JP2013222771A - Holding nozzle and electronic component mounting apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a holding nozzle which stably mounts a lead component on a substrate and an electronic component mounting apparatus.SOLUTION: A holding nozzle comprises: a cylinder to or from which air is supplied or exhausted; a piston disposed in the cylinder and reciprocating; a movable piece connected with the piston and holding and releasing the lead component in conjunction with the reciprocating movement of the piston; a holding spring providing a force to the movable piece in a direction that the movable piece holds the lead component; a fixed piece contacting with the movable piece and holding the lead component; a pressing spring provided in the fixed piece; and a pressing part contacting with the lead component and pressing the lead component into the substrate using a pressing force of the pressing spring.

Description

  The present invention relates to a gripping nozzle for gripping a lead component and an electronic component mounting apparatus including the gripping nozzle.

  An electronic component mounting apparatus such as a chip mounter for mounting electronic components on a substrate mounts various types of electronic components such as chips and ICs on the substrate by exchanging a plurality of types of suction nozzles. An electronic component (for example, a lead component) that cannot be adsorbed by an adsorbing nozzle that adsorbs an electronic component by using negative pressure is mounted on a substrate using a holding nozzle that mechanically holds the electronic component. As a method for sandwiching an electronic component when mounting the electronic component, for example, there is a technique described in Patent Document 1.

Japanese Patent Laid-Open No. 11-068390

  In the technique described in Patent Document 1, when lead parts such as axial parts and radial parts are mounted, if the leads are gripped in order to stabilize the mounting accuracy, there is a possibility that the leads cannot be inserted more than a certain amount. As a result, the mounted lead component may become unstable or a mounting error may be caused, which may reduce the production efficiency of the board.

  An object of the present invention is to provide a gripping nozzle and an electronic component mounting apparatus capable of stably mounting lead components on a substrate.

  The present invention grips a lead component and inserts a lead into a substrate, and is connected to the piston, a cylindrical cylinder to which air is supplied or discharged, a piston that is disposed in the cylinder and reciprocates, and A movable piece capable of gripping and releasing the lead of the lead component in conjunction with the reciprocating motion of the piston, and a gripping spring for applying a force in a direction in which the movable piece grips the lead to the movable piece A fixed piece that comes into contact with the movable piece and grips the lead, a pushing spring provided on the fixed piece, and a contact with the lead part, and the lead part is pressed by the pushing force of the pushing spring. A gripping nozzle including a push-in portion that pushes into a substrate.

  In the present invention, it is preferable to have a guide that is coupled to the pushing portion, moves in a direction parallel to the direction in which the piston reciprocates together with the pushing portion, and has an engaging portion with the fixed piece.

In the present invention,
Preferably, the movable piece includes a first groove provided at a location where the lead of the lead component is gripped and a second groove provided at a location where the lead of the fixed piece grips the lead of the lead component.

  The present invention provides an electronic component supply device that supplies an electronic component to a holding region, a gripping nozzle that grips an electronic component that is supplied from the electronic component supply device to the holding region, and a vertical drive and rotation of the gripping nozzle. A head main body having a nozzle driving section for driving and supplying air pressure for driving the gripping nozzle to the gripping nozzle; a head support for supporting the gripping nozzle and the nozzle driving section; and a head for moving the head main body. An electronic component mounting apparatus including a moving mechanism.

