JP2006108384A - Mounting device, its mounting load correcting method and nozzle inspecting method - Google Patents

Mounting device, its mounting load correcting method and nozzle inspecting method Download PDF

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JP2006108384A
JP2006108384A JP2004292958A JP2004292958A JP2006108384A JP 2006108384 A JP2006108384 A JP 2006108384A JP 2004292958 A JP2004292958 A JP 2004292958A JP 2004292958 A JP2004292958 A JP 2004292958A JP 2006108384 A JP2006108384 A JP 2006108384A
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load
mounting
suction
nozzle
suction nozzle
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Atsushi Iwase
温資 岩瀬
Hiroki Kato
礼貴 加藤
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Juki Corp
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Juki Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To improve loading accuracy upon mounting an electronic component on a substrate by a suction nozzle. <P>SOLUTION: The mounting device mounts the electronic component sucked and retained by the suction nozzle 10 mounted on a suction head moving into XY directions on the substrate fixed at a predetermined position. A load cell 28 for measuring a load when the suction nozzle 10 is descended into a Z direction within a range wherein a suction head is movable to make a suction terminal abut against the load is installed and nozzle operation same as that upon mounting is effected on a load cell to measure the load previously whereby the load set upon mounting is corrected. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

本発明は、実装装置、その実装荷重補正方法及びノズル検査方法、特に基板に電子部品を実装する際の荷重制御の精度向上に適用して好適な実装装置、その荷重補正方法及びノズル検査方法に関する。   The present invention relates to a mounting apparatus, a mounting load correction method thereof, and a nozzle inspection method, and more particularly to a mounting apparatus suitable for improving the accuracy of load control when mounting electronic components on a substrate, and the load correction method and nozzle inspection method thereof. .

一般に、電子部品をプリント基板等の配線基板に実装（搭載）する場合、ＸＹ平面方向に移動可能な吸着ヘッドに搭載されている吸着ノズルにより、所定位置に供給される電子部品を吸着し、ピックアップした後該ヘッドをステージ上に位置決め固定されている基板上に移動させ、吸着ノズルを下降させることにより実装を行なっている（例えば、特許文献１参照）。   Generally, when an electronic component is mounted (mounted) on a wiring board such as a printed circuit board, the electronic component supplied to a predetermined position is picked up by a suction nozzle mounted on a suction head movable in the XY plane direction, and picked up. After that, mounting is performed by moving the head onto the substrate positioned and fixed on the stage and lowering the suction nozzle (see, for example, Patent Document 1).

このような実装装置では、ヘッドに搭載される吸着ノズル１０として、図５に模式的に示すようにノズル本体１２と、該本体１２の内部に摺動可能なスライダ部１４と、その先端に位置する吸着端部１６と、ノズル本体１２と吸着端部１６との間に弾性力を付与するためのばね１８（断面を示す）とを有するものが使用されている。   In such a mounting apparatus, as the suction nozzle 10 mounted on the head, as schematically shown in FIG. 5, a nozzle body 12, a slider portion 14 slidable inside the body 12, and a tip thereof A suction end 16 that has a spring 18 (showing a cross section) for applying an elastic force between the nozzle body 12 and the suction end 16 is used.

この種の吸着ノズル１０は、構造が比較的簡単であるにも拘わらず、ばねの弾性係数を基に予め計算される荷重値を目標実装荷重として設定することにより、実装時の荷重を目標値に制御し易いという利点がある。   Although this type of suction nozzle 10 has a relatively simple structure, the load value calculated in advance based on the elastic coefficient of the spring is set as the target mounting load, whereby the load at the time of mounting is set to the target value. There is an advantage that it is easy to control.

特開２００４−６６０５号公報JP 2004-6605 A

しかしながら、前記吸着ノズルを搭載する実装装置で電子部品を実装する際、必ずしも計算通りの実装荷重でなかったり、スライダ部がスムーズに動かなかったりするために、実装時の荷重精度に問題がある場合があった。   However, when mounting electronic parts with the mounting device equipped with the suction nozzle, there is a problem in load accuracy during mounting because the mounting load is not always as calculated or the slider part does not move smoothly. was there.

本発明は、前記従来の問題点を解決するべくなされたもので、吸着ノズルにより吸着した電子部品を基板に実装する際の荷重精度を向上することができる実装装置、その実装荷重補正方法及びノズル検査方法を提供することを課題とする。   The present invention has been made to solve the above-described conventional problems, and a mounting apparatus capable of improving load accuracy when an electronic component sucked by a suction nozzle is mounted on a substrate, a mounting load correction method thereof, and a nozzle It is an object to provide an inspection method.

