JP6021550B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for holding and moving an electronic component with a nozzle and mounting the electronic component on a substrate.

  An electronic component mounting apparatus for mounting an electronic component on a substrate has a head including a nozzle, holds the electronic component with the nozzle, and mounts the electronic component on the substrate. The electronic component mounting device picks up the components in the electronic component supply device by moving the head nozzle in a direction perpendicular to the surface of the substrate, and then moves the head relatively in a direction parallel to the surface of the substrate. When the picked-up component arrives at the mounting position, the picked electronic component is mounted on the substrate by moving the nozzle of the head in a direction orthogonal to the surface of the substrate and bringing it closer to the substrate.

  Here, some electronic component mounting apparatuses include a mechanism that replaces a nozzle that sucks the electronic component in accordance with the electronic component that is sucked. As this nozzle, there is a nozzle provided with a mechanism for adjusting a load to be pressed at the time of suction and mounting (see Patent Documents 1 and 2). As a mechanism for adjusting the pressing load, there is a mechanism in which the tip and the base of the nozzle are connected by an elastic body such as a spring, and the tip is movable with respect to the base. By providing such an elastic body, the nozzle can adjust the direction of the tip in accordance with the shape of the suction surface of the electronic component. When a nozzle having a load adjustment function is used, a load detection unit such as a load cell is provided in the nozzle, and the vertical movement of the nozzle is controlled based on the detection result of the load detection unit.

JP 09-246790 A JP 2006-147640 A

  The electronic component mounting apparatus can suppress applying a large load to the electronic component supply apparatus and the substrate by detecting the load of the nozzle with a load detection unit provided in the nozzle. However, even if the load detection unit is provided, the detected load and the actual load may deviate, the nozzle may be pushed too much, or the nozzle may be separated, which may make the electronic component mounting operation unstable.

  The present invention has been made in view of the above, and an object of the present invention is to provide an electronic component mounting apparatus capable of stably adsorbing electronic components and mounting them on a substrate.

  In order to solve the above-described problems and achieve the object, the present invention holds an electronic component supply device that supplies an electronic component to a holding region, and an electronic component that is supplied from the electronic component supply device to the holding region. A head main body having a nozzle, a nozzle driving unit for driving the nozzle up and down and rotating, and supplying air pressure for driving the nozzle to the nozzle, and a head support for supporting the nozzle and the nozzle driving unit; and the head A head moving mechanism that moves the main body, a load detection unit that detects a load generated by pressing the tip of the nozzle against the measurement surface, a nozzle shape detection unit that detects the shape of the nozzle, and controls the operation of each unit The control device uses the load detection unit and the nozzle shape detection unit, and uses the load detection unit and the nozzle shape detection unit to determine the outer shape of the nozzle, the presence or absence of a spring, and its bar. It performs detection of the stroke, and stores the result of detection as a characteristic of the nozzle, based on the stored characteristics of the nozzle, and controlling the vertical drive of the nozzle by the nozzle driving unit.

  Here, it is preferable that the control device detects the presence or absence of a stopper of the nozzle using the nozzle shape detection unit, and determines that the nozzle is a load control nozzle when the stopper is provided.

  Moreover, it is preferable that the said load detection part is a load cell.

  Moreover, it is preferable that the said nozzle shape detection part is a laser sensor connected with the said head support body.

  The characteristic of the nozzle includes a contact load value and a Z-axis operation speed, and the control device includes the spring stroke, the contact load value, and the Z-axis operation speed included in the nozzle characteristic. It is preferable to determine the state of the nozzle based on the execution time of each operation during the mounting operation of mounting the electronic component with the nozzle.

  In addition, the control device detects an actual operation time during a mounting operation of mounting the electronic component with the nozzle, compares the theoretical value detected from the characteristics of the nozzle with the actual operation time, It is preferable to detect a change in the spring stroke.

  Further, the control device determines that the difference between the theoretical value and the actual operation time is within a threshold value, determines that the difference is normal, corrects the characteristics of the nozzle based on the actual operation time, and the theoretical value When the difference between the actual operation time and the actual operation time is equal to or greater than a threshold value, it is preferable to determine that the target nozzle is in an abnormal state by setting the target nozzle to be prohibited.

  According to the present invention, an electronic component can be sucked and mounted on a substrate with appropriate load control corresponding to the nozzle. As a result, the electronic component can be stably adsorbed and mounted on the substrate.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram showing a schematic configuration of the component supply unit. FIG. 3 is a schematic diagram showing a schematic configuration of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 5 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 6 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 7 is a flowchart showing an example of the operation of the electronic component mounting apparatus. FIG. 8 is an explanatory diagram showing a schematic configuration of the nozzle. FIG. 9 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load. FIG. 10 is an explanatory diagram illustrating an example of the operation of the nozzle. FIG. 11 is an explanatory diagram illustrating an example of nozzle characteristics. FIG. 12 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 13 is an explanatory diagram illustrating an example of the operation of the electronic component mounting apparatus. FIG. 14 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 15 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 16 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load. FIG. 17 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load. FIG. 18 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Embodiments of an electronic component mounting apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus.

  An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. A unit 19, a control device 20, an operation unit 40, a display unit 42, and a load cell 48 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side with the board conveyance unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished. The housing 11 is a box that accommodates each part of the electronic component mounting apparatus 10.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at the predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8, and can supply them to the head 15, that is, they can be held (sucked or gripped) by the head 15. The electronic component supply apparatus which supplies to a holding position in a state is provided. The component supply units 14f and 14r of the present embodiment have the same configuration and include a plurality of electronic component supply devices. The electronic component supply device supplies the electronic component to a holding position where the head 15 holds the electronic component. Hereinafter, the configuration of the component supply unit 14 will be described.

  As shown in FIG. 2, the component supply unit 14 includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 100. A plurality of component supply apparatuses 100 shown in FIG. 2 are held by a support base (bank) 102. Further, the support table 102 can be mounted with other devices (for example, a measurement device, a camera, etc.) of the component supply devices 100 and 100.

  The component supply unit 14 is mounted with an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body, and is mounted from the tape body at the holding position of the mounted electronic component held by the electronic component holding tape. An electronic component supply apparatus 100 is provided that can peel off and hold the mounted electronic component at the holding position by a suction nozzle or a grip nozzle provided in the head.

  The electronic component supply apparatus 100 supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 100 is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic component can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply apparatus 100 is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder or a bulk feeder can be used. The chip electronic component (mounted electronic component) is an electronic component without a lead that does not include a lead that is inserted into an insertion hole (through hole) in which a substrate is formed. Examples of the on-board electronic component include SOP and QFP. The chip-type electronic component is mounted on the substrate without inserting the lead into the insertion hole.

  The component supply unit 14 is composed of a plurality of types of component supply devices 100 in which the plurality of component supply devices 100 held on the support base 102 are different in the type of electronic component to be mounted, the mechanism for holding the electronic component, or the supply mechanism. The The component supply unit 14 may include a plurality of the same type of component supply devices 100. The component supply unit 14 is preferably configured to be detachable from the apparatus main body. The component supply unit 14 can use various electronic component supply devices that supply electronic components. For example, the component supply unit 14 may install a stick feeder or a tray feeder as the electronic component supply apparatus 100. The component supply unit 14 may be provided with a bowl feeder as an electronic component supply device.

