JP2006093248A - Electronic part suction nozzle - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily replace a reflecting plate at low cost if the reflecting plate 5 is contaminated, or in correspondence with various reflection conditions. <P>SOLUTION: A nozzle 10 is provided with a reflecting plate 5 like a hollow disc, so that a lighting light from the oblique lower side of the nozzle 10 may be reflected toward the back of a chip 18. The reflecting plate 5 is attachable and detachable to/from the nozzle 10. Therefore, the reflecting plate 5 can be easily replaced even if it is contaminated, and its shape is simple and suitable for easy processing, so that the reflecting plate 5 can be replaced at a low cost. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

The present invention relates to a nozzle for sucking and holding an electronic component used in an electronic component mounting machine, and in particular, an electronic component suction nozzle having a reflecting plate that reflects illumination light when imaging the sucked and held electronic component from below. It is related to.

In the electronic component manufacturing field, as a method for accurately positioning an electronic component, a method of imaging the electronic component from below and recognizing the image is widely used. This method recognizes the image obtained by imaging the electronic component, detects the position of the electrode, edge, or center of gravity of the electronic component, corrects the amount of adsorption position deviation of the electronic component, and applies it to the substrate. It is to be installed.

In the position detection of the electronic component by this image recognition, the electronic component is picked up and held by a nozzle and moved above the image pickup apparatus, and an image is picked up by a CCD camera. By the way, recent circuit mounting substrates are required to have high density and high precision, and chip components are often used as electronic components, and miniaturization of chip components is also being attempted. In such a case, a shadow placed with illumination light from above the nozzle is imaged by a camera installed below the nozzle.

Therefore, a tapered surface is formed in the lower part of the nozzle, and this tapered surface is used as a light diffusion surface. Then, when imaging the electronic component adsorbed by the nozzle, the outer dimension of the nozzle is made larger than the outer dimension of the electronic component, illumination light is irradiated obliquely below the nozzle, and the light diffusion surface of the electronic component is The diffused light is irradiated uniformly from behind (see Patent Document 1).

Further, the support cylinder portion and the diffusion plate portion of the nozzle that is attached to and held by the head portion are integrally formed of a light diffusion material such as plastic, glass, ceramic, and the suction shaft is attached to the lower portion thereof. And when imaging the electronic component adsorbed by the suction shaft in the previous period, illumination light is irradiated from obliquely above the nozzle, and since there is no joint part of the support cylinder part and the diffusion plate part by integral molding, from behind the electronic part Irradiated with diffused light uniformly (see Patent Document 2).
JP-A-3-218697 Japanese Patent No. 3016958

  However, if a light diffusing surface is provided on the nozzle itself, the light diffusing surface is generally made of a rough surface, so it is easy to get dirty, and it becomes clogged, making it difficult to remove the dirt. Since it had to be done, there was a problem that a wasteful cost was required. In addition, when the support cylinder portion and the diffusion plate portion of the nozzle are integrally formed of plastic, it is difficult to obtain accuracy. Therefore, there has been a problem that if it is integrally formed of glass or ceramic, the processing is difficult and very expensive.

  Therefore, in the present invention, a hollow disk-shaped reflector is provided on the nozzle so that illumination light from obliquely below the nozzle is reflected from behind the electronic component. Since the reflecting plate is detachably provided on the nozzle, it can be easily replaced even when the reflecting plate is dirty, and the reflecting plate is simple and easy to process, so that it can be replaced at low cost. Moreover, it can replace | exchange for the reflecting plate from which various reflection conditions differ according to illumination conditions by detachability. Thus, an object of the present invention is to provide an electronic component suction nozzle adapted to various illumination conditions without wasteful cost by providing a simple-shaped reflector detachably.

According to the first aspect of the present invention, in the electronic component suction nozzle that is detachably mounted on the head of the electronic component mounting machine and sucks and holds the electronic component, the illumination light projected from the electronic component recognition device is emitted from the electronic component. A hollow disk-shaped reflecting plate that reflects toward the back surface and a cylindrical member that forms a step portion of the jaw at the lower end, and the reflection plate is provided through the hollow portion and in contact with the step portion. And the thrust stopper inserted into the inner and in contact with the upper end of the reflecting plate to solve the above problem.

According to the second aspect of the present invention, in the electronic component suction nozzle that is detachably attached to the head of the electronic component mounting machine and holds the electronic component by suction, the columnar shape has a step portion formed at the lower end and the lower end. A piston portion formed in the interior having a slider having a suction port for sucking and holding the electronic component and a groove penetrating the side surface, a columnar shape and a step portion formed at the lower end and a female screw penetrating the side surface An inner portion for inserting the upper portion of the slider so as to be slidably supported, a compression spring which is arranged between the lower end of the inner portion and the step portion of the slider and constantly urges the slider downward, and the inner portion. A stepped pin that has a male screw integrated with the female screw at its head and slidably engages the pin portion with the groove of the slider to prevent the slider from coming off, and a hollow disk-shaped hollow portion Inserted into the inner A reflector that abuts the lower end at the inner step, a cylindrical stopper that is inserted into the inner and holds the reflector from above, and a step hole formed in the thrust stopper. A bind screw that accumulates on the inner female screw, the stepped pin and the bind screw are inserted into the inner female screw from opposite directions, and the stepped pin is inserted into the inner to a position where it does not interfere with the thrust stopper. The above-mentioned problem is solved because it is inserted.