本発明は、ＸＹ方向に移動する吸着ヘッドに搭載された吸着ノズルにより吸着保持した電子部品を、所定位置に固定された基板に実装する実装装置において、前記吸着ヘッドが移動可能な範囲内に、前記吸着ノズルをＺ方向に下降させて、その吸着端部を当接させた際の荷重を測定する荷重測定手段を設置したことにより、前記課題を解決したものである。   The present invention provides a mounting apparatus that mounts an electronic component sucked and held by a suction nozzle mounted on a suction head moving in an XY direction on a substrate fixed at a predetermined position, within a range in which the suction head can move, The problem is solved by installing a load measuring means for measuring the load when the suction nozzle is lowered in the Z direction and the suction end is brought into contact therewith.

本発明においては、前記荷重測定手段により測定された荷重を表示する表示手段を備えているようにしてもよい。   In this invention, you may make it provide the display means which displays the load measured by the said load measurement means.

又、本発明においては、前記荷重測定手段が、測定面を実装時の基板上面と実質的に同一高さに調整したロードセルであるようにすることが好ましい。   In the present invention, it is preferable that the load measuring means is a load cell having a measurement surface adjusted to substantially the same height as the upper surface of the substrate at the time of mounting.

本発明は、又、前記実装装置における前記荷重測定手段上で、前記吸着ノズルを実装時と実質的に同一の動作を行なった際の荷重を測定し、該測定荷重と計算荷重との差からオフセット荷重を算出し、実装時に設定する荷重を補正することにより、同様に前記課題を解決したものである。   The present invention also measures a load when performing substantially the same operation as when the suction nozzle is mounted on the load measuring means in the mounting apparatus, and determines the difference between the measured load and the calculated load. The problem is similarly solved by calculating the offset load and correcting the load set at the time of mounting.

本発明は、又、前記実装装置における前記荷重測定手段上で、前記吸着ノズルを下降させ、吸着端部が測定面に到達した後、更に下降させた際の荷重を測定し、測定荷重を基準値と比較して、該吸着ノズルの良・不良を判定することにより、同様に前記課題を解決したものである。   In the present invention, the suction nozzle is lowered on the load measuring means in the mounting apparatus, and the load when the suction end reaches the measurement surface and then further lowered is measured. The above problem is similarly solved by determining whether the suction nozzle is good or bad compared with the value.

本発明によれば、吸着ヘッドの移動可能なＸＹ平面方向の範囲に、垂直下方の荷重を測定する荷重測定手段を設置したので、該測定手段上で吸着ノズルを実装時と同様に動作させて実際に荷重を測定することにより、測定荷重と計算荷重との差からオフセット荷重を求め、該オフセット荷重を用いて実装時に設定する荷重を補正できる上に、吸着ノズルの当接時に測定される荷重からノズルのスライド異常も検出することができるため、実装時の荷重精度を向上することができる。   According to the present invention, since the load measuring means for measuring the vertically downward load is installed in the range of the XY plane direction in which the suction head is movable, the suction nozzle is operated on the measurement means in the same manner as when mounted. By actually measuring the load, the offset load can be obtained from the difference between the measured load and the calculated load, and the load set at the time of mounting can be corrected using the offset load. Therefore, it is possible to detect an abnormal slide of the nozzle, so that it is possible to improve the load accuracy during mounting.

以下、図面を参照して、本発明の実施の形態について詳細に説明する。   Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings.

図１には、本発明に係る電子部品実装装置の要部を模式的に示す。   FIG. 1 schematically shows a main part of an electronic component mounting apparatus according to the present invention.

本実施形態の実装装置は、複数のノズル１０を搭載する吸着ヘッド２０と、該吸着ヘッド２０をＸ方向に移動させるＸ駆動ガイド２２と、該ヘッド２０をＸ駆動ガイド２２と一体でＹ方向へ移動させるＹ駆動ガイド２４とを備えている。   The mounting apparatus of this embodiment includes a suction head 20 on which a plurality of nozzles 10 are mounted, an X drive guide 22 that moves the suction head 20 in the X direction, and the head 20 that is integrated with the X drive guide 22 in the Y direction. And a Y drive guide 24 to be moved.

