JP4117065B2 - Electronic component recognition device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component recognition apparatus, and more particularly, to an electronic component imaging apparatus capable of imaging by transmitting or reflecting an electronic component with the same nozzle without replacing a suction nozzle that sucks the electronic component.
[0002]
[Prior art]
In Japanese Patent Publication No. 8-24234, the outer dimension of the nozzle is made larger than the outer dimension of the electronic component adsorbed by the nozzle, the lower part of the nozzle is a tapered surface and a light diffusion surface, and the nozzle tip is an electronic component. The nozzle shape to be made smaller is described. In this nozzle shape, the illumination light from below is scattered downward by the light diffusion plate provided on the upper part of the nozzle (above the taper surface), and part of the light is incident on the taper surface and further scattered. Inside the bright and shining tapered surface, a black silhouette can be clearly observed with the camera below.
[0003]
Also, in Utility Model Registration No. 2520596 (Japanese Utility Model Laid-Open No. 4-63197), an irradiation light is projected onto an electronic component adsorbed by a nozzle, the nozzle is tapered and the surface is mirror-finished, and the electronic component A configuration is described in which only reflected light of an electronic component can be observed by the imaging means so that the reflected light of the irradiation light except the reflected light from the light is not incident on the imaging means disposed at a position facing the electronic component. ing.
[0004]
In Japanese Patent Publication No. 4-46000, a light source is disposed above and below the electronic component adsorbed by the nozzle, and illumination light from the upper light source is projected onto the electronic component through the diffusion plate. It is possible to take an image with the imaging means arranged below, project the illumination light from the light source below to the electronic component through the diffuser plate with the translucent part, and reflect the reflected light from the electronic component through the translucent part A configuration is described in which an electronic component can be observed and imaged by both transmission and reflection illumination by imaging with the imaging unit.
[0005]
[Problems to be solved by the invention]
However, in the configuration described in Japanese Patent Publication No. 8-24234, the internal corner chip parts of various electronic parts and the parts such as SOP, QFP, and MELF can be recognized with high precision, but the terminal is provided on the back surface because it has a structure only with transmitted illumination. And PLCC or SOJ with leads cannot be recognized with high accuracy when imaging a component, and for BGA and other components, the terminal is on the bottom of the component, so the terminal cannot be recognized and recognized by the component outline Even so, there is a problem in that the accuracy is very poor, and therefore it is necessary to recognize electronic components by reflected illumination at another station (in the case of a shooter). Furthermore, the light source arranged below has to be a ring-shaped light source, which has a drawback that a considerable installation area is required. Further, when the diameter of the light source ring is reduced to reduce the installation area, a lens or the like must be used to reduce the directivity of the light source, resulting in a high cost.
[0006]
On the other hand, in the configuration of utility model registration No. 2520596, the accuracy of the square chip parts or parts such as SOP and QFP may be lower than the recognition by the above-described transmitted illumination depending on the solder surface and the surface state of the lead. Yes, recognition is possible. However, although electronic components such as PLCC, SOJ, and BGA are recognizable, a cylindrical electronic component such as MELF reflects light only at a part of the terminal because it has a structure with only reflected illumination. There is a problem that cannot be done. Furthermore, since it is necessary to prevent the reflected light of the illumination light from entering the imaging means except for the reflected light from the electronic components, it is necessary to provide a diffusion plate on the upper part of the nozzle, or to capture the tapered surface of the mirror finish of the nozzle. There is a drawback in that it has to be wide so that it is larger than the screen of the means, resulting in high costs.
[0007]
In both types, the nozzle tip surface must be smaller than the electronic component, and in the case of a very small electronic component, insufficient nozzle strength becomes a problem.
[0008]
Further, in the configuration described in Japanese Patent Publication No. 4-46000, although both transmission and reflection systems are used, both illumination parts diffuse light internally from a light source through a diffusion plate and are adsorbed by an adsorption nozzle. In the lower reflection illumination device, there is a space for arranging the light source and the diffusion plate, but in the upper transmission illumination device, the light source and the diffusion plate are arranged in the space above the nozzle. However, there is a problem that a complicated structure is required due to the ingenuity of the mounting method.
