JP6131023B2 - Nozzle replacement mechanism and electronic component mounting apparatus - Google Patents

Description

  The present invention relates to a nozzle exchanging mechanism that is used when exchanging nozzles held by a head, and an electronic component mounting apparatus that uses the nozzle exchanging mechanism to move an electronic component while holding the nozzle with a nozzle.

  An electronic component mounting apparatus for mounting an electronic component on a substrate has a head including a nozzle, holds the electronic component with the nozzle, and mounts the electronic component on the substrate. The electronic component mounting device picks up the components in the electronic component supply device by moving the head nozzle in a direction perpendicular to the surface of the substrate, and then moves the head relatively in a direction parallel to the surface of the substrate. Then, when the picked-up component arrives at the mounting position, the sucked electronic component is mounted on the substrate by moving the nozzle of the head in a direction perpendicular to the surface of the substrate and bringing it closer to the substrate.

  Some electronic component mounting apparatuses are detachable with nozzles attached to a head. For example, Patent Document 1 describes a mechanism for mounting a nozzle portion on a socket portion. Some electronic component mounting apparatuses include a nozzle replacement mechanism. An electronic component mounting apparatus including a nozzle replacement mechanism replaces a nozzle that holds an electronic component corresponding to the electronic component to be mounted on the substrate, and mounts the electronic component on the substrate with a head that has replaced the nozzle.

JP 2002-178285 A

  Here, as described in Patent Document 1, the nozzle replacement mechanism of the electronic component mounting apparatus moves the nozzle holding portion over the position where the nozzle is placed, lowers the nozzle holding portion, and By connecting the nozzle holding part and the nozzle holding part, the nozzle is attached to the nozzle holding part of the head. Here, the nozzle needs to be removed from the nozzle replacement mechanism while being held in the nozzle holding portion. For this reason, the portion of the nozzle replacement mechanism that holds the nozzle needs to be larger than the portion of the nozzle below the holding position, and the shape of the nozzle is restricted. For example, a nozzle that can hold a large electronic component cannot be held by the same nozzle changer.

  The present invention has been made in view of the above, and provides a nozzle replacement mechanism and an electronic component mounting apparatus that can deal with more types of nozzles and can hold more nozzles. The purpose is to do.

  In order to solve the above-described problems and achieve the object, the present invention provides a nozzle replacement mechanism that holds a plurality of nozzles in a state that it can be attached to a nozzle holding portion of a head, in which the nozzles are stored in a horizontal direction. A storage plate formed with a U-shaped storage hole that is partially opened, and a holding mechanism that holds the nozzle in the storage hole, the holding mechanism being a U-shaped storage hole. A stopper disposed at a position facing the opened end, and a distance from the storage hole in a direction perpendicular to the opened surface from a position where the stopper is held in the storage hole by the stopper. And a drive mechanism that moves to a position larger than the diameter of the nozzle.

  The storage plate has a plurality of storage holes formed in a row, and the stopper is a bar-shaped member extending in one direction and faces the storage holes formed in a row. Is preferred.

  Moreover, it is preferable that the said holding mechanism is a projection part which is arrange | positioned at the at least one of the open ends of the U shape of the said storage hole, and narrows the width | variety of the open end of the said U shape.

  Moreover, it is preferable that the said protrusion part is formed with the elastic member.

  In order to solve the above-described problems and achieve the object, the present invention provides an electronic component mounting apparatus, the nozzle replacement mechanism according to any one of the above, a nozzle holding unit to which a nozzle is mounted, and the nozzle A head body having a nozzle driving unit that drives the holding unit up and down and rotates together with the nozzle and supplies air pressure for driving the nozzle to the nozzle, and a head support that supports the nozzle holding unit and the nozzle driving unit. A head moving mechanism for moving the head body, and a control device for controlling the movement of the nozzle holding unit by the nozzle driving unit and the head moving mechanism and the operation of the nozzle replacement mechanism, and the control device. After moving the nozzle holding part and connecting it to the nozzle stored in the nozzle replacement mechanism, the storage hole is opened in the horizontal direction. Moving the nozzle holder in the direction in which characterized in that removing the nozzle connected to the nozzle holder from the storage hole.

  Further, the control device moves the nozzle holding portion, and positions the mounted nozzle at a position displaced from the storage hole by a certain distance in the opening direction of the storage hole and at the same height as the storage hole. It is preferable to move the nozzle holder toward the storage hole in the horizontal direction and store the nozzle in the storage hole.

  The head body preferably includes an elastic member disposed between the nozzle holding part and the driving part.

  Moreover, it is preferable that the said nozzle holding part is equipped with the magnet which attracts | sucks the said nozzle.

  The present invention can cope with more types of nozzles and can hold more nozzles.

FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. FIG. 2 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram illustrating a schematic configuration of a nozzle and a nozzle support portion. FIG. 5 is a perspective view showing a schematic configuration of the nozzle replacement mechanism. FIG. 6 is a top view illustrating a schematic configuration of the nozzle replacement mechanism. FIG. 7A is a top view showing a schematic configuration of the storage hole. FIG. 7B is a top view illustrating a schematic configuration of another example of the storage hole. FIG. 7C is a top view illustrating a schematic configuration of another example of the storage hole. FIG. 8 is an explanatory diagram for explaining the operation of the nozzle replacement mechanism. FIG. 9 is an explanatory diagram for explaining the operation of the nozzle replacement mechanism. FIG. 10 is a perspective view showing a schematic configuration of another example of the nozzle replacement mechanism. FIG. 11 is a top view illustrating a schematic configuration of another example of the nozzle replacement mechanism. FIG. 12 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 13 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. FIG. 14 is a flowchart illustrating an example of the nozzle replacement operation of the electronic component mounting apparatus. FIG. 15 is an explanatory diagram showing the relationship between the movement of the nozzle holding portion and the stopper in the nozzle replacement operation. FIG. 16 is an explanatory diagram showing the relationship between the movement of the nozzle holding portion and the stopper in the nozzle replacement operation. FIG. 17 is a flowchart illustrating an example of the nozzle replacement operation of the electronic component mounting apparatus.

  Hereinafter, the present invention will be described in detail with reference to the drawings. The present invention is not limited by the following modes for carrying out the invention (hereinafter referred to as embodiments). In addition, constituent elements in the following embodiments include those that can be easily assumed by those skilled in the art, those that are substantially the same, and those in a so-called equivalent range. Furthermore, the constituent elements disclosed in the following embodiments can be appropriately combined.

  FIG. 1 is a schematic diagram showing a schematic configuration of an electronic component mounting apparatus. Next, the electronic component mounting apparatus 10 will be described with reference to FIG. An electronic component mounting apparatus 10 shown in FIG. 1 is an apparatus for mounting electronic components on a substrate 8. The electronic component mounting apparatus 10 includes a housing 11, a board transport unit 12, component supply units 14 f and 14 r, a head 15, an XY movement mechanism 16, a nozzle replacement mechanism 18, a control device 20, and an operation unit 40. And a display unit 42. The XY moving mechanism 16 includes an X-axis drive unit 22 and a Y-axis drive unit 24. In the electronic component mounting apparatus 10 of FIG. 1, the control device 20, the operation unit 40, and the display unit 42 are arranged outside the housing 11, but may be built in the housing 11.

