the board 6 by the front and rear component mounting sections 12 of the component mounting device M2, the determination section 43 can determine the suitability of the correction value (Xc, yc) for use per component mounting section 12.

Here, the determination of whether or not the correction values (Xc, yc) of the determination unit 43 are suitable will be described with reference to fig. 10. Fig. 10 is a diagram illustrating an example of the post-correction evaluation value and the pre-correction evaluation value calculated in the component mounting system 1. In fig. 10, correction value information 41c, corrected information 41D, and information contained in the pre-correction information 41e are extracted and displayed in an aligned manner for a part of a plurality of types of components D mounted on the board 6 in the component mounting devices M2 and M3. That is, in fig. 10, the correction value 51 contained in the correction value information 41c, the post-correction evaluation value 52 contained in the post-correction information 41D, the pre-correction evaluation value 53 contained in the pre-correction information 41e, and the correction suitability 54 of the judging section 43 are displayed for each component name 50 (type of component D).

For example, when the component name 50 is "D01", the judgment unit 43 judges whether the correction suitability 54 is "suitable" because the post-correction evaluation value 52 (Cpk (X01)) in the X-axis direction is equal to or greater than the pre-correction evaluation value 53 (Cpkb (X01)) and the post-correction evaluation value 52 (Cpk (Y01)) in the Y-axis direction is equal to or greater than the pre-correction evaluation value 53 (Cpkb (Y01)). In addition, when the component name 50 is "D02", the judgment unit 43 judges whether the correction suitability 54 is "unsuitable" because the corrected evaluation value 52 (Cpk (X02)) in the X-axis direction is smaller than the pre-correction evaluation value 53 (Cpkb (X02)) or the corrected evaluation value 52 (Cpk (Y02)) in the Y-axis direction is smaller than the pre-correction evaluation value 53 (Cpkb (Y02)).

In fig. 5, the setting unit 44 sets the correction value (Xc, yc) to be used by the component mounting unit 12 when the determination unit 43 determines that the correction value (Xc, yc) is suitable for use. In addition, when the judgment section 43 judges that the use of the correction value (Xc, yc) is unsuitable (unsuitable), the setting section 44 sets that the correction value (Xc, yc) is not used by the component mounting section 12. Specifically, the setting unit 44 changes (sets) the "fit" and "unfit" information of the correction fit information 21c stored in the component mounting devices M2 and M3, respectively, for mounting the component D, which change the fit of the correction values (Xc and Yc).

Thus, the component mounting units 12 of the component mounting devices M2 and M3 mount the component D with or without using the correction values (Xc, yc) according to the setting of the correction suitability information 21c after the change. That is, the setting section 44 sets whether or not the correction value (Xc, yc) is used at the time of mounting of the component mounting section 12.

Here, an example of the component D1 in which the positional deviation amounts Δx, Δy of the component D become large by using the correction values (Xc, yc) at the time of mounting will be described with reference to fig. 11A and 11B. Fig. 11A and 11B are a top view and a side view, respectively, showing an example of the component D1 in which the positional deviation is likely to become large when the correction value calculated in the component mounting system 1 is used. The member D1 is a patch member whose center position of the upper surface Dc and center position of the lower surface De are offset. The member D1 has a parallelogram cross-sectional shape. When the member D1 having such a shape is irregularly accommodated in the pocket of the carrier tape 17, as shown in fig. 11A and 11B, the side surface Dd is irregularly attached to the substrate 6 in a direction (a relationship between the center position of the upper surface Dc and the center position of the lower surface De) extending from the upper surface Dc when viewed from above.

When the component D1 is imaged by the inspection camera 32 of the inspection device M4 and recognized by the recognition processing unit 36, the center position of the upper surface Dc of the recognized component D1 and the center position of the lower surface De of the component D1 in contact with the substrate 6 deviate. That is, since the direction of the deviation is different for each component D1, the correction values (Xc, yc) calculated by the correction value calculating unit 37 do not necessarily correct the deviation in the correct direction at the time of mounting. Therefore, it is possible to make the positional deviation amounts Δx, Δy of the component D1 rather large by using the correction values (Xc, yc) at the time of mounting.

Fig. 12 is a flowchart of a component mounting method in the component mounting system 1. Next, a component mounting method of determining whether or not the correction values (Xc, yc) in the component mounting apparatuses M2, M3 are suitable for use based on the amounts of positional deviation Δx, Δy of the component D mounted on the substrate 6 by the component mounting system 1 and the correction values (Xc, yc) used at the time of mounting will be described in accordance with the flow chart of fig. 12. First, when the component mounting system 1 starts the production of the mounted board (ST 1), the component mounting apparatuses M2 and M3 perform the component mounting operation of mounting the component D on the board 6 without using the correction values (Xc and Yc) until the positional deviation information (positional deviation amounts Δx and Δy) of a predetermined number (for example, 30 pieces) is acquired (no in ST 3) (ST 2).

