JP6457245B2 - Electronic component mounting equipment - Google Patents

Description

  The present invention relates to an electronic component mounting apparatus for mounting electronic components on a substrate.

  The electronic component mounting apparatus mounts the electronic component on the substrate by repeatedly holding the electronic component with a nozzle provided in the head and mounting the electronic component on the mounting point of the substrate. In recent years, in addition to mounted electronic components mounted on a substrate, electronic components that can be mounted both on an inserted electronic component that has a lead wire and is mounted on the substrate by inserting the lead wire into a hole in the substrate A mounting apparatus has been proposed (see Patent Document 1).

  Patent Document 1 describes a suction-type nozzle having a mechanism for sucking and holding an electronic component and a gripping nozzle having a mechanism for sandwiching and holding the electronic component. Further, as a nozzle mechanism, Patent Document 2 and Patent Document 3 also describe a gripping type nozzle having a mechanism for sandwiching and holding an electronic component.

JP 2013-179190 A JP 2006-108199 A JP 2006-140274 A

  The insertion-type electronic component has a lead wire, and is mounted by inserting the lead wire into a hole in the substrate. As described above, electronic components having lead wires include electronic components having shapes that are difficult to hold by suction or gripping. For example, there are a memory module, specifically a DIMM connector into which a DIMM (Dual Inline Memory Module) is inserted, and a flat cable connector into which a flat cable is inserted. The connector-type electronic component having these insertion portions is formed with an insertion portion for inserting various components, and further has a structure in which a plate-like member is inserted. Therefore, there is an electronic component having a shape that is difficult to hold by suction or gripping. Therefore, at present, the operator manually inserts.

  The present invention has been made in view of the above, and is capable of holding and transporting an electronic component having a shape that is difficult to hold by holding or sandwiching and holding it, and is preferably mounted on a substrate An object is to provide an apparatus.

  The present invention is an electronic component mounting apparatus, an electronic component supply apparatus for supplying a connector-type electronic component having a board conveyance section for conveying a board, and an insertion section into which a lead wire and a plate-like member are inserted, An electronic component transport nozzle for holding a connector-type electronic component; and a nozzle drive unit for driving the electronic component transport nozzle; the connector-type electronic component is held by the electronic component transport nozzle; A head that is transported to the substrate and mounts the connector-type electronic component on the substrate; a head moving mechanism that moves the head; and a control device that includes a head control unit that controls the operation of the head; The head can replace the nozzle driven by the nozzle driving unit with the electronic component transport nozzle and a nozzle other than the electronic component transport nozzle, and the control device includes: If wearing the serial electronic component conveying nozzle in the vertical direction of the electronic component conveying nozzle, if it exceeds the threshold of the movable position in the vertical way improved side, characterized in that it does not move the electronic component conveying nozzle.

  Moreover, it is preferable that the said control apparatus sets the range which can move the said electronic component conveyance nozzle in the perpendicular direction according to the attitude | position of the said electronic component conveyance nozzle.

  The image processing apparatus further includes an image recognition device that is disposed within a range in which the head moves and images the nozzle from the substrate side, and the control device includes an image processing unit that processes an image captured by the image recognition device. The control device moves the nozzle to a position facing the image recognition device in a state where the connector type electronic component is held by the nozzle of the head, and the connector type electronic component and the image recognition device. A plurality of images acquired by the image processing unit by acquiring images of the surface on the lead wire side of the connector-type electronic component at a plurality of positions having different distances. The position of the lead wire is identified based on the synthesized image, and the mounting position of the connector-type electronic component is determined based on the identified position of the lead wire. And, it is preferable to implement the connector type electronic component on the substrate based on the determined position.

  Further, the control device performs photographing with the image recognition device while changing a distance between the connector type electronic component and the image recognition device only at both ends in the longitudinal direction of the connector type electronic component, and It is preferable to detect the position and determine the mounting position based on the detection result.

  In the head, the nozzle drive units are arranged in a row in a predetermined direction, and the control device arranges the electronic component transport nozzle in a direction parallel to the predetermined direction, and the connector-type electronic component It is preferable to take a picture with the image recognition device while changing the distance between the image recognition device and the image recognition device.

  When the control device arranges the electronic component transport nozzle in a direction parallel to the predetermined direction and performs photographing with the image recognition device while changing a distance between the connector-type electronic component and the image recognition device. It is preferable that the threshold value of the movable position on the upper side in the vertical direction is changed to a height on the upper side in the vertical direction.

  The electronic component transport nozzle is connected to a base portion connected to a head of the electronic component mounting apparatus, a guide shaft connected to a side surface of the base portion, the guide shaft, and the base portion. A movable slide portion, an arm portion fixed to the slide portion and provided with a distal end portion in contact with the connector-type electronic component at a distal end portion farthest from the slide portion, and the base portion and the slide portion. An expansion / contraction adjustment mechanism that moves the slide portion relative to the base portion and changes a distance from the base portion to the tip portion, and the tip portion of the connector-type electronic component The connector type electronic part is inserted into a groove formed on the surface facing the center side, and the arm part is urged toward the surface facing the center side of the connector type electronic component. It is preferable to retain the.

  INDUSTRIAL APPLICABILITY The present invention has an effect that a connector-type electronic component of an electronic component having a shape that is difficult to be held by pinching or sandwiched and held can be transported and can be suitably mounted on a substrate.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. FIG. 3 is a schematic diagram showing a schematic configuration of another example of the component supply unit. FIG. 4 is a perspective view showing an example of a connector-type electronic component. FIG. 5 is a front view of the connector-type electronic component shown in FIG. 6 is an enlarged perspective view showing a latch portion of the connector-type electronic component shown in FIG. FIG. 7 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 8 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 9 is a perspective view showing a schematic configuration of the connector nozzle. FIG. 10 is a top view showing a schematic configuration of the connector nozzle. FIG. 11 is an enlarged cross-sectional view showing a schematic configuration of the connector nozzle. FIG. 12 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 13 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 14 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 15 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 16 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. FIG. 17 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 18 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 19 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 20 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. FIG. 21 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 22 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 23 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. FIG. 24 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 25 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 26 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 27 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. FIG. 28 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. FIG. 29 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Embodiments of an electronic component mounting apparatus according to the present invention will be described below in detail with reference to the drawings. In addition, this invention is not limited by this embodiment. The electronic component mounting apparatus of the present embodiment has a lead wire (insertion portion), and the lead wire is inserted into a substrate hole (insertion hole, hole) of the substrate, whereby the electronic component mounted on the substrate, This is an electronic component mounting apparatus for mounting a so-called insertion type electronic component and a mounting type electronic component mounted on a substrate without being inserted into an insertion hole (substrate hole). Here, the insertion type electronic component is mounted by inserting a lead wire into a hole formed in the substrate. Further, electronic components mounted on the substrate without being inserted into the insertion hole (substrate hole), for example, SOP, QFP, etc., are mounted electronic components. Note that the electronic component mounting apparatus may have only a function of mounting an insertion type electronic component (lead type electronic component).

  Next, the electronic component mounting apparatus 10 of this embodiment will be described. The electronic component mounting apparatus 10 can mount both a mountable electronic component that is mounted by being placed on a substrate and an insertable electronic component that is mounted by inserting a lead into an insertion hole of the substrate (leaded electronic component). It is a device that can. The electronic component mounting apparatus 10 can mount both the mountable electronic component and the insertion-type electronic component, or can mount only one of them. In other words, the electronic component mounting apparatus 10 can mount both a mountable electronic component and an insertable electronic component, and can be used for various purposes according to the layout of the board to be manufactured and other electronic component mounting apparatuses. Can do.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14f and 14r, heads 15f and 15r, an XY moving mechanism 16, a VCS unit 17, an exchange nozzle holding mechanism 18, The component storage unit 19, the control device 20, the operation unit 40, and the display unit 42 are included. The XY movement mechanism 16 includes X-axis drive units 22f and 22r and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment has component supply units 14f and 14r, heads 15f and 15r, and an X-axis drive on the front side and the rear side around the board transport unit 12. The sections 22f and 22r are provided. In the electronic component mounting apparatus 10, the component supply unit 14f, the head 15f, and the X-axis drive unit 22f are arranged on the front side of the electronic component mounting apparatus 10, and the component supply unit 14r, the head 15r, and the X-axis drive unit 22r are mounted on the electronic component. It is arranged on the rear side of the device 10. In the following description, when the two component supply units 14f and 14r, the two heads 15f and 15r, and the two X-axis drive units 22f and 22r are not particularly distinguished, the component supply unit 14, the head 15, and the X-axis drive unit 22 To do.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at a predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined, and the substrate 8 is transported with the substrate 8 mounted on the endless belt. This is a belt-type transport mechanism integrated with a transport mechanism.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14 f and the rear-side component supply unit 14 r can hold a large number of electronic components mounted on the substrate 8 and supply them to the head 15. In other words, an electronic component supply device that supplies the holding position in a state where the head 15 can hold (suck or grip) is provided.