  The present invention can provide a gripping nozzle and an electronic component mounting apparatus capable of stably mounting lead components on a substrate.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a perspective view showing a schematic configuration of the electronic component mounting apparatus. FIG. 3 is a schematic diagram showing a schematic configuration of the electronic component mounting apparatus. FIG. 4 is an explanatory diagram of the component supply unit. FIG. 5 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 6 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 7 is a diagram illustrating a gripping nozzle according to the present embodiment. FIG. 8 is a diagram illustrating a gripping nozzle according to the present embodiment. FIG. 9 is a diagram illustrating a movable piece and a fixed piece of the gripping nozzle according to the present embodiment. FIG. 10 is a diagram illustrating a state where the gripping nozzle according to the present embodiment has opened the lead component.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  Hereinafter, embodiments of an electronic component mounting apparatus, an electronic component mounting system, and an electronic component mounting method according to the present invention will be described in detail with reference to the drawings.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a VCS unit 17, a replacement nozzle holding mechanism 18, and a component storage. The unit 19, the control device 20, the operation unit 40, and the display unit 42 are included. The XY movement mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. Here, as shown in FIG. 1, the electronic component mounting apparatus 10 according to the present embodiment includes component supply units 14 f and 14 r on the front side and the rear side with the board conveyance unit 12 as the center. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  FIG. 2 is a perspective view illustrating a schematic configuration of a housing of the electronic component mounting apparatus. In FIG. 2, the component supply units 14f and 14r are not shown for easy understanding of the housing 11. As shown in FIG. 2, the housing 11 includes a main body 11a and covers 11bf and 11br. The main body 11 a is a box that accommodates each part constituting the electronic component mounting apparatus 10. The main body 11a includes a cover 11bf, a front-side component supply unit 14f, an operation unit 40, and a display unit 42 on the front side, and a cover 11br on the rear side. The main body 11a is formed with two openings 11c on two side surfaces for carrying the substrate 8 into the apparatus and discharging it. The operation unit 40 of this embodiment includes a keyboard 40a and a mouse 40b. The display unit 42 of this embodiment includes a touch panel 42a and a vision monitor 42b. The touch panel 42a also serves as a part of the operation unit 40.

  The cover 11bf is an enclosure provided in a part on the front side of the main body 11a, and is disposed on the upper side in the vertical direction. The cover 11br is an enclosure provided in a part on the rear side of the main body 11a, and is disposed on the upper side in the vertical direction. The covers 11bf and 11br are shaped to cover a part of the front surface or the back surface and a part of the upper surface of the main body 11a, and have a cross section of L. The covers 11bf and 11br can be opened and closed with respect to the main body 11a. When the covers 11bf and 11br are in the open state, it is possible to perform operations on the respective parts disposed inside the main body 11a. The covers 11bf and 11br have their upper ends connected to the main body 11a, and rotate with the connecting portion as a fulcrum.

  FIG. 3 is a schematic diagram showing a schematic configuration of the electronic component mounting apparatus. Hereinafter, the electronic component mounting apparatus 10 will be described with reference to FIG. 3 in addition to FIG. 1. The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. The substrate 8 is also formed with through holes (insertion holes, substrate holes) into which electronic components are inserted.

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at the predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f and the rear-side component supply unit 14r each hold a large number of electronic components mounted on the substrate 8 and can supply them to the head 15, that is, they can be held (sucked or gripped) by the head 15. The electronic component supply apparatus which supplies to a holding position in a state is provided. The component supply units 14f and 14 of the present embodiment have the same configuration and include a plurality of electronic component supply devices. The electronic component supply device supplies the electronic component to a holding position where the head 15 holds the electronic component. Hereinafter, the configuration of the component supply unit 14 will be described.

  FIG. 4 is an explanatory diagram of the component supply unit. As shown in FIG. 4, the component supply unit 14 includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 70 and a plurality of electronic component supply devices 70 a. A plurality of component supply apparatuses 70 and 70 a shown in FIG. 5 are held by a support base (bank) 72. Further, the support base 72 can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply devices 70 and 70a.

  The component supply unit 14 is mounted with an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and the lead type electronic component held by the electronic component holding tape is mounted. The lead is cut at the holding position (second holding position), and a plurality of electronic component supply devices 70 that can hold the lead-type electronic component at the holding position with the suction nozzle or the gripping nozzle provided in the head are mounted. In addition, the component supply unit 14r is mounted with an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body, and a holding position (first position) of the mounted electronic component held by the electronic component holding tape. An electronic component supply device 70a that can be peeled off from the tape main body at one holding position and can be held by a suction nozzle or a gripping nozzle provided in the head.

  The electronic component supply device 70 is a radial feeder, and supplies electronic components to a holding position (suction position, gripping position). The electronic components supplied to the holding position by each component supply device 70 are mounted on the substrate 8 by the head 15. The component supply device 70 supplies a radial lead type electronic component to the head 15 using an electronic component holding tape configured by attaching leads of a plurality of radial lead type electronic components to the tape. The component supply device 70 holds an electronic component holding tape, feeds the held electronic component holding tape, and holds a radial lead type electronic component held by the nozzle of the head 15 (suction position) , Gripping position, holding position). The component supply device 70 cuts and separates the lead of the radial lead type electronic component moved to the holding region, so that the radial lead type electronic component with the lead fixed by the tape can be held in a predetermined position. The radial lead type electronic component can be held (adsorbed and gripped) by the nozzle of the head 15. The lead-type electronic component is mounted on the substrate by inserting a lead into an insertion hole formed in the substrate. The plurality of component supply devices 70 may supply different types of electronic components or separate electronic components.

