EP2699071A2 - Head module for pick and place dedicated components in SMT technology - Google Patents
Head module for pick and place dedicated components in SMT technology Download PDFInfo
- Publication number
- EP2699071A2 EP2699071A2 EP13180071.6A EP13180071A EP2699071A2 EP 2699071 A2 EP2699071 A2 EP 2699071A2 EP 13180071 A EP13180071 A EP 13180071A EP 2699071 A2 EP2699071 A2 EP 2699071A2
- Authority
- EP
- European Patent Office
- Prior art keywords
- head module
- gripping
- gripping component
- suction nozzle
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0413—Pick-and-place heads or apparatus, e.g. with jaws with orientation of the component while holding it; Drive mechanisms for gripping tools, e.g. lifting, lowering or turning of gripping tools
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
- H05K13/0408—Incorporating a pick-up tool
- H05K13/0409—Sucking devices
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Supply And Installment Of Electrical Components (AREA)
- Manipulator (AREA)
- Automatic Assembly (AREA)
Abstract
Description
- This invention relates to the head module for positioning SMD (Surface Mount Device) electronic components or elements on PCBs (Printed Circuit Boards) using SMT technology (Surface Mount Technology) in assembly semi-automatons and automatons, particularly for pick and place dedicated components in SMT technology, according to the preamble of
claim 1. A head module can comprise a body of the head module, a suction nozzle assembly with a gripping component comprising a negative pressure duct inside the gripping component, which at one end is equipped with a suction nozzle gripping the dedicated components, to which a pressure connector is connected supplying negative pressure to the negative pressure duct, which connects with a centre through hole of the suction nozzle gripping, and the linear displacement drive of the gripping component in relation to the body of the head module mounted to the body of the head module. - Positioning electronic components is based on picking them up from feeders or containers, where SMD components are collected, and placing them in a given location on the PCB surface. In known solutions, positioning the SMD components is executed by heads.
- Application
US 200810315603 A1 - Application
US2007059149 A1 titled "Multi-axis pick and place assembly" discloses a picking up and placing system for picking up and positioning different components. The system comprises a spindle with a chamber equipped with a head for picking up the components, to which negative pressure is supplied via a housing and a sealing set located between the housing and the spindle displaced using a driving system. - Application
US2004042890 A1 titled "Component-placing apparatus" discloses a device with a negative pressure nozzle for placing components and with a rotary actuator and a linear actuator, which are fixed in relation to each other. The negative pressure nozzle is equipped with a suction nozzle at the bottom, which can move using rotary motion and translational motion. - Application
US2009056114 A1 titled "Nozzle mechanism, mounting head and electronic component mounting apparatus" discloses a nozzle mechanism" a mounting head and a device for mounting electronic components. The nozzle mechanism has a rotating mechanism that transfers power from an engine to a nozzle catching the electronic components by a bar, which is mounted directly on an engine wheel and a nozzle wheel. - The drawback of the known solutions is the necessity to employ complicated heads, comprising many components thus their production and operation are expensive and problematic.
- A purpose of this invention is to create a head module to pick up and place SMD components, deprived of the aforementioned drawbacks and inconveniences, known from the known solutions.
- This object of invention is achieved by the head module with the features of
claim 1. Advantageous embodiments are given in the dependent claims. In a case of a head module to pick up and place dedicated components in the SMT technology, according to the invention it is provided a head module comprising a body of the head module, a suction nozzle assembly with a gripping component comprising a vacuum duct inside the gripping component, which at one end is equipped with a suction nozzle gripping the dedicated components, to which a vacuum connector is connected supplying vacuum or negative pressure to the vacuum duct by using which the dedicated components are sucked to the suction nozzle. The vacuum or negative pressure is so great that after capture the dedicated component by the nozzle, the dedicated component does not move relative to the suction nozzle. - Indeed the dedicated component does not move relative to the suction nozzle but due to the fact that the nozzle is attached to the gripping element, which can perform rotary motion around its own axis and move vertically, the dedicated component can move in rotation and movement in the vertical direction relative to the PCB on which the dedicated component is to be placed. The described movements are realized by means of a drive generating rotary motion of the gripping component and a drive for linear movement of the gripping component in relation to the body of the head module, from which only the drive for linear movement is installed on the body of the head module. Because the body of the head module together with the head module is seated on a carriage displacing, the head module can displace in a plane perpendicular to the axis of rotation of the gripping component, that is, in a plane parallel to a plane of the PCB, and stopped over the place where the dedicated component is to be placed. Thanks to the compact head module, on the trolley moving the head module can be placed more than one body of the head module with the module head.