  The head 15 holds (sucks or holds) an electronic component held by the component supply unit 14 (mounted electronic component held by the electronic component supply apparatus 100) with a nozzle, and the held electronic component is held by the substrate transport unit 12. This is a mechanism for mounting on the substrate 8 moved to a predetermined position. The configuration of the head 15 will be described later.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8, and is an X-axis drive unit 22 and a Y-axis drive unit 24. And have. The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The X-axis drive unit 22 has a ball screw, and moves the support unit supporting the head 15 in the X direction by rotating the ball screw. The X-axis drive unit 22 is also provided with a linear guide that supports the head 15 so that the head 15 does not rotate even when the ball screw rotates so as to be movable in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The Y-axis drive unit 24 has a ball screw, and moves the support unit that supports the head 15 in the Y direction by rotating the ball screw. The Y-axis drive unit 24 also includes a linear guide that supports the X-axis drive unit 22 so that it can move in the Y-axis direction so that the X-axis drive unit 22 does not rotate even when the ball screw rotates. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices of the component supply units 14f and 14r on the substrate 8 at predetermined positions (mounting position, mounting position). It becomes a transfer means to transfer to. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism (X-axis drive unit 22, Y-axis drive unit 24) for moving the object in a predetermined direction, a mechanism other than a conveyance mechanism using a ball screw and a linear guide can be used. As a mechanism of the X-axis drive unit 22 and the Y-axis drive unit 24, for example, a linear motor, a rack and pinion, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and includes a camera for photographing the vicinity of the nozzles of the head 15 and an illumination unit for illuminating the photographing region. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image to obtain the shape of the nozzle, the nozzle It recognizes the shape of the electronic component attracted by the nozzle and the holding state of the electronic component by the nozzle. The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18, and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. An electronic component is thrown into the component storage unit 19 by opening the component.

  The load cell 48 is disposed between the VCS unit 17 and the component storage unit 19. The load cell 48 detects the load applied to the measurement surface, with the upper surface in the vertical direction, that is, the surface on the head 15 side serving as the measurement surface. For example, the load cell 48 detects a load generated when the nozzle of the head 15 is pressed against the measurement surface. The load cell 48 transmits the detected load to the control device 20. By detecting the load using the load cell 48, the later-described nozzle load can be measured with high accuracy. In this embodiment, the load cell 48 that detects the load generated by pressing the nozzle against the measurement surface with a strain gauge or the like is used, but the present invention is not limited to this. The electronic component mounting apparatus 10 may use various load detection mechanisms that can measure the load applied to the nozzle as a load detection unit instead of the load cell 48.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. In addition, the control device 20 includes a storage area for storing various data. The operation unit 40 is an input device through which an operator inputs an operation. Examples of the input device include a keyboard, a mouse, and a touch panel. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker, and includes a touch panel, a vision monitor, and the like. The display unit 42 displays various images based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of the present embodiment has one head, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two X-axis drive units are provided, and the two heads can be moved independently by moving the two heads in the XY directions, respectively. Since the electronic component mounting apparatus 10 includes two heads, electronic components can be alternately mounted on one substrate 8. Thus, by alternately mounting electronic components with two heads, while one head is mounting the electronic component on the substrate 8, the other head holds the electronic component in the component supply device. be able to. Thereby, the time when an electronic component is not mounted on the board | substrate 8 can be shortened more, and an electronic component can be mounted efficiently. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can more efficiently mount electronic components on the substrate by moving the two substrates alternately to the electronic component mounting position by the two substrate transfer units 12 and mounting the components alternately by the two heads 15. can do.

  Next, the configuration of the head 15 will be described with reference to FIGS. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 5 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. In FIG. 3, various control units that control the electronic component mounting apparatus 10 and one component supply device 100 of the component supply unit 14 are also shown. As shown in FIGS. 4 and 5, the head 15 includes a head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (laser sensor, component state detection unit). , State detection unit) 38, special purpose head 70, imaging device (substrate state detection unit) 76, and height sensor (substrate state detection unit) 77.

  As shown in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  In the electronic component supply device 100, the main body of the electronic component 80 is exposed upward on the electronic component holding tape. The electronic component supply apparatus 100 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the electronic component supply apparatus 100 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. As shown in FIGS. 4 and 5, six nozzles 32 are arranged in a row in the head main body 30 of the present embodiment. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG.4 and FIG.5, the adsorption | suction nozzle which adsorb | sucks and hold | maintains an electronic component is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, a laser recognition device 38, and a special purpose head 70.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 33 at the tip, and sucks air from the opening 33 to suck and hold the electronic component 80 at the tip. The nozzle 32 is connected to the shaft 32a. The shaft 32a is a rod-like member that supports the nozzle 32, and is arranged extending in the Z-axis direction. The shaft 32 a has an air pipe (pipe) that connects the opening 33 and the suction mechanism of the nozzle drive unit 34 therein.

  The nozzle drive unit 34 moves the nozzle 32 in the Z-axis direction and sucks the electronic component 80 through the opening 33 of the nozzle 32. Here, the Z axis is an axis orthogonal to the XY plane. The Z axis is a direction orthogonal to the surface of the substrate 8. In addition, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction when mounting electronic components. That is, the θ direction is a direction parallel to the circumferential direction of a circle around the Z axis, which is an axis parallel to the direction in which the nozzle driving unit moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32.

  As the mechanism for moving the nozzle 32 in the Z-axis direction, the nozzle driving unit 34 includes, for example, a mechanism having a linear motion linear motor in which the Z-axis direction is the driving direction. The nozzle driving unit 34 moves the opening 33 at the tip of the nozzle 32 in the Z-axis direction by moving the shaft 32a of the nozzle 32 in the Z-axis direction with a linear motion linear motor. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to the shaft 32a as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle drive unit 34 transmits the driving force output from the motor to the shaft 32a by a transmission element, and rotates the shaft 32a in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 33 of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 33 of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 switches whether to suck air from the opening 33 by sucking air from the air pipe with a pump and switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks air from the opening 33 to suck (hold) the electronic component 80 into the opening 33, and closes the electromagnetic valve and does not suck air from the opening 33 to suck into the opening 33. The electronic component 80 that has been opened is opened, that is, a state in which the electronic component 80 is not picked up by the opening 33 (not held).

  Further, the head 15 of the present embodiment includes a pressure detection unit that detects the pressure in each nozzle 32 or the shaft 32a. The head 15 detects the pressure applied to the corresponding nozzle 32 by the pressure detection unit, that is, the load applied to the nozzle 32.

  Moreover, the head 15 can change the nozzle 32 which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement. For example, the head 15 of the present embodiment changes the type of nozzle 32 to be mounted based on the type of electronic component to be sucked (held). The head 15 of the present embodiment uses a gripping nozzle when the top surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component 80. The gripping nozzle can open and close the main body of the electronic component 80 from above by opening and closing the movable piece with respect to the fixed piece by sucking and releasing air in the same manner as the suction nozzle.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. In addition, the height sensor 37 processes the distance from the facing portion using the position of the sensor itself and the position of the substrate 8 to measure the height of the facing portion, specifically, the electronic component 80. To detect. The process of detecting the height of the electronic component 80 based on the measurement result of the distance to the electronic component may be performed by the control unit 60.