  Here, the electronic component mounting apparatus 10 of this embodiment is provided with component supply units 14f and 14r as shown in FIG. As described above, the electronic component mounting apparatus 10 includes two component supply units. In the electronic component mounting apparatus 10, the component supply unit 14 f is disposed on the front side of the electronic component mounting apparatus 10, and the component supply unit 14 r is disposed on the rear side of the electronic component mounting apparatus 10. In the following description, the two component supply units 14f and 14r are referred to as a component supply unit 14 unless particularly distinguished.

  The board | substrate 8 should just be a member which mounts an electronic component, and the structure is not specifically limited. The substrate 8 of the present embodiment is a plate-like member, and a wiring pattern is provided on the surface. Solder which is a bonding member for bonding the wiring pattern of the plate-like member and the electronic component is attached to the surface of the wiring pattern provided on the substrate 8 by reflow. In the electronic component mounting apparatus 10 of FIG. 1, the substrate 8 is transferred by the substrate transfer unit 12.

  The housing 11 is a box that accommodates each part of the electronic component mounting apparatus 10. The housing 11 incorporates each part of the electronic component mounting apparatus 10. The housing 11 includes a front-side component supply unit 14f, an operation unit 40, and a display unit 42 on the front side, and a rear-side component supply unit 14r on the rear side. The housing 11 is formed with two openings for carrying the substrate 8 into and out of the apparatus on two side surfaces (opposing side surfaces where the component supply units 14f and 14r are not disposed).

  The substrate transport unit 12 is a transport mechanism that transports the substrate 8 in the X-axis direction in the drawing. The substrate transport unit 12 includes a rail that extends in the X-axis direction, and a transport mechanism that supports the substrate 8 and moves the substrate 8 along the rail. The substrate transport unit 12 transports the substrate 8 in the X-axis direction by moving the substrate 8 along the rail by the transport mechanism in a direction in which the mounting target surface of the substrate 8 faces the head 15. The board transport unit 12 transports the board 8 supplied from the equipment supplied to the electronic component mounting apparatus 10 to a predetermined position on the rail. The head 15 mounts an electronic component on the surface of the substrate 8 at the predetermined position. When the electronic component is mounted on the substrate 8 that has been transported to the predetermined position, the substrate transport unit 12 transports the substrate 8 to an apparatus that performs the next step. Various structures can be used as the transport mechanism of the substrate transport unit 12. For example, a belt system in which a transport mechanism is integrated, in which a rail disposed along the transport direction of the substrate 8 and an endless belt rotating along the rail are combined and transported in a state where the substrate 8 is mounted on the endless belt. Can be used. The substrate transport unit 12 may include a position adjustment mechanism that adjusts the position in the Y direction according to the size of the substrate 8 to be transported. In the present embodiment, the substrate transport unit 12 is provided and the substrate is transported. However, the number of substrate transport units is not particularly limited, and may be two or more.

  In the electronic component mounting apparatus 10, a component supply unit 14f is disposed on the front side, and a component supply unit 14r is disposed on the rear side. The front-side component supply unit 14f holds a large number of electronic components mounted on the substrate 8, and can supply the head 15 with the electronic components, that is, the electrons supplied to the holding position while being held (adsorbed or gripped) by the head 15. A component supply device is provided. The rear-side component supply unit 14r holds a large number of electronic components mounted on the substrate 8 and can supply the head 15 with the electronic components, that is, the electrons supplied to the holding position in a state where the head 15 can hold (suck or hold) the electronic components. A component supply device is provided. The component supply units 14f and 14r of the present embodiment have the same configuration and include a plurality of electronic component supply devices 100. The electronic component supply apparatus 100 supplies the electronic component to a holding position where the head 15 holds the electronic component. Hereinafter, the configuration of the component supply unit 14 will be described.

  The component supply unit 14 includes a plurality of electronic component supply devices (hereinafter also simply referred to as “component supply devices”) 100. The plurality of component supply devices 100 are held on a support base (bank). Moreover, the support stand can be mounted with other devices (for example, a measuring device, a camera, etc.) of the component supply device 100.

  In addition, the component supply unit 14 is mounted with an electronic component holding tape (chip component tape) in which a plurality of mounted electronic components are fixed to the tape body, and a holding position (first position) of the mounted electronic component held by the electronic component holding tape. The electronic component supply device 100 is provided that can be peeled off from the tape main body at one holding position and can be held by a suction nozzle or a gripping nozzle provided in the head.

  The electronic component supply apparatus 100 uses an electronic component holding tape configured by attaching a chip-type electronic component mounted on a substrate to a tape, and holds an electronic component on the head 15 (suction position, gripping position, holding position). To supply. The electronic components supplied to the holding position by each component supply device 100 are mounted on the substrate 8 by the head 15. In the electronic component holding tape, a plurality of storage chambers are formed in the tape, and the electronic components are stored in the storage chamber. The electronic component supply device 100 is a tape feeder that holds an electronic component holding tape, sends the held electronic component holding tape, and moves the storage chamber to a holding region where the electronic component can be adsorbed by the nozzles of the head 15. By moving the storage chamber to the holding area, the electronic component accommodated in the storage chamber can be exposed to a predetermined position, and the electronic component is sucked and held by the nozzle of the head 15. Can do. The plurality of component supply apparatuses 100 may supply different types of electronic components or separate electronic components.

  The electronic component supply apparatus 100 is not limited to a tape feeder, and can be various chip component feeders that supply chip-type electronic components. As the chip component feeder, for example, a stick feeder or a bulk feeder can be used. Note that examples of the chip-type electronic component (mounted electronic component) include SOP and QFP. The chip-type electronic component is mounted on the substrate 8 by being placed on the surface of the substrate 8.

  The component supply unit 14 includes a plurality of component supply devices 100 that are different from each other in the type of electronic component to be mounted, the mechanism for holding the electronic component, or the supply mechanism. . The component supply unit 14 may include a plurality of the same type of component supply devices 100. The component supply unit 14 is preferably configured to be detachable from the apparatus main body. The component supply unit 14 can use various electronic component supply devices that supply electronic components. For example, the component supply unit 14 may install a stick feeder or a tray feeder as the electronic component supply apparatus 100. Further, the component supply unit 14 may be provided with a bowl feeder as the component supply device 100.

  Moreover, although the component supply unit 14 of this embodiment was demonstrated as a case where a chip type electronic component is supplied, it can also supply a lead type electronic component. For example, the component supply unit 14 is mounted with an electronic component holding tape (radial component tape) in which a plurality of radial lead type electronic components (radial lead components) are fixed to the tape body, and is held by the electronic component holding tape. The electronic component lead is cut at the holding position (second holding position), and a plurality of electronic component supply devices are mounted so that the radial lead type electronic component at the holding position can be held by the suction nozzle or gripping nozzle provided in the head. You can also. An electronic component supply device that supplies radial lead type electronic components cuts and separates the lead of the radial lead type electronic component that has been moved to the holding area, thereby removing the radial lead type electronic component having the lead fixed by the tape. The radial lead type electronic component can be held (sucked and gripped) by the nozzle of the head 15. A radial lead type electronic component is mounted on a substrate by inserting a lead into an insertion hole formed in the substrate.

  The head 15 holds (sucks or holds) an electronic component held by the component supply unit 14 (mounted electronic component held by the electronic component supply apparatus 100) with a nozzle, and the held electronic component is held by the substrate transport unit 12. This is a mechanism for mounting on the substrate 8 moved to a predetermined position. The head 15 of this embodiment holds electronic components held by the component supply unit 14f and the component supply unit 14r with nozzles and mounts them on the substrate 8 conveyed by the substrate conveyance unit 12. That is, the head 15 holds at least one of the electronic components of the front-side component supply unit 14 f and the rear-side component supply unit 14 r and mounts it on the substrate 8. The configuration of the head 15 will be described later.