  FIG. 2 is a schematic diagram illustrating a schematic configuration of an example of a component supply unit. As shown in FIG. 2, the front-side component supply unit 14 f includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 90 and 90 a held by a support base (bank) 96. It is configured. The electronic component supply devices 90 and 90a have different mechanisms and supply mechanisms for holding the electronic components depending on the types of electronic components to be mounted. Further, the component supply unit 14 may include a plurality of electronic component supply devices 90 and 90a of the same type. The component supply unit 14 is preferably configured to be detachable from the apparatus main body. Further, the support table 96 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 90 and 90a.

  The component supply device 90 supplies a radial lead type electronic component to the head 15 using an electronic component holding tape configured by sticking a plurality of radial lead type electronic component leads to the tape. In addition, the component supply device 90 holds an electronic component holding tape, sends the held electronic component holding tape, and holds the radial lead type electronic component held by the nozzle of the head 15 in a holding region ( It is a tape feeder that moves to a suction position, a gripping position, and a holding position. Further, the component supply device 90 can hold the radial lead type electronic component having the lead fixed by the tape in a predetermined position by cutting and separating the lead of the radial lead type electronic component moved to the holding region. The radial lead type electronic component can be held (adsorbed and gripped) by the nozzle of the head 15.

  The plurality of component supply apparatuses 90 may supply different types of electronic components or separate electronic components. Further, the component supply device 90 is not limited to a tape feeder that supplies a plurality of radial lead type electronic components attached to a tape, and various lead types using a bowl feeder, an axial feeder, a stick feeder, a tray feeder, or the like. Electronic components can be supplied.

  The electronic component supply device 90a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 90 a is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic components can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 90a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder or a bulk feeder can be used.

  Next, a connector-type electronic component which is an example of an electronic component supplied from the rear-side component supply unit 14r and the rear-side component supply unit 14r will be described with reference to FIGS. FIG. 3 is a schematic diagram showing a schematic configuration of another example of the component supply unit. FIG. 4 is a perspective view showing an example of a connector-type electronic component. FIG. 5 is a front view of the connector-type electronic component shown in FIG. 6 is an enlarged perspective view showing a latch portion of the connector-type electronic component shown in FIG.

  The rear-side component supply unit 14r is a tray feeder that holds a plurality of trays and selects a tray to be arranged at a position where the electronic component is supplied according to the electronic component to be mounted. The rear-side component supply unit 14r has a plurality of trays 98 shown in FIG. On the tray 98, a plurality of connector-type electronic components 80a are placed. In FIG. 3, the connector-type electronic component 80a is placed, but the rear-side component supply unit 14r may have different electronic components placed for each tray. The rear-side component supply unit 14r can supply different types of electronic components by switching the tray to be arranged at a position where the electronic components are supplied because the electronic components placed on the trays are different.

  Next, the connector type electronic component 80a will be described. The connector-type electronic component 80a shown in FIGS. 4 to 6 is a DIMM connector into which a DIMM (Dual Inline Memory Module) is inserted. The connector-type electronic component 80a includes a base portion 110 whose one direction is a longitudinal direction, and latch portions 112 provided at both ends of the base portion 110 in the longitudinal direction. The base portion 110 is formed with an insertion portion 122 and connected to a lead wire 124. In the insertion part 122, an electronic component (memory module) to be inserted into the connector-type electronic component 80a is inserted. The insertion part 122 is a groove extending along the longitudinal direction of the base part 110, and a circuit in contact with the electronic component is formed inside the groove. The lead wire 124 is disposed on the surface opposite to the surface on which the insertion portion 122 is formed. 4 to 6, the lead wire 124 is shown only on a part of the bottom surface of the base portion 110, but is disposed on the entire surface. The latch part 112 includes a fixed part 130 and a movable part 132. The fixing part 130 is fixed to the base part 110. The movable part 132 is movable with respect to the fixed part 130, and a groove 134 is formed on the surface of the base part 110 on the center side (center side of the connector-type electronic component 80a). When the inserted electronic component is inserted, the movable portion 132 moves together with the inserted electronic component. Specifically, the movable part 132 moves in a direction to tighten the electronic component to be inserted. Further, the groove 134 is a mechanism for guiding an electronic component to be inserted, and becomes a part of the insertion portion 122. That is, the connector-type electronic component 80a supports the electronic component on the insertion side by inserting part of the bottom surface and side surface of the electronic component on the insertion side into the groove.

  The connector-type electronic component 80 a is mounted on the substrate 8 by inserting the lead wires 124 into the holes formed in the substrate 8. That is, the insertion portion 122 is inserted into the substrate 8 with the insertion portion 122 facing upward in the vertical direction. Further, the connector-type electronic component 80a is inserted along the insertion portion 122, so that the movable portion 132 moves, and the movable portion 132 that moves to a predetermined fixed position is supported so as not to move with respect to the fixed portion 130. Is done. A mechanism for inserting the connector-type electronic component 80a will be described later.

  The connector-type electronic component 80a is not limited to a DIMM connector. The connector-type electronic component 80a only needs to have a lead wire inserted into the substrate 8 and another component having an insertion portion. The insertion portion 122 includes a groove 134 formed on the center side surface of the latch portion 112. As the connector-type electronic component 80a, a flat cable connector into which a flat cable is inserted is also exemplified.

  In the present embodiment, the rear-side component supply unit 14r is provided with a device for supplying electronic components using a tray, but is not limited thereto. The electronic component mounting apparatus 10 may be provided with a device for supplying electronic components by the tray 98 to the front-side component supply unit 14f. Moreover, although the component supply unit 14 of this embodiment demonstrated the case where the connector-type electronic component 80a was supplied with a tray, you may supply it by methods other than a tray. Moreover, the component supply unit 14 may arrange | position in parallel the mechanism which supplies an electronic component with a tray, and the mechanism which supplies an electronic component with a tape feeder like FIG. For example, as the rear-side component supply unit 14r, both a mechanism for supplying electronic components with a tray and a mechanism for supplying electronic components with a tape feeder may be arranged.

  The head 15 holds (sucks or holds) the electronic component held by the component supply unit 14f or the electronic component held by the component supply unit 14r with a nozzle, and moves the held electronic component to a predetermined position by the substrate transport unit 12. And a mechanism for mounting on the substrate 8. Further, when the component supply unit 14r includes the electronic component supply device 90a, the head 15 mounts (mounts) a chip-type electronic component (mounted electronic component) held by the electronic component supply device 90a on the substrate 8. It is a mechanism to do. The configuration of the head 15 will be described later. The chip-type electronic component (mounted electronic component) is a leadless electronic component that does not include a lead that is inserted into an insertion hole (through hole) formed in the substrate 8. Examples of the on-board electronic component include SOP and QFP as described above. The chip-type electronic component is mounted on the substrate 8 without inserting the lead into the insertion hole.

  An XY moving mechanism (also referred to as a head moving mechanism) 16 is a moving mechanism that moves the heads 15 f and 15 r in the X-axis direction and the Y-axis direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8. The XY moving mechanism 16 includes X-axis drive units 22 f and 22 r and a Y-axis drive unit 24. The X-axis drive unit 22f is connected to the head 15f and moves the head 15f in the X-axis direction. The X-axis drive unit 22r is connected to the head 15r and moves the head 15r in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22, and moves the head 15f in the Y-axis direction by moving the X-axis drive unit 22f in the Y-axis direction. The Y-axis drive unit 24 moves the head 15r in the Y-axis direction by moving the X-axis drive unit 22r in the Y-axis direction. The XY moving mechanism 16 can move the head 15f to a position facing the substrate 8 or a position facing the component supply unit 14f by moving the head 15f in the XY axis direction.

  The XY moving mechanism 16 can move the head 15r to a position facing the substrate 8 or a position facing the component supply unit 14r by moving the head 15r in the XY axis direction.

  The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY moving mechanism 16 moves the heads 15f and 15r on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices 90 and 90a of the component supply units 14f and 14r on the predetermined position (mounting). Position, mounting position).

  As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap with the movable region of the head 15 in the XY plane and that the position in the Z-axis direction is lower than the head 15 in the vertical direction. It is arranged at the position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit 17 is an image recognition device, and includes a camera that captures the vicinity of the nozzles of the head 15 and an illumination unit that illuminates the capturing area. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction and analyzes the captured image to hold the nozzle 15. Recognize the shape of the electronic component and the holding state of the electronic component by the nozzle. The VCS unit 17 is arranged closer to the substrate 8 than the nozzle, and the surface of the electronic component facing the substrate 8 can be photographed by photographing the electronic component held by the nozzle from the substrate 8 side. The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18 and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation. Examples of the operation unit 40 include a keyboard, a mouse, and a touch panel. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker. Examples of the display unit 42 include a touch panel and a vision monitor. The display unit 42 displays various images based on the image signal input from the control device 20.