  The laser recognition device (laser sensor / nozzle shape detection unit) 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 3, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 100 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 and the shape of the nozzle 32 by irradiating the electronic component 80 adsorbed by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The shape of the nozzle 32 is the outer shape of the nozzle. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a.

  The special purpose head 70 is connected to the head body 30. The special purpose head 70 has the same configuration as the head body 30 except that the number of nozzles is one. The special purpose head 70 includes a head support 71 that supports each part, a single nozzle 72, and a nozzle driving unit 74. In the special purpose head 70 of the present embodiment, as shown in FIG. 4, nozzles 72 are arranged on the extended line of the row in which the six nozzles 32 of the head body 30 are arranged. The six nozzles 32 are arranged in a direction parallel to the X axis. The nozzle 72 is provided with a suction nozzle that sucks and holds the electronic component 80.

  The head support 71 is a support member connected to the head support 31 and supports the nozzle 72 and the nozzle driving unit 74. The head support 71 supports the nozzle 72 at a position away from the head support 31 by a certain distance.

  The nozzle 72 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 72 has an opening at the tip, and sucks air from the opening to suck and hold the electronic component 80 at the tip. The nozzle 72 has a shaft 72a formed with an opening and connected to a tip end portion that sucks the electronic component 80. The shaft 72a is a rod-like member that supports the tip portion, and is arranged extending in the Z-axis direction. The shaft 72 a has an air pipe (pipe) that connects the opening and the suction mechanism of the nozzle drive unit 74 inside.

  The nozzle drive unit 74 moves the nozzle 72 in the Z-axis direction and sucks the electronic component 80 through the opening of the nozzle 72. In addition, the nozzle driving unit 74 rotates the nozzle 72 in the θ direction when the electronic component 80 is mounted. As the mechanism for moving the nozzle 72 in the Z-axis direction, the nozzle driving unit 74 includes, for example, a mechanism having a linear motion linear motor in which the Z-axis direction is the driving direction. The nozzle drive unit 74 moves the opening at the tip of the nozzle 72 in the Z-axis direction by moving the shaft 72a of the nozzle 72 in the Z-axis direction with a linear motion linear motor. In addition, the nozzle driving unit 74 includes a mechanism configured by, for example, a motor and a transmission element coupled to the shaft 72a as a mechanism for rotating the nozzle 72 in the θ direction. The nozzle driving unit 74 transmits the driving force output from the motor to the shaft 72a by a transmission element, and rotates the shaft 72a in the θ direction, thereby rotating the tip of the nozzle 72 in the θ direction.

  The nozzle drive unit 74 has a mechanism for sucking the electronic component 80 through the opening of the nozzle 72, that is, as a suction mechanism, for example, an air pipe connected to the opening of the nozzle 72, a pump connected to the air pipe, and an air There is a mechanism having an electromagnetic valve for switching opening and closing of a pipe line. The nozzle driving unit 74 sucks air from the air pipe with a pump, and switches whether to suck air from the opening by switching between opening and closing of the electromagnetic valve. The nozzle drive unit 74 opens the electromagnetic valve and sucks air from the opening to suck (holds) the electronic component 80 into the opening, and closes the electromagnetic valve and sucks air from the opening to suck the electronic component from the opening. 80 is opened, that is, the electronic component 80 is not picked up by the opening (not held).

  The imaging device 76 is fixed to the head support 71 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The photographing device 76 has the same function as the photographing device 36. The height sensor 77 is fixed to the head support 71 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 77 has the same function as the height sensor 37. The photographing device 76 and the height sensor 77 have the same functions as those of the photographing device 36 and the height sensor 37 except for the arrangement positions, and are used for the same purposes.

  The head 15 includes a special-purpose head 70 in which the nozzle 72 is disposed at a position away from the head main body 30, so that the head 15 is mounted on the electronic component to be mounted in one reciprocation between the component supply unit 14 and the substrate 8. The options can be broadened. For example, a small electronic component can be held by the six adjacent nozzles 32 while holding a large electronic component (an electronic component larger than the arrangement interval of the nozzles 32) by the nozzle 72 at a distant position. In other words, even when there is a large electronic component that cannot be held by another nozzle 32 when sucked by the nozzle 32, the nozzle 72 can be used to operate without affecting the holding of the other nozzle 32. it can.

  The head 15 is configured as described above. The head 15 of the above embodiment has been described as the case where the suction nozzles are mounted on the nozzles 32 and 72, but a gripping nozzle that grips and holds the electronic component on the nozzles 32 and 72 can be used. Even when a gripping nozzle is used for the nozzles 32 and 72, the head 15 operates the gripping nozzle drive unit by adjusting the air pressure supplied to the nozzles 32 and 72, and releases the state where the electronic component is gripped. Change the status. The head 15 preferably includes photographing devices (substrate state detecting units) 36 and 76, height sensors (substrate state detecting units) 37 and 77, a laser recognizing device 38, and a special purpose head 70. It does not have to be provided.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function such as a CPU, a ROM, and a RAM, and a storage function (storage area). In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices. Each control unit may be stored in a single ROM or RAM as a storage area, or a plurality of storage media may be provided. Each control unit stores a program used for arithmetic processing, various setting data, and conditions in a storage area.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls control operations by the head control unit 62 and the component supply control unit 64.

  The head control unit 62 is connected to the nozzle driving units 34 and 74 and various sensors disposed on the head support 31 and the control unit 60, controls the nozzle driving units 34 and 74, and operates the nozzles 32 and 72. Control. The head control unit 62 performs the suction (holding) / release operation of the electronic components 80 of the nozzles 32 and 72 based on the operation instructions supplied from the control unit 60 and the detection results of various sensors (for example, distance sensors), and each nozzle. The rotation operation of 32 and 72 and the movement operation in the Z-axis direction are controlled.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each component supply device 100 or may control all the component supply devices 100 by one. For example, the component supply control unit 64 controls tray replacement operation and movement operation by the electronic component supply apparatus 100. In addition, the component supply control unit 64 controls the operation (moving operation) of the electronic component holding tape by the component supply apparatus 100. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

  The control device 20 stores nozzle characteristic data in the storage area. The control device 20 may store nozzle characteristic data in a storage area of any of the control unit 60, the head control unit 62, and the component supply control unit 64. In addition, the control device 20 provides a storage area (ROM, etc.) separate from the control unit 60, the head control unit 62, and the component supply control unit 64, and stores nozzle characteristic data in this separate storage area. Also good. The control device 20 controls the operation of the head control unit 62 and the component supply control unit 64 by the control unit 60 to execute an operation for detecting the characteristics of the nozzle. Furthermore, the control device 20 controls the head operation by the head control unit 62, specifically, the movement operation of the nozzles 32 and 72 in the Z-axis direction based on the detected nozzle characteristics. This point will be described later.