  The XY moving mechanism 16 is a moving mechanism that moves the head 15 in the X-axis direction and the Y-axis direction in FIG. 1, that is, on a plane parallel to the surface of the substrate 8, and the X-axis driving unit 22 and the Y-axis driving unit 24. Have The X-axis drive unit 22 is connected to the head 15 and moves the head 15 in the X-axis direction. The Y-axis drive unit 24 is connected to the head 15 via the X-axis drive unit 22 and moves the head 15 in the Y-axis direction by moving the X-axis drive unit 22 in the Y-axis direction. The Y-axis drive unit 24 has a ball screw 24 a arranged in a direction in which the axis is in the Y-axis direction, a drive unit 24 b that drives, that is, rotates the ball screw 24 a, and a holder that fixes the ball screw 24 a and the drive unit 24 b to the housing 11. Part 24c. The Y-axis drive unit 24 moves the X-axis drive unit 22 screwed to the ball screw 24a in the Y-axis direction by rotating the ball screw 24a that is rotatably fixed to the holding unit 24c with the drive unit 24b. In the Y-axis drive unit 24, units in which the ball screw 24a, the drive unit 24b, and the holding unit 24c are combined are arranged at both ends in the X-axis direction, and hold both ends of the X-axis drive unit 22. The XY moving mechanism 16 can move the head 15 to the position facing the substrate 8 or the position facing the component supply units 14f and 14r by moving the head 15 in the XY axis direction. The XY moving mechanism 16 adjusts the relative position of the head 15 and the substrate 8 by moving the head 15. Thus, the electronic component held by the head 15 can be moved to an arbitrary position on the surface of the substrate 8, and the electronic component can be mounted at an arbitrary position on the surface of the substrate 8. In other words, the XY moving mechanism 16 is included in the head moving mechanism, and moves the head 15 on the horizontal plane (XY plane) to transfer the electronic components in the electronic component supply apparatus 100 of the component supply units 14f and 14r to the predetermined of the substrate 8. It becomes a transfer means which transfers to a position (mounting position, mounting position). As the X-axis drive unit 22, various mechanisms that move the head 15 in a predetermined direction can be used. As the Y-axis drive unit 24, various mechanisms that move the X-axis drive unit 22 in a predetermined direction can be used. As a mechanism for moving the object in a predetermined direction, for example, a linear motor, a rack and pinion, a transport mechanism using a ball screw, a transport mechanism using a belt, or the like can be used.

  The nozzle replacement mechanism 18 is disposed at a position that overlaps the movable region of the corresponding head 15 on the XY plane, and that the position in the Z direction is lower than the head 15 in the vertical direction.

  The nozzle replacement mechanism 18 is a mechanism that includes a plurality of types of nozzles and replaces the nozzles held (mounted) by the corresponding head 15. The nozzle replacement mechanism 18 includes a mechanism capable of holding a plurality of nozzles. Moreover, it is preferable that the nozzle replacement mechanism 18 is in a state where at least one nozzle holding unit does not hold the nozzle, that is, in an empty region. Thereby, the replacement of the nozzle can be performed smoothly. Here, the nozzle replacement mechanism 18 of the present embodiment can hold both the suction nozzle that is held by sucking the electronic component and the gripping nozzle that is held by gripping the electronic component. The nozzle replacement mechanism 18 holds a plurality of types of nozzles in a state where the head 15 can be attached and detached. The head 15 changes the nozzle to be mounted by the nozzle replacement mechanism 18, and supplies air pressure to the mounted nozzle to drive it, thereby holding the electronic component to be held under appropriate conditions (suction or gripping). Can do. The nozzle holding mechanism 18 will be described later.

  The control device 20 controls each part of the electronic component mounting apparatus 10. The control device 20 is an aggregate of various control units. The operation unit 40 is an input device through which an operator inputs an operation, and includes a keyboard, a mouse, a touch panel, and the like. The operation unit 40 sends the detected various inputs to the control device 20. The display unit 42 is a screen that displays various types of information to the worker, and includes a touch panel, a vision monitor, and the like. The display unit 42 displays various images on the touch panel and the vision monitor based on the image signal input from the control device 20.

  Next, the configuration of the head 15 will be described with reference to FIGS. FIG. 2 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 3 is a schematic diagram showing a schematic configuration of the head of the electronic component mounting apparatus. FIG. 4 is a schematic diagram illustrating a schematic configuration of a nozzle and a nozzle support portion. In FIG. 2, various control units that control the electronic component mounting apparatus 10 and one component supply device 100 of the component supply unit 14 are also shown. As shown in FIGS. 2 and 3, the head 15 includes a head body 30, an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device (component state detection unit, state detection). Part) 38.

  As shown in FIG. 2, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64. The control unit 60, the head control unit 62, and the component supply control unit 64 are part of the control device 20 described above. In addition, the electronic component mounting apparatus 10 is connected to a power source and supplies power supplied from the power source to each unit using the control unit 60, the head control unit 62, the component supply control unit 64, and various circuits. The control unit 60, the head control unit 62, and the component supply control unit 64 will be described later.

  In the electronic component supply device 100, the main body of the electronic component 80 is exposed upward on the electronic component holding tape. The electronic component supply apparatus 100 moves the electronic component 80 held on the electronic component holding tape to the holding area (suction area, holding area) by pulling out and moving the electronic component holding tape. In the present embodiment, the vicinity of the tip in the Y-axis direction of the component supply apparatus 100 is a holding region where the nozzle of the head 15 holds the electronic component 80 held on the electronic component holding tape.

  The head body 30 includes a head support 31 that supports each part, a plurality of nozzles 32, a nozzle holding part 33 that holds the nozzles 32, and a nozzle driving part 34. In the head body 30, the nozzle 32, the nozzle holding unit 33, and the nozzle driving unit 34 form one unit, and 6 units are arranged in a row. The six units are arranged in a direction parallel to the X axis. Note that the nozzles 32 shown in FIG. 3 are each provided with a suction nozzle that sucks and holds the electronic component 80.

  The head support 31 is a support member connected to the X-axis drive unit 22 and supports the nozzle 32 and the nozzle drive unit 34. The head support 31 also supports an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device 38.

  The nozzle 32 is a suction mechanism that sucks and holds the electronic component 80. The nozzle 32 includes a connecting portion 32a, a recessed portion 32b, an opening 32c, and a groove 32d. The connecting portion 32 a is a portion on the upper side in the vertical direction of the nozzle 32 and is connected to the nozzle holding portion 33. The connecting portion 32 a has an outer shape that follows the hole portion of the lower portion in the vertical direction of the nozzle holding portion 33. The concave portion 32 b has a smaller diameter than other portions formed in the nozzle 32. It is a part and is a part between the connection part 32a and the opening 32c. The nozzle 32 is provided with a flange having a diameter larger than that of the connecting portion 32a between the connecting portion 32a and the opening 32c. The opening 32 c is formed at the end (tip) on the lower side in the vertical direction of the nozzle 32. The opening 32 c is connected to the nozzle driving unit 34 via an internal cavity and a cavity of the nozzle support part 33. The nozzle 32 sucks air from the opening 32c to suck and hold the electronic component 80 at the tip. The groove 32d is formed in a flange between the connecting portion 32a and the opening 32c. The nozzle 32 is held by the nozzle replacement mechanism 18 by inserting a corresponding portion of the nozzle replacement mechanism 18 into the groove 32d.

