JP6673900B2 - Mounting device and mounting method - Google Patents

Description

  The present invention relates to a mounting device and a mounting method.

  Conventionally, as a mounting apparatus, an LED chip emits light, the center of the light emission is recognized, the external reference coordinates corresponding to the coordinates of the light emission center are image-recognized, and the LED chip is positioned at the bonding position on the substrate based on the external reference coordinates. (For example, see Patent Document 1). In this device, the light emission center of the light emitting element can be positioned at a predetermined position on the substrate with high accuracy.

JP 2000-150970 A

  However, in the mounting apparatus of Patent Literature 1, although it is positioned at a predetermined position on the substrate based on the coordinates of the light emission center, no consideration has been given to adsorption of components. For this reason, in this device, the components may be shifted when the components are sucked.

  The present invention has been made in view of such problems, and has as its main object to provide a mounting apparatus and a mounting method that can further suppress a suction shift of a component having a characteristic portion formed on an upper surface.

  The present invention employs the following means in order to achieve the above main object.

The mounting device of the present invention
A mounting head having one or more suction nozzles for sucking the component and mounting the sucked component on a substrate;
While the mounting head is controlled to perform the mounting process on the first component by the general-purpose suction operation, a predetermined suppression suction different from the general-purpose suction operation is performed when the mounting process is performed on the characteristic component having the predetermined characteristic portion formed on the upper surface. A control unit for controlling the mounting head so as to perform mounting processing by operation,
It is provided with.

  In this apparatus, while the first component is mounted by a general suction operation, the mounting process is performed by a predetermined suppression suction operation different from the general suction operation when mounting a characteristic component having a predetermined characteristic portion formed on an upper surface. I do. In this apparatus, by performing a suppression suction operation different from the general-purpose suction operation, it is possible to further suppress the shift in suction of the characteristic component having the characteristic portion formed on the upper surface.

  In the mounting device according to the aspect of the invention, the control unit may perform the suppression suction operation of applying a negative pressure to the suction nozzle at a later timing than the general suction operation, and the acceleration may be slower than the general suction operation. The mounting head may be controlled to perform any one or more of the suppression suction operations in which the characteristic component is moved after the suction. Generally, in a mounting apparatus, a negative pressure may be supplied to a suction nozzle before the suction nozzle comes into contact with a component. In general, in a mounting apparatus, a mounting head sometimes moves a non-characteristic component and a characteristic component at the same acceleration. In such a mounting apparatus, components are easily shifted. In this apparatus, the timing of applying a negative pressure to the suction nozzle and the movement acceleration after suction are made slower, so that the suction shift of the characteristic component can be further suppressed.

  The mounting apparatus of the present invention includes an imaging unit capable of imaging the upper surface of the component, and a mounting table for mounting the component, wherein the control unit performs the suction operation before mounting the characteristic component on the mounting table. After the upper surface of the feature component is imaged on the mounting table by the imaging unit and the feature portion is recognized, the feature component is mounted by the suppression suction operation different from the pre-placement suction operation. The mounting head may be controlled to perform processing. In this apparatus, since the component is moved to the mounting table and the position of the characteristic portion of the characteristic component is recognized on the mounting table, the characteristic portion can be more accurately recognized. Furthermore, since this device performs the suppression suction operation after recognizing the characteristic portion, it is possible to further suppress the misalignment of the characteristic component. Here, the “suction operation before mounting” and the “general-purpose suction operation” may be the same operation or different operations.

Alternatively, the mounting device of the present invention
A mounting head having one or more suction nozzles for sucking the component and mounting the sucked component on a substrate;
An imaging unit capable of imaging the upper surface of the component,
A mounting table for mounting the component,
The characteristic component having the predetermined characteristic portion formed on the upper surface is mounted on the mounting table by the pre-mounting suction operation, and the upper surface of the characteristic component is imaged by the imaging section on the mounting table, and the characteristic portion is recognized. Thereafter, a control unit that controls the mounting head to perform the mounting process of the characteristic component in a predetermined suppression suction operation different from the pre-placement suction operation,
May be provided.

  In this apparatus, a characteristic component having a predetermined characteristic portion formed on the upper surface is placed on a mounting table by a suction operation before mounting, and the upper surface of the characteristic component is imaged on the mounting table by an imaging section, and the characteristic portion is recognized. Then, the characteristic component is mounted by a predetermined suppression suction operation different from the pre-placement suction operation. In this device, by performing a suppression suction operation different from the suction operation before mounting, it is possible to further suppress the shift in suction of the characteristic component having the characteristic portion formed on the upper surface. Further, in this device, since the component is moved to the mounting table and the position of the characteristic portion of the characteristic component is recognized on the mounting table, the characteristic portion can be more accurately recognized. Furthermore, since this device performs the suppression suction operation after recognizing the characteristic part, the characteristic part can be suctioned at a more accurate position of the characteristic part.