  In the electronic component mounting apparatus 10 according to the present embodiment, it is also preferable to arrange two board transfer units 12 in parallel. The electronic component mounting apparatus 10 efficiently moves the two substrates 8 to the mounting positions of the electronic components by the two substrate transfer units 12 and mounts the components alternately by the two heads 15. Can be installed.

  Next, the configuration of the head 15 will be described with reference to FIGS. FIG. 7 is a schematic diagram showing a schematic configuration of the head 15 of the electronic component mounting apparatus. FIG. 8 is a schematic diagram showing a schematic configuration of the head 15 of the electronic component mounting apparatus. 7 also shows various control units of the control device 20 that controls the electronic component mounting apparatus 10 and one component supply device 90 of the component supply unit 14r.

  As shown in FIGS. 7 and 8, the head 15 includes a head main body 30, an imaging device 36, a height sensor 37, and a laser recognition device 38. Further, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, a component supply control unit 64, and an image processing unit 66, as shown in FIG. The control unit 60, the head control unit 62, the component supply control unit 64, and the image processing unit 66 are a part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source, and uses the control unit 60, the head control unit 62, the component supply control unit 64, the image processing unit 66, and various circuits to supply power supplied from the power source. To supply. The control unit 60, the head control unit 62, the component supply control unit 64, and the image processing unit 66 will be described later.

  In the electronic component supply device 90, the main body of the electronic component 80 in which the leads are held by the electronic component holding tape (radial component tape) is exposed upward. The electronic component 80 is exemplified by an aluminum electrolytic capacitor. In addition to the aluminum electrolytic capacitor, various electronic components having leads can be used as the electronic component 80. The electronic component supply apparatus 90 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the component supply device 90 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape. The configuration of the electronic component supply device 90 will be described later. Similarly, in the case of the electronic component supply apparatus 90a, the predetermined position is a holding region for holding the electronic component 80 in which the nozzles of the head 15 are held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. As shown in FIG. 8, six nozzles 32 are arranged in a line in the head main body 30 of the present embodiment. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 8, the adsorption | suction nozzle which adsorb | sucks and hold | maintains the electronic component 80 is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 32a at the tip. The opening 32 a is connected to the nozzle driving unit 34 via an internal cavity and a cavity of the nozzle support part 33. The nozzle 32 sucks air from the opening 32a to suck and hold the electronic component 80 at the tip. The nozzle 32 is detachable from the nozzle support portion 33 and is stored (stored) in the replacement nozzle holding mechanism 18 when the nozzle 32 is not attached to the nozzle support portion 33. The nozzle 32 has various shapes and sizes of the opening 32a. In the present embodiment, the suction type nozzle having the opening 32a for sucking the electronic component 80 is shown. However, a gripping type nozzle that holds the electronic component 80 by sandwiching the electronic component 80 using an arm operated by air pressure. Can also be used.

  The nozzle support portion 33 is a mechanism that holds the nozzle 32 at the end (tip) on the lower side in the vertical direction. For example, the nozzle drive portion 34 is connected to the nozzle 32 and a shaft that is moved relative to the head support 31. Socket. The shaft is a rod-shaped member, and is arranged extending in the Z-axis direction. The shaft supports a socket disposed at an end portion on the lower side in the vertical direction. The shaft is supported with respect to the head support 31 in a state where a portion connected to the socket is movable in the Z-axis direction and is rotatable in the θ direction. Here, the Z axis is an axis orthogonal to the XY plane and is a direction orthogonal to the surface of the substrate 8. That is, the θ direction is a direction parallel to the circumferential direction of a circle around the Z axis, which is an axis parallel to the direction in which the nozzle driving unit 34 moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32. A portion of the shaft connected to the socket is moved and rotated in the Z-axis direction and the θ direction by the nozzle driving unit 34.

  The nozzle drive unit 34 moves the nozzle support unit 33 in the Z-axis direction to move the nozzle 32 in the Z-axis direction, and sucks the electronic component 80 through the opening 32 a of the nozzle 32. In addition, the nozzle driving unit 34 rotates the nozzle 32 in the θ direction by rotating the nozzle support unit 33 in the θ direction when the electronic component 80 is mounted.

  The nozzle drive unit 34 includes a Z-axis motor 34a as a mechanism for moving the nozzle 32 in the Z-axis direction. The nozzle drive unit 34 is fixed to the nozzle support unit 33 by being screwed into the belt that is applied to the rotation unit of the Z-axis motor 34 a, the screw rod that extends in the Z-axis direction and is rotated by the belt, and the screw rod. And a screw. The nozzle drive unit 34 rotates the screw rod connected via the belt by the Z-axis motor 34a, and moves the screw screwed into the screw rod in the Z-axis direction. The nozzle driver 34 is fixed to the nozzle support 33 by a screw screwed into a screw rod. The nozzle drive unit 34 rotates the screw rod by the Z-axis motor 34a, and moves the nozzle 32 in the Z-axis direction together with the nozzle support unit 33 fixed to the screw, thereby moving the shaft of the opening 32a at the tip of the nozzle 32. Move in the Z-axis direction. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element coupled to the shaft of the nozzle support unit 33 as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle drive unit 34 transmits the driving force output from the motor to the shaft of the nozzle support unit 33 by a transmission element, and rotates the shaft in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 32a of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 32a of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether to suck air from the opening 32a by switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks (holds) the electronic component 80 in the opening 32a by sucking air from the opening 32a, and closes the electromagnetic valve and sucks air in the opening 32a by not sucking air from the opening 32a. The electronic component 80 that has been released is released, that is, the electronic component 80 is not sucked (not held) by the opening 32a.

  Further, the head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component 80. As with the suction nozzle, the gripping nozzle can release the air to suck and release the air so that the movable piece opens and closes with respect to the fixed piece, thereby holding and releasing the main body of the electronic component 80 from above. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  An imaging device 36 shown in FIG. 8 is fixed to the head support 31 of the head main body 30 and photographs a region facing the head 15, for example, the substrate 8 on which the substrate 8 or the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the field of view with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as “BOC”) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken. One imaging device 36 is provided for each head 15. The imaging device 36 has a camera arranged in parallel with the Z-axis direction, and shoots from a direction parallel to the Z-axis direction.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. In addition, the height sensor 37 processes the distance from the facing portion using the position of the sensor itself and the position of the substrate 8 to measure the height of the facing portion, specifically, the electronic component 80. To detect. The process of detecting the height of the electronic component 80 based on the measurement result of the distance from the electronic component 80 may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 7, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 90 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 7, the electronic component mounting apparatus 10 includes a control unit 60, a storage unit 61, a head control unit 62, a component supply control unit 64, and an image processing unit 66 as the control device 20. . Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, a ROM, and a RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls the control operation by the component supply control unit 64.

  The storage unit 61 is connected to the control unit 60 and has a storage function such as a ROM or a RAM. The storage unit 61 may be provided integrally with the control unit 60 or may be provided separately. The storage unit 61 stores data acquired from each unit by the control unit 60 and data calculated and calculated by the control unit 60. For example, the storage unit 61 corrects design drawing data including through-hole coordinate design values, reference mark coordinate design values, and electronic component mounting coordinate design values, as well as various electronic component shapes, suction conditions, and suction processing corrections. Stores conditions, production programs, etc. In addition, the storage unit 61 stores a creation condition, which is a condition for detecting the shape of a lead of an insertion type electronic component having a lead, such as a radial lead type electronic component, in association with the type of the insertion type electronic component. Furthermore, the storage unit 61 also stores a program for controlling an operation (parameter acquisition process) when determining the creation conditions. The storage unit 61 can also delete unnecessary data under the control of the control unit 60.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the suction (holding) / release operation of the electronic component 80 of the nozzle 32 and the operation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, a distance sensor). Controls the rotation operation and the movement operation in the Z-axis direction. The head controller 62 also controls the nozzle replacement operation.

  The component supply control unit 64 controls the supply operation of the electronic components 80 and 80a by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each of the electronic component supply devices 90 and 90a or may control all the electronic component supply devices 90 and 90a. For example, the component supply control unit 64 controls an electronic component holding tape drawing operation (moving operation), lead cutting operation, and radial lead type electronic component holding operation by the electronic component supply device 90. In addition, when the component supply unit 14 includes the electronic component supply device 90a, the component supply control unit 64 controls the electronic component holding tape drawing operation (moving operation) by the electronic component supply device 90a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape.

  The image processing unit 66 controls the photographing operation in the VCS unit 17 and processes the acquired image. The image processing unit 66 sends information obtained by image processing and image information to the control unit 60. When acquiring an image of the insertion type electronic component, the image processing unit 66 combines images taken at a plurality of positions at different distances from the insertion type electronic component. That is, the image processing unit 66 acquires an image of the surface on which the lead of the insertion type electronic component is formed by omnifocal recognition processing, and acquires information on the shape of the lead. Further, the image processing unit 66 performs various image processing on the image acquired by the VCS unit 17. The image processing includes edge enhancement processing using a primary (differential) filter, smoothing processing using a secondary (differential) filter, binarization processing, and the like. The processing by the control device 60 will be described later.

  Here, in the above embodiment, the case where the suction nozzle is used as the nozzle attached to the head 15 has been described, but the present invention is not limited to this. As the nozzle mounted on the head 15, a gripping nozzle that grips an electronic component can also be used. The electronic component mounting apparatus 10 can appropriately hold the electronic component 80 by selecting the type of the nozzle that holds the electronic component 80 according to the type of the electronic component 80 to be held. Specifically, according to the electronic component 80 to be held, whether to use the suction nozzle or the gripping nozzle is selected, and further, it is possible to switch which nozzle among the types of nozzles is used. More types of electronic components 80 can be mounted with the component mounting apparatus.

  Next, nozzles (connector nozzle, electronic component transport nozzle) used for inserting the connector-type electronic component 80a will be described with reference to FIGS. The connector nozzle 150 is a nozzle used for inserting the connector-type electronic component 80a. Similarly to the nozzle 32, the connector nozzle 150 is attached to the nozzle support portion 33 of the head 15. Further, the connector nozzle 150 is held by the replacement nozzle holding mechanism 18 when not attached to the head 15.

  The connector nozzle 150 includes a base portion 152, a slide portion 154, a guide shaft 156, an arm portion 160, and an expansion / contraction adjustment mechanism 162.

  The base portion 152 is a base body of the connector nozzle 150, and is fixed to the nozzle support portion 33 when being mounted on the nozzle support portion 33. The base portion 152 includes a connecting portion 164 and a D cut portion 166. The connecting portion 164 is formed at the end on the upper side in the vertical direction while being supported by the nozzle support portion 33 of the base portion 152. The connecting part 164 is connected to the nozzle support part 33. The D-cut portion 166 is a disc lacking a part of the D-cut portion 166 protruding in the direction orthogonal to the Z-axis of the connector nozzle 150 while being supported by the nozzle support portion 33. The D cut part 166 is fixed to the base part 152. The connector nozzle 150 can identify the position of the connector nozzle 150 by detecting the position of the portion (notch portion) where the D-cut portion 166 is missing.

  The slide part 154 is disposed on each of two opposing side surfaces of the base part 152. That is, the connector nozzle 150 includes two slide portions 154, one slide portion 154 faces one of the two opposing side surfaces of the base portion 152, and one slide portion 154 includes the base portion. It faces the other surface of the two opposing side surfaces of 152. The slide part 154 is supported by the guide shaft 156 in a state of being movable with respect to the base part 152.

  The two guide shafts 156 are disposed corresponding to the two slide portions 154, respectively. The guide shaft 156 is connected to the side surface of the base portion 152 in a movable state, and is fixed to the slide portion 154. The guide shaft 156 has a predetermined direction in which the slide portion 154 is moved with respect to the base portion 152. The guide shaft portion 156 supports the slide portion 154 with respect to the base portion 152 so as to be movable in a direction perpendicular to the side surface of the base portion 152.

  The two arm portions 160 are fixed to the two slide portions 154, respectively. The arm part 160 is fixed in a detachable state by a fastening part 190 such as a bolt or a screw. The arm portion 160 is an arm-like member that extends in a direction orthogonal to the side surface of the base portion 152. In the arm part 160, the part farthest from the slide part 154 becomes the tip part 202. The tip portion 202 contacts the groove 134 of the connector type electronic component 80a.

  The arm portion 160 is provided such that the distal end portion 202 is provided on the lower side in the vertical direction than the end portion on the lower side in the vertical direction of the base portion 152. Specifically, in a state where the arm portion 160 is mounted on the nozzle support portion 33, the arm portion 160 has a lower end in the vertical direction of the tip portion 202 than the end portion of the base portion 152 on the lower side in the vertical direction. It is arranged on the lower side in the vertical direction. By providing the arm portion 160 on the lower side in the vertical direction than the base portion 152, the base portion 152 can be prevented from coming into contact with other devices or electronic components during the mounting operation of the electronic component. As a result, it is possible to mount the connector-type electronic components with high density.

  The expansion / contraction adjustment mechanism 162 is disposed between the base portion 152 and the slide portion 154, and moves the slide portion 154 with respect to the base portion 152 to change the distance from the base portion 152 to the distal end portion 202 of the arm portion 160. . The expansion / contraction adjustment mechanism 162 includes a spring portion 170 and an air pressure adjustment portion 172. The spring portion 170 is disposed on the mutually opposing surfaces of the base portion 152 and the slide portion 154, one of which is fixed to the base portion 152 and the other is fixed to the slide portion 154. The spring portion 170 applies a force indicated by an arrow 210 to the slide portion 154, that is, a force in a direction in which the base portion 152 and the slide portion 154 are separated from each other.

  The air pressure adjusting unit 172 is supplied with air pressure, so that the force on the side opposite to the spring portion 170, that is, the slide portion 154, the force indicated by the arrow 220, that is, the base portion 152 and the slide portion 154 approach each other. Apply direction force. The air pressure adjustment unit 172 includes an air pressure supply unit 180, an air flow path 182, a cylinder unit 184, and a piston unit 186. The air pressure supply unit 180 is connected to the head 15 and supplies air to the connector nozzle 150 via the nozzle support unit 33. The air pressure supply unit 180 is also used during the mounting operation of electronic components of other types of nozzles.

  The air flow path 182 is formed inside the base portion 152 and is connected to the air flow path of the nozzle support portion 33. The air flow path 182 supplies air supplied from the air flow path of the nozzle support portion 33 from the slide portion 154 side of the piston portion 186 of the cylinder portion 184. The cylinder part 184 is a cylindrical space formed inside the base part 152. The piston part 186 is disposed inside the cylinder part 184 and is connected to the guide shaft 156.

  The air pressure adjusting unit 172 applies the force indicated by the arrow 220, that is, the force in the direction in which the base portion 152 and the slide portion 154 approach each other, to the piston portion 186 of the cylinder portion 184 by supplying air pressure from the air pressure supply portion 180.

  The connector nozzle 150 is configured as described above. The connector nozzle 150 adjusts the force in the direction in which the base portion 152 and the slide portion 154 applied by the air pressure adjusting portion 172 approach each other, and adjusts the balance with the force applied from the spring portion 170, so that the slide portion 154 and the arm portion are adjusted. Adjust the position of 160. That is, by making the force of the arrow 220 applied by the air pressure adjusting unit 172 larger than the force of the arrow 210 applied by the spring portion 170, the base portion 152 and the slide portion 154 can be moved in the approaching direction. Further, by making the force of the arrow 220 applied by the air pressure adjusting unit 172 smaller than the force of the arrow 210 applied by the spring unit 170, the base unit 152 and the slide unit 154 can be moved away from each other. In this way, by moving the slide portion 154, the distance between the distal end portions 202 of the arm portion 160 fixed to the slide portion 154 can be adjusted. In the connector nozzle 150, the range of movement of the distance between the base portion 152 and the slide portion 154 is limited to a predetermined range by the guide shaft 156, specifically, by the piston portion 186. That is, by adopting a structure in which the range in which the piston portion 186 can move in the cylinder 184 is limited, the moving range of the slide portion 154 connected via the guide shaft 156 can be limited.

  Next, the operation of each part of the electronic component mounting apparatus will be described. Note that the operation of each part of the electronic component described below can be executed by controlling the operation of each part based on the control device 20.

  FIG. 12 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The overall processing operation of the electronic component mounting apparatus 10 will be described with reference to FIG. The process shown in FIG. 12 is executed by the control device 20 controlling each unit. The electronic component mounting apparatus 10 reads a production program as step S52. The production program is created by a dedicated production program creation device, or created by the control device 20 based on various input data.

  After reading the production program in step S52, the electronic component mounting apparatus 10 detects the state of the apparatus in step S54. Specifically, the configuration of the component supply units 14f and 14r, the type of electronic component being filled, the type of nozzle 32 that is prepared, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and when preparation is completed, the board 8 is carried in as step S56. The electronic component mounting apparatus 10 carries the board | substrate 8 in step S56, and if the board | substrate 8 is arrange | positioned in the position which mounts an electronic component, it will mount an electronic component in the board | substrate 8 as step S58. The electronic component mounting apparatus 10 will carry out the board | substrate 8 as step S60, if mounting of an electronic component is completed by step S58. If the electronic component mounting apparatus 10 carries the board | substrate 8 in step S60, it will determine whether production is complete | finished as step S62. If the electronic component mounting apparatus 10 determines in step S62 that the production is not finished (No), the electronic component mounting apparatus 10 proceeds to step S56 and executes the processing from step S56 to step S62. That is, processing for mounting electronic components on the board 8 is executed based on the production program. If the electronic component mounting apparatus 10 determines that the production is finished (Yes) in step S62, the electronic component mounting apparatus 10 finishes this process.

  The electronic component mounting apparatus 10 can manufacture the board on which the electronic component is mounted by loading the electronic component on the board 8 after reading the production program and performing various settings as described above. In addition, the electronic component mounting apparatus 10 mounts a lead-type electronic component having a main body and leads connected to the main body on the substrate 8 as an electronic component, specifically, a hole (insertion) formed on the substrate. The electronic component can be mounted on the substrate by inserting it into the hole).