  The nozzle 32 can be attached to and detached from the nozzle support portion 33, and is stored (stored) in the nozzle replacement mechanism 18 when it is not attached to the nozzle support portion 33. The nozzle 32 has various shapes and sizes of the opening 32c. In the present embodiment, an adsorption type nozzle having an opening for adsorbing an electronic component is shown. However, an arm that operates by air pressure is used, and a holding type nozzle is used to hold the electronic component by sandwiching it. Can do.

The nozzle holding portion 33 is a mechanism that holds the nozzle 32 at the end (tip) on the lower side in the vertical direction, and includes a shaft 33a, a socket 33b, and a spring (elastic member) 33c.
The shaft 33a is a rod-shaped member, and is arranged extending in the Z-axis direction. The shaft 33a supports the socket 33b disposed at the end portion on the lower side in the vertical direction via the spring 33c. The shaft 33a is instructed to the head support 31 in a state where a portion connected to the socket 33b is movable in the Z-axis direction and rotatable in the θ direction. Here, the Z axis is an axis orthogonal to the XY plane and is a direction orthogonal to the surface of the substrate 8. That is, the θ direction is a direction parallel to the circumferential direction of a circle around the Z axis, which is an axis parallel to the direction in which the nozzle driving unit 34 moves the nozzle 32. The θ direction is the rotation direction of the nozzle 32. The portion of the shaft 33a that is connected to the socket 33b is moved and rotated in the Z-axis direction and the θ direction by the nozzle driving unit 34. The shaft 33a has an air pipe (pipe) that connects the opening 32c and the suction mechanism of the nozzle drive unit 34 therein. The socket 33b is a portion connected to the nozzle 32, and is disposed on the lower side in the vertical direction of the shaft 33a. As described above, the socket 33b has a hole corresponding to the shape of the connecting portion 32a of the nozzle 32. The spring 33c is disposed between the shaft 33a and the socket 33b, and the socket 33b is movable in the Z-axis direction with respect to the shaft 33a, and a force can be applied from the shaft 33a to the socket 33b. Thereby, even if force acts on the socket 33b, the nozzle holding | maintenance part 33 can suppress that the spring 33c elastically deforms and a big force acts on the nozzle 32, the board | substrate 8, and an electronic component. Further, the nozzle holding part 33 can absorb the force with the spring 33c, so that the socket 33b and the nozzle 32 can be brought into contact with each other more reliably. Thereby, when the nozzle 32 is attached to the nozzle holding part 33, the nozzle 32 can be held more reliably by the nozzle holding part 33.

  Here, the nozzle holding part 33 of the present embodiment further includes a magnet 33d in the socket 33b. The nozzle holding part 33 can attract the nozzle 32 to the socket 33b by the magnetic force of the magnet 33d. Thereby, the nozzle holding | maintenance part 33 can hold | maintain the nozzle 32 more reliably.

  The nozzle driving unit 34 moves the nozzle holding unit 33 in the Z-axis direction to move the nozzle 32 in the Z-axis direction, and sucks the electronic component 80 through the opening 32 c of the nozzle 32. Further, the nozzle drive unit 34 rotates the nozzle 32 in the θ direction by rotating the nozzle holding unit 33 in the θ direction when the electronic component 80 is mounted.

  As the mechanism for moving the nozzle 32 in the Z-axis direction, the nozzle driving unit 34 includes, for example, a mechanism having a linear motion linear motor in which the Z-axis direction is the driving direction. The nozzle drive unit 34 moves the shaft 32a of the nozzle holding unit 33 in the Z-axis direction with a linear motion linear motor, thereby moving the opening 32c at the tip of the nozzle 32 in the Z-axis direction. In addition, the nozzle driving unit 34 includes a mechanism configured by, for example, a motor and a transmission element connected to a portion of the shaft 33a connected to the nozzle 32 as a mechanism for rotating the nozzle 32 in the θ direction. The nozzle driving unit 34 transmits the driving force output from the motor to the shaft 33a by a transmission element, and rotates the shaft 33a in the θ direction, thereby rotating the tip of the nozzle 32 in the θ direction.

  The nozzle drive unit 34 has a mechanism for sucking the electronic component 80 through the opening 32c of the nozzle 32, that is, as a suction mechanism, for example, an air pipe connected to the opening 32c of the nozzle 32, and a pump connected to the air pipe. And a solenoid valve that switches between opening and closing the pipe of the air pipe. The nozzle drive unit 34 sucks air from the air pipe with a pump, and switches whether to suck air from the opening 32c by switching between opening and closing of the electromagnetic valve. The nozzle drive unit 34 opens the electromagnetic valve and sucks (holds) the electronic component 80 into the opening 32c by sucking air from the opening 32c. The nozzle driving unit 34 closes the electromagnetic valve and does not suck air from the opening 32c and sucks it into the opening 32c. The electronic component 80 that has been opened is opened, that is, the electronic component 80 is not sucked (not held) by the opening 32c.

  Further, the head 15 of the present embodiment uses a gripping nozzle, which will be described later, when the upper surface of the main body has a shape that cannot be sucked by the nozzle (suction nozzle) 32 when holding the main body of the electronic component 80. The gripping nozzle can open and close the main body of the electronic component 80 from above by opening and closing the movable piece with respect to the fixed piece by sucking and releasing air in the same manner as the suction nozzle. Moreover, the head 15 can change the nozzle 32 which the nozzle drive part 34 drives by moving the nozzle 32 by the nozzle drive part 34, and performing replacement | exchange operation | movement.

  The imaging device 36 is fixed to the head support 31 of the head body 30 and images an area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The imaging device 36 has a camera and an illumination device, and acquires an image with the camera while illuminating the visual field with the illumination device. Thereby, an image of a position facing the head body 30, for example, various images of the substrate 8 and the component supply unit 14 can be taken. For example, the imaging device 36 captures an image of a BOC mark (hereinafter also simply referred to as a BOC) or a through hole (insertion hole) as a reference mark formed on the surface of the substrate 8. Here, when a reference mark other than the BOC mark is used, an image of the reference mark is taken.

  The height sensor 37 is fixed to the head support 31 of the head body 30 and measures the distance from the area facing the head 15, for example, the substrate 8 or the substrate 8 on which the electronic component 80 is mounted. The height sensor 37 includes a light emitting element that emits laser light and a light receiving element that receives the laser light reflected and returned at the facing position, and the time from when the laser light is emitted until it is received. It is possible to use a laser sensor that measures the distance from the facing part. In addition, the height sensor 37 processes the distance from the facing portion using the position of the sensor itself and the position of the substrate 8 to measure the height of the facing portion, specifically, the electronic component 80. To detect. The process of detecting the height of the electronic component 80 based on the measurement result of the distance from the electronic component 80 may be performed by the control unit 60.

  The laser recognition device 38 includes a light source 38a and a light receiving element 38b. The laser recognition device 38 is built in the bracket 50. As shown in FIG. 2, the bracket 50 is connected to the lower side of the head support 31, the substrate 8, and the component supply device 100 side. The laser recognition device 38 is a device that detects the state of the electronic component 80 by irradiating the electronic component 80 sucked by the nozzle 32 of the head body 30 with laser light. Here, the state of the electronic component 80 includes the shape of the electronic component 80, whether the electronic component 80 is sucked in the correct posture by the nozzle 32, and the like. The light source 38a is a light emitting element that outputs laser light. The light receiving element 38b has a position in the Z-axis direction, that is, a position having the same height, and is disposed at a position facing the light source 38a.