- The first basic idea of the invention consists in using, as the drive of the gripping component, generating rotary motion of the gripping component, a stepping or stepper motor installed by its housing to the body of the head module. However, a stepper motor shaft is a hollow shaft, inside which the gripping component is seated and coupled displaceably along the hollow shaft axis, using a clearance-free guide coupling the sleeve with the hollow shaft. The gripping component has vacuum duct hollowed inside, which connects with a centre through hole of the suction nozzle gripping the dedicated components using the suction end.
- A large simplification of the head module construction is apply as the linear displacement drive of the gripping component in relation to the body of the head module the belt transmission with the tensioning pulley and drive pulley seated on the motor shaft generating motion of the belt of the belt transmission, on which a holder with a rotary seated gripping component is fixed.
- The axis of rotation of the gripping component may be disposed coaxially with the axis of rotation of the hollow shaft of the stepper motor, which also simplifies the design of the head module. Preferably, the clearance-free guide coupling sleeve is seated on the hollow shaft of the stepper motor and is coupled with the hollow shaft of the stepper motor using a screw screwed into the coupling sleeve fixing the hollow shaft with the coupling sleeve, which is coupled by a spline with the gripping component linearly displaced along the symmetry axis of the hollow shaft in relation to the body.
- The accuracy of the vertical movement of a dedicated component, thus preventing damage of the PCB is provided by using a belt transmission with toothed belt, and a tensioning pulley and a driving pulley that are toothed pulleys.
- To ensure fast picking up of the dedicated components at the second end of the gripping component, there is a pressure connector installed that supplies vacuum or negative pressure to the vacuum duct of the gripping component, which is on the opposite side of the gripping element where the suction nozzle is fixed.
- A subject of the invention is presented in the embodiments in the drawings, in which
Fig. 1 presents an axonometric view of a head module,Fig. 2 presents an axonometric view of the head module with details of connector of a stepping motor axis with a clearance-free guide and fixing of a belt with a suction nozzle assembly,Fig. 3 presents longitudinal cross-section of a gripping component,Fig. 4 presents head modules located on a carriage and used to position SMD electronic components,Fig. 5 presents a pneumatic system generating vacuum or negative pressure in a flexible hose supplying vacuum or negative pressure and a vacuum duct located inside the gripping component with a suction nozzle, andFig. 6 presents a diagram of an electrical system. - A
head module 5, presented inFig. 1 ,2 ,3 and4 is used to pick up and place dedicated components in SMT technology, which for example, are electronic components mountable on the flat surface. These components are picked up from a feeder (not shown in the drawing) and then transported to the place of their assembly on PCB. The mentionedhead module 5 comprises abody 10 of thehead module 5, asuction nozzle assembly 40 with agripping component 41, adrive 20 of thegripping component 41 generating rotary motion of the gripping component and adrive 30 for linear displacement of thegripping component 41 in relation to thebody 10 of thehead module 5 fixed to thebody 10 of thehead module 5. - The
body 10 of thehead module 5 has itsbase 11 in a shape of a flat bar with stepped throughholes 12 in whichscrews 13 are located, by which ahousing 22 of astepper motor 21 is fixed to thebase 11 of thebody 10 from the bottom of thebase 11, adopting the positioning of thebody 10 presented in theFigs. 1 and2 as the reference positioning, in case of which thestepper motor 21 is located at the bottom of the figure. - Additionally, the
body 10 has anarm 15 which stands out from thebase 11 at an angle, for example 90°. Thearm 15 has the shape of a flat bar and as thebase 11, has stepped throughholes 16 for fixing amotor 33 for linear displacement of thegripping component 41 in relation to thebody 10 of thehead module 5. Thebase 11 and thearm 15 of thebody 10 form a partial shield of theassembly 40 of the suction nozzle with thegripping component 41 and limit aspace 6 from the bottom and rear, in which theassembly 40 of the suction nozzle with thegripping component 41 is located. Ashaft 34 of themotor 33 passes through thehole 17 made in the bottom part of thearm 15 located adjacent to thebase 11 of thebody 10. On theshaft 34, which protrudes from thehole 17, adriving pulley 35 is seated, which is wound by abelt 36 of abelt transmission 31, of which abelt tensioning pulley 32 is fixed to anassembly 38 that tensions