  Next, the operation of each part of the electronic component mounting apparatus will be described. Note that the operation of each part of the electronic component described below can be executed by controlling the operation of each part based on the control device 20.

  FIG. 6 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The overall processing operation of the electronic component mounting apparatus 10 will be described with reference to FIG. Note that the processing shown in FIG. 6 is executed by the control device 20 controlling each unit. The electronic component mounting apparatus 10 reads a production program as step S52. The production program is created by a dedicated production program creation device, or created by the control device 20 based on various input data.

  After reading the production program in step S52, the electronic component mounting apparatus 10 detects the state of the apparatus in step S54. Specifically, the configuration of the component supply units 14f and 14r, the type of the electronic component 80 that is filled, the type of the nozzles 32 and 72 that are prepared, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and when preparation is completed, the board 8 is carried in as step S56. The electronic component mounting apparatus 10 carries in a board | substrate at step S56, and if a board | substrate is arrange | positioned in the position which mounts an electronic component, it will mount an electronic component on a board | substrate as step S58. The electronic component mounting apparatus 10 will carry out a board | substrate as step S60, if mounting of an electronic component is completed by step S58. When the electronic component mounting apparatus 10 carries out the board in step S60, it is determined in step S62 whether production is finished. If the electronic component mounting apparatus 10 determines that the production is not finished (No) in step S62, the electronic component mounting apparatus 10 proceeds to step S56, and executes the processing from step S56 to step S60. That is, processing for mounting electronic components on the board is executed based on the production program. If the electronic component mounting apparatus 10 determines that the production is finished (Yes) in step S62, the electronic component mounting apparatus 10 finishes this process.

  The electronic component mounting apparatus 10 can manufacture a board on which the electronic component is mounted by reading the production program and performing various settings as described above, and then mounting the electronic component on the board. In addition, the electronic component mounting apparatus 10 mounts a lead-type electronic component having a main body and leads connected to the main body on the substrate as an electronic component, specifically, a hole (insertion hole) formed on the substrate. ) Can be mounted on the substrate.

  FIG. 7 is a flowchart showing an example of the operation of the electronic component mounting apparatus. Note that the processing operation shown in FIG. 7 is an operation from the loading of the substrate to the completion of the mounting of the electronic component on the substrate. Further, the processing operation shown in FIG. 7 is executed by the control unit 60 controlling the operation of each unit.

  The control part 60 carries in the board | substrate 8 as step S102. Specifically, the control unit 60 transports the substrate on which the electronic component is to be mounted to a predetermined position by the substrate transport unit 12. If the board | substrate is carried in by step S102, the control part 60 will carry out holding movement as step S104. Here, the holding movement (suction movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding area of the component supply unit 14.

  After performing the holding movement in step S104, the control unit 60 lowers the nozzle 32 as step S106. That is, the control unit 60 moves the nozzle 32 downward to a position where the electronic component 80 can be held (sucked and gripped). After lowering the nozzle 32 in step S106, the control unit 60 holds the component with the nozzle 32 as step S108 and raises the nozzle 32 as step S110. When the control unit 60 raises the nozzle to a predetermined position in step S110, specifically, moves the electronic component 80 to the measurement position of the laser recognition device 38, the electronic component sucked by the nozzle 32 is step S112. 80 shapes are detected. When detecting the shape of the electronic component in step S112, the control unit 60 raises the nozzle 32 in step S114. Note that the control unit 60 detects the shape of the electronic component in step S112 as described above, and when it is determined that the held electronic component cannot be mounted, the electronic component is discarded and the electronic component is adsorbed again. When the control unit 60 raises the nozzle to a predetermined position, in step S116, the controller 60 moves the electronic component sucked by the nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8. In step S118, the nozzle 32 is lowered. In step S120, component mounting (component mounting), that is, a processing operation for releasing the electronic component 80 from the nozzle 32 is performed. In step S122, the nozzle 32 is raised. That is, the control unit 60 performs the mounting process described above in the processing operation from step S112 to step S120.

  When the nozzle 32 is raised in step S122, the control unit 60 determines in step S124 whether the mounting of all the components is complete, that is, whether the mounting process of the electronic components to be mounted on the board 8 is completed. If the control unit 60 determines in step S124 that the mounting of all the components has not been completed (No), that is, it is determined that the electronic components to be mounted remain, the process proceeds to step S104, and the next electronic component is placed on the substrate 8. Execute the processing operation to be installed. In this way, the control unit 60 repeats the above processing operation until the mounting of all components on the substrate 8 is completed. If the control unit 60 determines in step S124 that all parts have been mounted (Yes), the process ends.

  The electronic component mounting apparatus 10 can mount the electronic component on the substrate by executing the processing operation shown in FIG. 7, and can produce a substrate on which the electronic component is mounted.

  Next, the control operation of the nozzle 32 by the electronic component mounting apparatus 10, specifically, the operation at the time of suction of the electronic component by the nozzle and the operation at the time of mounting on the substrate will be described with reference to FIGS. 8 to 18.

  First, an example of a nozzle will be described with reference to FIG. FIG. 8 is an explanatory diagram showing a schematic configuration of the nozzle. The electronic component mounting apparatus 10 of the present embodiment includes a standard type nozzle and a load control type nozzle as suction type nozzles that suck and hold electronic components. A nozzle 120 shown in FIG. 8 is a load control type nozzle, and includes a base 130, a tip support portion 132, a tip portion 134, a spring 136, and a stopper 138. The base part 130 is a part connected to the shaft 32a. The nozzle 120 is in a state where it can move integrally with the shaft 32a by the base 130 being supported by the tip of the shaft 32a. The tip support portion 132 is a rod-like member extending in the Z-axis direction, and is connected to the base portion 130 in a slidable state. The distal end portion 134 is connected to the distal end of the distal end support portion 132. The tip portion 134 is the surface that is farthest from the base portion 130 and is in contact with the electronic component. One end of the spring 136 is connected to the base 130, and the other end is connected to the stopper 138. When the stopper 138 moves to the base portion 130 side, the spring 136 applies a force to the stopper 138 in a direction to move the stopper 138 to the original position. The stopper 138 is fixed at a position away from the tip support portion 132 by a certain distance.

  The nozzle 120 is configured as described above, and the base 130 and the stopper 138 are separated from each other in a no-load state. When a load is applied to the distal end portion 134 from this state, the distal end support portion 132, the distal end portion 134, and the stopper 138 move in a direction approaching the base portion 130, and the spring 136 contracts. Further, when a certain load or more is applied to the distal end portion 134, the stopper 138 and the base portion 130 come into contact as shown in the nozzle 120a. Further, when the nozzle 120a moves to a position where the stopper 138 contacts the base portion 130, the tip portion 134 basically does not move even if the load applied to the tip portion 134 increases. Further, when the load applied to the tip end portion 134 becomes smaller and the reaction force of the spring 136 becomes larger than the load, the nozzle 120a moves in a direction in which the tip end portion 134 moves away from the base portion 130 due to the reaction force of the spring 136. When becomes zero, the state of the nozzle 120 is reached.

