JP6131045B2 - Electronic component mounting apparatus and electronic component mounting method - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

  When an electronic component having a lead wire is mounted on a substrate, the electronic component mounting apparatus inserts the lead wire of the electronic component into a through hole formed on the substrate. The electronic component mounting apparatus executes a process for detecting the position where the through hole of the substrate is formed when mounting the electronic component. Japanese Patent Application Laid-Open No. 2004-228561 describes a method of capturing an image of a through hole, detecting the position of the through hole on the substrate by analyzing the captured image, and setting the detected position as the origin of the substrate.

Japanese Patent Laid-Open No. 7-91914

  The apparatus described in Patent Document 1 can detect the position of a through hole by analyzing an image obtained by photographing the through hole. However, since image analysis requires time, the number of substrates produced per unit time may be reduced.

  The present invention has been made in view of the above, and an object thereof is to provide an electronic component mounting apparatus and an electronic component mounting method capable of suppressing a decrease in the number of substrates produced per unit time.

  The present invention provides a substrate transport unit that transports a substrate on which a mark serving as a reference for a mounting position of an electronic component is formed, an imaging unit that photographs the substrate transported by the substrate transport unit, and the mark on the substrate. A storage unit that stores a design position; and a control unit that corrects a position at which the electronic component is mounted on the substrate based on a deviation between the mark position and the design position in an image captured by the imaging unit. The control unit is obtained by photographing the predetermined number of substrates when the first representative value or variation of the deviation obtained by photographing the predetermined number of substrates is smaller than a threshold value. The position where the electronic component is mounted on the substrate is corrected based on the second representative value of the deviation.

  Here, the board is further formed with a wiring pattern, and the mark is an insertion hole into which an insertion part of an insertion type electronic component is inserted or a reference formed simultaneously with the insertion hole, and the control part is , Detecting a deviation of the wiring pattern based on the image photographed by the photographing unit, and if the first representative value or the variation is smaller than the threshold, the deviation and the second representative value Based on this, it is preferable to correct the position where the insertion type electronic component is mounted on the substrate.

  In addition, when the first representative value or the variation is not smaller than the threshold value, the control unit performs control to correct the position where the electronic component is mounted on the substrate based on the second representative value. It is preferable to make an inquiry about whether to start.

  The threshold is preferably determined based on the diameter of the insertion hole.

  The first representative value may be an average value or a maximum value. The second representative value may be an average value or a maximum value.

  A component supply unit that supplies the electronic component; a nozzle that sucks the electronic component supplied from the component supply unit; a nozzle driving unit that drives the nozzle; and a head that supports the nozzle and the nozzle driving unit. And a head body having a support, wherein the control unit controls the operation of the head body to move the electronic component to the corrected position of the substrate, and the electronic component is moved to the substrate. It is preferable to implement.

  The present invention relates to an electronic component mounting method for an electronic component mounting apparatus for mounting the electronic component on a plurality of substrates on which marks serving as a reference for the mounting position of the electronic component are formed, in an image captured by an imaging unit A step of correcting the position where the electronic component is mounted on the board based on the deviation between the mark position and the design position, and a first representative value of the deviation obtained by photographing a predetermined number of the boards. Alternatively, when the variation is smaller than a threshold value, correcting the position where the electronic component is mounted on the substrate based on the second representative value of the shift obtained by photographing the predetermined number of the substrates. , Including.

  The present invention can correct the position at which the electronic component is mounted on the board based on the second representative value of the deviation between the mark position obtained by photographing a predetermined number of boards and the design position. For this reason, when a plurality of substrates are produced, since the image analysis of the marks is not required after a predetermined number of sheets, there is an effect that it is possible to suppress a decrease in the number of substrates produced per unit time.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 6 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape. FIG. 7 is a perspective view showing a schematic configuration of the electronic component supply device of the component supply unit. FIG. 8 is an explanatory diagram showing an example of a design drawing of a board on which electronic components are mounted. FIG. 9 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 10 is a flowchart illustrating an example of a processing procedure of position correction processing based on image recognition. FIG. 11 is a flowchart illustrating an example of a processing procedure of position correction processing based on the second representative value. FIG. 12 is a flowchart illustrating an example of a processing procedure regarding mounting of an insertion type electronic component. FIG. 13 is a diagram illustrating an example of a second deviation to be recorded. FIG. 14 is a diagram illustrating an example when the second deviation is small. FIG. 15 is a diagram illustrating an example when the second deviation is large. FIG. 16 is a diagram for explaining the correction of the mounting position of the insertion type electronic component in the position correction process based on image recognition. FIG. 17 is a diagram for explaining the correction of the mounting position of the insertion type electronic component in the position correction process based on the second representative value.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Embodiments of an electronic component mounting apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting apparatus of the present invention has a lead wire (insertion portion), and the lead wire is inserted into a substrate hole (insertion hole, hole) of the substrate, so that the electronic component mounted on the substrate, so-called An insertion-type electronic component and an electronic component mounting apparatus for mounting the insertion-type electronic component. The electronic component mounting apparatus has a function of mounting an insertion type electronic component (lead type electronic component). Here, the insertion type electronic component is mounted by inserting a lead wire into a hole formed in the substrate. Further, electronic components mounted on the substrate without being inserted into the insertion hole (substrate hole), for example, SOP, QFP, etc., are mounted electronic components. The electronic component mounting apparatus may have a function of mounting a mountable electronic component mounted on the substrate. The electronic component mounting apparatus 10 of the following embodiment has a function of mounting both a mountable electronic component and an insertable electronic component.

  Next, an electronic component mounting apparatus 10 capable of mounting both the mountable electronic component and the insertable electronic component of the present embodiment will be described with reference to FIGS. The electronic component mounting apparatus 10 can mount both a mountable electronic component to be mounted by placing it on a substrate and a lead type electronic component (insertable electronic component) to be mounted by inserting a lead into an insertion hole of the substrate. It is a device that can. The electronic component mounting apparatus 10 can mount both the mounted electronic component and the lead electronic component, or can mount only one of them. That is, the electronic component mounting apparatus 10 can mount both a mounted electronic component and a lead type electronic component, and can be used for various purposes depending on the board to be manufactured and the layout of other electronic component mounting apparatuses. Can do.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. The unit 19, the control device 20, the operation unit 40, and the display unit 42 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side with the board conveyance unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at a predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8 and can supply them to the head 15, that is, they can be held (sucked or gripped) by the head 15. The electronic component supply apparatus which supplies to a holding position in a state is provided. Both the component supply units 14f and 14r of this embodiment supply lead-type electronic components having a main body and leads connected to the main body.

  FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. As shown in FIG. 2, the component supply unit 14 includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 90 and 90 a.

  Specifically, the component supply unit 14 is mounted with an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and held by the electronic component holding tape. An electronic component supply device 90 that cuts the lead of the radial lead type electronic component at the holding position (second holding position) and can hold the radial lead type electronic component at the holding position by the suction nozzle or the grip nozzle provided in the head. In addition to mounting a plurality of electronic components holding tape (chip component tape) with a plurality of mounted electronic components fixed to the tape body, the mounting position of the mounted electronic components held by the electronic component holding tape (first 1 holding position) and the mounted electronic component at the holding position is held by the suction nozzle or gripping nozzle provided in the head. Possible to may comprise an electronic component supply device 90a. The component supply unit 14 may install a stick feeder or a tray feeder in the rear side bank as the other electronic component supply device 90a. A plurality of component supply apparatuses 90 and 90 a shown in FIG. 2 are held by a support base (bank) 96. Further, the support table 96 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 90 and 90a.

  The component supply unit 14 includes a plurality of types of electronic component supply devices in which the plurality of electronic component supply devices 90 and 90a held on the support 96 differ in the type of electronic component to be mounted, the mechanism for holding the electronic component, or the supply mechanism. 90, 90a. Further, the component supply unit 14 may include a plurality of electronic component supply devices 90 and 90a of the same type. The component supply unit 14 is preferably configured to be detachable from the apparatus main body.

  The component supply device 90 supplies a radial lead type electronic component to the head 15 using an electronic component holding tape configured by sticking a plurality of radial lead type electronic component leads to the tape. The component supply device 90 holds an electronic component holding tape, sends the held electronic component holding tape, and holds the radial lead type electronic component held by the nozzle of the head 15 (suction position) , Gripping position, holding position). The component supply device 90 cuts and separates the lead of the radial lead type electronic component moved to the holding region, so that the radial lead type electronic component with the lead fixed by the tape can be held in a predetermined position. The radial lead type electronic component can be held (adsorbed and gripped) by the nozzle of the head 15. The component supply device 90 will be described later. The plurality of component supply apparatuses 90 may supply different types of electronic components or separate electronic components. Further, the component supply device 90 is not limited to a plurality of radial lead type electronic components on a tape, and a bowl feeder, an axial feeder, a stick feeder, a tray feeder, or the like can also be used.

  The electronic component supply device 90a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 90 a is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic components can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 90a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder, a tape feeder, or a bulk feeder can be used.

  The head 15 holds (sucks or grips) the electronic component held by the component supply unit 14f or the electronic component held by the component supply unit 14r with a nozzle, and the held electronic component is placed at a predetermined position by the substrate transport unit 12. It is a mechanism for mounting on the moved substrate 8. Further, when the component supply unit 14r includes the electronic component supply device 90a, the head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 90a on the substrate 8. It is a mechanism to do. The configuration of the head 15 will be described later. The chip-type electronic component (mounted electronic component) is a leadless electronic component that does not include a lead that is inserted into an insertion hole (through hole) formed in the substrate. Examples of the on-board electronic component include SOP and QFP as described above. The chip-type electronic component is mounted on the substrate without inserting the lead into the insertion hole.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8, and the X-axis driving unit 22 and the Y-axis driving unit 24. Have The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and moves the electronic components in the electronic component supply devices 90 and 90a of the component supply units 14f and 14r to a predetermined position (mounting position, It becomes a transfer means for transferring to the mounting position. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit 17 is an image recognition device, and includes a camera that captures the vicinity of the nozzles of the head 15 and an illumination unit that illuminates the capturing area. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image, so that it is adsorbed by the nozzle. Recognize the shape of the electronic component and the holding state of the electronic component by the nozzle. The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18 and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation. Examples of the operation unit 40 include a keyboard, a mouse, and a touch panel. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker. Examples of the display unit 42 include a touch panel and a vision monitor. The display unit 42 displays various images based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of this embodiment has one head 15, two heads 15 may be provided corresponding to each of the component supply units 14f and 14r. In this case, the two heads 15 can be moved independently by providing two X-axis drive units and moving the two heads 15 in the X and Y directions, respectively. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can move the two substrates 8 alternately to the electronic component mounting positions by the two substrate transfer units 12 and alternately mount the components by the two heads 15. Can be installed.

  Next, the configuration of the head 15 will be described with reference to FIGS. 3 and 4. FIG. 3 is a schematic diagram showing a schematic configuration of the head 15 of the electronic component mounting apparatus. FIG. 4 is a schematic diagram showing a schematic configuration of the head 15 of the electronic component mounting apparatus. FIG. 3 also shows various control units that control the electronic component mounting apparatus 10 and one component supply device 90 of the component supply unit 14r. As shown in FIGS. 3 and 4, the head 15 includes a head body 30, an imaging device 36, a height sensor 37, and a laser recognition device 38.

  As shown in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  In the electronic component supply device 90, the main body of the electronic component 80 in which the leads are held by the electronic component holding tape (radial component tape) is exposed upward. The electronic component 80 is exemplified by an aluminum electrolytic capacitor. In addition to the aluminum electrolytic capacitor, various electronic components having leads can be used as the electronic component 80. The electronic component supply apparatus 90 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the component supply device 90 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape. The configuration of the electronic component supply device 90 will be described later. Similarly, in the case of the electronic component supply apparatus 90a, the predetermined position is a holding region for holding the electronic component 80 in which the nozzles of the head 15 are held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. As shown in FIG. 4, six nozzles 32 are arranged in a row in the head main body 30 of the present embodiment. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 4, the suction nozzle which adsorbs and hold | maintains the electronic component 80 is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 32a at the tip. The opening 32 a is connected to the nozzle driving unit 34 via an internal cavity and a cavity of the nozzle support part 33. The nozzle 32 sucks air from the opening 32a to suck and hold the electronic component 80 at the tip. The nozzle 32 is detachable from the nozzle support portion 33 and is stored (stored) in the replacement nozzle holding mechanism 18 when the nozzle 32 is not attached to the nozzle support portion 33. The nozzle 32 has various shapes and sizes of the opening 32a. In the present embodiment, the suction type nozzle having the opening 32a for sucking the electronic component 80 is shown. However, a gripping type nozzle that holds the electronic component 80 by sandwiching the electronic component 80 using an arm that operates by air pressure is also used. Can be used.