  The head 15 is configured as described above. Although the head 15 of the above embodiment has been described as a case where the suction nozzle is mounted on the nozzle 32, a gripping nozzle that grips and holds the electronic component on the nozzle 32 can be used. Even when a gripping nozzle is used as the nozzle 32, the head 15 operates the gripping nozzle drive unit by adjusting the air pressure supplied to the nozzle 32, and holds and releases the electronic component. Switch. The head 15 preferably includes an imaging device (substrate state detection unit) 36, a height sensor (substrate state detection unit) 37, and a laser recognition device 38, but may not necessarily include them.

  Next, the control function of the device configuration of the electronic component mounting apparatus 10 will be described. As illustrated in FIG. 2, the electronic component mounting apparatus 10 includes a control unit 60, a head control unit 62, and a component supply control unit 64 as the control device 20. Each of the various control units is configured by a member having an arithmetic processing function and a storage function such as a CPU, a ROM, and a RAM. In this embodiment, a plurality of control units are used for convenience of explanation, but a single control unit may be used. Further, when the control function of the electronic component mounting apparatus 10 is a single control unit, it may be realized by one arithmetic device or a plurality of arithmetic devices.

  The control unit 60 is connected to each unit of the electronic component mounting apparatus 10 and executes a stored program based on the input operation signal and information detected by each unit of the electronic component mounting apparatus 10. Control the operation of each part. The control unit 60 controls, for example, the transport operation of the substrate 8, the drive operation of the head 15 by the XY movement mechanism 16, the shape detection operation by the laser recognition device 38, and the like. Further, the control unit 60 sends various instructions to the head control unit 62 as described above, and also controls the control operation by the head control unit 62. The control unit 60 also controls the control operation by the component supply control unit 64. The control unit 60 also controls the operation of the nozzle replacement mechanism 18.

  The head control unit 62 is connected to the nozzle driving unit 34 and various sensors and the control unit 60 disposed on the head support 31, and controls the nozzle driving unit 34 to control the operation of the nozzle 32. The head control unit 62 performs the suction (holding) / release operation of the electronic component 80 of the nozzle 32 and the operation of each nozzle 32 based on the operation instruction supplied from the control unit 60 and the detection results of various sensors (for example, a distance sensor). Controls the rotation operation and the movement operation in the Z-axis direction.

  The component supply control unit 64 controls the operation of supplying the electronic component 80 by the component supply units 14f and 14r. The component supply control unit 64 may be provided for each component supply device 100 or may control all the component supply devices 100 by one. For example, the component supply control unit 64 controls tray replacement operation and movement operation by the electronic component supply apparatus 100. Further, the component supply control unit 64 controls the electronic component holding tape withdrawing operation (moving operation) by the component supplying device 100. The component supply control unit 64 executes various operations based on instructions from the control unit 60. The component supply control unit 64 controls the movement of the electronic component holding tape by controlling the drawing operation of the electronic component holding tape.

  Next, the nozzle replacement mechanism will be described in more detail with reference to FIGS. FIG. 5 is a perspective view showing a schematic configuration of the nozzle replacement mechanism. FIG. 6 is a top view illustrating a schematic configuration of the nozzle replacement mechanism. FIG. 7A is a top view showing a schematic configuration of the storage hole. 7B and 7C are top views showing a schematic configuration of another example of the storage hole. FIG. 8 is an explanatory diagram for explaining the operation of the nozzle replacement mechanism. FIG. 9 is an explanatory diagram for explaining the operation of the nozzle replacement mechanism.

  As shown in FIGS. 5 and 6, the nozzle replacement mechanism 18 includes a base 110, a storage plate 112 in which a plurality of storage holes 130 are formed, a stopper 114, and a drive mechanism 116. The nozzle replacement mechanism 18 is a holding mechanism in which the combination of the stopper 114 and the driving mechanism 116 holds the nozzle stored in the storage hole 130. The base 110 is installed in the housing 11 and supports the storage plate 112, the stopper 114, and the drive mechanism 116.

  The storage plate 112 is a plate-like member supported by the base 110 and is disposed in a direction parallel to the XY plane, that is, in a direction in which the widest surface is disposed in the horizontal direction. The storage plate 112 has a plurality of storage holes 130 formed therein. The storage plate 112 has a plurality of storage holes 130 formed in a row. Specifically, a plurality of storage holes 130 are formed side by side in the X direction. In addition, two rows of storage holes 130 arranged in the X direction are formed in the Y direction. The storage hole 130 is a hole penetrating in the vertical direction, and as shown in FIG. 7A, has a U-shape in which a part of the surface is opened in the horizontal direction. The storage plate 112 is formed with an opening extending in the X direction at the end of the storage hole 130 on the opened side, and the plurality of storage holes 130 arranged in the X direction are connected by the opening.

  Here, the storage hole 130 of the present embodiment is U-shaped when the wall surface 150 of the opening is connected, that is, the opening shape is U-shaped. However, the present invention is not limited to this. The storage hole 130 may have a shape that can hold the nozzle 32 and that is at least partially opened in the horizontal direction. The shape in which a part of the storage hole 130 is opened in the horizontal direction means that when the nozzle is moved in the horizontal direction, the nozzle 32 passes through the space opened in the horizontal direction and the nozzle 32 is detached from the storage hole 130. It is a shape that can be moved to. Note that the storage hole 130 of the present embodiment holds the nozzle 32 in the storage hole 130 by inserting the end portion of the U-shaped unclosed side into the groove 32 d of the nozzle 32.

  The storage hole 130a shown in FIG. 7B includes a protrusion 152 at the end of the wall 150 that is open. The protrusions 152 are respectively disposed at two ends of the U-shaped open side. The protrusion 152 protrudes toward the end opposite to the provided end. As a result, the storage hole 130a has a shape in which the end side of the U-shaped wall surface 150 is narrowed by the protrusion 152, and the nozzle 32 stored in the storage hole 130a can be reliably held in the storage hole 130a. In this case, the nozzle replacement mechanism includes the protrusion 152 in the holding mechanism. Moreover, although the storage hole 130a shown to FIG. 7B provided the projection part 152 in both the two edge parts of the open side of a U-shape, you may provide the projection part 152 only in any one. The storage hole can reliably hold the nozzle 32 in the storage hole by providing the projection 152 at either one of the end portions.

  The storage hole 130b of the nozzle replacement mechanism shown in FIG. 7C includes a magnet 154 at the end of the wall 150 that is not open. The storage hole 130b is provided with a magnet 154 at the end of the wall 150 where the U-shape is not opened, so that the nozzle 32 stored in the storage hole 130b is opened by the magnet 154 in the U-shape of the wall 150. Can be sucked into the end of the side that is not. Thereby, the nozzle 32 stored in the storage hole 130b can be reliably held in the storage hole 130b. In this case, in the nozzle replacement mechanism, the magnet 154 is included in the holding mechanism.

  The stopper 114 is a rod-like member arranged on the open end side of the storage holes 130 arranged in a row, and the surface on the storage hole 130 side becomes the contact portion 142. In the nozzle replacement mechanism 18, one stopper 114 is arranged for each of the plurality of storage holes 130 arranged in two rows. That is, in the nozzle replacement mechanism 18, the two stoppers 114 are arranged corresponding to different rows configured by the plurality of storage holes 130. The stopper 114 is arranged in a direction parallel to the arrangement direction of the plurality of storage holes 130 in which the bar-shaped members are arranged in a row, and one bar-shaped member is an end portion where the plurality of storage holes 130 are opened. Are facing each other.