  The electronic component supply device 70a supplies an electronic component to the head 15 using an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 70 a is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic component can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The electronic component supply device 70a is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder or a bulk feeder can be used. The chip electronic component (mounted electronic component) is an electronic component without a lead that does not include a lead that is inserted into an insertion hole (through hole) in which a substrate is formed. Examples of the on-board electronic component include SOP and QFP as described above. The chip-type electronic component is mounted on the substrate without inserting the lead into the insertion hole.

  The component supply unit 14 includes a plurality of component supply devices 70, 70 a held by the support base 72, a plurality of types of component supply devices 70, different types of electronic components to be mounted, mechanisms for holding electronic components, or supply mechanisms. 70a. The component supply unit 14 may include a plurality of the same type of component supply devices 70 and 70a. The component supply unit 14 is preferably configured to be detachable from the apparatus main body. The component supply unit 14 can use various electronic component supply devices that supply electronic components. For example, the component supply unit 14 may install a stick feeder or a tray feeder as the electronic component supply device 70a. Moreover, the component supply unit 14 may provide a bowl feeder as a component supply device.

  The head 15 is held by an electronic component (radial lead type electronic component (lead type electronic component, insertion type electronic component) held by the electronic component supply device 70) or an electronic component supply device 70a held by the component supply unit 14. This is a mechanism for holding (sucking or gripping) the mounted electronic component) with a nozzle and mounting the held electronic component on the substrate 8 that has been moved to a predetermined position by the substrate transfer unit 12. The configuration of the head 15 will be described later.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIGS. 1 and 3, that is, on a plane parallel to the surface of the substrate 8. And a drive unit 24. The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The X-axis drive unit 22 has a ball screw 22a, and moves the support unit supporting the head 15 in the X direction by rotating the ball screw 22a. The X-axis drive unit 22 is also provided with a linear guide that supports the head 15 so that the head 15 does not rotate even when the ball screw 22 rotates so as to be movable in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The Y-axis drive unit 24 has a ball screw 24a, and moves the support unit supporting the head 15 in the Y direction by rotating the ball screw 24a. The Y-axis drive unit 24 also includes a linear guide that is supported so as to be movable in the Y-axis direction so that the X-axis drive unit 22 does not rotate even when the ball screw 24 rotates. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. That is, the XY movement mechanism 16 moves the head 15 on the horizontal plane (XY plane), and places the electronic components in the electronic component supply devices of the component supply units 14f and 14r on the substrate 8 at predetermined positions (mounting position, mounting position). It becomes a transfer means to transfer to. As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism (X-axis drive unit 22, Y-axis drive unit 24) for moving the object in a predetermined direction, a mechanism other than a conveyance mechanism using a ball screw and a linear guide can be used. As a mechanism of the X-axis drive unit 22 and the Y-axis drive unit 24, for example, a linear motor, a rack and pinion, a transport mechanism using a belt, or the like can be used.

  The VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are positions that overlap the movable region of the head 15 in the XY plane, and the position in the Z direction is lower than the head 15 in the vertical direction. Placed in position. In the present embodiment, the VCS unit 17, the replacement nozzle holding mechanism 18, and the component storage unit 19 are disposed adjacent to each other between the substrate transport unit 12 and the component supply unit 14r.

  The VCS unit (component state detection unit, state detection unit) 17 is an image recognition device, and includes a camera for photographing the vicinity of the nozzles of the head 15 and an illumination unit for illuminating the photographing region. The VCS unit 17 recognizes the shape of the electronic component sucked by the nozzle of the head 15 and the holding state of the electronic component by the nozzle. More specifically, when the head 15 is moved to the facing position, the VCS unit 17 captures the nozzle of the head 15 from the lower side in the vertical direction, and analyzes the captured image so that it is adsorbed by the nozzle. Recognize the shape of the electronic component and the holding state of the electronic component by the nozzle. The VCS unit 17 sends the acquired information to the control device 20.