  In the mounting apparatus according to the aspect of the invention including the imaging unit and the mounting table, the control unit performs the suppression suction operation of applying a negative pressure to the suction nozzle at a later timing than the pre-placement suction operation, Further, the mounting head may be controlled to perform any one or more of the suppression suction operations in which the characteristic component is moved after suction at a slower acceleration than the pre-placement suction operation. Generally, in a mounting apparatus, a negative pressure may be supplied to a suction nozzle before the suction nozzle comes into contact with a component. In general, in a mounting apparatus, a mounting head sometimes moves a non-characteristic component and a characteristic component at the same acceleration. In such a mounting apparatus, components are easily shifted. In this apparatus, the timing of applying a negative pressure to the suction nozzle and the movement acceleration after suction are made slower, so that the suction shift of the characteristic component can be further suppressed.

  The mounting apparatus of the present invention includes an imaging unit capable of imaging the upper surface of the component, and the control unit captures the upper surface of the characteristic component with the imaging unit and recognizes the characteristic unit. The mounting head may be controlled by the suppression suction operation of applying a negative pressure to the suction nozzle after the nozzle comes into contact with the characteristic component. Generally, in a mounting apparatus, if a negative pressure is applied before the suction nozzle comes into contact with the component, the position of the component may be shifted due to the suction nozzle sucking up the characteristic component. In this device, since a negative pressure is applied to the suction nozzle after the suction nozzle comes into contact with the characteristic component, the suction displacement can be further suppressed. In addition, since this device performs the suppression suction operation after recognizing the characteristic part, the characteristic part can be suctioned at a more accurate position of the characteristic part.

  The mounting apparatus of the present invention, an imaging unit that can image the top surface of the component, a supply unit that supplies the component, a mounting table that includes the suction unit that mounts the component and suctions the mounted component, The control unit controls the mounting head to suck the characteristic component from the supply unit by the suppression suction operation, while capturing the upper surface of the characteristic component on the mounting table by the imaging unit. When adsorbing the characteristic component after recognizing the characteristic portion, the mounting head is controlled to perform the mounting process of the characteristic component by a post-mounting adsorption operation different from the general-purpose adsorption operation or the suppression adsorption operation. Is also good. In this apparatus, while the characteristic component is sucked from the supply unit by the suppression suction operation, the characteristic component is mounted on the mounting table by the general-purpose suction operation or the post-mounting suction operation after the recognition of the characteristic part. In this apparatus, the suction unit of the mounting table can suppress the displacement of the suction of the components on the mounting table. In this device, the suction shift of the characteristic component in the supply unit can be suppressed by the suppressed suction operation. Here, the “post-mounting suction operation” and the “general-purpose suction operation” may be the same operation or different operations.

Alternatively, the mounting device of the present invention
A mounting head having one or more suction nozzles for sucking the component and mounting the sucked component on a substrate;
An imaging unit capable of imaging the upper surface of the component,
When mounting a characteristic part having a predetermined characteristic part formed on the upper surface, the upper surface of the characteristic part is imaged by the imaging unit, and after the characteristic part is recognized, the suction nozzle contacts the characteristic part. A control unit that controls the mounting head by a suppression suction operation of applying a negative pressure to the suction nozzle after contacting the mounting head;
May be provided.

  In this apparatus, after the upper surface of the characteristic component is imaged and the characteristic portion is recognized, the mounting process is performed by the suppression suction operation of applying a negative pressure to the suction nozzle after the suction nozzle contacts the characteristic component. Generally, in a mounting apparatus, if a negative pressure is applied before the suction nozzle comes into contact with the component, the position of the component may be shifted due to the suction nozzle sucking up the characteristic component. In this device, since a negative pressure is applied to the suction nozzle after the suction nozzle comes into contact with the characteristic component, the suction displacement can be further suppressed. In addition, since this device performs the suppression suction operation after recognizing the characteristic part, the characteristic part can be suctioned at a more accurate position of the characteristic part.

The mounting method of the present invention
A mounting method comprising: one or more suction nozzles for sucking a component; and a mounting process for mounting the sucked component on a substrate.
While the mounting head is controlled to perform the mounting process on the first component by the general-purpose suction operation, a predetermined suppression suction different from the general-purpose suction operation is performed when the mounting process is performed on the characteristic component having the predetermined characteristic portion formed on the upper surface. Controlling the mounting head to perform mounting processing in operation;
Is included.