The drive mechanism 116 is a mechanism that moves the stopper 114 with respect to the storage hole 130, and includes a rotation part 122, a rotation shaft 124, and a linear movement part 126. The rotation part 122 includes two stoppers 112. Are connected. The rotating shaft 124 is fixed to the base 110 and supports the rotating unit 122 in a rotatable state. The linear motion part 126 is connected to the end of the rotation part 122 that is connected to the stopper 112 via the rotary shaft 124 at the opposite end.
The linear motion part 126 moves in the linear motion direction by a drive source. The linear motion part 126 is connected to the rotation part 122 by a long hole and a bolt inserted into the long hole. Thereby, the connection part of the linear motion part 126 and the rotation part 122 will be in the state which can be moved, and the linear motion of the linear motion part 126 is transmitted to the rotation part 122 as rotational motion, maintaining a connection state. .

  The nozzle replacement mechanism 18 is configured as described above, and has a shape in which a part of the storage hole 130 that holds the nozzle 32 in the horizontal direction is opened, and a stopper 114 and a drive mechanism 116 are provided at the opened end. A holding mechanism is provided to keep the nozzle 32 from coming off the storage hole 130. Further, the nozzle replacement mechanism 18 moves the stopper 114 by the drive mechanism 116, so that the contact portion 142 of the stopper 114 comes into contact with the nozzle 30 stored in the storage hole 130 as shown in FIG. The stopper 114 can be moved to a position where the contact portion 142 of the stopper 114 is away from the storage hole 130 as shown in FIG. Here, the position where the contact portion 142 of the stopper 114 is separated from the storage hole 130 is a position where the distance between the end of the storage hole 130 on the opened side and the stopper 114 is larger than the diameter of the nozzle. . That is, the stopper 114 is separated from the storage hole 130 until the nozzle 32 stored in the storage hole 130 can pass between the storage hole 130 and the contact portion 142.

  As described above, the nozzle replacement mechanism 18 stores the nozzle 32 in the storage hole 130 from the horizontal direction by forming the storage hole 130 in a U-shape and opening a part of the hole for holding the nozzle 32. be able to. As a result, the nozzle 32 can be stored in the storage hole 130 after the nozzle 32 is moved in the Z-axis direction until the holding position of the nozzle 32 becomes the same position as the storage hole 130, and therefore the tip of the nozzle 32 (downward in the vertical direction). Even if the shape of the side portion is larger than the storage hole 130, it can be stored in the storage hole 130. In addition, the nozzle replacement mechanism 18 can store a nozzle having a tip portion larger than the diameter of the storage hole 130, so that the diameter of the storage hole 130 can be reduced. Thereby, the arrangement | positioning density of the storage hole 130 can be made higher. Thereby, it can respond to more types of nozzles, and can hold more nozzles.

  Further, the nozzle replacement mechanism 18 can suitably hold the nozzle 32 in the storage hole 130 even if the nozzle replacement mechanism 18 is provided with the stopper 114 and the drive mechanism 116 as a holding mechanism so that a part of the storage hole 130 is opened. Further, the nozzle replacement mechanism 18 moves all the stoppers 114 in conjunction with each other by the drive mechanism 116, so that which nozzle 32 is replaced when the nozzle 32 is replaced (the nozzle 32 in the storage hole 130 is replaced by the nozzle holding portion 33). And the case where the nozzle 32 attached to the nozzle holding portion 33 is stored in the storage hole 130) can be handled by the same operation, and the control can be simplified. Further, as described above, the protrusion 152 and the magnet 154 can be used as the holding mechanism.

  FIG. 10 is a perspective view showing a schematic configuration of another example of the nozzle replacement mechanism. FIG. 11 is a top view illustrating a schematic configuration of another example of the nozzle replacement mechanism. The nozzle replacement mechanism 18a illustrated in FIGS. 10 and 11 includes a base 210, a storage plate 212 in which a plurality of storage holes are formed, a stopper 214, and a drive mechanism 216. The nozzle replacement mechanism 18a is also a holding mechanism in which the combination of the stopper 214 and the driving mechanism 216 holds the nozzle stored in the storage hole. Further, the nozzle replacement mechanism 18a is the same as the nozzle replacement mechanism 18 except that the number of columns formed by a plurality of storage holes arranged in a row and the configuration change associated therewith are different.

  The base 210 is installed in the housing 11 and supports the storage plate 212, the stopper 214, and the drive mechanism 216. The storage plate 212 is a plate-like member supported by the base 210. The storage plate 212 has a plurality of storage holes. The storage plate 212 has four rows of storage holes arranged in the X direction in the Y direction. In the nozzle replacement mechanism 18a, two rows of the plurality of storage holes become one unit 220a, and the remaining two rows become one unit 220b.

  The stopper 214 is a rod-like member arranged on the end side where the storage holes arranged in a row are opened, and the surface on the storage hole side serves as a contact portion. In the nozzle replacement mechanism 18a, one stopper 214 is arranged for each of a plurality of storage holes arranged in four rows. That is, in the nozzle replacement mechanism 18a, the four stoppers 214 are arranged corresponding to the separate rows configured with a plurality of storage holes. The drive mechanism 216 is a mechanism for moving the stopper 214 with respect to the storage hole, and includes one rotation unit 222 including two rotation units 222, two rotation shafts 224, and a linear movement unit 226. Are connected to a stopper 214 corresponding to the unit 220a, and are rotatably supported by one rotating shaft 224. The other rotating part 222 is connected to a stopper 214 corresponding to the unit 220b, and is rotatably supported by another rotating shaft 224. The linear movement part 226 is connected to the two rotation parts 222, and rotates the two rotation parts 222 by moving in one direction.

  The nozzle replacement mechanism 18a is configured as described above, and when the storage holes for holding the nozzles are provided in four rows, the state in which the nozzles are held in the storage holes by the stoppers 214 as in the case where the nozzles are provided in two rows, The state in which the nozzle can be detached from the storage hole can be switched. Further, by moving the two rotating portions 222 in conjunction with each other by the drive mechanism 216, the state in which the nozzle is held in the storage hole of the nozzle replacement mechanism 18a and the state in which the nozzle can be attached to and detached from the storage hole are simultaneously performed. Can be switched.

  In the above embodiment, the holding mechanism corresponding to the plurality of storage holes arranged in a row is also used as one stopper, but the present invention is not limited to this. A plurality of stoppers may be provided for one row of storage holes, or one stopper may be provided for one storage hole.

  Next, the operation of each part of the electronic component mounting apparatus 10 will be described. Note that the operation of each part of the electronic component mounting apparatus 10 described below can be executed by controlling the operation of each part based on the control device 20.

  FIG. 12 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. The overall processing operation of the electronic component mounting apparatus 10 will be described with reference to FIG. The process shown in FIG. 12 is executed by the control device 20 controlling each unit. The electronic component mounting apparatus 10 reads a production program as step S52. The production program is created by a dedicated production program creation device, or created by the control device 20 based on various input data.