  The replacement nozzle holding mechanism 18 is a mechanism that holds a plurality of types of nozzles. The replacement nozzle holding mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. Here, the replacement nozzle holding mechanism 18 of the present embodiment holds a suction nozzle that holds the electronic component by suction and a gripping nozzle that holds the electronic component by gripping the electronic component. The head 15 changes the nozzle to be mounted by the replacement nozzle holding mechanism 18 and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). be able to.

  The component storage unit 19 is a box that stores electronic components that the head 15 holds with nozzles and is not mounted on the substrate 8. That is, the electronic component mounting apparatus 10 is a disposal box for discarding electronic components that are not mounted on the substrate 8. When there is an electronic component that is not mounted on the substrate 8 among the electronic components held by the head 15, the electronic component mounting apparatus 10 moves the head 15 to a position facing the component storage unit 19 and holds the held electronic component. By releasing the part, the electronic part is put into the part storage unit 19.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation, and includes a keyboard 40a, a mouse 40b, and a touch panel 42a. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker, and includes a touch panel 42a and a vision monitor 42b. The display unit 42 displays various images on the touch panel 42 a and the vision monitor 42 b based on the image signal input from the control device 20.

  Although the electronic component mounting apparatus 10 of the present embodiment has one head, two heads may be provided corresponding to each of the component supply units 14f and 14r. In this case, two X-axis drive units are provided, and the two heads can be moved independently by moving the two heads in the XY directions, respectively. Since the electronic component mounting apparatus 10 includes two heads, electronic components can be alternately mounted on one substrate 8. Thus, by alternately mounting electronic components with two heads, while one head is mounting the electronic component on the substrate 8, the other head holds the electronic component in the component supply device. be able to. Thereby, the time when an electronic component is not mounted on the board | substrate 8 can be shortened more, and an electronic component can be mounted efficiently. Furthermore, the electronic component mounting apparatus 10 is also preferably arranged with two board transfer parts 12 in parallel. The electronic component mounting apparatus 10 can more efficiently mount electronic components on the substrate by moving the two substrates alternately to the electronic component mounting position by the two substrate transfer units 12 and mounting the components alternately by the two heads 15. can do.

  FIG. 5 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 6 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. Note that FIG. 5 also shows various control units that control the electronic component mounting apparatus 10 and one component supply device 70 of the component supply unit 14r. The configuration of the head 15 will be described with reference to FIGS. As shown in FIGS. 5 and 6, the head 15 includes a head main body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (component state detection unit, state detection). Part) 38.

  As shown in FIG. 5, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  In the electronic component supply device 70, the main body of the electronic component 80 is exposed upward on the electronic component holding tape. The electronic component supply apparatus 70 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the electronic component mounting apparatus 10 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape. The configuration of the electronic component supply device 70 will be described later. Similarly, in the case of the electronic component supply device 70a, the predetermined position is a holding region for holding the electronic component 80 in which the nozzles of the head 15 are held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, and a nozzle drive unit 34. In the head main body 30 of the present embodiment, as shown in FIG. 6, six nozzles 32 are arranged in a line. The six nozzles 32 are arranged in a direction parallel to the X axis. In addition, as for the nozzle 32 shown in FIG. 6, the suction nozzle which adsorb | sucks and hold | maintains an electronic component is arrange | positioned.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports the laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 has an opening 33 at the tip, and sucks air from the opening 33 to suck and hold the electronic component 80 at the tip. The nozzle 32 has a shaft 32 a that is formed with an opening 33 and is connected to a tip portion that sucks the electronic component 80. The shaft 32a is a rod-like member that supports the tip, and is arranged extending in the Z-axis direction. The shaft 32 a has an air pipe (pipe) that connects the opening 33 and the suction mechanism of the nozzle drive unit 34 therein.

  The nozzle drive unit 34 moves the nozzle 32 in the Z-axis direction and sucks the electronic component 80 through the opening 33 of the nozzle 32. Here, the Z axis is an axis orthogonal to the XY plane. The Z axis is a direction orthogonal to the surface of the substrate. In addition, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction when mounting electronic components. That is, the θ direction is a direction parallel to the circumferential direction of a circle centering on the Z axis, which is an axis parallel to the direction in which the Z-axis drive unit moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32.