[0009]
The present invention has been made to solve such problems, and it is an object of the present invention to provide an electronic component recognizing device capable of recognizing an electronic component attracted by a nozzle through transmission illumination or reflection illumination with high accuracy. To do.
[0010]
[Means for Solving the Problems]
In order to solve the above-described problems, the present invention provides an electronic component recognition apparatus that picks up and recognizes an adsorbed electronic component with an imaging unit, and has a diameter larger than the outer size of the electronic component and has a light diffusibility on the adsorption surface side. A suction nozzle formed with a tapered surface, first and second light sources for illuminating an electronic component sucked by the suction nozzle, and a cylindrical light absorption plate having a hole formed therein, through the hole Light incident on the tapered surface from obliquely above is transmitted and illuminated by a first light source that illuminates the electronic component adsorbed by the adsorption nozzle from above, and illuminates the electronic component adsorbed by the adsorption nozzle from below . A configuration that is set so as to be reflected and illuminated by two light sources was adopted.
[0011]
In such a configuration, the tapered surface of the suction nozzle has a predetermined inclination angle with respect to the suction nozzle axis, and by selectively turning on the two light sources, the direction of light scattering on the tapered surface changes. It becomes like this. As a result, it is possible to perform optimal transmission illumination or reflection illumination on the electronic component, thereby enabling highly accurate recognition.
[0012]
This tapered surface can be made to have predetermined reflection and scattering characteristics by, for example, sandblasting on a machined surface (for example, a lathe).
[0013]
When recognizing the electronic component sucked by the suction nozzle, by detecting the edge of the tapered portion of the nozzle, by obtaining the center, to see the image processing of including meta near the electronic parts. Thereby, the image processing time can be shortened and the area of the tapered surface of the suction nozzle can be reduced.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, the present invention will be described in detail based on embodiments shown in the drawings.
[0018]
The electronic component supply unit (not shown) of the electronic component mounting apparatus stores a large number of various electronic components such as rectangular chip components and SOP, QFP, and MELF as shown in FIGS. Yes. A transfer head (not shown) having the suction nozzle 2 as shown in FIG. 2 is similarly moved to an electronic component supply unit by an XY drive mechanism (not shown) and is moved downward via an elevating drive mechanism (not shown). Moving. At this time, a vacuum pressure is generated in the vacuum drawing inner tube 3 and the passage 4, the electronic component 1 is taken up by the suction nozzle 2, the transfer head moves XY in the direction of the electronic component mounting substrate, and the electronic component is moved to the substrate. It is mounted at a predetermined position above.
[0019]
The recognition posture (position) of the electronic component sucked by the suction nozzle 2 during the movement of the electronic component to the substrate is recognized by the recognition camera (CCD) 11, and the amount of displacement of the suction posture and the XY position shift with respect to a predetermined direction. By correcting the amount, the electronic component is mounted on the substrate in an accurate position and direction.
[0020]
The electronic component suction device is provided with a cylindrical light absorbing plate 8 having a hole 9 formed therein, and a first light source 7 (for example, LED) is disposed so as to face the hole 9. The position of the light source 7 is located above the suction surface 6 of the suction nozzle 2 and the tapered surface 5 is formed above the suction surface 6. Therefore, when the light source 7 is turned on, the hole 9 of the light absorbing plate 8 is turned on. Light enters the tapered surface 5 obliquely from above and illuminates the electronic component 1 sucked by the suction nozzle 2 from above. In this case, the optical axis of the light source 7 is set to an angle α with respect to the axis of the suction nozzle, and the tapered surface 5 is set to an angle β with respect to the axis.