又、便宜上二点鎖線で示す基板搬送部２６がＸ方向に沿って配設され、該基板搬送部２６により基板Ｓをその途中に設置されている実装ステージ（明示せず）に搬入し、実装後に搬出することができるようになっている。   Further, for convenience, a substrate transfer unit 26 indicated by a two-dot chain line is disposed along the X direction, and the substrate transfer unit 26 carries the substrate S to a mounting stage (not explicitly shown) installed in the middle thereof for mounting. It can be taken out later.

本実施形態の実装装置には、更に、前記基板搬送部２６の近傍（ヘッド２０が移動可能なＸＹ方向範囲内）に、前記吸着ノズル１０をＺ方向に下降させてその吸着端部１６を当接させた際の荷重を測定するロードセルユニット（荷重測定手段）２８が設置されている。   In the mounting apparatus of the present embodiment, the suction nozzle 10 is further lowered in the Z direction in the vicinity of the substrate transport unit 26 (within the XY direction range in which the head 20 can move) so that the suction end 16 is abutted. A load cell unit (load measuring means) 28 for measuring the load when contacting is installed.

図２には、ロードセルユニット２８と吸着ノズル１０及び吸着ヘッド２０との関係を模式的に拡大して示す。このロードセルユニット２８の荷重測定面（上面）は、実装ステージに固定される実装時の基板上面（図示せず）と実質的に同一高さになるように調整してある。   In FIG. 2, the relationship between the load cell unit 28, the suction nozzle 10 and the suction head 20 is schematically enlarged. The load measurement surface (upper surface) of the load cell unit 28 is adjusted so as to be substantially the same height as the upper surface (not shown) of the substrate fixed on the mounting stage.

前記吸着ヘッド２０に搭載されている複数のノズル１０は、それぞれ図示しないモータにより上下動可能なシャフト３０の先端部に装着されており、該ヘッド２０をロードセルユニット２８の上方に移動させた後、所望の吸着ノズル１０が装着されているシャフト３０を、同図に示すように下降させ、その吸着端部１６をロードセルユニット２８の測定面に当接させることにより、該吸着ノズル１０の当接時の荷重が測定される。   The plurality of nozzles 10 mounted on the suction head 20 are respectively mounted on the tip of a shaft 30 that can be moved up and down by a motor (not shown), and after moving the head 20 above the load cell unit 28, The shaft 30 on which the desired suction nozzle 10 is mounted is lowered as shown in the figure, and the suction end 16 is brought into contact with the measurement surface of the load cell unit 28 so that the suction nozzle 10 is in contact. The load is measured.

その際、実装時と同一の下降速度及び押込み量（吸着端部１６が測定面に当接した初期の高さからのノズル下降量）を設定し、吸着ノズル１０を動作させて荷重を測定することにより、実質上実装時と同一条件の衝撃荷重を実測することができる。   At that time, the same descent speed and push-in amount (nozzle lowering amount from the initial height at which the suction end 16 abuts the measurement surface) are set, and the load is measured by operating the suction nozzle 10. As a result, it is possible to actually measure the impact load under the same conditions as when mounting.

通常、前記図５に示した種類の吸着ノズルを使用する実装装置では、実装時に設定する荷重はノズル１０毎に、ばね１８の弾性力と押込み量（ｍｍ）から、次式により計算して制御装置に設定している。なお、式中、ノズル最小荷重長さは、ばね定数と押込み量から荷重を計算する際に必要なばねによる固有値である。   Usually, in the mounting apparatus using the kind of suction nozzle shown in FIG. 5, the load set at the time of mounting is calculated and controlled by the following equation for each nozzle 10 from the elastic force of the spring 18 and the pushing amount (mm). The device is set. In the formula, the nozzle minimum load length is an eigenvalue by the spring necessary for calculating the load from the spring constant and the pushing amount.

荷重（ｇ）＝ばね定数（ｇ／ｍｍ）×｛ノズル最小荷重長さ（ｍｍ）
＋押込み量（ｍｍ）｝ …（１） Load (g) = Spring constant (g / mm) × {Nozzle minimum load length (mm)
+ Indentation amount (mm)} (1)

本実施形態では、前記ロードセルユニット２８を装置内に設置したので、該ロードセルユニット２８上で、前記吸着ノズル１０に実装時と実質的に同一の動作を行なわせた際の荷重を測定できる。そして、その測定荷重と前記（１）式により算出される計算荷重との差からオフセット荷重を算出することにより、該オフセット荷重を用いて実装時に設定する荷重を補正することができる。   In this embodiment, since the load cell unit 28 is installed in the apparatus, it is possible to measure the load when the suction nozzle 10 is caused to perform substantially the same operation as when mounted on the load cell unit 28. Then, by calculating the offset load from the difference between the measured load and the calculated load calculated by the equation (1), it is possible to correct the load set at the time of mounting using the offset load.

具体的には、ロードセル（ユニット）２８上で実装時の荷重として吸着時と搭載時の荷重をそれぞれ測定する。   Specifically, the load at the time of adsorption and the load at the time of mounting are respectively measured as loads at the time of mounting on the load cell (unit) 28.

即ち、図３に模式的に示すように、吸着時荷重を測定する場合は、ロードセル方２８上にヘッドを移動させ、吸着ノズル１０を同図（Ａ）に示す状態にする。次いで、部品吸着時と同様のＺ軸（方向）下降速度と、バキュームＯＮのタイミングで動作させ、ロードセル２８の測定面に吸着端部が当接した後、同図（Ｂ）に示すように設定荷重の計算に使用した押込み量ΔＬ分だけシャフト（ヘッド）を下降させる。   That is, as schematically shown in FIG. 3, when measuring the load at the time of suction, the head is moved onto the load cell 28 to bring the suction nozzle 10 into the state shown in FIG. Next, the actuator is operated at the same Z-axis (direction) lowering speed and vacuum ON timing as when parts are sucked, and after the suction end abuts against the measurement surface of the load cell 28, the setting is made as shown in FIG. The shaft (head) is lowered by the pushing amount ΔL used for the load calculation.

その後、同図（Ｃ）に示すように、バキュームＯＮにしたまま吸着時と同様のＺ軸上昇速度で、シャフト（ヘッド）により吸着ノズル１０を上昇させる。   Thereafter, as shown in FIG. 3C, the suction nozzle 10 is lifted by the shaft (head) at the same Z-axis lift speed as that during suction while the vacuum is ON.

以上の図３（Ａ）〜（Ｃ）の動作を行なった時に、ロードセル２８により測定される荷重曲線は図４に示すようになるが、その中の最大値を吸着時測定荷重とする。   When the operations shown in FIGS. 3A to 3C are performed, the load curve measured by the load cell 28 is as shown in FIG. 4, and the maximum value among them is taken as the measurement load at the time of adsorption.

又、搭載時荷重を測定する場合も、ロードセル２８上方にヘッドを移動させ、搭載時と同様のＺ軸下降速度とバキュームＯＦＦタイミングで、押込み量分だけロードセル２８に当接した後にヘッドを下降させ、その後搭載時と同様のＺ軸上昇速度でヘッドを上昇させることにより、前記図４と同様の荷重曲線を得ることができる。そして、ロードセル２８上で測定された荷重曲線における最大値を搭載時測定荷重とする。   Also, when measuring the load at the time of mounting, the head is moved above the load cell 28, and the head is lowered after contacting the load cell 28 by the amount of pushing at the same Z-axis lowering speed and vacuum OFF timing as at the time of mounting. Then, by raising the head at the same Z-axis raising speed as that at the time of mounting, a load curve similar to that in FIG. 4 can be obtained. Then, the maximum value in the load curve measured on the load cell 28 is set as a measurement load at the time of mounting.

以上のように得られた吸着時及び搭載時の各荷重測定結果からのオフセット荷重を、前記（１）式で求めた押込み荷重設定値（計算値）を用いた次式により算出する。   The offset load from each load measurement result at the time of adsorption and mounting obtained as described above is calculated by the following equation using the indentation load setting value (calculated value) obtained by the equation (1).

オフセット荷重（ｇ）＝押込み荷重設定値（ｇ）−測定荷重結果（ｇ）
…（２） Offset load (g) = Indentation load setting value (g)-Measurement load result (g)
... (2)

以上の荷重測定操作を行なうことにより、生産中の吸着／搭載動作で部品や基板にかかる荷重を測定することが可能となる。従って、その測定結果を用いて、前記（２）式から算出されるオフセット荷重の値を用いて、吸着／搭載時の押込み制御に設定する荷重値の補正を行なうことにより、荷重制御の精度を向上させることが可能となる。   By performing the load measuring operation described above, it is possible to measure the load applied to the component and the substrate during the suction / mounting operation during production. Therefore, by using the measurement result and correcting the load value set in the pushing control at the time of suction / mounting using the offset load value calculated from the equation (2), the accuracy of the load control is improved. It becomes possible to improve.

又、本実施形態の実装装置では、便宜上図３（Ａ）に併記したように、ロードセル２８による測定信号が、Ａ／Ｄ変換されてた後に制御装置（ＣＰＵ）３２に入力され、前記図４に示したような荷重曲線がリアルタイムでモニタ画面３４に表示できるようになっており、その画面からオペレータは容易に荷重最大値を検出し、前記（２）式による計算をすることも可能になっている。又、これらの荷重測定結果を、生産履歴としてメモリに保存することも可能となっている。   Further, in the mounting apparatus of this embodiment, as shown in FIG. 3A for convenience, the measurement signal from the load cell 28 is A / D converted and then input to the control device (CPU) 32, and the above-described FIG. The load curve as shown in Fig. 6 can be displayed on the monitor screen 34 in real time, and the operator can easily detect the maximum load value from the screen and perform the calculation according to the equation (2). ing. In addition, these load measurement results can be stored in a memory as a production history.

次に、本実施形態の実装装置が有するノズル検査機能を説明する。   Next, the nozzle inspection function of the mounting apparatus according to this embodiment will be described.

本実施形態においては、前記ロードセルユニット２８上方で、前記吸着ノズル１０を下降させ、その吸着端部１６が測定面に到達した後、更に下降させた際の荷重を測定し、測定された荷重を基準値と比較して、該吸着ノズル１０の良・不良を判定することができるようになっている。   In the present embodiment, the suction nozzle 10 is lowered above the load cell unit 28, and after the suction end portion 16 reaches the measurement surface, the load when further lowered is measured, and the measured load is measured. Compared with a reference value, it is possible to determine whether the suction nozzle 10 is good or bad.

具体的には、前記図２において、ノズル１０を装着したシャフト３０はモータで駆動され、ロードセル（ユニット）２８の上で下降を始め、該ノズル１０がロードセル２８の測定面に当接したら荷重の測定を始める。その際、衝撃による荷重の急激な変動を抑制するために、衝撃が起きない程度の速度でゆっくり下降させる。   Specifically, in FIG. 2, the shaft 30 on which the nozzle 10 is mounted is driven by a motor and starts to descend on the load cell (unit) 28. When the nozzle 10 comes into contact with the measurement surface of the load cell 28, the load is reduced. Start measurement. At that time, in order to suppress a rapid fluctuation of the load due to the impact, it is slowly lowered at a speed that does not cause the impact.

ノズル１０の吸着端部１６がロードセル２８に当接すると、スライダ部１４はロードセル２８によってノズル本体１２内に押し込められると同時に、ばね１８による押し返す反発力が発生する。   When the suction end portion 16 of the nozzle 10 contacts the load cell 28, the slider portion 14 is pushed into the nozzle body 12 by the load cell 28, and at the same time, a repulsive force is pushed back by the spring 18.

そこで、ロードセル２８によってその時の荷重を測定する。その際、押込む範囲はノズルスライダ部１４の可動範囲全域とせずに、当接初期の方の前半を中心にする。スライダ部１４の可動範囲の後半ではノズルの組付け等により荷重のばらつき等が大きく、又実際にその可動範囲後半までスライダが到達することが殆どないためである。   Therefore, the load at that time is measured by the load cell 28. At that time, the pushing range is not the entire movable range of the nozzle slider portion 14, but the first half of the first contact is centered. This is because, in the latter half of the movable range of the slider portion 14, there is a large variation in load due to the assembly of the nozzles and the like, and the slider hardly reaches the latter half of the movable range actually.

このように吸着ノズル１０の荷重を測定することにより、異常の有無を判定する。判定する際の基準荷重の大きさは、ノズルのばね定数や正常なノズルの荷重等から経験的に決定し、その荷重を超えたものを異常なノズルと判定する。   Thus, the presence or absence of abnormality is determined by measuring the load of the suction nozzle 10. The magnitude of the reference load at the time of determination is determined empirically from the spring constant of the nozzle, the load of a normal nozzle, and the like, and those exceeding the load are determined as abnormal nozzles.