  As the mechanism for moving the nozzle 32 in the Z-axis direction, the nozzle driving unit 34 includes, for example, a mechanism having a linear motion linear motor in which the Z-axis direction is the driving direction. The nozzle driving unit 34 moves the opening 33 at the tip of the nozzle 32 in the Z-axis direction by moving the shaft 32a of the nozzle 32 in the Z-axis direction with a linear motion linear motor. In addition, the nozzle drive unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to the shaft 32a as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle drive unit 34 transmits the driving force output from the motor to the shaft 32a by a transmission element, and rotates the shaft 32a in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 33 of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 33 of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 switches whether to suck air from the opening 33 by sucking air from the air pipe with a pump and switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks air from the opening 33 to suck (hold) the electronic component 80 into the opening 33, and closes the electromagnetic valve and does not suck air from the opening 33 to suck into the opening 33. The electronic component 80 that has been opened is opened, that is, a state in which the electronic component 80 is not picked up by the opening 33 (not held).

  The head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component. The gripping nozzle can grip or open the main body of the electronic component from above by opening and closing the movable piece with respect to the fixed piece by supplying or discharging air in the same manner as the suction nozzle. Moreover, the head 15 can change the nozzle which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as “BOC”) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. Further, the height sensor 37 detects the height of the facing part, specifically, the electronic component by processing the distance from the facing part using its own position at the time of measurement and the position of the substrate. . The process of detecting the height of the electronic component based on the measurement result of the distance to the electronic component may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 5, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 70 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a. The shape recognition processing by the laser recognition device 38 will be described later.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 5, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, ROM, and RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls control operations by the head control unit 62 and the component supply control unit 64.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the suction (holding) / release operation of the electronic components of the nozzle 32 and the rotation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, a distance sensor). Controls movement and movement in the Z-axis direction.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each of the component supply devices 70, 70a, 100, or may control all the component supply devices 70, 70a, 100 by one. For example, the component supply control unit 64 controls tray replacement operation and movement operation by the electronic component supply device 70. The component supply control unit 64 controls the electronic component holding tape drawing operation (moving operation), lead cutting operation, and radial lead type electronic component holding operation by the component supply device 70. Further, the electronic component holding tape is pulled out (moved) by the component supply device 70a. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape or the electronic component holding tape by controlling the drawing operation of the electronic component holding tape or the electronic component holding tape. Next, the grip nozzle described above will be described.

  7 and 8 are diagrams showing the gripping nozzle according to the present embodiment. FIG. 9 is a diagram illustrating a movable piece and a fixed piece of the gripping nozzle according to the present embodiment. FIG. 10 is a diagram illustrating a state where the gripping nozzle according to the present embodiment has opened the lead component. The gripping nozzle 100 grips a lead component 120, which is a kind of electronic component, and inserts the lead 122 into a through hole of a substrate. In the present embodiment, the gripping nozzle 100 includes a cylinder 102, a piston 103, a movable piece 104, a gripping spring 105, a fixed piece 106, a pushing spring 108, and a pushing portion 109. In addition, the gripping nozzle 100 includes a sliding spring 107 and a guide 110.

  The gripping nozzle 100 has a cylindrical (substantially cylindrical shape in the present embodiment) main body 101. The main body 101 has an air passage 101 </ b> P that supplies air to the cylinder 102 and exhausts air from the cylinder 102. The cylinder 102 is connected to the air passage 101P. The cylinder 102 has a cylindrical shape (cylindrical shape in the present embodiment), and air is supplied through the air passage 101P. Further, the air discharged from the cylinder 102 is discharged to the outside of the main body 101 through the air passage 101P. An air passage 101 </ b> P opens on one end side of the main body 101. The opening 101PH of the air passage 101P is connected to an air pipe (pipe) provided inside the shaft 32a shown in FIG.

  The piston 103 is a cylindrical structure and is disposed inside the cylinder 102 and reciprocates. One end of the piston 103 is opposed to the opening on the cylinder 102 side of the air passage 101P. A rod-like (cylindrical in this embodiment) shaft 103S is attached to the other end of the piston 103. The shaft 103S has one end connected to the piston 103 and the other end connected to the movable piece 104 via a pin 114. With such a structure, the movable piece 104 can rotate around the pin 114 with respect to the shaft 103S.

  As for the main-body part 101, the bottom part 111 is attached to the other end part side, ie, the edge part side on the opposite side to the opening part 101PH of the air path 101P. The bottom 111 has a through hole 111H through which the shaft 103S passes. The shaft 103S passes through the through hole 111H and is connected to the movable piece 104. The bottom 111 has a fixed piece support 112 and a movable piece support 113 on the side where the shaft 103S protrudes from the main body 101. The fixed piece support 112 and the movable piece support 113 are arranged to face each other with the through hole 111H interposed therebetween.