  In this method, similar to the mounting apparatus described above, when performing the mounting process of the characteristic component, a suction operation different from the general-purpose suction operation is performed, thereby further suppressing the displacement of the characteristic component having the characteristic portion formed on the upper surface. can do. In this mounting method, various aspects of the above-described mounting apparatus may be employed, or steps for realizing each function of the above-described mounting apparatus may be added.

FIG. 1 is a schematic explanatory diagram illustrating an example of a mounting system 10. FIG. 2 is an explanatory diagram illustrating a schematic configuration of a mounting apparatus 11. FIG. 2 is a block diagram illustrating an electrical connection relationship of the mounting apparatus 11. 9 is a flowchart illustrating an example of an implementation processing routine. FIG. FIG. 4 is an explanatory diagram of a suction operation on a mounting table 18B including a suction unit 19;

  Preferred embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic explanatory diagram illustrating an example of the mounting system 10. FIG. 2 is an explanatory diagram illustrating a schematic configuration of the mounting apparatus 11. FIG. 3 is a block diagram illustrating an electrical connection relationship of the mounting apparatus 11. The mounting system 10 is, for example, a system that executes a mounting process related to a process of mounting components on the substrate S. The mounting system 10 includes a mounting device 11 and a management computer 50. In the mounting system 10, a plurality of mounting apparatuses 11 for performing a mounting process for mounting components on a substrate S are arranged from upstream to downstream. FIG. 1 shows only one mounting device 11 for convenience of explanation. In this embodiment, the left-right direction (X-axis), the front-rear direction (Y-axis), and the up-down direction (Z-axis) are as shown in FIGS.

  The mounting apparatus 11 includes, as shown in FIGS. 1 to 3, the substrate transport unit 12, the mounting unit 13, the pressure applying unit 27, the component supply unit 14, the parts camera 15, the mounting table 18, the control device 40 And The substrate transport unit 12 is a unit that carries in, transports, fixes and unloads the substrate S at the mounting position. The substrate transport unit 12 has a pair of conveyor belts provided at intervals in front and rear of FIG. The substrate S is transported by this conveyor belt.

  As shown in FIG. 1, the mounting apparatus 11 has a feature in which a shape and the like of a component can be grasped by imaging from a lower surface side and a feature portion 61 is provided on an upper surface side in addition to a normal component P that does not need to be recognized on an upper surface side. The component 60 is mounted. The characteristic component 60 has a characteristic portion 61 that needs to recognize its position, shape, and the like from the upper surface side (also referred to as upper surface recognition), and a contact surface 62 that is an upper surface that comes into contact at the time of collection. The characteristic portion 61 may be, for example, a light-emitting body that emits light. That is, the characteristic component 60 may be an LED component having an upper portion formed of a transparent resin having a light transmitting property. Note that the normal part P and the characteristic part 60 are collectively referred to as “parts”.

  The mounting unit 13 collects components from the component supply unit 14 and places them on the board S fixed to the board transport unit 12. The mounting unit 13 includes a head moving unit 20, a mounting head 22, and a suction nozzle 24. The head moving unit 20 includes a slider that is guided by a guide rail and moves in the X and Y directions, and a motor that drives the slider. The mounting head 22 is detachably mounted on the slider, and is moved by the head moving unit 20 in the XY directions. One or more suction nozzles 24 are detachably mounted on the lower surface of the mounting head 22. The suction nozzle 24 is a sampling member that samples components using pressure, and is detachably attached to the mounting head 22. The mounting head 22 has a built-in Z-axis motor 23, and the height of the suction nozzle 24 is adjusted along the Z-axis by the Z-axis motor. Further, the mounting head 22 includes a rotating device that rotates (spins) the suction nozzle 24 by a drive motor (not shown) so that the angle of the component sucked by the suction nozzle 24 can be adjusted.

  The mark camera 25 is, for example, an imaging device that can image the substrate S and components from above. The mark camera 25 is provided on the lower surface side of the mounting head 22 (or slider), and moves in the XY directions as the mounting head 22 moves. The lower part of the mark camera 25 is an imaging area 26 (see FIG. 2), which captures a reference mark attached to the substrate S and used for grasping the position of the substrate S, and outputs the image to the control device 40. The mark camera 25 captures an image of the upper surface of the characteristic component 60 and outputs the image to the control device 40.

  The pressure applying unit 27 is a unit that supplies a negative pressure and a positive pressure required for the operation of the device. The pressure applying unit 27 includes a vacuum pump 28, a solenoid valve 29, an intake port 30, and an air pipe 27a (see FIG. 1). The air pipe 27a is connected to one of the vacuum pump 28 and the intake port 30 via an electromagnetic valve 29. When the electromagnetic valve 29 is operated so as to communicate with the vacuum pump 28, the pressure applying unit 27 applies a negative pressure to the air pipe 27 a, and when the electromagnetic valve 29 is operated so as to communicate with the intake port 30, the air piping A positive pressure is applied to 27a. The suction nozzle 24 is connected to the end of the air pipe 27a.

  In the component supply unit 14, a plurality of feeders 32 each having a reel 33 are detachably attached to a mounting unit 31 provided on the front side of the mounting apparatus 11. A tape 34 is wound around each reel 33, and a plurality of components are held on the tape 34 along the longitudinal direction of the tape 34. The tape 34 is unwound from the reel 33 rearward, and is sent out to a sampling position 36 (see FIG. 2) where the suction nozzle 24 sucks the tape with the components exposed. The component supply unit 14 includes a tray unit 35 having a tray on which a plurality of components are arranged and placed.

  The parts camera 15 is provided between the board transfer unit 12 and the parts supply unit 14. The imaging range of the part camera 15 is above the part camera 15. When the suction nozzle 24 sucking the component passes above the part camera 15, the part camera 15 captures an image of the component sucked by the suction nozzle 24 from below, and outputs the image to the control device 40.

  The mounting table 18 is disposed between the substrate transport unit 12 and the component supply unit 14 and beside the part camera 15. The mounting table 18 is supported so that the upper surface on which the components are mounted is horizontal, and is used as a temporary mounting table for the characteristic components 60. When the characteristic component 60 is mounted on the mounting table 18, the posture thereof is more stable than when the characteristic component 60 is stored in the storage portion of the tape 34. The mounting table 18 may be formed in such a size that the maximum number of the characteristic components 60 to be sucked at one time to the mounting head 22 can be mounted.

  As shown in FIG. 3, the control device 40 is configured as a microprocessor having a CPU 41 as a main component, and includes a ROM 42 for storing a processing program, an HDD 43 for storing various data, a RAM 44 used as a work area, an external device and an electric device. An input / output interface 45 for exchanging signals is provided, and these are connected via a bus 46. The control device 40 outputs control signals to the substrate transport unit 12, the mounting unit 13, the component supply unit 14, the part camera 15, and the pressure applying unit 27, and outputs signals from the mounting unit 13, the component supply unit 14, and the part camera 15. Enter

  The management computer (PC) 50 is a computer that manages information of each device of the mounting system 10. The management PC 50 includes a control device configured as a microprocessor mainly including a CPU. The control device includes a ROM for storing a processing program, an HDD for storing various data, a RAM used as a work area, and an external device. It has an input / output interface for exchanging electrical signals with the device. The management PC 50 includes an input device 52 such as a keyboard and a mouse for inputting various commands by an operator, and a display 54 for displaying various information.

  Next, the operation of the mounting system 10 of the present embodiment thus configured, specifically, the mounting process of the mounting device 11 will be described. FIG. 4 is a flowchart illustrating an example of a mounting process routine executed by the CPU 41 of the control device 40. This routine is stored in the HDD 43 of the control device 40 and is executed according to a start instruction from the operator. Here, a case where the normal component P and the characteristic component 60 are mounted on the substrate S by the suction nozzle 24 will be described. When this routine is started, the CPU 41 of the control device 40 first acquires mounting job information from the management computer 50 (step S100). The mounting job information includes the mounting order of the components, the type of the component to be mounted, information on a suction nozzle that suctions the component, and the like.

  Next, the CPU 41 performs a process of transporting and fixing the substrate S (Step S110), and sets a component to be sucked (Step S120). Next, the CPU 41 determines whether the component to be sucked by the suction nozzle 24 is the normal component P or the characteristic component 60 based on the mounting job information (step S130). When the component to be sucked is the normal component P, the CPU 41 causes the general component S to perform the suction and movement process of the normal component P (step S140), and arranges the normal component P at the mounting position of the board S (step S200). .

  5A and 5B are explanatory diagrams of the suction operation. FIG. 5A is an explanatory diagram of the suction operation of the normal component P, and FIG. As shown in FIG. 5A, in the mounting process of the normal component P, the CPU 41 applies the suction nozzle to the normal component P stored in the tape 34 while applying a negative pressure to the suction nozzle 24 as a general suction operation. 24 are brought into contact with each other to collect a normal part P. Further, as a general-purpose suction operation, the CPU 41 sucks the normal component P on the suction nozzle 24, and then moves the suction nozzle 24 sucking the normal component P at an acceleration α1. At this time, the CPU 41 controls the mounting head 22 so as to pass over the part camera 15, corrects the suction position shift based on the imaging result of the part camera 15, and arranges the normal part P on the substrate S. Generally, when the normal component P contained in the tape 34 is to be collected in a state where a negative pressure is applied to the suction nozzle 24, the normal component P is sucked when the suction nozzle 24 approaches the normal component P. The adsorption position of P may be shifted. Further, when the normal component P is moved at a relatively large acceleration, the acceleration may cause a shift in the suction position of the normal component P. In the mounting process of the normal component P, the suction position shift can be corrected by the imaging result of the part camera 15, so that the normal component P is sampled from the tape 34 in a state where the negative pressure is applied, or the normal component P is applied at a relatively large acceleration α1. The part P can be moved.

  On the other hand, in step S130, when the component to be sucked by the suction nozzle 24 is the characteristic component 60, the CPU 41 causes the suction and movement process of the characteristic component 60 to be executed by the pre-mounting suction operation (step S150). The characteristic component 60 is placed (Step S160). The characteristic component 60 has a characteristic portion 61 on the upper surface side, and needs to be mounted on the substrate S more accurately so that the position of the optical axis does not shift. With the tape 34, the posture of the characteristic component 60 may not be stable. For this reason, the CPU 41 recognizes the position of the characteristic part 61 in a state where the characteristic part 60 is once placed on the mounting table 18 and the posture of the characteristic part 60 is stabilized, and the position of the characteristic part 61 is determined based on the recognized position. It is assumed that the characteristic component 60 is mounted on the substrate S so that the position is at the correct position. In the mounting process of the characteristic component 60, the CPU 41 causes the suction nozzle 24 to abut on the characteristic component 60 stored in the tape 34 in a state where a negative pressure is applied to the suction nozzle 24 as a pre-mounting suction operation. The part 60 is collected. In addition, as shown in FIG. 5B, the CPU 41 sucks the characteristic component 60 on the suction nozzle 24 and then moves the suction nozzle 24 that is sucking the characteristic component 60 at the acceleration α2 as the pre-mounting suction operation. Let it. Since the accurate suction of the characteristic components 60 is performed on the mounting table 18, the sampling of the characteristic components 60 from the tape 34 may be performed by the pre-mounting suction operation, which is the same operation as the above-described general-purpose suction operation. Good. That is, the acceleration α1 and the acceleration α2 may be different or may be the same.

  Next, the CPU 41 causes the mark camera 25 to take an image of the characteristic component 60 on the mounting table 18 and executes a process of recognizing the position of the characteristic unit 61 (step S170). In this process, for example, the captured image may be binarized, the area of the pixel value corresponding to the characteristic portion 61 may be determined, and the coordinates of the characteristic portion 61 may be obtained. In this manner, the CPU 41 can determine the exact position (coordinates) of the characteristic portion 61 on the mounting table 18. Next, the CPU 41 determines whether or not the recognition process of the feature unit 61 has been completed based on whether or not the recognition process has been performed for all of the feature components 60 on the mounting table 18 (step S180). If not completed, the process of step S170 is executed.

  On the other hand, when the recognition process of the characteristic part 61 is completed, the CPU 41 causes the characteristic component 60 to be suctioned and moved by a predetermined suppression suction operation for further suppressing the displacement of the characteristic component 60 (step S190), and the board S The characteristic component 60 is arranged at the mounting position (step S200). In step S190, the CPU 41 performs the position correction using the recognition result of the characteristic portion 61 and causes the characteristic component 60 to be suctioned. In the mounting process of the characteristic component 60, as shown in FIG. 5B, the CPU 41 causes the suction nozzle 24 to contact the characteristic component 60 and then applies a negative pressure to the suction nozzle 24 as a suppression suction operation. Then, the characteristic part 60 is collected. Further, as the suppression suction operation, the CPU 41 sucks the characteristic component 60 on the suction nozzle 24, and then moves the suction nozzle 24 that is sucking the characteristic component 60 at an acceleration α3 slower than the accelerations α1 and α2. As described above, after recognizing the accurate position of the characteristic portion 61, the CPU 41 suctions and moves the characteristic component 60 under the condition of further suppressing the suction position shift.

  Subsequently, the CPU 41 determines whether or not the mounting processing of the current board S by the mounting apparatus 11 has been completed (step S210). If the mounting processing of the current board S has not been completed, the processing from step S120 is executed. I do. That is, the CPU 41 sets a component to be sucked next, and sucks and moves it under suction conditions according to the set component. On the other hand, when the mounting process of the current board S is completed in step S210, the CPU 41 discharges the board S on which mounting is completed (step S220), and determines whether or not the production is completed (step S230). If the production has not been completed, the CPU 41 executes the processing from step S110. That is, the CPU 41 conveys and fixes a new substrate S, and executes the processing after step S120. On the other hand, when the production is completed in step S230, the CPU 41 ends this routine as it is.

  Here, the correspondence between the components of the present embodiment and the components of the present invention will be clarified. The mounting head 22 of the present embodiment corresponds to the mounting head of the present invention, the mark camera 25 corresponds to an imaging unit, the mounting table 18 corresponds to a mounting table, and the control device 40 corresponds to a control unit. In the present embodiment, an example of the mounting method of the present invention is clarified by describing the operation of the mounting apparatus 11.

  In the mounting apparatus 11 of the embodiment described above, while the normal component P (first component) is mounted by the general-purpose suction operation, the mounting process of the characteristic component 60 having the characteristic portion 61 formed on the upper surface is performed by the general-purpose component. The mounting process is performed by a predetermined suppression suction operation different from the suction operation. At this time, the control device 40 applies a negative pressure to the suction nozzle 24 at a timing later than the general-purpose suction operation, and moves the characteristic component 60 after the suction with a slower acceleration than the general-purpose suction operation. Perform the operation. In general, in a mounting apparatus, if a negative pressure is supplied to the suction nozzle 24 before the suction nozzle comes into contact with the component, the component is likely to shift in suction position, such as sucking up the component. In addition, in the mounting apparatus, when the mounting head moves the normal component P and the characteristic component 60 at the same acceleration, the component is likely to shift in a suction position. In the mounting apparatus 11, the timing at which a negative pressure is applied to the suction nozzle 24 and the movement acceleration after suction are made slower, so that the shift of the suction position of the characteristic component 60 can be further suppressed.

  Further, since the mounting device 11 moves the characteristic component 60 to the mounting table 18 and recognizes the position of the characteristic portion 61 of the characteristic component 60 on the mounting table 18, it is possible to more accurately recognize the characteristic portion 61. Furthermore, since the mounting device 11 performs the suppression suction operation after recognizing the characteristic portion 61, the displacement of the suction position of the characteristic component 60 can be further suppressed. Furthermore, the mounting apparatus 11 places the characteristic component 60 on the mounting table 18 by the pre-mounting suction operation, recognizes the characteristic portion 61 on the mounting table 18, and then performs a suppression suction operation different from the pre-mounting suction operation. The characteristic component 60 is mounted. As described above, since the mounting device 11 performs the suppression suction operation after recognizing the characteristic portion 61, it is possible to suction the characteristic component 60 at a more accurate position of the characteristic portion 61. Further, the control device 40 can further suppress the suction position deviation of the characteristic component 60 by making the timing of applying the negative pressure to the suction nozzle 24 and the moving acceleration after the suction more slow. Furthermore, in the mounting apparatus 11, since the suction nozzle 24 applies a negative pressure to the suction nozzle 24 after the suction nozzle 24 contacts the characteristic component 60, the suction position shift can be further suppressed.

  It should be noted that the present invention is not limited to the above-described embodiment at all, and it goes without saying that the present invention can be implemented in various modes as long as it belongs to the technical scope of the present invention.

  For example, in the above-described embodiment, the control device 40 applies a negative pressure to the suction nozzle 24 at a timing later than the general-purpose suction operation or the pre-mounting suction operation, and also performs the characteristic component 60 with a slower acceleration than the general-purpose suction operation. Although the suppression suction operation of performing the movement after the suction is performed, any one of the processes may be omitted. In this mounting apparatus, the suction position shift can be further suppressed by delaying one of the negative pressure application timing and the movement acceleration.

  In the above-described embodiment, a negative pressure is applied to the suction nozzle 24 after the suction nozzle 24 comes into contact with the characteristic component 60. However, for example, the suction nozzle 24 applies the negative pressure at a later timing than the general-purpose suction operation. May be provided. When the suction nozzle 24 approaches the characteristic component 60, the tip of the suction nozzle 24 has a smaller negative pressure than the general-purpose suction operation, so that the suction position shift can be further suppressed.

  In the above-described embodiment, the control device 40 causes the characteristic component 60 to be suction-moved by the suppressed suction operation different from the general-purpose suction operation of the normal component P, and performs the characteristic component by the suppressed suction operation different from the pre-placement suction operation of the characteristic component 60. Although 60 is moved by suction, it may be one that satisfies either one. For example, when the characteristic component 60 is sucked and moved by the suppression suction operation different from the general-purpose suction operation of the normal component P, the pre-placement suction operation and the suppression suction operation may be the same condition. Further, when the characteristic component 60 is suction-moved by the suppression suction operation different from the pre-placement suction operation, the general-purpose suction operation and the suppression suction operation may be the same condition.

  In the embodiment described above, the mounting table 18 is provided, and the position recognition of the characteristic portion 61 is performed on the mounting table 18. However, the present invention is not particularly limited to this, and the mounting of the characteristic component 60 on the mounting table 18 is omitted. May be. For example, if the posture of the characteristic component 60 is stable in the accommodation portion of the tape 34 of the feeder 32, the control device 40 performs recognition of the characteristic portion 61 on the feeder 32 without mounting on the mounting table 18. Implementation processing may be performed. In this mounting apparatus, the position recognition processing of the characteristic portion 61 is performed on the feeder 32, and the suppressed suction operation under conditions slower than the general-purpose suction operation when the characteristic component 60 is suctioned on the feeder 32 may be performed. Note that the mounting apparatus 11 may not include the mounting table 18.

  In the above-described embodiment, the characteristic component 60 is mounted on the flat mounting table 18. However, as illustrated in FIG. 6, the mounting device 11 includes the suction unit 19 that suctions the mounted component. The mounting table 18B may be provided. FIG. 6 is an explanatory diagram of a suction operation in the mounting apparatus 11B including the mounting table 18B on which the suction unit 19 is formed. In the mounting table 18B, a slit-shaped suction portion 19 having a width sufficiently smaller than the characteristic component 60 is formed on a mounting surface on which the characteristic component 60 is mounted. The suction unit 19 is connected to the pressure applying unit 27, and is supplied with a negative pressure and a positive pressure. In the mounting device 11B, the control device 40 may control the mounting head 22 to suck the characteristic component 60 from the component supply unit 14 by the suppressed suction operation. On the other hand, the control device 40 picks up the upper surface of the characteristic component 60 on the mounting table 18B with the mark camera 25 and recognizes the characteristic portion 61, and then picks up the characteristic component 60. The mounting head 22 may be controlled to mount the characteristic component 60 by the suction operation. The post-placement suction operation may be the same as, for example, the general-purpose suction operation and / or the pre-placement suction operation, or may be different. In the suppression suction operation, the negative pressure supply timing to the suction nozzle 24 may be slower than the suction operation after placing, or the movement acceleration after suction may be slower. In this mounting apparatus 11B, the suction position of the characteristic component 60 on the mounting table 18B can be suppressed by the suction unit 19 of the mounting table 18B. Therefore, when the suction unit 19 can sufficiently fix the characteristic component 60, the suppression suction operation can be omitted on the mounting table 18B. In addition, on the feeder 32, by performing the suppression suction operation, it is possible to suppress the displacement of the suction of the characteristic component 60 in the component supply unit 14. In the mounting device 11B, the suppression suction operation may be performed on both the feeder 32 and the mounting table 18B.

  In the above-described embodiment, the upper surface of the characteristic component 60 is imaged, and the position is corrected using the result of recognizing the position of the characteristic component 60 (the characteristic portion 61). However, the present invention is not limited to this. The obtained image may be used for other processing. In the above-described embodiment, the characteristic portion 61 is described as the characteristic component 60 which is a light emitting body. However, the component is not particularly limited as long as it is a component that requires imaging of the characteristic portion 61 from the upper surface side. It may be a part.

  In the above-described embodiment, the present invention has been described as the mounting apparatus 11, but may be, for example, a mounting method or a program for executing the above-described processing by a computer.

  INDUSTRIAL APPLICABILITY The present invention is applicable to an apparatus that performs a mounting process for arranging components on a substrate.

Reference Signs List 10 mounting system, 11, 11B mounting device, 12 substrate transport unit, 13 mounting unit, 14 component supply unit, 15 parts camera, 18, 18B mounting table, 19 suction unit, 20 head moving unit, 22 mounting head, 23 Z axis Motor, 24 suction nozzle, 25 mark camera, 26 imaging area, 27 pressure applying unit, 27a piping, 28
Vacuum pump, 29 solenoid valve, 30 intake port, 31 mounting part, 32 feeder, 33 reel, 34 tape, 35 tray unit, 36 sampling position, 40 control device, 41 CPU, 42 ROM, 43 HDD, 44 RAM, 45 input Output interface, 46 bus, 50 management computer, 52 input device, 54 display, 60 feature parts, 61 feature part, 62 contact surface, P normal part, S board.