  The nozzle 120 is configured as described above, and by providing the stopper 138 on the tip support portion 132 and connecting it to the spring 136, the operation of the spring 136 and the tip support portion 132 is performed rather than connecting the spring to the tip support portion 132. The range can be reduced. By reducing the operating range of the tip support portion 132, it is possible to suppress the displacement of the tip support portion 132 and to easily attract the electronic components. Further, the nozzle 120 has a structure in which the base portion 130 pushes the stopper 138 with the surface at the rigid time, that is, when the stopper 138 and the base portion 130 are in contact with each other. Thereby, it can suppress that force concentrates on the front-end | tip support part 132, the front-end | tip part 134, etc., can improve the durability of the nozzle 120, and can make it difficult to break even if a heavy load is applied. The electronic component mounting apparatus uses the nozzle 120 to transmit the load generated by the various means of the head 15 to the electronic component at a high transmission rate by sufficiently pushing the spring 136 into the rigid at the time of load control. Thereby, the difference of the detected pressure and the load concerning an electronic component can be made small. The electronic component mounting apparatus 10 includes nozzles having the same shape and different spring constants, that is, different loads (designated loads) until becoming rigid.

  The relationship between nozzle operation and load will be described with reference to FIGS. 9 and 10. FIG. 9 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load. FIG. 10 is an explanatory diagram illustrating an example of the operation of the nozzle. 9 and 10, the tip portion 134 of the nozzle 120 is brought into contact with the load cell 48, and the load cell 48 detects the load. In addition, the vertical axis shown in FIG. 9 shows the Z-axis operation and the load. The Z-axis operation indicates the movement speed when the movement speed in the downward direction in the vertical direction is positive, that is, when the downward movement is the positive direction. The load is a load detected by the load cell. The same control is performed when a load is detected by a load detector provided in the head. In this case, a load in a state where the nozzle and the electronic component are in contact with each other, and a load in a state in which the nozzle that adsorbs the electronic component and the substrate are in contact with each other are detected. The contact detection load is a reference load for determining that the nozzle is in contact, and the designated load is a load set to be applied to the nozzle when the electronic component is attracted or when the electronic component is mounted on the substrate.

  The head 15 descends from a state where the nozzle 120 is at a predetermined height in the Z-axis direction, decelerates when the nozzle 120 descends to the predetermined height, and stops once at a time t1 when the nozzle 120 descends to the predetermined height. Thereafter, the descent is started again at a speed (substrate contact speed) lower than the speed when descent to the predetermined height. In addition, when the electronic component mounting apparatus starts descending at the substrate contact speed at time t <b> 1, the electronic component mounting apparatus starts detecting the load in the load cell 48. Thereafter, the nozzle continues to descend, and when the load cell detects a load greater than the contact detection load at time t2, it is determined that the electronic component and the load cell are in contact. That is, it is determined that the state of the nozzle 120 in FIG. 10 has shifted to the state of the nozzle 120b.

  The head 15 temporarily stops the descent of the nozzle at a time t3 after a predetermined time has elapsed after detecting contact at time t2, and starts descent at a speed (load control speed) lower than the substrate contact speed. Here, a fixed time from time t2 to time t3 is a switching waiting time. Further, since the head is lowered from time t2 to time t3, as shown in the head 120b to the head 120c shown in FIG. 10, the base portion 130 is lowered and the spring is moved with the distal end portion 134 in contact with the load cell 48. Compressed. Thereafter, after the head 15 starts to descend again at time t3, the nozzle 120 is in a rigid state at time t4. That is, the stopper 138 and the base 130 are in contact with each other as shown by the nozzle 120d in FIG.

  The head 15 continues the lowering operation even after the nozzle 120 is in a rigid state, thereby increasing the load applied to the load cell 48 from the distal end portion 134 as shown from time t4 to time t5 in FIG. . The head 15 starts to decelerate the descending speed at time t5 when it is determined that the specified load is reached after the stop, and stops the movement of the nozzle with the specified load by stopping. Further, the head 15 starts to raise the nozzle at time t6 when the predetermined work is completed.

  The behavior of the load control nozzle is controlled by the operation described above. The electronic component mounting apparatus 10 includes a plurality of nozzles having different characteristics in order to mount various electronic components. Moreover, since the spring stroke, the contact load, and the specified load differ depending on the type, proper control cannot be performed if the nozzle is controlled under the same conditions.

  The electronic component mounting apparatus 10 according to the present embodiment stores nozzle characteristic data in the storage area of the control device 20, and controls the operation of each nozzle, particularly the load control nozzle, based on the stored data. .

  Here, FIG. 11 is an explanatory diagram showing an example of the characteristics of the nozzle. As shown in FIG. 11, the storage area stores information such as the tip X-direction width, the tip Y-direction width, the nozzle type, the contact load, and the spring stroke for each nozzle. The nozzle characteristics may further include an upper limit value of the designated load. Of the nozzle characteristics, information input by the operator to the operation unit 40 may be used for the tip X-direction width, the tip Y-direction width, the nozzle type, and the like. The electronic component mounting apparatus 10 may detect the shape with the laser recognition device 38 or the VCS unit 17 or may specify the nozzle type based on the results of various measurements. Moreover, the electronic component mounting apparatus 10 can also detect the contact load and the spring stroke by measurement.

  Hereinafter, the process of acquiring the nozzle characteristics (nozzle data) will be described. FIG. 12 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 13 is an explanatory diagram illustrating an example of the operation of the electronic component mounting apparatus. FIG. 14 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The processing illustrated in FIGS. 12 and 14 can be realized by the control device 20 controlling the operation of each unit.

  The controller 20 mounts the nozzle as step S200. Specifically, the target nozzle for acquiring the nozzle characteristics is mounted on the head. After mounting the nozzle in step S200, the control device 20 acquires the nozzle tip shape in step S202. Specifically, the shape of the nozzle is detected by the laser recognition device 38. Specifically, the nozzle tip size (X-direction width, Y-direction width) is detected by specifying the tip of the nozzle (vertical lower end) and measuring the shape of the nozzle at that height.

  If the shape of the tip is detected in step S202, the control device 20 performs classification based on the tip shape in step S204. Specifically, the control device 20 extracts a nozzle having the same shape as the detected tip shape from the data stored in the storage area.

  After performing the classification in step S204, the control device 20 determines in step S206 whether the nozzle classification has been completed, that is, whether the target nozzle has been identified. Specifically, the control device 20 determines that the nozzle classification is complete when there is one nozzle having the same shape extracted from the storage area, and determines that the nozzle classification is not complete when the number is two or more or zero. . When it is determined in step S206 that the nozzle classification is not completed (No in step S206), the control device 20 proceeds to step S210.

  If there are two or more extracted nozzles and includes a normal nozzle and a load control nozzle in step S206, the control device 20 determines the height of the position of the stopper of the load control nozzle. The shape may be measured to determine the type of nozzle. Specifically, as shown in FIG. 13, by measuring the shape at the height 150 where the stopper for the load control nozzle is disposed, the nozzle for measurement includes the stopper 138. Whether it is 120 or a normal nozzle 140 without a stopper can be identified. Here, the nozzle 140 is provided with a spring 148 having one end connected to the distal end 134 and the other end connected to the base 130. Further, when it is determined that the nozzle is a normal nozzle, the control device 20 may end the nozzle characteristic detection process.