  The movable piece 104 is a member that is connected to the piston 103 and can hold and release the lead component 120 in conjunction with the reciprocating motion of the piston 103. The movable piece 104 is an L-shaped member in side view, and is connected to the piston 103 via the shaft 103S and the pin 114 as described above. The movable piece 104 is connected to the movable piece support 113 by a pin 115 at a corner that is bent at a substantially right angle. With such a structure, the movable piece 104 is supported so as to be rotatable with respect to the movable piece support 113 around the pin 115. The fixed piece 106 contacts the movable piece 104 and grips the lead component 120. The fixed piece 106 is attached to the fixed piece support 112.

  A gripping spring 105 is interposed between the piston 103 and the bottom 111. The gripping spring 105 is a compressed coil spring, for example, and applies a force in the direction of increasing the distance between the piston 103 and the bottom portion 111 to both. When the piston 103 moves toward the bottom 111, the movable piece 104 rotates around the pin 115, and one end of the movable piece 104 (the end on the pin 114 side) moves toward the fixed piece 106. Then, the other end (the end opposite to the pin 114) of the movable piece 104 moves in a direction away from the fixed piece 106. When the piston 103 moves away from the bottom portion 111, the movable piece 104 rotates around the pin 115, and one end portion (end portion on the pin 114 side) of the movable piece 104 moves in a direction away from the fixed piece 106. Then, the other end (the end opposite to the pin 114) of the movable piece 104 moves toward the fixed piece 106.

  The pushing spring 108 is provided on the fixed piece 106. The pushing portion 109 abuts on the lead component 120 and pushes the lead component 120 into the board by the pressing force of the pushing spring 108. In the present embodiment, the pushing spring 108 is, for example, a compressed coil spring, and is interposed between the fixed piece 106 and the pushing portion 109. With such a structure, the pushing spring 108 applies a force in a direction in which the fixed piece 106 and the pushing portion 109 are moved away from each other. The pushing portion 109 is disposed on the open end (end portion opposite to the bottom portion 111) side of the fixed piece 106, and the pushing spring 108 is disposed on the bottom portion 111 side with respect to the pushing portion 109. Therefore, the pushing spring 108 presses the pushing portion 109 toward the open end side of the fixed piece 106. The guide 110 is coupled to the pushing portion 109, moves in a direction parallel to the direction in which the piston 103 reciprocates together with the pushing portion 109, and has an engaging portion 116 with the fixed piece 106. When the engaging portion 116 of the guide 110 is engaged with the fixed piece 106, the pushing-in portion 109 is prevented from dropping from the gripping nozzle 100.

  When the gripping nozzle 100 holds the lead component 120, the other end of the movable piece 104 and the open end of the fixed piece 106 sandwich the lead 122 of the lead component 120. At this time, the pressing portion 109 receives a pressing force from the main body 121 of the lead component 120 and moves toward the bottom portion 111, and the pressing spring 108 contracts. For this reason, the force by which the pressing spring 108 presses the pressing portion 109 increases.

  The bottom 111 has a groove 111S on the outer periphery. When the bottom 111 is attached to the main body 101, the stopper 117 attached from the main body 101 enters the groove 111 </ b> S of the bottom 111. With such a structure, the bottom 111 can move in a direction parallel to the direction in which the piston 103 reciprocates with respect to the main body 101. The sliding spring 107 is disposed between the bottom 111 of the gripping nozzle 100 and the main body 101. The sliding spring 107 is, for example, a compressed coil spring, and applies a force in a direction in which the bottom 111 protrudes from the main body 101 to the bottom 111.

  As shown in FIG. 9, a first groove 113 </ b> M is provided at a location where the lead 122 of the lead component 120 of the movable piece 104 is gripped. A second groove 113 </ b> S is provided at a location where the lead 122 of the lead component 120 of the fixed piece 106 is gripped. Each of the first groove 113M and the second groove 113S has a V-shaped cross section. The lead 122 of the lead component 120 is sandwiched between the first groove 113M and the second groove 113S.