[0021]
The tapered surface 5 is a machined surface (for example, lathe processing) and does not need to be polished. Moreover, in order to give scattering property, for example, sandblasting is performed. Also, the nozzle outer diameter of the suction nozzle 2 is made larger than the electronic component 1 to be sucked, and even when the type and size of the electronic component to be picked up changes, the nozzle outer diameter is not required. Keep it larger than electronic parts. In this case, by using the nozzle tip suction surface 6 as a light absorbing material (camera plating or ceramic), the size of the nozzle tip suction surface can be made larger than the electronic component to be sucked, and the nozzle is an extremely small electronic component. Even when adsorbing water, the nozzle tip can have sufficient strength.
[0022]
In addition, a recognition camera 11 having a second light source (for example, LED) 10 and a lens is installed at a lower position facing the suction surface 6 of the suction nozzle 2. The light source of the second light source 10 is set at an angle γ with respect to the axis of the suction nozzle, and when the second light source is turned on, the light from this light source illuminates the electronic component 1 from below. Become. Further, the light incident on the tapered surface 5 from the light source 10 is scattered to the side, and a part thereof is absorbed by the light absorbing plate 8.
[0023]
As shown in FIG. 3, a plurality of (eight) second light sources 10 are arranged at equal intervals around the recognition camera 11. Similarly, the first light sources 7 are also arranged around the light absorbing plate 8. A plurality of holes 9 are arranged, and a plurality of holes 9 are formed correspondingly.
[0024]
In addition, as shown in FIG. 2, when the angle between the transmission illumination and the nozzle axis is α, the angle between the reflection illumination and the nozzle axis is γ, and the angle between the tapered surface and the nozzle axis is β, as shown in FIG. (Π / 2 + β)> α and (π / 2−β)> γ are set.
[0025]
In such an electronic component suction device, when the electronic component 1 such as the rectangular chip component of FIG. 1 or SOP, QFP, and MELF is sucked by the suction nozzle 2 and taken up, the transfer head first detects the recognition camera 11. Move XY to position. Then, as shown in FIG. 2 (A), the first light source 7 is turned on, and light from this light source is reflected by the tapered surface 5 through the hole 9 of the light absorbing plate 8, and illuminates the electronic component 1 from above. . Since the illumination light is also scattered on the tapered surface 5, as shown in FIG. 2B, the electronic component 1 is picked up by the recognition camera 11 as a black shadow 1a with the tapered surface 5 as the background 5a. Good recognition is possible regardless of the surface condition of 1.
[0026]
When the rectangular chip component of FIG. 1 or the electronic component 1 such as PLCC, SOJ, or BGA is sucked by the suction nozzle 2 and taken up, as shown in FIG. Is illuminated, the illumination light from the light source is reflected by the electronic component 1, and the reflected light is imaged and recognized by the recognition camera 11. At this time, light in the vicinity of the outer shape of the electronic component 1 is reflected by the tapered surface 5 and absorbed by the light absorbing plate 8, but the tapered surface 5 is also a light diffusing surface, and a part thereof is directed to the electronic component 1. However, if it is darker than at least the reflected light from the electronic component 1, the contrast can be increased, and the image 1a of the electronic component such as the square chip component of FIG. 1 has a tapered surface as shown in FIG. The image 5a is observed by the recognition camera 11 as a contrast image, and even a component having terminals and leads on the electronic component mounting side can be accurately recognized.
[0027]
When the first light source 7 is turned on, the second light source 10 is turned off. When the second light source 10 is turned on, the first light source 7 is turned off. A shutter device may be provided in front of each of the first light source and the second light source, and each light source is always turned on, and the shutters may be opened and closed according to whether the illumination is transmitted or reflected. Alternatively, either the first light source or the second light source may be made sufficiently darker than one and both the light sources may be constantly turned on.
[0028]
In this way, the electronic component 1 sucked by the suction nozzle 2 is imaged by the recognition camera 11, the edge of the taper portion of the nozzle corresponding to the electronic component 1 is detected, and the center thereof is obtained, thereby obtaining the electronic component 1. Image processing is performed only in the vicinity including. The flow of this process is shown in FIG.