Claims (7)

A mounting head having one or more suction nozzles for sucking the component and mounting the sucked component on a substrate;
While the mounting head is controlled to perform the mounting process on the first component by the general-purpose suction operation, a predetermined suppression suction different from the general-purpose suction operation is performed when the mounting process is performed on the characteristic component having the predetermined characteristic portion formed on the upper surface. A control unit for controlling the mounting head so as to perform mounting processing by operation,
An imaging unit capable of imaging the upper surface of the component,
And a mounting table for mounting the component,
The control unit, the characteristic component is placed on the mounting table by a pre-mounting suction operation, and after recognizing the characteristic unit by imaging the upper surface of the characteristic component on the mounting table with the imaging unit, A mounting apparatus that controls the mounting head to perform mounting processing of the characteristic component in the suppression suction operation different from the pre-placement suction operation. A mounting head having one or more suction nozzles for sucking the component and mounting the sucked component on a substrate;
An imaging unit capable of imaging the upper surface of the component,
A mounting table for mounting the component,
Predetermined characteristic portion is placed on the mounting table by the pre-placement suction operation of the characteristic component formed on the upper surface,
After capturing the upper surface of the characteristic component with the imaging unit on the mounting table and recognizing the characteristic portion, the mounting process of the characteristic component is performed by a predetermined suppression suction operation different from the pre-placement suction operation. A control unit for controlling the mounting head;
Mounting device equipped with. The control unit performs the suppression suction operation of applying a negative pressure to the suction nozzle at a later timing than the pre-placement suction operation, and the characteristic component with a slower acceleration than the pre-placement suction operation. controlling the mounting head to perform any one or more of the suppression suction operation for moving after adsorption, mounting apparatus according to claim 1 or 2. A mounting head having one or more suction nozzles for sucking the component and mounting the sucked component on a substrate;
While the mounting head is controlled to perform the mounting process on the first component by the general-purpose suction operation, a predetermined suppression suction different from the general-purpose suction operation is performed when the mounting process is performed on the characteristic component having the predetermined characteristic portion formed on the upper surface. A control unit for controlling the mounting head so as to perform mounting processing by operation,
An imaging unit capable of imaging the upper surface of the component,
A supply unit for supplying parts,
A mounting table provided with a suction unit that mounts the component and suctions the mounted component,
The control unit controls the mounting head to suck the feature component from the supply unit in the suppression suction operation, while capturing the top surface of the feature component with the imaging unit on the mounting table. A mounting apparatus for controlling the mounting head to mount the characteristic component in a suction operation after placement different from the general-purpose suction operation or the suppression suction operation when the characteristic component is suctioned after the recognition. A mounting head for mounting processing one or more organic and parts that intake wearing suction nozzle for sucking a component onto a substrate, an imaging capable imaging unit the upper surface of the component, the mounting table for mounting the component, the A mounting method executed by the mounting apparatus provided ,
While the mounting head is controlled to perform the mounting process on the first component by the general-purpose suction operation, a predetermined suppression suction different from the general-purpose suction operation is performed when the mounting process is performed on the characteristic component having the predetermined characteristic portion formed on the upper surface. Controlling the mounting head to perform mounting processing in an operation,
In the step, the characteristic component is placed on the mounting table by a pre-mounting suction operation, and the upper surface of the characteristic component is imaged on the mounting table by the imaging unit to recognize the characteristic unit. A mounting method, wherein the mounting head is controlled so that the characteristic component is mounted in the suppressed suction operation different from the pre-placement suction operation . A mounting head for mounting processing one or more organic and parts that intake wearing suction nozzle for sucking a component onto a substrate, an imaging capable imaging unit the upper surface of the component, the mounting table for mounting the component, the A mounting method executed by the mounting apparatus provided ,
Was placed into the mounting table in置前pickup operation mounting features component features of Jo Tokoro is formed on the upper surface, on the mounting table to image the top surface of the feature part by the imaging unit recognizes the feature It was the then, before described置前 step of controlling the mounting head to implement processing the characteristic component by the suction operation and the different predetermined suppression adsorption operation, the including mounting method. A mounting head for mounting processing one or more organic and parts that intake wearing suction nozzle for sucking a component onto a substrate, and the upper surface can image imaging section of the component, and a supply unit for supplying components, the component A mounting table provided with a suction unit that suctions the mounted component to be mounted, and a mounting method performed by a mounting apparatus including the
While the mounting head is controlled to perform the mounting process on the first component by the general-purpose suction operation, a predetermined suppression suction different from the general-purpose suction operation is performed when the mounting process is performed on the characteristic component having the predetermined characteristic portion formed on the upper surface. Controlling the mounting head to perform mounting processing in an operation,
In the step, the mounting head is controlled to suck the characteristic component from the supply unit by the suppression suction operation, and the upper surface of the characteristic component is imaged by the imaging unit on the mounting table to recognize the characteristic unit. After that, when mounting the characteristic component, the mounting apparatus controls the mounting head such that the mounting process is performed on the characteristic component by a post-mounting suction operation different from the general-purpose suction operation or the suppression suction operation .

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