  In the gripping nozzle 100, when the movable piece 104 and the fixed piece 106 sandwich the lead 122 of the lead component 120, a component force Fs is generated by the gripping force Fa of the movable piece 104 and the shape of the first groove 113 </ b> M. The lead 122 can be deformed. Further, even when the lead nozzle 120 is gripped at a shifted position, the gripping nozzle 100 can grip the lead component 120 at the intended position by the gripping force Fa and the component force Fs generated by the first groove 113M. It is possible. As described above, the gripping nozzle 100 has an unintended shape such that the lead 122 of the lead component 120 is bent in advance when it is supplied by the supply device (component supply unit 14) of the lead component 120. Even in this case, the lead 122 can be corrected by the shapes of the first grooves 113M and 113S of the movable piece 104 and the fixed piece 106, respectively. Further, the gripping nozzle 100 can grip the lead component 120 at an intended position depending on the shapes of the first grooves 113M and 113S even when the position of gripping the lead component 120 is different. As a result, the gripping nozzle 100 can mount the lead component 120 more stably. Next, the operation of the gripping nozzle 100 will be described.

  When air is supplied from the air passage 101 </ b> P to the cylinder 102 and the force received by the piston 103 due to the air pressure becomes larger than the force received from the gripping spring 105, the piston 103 moves in the cylinder 102 toward the bottom 111. Then, one end of the movable piece 104 connected to the piston 103 by the shaft 103S moves toward the fixed piece 106, and the other end of the movable piece 104 moves away from the fixed piece 106. And the open end of the fixed piece 106 are opened. In this state, the pushing portion 109 is farthest from the fixed piece 106 by the pushing spring 108, and the pushing spring 108 is the longest.

  When the other end of the movable piece 104 and the open end of the fixed piece 106 are opened, the gripping nozzle 100 can grip the lead component 120. With the other end of the movable piece 104 and the open end of the fixed piece 106 open, the main body 121 and the lead 122 of the lead component 120 are brought into contact with the fixed piece 106. At this time, the lead 122 of the lead component 120 overlaps the open end of the fixed piece 106. When the supply of air to the cylinder 102 is stopped in this state, the piston 103 moves away from the fixed piece 106 by the pressing force of the gripping spring 105. In conjunction with the movement of the piston 103, one end of the movable piece 104 also moves away from the fixed piece 106, and the other end of the movable piece 104 moves toward the open end of the fixed piece 106. Pressed against. In this way, the gripping nozzle 100 holds the lead 122 of the lead component 120 between the other end of the movable piece 104 and the open end of the fixed piece 106.

  When the gripping nozzle 100 grips the lead component 120, the pushing portion 109 contacts the main body 121 of the lead component 120. Then, as the gripping nozzle 100 is lowered, the pushing portion 109 moves toward the bottom portion 111, and the pushing spring 108 is compressed. After the push-in part 109 comes into contact with the fixed piece 106 and cannot move toward the bottom part 111, when the gripping nozzle 100 further moves down, the sliding spring 107 contracts and the bottom part 111 is pushed into the main body part 101. The downward movement of the gripping nozzle 100 is absorbed by the sliding spring 107, so that an excessive force is not applied to the lead component 120 and the gripping nozzle 100.

  In a state where the gripping nozzle 100 grips the lead component 120, the movable piece 104, the fixed piece 106, and the pushing portion 109 hold the lead component 120. The gripping nozzle 100 moves to a position where the lead component 120 is mounted on the substrate, and the air passage 101P is moved from the air passage 101P to the cylinder 102 with the positions of the lead 122 and the through hole 9 of the substrate 8 aligned as shown in FIG. Supply air. When the force received by the piston 103 by the air pressure becomes larger than the force received from the gripping spring 105, the piston 103 moves in the cylinder 102 toward the bottom 111, and as a result, the other end of the movable piece 104 and the fixed piece 106. The open end of open.

  Then, the pushing portion 109 moves away from the bottom 111 by the pushing force of the pushing spring 108 (the direction indicated by the arrow D in FIG. 10), that is, moves toward the substrate 8, so that the lead 122 of the lead component 120 is moved to the substrate 8. It is pushed into the through hole 9. By such an operation of pushing the entire main body 121 of the lead component 120, the gripping nozzle 100 can mount the lead component 120 on the substrate 8.