or tightens thebelt 36 of thebelt transmission 31. Location of theassembly 38 tensioning thebelt 36 of thebelt transmission 31 is set using aset screw 39, which locks the position of theassembly 38 located in alongitudinal hole 18 located in the upper part of thearm 15 of thebody 10. On thebelt 36 of thebelt transmission 31, aholder 37 is mounted non-displaceably in relation to the belt and provided with an optical diaphragm, in which agripping component 41 is seated. Displacement of thebelt 36 of thebelt transmission 31 in relation to thebody 10 generates linear displacement of thegripping component 41 in respect to thebody 10, which is controlled by means of anoptical switch 98 of end position ofgripping element 41 of thesuction nozzle 55. - The
stepper motor 21, fixed by itshousing 22 to thebody 10 of thehead module 5, has ahollow shaft 23 in which thegripping component 41 is centrally fixed, which can move inside thehollow shaft 23 along its axis, and which is coupled using acoupling sleeve 52 of a clearance-free guide or backlash-free guide 50 with thehollow shaft 23. Thecoupling sleeve 52, presented inFig. 2 , of the clearance-free guide 50 is seated on thehollow shaft 23 of thestepper motor 21 and is coupled with thehollow shaft 23 of thestepper motor 21 using thescrew 54 screwed into thecoupling sleeve 52 and fixing thehollow shaft 23 in relation to thecoupling sleeve 52, inside which there is aninternal coupler 51, and which, using thespline 53, is coupled with thegripping component 41 which moves linearly along the symmetry axis of thehollow shaft 23 in relation to thebody 10 and rotatable around its own symmetry axis overlapping with the axis shown in theFig. 1 . InFig. 3 presenting the longitudinal cross section of thegripping component 41, theinternal connector 51 of the clearance-free guide 50 has a spline inside its through hole, however thegripping component 41 has splines shaped on its side surface, which dimensions and shape allows sliding displacement of thegripping component 41 in relation to theinternal connector 51 of the clearance-free guide 50. Thegripping component 41 has a threadedend 44 on the top, which is connected with amuff 45 using threaded connection. Themuff 45 is equipped with arotational pressure connector 46 with astub pipe 47, which allows connecting the pneumatic hose supplying vacuum or negative pressure to avacuum duct 42 located inside thegripping component 41. At the bottom of thegripping component 41, there is asuction nozzle 55 replaceably connected using a magnet to aconical seat 58, to which asuction nozzle 57 is connected, of which acentric hole 59 is connected with the centric throughhole 56 of thesuction nozzle 55 and theduct 42 of thegripping component 41. The axis ofrotation 141 of thegripping component 41 is positioned coaxially with the axis of rotation 121 of thehollow shaft 23 of thestepper motor 21. Thesuction nozzle 55 is designed to firmly grip the SMD dedicated component, take it out from the feeder, for example a cassette tape feeder for positioning SMD electronic components used to supply SMD components from belts in assembly automatons or semi-automatons, using the SMT technology and transport the SMD dedicated component, generally called an electronic component, to the specified location and place it in the predetermined location on the board. -
Fig. 4 presents tenbodies 10 of thehead modules 5, used to position the SMD electronic components placed one by another on acarriage 70, which can move horizontally. Thecarriage 70 is located on atransversal guide 71 and is equipped with onedrive 72, which forces displacement of thecarriage 70 along thetransversal guide 71, which is seated onmovable supports 75 fixed to thetransversal guide 71 and movable slidingly alonghorizontal guides 76. Each of thehorizontal guides 76 is supported at its ends onvertical supports 77, and themovable supports 75 have theirown drive systems 78, which are synchronized with each other so that thetransversal beam 71 moves at right angle in relation to thehorizontal guides 76. With an arrangement of thetransversal guide 71 and thehorizontal guides 76 and corresponding drives, each of thehead modules 5 can be displaced above any pre-determined location, located in the xy plane. - A
pneumatic system 80 generating vacuum or negative pressure in the flexible hose supplying vacuum or negative pressure and thevacuum duct 42 located inside thegripping component 41 with thesuction nozzle 55 is presented inFig. 5 . Thepneumatic system 80 comprises apump 82, which is driven by amotor 81, a switchingsolenoid valve 83, anejector 84, generating vacuum in thevacuum duct 42 of thegripping component 41 and adischarge valve 85. Vacuum or negative pressure supplied to thesuction nozzle 55 is changed using the stepwise method by application of a cut-offvalve 86, thus thesuction nozzle 55 sucks and holds the electronic component only when vacuum or negative pressure is supplied to it, and after cutting off the vacuum or the negative pressure, thesuction nozzle 55 releases and leaves the electronic components in the pre-determined place. -
Fig. 6 schematically presents anelectric system 90, which comprises main systems such as asupply system 91 and acontrol system 92 with acontroller 93. To thesupply system 91 and thecontrol system 92, the following systems are connected: asystem 94 controlling thestepper motor 21 of the gripping component rotation with the suction nozzle, apneumatic system 80 with apump motor 82,controllers 95 of thepneumatic system 80 valves and avacuum measurement module 96 as well as asystem 97 controlling thestepper motor 33 for linear movement of the gripping component with the suction nozzle, withoptical switch 98 of end position of the gripping component with the suction nozzle. - While collecting the dedicated components, the
assembly 40 of the suction nozzle with thegripping component 41 is displaced over the feeder container with specified electronic components. In theduct 42 of thegripping component 41, vacuum or negative pressure is generated which causes that a specifiedelectronic component 1, shown inFig. 4 , is being sucked to thereplaceable suction nozzle 55 located at the bottom of thegripping component 41, after displacing the suction nozzle together with the gripping component to theelectronic component 1 using thedrive 30 for linear movement of thegripping component 41 in relation of thebody 10 of thehead module 5, namely, using thebelt transmission 31 generating motion of thebelt 36, on which aholder 37 is mounted non-displaceably in respect to the belt with thegripping component 41 rotationally assembled inside it. After gripping theelectronic component 1, thegripping component 41 together with theelectronic component 1 is displaced over adevice 99, shown inFig. 4 , for example a camera, controlling the location of theelectronic component 1 in relation to the longitudinal symmetry axis of thegripping component 41 or other reference point located on thegripping component 41 or thehead module 5. If it is found that the location of the electronic component have to be corrected, theelectronic component 1 is rotated using thedrive 20 of thegripping component 41 generating the rotary motion of thegripping component 41, namely using thestepper motor 21 installed by itshousing 22 to thebody 10 of thehead module 5. If theelectronic component 1 is correctly located in relation to the head, the grippingcomponent 41 is displaced together with the carriage over the pre-determined position over theboard 2, then the electronic component is moved downwards, until it contacts with the printedcircuit board 2, which is controlled by the control system with the set end bottom position of the suction nozzle. An additional protection against displacement of the suction nozzle too far towards the bottom is the optical switch of end position, operating together with the optical diaphragm, which cuts a light beam between the optical transmitter and the receiver in the optical switch of end position. After placing theelectronic component 1 on the printedcircuit board 2, theelectronic component 1 is released by the grippingcomponent 41, after equalizing the pressured in the vacuum duct in relation to ambient pressure. The controlledsolenoid valve 83 activating vacuum or negative pressure is activated by thecontroller 95 of the pneumatic system valves during picking up the components. Information that the head has picked up the electronic component is obtained from the pressure sensor, which sends proper information when the preset value of vacuum or negative pressure is achieved. The preset value of negative pressure is established when the suction nozzle touches the flat surface of the component, because negative pressure rise occurs, or the PCB surface. Vacuum or negative pressure rise caused by contact with the printed board is also used to specify the reference height, i.e. so called zero height, which is to be used to determine the height of lowering the electronic components during their placement on the printed board. - The feature distinguishing the operation of the head module for picking up and placing the dedicated components in the SMT technology from the other heads is simplification of the mechanism by application of the hollow shaft of the stepping motor setting in rotary motion the gripping component, which is located inside the hollow shaft of the stepper motor. Positioning of the gripping component inside the hollow shaft of the stepper motor, protruding from the both sides of the stepper motor shaft allows to reduce the number of components of the head module, especially when comparing the head presented in this application with the mechanism from other solutions, where rotation around the vertical axis is executed using the motor and belt transmission.
- The solution according to the invention is presented in relation to selected embodiments. These embodiments do not limit the invention. It is obvious that modifications can be introduced without deviating from the nature of the solution. The presented embodiments do not exhaust all applications of the solution according to the invention.
Claims (8)
- A head module (5) for pick and place dedicated components in SMT technology, comprising a body (10) of a head module (5), a suction nozzle assembly (40) with a gripping element (41) comprising a vacuum duct (42) inside the gripping element, which at one end is equipped with suction nozzle gripping dedicated components, to which at the opposite end of the suction nozzle a pressure connector is connected supplying vacuum or negative pressure to the vacuum duct which is connected with a through hole of a suction nozzle, a drive (20) of the gripping element generating a rotary motion of the gripping component and a drive (30) for linear movement of the gripping component in relation to the body of the head module mounted on the body of the head module, characterized in that the drive (20) of the gripping component (41), generating the rotary motion of the gripping component (41), is a stepper motor (21) mounted by its housing (22) to the body (10) of the head module (5), whereby a stepper motor shaft is a hollow shaft (23), inside which the gripping component (41) is seated and coupled displaceably along the hollow shaft (23) axis, using a coupling sleeve (52) of a clearance-free guide (50) with the hollow shaft (23), while the gripping component (41) has the vacuum duct (42) hollow inside, which is connected with a centre through hole (56) of the suction nozzle (55) gripping the dedicated components using the suction end (57), and the drive (30) of linear displacement of the gripping component (41) in relation to the body (10) of the head module (5) is a belt transmission (31) with a belt tensioning pulley (32) and a drive pulley (35) seated on the motor (33) shaft (34) generating motion of a belt (36) of the belt transmission (31), on which a holder (37)) is non-displaceably mounted, whereas the holder (37) allows movement of the rotary seated gripping component (41) rotationally in relation to the holder (37).
- The head module according to claim 1, characterized in that the coupling sleeve (52) of the clearance-free guide (50) is seated on the hollow shaft (23) of the stepper motor (21) and is coupled with the hollow shaft (23) of the stepper motor (21) using a screw (54) screwed into the coupling sleeve (52) fixing the hollow shaft (23) to the coupling sleeve (52), which is coupled by a spline (53) with the gripping component (41) linearly displaceable along the symmetry axis of the hollow shaft (23) in relation to the body (10).
- The head module according to claim 1 or 2 characterized in that an axis (141) of rotation of the gripping component (41) is disposed coaxially with an axis (121) of rotation of the hollow shaft (23) of the stepping motor (21).
- The head module according to claim 1 or 2 or 3 characterized in that the belt transmission (31) is the belt transmission (31) with a toothed belt (36), and the belt tensioning pulley (32) and the drive pulley (35) are toothed pulleys.
- The head module according to claim 1 or 2 or 3 or 4 characterized in that the belt tensioning pulley (32) is seated on bearings in tensioning arrangement (38) of the toothed belt (36) displaceable in relation to the drive pulley (35).
- The head module according to claim 1 or 2 or 3 or 4 or 5 characterized in that at the other end of the gripping component (41) a pressure connector (46) is installed, which supplies vacuum or negative pressure to the vacuum duct (42) of the gripping component (41).
- The head module according to claim 1 or 2 or 3 or 4 or 5 or 6 characterized in that the body (10) of the head module (5) together with the head module (5) is seated on a carriage (70) moving the head module (5) in a plane perpendicular to the axis of rotation of the gripping component (41).