When positional deviation information (positional deviation amounts Δx, Δy) of a predetermined number of pieces is acquired (yes in ST 3), the correction value calculating unit 37 calculates a correction value (Xc, yc) based on the acquired positional deviation amounts Δx, Δy (ST 4: correction value calculating step). That is, the correction value calculating unit 37 calculates the correction value (Xc, yc) at the time of mounting the component D on the substrate 6 based on the substrate inspection information 41b including at least the positional deviation information (positional deviation amounts Δx, Δy) of the component D mounted on the substrate 6. The calculated correction values (Xc, yc) are transmitted to the component mounting devices M2, M3 (correction value information 21 b) and the management computer 3 (correction value information 41 c).

In fig. 12, next, the component mounting apparatuses M2 and M3 perform the component mounting operation of mounting the component D on the substrate 6 by using the correction values (Xc, yc) included in the correction value information 21b until the substrate inspection information 41b (the positional deviation amounts Δx and Δy) of a predetermined number of pieces (for example, 30 pieces) is acquired (no in ST 6) (ST 5). That is, the suitability information contained in the correction suitability information 21c is "suitability", and the component mounting section 12 mounts the component D on the substrate 6 based on the correction value (Xc, yc).

When the substrate inspection information 41b (positional deviation amounts Δx, Δy) of a predetermined number of pieces is obtained (yes in ST 6), the calculating unit 42 calculates a corrected evaluation value (process capability index Cpk) in the case of mounting the component D on the substrate 6 using the correction values (Xc, yc) based on the substrate inspection information 41b of the substrate 6 using the correction values (Xc, yc) (ST 7: corrected evaluation value calculating process). The calculating unit 42 calculates a pre-correction evaluation value (process capability index Cpkb) assuming that the component D is mounted on the substrate 6 without using the correction value (Xc, yc) based on the same substrate inspection information 41b and the correction values (Xc, yc) as in the post-correction evaluation value calculating process (ST 7) (ST 8: pre-correction evaluation value calculating process).

In fig. 12, the judgment unit 43 then judges whether or not the correction value (Xc, yc) is suitable for use at the time of mounting based on the post-correction evaluation value (process capability index Cpk) and the pre-correction evaluation value (process capability index Cpkb) (ST 9: judgment step). When the post-correction evaluation value (process capability index Cpk) is smaller than the pre-correction evaluation value (process capability index Cpkb) (Cpk < Cpkb), the determination unit 43 determines that the correction value (Xc, yc) is not used (unsuitable) (yes in ST 9). In this case, the setting unit 44 sets the correction suitability information 21c of the component D to be mounted on the component mounting device M2 or M3 which has judged "unsuitable" as "unsuitable".

When the post-correction evaluation value (process capability index Cpk) is equal to or greater than the pre-correction evaluation value (process capability index Cpkb) (Cpk is equal to or greater than Cpkb), the determination unit 43 determines that the correction value (Xc, yc) is used (appropriate) (no in ST 9). In this case, the setting unit 44 does not change the suitability information (set to "suitable") of the component D for which the correction suitability information 21c of either one of the component mounting devices M2, M3 that has judged to be "suitable" for the component D is mounted.

In fig. 12, next, the component mounting apparatuses M2 and M3 perform component mounting operation for mounting the component D on the board 6 based on the corrected suitability information 21c after the change (ST 11). That is, the component mounting operation that does not use the correction value (Xc, yc) is performed for the component D determined to be "unsuitable" in the determination step (ST 9), and the component mounting operation that uses the correction value (Xc, yc) is continued for the component D determined to be "suitable". This can provide good mounting accuracy for various components D mounted on the board 6.

In the component mounting method described above, in the pre-correction evaluation value calculating step (ST 8), the pre-correction evaluation value (process capability index Cpkb) is calculated based on the same board inspection information 4lb and correction values (Xc, yc) as in the post-correction evaluation value calculating step (ST 7), but the method is not limited thereto. For example, in the pre-correction evaluation value calculation step (ST 8), the pre-correction evaluation value (process capability index Cpkb) may be calculated based on the substrate inspection information 41b of the substrate 6 on which the component D is mounted without using the correction values (Xc, yc) in (ST 2). That is, the calculating unit 42 may calculate the pre-correction evaluation value (process capability index Cpkb) based on the board inspection information 41b that the component D is mounted on the board 6 without using the correction values (Xc, yc).

In addition, when the cause of the "unsuitable" is determined to be due to the shape of the component D in the determining step (ST 9) (refer to fig. 11A and 11B), the suitability information of the component D for the suitability correction information 21c may be set to "unsuitable" from the production start time point (ST 1), and the component D may be mounted on the board 6 without using the correction values (Xc, yc) in the component mounting operation of (ST 5). That is, the "fit" and "unfit" of the fit/unfit information may be stored in a database or the like for each type of component, and the correction fit/unfit information 21c of the new mounting board may be created by referring to the database when manufacturing the new mounting board.