  When it is determined in step S206 that the nozzle classification is completed (Yes in step S206), the control device 20 determines in step S208 whether the nozzle is for load control. If the control device 20 determines in step S208 that the nozzle is for load control (Yes in step S208), the control device 20 proceeds to step S210. When determining that the nozzle is not a load control nozzle (No in Step S208) in Step S208, the control device 20 proceeds to Step S230.

  The control device 20 determines No in step S206 or Yes in step S208, that is, if two or more nozzles are extracted from the storage area or none is extracted, or the target is a nozzle for load control. In this case, the head 15 is moved onto the load cell 48 as step S210. In this embodiment, the load cell 48 is used. However, when a mechanism for detecting the load of the nozzle (load detection unit) is installed in the head 15, the load cell 48 is moved to a horizontal table (such as a temporary table for electronic components). The load detection may be performed by a load detection unit provided in the head.

  After moving the head 15 onto the load cell 48 in step S210, the control device 20 turns on the vacuum in step S212. That is, the nozzle suction operation is started. By performing the suction operation with the nozzle, the inside of the nozzle becomes negative pressure, and the environment is the same as when actual components are mounted. Specifically, by setting the inside of the nozzle to a negative pressure, the actual detected load becomes lower than the theoretical value detected based on the spring constant.

  When the vacuum is turned on in step S212, the control device 20 detects the contact load in step S214. Specifically, the control device 20 gradually lowers the nozzle, that is, moves closer to the load cell 48 until the load cell 48 detects a load that determines that the nozzle is in contact with the load cell 48.

  After acquiring the contact load in step S214, the control device 20 acquires a load value from the detected height to 10 mm as step S216. That is, the control device 20 further lowers the nozzle by 10 mm from the position where the contact load is detected, and detects the load when the nozzle is at each position by the load cell 48. For example, the control device 20 lowers the nozzle at intervals of 0.1 mm and detects the load at each position. The relationship between the detected position and the load is stored in the storage area.

  After acquiring the load value in step S216, the control device 20 determines whether there is an abnormality in the load control nozzle as step S218. Hereinafter, the determination process of the load control nozzle will be described with reference to FIG.

  The control device 20 sets the return value to no abnormality in step S240. That is, a value indicating a determination result described later is returned to the initial state. After initializing the return value in step S240, the control device 20 substitutes the load value for A in step S242, specifically, the contact load detected in step S214, and the final acquired value for B in step S244. Specifically, the last detected value among the values detected in step S216 is substituted, and A and B are compared in step S246.

  When it is determined in step S246 that A> B, that is, the load value is larger than the final acquired value, the control device 20 determines that the return value is abnormal in step S248 and ends the present process. That is, when the load value is larger than the final acquired value, it is determined that there is an abnormality in the measurement or the nozzle itself, and this process ends.

  When it is determined in step S246 that A = B, that is, the final acquired value and the load value are the same, the control device 20 determines in step S250 that the nozzle type is a normal type nozzle, and performs this process. finish. In this case, the return value is not abnormal. The control device 20 may determine that the nozzle type is a normal nozzle when the difference between A and B is within a threshold value, that is, when the difference is not only the same but also a close value.

  When it is determined in step S246 that A <B, that is, the load value is smaller than the final acquired value, the control device 20 determines in step S252 that the nozzle type is a load control type nozzle. If the control device 20 determines that the nozzle is a load control type nozzle in step S252, in step S254, the control device 20 stores the nozzle information table in C, that is, the corresponding nozzle stored in the nozzle characteristic data stored in the storage area. Substitute the contact load value. After substituting the value in step S254, the control device 20 determines whether or not the absolute value of (AC) is less than the threshold value in step S256.

  When it is determined in step S256 that the absolute value of (AC) is not less than the threshold value, that is, the control device 20 determines that the absolute value is equal to or greater than the threshold value (No in step S256), the process ends. When it is determined in step S256 that the absolute value of (AC) is less than the threshold value (Yes in step S256), the control device 20 determines that the return value is abnormal in step S258, and ends this process.

  When it is determined that there is no abnormality in the process shown in FIG. 14 (No in step S218), the control device 20 stores the nozzle information as step S220, that is, stores the detected information as the characteristics of the nozzle, and proceeds to step S230. . Here, as a characteristic of the nozzle, in the case of a nozzle for load control, the contact load value acquired in step S214 is set as the contact load, and the relationship calculated based on the load value and the position detected in step S216 is as follows. Memorize as spring stroke. Further, the shape of the nozzle and the like are stored as necessary. When it is determined that there is an abnormality in the process shown in FIG. 14 (Yes in step S218), the control device 20 displays an error as step S222 and proceeds to step S230. Note that when error display is performed, since the nozzle characteristics are not normally detected, the acquired data is not stored as the nozzle characteristics.

  When it is determined No in step S208, or when the process of step S220 or step S222 is performed, the control device 20 determines that the nozzle characteristic detection process for the target nozzle has ended, and returns the nozzle as step S230. Then, for example, the replacement nozzle holding mechanism 18 is returned to a predetermined position, and this process is terminated.

  The electronic component mounting apparatus 10 preferably determines the state of the nozzle during the mounting operation of the electronic component based on the nozzle characteristics detected by the above-described processing. Here, the inspection operation by the electronic component mounting apparatus 10 will be described. Since the substrate production operation performs the above-described processing, detailed description will be omitted, and processing relating to determination of the state of the nozzle will be mainly described.

  When the production of the substrate is started, the control device 20 refers to the designated production program data, detects the nozzle to be used from the data of the electronic component to be mounted, and mounts the detected nozzle on the head. When the nozzle is mounted on the head, the control device 20 detects the shape of the tip of the nozzle with the laser recognition device 38 and compares it with the characteristic data of the nozzle in the storage area to determine whether the type of the mounted nozzle is correct. Further, the control device 20 detects the shape of a predetermined height (the height at which the stopper is formed) by the laser recognition device 38, compares it with the characteristic data of the nozzles in the storage area, and confirms whether the type of the mounted nozzle is correct. Determine.

  When the mounted nozzle is a normal nozzle (when the electric component to be mounted is a non-load production component), the control device 20 performs the operation of sucking and mounting the electronic component based on the production program. Even when the mounted nozzle is a load control nozzle (when the electronic component to be mounted is a load production component), the electronic component mounting apparatus 10 performs the operation of sucking and mounting the electronic component based on the production program. . At this time, the control device 20 mounts the electronic component by the operation shown in FIG. 9 during the mounting operation. In other words, the electronic component is pushed into the board to the specified load using the nozzle at the time of mounting. Here, the contact load value uses the contact load value of the nozzle characteristic data, and the control switching waiting time uses the spring stroke / load control speed + margin value of the nozzle characteristic data. The control device 20 performs the load operation using the contact detection load control switching waiting time, and is used when a load exceeding an allowable range is generated when the specified load value is reached. The nozzle is set to an unusable nozzle, that is, a setting that cannot be used in the production operation until the nozzle characteristic data is re-acquired, and error information for warning the nozzle state confirmation is output.