- The head module according to claim 7 characterized in that on the carriage (70) moving the head module (5) is placed more than one body (10) of the head module (5) together with the head module (5).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL13180071T PL2699071T3 (en) | 2012-08-14 | 2013-08-12 | Head module for pick and place dedicated components in SMT technology |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PL400384A PL222470B1 (en) | 2012-08-14 | 2012-08-14 | Head module for collection and placement of components dedicated in SMT technology |
Publications (3)
Publication Number | Publication Date |
---|---|
EP2699071A2 true EP2699071A2 (en) | 2014-02-19 |
EP2699071A3 EP2699071A3 (en) | 2014-10-22 |
EP2699071B1 EP2699071B1 (en) | 2016-11-09 |
Family
ID=48951378
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP13180071.6A Active EP2699071B1 (en) | 2012-08-14 | 2013-08-12 | Head module for pick and place dedicated components in SMT technology |
Country Status (2)
Country | Link |
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EP (1) | EP2699071B1 (en) |
PL (2) | PL222470B1 (en) |
Cited By (12)
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CN104261127A (en) * | 2014-09-10 | 2015-01-07 | 苏州赛腾精密电子有限公司 | Blanking taking and placing mechanism |
CN104495372A (en) * | 2014-12-16 | 2015-04-08 | 苏州慧捷自动化科技有限公司 | Filter cotton vacuum adsorption device |
US20150298316A1 (en) * | 2014-04-18 | 2015-10-22 | Kla-Tencor Corporation | Pick and place device with automatic pick-up-height adjustment and a method and a computer program product to automatically adjust the pick-up-height of a pick and place device |
CN105059928A (en) * | 2015-08-10 | 2015-11-18 | 苏州赛腾精密电子股份有限公司 | Circular rotating mechanism of vacuum tube |
CN107172875A (en) * | 2017-07-20 | 2017-09-15 | 合肥裕朗机电科技有限公司 | A kind of chip mounter of anti-deviation replaceable suction nozzle |
WO2018041966A1 (en) | 2016-08-31 | 2018-03-08 | Sigma Clermont | Mechanical transmision device and system comprising such a device |
US10190994B2 (en) | 2015-06-05 | 2019-01-29 | Kla-Tencor Corporation | Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices |
US10324044B2 (en) | 2014-12-05 | 2019-06-18 | Kla-Tencor Corporation | Apparatus, method and computer program product for defect detection in work pieces |
CN110494034A (en) * | 2019-08-30 | 2019-11-22 | 青岛飞梭科技有限公司 | Multilayer year wheeled rotary pneumatic road device |
CN111788035A (en) * | 2018-02-26 | 2020-10-16 | 环球仪器公司 | Dispensing head, nozzle and method |
US11375651B2 (en) | 2018-02-26 | 2022-06-28 | Universal Instruments Corporation | Dispensing head, nozzle and method |
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- 2013-08-12 EP EP13180071.6A patent/EP2699071B1/en active Active
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US20150298316A1 (en) * | 2014-04-18 | 2015-10-22 | Kla-Tencor Corporation | Pick and place device with automatic pick-up-height adjustment and a method and a computer program product to automatically adjust the pick-up-height of a pick and place device |
US9669550B2 (en) | 2014-04-18 | 2017-06-06 | Kla-Tencor Corporation | Pick and place device with automatic pick-up-height adjustment and a method and a computer program product to automatically adjust the pick-up-height of a pick and place device |
CN104261127A (en) * | 2014-09-10 | 2015-01-07 | 苏州赛腾精密电子有限公司 | Blanking taking and placing mechanism |
US10935503B2 (en) | 2014-12-05 | 2021-03-02 | Kla Corporation | Apparatus, method and computer program product for defect detection in work pieces |
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US10324044B2 (en) | 2014-12-05 | 2019-06-18 | Kla-Tencor Corporation | Apparatus, method and computer program product for defect detection in work pieces |
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US11105839B2 (en) | 2014-12-05 | 2021-08-31 | Kla Corporation | Apparatus, method and computer program product for defect detection in work pieces |
CN104495372A (en) * | 2014-12-16 | 2015-04-08 | 苏州慧捷自动化科技有限公司 | Filter cotton vacuum adsorption device |
US10190994B2 (en) | 2015-06-05 | 2019-01-29 | Kla-Tencor Corporation | Apparatus, method and computer program product for inspection of at least side faces of semiconductor devices |
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Also Published As
Publication number | Publication date |
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PL2699071T3 (en) | 2017-04-28 |
PL222470B1 (en) | 2016-07-29 |
PL400384A1 (en) | 2014-02-17 |
EP2699071A3 (en) | 2014-10-22 |
EP2699071B1 (en) | 2016-11-09 |
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