  The nozzle support portion 33 is a mechanism that holds the nozzle 32 at the end (tip) on the lower side in the vertical direction. For example, the nozzle drive portion 34 is connected to the nozzle 32 and a shaft that is moved relative to the head support 31. Socket. The shaft is a rod-shaped member, and is arranged extending in the Z-axis direction. The shaft supports a socket disposed at an end portion on the lower side in the vertical direction. The shaft is supported with respect to the head support 31 in a state where a portion connected to the socket is movable in the Z-axis direction and is rotatable in the θ direction. Here, the Z axis is an axis orthogonal to the XY plane and is a direction orthogonal to the surface of the substrate 8. That is, the θ direction is a direction parallel to the circumferential direction of a circle around the Z axis, which is an axis parallel to the direction in which the nozzle driving unit 34 moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32. A portion of the shaft connected to the socket is moved and rotated in the Z-axis direction and the θ direction by the nozzle driving unit 34.

  The nozzle drive unit 34 moves the nozzle support unit 33 in the Z-axis direction to move the nozzle 32 in the Z-axis direction, and sucks the electronic component 80 through the opening 32 a of the nozzle 32. In addition, the nozzle driving unit 34 rotates the nozzle 32 in the θ direction by rotating the nozzle support unit 33 in the θ direction when the electronic component 80 is mounted.

  The nozzle driving unit 34 includes a mechanism having a Z-axis motor 34a, specifically, a linear motion linear motor whose driving direction is the Z-axis direction as a mechanism for moving the nozzle 32 in the Z-axis direction. The nozzle drive unit 34 moves the nozzle 32 in the Z-axis direction together with the nozzle support unit 33 by the Z-axis motor 34a, thereby moving the shaft of the opening 32a at the tip of the nozzle 32 in the Z-axis direction. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element coupled to the shaft of the nozzle support unit 33 as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle drive unit 34 transmits the driving force output from the motor to the shaft of the nozzle support unit 33 by a transmission element, and rotates the shaft in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 32a of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 32a of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether to suck air from the opening 32a by switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks (holds) the electronic component 80 in the opening 32a by sucking air from the opening 32a, and closes the electromagnetic valve and sucks air in the opening 32a by not sucking air from the opening 32a. The electronic component 80 that has been released is released, that is, the electronic component 80 is not sucked (not held) by the opening 32a.

  Further, the head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component 80. As with the suction nozzle, the gripping nozzle can release the air to suck and release the air so that the movable piece opens and closes with respect to the fixed piece, thereby holding and releasing the main body of the electronic component 80 from above. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. Further, the height sensor 37 detects the height of the facing part, specifically, the electronic component 80 by processing the distance from the facing part using its own position at the time of measurement and the position of the substrate. To do. The process of detecting the height of the electronic component 80 based on the measurement result of the distance from the electronic component 80 may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 3, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 90 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a. The shape recognition processing by the laser recognition device 38 will be described later.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 3, the electronic component mounting apparatus 10 includes a control unit 60, a storage unit 61, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, a ROM, and a RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls the control operation by the component supply control unit 64.

  The storage unit 61 is connected to the control unit 60 and has a storage function such as a ROM or a RAM. The storage unit 61 may be provided integrally with the control unit 60 or may be provided separately. The storage unit 61 stores data acquired from each unit by the control unit 60 and data calculated and calculated by the control unit 60. For example, the storage unit 61 corrects design drawing data including through-hole coordinate design values, reference mark coordinate design values, and electronic component mounting coordinate design values, as well as various electronic component shapes, suction conditions, and suction processing corrections. Stores conditions, production programs, etc. The storage unit 61 can also delete unnecessary data under the control of the control unit 60.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the suction (holding) / release operation of the electronic component 80 of the nozzle 32 and the operation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, a distance sensor). Controls the rotation operation and the movement operation in the Z-axis direction. Control of the head controller 62 will be described later.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each of the electronic component supply devices 90 and 90a or may control all the electronic component supply devices 90 and 90a. For example, the component supply control unit 64 controls an electronic component holding tape drawing operation (moving operation), lead cutting operation, and radial lead type electronic component holding operation by the electronic component supply device 90. In addition, when the component supply unit 14 includes the electronic component supply device 90a, the component supply control unit 64 controls the electronic component holding tape drawing operation (moving operation) by the electronic component supply device 90a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

  Here, in the above embodiment, the case where the suction nozzle is used as the nozzle attached to the head 15 has been described, but the present invention is not limited to this. FIG. 5 is an explanatory diagram illustrating an example of a nozzle. FIG. 5 is a diagram illustrating an example of a gripping nozzle (gripper nozzle). A nozzle 201 illustrated in FIG. 5 includes a fixed arm 202 and a movable arm 204. The nozzle 201 is fixed in a state in which the fulcrum 205 of the movable arm 204 is rotatable on the main body of the nozzle 201, and the movable arm 204 has a portion facing the fixed arm 202 with the fulcrum 205 as an axis close to the fixed arm 202. It can move in a direction away from the direction. The movable arm 204 is connected to a drive unit 206 on a side opposite to a portion of the main body of the nozzle 201 and a portion approaching or moving away from the fixed arm 202 via a fulcrum 205. The drive unit 206 is moved by a drive source (air pressure) that drives the gripping nozzle. The movable arm 204 moves in a direction away from the direction in which the portion facing the fixed arm 202 approaches the fixed arm 202 when the driving unit 206 moves.

  The nozzle 201 can grip the electronic component 80 by reducing the distance between the fixed arm 202 and the movable arm 204 in a state where the electronic component 80 is between the fixed arm 202 and the movable arm 204.

  The gripping nozzle is not limited to the nozzle 201 and can have various shapes. The gripping nozzle can have various values for the distance between the fixed arm and the movable arm and the movable range. Thus, the shape of the electronic component 80 that can be gripped differs depending on the shape of the nozzle.

  The electronic component mounting apparatus 10 can appropriately hold the electronic component 80 by selecting the type of the nozzle that holds the electronic component 80 according to the type of the electronic component 80 to be held. Specifically, one electronic component can be selected by selecting whether to use a suction nozzle or a gripping nozzle according to the electronic component 80 to be held, and switching which nozzle to use among each type of nozzle. More types of electronic components 80 can be mounted with the mounting apparatus.

  Next, the component supply apparatus 90 is demonstrated using FIG.6 and FIG.7. The component supply device 90 is a radial feeder that supplies radial lead type electronic components to the holding position as described above. First, the electronic component holding tape will be described with reference to FIG. FIG. 6 is a schematic diagram illustrating a schematic configuration of an example of an electronic component holding tape.

  An electronic component holding tape (radial component tape) 70 shown in FIG. 6 includes a tape main body 72 and a plurality of electronic components (radial lead type electronic components, radial lead components) 80 held by the tape main body 72. The tape main body 72 is bonded with a first tape 74 and a second tape 76 that is narrower than the first tape 74. The tape body 72 has holes 78 as feed holes formed at regular intervals in the extending direction. That is, the tape body 72 has a plurality of holes 78 formed in a row in the extending direction.

  The electronic component 80 includes an electronic component main body (hereinafter simply referred to as “main body”) 82 and two leads 84 arranged in the radial direction of the main body 82. In the electronic component 80, the lead 84 is sandwiched and fixed between the first tape 74 and the second tape 76. Accordingly, the electronic component 80 is fixed at a predetermined position of the tape main body 72 by the lead 84 being sandwiched and fixed between the first tape 74 and the second tape 76. Further, the plurality of electronic components 80 are each fixed at a position where a hole 78 is disposed between the two leads 84 and the hole 78 of the tape body 72 is formed. That is, the electronic component 80 is disposed at the same feed pitch P interval as the holes 78 and at the same position in the tape extending direction. The electronic component 80 may have any shape having a lead wire sandwiched between the first tape 74 and the second tape 76 of the tape body 72, and the shape and type of the lead wire and the body are not particularly limited. In addition, the electronic component holding tape 70 can have various relative positional relationships between the hole 78 and the electronic component 80 in the extending direction of the tape. For example, in the electronic component holding tape 70, the electronic component 80 may be disposed between the hole 78 and the hole 78.

  Next, FIG. 7 is a perspective view showing a schematic configuration of the electronic component supply device of the component supply unit. As shown in FIG. 7, the electronic component supply device (component supply device) 90 holds the other parts, guides the electronic component holding tape, a housing 210, a clamp unit 212 connected to the rear bank, It has the feed unit 214 which conveys an electronic component holding tape, and the cut unit 216 which cut | disconnects the lead | read | reed of the electronic component 80 currently hold | maintained at the electronic component holding tape. In the electronic component supply device 90, an air pressure adjusting unit is disposed inside the housing 210. The air pressure adjusting unit adjusts the air pressure of the driving unit of the feed unit 214 and the driving unit of the cut unit 216, and controls the driving of each unit.

  The casing 210 is a vertically elongated hollow box, and holds the clamp unit 212, the feed unit 214, the cut unit 216, and the air pressure adjusting unit therein. The housing 210 is provided with a guide groove 220, a guide part 222, a discharge part 226, and a grip part 228. The guide groove 220 has a shape in which one end portions of two straight lines formed along the longitudinal direction of the elongated surface on the upper side in the vertical direction of the casing 210 are connected. That is, the guide groove 220 is formed in a U-shape that extends from one end of the housing 210 to the vicinity of the other end, is folded back in the vicinity of the other end, and extends to the one end. The guide groove 220 is a groove for guiding the electronic component holding tape, and the electronic component holding tape is supplied from one end (end on the supply side) of the U shape. The guide groove 220 moves the supplied electronic component holding tape along the U shape, and discharges it from the other end (end on the discharge side) of the U shape. The guide groove 220 guides the electronic component holding tape in a state where the tape main body 72 is inside the housing 210 and the electronic component 80 is exposed to the outside of the housing 210.

  The guide portion 222 is connected to the supply-side end portion of the guide groove 220 and guides the electronic component holding tape in a state where the electronic component 80 is held to the guide groove 220. The discharge portion 226 is connected to the discharge-side end portion of the guide groove 220, and the portion that moves in the housing 210 and supplies the electronic component 80 to the head 15 discharges the electronic component holding tape. The gripping part 228 is a part held by the operator when the electronic component supply device 90 is transported.

  The clamp unit 212 is a mechanism connected to the support base 96. The clamp unit 212 is fixed to the casing 210 and is a mechanism that can switch between a state in which it is connected and fixed to the support base 96 and a state in which it is released without being connected to the support base 96. . The operator can attach / detach the electronic component supply device 90 to / from the support base 96 by operating the clamp unit 212.

  The feed unit 214 is a mechanism for transporting the electronic component holding tape, that is, for moving the electronic component holding tape guided along the guide groove 220. The feed unit 214 includes a protrusion that is inserted into the hole of the electronic component holding tape, and the protrusion is moved in the transport direction in a state where the protrusion is inserted into the hole of the electronic component holding tape. Move the electronic component holding tape. The protrusion of the feed unit 214 is removed from the hole when moved in the direction opposite to the conveyance direction. Thus, the feed unit 214 can move the tape sequentially in the feed direction by one pitch by reciprocating the protrusion in the feed direction by one pitch of the hole of the tape body 72.

  The cut unit 216 is disposed at a supply position for supplying the electronic component 80 and cuts the lead of the electronic component 80 held on the electronic component holding tape. Further, the cut unit 216 clamps, that is, holds the electronic component 80 whose lead has been cut until the electronic component 80 is sucked (held) by the nozzle. The cut unit 216 includes a mechanism that adjusts the height at which the leads are cut, a mechanism that adjusts the range in which the mechanism that clamps the electronic component 80 is moved, and the like. By making various adjustments with the mechanism, the leads of various lead-type electronic components can be cut and clamped.

  The electronic component mounting apparatus 10 improves the stability of the lead interval when the main body of the electronic component 80 at the holding position of the component supply device 90 is held by the nozzle by the cut unit 216 cutting the lead short. Therefore, it is possible to increase the number of parts in which the lead can be inserted into the insertion hole, so that the lead can be mounted very efficiently and with high accuracy.

  The electronic component supply device 90 is configured as described above, and is fixed to a predetermined position of the support base 96 by the clamp unit 212. The electronic component supply device 90 moves the electronic component holding tape by the feed unit 214. In addition, the electronic component supply device 90 cuts the lead of the electronic component 80 at the supply position by the cut unit 216 and holds the electronic component 80 whose lead has been cut until it is sucked by the nozzle 32 of the head 15. Thereby, the electronic component 80 conveyed with an electronic component holding tape can be made into the state which can be conveyed with the head 15. FIG.

  Next, a design drawing of the substrate 8 stored in the electronic component mounting apparatus 10 will be described with reference to FIG. FIG. 8 is an explanatory diagram showing an example of a design diagram of the substrate 8 on which the electronic component 80 is mounted.

  As shown in FIG. 8, the electronic component mounting apparatus 10 stores information on the design drawing 970. The electronic component mounting apparatus 10 determines a position where the electronic component 80 is mounted on the substrate 8 based on the information of the design drawing 970. The electronic component mounting apparatus 10 acquires the information of the design drawing 970 via a communication line or from a storage medium, and stores the acquired information in the storage unit 61. Here, the design drawing 970 includes a plurality of electronic component mounting regions 980. The electronic component mounting area 980 is design value information (electronic component mounting coordinate design value) of mounting coordinates of electronic components on the substrate 8. The plurality of electronic component mounting regions 980 included in the design drawing 970 have different sizes and shapes depending on the types of electronic components to be mounted. The electronic component mounting area 980 includes design value information of through-hole forming positions 982a, 982b, 982c, 984a, 984b, 986a, 986b, and 986c corresponding to the positions where the lead wires of the electronic components to be mounted are inserted. Yes. Here, the through-hole forming position 982a, the through-hole forming position 982b, and the through-hole forming position 982c are through-holes adjacent to each other. The through-hole formation position 986a, the through-hole formation position 986b, and the through-hole formation position 986c are through holes adjacent to each other. Another through hole is disposed between the through hole forming position 984a and the through hole forming position 984b. In FIG. 8, reference numerals are given to some through-hole formation positions in the electronic component mounting region 980, but when other electronic component mounting regions 980 also have through-holes, through-hole formation positions are provided. 8 shows only an electronic component mounting area 980 corresponding to an electronic component having a lead wire, but the design drawing 970 shows an electronic component having no lead wire as an electronic component type (surface-mounted electronic component). The electronic component mounting area information corresponding to the position where the component is mounted is included. The design drawing 970 also includes design value information (reference mark coordinate design value) of the coordinates of the BOC 990 serving as a reference mark for the mounting position of the electronic component to be surface-mounted. As described above, the design drawing 970 includes information on the electronic component mounting coordinate design value, the through-hole coordinate design value, and the reference mark coordinate design value.

  In the present embodiment, the through-hole coordinate design value is also used as a coordinate design value for detecting a shift between the wiring pattern provided on the substrate 8 and the insertion hole provided on the substrate 8. In the process of manufacturing the substrate 8, the step of printing the BOC 990 and the wiring pattern on the substrate 8 is different from the step of making an insertion hole in the substrate 8. For this reason, the position and direction of the wiring pattern may deviate from the position and direction in which the insertion holes are arranged. Furthermore, the position and direction of the wiring pattern may deviate from the position and direction in which the insertion holes are arranged due to warpage, distortion, or the like of the substrate 8.

  A through-hole coordinate design value used as a coordinate design value for detecting a shift between the wiring pattern and the insertion hole is selected in advance. In order to detect a displacement in position and direction, it is preferable that two or more through-hole coordinate design values are selected. In the following description, the insertion hole of the substrate 8 corresponding to the through-hole coordinate design value used as the coordinate design value for detecting the deviation between the wiring pattern and the insertion hole is referred to as a mark (area fiducial mark). There is.

  FIG. 9 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The overall processing operation of the electronic component mounting apparatus 10 will be described with reference to FIG. Note that the operation of each part of the electronic component mounting apparatus 10 in FIG. 9 can be executed by controlling the operation of each part based on the control device 20.

  When reading the production program, the electronic component mounting apparatus 10 transports the substrate 8 by the substrate transport unit 12 in step S11. Specifically, the electronic component mounting apparatus 10 carries the substrate 8 in a position where the electronic component 80 can be mounted by the head 15, that is, the component mounting region, and fixes it.

  When the electronic component mounting apparatus 10 transports the substrate 8, as shown in step S12, the electronic component mounting apparatus 10 executes a position correction process based on image recognition. Specifically, the electronic component mounting apparatus 10 analyzes the image photographed by the photographing apparatus 36 and detects the positions of the BOC and the mark. The electronic component mounting apparatus 10 detects a deviation (hereinafter also referred to as a “first deviation”) between the detected BOC position and a reference mark coordinate design value (BOC design position) corresponding to the BOC. Furthermore, the electronic component mounting apparatus 10 detects a deviation (hereinafter, also referred to as “second deviation”) between the detected mark position and a through-hole coordinate design value (mark design position) corresponding to the mark. To do. The second shift is detected as a shift relative to the first shift. For this reason, when there is no shift between the wiring pattern and the insertion hole, the position and direction of the second shift are both zero. The electronic component mounting apparatus 10 corrects the mounting position of the mounting electronic component based on the first shift, and corrects the mounting position of the insertion type electronic component based on the first shift and the second shift. Then, the second shift is stored in the storage unit 61.

  When the electronic component mounting apparatus 10 completes the position correction process based on the image recognition, the electronic component mounting apparatus 10 executes an electronic component mounting process in step S13. Specifically, the electronic component mounting apparatus 10 mounts the electronic component at the corrected mounting position. Details of the mounting process will be described later.

  The electronic component mounting apparatus 10 determines whether production is finished as step S14. For example, the electronic component mounting apparatus 10 determines the production end when the production of a preset number of boards is completed. When the production is finished (step S14, Yes), the electronic component mounting apparatus 10 finishes this processing procedure. When the production is not finished (No at Step S14), the electronic component mounting apparatus 10 proceeds to Step S15.

  In step S15, the electronic component mounting apparatus 10 determines whether or not the number of processed substrates 8 matches the predetermined number. The predetermined number is, for example, the number required to correctly grasp the deviation between the wiring pattern and the insertion hole. When electronic components are mounted on 100 substrates 8, the predetermined number is set to 10, for example.

  If the number of processed sheets does not match the predetermined number (step S15, No), the electronic component mounting apparatus 10 returns to step S11 and executes a series of processes. On the other hand, when the number of processed sheets coincides with the predetermined number (step S15, Yes), the electronic component mounting apparatus 10 determines, as step S16, the first representative value or variation based on the stored second deviation, A second representative value is calculated. The first representative value and variation are values for evaluating the deviation between the wiring pattern and the insertion hole. The second representative value is a value for correcting the position where the insertion type electronic component is mounted. The first representative value is, for example, an average value or a maximum value of the second deviation. The second representative value is, for example, an average value or a median value of the second deviation. The first representative value and the second representative value may be the same value.

  The electronic component mounting apparatus 10 determines whether a 1st representative value or variation is smaller than a threshold value as step S17. In the present embodiment, the threshold value is determined based on, for example, the diameter of the insertion hole of the lead of the insertion type electronic component. When the first representative value is smaller than the threshold value (step S17, Yes), the electronic component mounting apparatus 10 proceeds to step S19.

  When the first representative value is not smaller than the threshold (No at Step S17), the electronic component mounting apparatus 10 determines whether to apply the second representative value as Step S18. For example, the electronic component mounting apparatus 10 inquires the person in charge of whether to start control for correcting the position where the insertion type electronic component is mounted on the substrate 8 based on the second representative value. The electronic component mounting apparatus 10 determines to apply the second representative value when there is a response to start control. When the second representative value is not applied (No at Step S18), the electronic component mounting apparatus 10 returns to Step S11 and executes a series of processes. That is, the process of mounting electronic components on the substrate 8 is continued while performing position correction based on image recognition. When the second representative value is applied (step S18, Yes), the electronic component mounting apparatus 10 proceeds to step S19.

  The electronic component mounting apparatus 10 conveys the board | substrate 8 by the board | substrate conveyance part 12 as step S19. That is, the electronic component mounting apparatus 10 carries the substrate 8 on which the electronic component 80 is mounted next into the mounting area and fixes it.

  When the electronic component mounting apparatus 10 transports the substrate 8, as shown in step S20, the electronic component mounting apparatus 10 executes a position correction process based on the second representative value. Specifically, the electronic component mounting apparatus 10 analyzes an image photographed by the photographing apparatus 36 and detects the position of the BOC. The electronic component mounting apparatus 10 corrects the mounting position of the mountable electronic component based on the shift (first shift) between the detected BOC position and the reference mark coordinate design value corresponding to the BOC. Furthermore, the electronic component mounting apparatus 10 corrects the mounting position of the insertion type electronic component based on the first shift and the second representative value of the second shift. That is, the electronic component mounting apparatus 10 predicts the mounting position of the mountable electronic component without detecting it by image analysis of the mark.

  When the electronic component mounting apparatus 10 completes the position correction process based on the second representative value, the electronic component mounting apparatus 10 executes the electronic component mounting process in step S21. Specifically, the electronic component mounting apparatus 10 mounts the electronic component at the corrected mounting position. Thereafter, the electronic component mounting apparatus 10 determines whether production is finished as step S22. When the production is not finished (No at Step S22), the electronic component mounting apparatus 10 returns to Step S19 and executes a series of processes. That is, the electronic component mounting apparatus 10 executes processing for the next substrate 8. On the other hand, when it is production end (step S22, Yes), the electronic component mounting apparatus 10 complete | finishes this process sequence.

  As described above, the electronic component mounting apparatus 10 detects the position of the insertion hole by image analysis after grasping the displacement of the mounting position of the insertion type electronic component based on the result of image analysis of the predetermined number of substrates 8. The insertion type electronic component can be inserted into the corresponding insertion hole. For this reason, the electronic component mounting apparatus 10 can suppress a decrease in the number of boards produced per unit time due to image analysis.

  In addition, when the detected mounting position shift of the insertion type electronic component is not smaller than the threshold value, the electronic component mounting apparatus 10 mounts the insertion type electronic component without detecting the position of the insertion hole by image analysis. Inquire. For this reason, the electronic component mounting apparatus 10 can reduce the possibility of occurrence of an undesirable situation such as an increase in defects due to insertion errors.

  Next, the position correction process based on the image recognition shown in FIG. 9 will be described with reference to FIG. FIG. 10 is a flowchart illustrating an example of a processing procedure of position correction processing based on image recognition.

  The control unit 60 of the electronic component mounting apparatus 10 recognizes the BOC of the board 8 as step S101. Specifically, the control unit 60 detects the actual BOC position on the substrate 8 by analyzing an image photographed by the photographing device 36. Any known technique can be used for image analysis.

  In step S102, the control unit 60 calculates a deviation (first deviation) between the detected BOC position and the BOC design position. The first shift indicates a shift in the position and direction of the actual wiring pattern on the substrate 8. In step S103, the control unit 60 corrects the mounting position of the mounted electronic component (surface mounted component) based on the first deviation. If there is no surface mount component, the control unit 60 does not have to execute the process of step S103.

  Subsequently, in step S104, the control unit 60 corrects the design position of the mark based on the first deviation. Specifically, the control unit 60 acquires the mark design position (through-hole coordinate design value) from the information of the design drawing 970, and corrects the acquired mark design position based on the first deviation. More specifically, the control unit 60 corrects the design position of the mark to a position where it is assumed that the mark actually exists when there is no deviation between the wiring pattern and the insertion hole.

  Subsequently, in step S105, the control unit 60 detects the position of the mark by image recognition. The control unit 60 may also perform mark detection when detecting BOC in step S101.

  Subsequently, in Step S106, the control unit 60 calculates a deviation (second deviation) between the detected mark position and the corrected mark design position. The second shift indicates a shift in the position and direction of the mark in a state where the shift in the wiring pattern is corrected. When there are a plurality of marks, the second deviation is calculated for each mark.

  Subsequently, in step S107, the control unit 60 corrects the mounting position of the insertion type electronic component (inserted component) based on the first shift and the second shift. When there are a plurality of marks, an arithmetic average or a weighted average of a plurality of second shifts may be used as the second shift. The weighted average weight is set to a larger value as the design value of the mounting position of the insertion type electronic component is closer to the mark.

  Subsequently, the control unit 60 records the second deviation as step S108. When there are a plurality of marks, the second shift is recorded for each mark. When the second deviation is recorded, the control unit 60 ends this processing procedure.

  In the processing procedure illustrated in FIG. 10, the case where the mounting position of the insertion type electronic component is indirectly corrected through the first shift has been described. However, the correction method is not limited to this. For example, the control unit 60 may directly correct the mounting position of the insertion type electronic component based on the deviation between the uncorrected mark design position and the detected mark position.

  Next, the position correction process based on the second representative value shown in FIG. 9 will be described with reference to FIG. FIG. 11 is a flowchart illustrating an example of a processing procedure of position correction processing based on the second representative value.

  The control part 60 of the electronic component mounting apparatus 10 detects the actual position of the BOC as step S201. In step S202, the control unit 60 calculates a deviation (first deviation) between the detected BOC position and the BOC design position. In step S203, the control unit 60 corrects the mounting position of the surface mounting component based on the first deviation. When there is no surface mount component, the control unit 60 does not have to execute the process of step S203. Note that steps S201 to S203 are the same as the processes of steps S101 to S103 described above.

  In step S204, the control unit 60 corrects the mounting position of the insertion type electronic component based on the first deviation and the second representative value. When there are a plurality of marks, the control unit 60 may calculate the second representative value every time step S204 is executed without calculating the second representative value in step S16. For example, the weighted average of the second deviation may be calculated for each substrate in the manner described in step S107, and the second representative value of the calculated weighted average may be calculated. Alternatively, the control unit 60 calculates the second representative value of the weighted average for each area obtained by subdividing the board area, and adopts the second representative value of the area corresponding to the mounting position of the insertion type electronic component. May be. Then, when the correction of the mounting position is completed, the control unit 60 ends this processing procedure.

  Next, processing of the electronic component mounting apparatus 10 for mounting the insertion type electronic component on the substrate 8 will be described with reference to FIG. Here, a procedure for mounting the insertion type electronic component will be described. FIG. 12 is a flowchart illustrating an example of a processing procedure regarding mounting of an insertion type electronic component.

  The control unit 60 performs holding movement as step S301. Here, the holding movement (suction movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding area of the component supply unit 14.

  After performing the holding movement in step S301, the control unit 60 lowers the nozzle 32 as step S302. That is, the control unit 60 moves the nozzle 32 downward to a position where the electronic component 80 can be held (sucked and gripped). After lowering the nozzle 32 in step S302, the control unit 60 holds the electronic component 80 with the nozzle 32 as step S303, and raises the nozzle 32 as step S304. When the control unit 60 raises the nozzle 32 to a predetermined position in step S304, specifically, moves the electronic component 80 to the measurement position of the laser recognition device 38, the electron adsorbed by the nozzle 32 is set as step S305. The shape of the part 80 is detected. When the controller 60 detects the shape of the electronic component 80 in step S305, the controller 60 raises the nozzle in step S306. Note that, as described above, the control unit 60 detects the component shape in step S305, and when it is determined that the held electronic component 80 cannot be mounted, the electronic component 80 is discarded and the electronic component 80 is attracted again. When the control unit 60 raises the nozzle to a predetermined position, in step S307, the controller 60 moves the electronic component 80 sucked by the nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8. In step S308, the nozzle 32 is lowered. In step S309, component mounting (component mounting), that is, a processing operation for releasing the electronic component 80 from the nozzle 32 is performed. In step S310, the nozzle 32 is raised. The processing procedure ends.

  Next, the first representative value and variation will be described with reference to FIGS. FIG. 13 is a diagram illustrating an example of a second deviation to be recorded. FIG. 14 is a diagram illustrating an example when the second deviation is small. FIG. 15 is a diagram illustrating an example when the second deviation is large. In the following description, it is assumed that the predetermined number is five and the number of marks is one.

  The position Pa shown in FIGS. 14 and 15 is a position where the design value of the mark is corrected based on the first deviation detected for each substrate, and the circle C1 is a circle with a radius 84r centered on the position Pa. is there. The radius 84r is the radius of the insertion hole into which the lead 84 is inserted. Positions P11 to P15 and positions P21 to P25 shown in FIGS. 13 to 15 indicate the positions of the centers of the marks actually detected for each substrate. In FIG. 13, positions P11 to P15 are recorded as relative positions corresponding to the position Pa.

  In the example shown in FIGS. 13 and 14, the coordinates of the positions P11, P12, P13, P14, and P15 on the XY plane are (−X1, + Y1), (−X2, −Y2), (+ X3, + Y3), respectively. , (+ X4, -Y4), and (+ X5, + Y5). The deviation between the position Pa and the positions P11, P12, P13, P14, and P15 corresponds to a second deviation in each substrate. When the second deviation is sufficiently small with respect to the circle C1 as in this example, the error based on the second representative value of the second deviation causes the error of the insertion error to occur in the actual insertion hole position. There is a high possibility that it can be predicted with a smaller error.

  In the example shown in FIG. 15, among the positions P21, P22, P23, P24, and P25, the positions P22 and P23 are out of the circle C1. As in this example, when the second deviation is larger than the circle C1, the frequency of the position predicted by the correction based on the second representative value of the second deviation is increased outside the insertion hole, and an insertion error occurs. There is a high probability that a failure such as this will occur. In such a case, the electronic component mounting apparatus 10 pauses production and inquires of the user whether to perform processing for detecting insertion holes by image recognition for each board.

  Whether or not the second deviation is sufficiently small with respect to the circle C1 is determined based on the first representative value or variation of the second deviation and the threshold value.

  When the variation is used for the determination, the variation is, for example, from the average position of the positions P11, P12, P13, P14, and P15 (the center of gravity of the polygon having the vertices at the positions P11, P12, P13, P14, and P15). It is calculated as a value that is three times the standard deviation of the distance to each position. In this case, the threshold value is, for example, a value obtained by multiplying the radius 84r by a coefficient greater than 0 and equal to or less than 1. In this method, even if the positions P11, P12, P13, P14, and P15 are far away from the position Pa, it may be determined that the second deviation is sufficiently small with respect to the circle C1. This method is suitable when the number of production is relatively large (when the predetermined number is set to a large value).

  When an average value, which is a kind of representative value, is used for determination, the average value is, for example, the center of positions P11, P12, P13, P14, and P15 (positions P11, P12, P13, P14, and P15 as vertices). It is calculated as a distance from the center of gravity of the polygon) to the position Pa. In this case, the threshold value is, for example, a value obtained by multiplying the radius 84r by a coefficient greater than 0 and equal to or less than 1. This method is suitable when the number of production is relatively small.

  When the maximum value, which is a kind of representative value, is used for the determination, the maximum value is calculated as, for example, the distance from the position P11, P12, P13, P14, and P15 that is furthest from the position Pa to the position Pa. . In this case, the threshold value is, for example, a value obtained by multiplying the radius 84r by a coefficient greater than 0 and equal to or less than 1. This method is suitable when the number of production is relatively small.

  Next, with reference to FIGS. 16 and 17, a correction example in the case of mounting an insertion type electronic component by the electronic component mounting apparatus 10 will be described. FIG. 16 is a diagram for explaining the correction of the mounting position of the insertion type electronic component in the position correction process based on image recognition. FIG. 17 is a diagram for explaining the correction of the mounting position of the insertion type electronic component in the position correction process based on the second representative value.

  In the example shown in FIGS. 16 and 17, the design position corresponding to the substrate 8 includes the design position (design value information) of the BOC 990, the design position of the mark 991 (design value information), and the lead of the insertion type electronic component. It is assumed that the design position (design value information) of the other insertion hole is included.

  In the position correction process based on image recognition, the electronic component mounting apparatus 10 detects the actual BOC 990a from the image of the board 8 photographed by the photographing apparatus 36, as shown in FIG. The electronic component mounting apparatus 10 calculates the deviation between the design position of the BOC 990 and the actual position of the BOC 990a as the first deviation ma. A first shift ma indicated by an arrow in FIG. 16 indicates a shift amount and a shift direction from the design position of the BOC 990 to the actual position of the BOC 990a.

  The electronic component mounting apparatus 10 calculates the corrected position of the mark 991a by correcting the design position of the mark 991 based on the first deviation ma. The electronic component mounting apparatus 10 acquires the actual position of the mark 991b from the image photographed by the photographing apparatus 36, and determines the second deviation as a deviation between the corrected position of the mark 991a and the actual position of the mark 991b. Calculated as mb and stored for calculating the second representative value md. A second shift mb indicated by an arrow in FIG. 16 indicates the shift amount and shift direction from the corrected position of the mark 991a to the actual position of the mark 991b. The electronic component mounting apparatus 10 predicts the actual position of the insertion hole by correcting the design position of each insertion type electronic component based on the first displacement ma and the second displacement mb.

  In the position correction process based on the second representative value md, the electronic component mounting apparatus 10 detects the actual BOC 990c from the image of the board 8 photographed by the photographing apparatus 36, as shown in FIG. The electronic component mounting apparatus 10 calculates a deviation between the design position of the BOC 990 and the actual position of the BOC 990c as the first deviation mc. A first shift mc indicated by an arrow in FIG. 17 indicates a shift amount and a shift direction from the design position of the BOC 990 to the actual position of the BOC 990c.

  The electronic component mounting apparatus 10 corrects the mark 991 based on the first deviation mc, thereby calculating the position of the mark 991c whose position has been corrected by the amount of deviation of the wiring pattern on the current board 8. The electronic component mounting apparatus 10 further predicts the actual position of the mark 991d by correcting the position of the mark 991c based on the second representative value md. Similarly, the electronic component mounting apparatus 10 predicts the actual position of the insertion hole by correcting the design position of each insertion-type electronic component based on the first deviation mc and the second representative value md. .

  In the above-described embodiment, the case where the insertion hole is used as a mark has been described, but the mark is not limited thereto. The mark may be any mark that is formed in the same process as the expected position (for example, an insertion hole) and can be used as a reference for the position. For example, the mark may be a hole that is used only as a position reference in which a lead of an electronic component or the like is not inserted.

  In the embodiment described above, the electronic component mounting apparatus 10 has been described with respect to the case where the position of the insertion hole is predicted, but the predicted position is not limited to this. For example, the predicted position may be the mounting position of the mountable electronic component. In this case, the first shift is treated as the second shift and is processed as having no first shift.

  In the embodiment described above, the electronic component mounting apparatus 10 has been described with respect to the case where the mounting position is corrected collectively in units of drawings, and then the electronic component is mounted. However, the correction and mounting method is not limited to this. For example, the electronic component mounting apparatus 10 may be configured to perform the correction of the mounting position for each electronic component when mounting the electronic component without performing batch correction in units of drawings.

  8 substrate, 10 electronic component mounting apparatus, 11 housing, 12 substrate transport unit, 14, 14f, 14r component supply unit, 15 head, 16 XY moving mechanism, 17 VCS unit, 18 replacement nozzle holding mechanism, 19 component storage unit, 20 control device, 22 X-axis drive unit, 24 Y-axis drive unit, 30 head body, 31 head support, 32 nozzles, 34 nozzle drive unit, 34a Z-axis motor, 38 laser recognition device, 40 operation unit, 42 display unit , 60 control unit, 61 storage unit, 62 head control unit, 64 component supply control unit, 70 electronic component holding tape, 72 tape body, 80 electronic component, 82 body (electronic component body), 84 lead, 90, 90a electronic component Feeder, 96 support stand

Claims (6)

A board transfer section for transferring a board on which a mark and a wiring pattern serving as a reference for mounting positions of electronic components are formed;
An imaging unit for imaging the substrate conveyed by the substrate conveyance unit;
A storage unit for storing the design position of the mark and the design position of the wiring pattern on the substrate;
The second displacement is a displacement between the design position of said mark of the first shift and the mark is a deviation between the design position of the wiring pattern and the position of the wiring pattern in the captured image by the imaging unit Based on the control unit for correcting the position of mounting the electronic component on the substrate,
With
When the first representative value or variation of the second deviation obtained by photographing a predetermined number of substrates is smaller than a threshold, the control unit obtains the first number obtained by photographing the predetermined number of substrates. Based on the deviation of 1, the mounting position of the mountable electronic component is corrected, and the first deviation obtained by photographing a predetermined number of the substrates and the second representative value of the second deviation are obtained. An electronic component mounting apparatus which corrects a position for mounting an insertion type electronic component based on the above .   When the first representative value or the variation is not smaller than the threshold value, the control unit starts control for correcting the position where the electronic component is mounted on the substrate based on the second representative value. The electronic component mounting apparatus according to claim 1, wherein an inquiry about whether or not is made. The mark is a reference formed simultaneously with the insertion hole or the insertion hole into which the insertion part of the insertion type electronic component is inserted,
The electronic component mounting apparatus according to claim 2 , wherein the threshold is determined based on a diameter of the insertion hole. The electron according to any one of claims 1 to 3 , wherein the first representative value is an average value or a maximum value, and the second representative value is an average value or a maximum value. Component mounting equipment. A component supply unit for supplying the electronic component;
A head main body having a nozzle that sucks an electronic component supplied from the component supply unit, a nozzle driving unit that drives the nozzle, and a head support that supports the nozzle and the nozzle driving unit;
Further comprising
Wherein the control unit controls the operation of the head body, wherein the corrected position of the substrate by moving the electronic component, of 4 the electronic component from claim 1, characterized in that mounted on the board The electronic component mounting apparatus according to any one of the above items. An electronic component mounting method for an electronic component mounting apparatus for mounting the electronic component on a plurality of substrates on which marks and wiring patterns serving as a reference for mounting positions of the electronic component are formed,
The second displacement is a displacement between the design position of said mark of the first shift and the mark is a deviation between the design position of the wiring pattern and the position of the wiring pattern in the captured image by the imaging unit Based on the step of correcting the position of mounting the electronic component on the substrate;
When the first representative value or variation of the second deviation obtained by photographing the predetermined number of substrates is smaller than a threshold value, the first deviation obtained by photographing the predetermined number of substrates is based on the first deviation. The insertion type electronic component is corrected based on the first deviation obtained by photographing a predetermined number of the boards and the second representative value of the second deviation. Correcting the position where the electronic component is mounted ;
An electronic component mounting method comprising:

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