  After reading the production program in step S52, the electronic component mounting apparatus 10 detects the state of the apparatus in step S54. Specifically, the configuration of the component supply units 14f and 14r, the type of the electronic component 80 filled, the type of the prepared nozzle 32, and the like are detected. The electronic component mounting apparatus 10 detects the state of the apparatus in step S54, and when preparation is completed, the board 8 is carried in as step S56. The electronic component mounting apparatus 10 carries in a board | substrate at step S56, and if a board | substrate is arrange | positioned in the position which mounts an electronic component, it will mount an electronic component on a board | substrate as step S58. The electronic component mounting apparatus 10 will carry out a board | substrate as step S60, if mounting of an electronic component is completed by step S58. When the electronic component mounting apparatus 10 carries out the board in step S60, it is determined in step S62 whether production is finished. If the electronic component mounting apparatus 10 determines that the production is not finished (No) in step S62, the electronic component mounting apparatus 10 proceeds to step S56, and executes the processing from step S56 to step S60. That is, processing for mounting electronic components on the board is executed based on the production program. If the electronic component mounting apparatus 10 determines that the production is finished (Yes) in step S62, the electronic component mounting apparatus 10 finishes this process.

  The electronic component mounting apparatus 10 can manufacture a board on which the electronic component is mounted by reading the production program and performing various settings as described above, and then mounting the electronic component on the board.

  FIG. 13 is a flowchart illustrating an example of the operation of the electronic component mounting apparatus. Note that the processing operation shown in FIG. 13 is an operation from the loading of the substrate to the completion of the mounting of the electronic component on the substrate. Further, the processing operation shown in FIG. 13 is executed by the control unit 60 controlling the operation of each unit.

  The control part 60 carries in the board | substrate 8 as step S102. Specifically, the control unit 60 transports the substrate on which the electronic component is to be mounted to a predetermined position by the substrate transport unit 12. If the board | substrate is carried in by step S102, the control part 60 will carry out holding movement as step S104. Here, the holding movement (suction movement) is a processing operation for moving the head main body 30 to a position where the nozzle 32 faces the electronic component 80 in the holding area of the component supply unit 14.

  After performing the holding movement in step S104, the control unit 60 lowers the nozzle 32 as step S106. That is, the control unit 60 moves the nozzle 32 downward to a position where the electronic component 80 can be held (sucked and gripped). After lowering the nozzle 32 in step S106, the control unit 60 holds the component with the nozzle 32 as step S108 and raises the nozzle 32 as step S110. When the control unit 60 raises the nozzle to a predetermined position in step S110, specifically, moves the electronic component 80 to the measurement position of the laser recognition device 38, the electronic component sucked by the nozzle 32 is step S112. 80 shapes are detected. When detecting the shape of the electronic component in step S112, the control unit 60 raises the nozzle 32 in step S114. Note that the control unit 60 detects the shape of the electronic component in step S112 as described above, and when it is determined that the held electronic component cannot be mounted, the electronic component is discarded and the electronic component is adsorbed again. When the control unit 60 raises the nozzle to a predetermined position, in step S116, the controller 60 moves the electronic component sucked by the nozzle 32 to a position facing the mounting position (mounting position) of the substrate 8. In step S118, the nozzle 32 is lowered. In step S120, component mounting (component mounting), that is, a processing operation for releasing the electronic component 80 from the nozzle 32 is performed. In step S122, the nozzle 32 is raised. That is, the control unit 60 executes the mounting process described above as the processing operation from step S112 to step S120.

When the nozzle 32 is raised in step S122, the control unit 60 determines in step S124 whether the mounting of all the components is complete, that is, whether the mounting process of the electronic components to be mounted on the board 8 is completed. If it is determined in step S124 that all the components have not been mounted (No), that is, if it is determined that there are remaining electronic components to be mounted, in step S126, the control unit 60 determines whether there is a nozzle replacement. . That is, in order to hold the electronic component to be mounted next, it is determined whether a nozzle different from the nozzle 32 currently mounted on the nozzle holding portion 33 of the head 15 is used. If it is determined in step S126 that there is a nozzle replacement (Yse), the control unit 60 executes a nozzle replacement process in step S128, and then proceeds to step S104 to mount the next electronic component on the substrate 8. Perform processing operations.
If it is determined in step S126 that the nozzle is not replaced (No), the control unit 60 proceeds to step S104 and executes a processing operation for mounting the next electronic component on the substrate 8. In this way, the control unit 60 repeats the above processing operation until the mounting of all components on the substrate 8 is completed. If the control unit 60 determines in step S124 that all parts have been mounted (Yes), the process ends.

  The electronic component mounting apparatus 10 can mount the electronic component on the substrate by executing the processing operation shown in FIG. 13, and can produce a substrate on which the electronic component is mounted.

  Next, the nozzle replacement process will be described with reference to FIGS. First, using FIG. 14 to FIG. 16, a processing operation for mounting a nozzle held by the nozzle replacement mechanism on a nozzle holding unit not mounted with a nozzle will be described. FIG. 14 is a flowchart illustrating an example of the nozzle replacement operation of the electronic component mounting apparatus. FIG. 15 is an explanatory diagram showing the relationship between the movement of the nozzle holding portion and the stopper in the nozzle replacement operation. FIG. 16 is an explanatory diagram showing the relationship between the movement of the nozzle holding portion and the stopper in the nozzle replacement operation. Here, the rise of Z in FIG. 15 is a state where the nozzle holding portion 33 (more precisely, the socket) is raised in the Z-axis direction, and the lowering of Z means that the nozzle holding portion is moved in the Z-axis direction. In this state, the nozzle holding portion 33 is not moved in the Z-axis direction during the rise and fall of Z. Moreover, ON of XY of FIG. 15 is the state which has moved the nozzle holding | maintenance part 33 to XY direction. XY OFF in FIG. 15 is a state where the nozzle holding portion 33 is not moved in the XY direction. The stopper OPEN in FIG. 15 is in a state where the stopper and the storage hole are separated and the nozzle can be attached to and detached from the storage hole. The stopper CLOSE is close to the stopper and the storage hole. Is in a state of holding.

  In step S202, the control unit 60 moves the head and moves the target nozzle support unit to the target nozzle replacement position. Specifically, the head 15 is moved in the X and Y directions by the XY movement mechanism 16, and the nozzle holding portion to which the nozzle is mounted is moved directly above the storage hole 130 of the nozzle replacement mechanism 18 where the target nozzle is arranged. The process of step S202 is the process up to time t1 in FIG. 15, the movement of the nozzle holding part in the Z-axis direction is stopped, the movement of the nozzle holding part in the XY direction is executed, and the stopper is closed.

  When the control unit 60 moves the nozzle support unit to the replacement position in step S202, the control unit 60 lowers the nozzle support unit in step S204, and mounts the nozzle in the nozzle support unit in step S206. The process of step S202 is the process from time t1 to t2 in FIG. 15, the nozzle holding part is moved downward in the Z-axis direction, the movement of the nozzle holding part in the XY direction is stopped, and the stopper is closed. It becomes. As a result, the nozzle holding part 33 is lowered together with the socket 33b as shown in step S10 of FIG. 16, and the socket 33b and the nozzle 32 are in contact with each other as shown in step S12.

  When the control unit 60 attaches the nozzle to the nozzle support unit in step S206, the control unit 60 opens the stopper in step S208. The processing in step S208 is processing at time t2 in FIG. 15, and the stopper is opened from the closed state. At this time, the movement of the nozzle holding portion in the Z-axis direction and the XY direction is stopped. As a result, a gap is formed between the nozzle 32 and the stopper 114 as shown in step S14 of FIG. 16, and the nozzle 32 can be moved in the horizontal direction (the end side where the storage hole is opened).