  FIG. 13 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. Note that the processing operation shown in FIG. 13 is an operation from the loading of the substrate to the completion of the mounting of the electronic component on the substrate. Further, the processing operation shown in FIG. 13 is executed by the control unit 60 controlling the operation of each unit.

  The control part 60 carries in the board | substrate 8 as step S102. Specifically, the control unit 60 transports the substrate on which the electronic component is to be mounted to a predetermined position by the substrate transport unit 12. If the board | substrate 8 is carried in by step S102, the control part 60 will carry out holding movement as step S104. Here, the holding movement (suction movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component in the holding area of the component supply unit 14.

  After performing the holding movement in step S104, the control unit 60 lowers the nozzle 32 as step S106. That is, the control unit 60 moves the nozzle 32 downward to a position where the electronic component can be held (sucked and gripped). After lowering the nozzle 32 in step S106, the control unit 60 holds the electronic component with the nozzle 32 as step S108, and raises the nozzle 32 as step S110. When the nozzle is raised to a predetermined position in step S110, the control unit 60 performs inspection movement in step S112. Specifically, the electronic component 8 is moved to a position where the shape of the electronic component is detected. Specifically, it moves to a position facing the VCS unit 17. Depending on the type of electronic component, the position of the nozzle 32 may be moved to move the electronic component to the measurement position of the laser recognition device 38. When the control unit 60 is moved to a position where the electronic component is inspected, the control unit 60 detects the shape of the electronic component sucked by the nozzle 32 as step S114. The process of step S114 will be described later. Note that, as described above, the control unit 60 detects the shape of the electronic component in step S114, and when it is determined that the held electronic component cannot be mounted, the electronic component is discarded and the electronic component is adsorbed again.

  After detecting the shape of the electronic component in step S114, the control unit 60 moves the mounting movement, that is, moves the electronic component sucked by the nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8 in step S116. A processing operation is performed, the nozzle 32 is lowered in step S118, a component mounting (component mounting) is performed in step S120, that is, a processing operation for releasing the electronic component from the nozzle 32 is performed, and the nozzle 32 is raised in step S122. That is, the control unit 60 executes the mounting process described above by the processing operation from step S112 to step S120.

  When the nozzle 32 is raised in step S122, the control unit 60 determines in step S124 whether the mounting of all the components is complete, that is, whether the mounting process of the electronic components to be mounted on the board 8 is completed. If the control unit 60 determines in step S124 that the mounting of all the components has not been completed (No), that is, it is determined that the electronic components to be mounted remain, the process proceeds to step S104, and the next electronic component is placed on the substrate 8. Execute the processing operation to be installed. In this way, the control unit 60 repeats the above processing operation until the mounting of all components on the substrate 8 is completed. If the control unit 60 determines in step S124 that all parts have been mounted (Yes), the process ends.

  Next, when a connector-type electronic component is mounted on a substrate as an electronic component with reference to FIGS. 14 to 18, specifically, a connector-type electronic component having a connector nozzle 150 as a nozzle and a component to be inserted as a component is shown. Processing operations executed when a component is set will be described. 14 to 18 are flowcharts showing an example of the operation of the electronic component mounting apparatus. FIG. 16 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. Also, the processing operations shown in FIGS. 14 to 18 are executed by the control unit 60 controlling the operation of each unit.

  The control unit 60 determines whether to mount the connector type electronic component 80a (step S202). That is, the control unit 60 determines whether the next electronic component to be mounted includes a connector type electronic component. When it is determined that the connector-type electronic component is not mounted (No in Step S202), the control unit 60 determines whether the nozzle needs to be replaced (Step S204). When it is determined that the nozzle needs to be replaced (Yes in step S204), the control unit 60 replaces the nozzle mounted on the nozzle support unit 33 of the head 15 with the replacement nozzle holding mechanism 18 (step S206). When it is determined that the nozzle replacement is not necessary (No in step S204), or when the nozzle mounted in the nozzle support unit 33 is replaced by the replacement nozzle holding mechanism 18, the control unit 60 mounts the electronic component (step). S208). Here, Step S204 to Step S208 are the same operations as the operations executed when mounting electronic components other than the connector type electronic components.

  When it is determined that the connector-type electronic component 80a is to be mounted (Yes in Step S202), the control unit 60 determines whether the connector nozzle 150 has been mounted (Step S212). That is, it is determined whether the connector nozzle 150 is attached to the nozzle support portion 33 of the head 15. If the controller 60 determines that the connector nozzle 150 is not attached (No in step S212), the nozzle for the connector attached to the nozzle support part 33 of the head 15 is held by the replacement nozzle holding mechanism 18. It replaces with 150 (step S214). When it is determined that the nozzle has been replaced (Yes in step S212), or when the nozzle mounted in the nozzle support unit 33 is replaced, the control unit 60 mounts the connector-type electronic component 80a using the connector nozzle 150. (Step S216).

  Next, the operation of mounting the connector-type electronic component 80a using the connector nozzle 150 will be described with reference to FIG. The control unit 60 supplies air to contract the arm unit 160 (step S220). Specifically, by supplying air from the air pressure supply unit 180, the piston unit 186 is urged toward the center of the base unit 152, and the slide unit 154 and the arm unit 160 are moved toward the base unit 152. The electronic component mounting apparatus 10 shrinks the arm portion 160 so that the distance between the distal end portions 202 of the arm portion 160 is narrower than the interval between the grooves 134 of the connector-type electronic component 80a.

  When the arm unit 160 is contracted, the control unit 60 moves to the holding position of the electronic component supply device (component supply unit 14r) (step S222). That is, the control unit 60 moves the connector nozzle 150 mounted on the head 15 to a position where the connector type electronic component 80a of the component supply unit 14r is placed. Here, as shown in FIG. 16, the control unit 60 moves the connector nozzle 150 attached to the head 15 to a position where the line connecting the distal end portion 202 and the line connecting the groove 134 overlap. The control unit 60 further moves the connector nozzle 150 downward in the vertical direction so that the distal end portion 202 and the groove 134 face each other.

  When the control unit 60 moves the connector nozzle 150 to the holding position of the electronic component supply device, the control unit 60 stops supplying air, extends the arm unit 160, and holds the connector-type electronic component 80a with the connector nozzle 150 (step S224). ). That is, the supply of air is stopped, the arm portion 160 is extended in the direction in which the distance between the tip portions 202 is increased by the force of the spring portion 170, the groove 134 and the tip portion 202 are brought into contact, and the tip portion 202 is further moved into the groove 134. The connector-type electronic component 80a is held by the connector nozzle 150 by urging in the pressing direction.

  After holding the electronic component with the nozzle, the control unit 60 moves the electronic component to the mounting position of the substrate and mounts the electronic component on the substrate (step S226). That is, the lead wire 124 of the connector type electronic component 80a is inserted into the hole of the board. At this time, the control unit 60 preferably moves the connector nozzle 150 by a predetermined distance to the vertical direction side from the mounting position of the connector-type electronic component 80a. As a result, the connector-type electronic component 80a can be pressed against the substrate, and the connector-type electronic component 80a can be more reliably mounted on the substrate.

  When the electronic component is mounted on the substrate, the control unit 60 supplies air and contracts the arm unit 160 to detach the electronic component from the nozzle (step S228). That is, the distance between the tip portions 202 is made shorter than the distance between the grooves 134 so that the tip portion 202 and the groove 134 are separated.

  Next, it is a flowchart which shows an example of operation | movement of an electronic component mounting apparatus using FIG. The process shown in FIG. 17 is executed during the nozzle replacement process in step S214 of FIG. The control unit 60 moves to a position where the laser recognition device 38 and the D cut unit 166 face each other (step S302), and the laser recognition device 38 recognizes the shape of the D cut unit 166 (step S304). Precisely, the control unit 60 recognizes the shape of the position where the D-cut unit 166 is assumed. Note that the control unit 60 measures the shape by irradiating the laser recognition device 38 while rotating the nozzle support unit 33 on which the connector nozzle 150 is mounted by a predetermined angle, thereby providing the D-cut unit 166. Measure the outer shape of the assumed position. The laser recognizing device 38 measures the outer shape by measuring and superposing the positions of the end portions at the respective positions. When recognizing the shape of the D-cut unit 166, the control unit 60 determines whether the D-cut unit 166 has been successfully recognized (step S306). The control unit 60 determines whether the D-cut unit 166 has been successfully recognized based on whether or not there is a member having an allowable width at a position where the D-cut unit 166 is located.

  When it is determined that the D-cut unit 166 has been successfully recognized (Yes in step S306), the control unit 60 determines that the connector nozzle 150 has been successfully mounted (step S308). When it is determined that the recognition of the D-cut unit 166 has failed (No in step S306), the control unit 60 determines that the nozzle is unsuccessful and outputs a nozzle removal instruction (step S309). Further, when the control unit 60 succeeds in recognizing the shape of the D-cut unit 166, the controller 60 identifies the angle of the connector nozzle 150 based on the position of the D-cut unit 166, and based on the identified result, the connector nozzle 150 positions around the Z-axis may be determined.