以上詳述した本実施形態によれば、事前にノズルの正・異常を正確に判断できる上に、実装時に適切な荷重を設定できるようになることから、実装時の荷重精度を大幅に向上させることができるようになる。   According to the present embodiment described in detail above, it is possible to accurately determine whether the nozzle is positive or abnormal in advance, and it is possible to set an appropriate load at the time of mounting, thereby greatly improving the load accuracy at the time of mounting. Will be able to.

本発明に係る一実施形態の実装装置の要部を示す概略斜視図The schematic perspective view which shows the principal part of the mounting apparatus of one Embodiment which concerns on this invention. 本実施形態の実装装置におけるロードセルと、吸着ノズル及び吸着ヘッドとの関係を模式的に示す正面図The front view which shows typically the relationship between the load cell in the mounting apparatus of this embodiment, a suction nozzle, and a suction head. ロードセルによる荷重測定動作の概要を示す説明図Explanatory drawing showing the outline of load measurement operation by load cell 本実施形態において測定される荷重測定曲線を示す線図Diagram showing load measurement curve measured in this embodiment 本実施形態に適用されるノズルを模式的に示す正面図The front view which shows typically the nozzle applied to this embodiment

符号の説明Explanation of symbols

１０…吸着ノズル
１２…ノズル本体
１４…スライダ部
１６…吸着端部
１８…ばね
２０…吸着ヘッド
２２…Ｘ駆動ガイド
２４…Ｙ駆動ガイド
２６…基板搬送部
２８…ロードセル（ユニット）
３０…シャフト DESCRIPTION OF SYMBOLS 10 ... Adsorption nozzle 12 ... Nozzle main body 14 ... Slider part 16 ... Adsorption end part 18 ... Spring 20 ... Adsorption head 22 ... X drive guide 24 ... Y drive guide 26 ... Substrate conveyance part 28 ... Load cell (unit)
30 ... Shaft

Claims (5)

ＸＹ方向に移動する吸着ヘッドに搭載された吸着ノズルにより吸着保持した電子部品を、所定位置に固定された基板に実装する実装装置において、
前記吸着ヘッドが移動可能な範囲内に、前記吸着ノズルをＺ方向に下降させて、その吸着端部を当接させた際の荷重を測定する荷重測定手段を設置したことを特徴とする実装装置。 In a mounting apparatus for mounting an electronic component sucked and held by a suction nozzle mounted on a suction head moving in the XY direction on a substrate fixed at a predetermined position,
A mounting apparatus comprising load measuring means for measuring a load when the suction nozzle is lowered in the Z direction and brought into contact with the suction end within a range in which the suction head is movable. . 前記荷重測定手段により測定された荷重を表示する表示手段を備えていることを特徴とする請求項１の記載の実装装置。   2. The mounting apparatus according to claim 1, further comprising display means for displaying a load measured by the load measuring means. 前記荷重測定手段が、測定面を実装時の基板上面と実質的に同一高さに調整したロードセルであることを特徴とする請求項１の記載の実装装置。   2. The mounting apparatus according to claim 1, wherein the load measuring means is a load cell having a measurement surface adjusted to substantially the same height as a substrate upper surface at the time of mounting. 請求項１に記載の実装装置における前記荷重測定手段上で、前記吸着ノズルを実装時と実質的に同一の動作を行なった際の荷重を測定し、該測定荷重と計算荷重との差からオフセット荷重を算出し、実装時に設定する荷重を補正することを特徴とする荷重補正方法。   The load when the suction nozzle is operated in substantially the same manner as when the suction nozzle is mounted is measured on the load measuring means in the mounting apparatus according to claim 1, and is offset from a difference between the measured load and the calculated load. A load correction method characterized by calculating a load and correcting a load set at the time of mounting. 請求項１に記載の実装装置における前記荷重測定手段上で、前記吸着ノズルを下降させ、吸着端部が測定面に到達した後、更に下降させた際の荷重を測定し、測定荷重を基準値と比較して、該吸着ノズルの良・不良を判定することを特徴とするノズル検査方法。   The load measuring means in the mounting apparatus according to claim 1, the suction nozzle is lowered, the load when the suction end reaches the measurement surface and then further lowered is measured, and the measurement load is a reference value. A nozzle inspection method characterized by determining whether the suction nozzle is good or bad as compared with the nozzle.
JP2004292958A 2004-10-05 2004-10-05 Mounting device, its mounting load correcting method and nozzle inspecting method Pending JP2006108384A (en)

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