  According to the electronic component suction nozzle in the electronic component mounting machine of the present invention, the hollow portion of the reflecting plate is inserted into the inner, the lower end of the reflecting plate is pressed against the stepped portion of the inner, and the thrust stopper is inserted into the inner to thrust. The stopper was fixed to the inner so as to press against the reflector. By removing the thrust stopper from the inner, the reflector can be removed from the inner and replaced. Even when the reflector is dirty, it can be easily replaced with a new reflector and is inexpensive.

In addition, the stepped pin and the bind screw do not prepare a screw hole for each, but since one screw hole is shared by screwing from the direction opposite to the screw hole penetrating the inner, the processing cost is low. The stepped pin is reduced in size by being screwed and set to a position where it does not protrude from the inner side surface, that is, a position where it does not interfere with the thrust stopper.

  Furthermore, it can respond easily according to various illumination conditions. For example, if illumination by specular reflection light is required, a reflection plate with a reflective surface is attached, and if illumination by diffuse reflection light is required, a reflection plate with a rough reflection surface is attached, and illumination by light of a specific wavelength If necessary, the reflecting surface can be replaced with a reflecting plate of a color that reflects the wavelength. Therefore, it can be easily and inexpensively adapted to various lighting conditions.

That is, it is possible to irradiate reflected light suitable for the imaging condition from the back surface of the electronic component by the reflecting plate and project an accurate shadow on the CCD camera.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting machine incorporating an electronic component suction nozzle according to an embodiment of the present invention. FIG. 2 is a cross-sectional view of the electronic component suction nozzle, FIG. 3 is a diagram showing a configuration before assembly of the electronic component suction nozzle, and FIG. 4 is a conceptual diagram when imaging a chip component sucked by the nozzle.

  First, the overall structure of the electronic component mounting machine 20 will be described with reference to FIG. In FIG. 1, 13 is a board | substrate conveyance path. A substrate 19 transported by the substrate transport path 13 is held near the center of the substrate transport path 13. The mounting head unit 11 is supported by the XY transfer unit 12 and can move horizontally. An electronic component suction nozzle (nozzle) 10 (see FIGS. 2 and 4) that sucks and holds electronic components is mounted on the lower end portion of the mounting head portion 11 so that the shaft 2 can move up and down (Z direction) and rotate θ. Is arranged.

The mounting head unit 11 vacuum-sucks an electronic component (chip component) 18 supplied to an electronic component supply position of an electronic component supply device (feeder) 14 to the lower end portion of the nozzle 10 and moves it to the upper portion of the electronic component recognition device 15 XY. Moving. The electronic component recognition device 15 irradiates illumination light from below the nozzle 10 to image the lower surface of the chip component 18 and calculates the amount of suction displacement (XY error, angle error) of the chip component 18 sucked and held by image recognition processing. Then, the position of the board 19 is corrected with respect to the normal mounting position, and the board 19 is mounted.

The configuration of the electronic component suction nozzle (nozzle) 10 will be described with reference to FIGS. A cylindrical slider 1 has a jaw-shaped step 1c at the lower end, a suction port 1a communicating from the lower end to the upper end, and a groove 1d penetrating the side surface. A compression spring 2 biases the slider 1 downward. Reference numeral 3 denotes a cylindrical inner, which has a jaw-shaped step portion 3a at the bottom, a female screw 3c that penetrates the side surface, and a piston portion (slider guide hole) 3b that penetrates from the lower end to the upper end. A mounting groove 3d for mounting and holding on the head is provided. Reference numeral 4 denotes a stepped pin, which is composed of a straight pin portion 4a and a head portion 4b, and is formed by forming on the head portion 4b a male screw that accumulates with the female screw 3c.

Reference numeral 5 denotes a reflecting plate 5 having a hollow disk shape. The reflecting plate 5 has a hollow portion 5b to be inserted and attached to the inner 3, and a reflecting surface 5a for reflecting light on the lower surface portion. A thrust stopper 6 having a columnar shape has a through hole 6b that penetrates up and down to be inserted and attached to the inner 3, and a step hole 6a for a screw that stops on the female screw 3c of the inner 3. Reference numeral 7 denotes a bind screw having a male screw that is integrated with the female screw 3c.

  Here, the procedure for assembling the nozzle 10 will be described. First, the compression spring 2 is inserted into the slide portion 1 b of the slider 1. Next, the slider guide portion 3 b of the inner 3 is inserted into the slide portion 1 b of the slider 1. Then, the position is adjusted by moving the slider 1 in the vertical θ rotation direction so that the positions of the groove 1 d of the slider 1 and the female screw 3 c of the inner 3 are aligned and penetrated. Here, the pin portion 4a of the stepped pin 4 is inserted into the groove 1d of the slider 1 from one side of the female screw 3c, and the male screw of the head 4b is screwed into the female screw 3c. The screwing is performed until the head 4b does not protrude from the side surface of the inner 3.