  Next, a processing operation when the nozzle is moved will be described with reference to FIG. Note that the processing in FIG. 18 may be executed during teaching for setting the operation or during actual mounting operation. The controller 60 determines whether there is an instruction to raise the Z axis (step S312). The Z-axis ascending instruction is an instruction to move the nozzle upward in the Z-axis direction (upward in the vertical direction). When it is determined that there is an instruction to raise the Z axis (Yes in step S312), the control unit 60 determines whether the connector nozzle 150 is attached (step S314). When it is determined that the connector nozzle 150 is attached (Yes in step S314), the control unit 60 determines whether the height in the Z-axis direction exceeds the threshold (step S316). The threshold value for the height in the Z-axis direction is a preset value. In the Z-axis direction, the height of the connector nozzle 150 is lower than the height at which the connector nozzle 150 is in contact with other components of the head 15. The height is set so as not to be raised any further because there is a risk of contact with other parts. When it is determined that the height in the Z-axis direction exceeds the threshold (Yes in step S316), the control unit 60 determines that the movement is impossible and outputs an error (step S318).

  If the control unit 60 determines that there is no Z-axis ascending instruction (No in step S312), it determines that the connector nozzle 150 is not attached (No in step S314), the height in the Z-axis direction is When it is determined that the threshold value is not exceeded (No in step S316), the axis movement operation is executed (step S319).

  The electronic component mounting apparatus 10 performs the above processing, attaches the connector nozzle 150, and in the case of an instruction to move the connector nozzle 150 to a position that exceeds the threshold of the movable position on the upper side in the vertical direction, By not moving the nozzle 150 for the connector, the connector nozzle 150 can be prevented from coming into contact with other components of the head 15 even when the connector nozzle 150 is attached. Thereby, even when the electronic component mounting apparatus 10 uses the nozzle 150 for connectors with the wide width | variety used for mounting of the connector type electronic component 80a, it can suppress that a nozzle contacts a head. Thereby, it becomes possible to mount the connector-type electronic component 80a while suppressing the failure of the device, and the number of types of electronic components that can be mounted by the electronic component mounting apparatus 10 can be increased.

  Further, in the electronic component mounting apparatus 10, the tip end portion 202 is inserted into the groove 134 formed on the surface facing the center side of the connector type electronic component 80a, and the arm portion 160 faces the center side of the connector type electronic component 80a. By urging it toward the surface, the connector-type electronic component 80a can be held. Thereby, the electronic component mounting apparatus 10 can mount the connector-type electronic component 80 a on the substrate 8 using the connector nozzle 150. As described above, the connector-type electronic component 80a can be mounted on the substrate 8 by using the connector nozzle 150, so that the connector-type electronic component 80a can also be mounted by the electronic component mounting apparatus 10 for mounting various electronic components. Thereby, the number of electronic components that can be mounted by the electronic component mounting apparatus 10 can be increased only by replacing the nozzles.

  In addition, the expansion / contraction adjustment mechanism 162 of the electronic component mounting apparatus 10 adjusts the air pressure by the spring portion 170 that urges the base portion 152 and the slide portion 154 in a direction away from each other as in the present embodiment, thereby adjusting the base portion 152. By combining the air pressure adjusting unit 172 that biases the slide unit 154 in the direction in which the slide unit 154 approaches, the arm unit 160 can be suitably moved.

  In addition, the air pressure adjusting unit 172 of the present embodiment urges the base portion 152 and the slide portion 154 to approach each other by supplying air, that is, by supplying positive pressure, but sucks air. That is, by supplying a negative pressure, the base portion 152 and the slide portion 154 may be urged in the approaching direction. When air is sucked, an opening for supplying air from the air pressure supply unit 180 to the cylinder unit 184 is supplied to the surface of the piston unit 186 far from the slider unit 154.

  In addition, the expansion / contraction adjustment mechanism 162 of the electronic component mounting apparatus 10 includes a spring portion 170 that urges the base portion 152 and the slide portion 154 to approach each other, and a base portion 152 and the slide portion 154 that are adjusted by adjusting the air pressure. The arm unit 160 can also be suitably moved by combining with the air pressure adjusting unit 172 that urges in the away direction. Also in this case, the air pressure adjusting unit 172 sucks air by supplying air, that is, by supplying positive pressure, even if the base portion 152 and the slide portion 154 are urged away from each other. In other words, by supplying a negative pressure, the base portion 152 and the slide portion 154 may be urged away from each other.

  Further, the expansion / contraction adjustment mechanism 162 may move the arm portion 160 by a combination other than the spring and the air pressure.

  In addition, the connector nozzle 150 can be replaced by providing the fastening portion 190 and making the arm portion 160 detachable from the slide portion 154. Thereby, the arm part 160 can be replaced | exchanged according to the connector type electronic component 80a to mount, and units, such as one base part 152 and the slide part 154, can be utilized effectively.

  Moreover, in the said embodiment, the movement amount can be increased by providing the slide part 154 in both the base parts 152, and setting it as the mechanism which moves both. The structure of the connector nozzle 150 is not limited to this. The slide portion 154 may be provided on one side of the base portion 152, and the other may be a fixed arm portion 160.

  Moreover, although the said effect can be acquired by using the nozzle 150 for connectors of this embodiment, you may hold | maintain and convey the connector type | mold electronic component 80a using the nozzle of another structure.

  Next, an example of a treatment operation when mounting the connector-type electronic component 80a using the connector nozzle 150 will be described in more detail with reference to FIGS. FIG. 19 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 20 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus.

  The control unit 60 holds the connector-type electronic component 80a with the connector nozzle 150 (step S320). When holding the connector type electronic component 80a, the control unit 60 determines whether the mounting angle of the connector type electronic component 80a is 90 degrees or 270 degrees (step S322). Here, the mounting angle is such that the longitudinal direction of the connector-type electronic component 80a is parallel to the nozzle arrangement direction, that is, as shown in FIG. 20, the extending direction of the laser recognition device 38 and the connector-type electronic component 80a. The direction in which the longitudinal direction is parallel is 0 degree or 180 degrees.

  When it is determined that the mounting angle is not 90 degrees or 270 degrees, that is, the mounting angle is 0 degrees or 180 degrees (No in step S322), the control unit 60 rotates the mounting angle (step S324). When determining that the mounting angle is 90 degrees or 270 degrees (Yes in step S322), the control unit 60 rotates the connector-type electronic component 80a to the mounting angle +90 degrees (step S326). That is, the control unit 60 may be 180 degrees different in direction, but the longitudinal direction of the connector type electronic component 80a is the same as the nozzle arrangement direction as shown in FIG. Rotate to be parallel.

  After performing the process of step S324 or S326, the control unit 60 performs a vision recognition process (step S328). The vision recognition process is a process for detecting the position of the lead wire of the connector type electronic component 80a. The vision recognition process will be described later.

  After performing the vision recognition process, the control unit 60 determines whether the mounting angle of the connector-type electronic component 80a is 90 degrees or 270 degrees (step S330). When determining that the mounting angle is 90 degrees or 270 degrees (Yes in step S330), the control unit 60 rotates the connector-type electronic component 80a to the mounting angle of −90 degrees (step S332).

  When the control unit 60 determines that the mounting angle is not 90 degrees or 270 degrees, that is, the mounting angle is 0 degrees or 180 degrees (No in step S330), or when the process of step S332 is performed, the insertion position The connector type electronic component 80a is moved to (step S334), and the connector type electronic component 80a is mounted on the substrate 8 (step S336). The control unit 60 corrects the position based on the result of the vision recognition process when the connector-type electronic component 80a is mounted on the substrate 8. This point will be described later.

  Next, vision recognition processing will be described with reference to FIGS. FIG. 21 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 21 shows the shape of the connector-type electronic component, specifically the movement of the connector-type electronic component when measuring the lead wire, specifically, an example of the operation of the nozzle and head that hold the connector-type electronic component. Yes. The process shown in FIG. 21 can be realized by controlling the operation by each unit, particularly the head control unit 62, by the control unit 60. In addition, the control unit 60 prepares a creation condition stored in the storage unit 61 based on the type of connector-type electronic component held in the nozzle, and performs processing based on the creation condition.

  The control unit 60 moves the connector type electronic component onto the VCS unit 17 (step S350). Specifically, the control unit 60 moves the head 15 in the XY axis direction by the XY moving mechanism 16 and moves the connector-type electronic component held by the nozzle onto the VCS unit 17. This process is the same as step S312 of the process shown in FIG.

  The controller 60 moves the connector type electronic component to the Z start position after moving the connector type electronic component to the position facing the VCS unit 17 (step S352). The Z start position is a position in the Z-axis direction where measurement of a connector-type electronic component (creation of a composite image) is started. The Z start position may be included as one of the creation conditions, or may be the same position. That is, the position in the Z-axis direction of the connector-type electronic component is adjusted by adjusting the position of the nozzle 32 in the Z-axis direction by the nozzle driving unit 34.

  Next, the control unit 60 issues an imaging command to the VCS unit 17 via the image processing unit 66 (step S354). The imaging command includes an instruction to execute an operation for acquiring an image by the VCS unit 17. When issuing the imaging command, the control unit 60 determines whether there is a response from the VCS unit 17, that is, information indicating that the imaging has been performed (step S356). When it is determined that there is no response response (No in step S356), the control unit 60 returns to step S356. That is, the control unit 60 repeats the process of step S356 until a response response is detected.

  When determining that there is a response (Yes in step S356), the control unit 60 lowers the connector-type electronic component in the Z-axis direction (step S358). Here, the movement distance in the Z-axis direction is a distance set in the creation condition. That is, the control unit 60 adjusts the position of the nozzle 32 in the Z-axis direction with the nozzle driving unit 34 to bring the connector-type electronic component closer to the VCS unit 17 by a predetermined distance.

  When the control unit 60 lowers the connector-type electronic component in the Z-axis direction, the control unit 60 issues an imaging command to the VCS unit 17 via the image processing unit 66 (step S360). The imaging command includes an instruction to execute an operation for acquiring an image by the VCS unit 17. When issuing the imaging command, the control unit 60 determines whether there is a response from the VCS unit 17, that is, information indicating that the imaging has been executed (step S362). When it is determined that there is no response response (No in step S362), the control unit 60 returns to step S362.

  If it is determined that there is a response (Yes in step S362), the control unit 60 determines whether it is the last recognition, that is, whether the necessary number of images has been acquired (step S364).

  If the control unit 60 determines that it is not the last recognition (No in step S364), the control unit 60 returns to step S358 and performs the processing from step S358 to step S364 again. When it is determined that the control unit 60 is the last recognition (Yes in Step S364), the control unit 60 moves to a movable height (Step S366). That is, the nozzle 32 and the connector-type electronic component are raised in the Z-axis direction to a position where the head 15 can be moved in the XY-axis direction. As described above, the control unit 60 moves the position of the connector-type electronic component when taking an image.

  FIG. 22 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The process shown in FIG. 22 is a process executed by the image processing unit 66 and the VCS unit 17 by the control unit 60 corresponding to the process of FIG. Hereinafter, the processing of the image processing unit 66 will be described.

  The image processing unit 66 determines whether an imaging command has been detected (step S370). If the image processing unit 66 determines that an imaging command has not been detected (No in step S370), the process returns to step S370. The image processing unit 66 repeats the determination in step S370 until an imaging command is detected.

  If the image processing unit 66 determines that an imaging command has been detected (Yes in step S370), the image is captured by the VCS unit 17 to acquire an image (step S372), and a response response is output to the control unit 60 (step). S374). That is, the image processing unit 66 captures an image of the surface side where the lead of the connector-type electronic component is disposed, and outputs a response response indicating that the image has been captured.

  When outputting the response response, the image processing unit 66 determines whether shooting has been completed, that is, whether shooting at each position of the target connector-type electronic component has been completed (step S376). If the image processing unit 66 determines that shooting has not been completed (No in step S376), the process returns to step S370.

  If the image processing unit 66 determines that shooting has been completed (Yes in step S376), the image processing unit 66 generates a composite image (step S378). Hereinafter, a process of acquiring a composite image obtained by combining a plurality of images having different distances between the VCS unit 17 and the connector-type electronic component will be described with reference to FIG. FIG. 23 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. As shown in FIG. 23, the image processing unit 66 has different coordinates in the Z-axis direction, for example, Z = 1.00, 0.50, 0.00, −0.50, and −1.00. Five images 100a, 100b, 100c, 100d, and 100e are acquired. Here, Z is the difference from the reference distance 0 between the VCS unit 17 and the connector-type electronic component. The image processing unit 66 performs binarization processing on the image captured by the VCS unit 17 using a primary filter and a secondary filter in a state in which the lead wire is easy to understand, so that the lead wire and other portions are separated. To separate. As a result, in the images 100a, 100b, 100c, 100d, and 100e, the lead wires 102a, 102b, 102c, 102d, and 102e are white, and the other portions are black. The image processing unit 66 combines the images 100a, 100b, 100c, 100d, and 100e to generate the image 106. The image 106 is an image in which the lead wire 108 can be specified more clearly. Although the target to be extracted is different, the process of extracting a specific part image from a plurality of images is the same as that of JP 2012-23340 A, and a process using a primary filter and a secondary filter, The value processing and image composition processing can be performed by the same processing.

  After generating the composite image, the image processing unit 66 calculates a correction value based on the composite image (step S380). Specifically, based on the position of the lead wire detected in the composite image, a deviation between the design data, the reference data such as the shape of the component, and the position of the lead wire of the actual connector type electronic component is detected. Thus, correction values for the position of the head in the XY axis direction and the position of the nozzle in the θ direction at the time of mounting are calculated. After calculating the correction value, the image processing unit 66 outputs a recognition response (step S382).

  FIG. 24 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. 22 shows an example of processing operations of the control unit 60 and the head 15 after performing the processing of FIG. The control unit 60 determines whether there is a recognition response (step S390). When it is determined that there is no recognition response (No in step S390), the control unit 60 returns to step S390.

  If it is determined that there is a recognition response (Yes in step S390), the control unit 60 corrects the mounting position (step S392), and inserts the connector-type electronic component into the board 8 (step S394). That is, the position where the connector type electronic component is inserted is corrected in the XY axis direction and the θ direction based on the correction value calculated based on the composite image, and the connector type electronic component is mounted on the substrate 8 at the corrected position.

  Further, the electronic component mounting apparatus 10 detects the position of the lead using the vision recognition process described above, detects the posture and position of the connector-type electronic component 80a based on the detected position of the lead, and the result Based on this, the connector type electronic component 80a can be mounted at an appropriate position by correcting the position, and the connector type electronic component 80a can be mounted with higher accuracy.

  Further, before the vision processing, the posture of the connector type electronic component 80a is controlled, and the longitudinal direction of the connector type electronic component 80a and the nozzle arrangement direction are made parallel so that the nozzle moves up and down the connector type electronic component 80a. The region can be arranged on the lower side in the vertical direction between the light emitting unit 38a and the light receiving unit 38b of the laser recognition device 38. Thereby, when the connector-type electronic component 80a is moved up and down, the possibility that the connector-type electronic component 80 contacts the head 15 can be reduced.

  As described above, the electronic component mounting apparatus 10 uses the VCS unit 17 disposed on the lower side in the vertical direction (board side) of the nozzle that holds the connector-type electronic component in the vision recognition process, and uses the VCS unit 17 and the connector. The lead wire in the image from the direction in which the connector-type electronic component is inserted by creating a plurality of images while extracting the lead wire while changing the distance in the Z-axis direction with the mold-type electronic component Can be detected with high accuracy. Further, even when the lead wires are irregularly arranged or have a complicated shape, the state of each lead wire can be detected. That is, the mounting apparatus 10 acquires the position of the lead wire based on the image taken from the lead wire side of the connector-type electronic component, so that each of the lead wires that are two-dimensionally arranged, that is, other than the shape of the outer periphery The position of the lead wire can also be detected.

  Thereby, the position of the lead wire can be detected with high accuracy by detecting the position of the lead wire by the above-described processing. In addition, the electronic component mounting apparatus 10 detects the coordinates of the position where the lead wire first contacts the substrate by detecting the shape of the lead wire based on the image taken from the lead wire side of the connector-type electronic component. be able to. As a result, it is possible to detect a position serving as a reference for whether or not insertion is possible. Further, by correcting the mounting position based on the result and mounting the connector-type electronic component on the substrate, the connector-type electronic component can be inserted into the substrate with a high probability. In addition, since the position of the lead wire can be accurately detected, it can be detected with higher accuracy whether or not it can be mounted, and it is possible to suppress pressing of a connector-type electronic component that cannot be mounted on the substrate.

  Other processes of the electronic component mounting apparatus 10 will be described with reference to FIG. FIG. 25 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 25 is a process executed in place of the vision recognition process in step S328 of FIG. The controller 60 determines the Z-axis motion during vision recognition (step S402). If it is determined that the Z-axis motion is during vision recognition (Yes in step S402), the controller 60 determines whether the recognition angle is 0 degrees or 180 degrees (step S404). That is, the control unit 60 determines whether the longitudinal direction of the connector-type electronic component 80a is parallel to the nozzle arrangement direction.

  When it is determined that the recognition angle is 0 degree or 180 degrees (Yes in step S404), the control unit 60 increases the height threshold (step S406). That is, the control unit 60 sets the threshold value of the height in step S316 in FIG. 18 to a higher value so that the connector-type electronic component 80a can be moved further upward in the vertical direction.