[0029]
In step S1 of FIG. 4, image input of the recognition camera 11 is started, and in step S2, the edge position coordinates of the tapered portion 5a (FIGS. 2B and 2D) are detected. When it is determined in step S3 that the image input has ended, in step S4, the shadow image 1a in the tapered portion 5a detected in step S2 (in the case of the transmitted illumination in FIG. 2A) or the reflecting portion 1a (FIG. 2 ( In step S5, the center of gravity is calculated, and in step S5, the shadow image in the tapered portion 5a detected in step S2 or the principal axis of inertia of the reflecting portion 1a is calculated to calculate the inclination.
[0030]
In this manner, the displacement amount of the suction posture and the displacement amount in the XY directions with respect to a predetermined direction determined in advance are calculated. The suction posture deviation amount Δθ is rotated by Δθ by a rotation drive mechanism (not shown) that rotates the suction nozzle shaft core by θ, and the displacement amounts ΔX and ΔY in the XY directions are corrected by ΔX and ΔY by the transfer head XY drive mechanism. The electronic component 1 sucked by the suction nozzle 2 is accurately mounted on the electronic component mounting substrate.
[0031]
FIG. 5 illustrates another embodiment of the present invention . 5 , the same parts as those in FIG. 2 are denoted by the same reference numerals, and the description thereof is omitted.
[0032]
The embodiment of FIG. 5 is an example in which the recognition camera 11 is mounted on the same transfer head as the suction nozzle 2. In this case, the recognition camera 11 and the light source 10 are aligned with the suction nozzle 2 instead of below the suction surface. Arranged in shape. Accordingly, the movable prism (or mirror) 12 and the fixed prism (or mirror) 13 are used to reflect and illuminate the electronic component from below with the light from the light source 10. At the time of imaging, the movable prism 12 enters the optical path, and the light beam from the light source 10 reflects and illuminates the electronic component 1 via the fixed prism 13 and the movable prism 12. At this time, the light beam incident on the tapered surface 5 is reflected and scattered laterally as in the case of the example of FIG.
[0033]
In this example, the suction state of the electronic component can be recognized while the transfer head is moving in the XY direction. In this case, the movable prism 12 is removed from the suction or mounting path when the electronic component is suctioned or mounted.
[0042]
【The invention's effect】
As described above, in the present invention, a light diffusing tapered surface is formed on the suction surface side of the suction nozzle, and the electronic component sucked by the suction nozzle is transmitted and illuminated by the first light source through the tapered surface. In addition, since the reflected light is reflected by the second light source, it is possible to perform optimum transmitted illumination or reflected illumination on the electronic component with a simple configuration, and it is possible to recognize various electronic components well. become.
[Brief description of the drawings]
FIG. 1 is a perspective view showing appearance shapes of various electronic components.
FIG. 2 is an explanatory diagram showing a state in which an electronic component is recognized through transmission illumination or reflection illumination.
FIG. 3 is a layout diagram illustrating a layout of light sources with respect to a recognition camera.
FIG. 4 is a flowchart showing a flow of recognition of an electronic component.
FIG. 5 is a configuration diagram showing another embodiment of the present invention .
[ Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 ... Electronic component 2 ... Suction nozzle 5 ... Tapered surface 6 ... Suction surface 7, 10 ... Light source 11 ... Recognition camera

Claims (2)

In an electronic component recognition apparatus for picking up and recognizing the picked-up electronic component with an imaging means,
A suction nozzle having a diameter larger than the outer dimension of the electronic component and having a light-diffusing tapered surface formed on the suction surface side;
First and second light sources for illuminating the electronic component sucked by the suction nozzle;
A cylindrical light absorbing plate with a hole,
Light from obliquely upward through the holes enters the tapered surface, the is transmitted illumination by the first light source for illuminating the electronic component sucked by the suction nozzle from above, the electronic component from below the sucked by the suction nozzle recognizer of electronic components, characterized in that it is set to be reflected illuminated by a second light source illuminating. By detecting the edge of the tapered portion of the nozzle, by obtaining the center, recognizer electronic component according to claim 1, characterized in that the viewing image processing of including meta near the electronic parts.

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