  After releasing the stopper in step S208, the control unit 60 moves the head in the X and Y directions to release the nozzle from the nozzle replacement mechanism in step S210. The process of step S210 is a process from time t2 to t3 in FIG. 15, the movement of the nozzle holding unit in the Z-axis direction is stopped, the movement in the XY direction is executed, and the stopper is opened. Thereby, as shown in step S16 of FIG. 16, the nozzle 32 is moved in the horizontal direction and moved to a position away from the storage hole.

  When the control unit 60 removes the nozzle from the nozzle changer in step S210, the control unit 60 raises the nozzle support unit in step S212. The process of step S212 is a process from time t3 to t4 in FIG. 15, the nozzle holding unit is lifted in the Z-axis direction, the movement in the XY direction is stopped, and the stopper is opened. Thereby, as shown in step S18 of FIG. 16, the nozzle 32 is moved to a position higher than the storage hole at a position away from the storage hole 33.

  After raising the nozzle in step S212, the controller 60 closes the stopper in step S214. The processing in step S214 is processing at time t4 in FIG. 15, and the stopper is opened from the open state. At this time, the movement of the nozzle holding portion in the Z-axis direction and the XY direction is stopped.

  As described above, the control unit 60 controls the operation of each unit, so that the nozzles stored in the storage holes that are partially opened can be suitably attached to the nozzle holding unit. In addition, the control unit 60 selectively releases the stopper only while moving the nozzle holding unit holding the nozzle in the horizontal direction, thereby preventing the nozzles other than the purpose held in the storage hole from coming off the storage hole. can do.

  Next, a processing operation for detaching the nozzle held by the nozzle holding unit from the nozzle holding unit and storing (saving) it in the nozzle replacement mechanism will be described with reference to FIG. FIG. 17 is a flowchart illustrating an example of the nozzle replacement operation of the electronic component mounting apparatus.

  In step S252, the control unit 60 moves the head and moves the target nozzle support unit to the target nozzle replacement position. Specifically, the head 15 is moved in the X and Y directions by the XY moving mechanism 16, and the nozzle holding portion on which the nozzle is mounted is displaced from the storage hole 130 for storing the nozzle in the nozzle replacement mechanism 18 by a certain distance. Move to position (between open stopper and storage hole). That is, the target nozzle holding unit is moved to a position that is deviated from the storage hole 130 that does not store the nozzle by a certain distance.

When the control unit 60 moves the nozzle support unit to the replacement position in step S252, the control unit 60 opens the stopper in step S254, and lowers the nozzle support unit in step S256. Thereby, the nozzle is moved to a position where the position of the nozzle and the storage hole in the Z-axis direction is the same height.

  When the control unit 60 lowers the nozzle support unit in step S256, in step S258, the control unit 60 moves the head in the XY direction and inserts the nozzle into the nozzle replacement mechanism. That is, the nozzle is moved to a position where the storage hole is inserted into the groove of the nozzle, and the nozzle is disposed in the storage hole.

  After moving the nozzle to the replacement position in step S258, the control unit 60 separates the nozzle from the nozzle support unit in step S260, that is, separates the nozzle and the nozzle support unit, and raises the nozzle support unit in step S262. In step S260 and step S262, the nozzle stored in the storage hole may be separated from the nozzle support by a series of operations, specifically, raising the nozzle support.

  After raising the nozzle in step S262, the control unit 60 closes the stopper in step S264. In addition, you may perform the process which closes a stopper between step S258 and step S260.

  The control part 60 can store a nozzle suitably in the storage hole by which one part was open | released by controlling operation | movement of each part as mentioned above.

  8 Substrate, 10 Electronic component mounting device, 11 Housing, 12 Substrate transport unit, 14, 14f, 14r Component supply unit, 15 Head, 16 XY moving mechanism, 18, 18a Nozzle replacement mechanism, 20 Control device, 22 X-axis drive Part, 24 Y-axis drive part, 24a ball screw, 24b drive part, 24c holding part, 30 head body, 31 head support, 32 nozzle, 32a coupling part 32b recess, 32c opening, 32d groove, 33 nozzle holding part, 33a shaft , 33b socket, 33c spring (elastic member), 33d magnet, 34 nozzle drive unit, 38 laser recognition device, 40 operation unit, 42 display unit, 60 control unit, 62 head control unit, 64 component supply control unit, 80 electronic component , 100 Electronic component supply device, 110, 210 Base, 112, 212 Storage plate, 1 14, 214 Stopper (holding mechanism), 116, 216 Drive mechanism (holding mechanism), 122, 222 Rotating part, 124, 224 Rotating shaft, 126, 226 Direct acting part, 130 Storage hole, 142 Contact part, 150 Wall surface, 152 Protrusion (holding mechanism), 154 Magnet (holding mechanism), 220a, 220b Storage hole unit

Claims (8)

A nozzle replacement mechanism that holds a plurality of nozzles in a state that can be attached to a nozzle holding portion of a head,
A storage plate in which a U-shaped storage hole in which the nozzle is stored and a part of the horizontal direction is opened;
A holding mechanism for holding the nozzle in the storage hole,
The holding mechanism includes a stopper disposed at a position facing the U-shaped open end of the storage hole, and a position perpendicular to the open surface from the position where the stopper is held in the storage hole by the stopper. And a drive mechanism for moving the storage hole to a position where the distance from the storage hole is larger than the diameter of the nozzle. The storage plate has a plurality of storage holes formed in a row,
The nozzle replacement mechanism according to claim 1, wherein the stopper is a bar-shaped member extending in one direction and faces the plurality of storage holes formed in a row. The said holding mechanism is arrange | positioned in at least one of the open ends of the U-shape of the storage hole, and includes a protrusion that narrows the width of the open end of the U-shape. Or the nozzle exchange mechanism of 2.   The nozzle replacement mechanism according to claim 3, wherein the protrusion is formed of an elastic member. A nozzle replacement mechanism according to any one of claims 1 to 4,
A head main body having a nozzle holding portion to which a nozzle is mounted, a nozzle driving portion for driving the nozzle holding portion up and down and rotating together with the nozzle, and a head support for supporting the nozzle holding portion and the nozzle driving portion. When,
A head moving mechanism for moving the head body;
A control device that controls the movement of the nozzle holding unit by the nozzle driving unit and the head moving mechanism and the operation of the nozzle replacement mechanism,
The control device moves the nozzle holding part, connects the nozzle holding part to the nozzle stored in the nozzle replacement mechanism, and then moves the nozzle holding part in the horizontal direction in which the storage hole is opened. An electronic component mounting apparatus, wherein the nozzle connected to the nozzle holding part is removed from the storage hole.   The control device moves the nozzle holding part, and positions the mounted nozzle at a certain distance from the storage hole in the opening direction of the storage hole and at the same height as the storage hole. 6. The electronic component mounting apparatus according to claim 5, wherein the nozzle is stored in the storage hole by moving the nozzle holding portion toward the storage hole in the horizontal direction. The nozzle holding unit includes a shaft that is vertically driven and rotated by the nozzle driving unit, a socket that is disposed at a lower end of the shaft in the vertical direction, and that is connected to the nozzle, and the shaft and the socket. It is disposed between, while the socket is vertically movable relative to the shaft, an elastic member force to the socket from the shaft is ready for action, to claim 5 or 6, characterized in that it has a The electronic component mounting apparatus described.   The electronic component mounting apparatus according to claim 5, wherein the nozzle holding unit includes a magnet that attracts the nozzle.

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