  When it is determined that the Z-axis motion is not recognized during vision recognition (No in step S402), the control unit 60 determines that the recognition angle is not 0 degree or 180 degrees (No in step S404), or step S406. When the above process is performed, the vision recognition process is performed (step S408).

  After performing the vision recognition process, the control unit 60 restores the threshold value (step S410). Here, when the process of step S406 is not performed, the threshold value remains unchanged.

  When the electronic component mounting apparatus 10 performs the process shown in FIG. 25 and performs the vision recognition process, and when the longitudinal direction of the connector-type electronic component 80a and the nozzle arrangement direction are parallel, By setting the threshold value to a higher value, it is possible to increase the number of images that can be captured by the vision recognition process, and to measure the position of the lead wire with higher accuracy. Further, when the above condition is satisfied, the height threshold value is set to a higher value and returned to the original threshold value after the processing is completed, so that the connector nozzle 150 is prevented from contacting other parts of the head 15. However, the position of the lead wire can be measured with higher accuracy.

  Other processes of the electronic component mounting apparatus 10 will be described with reference to FIGS. 26 and 27. FIG. 26 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 27 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. When the connector-type electronic component is larger than the field of view of the VCS unit 17, the electronic component mounting apparatus 10 cannot recognize the shape of the entire area of the connector-type electronic component by a single vision recognition process. On the other hand, as shown in FIG. 27, the electronic component mounting apparatus 10 shifts the imaging regions 302a, 302b, 302c, 302d, and 302e where the vision recognition processing is executed with respect to the connector-type electronic component 80a, thereby The position and shape of the lead wire of the connector-type electronic component 80a can be detected by executing the vision recognition process for the first time.

  Hereinafter, an example of processing will be described with reference to FIG. The control unit 60 determines the vision recognition position of the connector component (connector type electronic component) (step S422). After determining the recognition position, the control unit 60 executes a vision recognition process at the determined position (step S424). The control unit 60 determines whether the vision recognition for all positions has been completed (step S426). If it is determined that the vision recognition of all positions has not been completed (No in step S426), the control unit 60 returns to step S422, determines a different position as the vision recognition position, and performs a vision recognition process.

  When it is determined that the vision recognition of all positions has been completed (Yes in step S426), the control unit 60 combines the results of a plurality of recognition processes and calculates a correction value based on the results (step S428).

  The electronic component mounting apparatus 10 can detect the position and shape of the connector-type electronic component 80a more accurately by recognizing the vision of the entire region of the connector-type electronic component 80a.

  Other processes of the electronic component mounting apparatus 10 will be described with reference to FIGS. FIG. 28 is an explanatory diagram for explaining the operation of the electronic component mounting apparatus. FIG. 29 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. As shown in FIG. 28, the electronic component mounting apparatus 10 sets imaging regions 312 and 314 for executing the vision recognition processing for both ends of the connector-type electronic component 80a, and executes the vision recognition processing twice. However, the position and shape of the lead wire of the connector-type electronic component 80a can be detected. In this case, the reference line 316 extending in the longitudinal direction of the connector type electronic component 80a and the center position 318 of the connector type electronic component 80a are detected based on the respective results of the imaging regions 312 and 314. By detecting the reference line 316, the inclination of the connector-type electronic component 80a can be detected.

  Hereinafter, an example of processing will be described with reference to FIG. The control unit 60 determines one end of the connector component (connector type electronic component) as a vision recognition position (step S430). After determining the recognition position, the control unit 60 executes a vision recognition process at the determined position (step S432). Next, the control unit 60 determines the other end of the connector component (connector type electronic component) as a vision recognition position (step S434). After determining the recognition position, the control unit 60 executes a vision recognition process for the determined position (step S436). When the controller 60 recognizes the two visions, the controller 60 synthesizes the results of the two recognition processes and calculates a correction value based on the result (step S438).

  As shown in FIGS. 28 and 29, the electronic component mounting apparatus 10 performs vision recognition processing only on both ends in the longitudinal direction of the connector-type electronic component 80a, thereby reducing the amount of vision recognition processing. Can do. By reducing the amount of processing, it is possible to improve the production efficiency by shortening the time required for the mounting process. Moreover, the inclination of the connector type electronic component 80a can be detected at a higher angle by detecting the positions of both ends in the longitudinal direction of the connector type electronic component 80a. Thereby, the accuracy of the correction value can be further increased.

  8 substrate, 10 electronic component mounting apparatus, 11 housing, 12 substrate transport unit, 14, 14f, 14r component supply unit, 15 head, 16 XY moving mechanism, 17 VCS unit, 18 replacement nozzle holding mechanism, 19 component storage unit, 20 Controller, 22, 22f, 22r X-axis drive unit, 24 Y-axis drive unit, 30 Head body, 31 Head support, 32 Nozzle, 33 Nozzle support unit, 34 Nozzle drive unit, 34a Z-axis motor, 38 Laser recognition Device, 40 operation unit, 42 display unit, 60 control unit, 61 storage unit, 62 head control unit, 64 component supply control unit, 66 image processing unit, 80 electronic component, 80a connector type electronic component, 90, 90a electronic component supply Device, 96 support base, 98 tray, 110 base part, 112 latch part, 122 insertion part, 124 lead Wire, 130 fixed part, 132 movable part, 134 groove, 150 connector nozzle, 152 base part, 154 slide part, 156 guide shaft, 160 arm part (gripping claw), 162 expansion / contraction adjustment mechanism, 164 connection part, 166 D cut Part, 170 spring part, 172 air pressure adjustment part, 180 air pressure supply part, 182 air flow path, 184 cylinder part, 186 piston part, 190 fastening part, 202 tip part

Claims (6)

A substrate transport section for transporting the substrate;
An electronic component supply device for supplying a connector-type electronic component having an insertion portion into which a lead wire and a plate-like member are inserted;
An electronic component supply device having an electronic component transfer nozzle for holding the connector type electronic component and a nozzle driving unit for driving the electronic component transfer nozzle, holding the connector type electronic component by the electronic component transfer nozzle A head for transferring the connector-type electronic component to the board,
A head moving mechanism for moving the head;
A control device including a head control unit that controls the operation of the head,
The head can replace the nozzle driven by the nozzle driving unit with the electronic component transport nozzle and a nozzle other than the electronic component transport nozzle,
Said control device, said mounting electronic components conveying nozzle in the vertical direction of the electronic component conveying nozzle, when an instruction to move to a position beyond the threshold of the movable position in the vertical way improving side, the electronic component conveying nozzle Do not move ,
An electronic component mounting apparatus that sets a vertically movable range of the electronic component transport nozzle in accordance with a posture of the electronic component transport nozzle . An image recognition device that is disposed within a range in which the head moves, and photographs the nozzle from the substrate side;
The control device includes an image processing unit that processes an image captured by the image recognition device,
The control device moves the nozzle to a position facing the image recognition device in a state where the connector type electronic component is held by the nozzle of the head, so that the connector type electronic component and the image recognition device Photographing with the image recognition device while changing the distance, obtaining images of the surface on the lead wire side of the connector-type electronic component at a plurality of positions having different distances, and obtaining a plurality of images obtained by the image processing unit The position of the lead wire is specified based on the combined image, the mounting position of the connector-type electronic component is determined based on the specified position of the lead wire, and the connector is determined based on the determined position. The electronic component mounting apparatus according to claim 1, wherein a mold electronic component is mounted on the substrate. The control device performs photographing with the image recognition device while changing the distance between the connector type electronic component and the image recognition device only at both ends in the longitudinal direction of the connector type electronic component, and determines the position of the lead wire. The electronic component mounting apparatus according to claim 2 , wherein the mounting position is determined based on the detected result. In the head, the nozzle driving units are arranged in a row in a predetermined direction,
The control device arranges the electronic component transport nozzle in a direction parallel to the predetermined direction, and performs photographing with the image recognition device while changing a distance between the connector-type electronic component and the image recognition device. The electronic component mounting apparatus according to claim 2 or 3 , characterized by the above. When the control device arranges the electronic component transport nozzle in a direction parallel to the predetermined direction and performs photographing with the image recognition device while changing a distance between the connector-type electronic component and the image recognition device. 5. The electronic component mounting apparatus according to claim 4 , wherein a threshold value of the movable position on the upper side in the vertical direction is changed to a height on the upper side in the vertical direction. The electronic component transport nozzle is connected to the head of the electronic component mounting apparatus, a guide shaft connected to a side surface of the base portion, and connected to the guide shaft, and is movable relative to the base portion. A sliding part, an arm part fixed to the sliding part and provided with a tip part in contact with the connector-type electronic component at a tip part farthest from the sliding part, and between the base part and the sliding part An expansion / contraction adjustment mechanism that is arranged and moves the slide part relative to the base part to change a distance from the base part to the tip part,
By inserting the tip portion into a groove formed on the surface facing the center side of the connector-type electronic component, and urging the arm portion toward the surface facing the center side of the connector-type electronic component, electronic component mounting apparatus according to any one of claims 1 to 5, characterized in that for holding the connector-type electronic component.