  The control device 20 executes the process shown in FIG. 15 in parallel with the electronic component mounting operation. FIG. 15 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. At step S270, the control device 20 sets the spring stroke = the spring stroke stored in the storage area, sets the time 1 at the completion of the control switching waiting time at step S272, and sets the time 2 = when the specified load is reached at step S274. In step S276, Time3 = Time2-Time1 and in step S278, Time4 = spring stroke / load control speed. Here, the load control speed is the moving speed (lowering speed) of the nozzle during load control. As a result, the control device 20 has Time3, which is the elapsed time from the completion of the control switching waiting time (Time1) to the arrival of the specified load (Time2), and Time4, which is the theoretical time of the pushing speed (spring stroke / load control speed). And are calculated.

  When the control device 20 obtains Time3 and Time4 by the processing from Step S270 to Step S278, it compares Time3 and Time4 as Step S280. If the control device 20 determines in step S280 that there is no difference between Time3 and Time4, that is, the theoretical value calculated from the characteristics of the nozzle matches the actual value, the present processing is terminated.

  If the controller 20 determines that the difference between Time3 and Time4 is greater than or equal to a certain range in step S280, it determines that the nozzle used is unusable in step S282, and warns that the spring stroke is abnormal in step S284. Is output, and this process ends.

  If the controller 20 determines in step S280 that the difference between Time3 and Time4 is within a certain range, then in step S286, the correction amount = the difference between the theoretical time / load control speed, that is, the actual time and the theoretical time. A value obtained by dividing the difference by the load control speed is calculated as a correction amount. After calculating the correction amount in step S286, the control device 20 determines whether Time3> Time4 as step S288.

  If it is determined in step S288 that Time3> Time4 is not satisfied (No), the control device 20 sets spring stroke = spring stroke−correction amount in step S290, that is, sets the current spring stroke−correction amount as a new spring stroke. The process proceeds to step S294. If it is determined in step S288 that Time3> Time4 (Yes), the control device 20 sets spring stroke = spring stroke + correction amount in step S292, that is, sets the current spring stroke + correction amount as a new spring stroke. The process proceeds to step S294. That is, the control device 20 determines that the control switching waiting time is long when the actual measurement value is faster than the theoretical value by a certain value or more, and determines the spring stroke stored in the storage area as “difference time / theoretical value / Reduce the load control speed ”. When the measured value is slower than the theoretical value by a certain value or more, the control device 20 determines that the control switching waiting time is short, and sets the spring stroke stored in the storage area as “difference time / theoretical value / Change the load control speed longer.

  After performing the processes in steps S290 and S292, the control device 20 updates the spring stroke in the storage area in step S294, that is, reflects the processing results in steps S290 and S292, and ends this process.

  By performing the above processing, the electronic component mounting apparatus 10 can correct the theoretical value so that a normal operation time is obtained during the next load control operation. In this way, even during the process of mounting the electronic component, by performing inspection, it is possible to quickly detect the occurrence of problems due to individual differences in nozzles and changes over time in the spring, and it is possible to respond quickly. . In addition, the electronic component mounting apparatus 10 can inspect the nozzle based on the processing time without increasing the nozzle load detection accuracy.

  The electronic component mounting apparatus 10 can detect the characteristic data of the nozzle and perform a mounting operation of the electronic component based on the result, thereby performing control from contact detection to spring compression with high accuracy. It is possible to suppress tact loss and quality degradation in the load control operation.

  FIG. 16 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load. When the load control operation in FIG. 16 is a theoretical value (initial state), an operation when the spring is contracted due to a nozzle having a short spring stroke or a change with time is shown. The head 15 descends from a state where the nozzle 120 is at a predetermined height in the Z-axis direction, decelerates when the nozzle 120 is lowered to the predetermined height, and stops once at a time t11 when the nozzle 120 is lowered to the predetermined height. Thereafter, the descent is started again at a speed (substrate contact speed) lower than the speed when descent to the predetermined height. In addition, when the electronic component mounting apparatus starts descending at the substrate contact speed at time t11, the electronic component mounting apparatus starts detecting the load in the load cell 48. Thereafter, the nozzle continues to descend, and when the load cell detects a load greater than the contact detection load at time t12, it is determined that the electronic component and the load cell are in contact. Thereafter, when the spring stroke is short, the compression time of the spring (between time t12 and time t13) is shortened, so that the nozzle is in a rigid state during the control switching waiting time. Since the Z-axis operation speed at this time is the board contact speed, the load applied to the component rises at a stretch and exceeds the specified load at time t14. When the electronic component mounting apparatus determines that the load has exceeded the specified load at time t14, the electronic component mounting apparatus changes the moving speed in the negative direction and raises the nozzle. When it is detected that the load has become lower than the predetermined value at time t15 when the nozzle is raised, the moving speed of the nozzle is reduced, and when the specified load is reached at time t16, the nozzle is stopped.

  Next, FIG. 17 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load. FIG. 17 shows an operation with a spring having a low contact load value. Even when the spring is compressed, the contact detection load is not detected, but contact detection is performed after the rigid state is reached, and the specified load is reached while the substrate contact speed is reached. This is the case when the load is exceeded. The head 15 descends from a state where the nozzle 120 is at a predetermined height in the Z-axis direction, decelerates when the nozzle 120 is lowered to the predetermined height, and stops once at a time t21 when the nozzle 120 is lowered to the predetermined height. Thereafter, the descent is started again at a speed (substrate contact speed) lower than the speed when descent to the predetermined height. In addition, when the electronic component mounting apparatus starts descending at the substrate contact speed at time t <b> 21, it starts detecting the load in the load cell 48. After that, if the load cell does not reach the contact detection load as shown at time t22 even if the nozzle continues to descend, the substrate contact speed continues to descend. In this case, when the nozzle is in a rigid state at time t23, the load increases rapidly, and the specified load is exceeded at time t24. If the electronic component mounting apparatus determines that the load has exceeded the specified load at time t24, the electronic component mounting apparatus changes the moving speed in the negative direction and raises the nozzle. When it is detected that the load has become lower than the predetermined value at time t25 when the nozzle is raised, the moving speed of the nozzle is reduced, and when the specified load is reached at time t26, the nozzle is stopped. Thereafter, the nozzle starts to rise at time t27 when the process is completed.

  The electronic component mounting apparatus 10 stores the nozzle characteristics in a storage area, and mounts the electronic component based on the detection result in the storage area, whereby the mounting operation as shown in FIGS. 16 and 17 occurs. It is possible to suppress the application of a load greater than the specified load to the electronic component. Thereby, a high quality board | substrate can be manufactured.

  Next, FIG. 18 is an explanatory diagram showing the relationship between the operation of the nozzle and the detected load. FIG. 18 shows that when a load detection unit is provided in the head and the load of the nozzle is detected by this load detection unit, it is determined that the contact load is detected by detecting the Z-axis sliding resistance (backlash) as the nozzle load. Is the operation. When the load detection unit detects the force generated by the Z-axis sliding resistance as a contact load at time t31, the electronic component mounting apparatus 10 temporarily stops at time t32 when the control switching time has elapsed from time t31. Start moving at the load control speed. Thereafter, when moving at the load control speed, the nozzle is in a rigid state at time t33, the load increases, and when the specified load is reached at time t34, the movement of the nozzle is stopped. Thereafter, the nozzle rise is started at the time when the processing is completed. In FIG. 18, since the contact is erroneously detected, the deceleration is accelerated, and the processing is delayed by the difference between time t35 and time t36 more specifically than when the contact load is appropriately detected. As described above, the electronic component mounting apparatus 10 can control the operation with high accuracy by detecting the theoretical value based on the characteristic data of the nozzle and performing comparison while using the result.