  Thus, the compression spring 2 disposed between the lower end of the inner 3 and the step portion 1c of the slider 1 is inserted into the slider guide portion 3b to support the slider 1 slidably. The slider 1 is always urged downward, and the upper end of the groove 1d of the slider 1 is in contact with the pin portion 4a of the stepped pin 4 to prevent the slider 1 from coming off.

  Here, the attachment of the reflector 5 is started. The hollow portion 5b of the reflecting plate 5 is inserted into the inner 3 so that the reflecting surface 5a faces downward, the through hole 6b of the thrust stopper 6 is inserted into the inner 3, and the stepped pin 4 is inserted into the inner 3. After the female screw 3c on the opposite side and the stepped hole 6a are aligned, the bind screw 7 is inserted into the female screw 3c through the stepped hole 6a, and the thrust stopper 6 is fixed to the inner 3.

FIG. 4 is a conceptual diagram when imaging a chip component adsorbed by the nozzle 10. The nozzle 10 is attached to the lower end of the shaft 11 a disposed in the mounting head portion 11, and the ball provided on the shaft 11 a is the inner 3. The nozzle 10 is prevented from falling off by fitting into the mounting groove 3d. Then, the chip component 18 is attracted to the nozzle 10, and the chip component 18 is positioned above the electronic component recognition apparatus 15 including the CCD camera 15 a and the LED 15 b.

  When the LED 15b located below the nozzle 10 is turned on in the above state, the light from the LED 13 is reflected by the reflecting surface 5a of the reflecting plate 5 and irradiates the chip component 18 from the back surface of the chip component 18 to accurately detect the CCD camera 15a. Can be used to project shadows.

  When it is necessary to replace the reflecting plate 5 with another type, the reflecting plate 5 can be easily replaced by removing the bind screw 7 and removing the thrust stopper 6 and the reflecting plate 5 from the inner 3. . The reflecting surface 5a of the reflecting plate 5 is a buffed mirror surface for specular reflection illumination, a sandblasted rough surface for diffuse reflection illumination, or a color-finished color surface for specific wavelength reflection illumination, depending on the illumination conditions. Can be prepared and exchanged.

It is a perspective view of the electronic component mounting machine in which the electronic component adsorption nozzle was incorporated. It is sectional drawing of an electronic component adsorption nozzle. It is a figure which shows the structure before the assembly of an electronic component adsorption nozzle. It is a conceptual diagram at the time of imaging the chip component adsorbed by the nozzle.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Slider 1a Groove 1b Adsorption port 1c Step part 2 Compression spring 3 Inner 3a Step part 3b Slider guide hole (piston part)
3c Female screw 4 Stepped pin 4a Pin part 4b Head part 5 Reflecting plate 5a Reflecting surface 5b Hollow part 6 Thrust stopper 6a Stepped hole 6b Through hole 7 Bind screw 10 Nozzle (electronic component suction nozzle)
DESCRIPTION OF SYMBOLS 11 Mount head part 11a Shaft 12 XY transfer part 13 Substrate conveyance apparatus 14 Electronic component supply apparatus 15 Electronic component recognition apparatus 15a CCD camera 15b LED
18 Electronic parts (chip parts)
19 Substrate 20 Electronic component mounting machine

Claims (2)

In the electronic component suction nozzle that is detachably mounted on the head of the electronic component mounting machine and holds the electronic component by suction,
A hollow disk-shaped reflector that reflects the illumination light projected from the electronic component recognition device toward the back surface of the electronic component;
A cylindrical member that forms a step portion of the jaw at the lower end, and an inner member that is provided in contact with the step portion through the hollow portion of the reflector,
An electronic component suction nozzle having a thrust stopper inserted into the inner and in contact with an upper end of the reflecting plate. In the electronic component suction nozzle that is detachably attached to the head of the electronic component mounting machine and holds the electronic component by suction,
A slider having a columnar shape, a step formed at the lower end, a suction port for sucking and holding the electronic component at the lower end, and a groove penetrating the side surface;
An inner part that is cylindrical and has a step formed at the lower end and a female thread that penetrates the side surface and inserts the upper part of the slider into a piston part that is formed inside;
A compression spring which is arranged between the lower end of the inner and the stepped portion of the slider and constantly urges the slider downward;
A stepped pin that has a male screw integrated with the female screw of the inner at the head and slidably engages the pin portion with the groove of the slider to prevent the slider from coming off;
A reflector that is hollow and has a hollow portion inserted into the inner and abuts the lower end at the stepped portion of the inner;
A thrust stopper that is cylindrical and is inserted into the inner to hold the reflector from above;
A bind screw that accumulates in the female screw of the inner through a step hole formed in the thrust stopper, and the step pin and the bind screw are inserted into the female screw of the inner from opposite directions, and the step pin is An electronic component suction nozzle inserted into the inner to a position where it does not interfere with the thrust stopper.

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