As described above, the component mounting system 1 of the present embodiment includes: the correction value calculating unit 37 calculates correction values (Xc, yc) when the component D is mounted on the substrate 6 based on the substrate inspection information 41b including at least the positional deviation information (positional deviation amounts Δx, Δy) of the component D mounted on the substrate 6; a component mounting section 12 that mounts the component D on the substrate 6 based on the correction values (Xc, yc); a calculating unit 42 that calculates an evaluation value indicating mounting accuracy at the time of mounting of the component mounting unit 12 based on the board inspection information 41b and the correction values (Xc, yc); and a judging section 43.

The calculation unit 42 calculates, as evaluation values, a post-correction evaluation value (process capability index Cpk) when the component D is mounted on the substrate 6 using the correction values (Xc, yc) and a pre-correction evaluation value (process capability index Cpkb) when the component D is mounted on the substrate 6 assuming that the correction values (Xc, yc) are not used, and the determination unit 43 determines whether or not the correction values (Xc, yc) are suitable for use at the time of mounting based on the post-correction evaluation value (process capability index Cpk) and the pre-correction evaluation value (process capability index Cpkb). This can provide good mounting accuracy for various components D mounted on the board 6.

In the above-described embodiment, the inspection device M4 calculates the correction value, but the component mounting system 1 of the present embodiment is not limited to this configuration. For example, the management computer 3 may include a correction value calculation unit 37 that calculates a correction value based on the board inspection information 41b and transmits the correction value to the component mounting devices M2 and M3. The component mounting apparatuses M2 and M3 may each include a correction value calculation unit 37, and the board inspection information 41b may be acquired from the inspection apparatus M4 to calculate the correction value.

In the above-described embodiment, the single process capability index Cpk was used as an example of the post-correction evaluation value and the pre-correction evaluation value, but the process capability index Cp on both sides may be used as the post-correction evaluation value and the pre-correction evaluation value.

Industrial applicability

The component mounting system and the component mounting method of the present disclosure have an effect of obtaining good mounting accuracy for various components mounted on a substrate, and are useful in the field of mounting components on a substrate.

Description of the reference numerals

1 component mounting System

6 substrate

12 parts mounting portion

D part

M2, M3 component mounting device

Δx, Δy positional deviation amount (positional deviation information).

Claims (9)

1. A component mounting system is provided with:

a correction value calculation unit that calculates a correction value when a component is mounted on a substrate, based on substrate inspection information including at least positional deviation information of the component mounted on the substrate;

a component mounting section that mounts the component to the substrate based on the correction value;

a calculating unit that calculates an evaluation value indicating mounting accuracy at the time of mounting of the component mounting unit based on the board inspection information and the correction value; and

a judging part for judging whether the current state of the current state is the current state,

the calculation unit calculates, as the evaluation values, a post-correction evaluation value in a case where the component is mounted on the substrate using the correction value and a pre-correction evaluation value in a case where the component is mounted on the substrate assuming that the correction value is not used,

the judgment section judges whether or not the correction value is used at the time of mounting based on the post-correction evaluation value and the pre-correction evaluation value.

2. The component mounting system of claim 1 wherein,

the calculating unit calculates the post-correction evaluation value based on the board inspection information, and subtracts the correction value used when the component mounting unit mounts the component on the board from the board inspection information to calculate the pre-correction evaluation value.

3. The component mounting system according to claim 1 or 2, wherein,

the calculation unit calculates the post-correction evaluation value and the pre-correction evaluation value for each type of component,

the judging section judges whether or not the correction value is suitable for use, for each type of the component.

4. The component mounting system according to claim 1 or 2, wherein,

the calculating unit calculates the post-correction evaluation value and the pre-correction evaluation value for each type of component and for each component mounting unit,

the judging section judges whether or not the correction value is used for each type of the component and for each component mounting section.

5. The component mounting system of any one of claims 1-4, wherein,

the determination unit determines to use the correction value when the post-correction evaluation value is equal to or greater than the pre-correction evaluation value.

6. The component mounting system of any one of claims 1-5, wherein,

the component mounting system further includes:

a setting section that sets whether or not the correction value is used at the time of mounting of the component mounting section,

the setting unit sets the correction value to be used when the judging unit judges that the correction value is suitable for use.

7. The component mounting system of claim 6 wherein,

the setting unit sets not to use the correction value when the judgment unit judges that the correction value is unsuitable to use.

8. The component mounting system of any one of claims 1-7, wherein,

the calculation unit calculates an assumed positional deviation amount assuming that the correction value is not used, based on a positional deviation amount in the horizontal direction obtained from the substrate inspection information using the correction value of the 1 st component and a correction amount in the horizontal direction obtained from the correction value of the 1 st component, and calculates the pre-correction evaluation value of the 1 st component.

9. A component mounting method, wherein,

a correction value when a component is mounted on a substrate is calculated based on substrate inspection information including at least positional deviation information of the component mounted on the substrate,

mounting the component to the substrate based on the correction value,

a corrected evaluation value in the case of mounting the component on the substrate using the correction value is calculated based on the substrate inspection information,

a pre-correction evaluation value assuming that the component is mounted on the substrate without using the correction value is calculated based on the substrate inspection information and the correction value,

and judging whether or not to use the correction value at the time of installation based on the post-correction evaluation value and the pre-correction evaluation value.