  Further, the electronic component mounting apparatus 10 can easily identify the normal nozzle and the load control nozzle by detecting the shape of the nozzle at a predetermined height based on the nozzle characteristic data. The type of nozzle can also be identified by detecting the shape of the nozzle tip. Thereby, even when using nozzles of various shapes, the nozzles can be specified appropriately. Further, by detecting the characteristics of each nozzle, it is possible to detect each characteristic with high accuracy even when the nozzle has a different spring stroke or when the spring constant is different. Since the electronic component mounting apparatus 10 can identify the nozzle with high accuracy, the electronic component mounting apparatus 10 can suppress the use of the normal nozzle during loading. Thereby, it is possible to suppress a decrease in tact due to a long spring stroke and a long load control time during mounting. In addition, it is possible to reduce the risk of the nozzle being damaged by using the normal nozzle in a high load region. In addition, when nozzles having different spring constants are used when a load is mounted, the contact load cannot be correctly controlled, and the risk of creating a defective substrate can be reduced. It is possible to prevent the use of the load control nozzle during normal mounting, which prevents the set suction operation from being performed, prevents parts from being correctly suctioned, and prevents mounting displacement due to the inability to perform push-in processing during mounting. it can.

  Further, the head 15 of this embodiment has an automatic nozzle changer (in this embodiment, the replacement nozzle in the case where a plurality of nozzles are provided so that more types of electronic components can be mounted by one head. Each head can be replaced with various suction nozzles and gripping nozzles during mounting production using a head replacement operation realized by a combination of the holding mechanism and the head body. The electronic component mounting apparatus 10 is based on component conditions such as the size, weight, whether the upper surface of the component body has a suckable plane, and whether the component body can be gripped. A suction nozzle having an appropriate suction hole diameter or a gripping nozzle having a gripping member having an appropriate shape is designated for each part and stored in the production program. The electronic component mounting apparatus 10 switches the nozzle to be mounted on the head or determines the nozzle that holds the electronic component in the head based on the correspondence between the electronic component and the nozzle stored in the production program. .

  The electronic component mounting apparatus is a radial component in which an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to a tape body is mounted on the component supply unit and held by the electronic component holding tape. An electronic component supply device that cuts the lead of the lead type electronic component at the holding position and can hold the radial lead type electronic component at the holding position with the suction nozzle or the grip nozzle provided in the head may be mounted.

  8 substrate, 10 electronic component mounting apparatus, 11 housing, 12 substrate transport unit, 14, 14f, 14r component supply unit, 15 head, 16 XY moving mechanism, 17 VCS unit, 18 replacement nozzle holding mechanism, 19 component storage unit, 20 control device, 22 X axis drive unit, 24 Y axis drive unit, 30 head body, 31 head support, 32 nozzle, 34 nozzle drive unit, 38 laser recognition device (nozzle shape detection unit), 40 operation unit, 42 display Unit, 48 load cell, 60 control unit, 62 head control unit, 64 component supply control unit, 80 electronic component, 100 electronic component supply device

Claims (7)

An electronic component supply device for supplying electronic components to the holding area;
A nozzle that holds an electronic component supplied from the electronic component supply device to the holding region, a nozzle drive unit that drives the nozzle up and down and rotates and supplies air pressure that drives the nozzle to the nozzle, the nozzle, and the nozzle A head body having a head support for supporting the nozzle drive unit;
A head moving mechanism for moving the head body;
A load detection unit for detecting a load generated by pressing the tip of the nozzle against the measurement surface;
A nozzle shape detection unit for detecting the shape of the nozzle;
A control device for controlling the operation of each part;
The control device uses the load detection unit and the nozzle shape detection unit to force the tip to move to the original position when the outer shape of the nozzle and the tip of the nozzle move to the base side. The presence / absence of a spring to be applied and the spring stroke thereof are detected, and the detected result is stored as the characteristics of the nozzle, and the vertical driving of the nozzle by the nozzle driving unit is controlled based on the stored characteristics of the nozzle. ,
The characteristics of the nozzle include a contact load value,
The control device is based on the spring stroke and the contact load value included in the characteristics of the nozzle, the Z-axis operation speed, and the execution time of each operation during the mounting operation of mounting the electronic component by the nozzle. An electronic component mounting apparatus characterized by determining the state of the nozzle. The control device detects the presence or absence of a stopper of the nozzle using the nozzle shape detection unit, and when the stopper is provided, determines that the nozzle is a load control nozzle,
2. The electronic component mounting according to claim 1, wherein the stopper has an end opposite to an end fixed to the base side of the spring and is moved integrally with the tip. apparatus.   The electronic component mounting apparatus according to claim 1, wherein the load detection unit is a load cell.   4. The electronic component mounting apparatus according to claim 1, wherein the nozzle shape detection unit is a laser sensor connected to the head support. 5. The control device detects an actual operation time during a mounting operation in which the electronic component is mounted by the nozzle, compares the theoretical value detected from the characteristics of the nozzle with the actual operation time, and performs the spring of the nozzle. electronic component mounting apparatus according to any one of claims 1, wherein the detecting a change in stroke 4.   An electronic component supply device for supplying electronic components to the holding area;
  A nozzle that holds an electronic component supplied from the electronic component supply device to the holding region, a nozzle drive unit that drives the nozzle up and down and rotates and supplies air pressure that drives the nozzle to the nozzle, the nozzle, and the nozzle A head body having a head support for supporting the nozzle drive unit;
  A head moving mechanism for moving the head body;
  A load detection unit for detecting a load generated by pressing the tip of the nozzle against the measurement surface;
  A nozzle shape detection unit for detecting the shape of the nozzle;
  A control device for controlling the operation of each part;
  The control device uses the load detection unit and the nozzle shape detection unit to force the tip to move to the original position when the outer shape of the nozzle and the tip of the nozzle move to the base side. The presence / absence of a spring to be applied and the spring stroke thereof are detected, and the detected result is stored as the characteristics of the nozzle, and the vertical driving of the nozzle by the nozzle driving unit is controlled based on the stored characteristics of the nozzle. ,
  And the actual operation time during the mounting operation of mounting the electronic component by the nozzle is detected, the theoretical value detected from the characteristics of the nozzle and the actual operation time are compared, and the change in the spring stroke of the nozzle An electronic component mounting apparatus characterized by detecting When the difference between the theoretical value and the actual operation time is within a threshold value, the control device determines that it is normal, and corrects the characteristics of the nozzle based on the actual operation time,
7. The electron according to claim 5 , wherein when the difference between the theoretical value and the actual operation time is equal to or greater than a threshold value, it is determined as abnormal and the target nozzle is set to be prohibited from use. Component mounting equipment.

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