  As described above, the gripping nozzle 100 is fixed by the pressing portion 109 and the pressing spring 108 provided in the gripping nozzle 100 when the lead component 120 such as an axial component or a radial component is mounted on the electronic component mounting apparatus. Since the pressing can be performed, the lead 122 of the lead component 120 can be reliably inserted into the through hole 9 of the substrate 8. As a result, the gripping nozzle 100 can reduce mounting errors of the lead component 120 and stably mount the lead component 120 on the substrate 8. Further, the movable piece 104 and the fixed piece 106 of the gripping nozzle 100 are misaligned when the lead 122 is bent in advance due to a mistake or the like that occurs when the lead 122 of the lead component 120 is cut, or the position where the lead component 120 is gripped. Even in such a case, the lead 122 can be corrected by the first groove 113M and the second groove 113S. As a result, the gripping nozzle 100 can more stably mount the lead component 120 on the substrate 8.

  In this embodiment, the pushing portion 109 pushes the lead 122 of the lead component 120 into the through hole 9 of the substrate 8 by the pushing force of the pushing spring 108, but the pushing of the lead 122 is performed using a force other than the pushing force of the pushing spring 108. Also good. For example, the pushing portion 109 is moved in conjunction with the lowering operation of the gripping nozzle 100, and the pushing portion 109 is inserted into the through hole 9 of the substrate 8 using the lowering operation of the gripping nozzle 100. May be. When the intervals between the leads 122 of the lead component 120 are different, the lead components 120 having different intervals can be mounted on the substrate 8 by preparing the gripping nozzles 100 corresponding to the intervals.

  Although the present embodiment has been described above, the present embodiment is not limited to the above-described content. The components of the present embodiment described above include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in the so-called equivalent range. Furthermore, the above-described components can be appropriately combined. In addition, various omissions, substitutions, and changes of the components can be made without departing from the scope of the present embodiment.

  8 Substrate, 10 Electronic component mounting apparatus, 11 Housing, 11a Main body, 11b, 11bf, 11br Cover, 11c Opening, 12 Substrate transport unit, 14, 14f, 14r Component supply unit, 15 Head, 16 XY moving mechanism, 17 VCS Unit, 18 Replacement nozzle holding mechanism, 19 Component storage unit, 20 Control device, 22 X-axis drive unit, 22a, 24a Ball screw, 24 Y-axis drive unit, 30 Head body, 31 Head support, 32 nozzle, 34 Nozzle drive unit , 38 Laser recognition device, 40 operation unit, 42 display unit, 48 reference mark group, 49 reference mark, 60 control unit, 62 head control unit, 64 component supply control unit, 70, 70a electronic component supply device, 80 electronic component, 100 gripping nozzle, 101 main body, 101P air passage, 102 cylinder, 10 3 piston, 104 movable piece, 106 fixed piece, 108 pushing spring, 109 pushing portion, 110 guide, 111 bottom portion, 113M first groove, 113S second groove, 120 lead component, 121 main body, 122 lead

Claims (4)

Holds the lead component and inserts the lead into the board.
A cylindrical cylinder to which air is supplied or discharged;
A piston disposed in the cylinder and reciprocating;
A movable piece connected to the piston and capable of gripping and releasing the lead of the lead component in conjunction with the reciprocating motion of the piston;
A gripping spring for applying a force in a direction in which the movable piece grips the lead to the movable piece;
A fixed piece that contacts the movable piece and grips the lead;
A pushing spring provided on the fixed piece;
A pushing portion that abuts the lead component and pushes the lead component into the substrate by a pressing force of the pushing spring;
A gripping nozzle comprising:   The gripping nozzle according to claim 1, further comprising a guide coupled to the push-in portion, moving in a direction parallel to a direction in which the piston reciprocates together with the push-in portion, and having an engagement portion with the fixed piece. A first groove provided at a position for holding the lead of the lead component of the movable piece;
A second groove provided at a position for holding the lead of the lead component of the fixed piece;
The gripping nozzle according to claim 1, comprising: An electronic component supply device for supplying electronic components to the holding area;
The gripping nozzle according to any one of claims 1 to 3, which grips an electronic component supplied from the electronic component supply device to the holding region.
A head main body having a nozzle driving section that drives the gripping nozzle up and down and rotates and supplies air pressure to the gripping nozzle to drive the gripping nozzle; and a head support that supports the gripping nozzle and the nozzle driving section; ,
A head moving mechanism for moving the head body;
An electronic component mounting apparatus comprising: