JP2002076031A - Apparatus for manufacturing semiconductor - Google Patents
Apparatus for manufacturing semiconductorInfo
- Publication number
- JP2002076031A JP2002076031A JP2000256418A JP2000256418A JP2002076031A JP 2002076031 A JP2002076031 A JP 2002076031A JP 2000256418 A JP2000256418 A JP 2000256418A JP 2000256418 A JP2000256418 A JP 2000256418A JP 2002076031 A JP2002076031 A JP 2002076031A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor chip
- support member
- light
- light source
- push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Die Bonding (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明はダイボンディング装
置等の半導体製造装置に関する。[0001] The present invention relates to a semiconductor manufacturing apparatus such as a die bonding apparatus.
【０００２】[0002]
【従来の技術】従来、ダイボンディング装置において、
半導体チップをウエハシートから取出す半導体チップ突
き上げ装置では、特開平11-345865号公報に記載の如
く、ウエハシート上の半導体チップを透明支持部材の上
に配置し、半導体チップをウエハシートを介して裏面側
からバックライト照明し、半導体チップを影絵の状態で
撮像し、結果として該半導体チップの位置や形状を検出
するものが提案されている。この従来技術によれば、半
導体チップを撮像装置の側（表面側）から照明し、表面
の反射光を撮像するものに比して、表面の凹凸や反射率
等の状態変化に無関係に常に変化の少ない高コントラス
トの安定した画像を撮像できるものとされる。2. Description of the Related Art Conventionally, in a die bonding apparatus,
In a semiconductor chip push-up device for removing a semiconductor chip from a wafer sheet, as described in JP-A-11-345865, the semiconductor chip on the wafer sheet is arranged on a transparent support member, and the semiconductor chip is placed on the back side via the wafer sheet. There has been proposed an apparatus that illuminates a backlight from the side and images a semiconductor chip in a shadow picture state, and as a result, detects the position and shape of the semiconductor chip. According to this conventional technique, a semiconductor chip is illuminated from the image pickup device side (front surface side) and constantly changes irrespective of a state change such as surface irregularities and reflectivity as compared with a device that illuminates the surface with reflected light. It is possible to capture a high-contrast, stable image with less image quality.
【０００３】[0003]
【発明が解決しようとする課題】然しながら、従来技術
では、透明支持部材の周囲の側方から光を導いて該支持
部材の内部から上方の半導体チップを裏面側から照明す
るものであり、以下の問題点がある。即ち、光源からの
光は支持部材に向けて照射されるが、照射された光の一
部は上方へ向かうものの、他の一部は水平又は下方へ向
かう。光源の近くでは上方へ向かう光量が比較的多い
が、光源から離れるに従い、光の直進性により上方へ向
かう光量は減少する。このため、支持部材の全体におい
て、半導体チップを照明するに充分な上向きの光量を確
保するには、光源の出力を大きくする必要があり、装置
構成が大型になる。However, in the prior art, light is guided from the side around the transparent support member to illuminate the upper semiconductor chip from inside the support member from the back side. There is a problem. That is, the light from the light source is emitted toward the support member, and part of the emitted light goes upward, but the other part goes horizontally or downward. The light amount going upward near the light source is relatively large, but the light amount going upward decreases as the distance from the light source increases due to the straightness of the light. For this reason, in order to secure a sufficient amount of upward light to illuminate the semiconductor chip in the entire support member, it is necessary to increase the output of the light source, and the device configuration becomes large.
【０００４】本発明の課題は、支持部材に支持された半
導体チップを裏面側から照明して半導体チップを影絵の
状態で撮像するに際し、光源からの光を効率よく半導体
チップに照射することにある。An object of the present invention is to efficiently irradiate a semiconductor chip with light from a light source when a semiconductor chip supported by a support member is illuminated from the back side to image the semiconductor chip in a shadow picture state. .
【０００５】[0005]
【課題を解決するための手段】請求項１の発明は、半導
体チップを支持可能とする透明又は半透明の支持部材
と、光源を有しその光を前記支持部材の表面に導く照明
装置と、前記半導体チップに対して前記支持部材とは反
対側に配置され、前記支持部材に支持された半導体チッ
プの周辺の支持部材透過光を捕えてその半導体チップの
画像を取り込む撮像装置と、この撮像装置が取り込んだ
画像を処理して半導体チップの位置を検出する画像処理
装置とを有してなる半導体製造装置において、前記照明
装置は、前記光源からの光を前記支持部材の表面に導く
反射部材を備えるようにしたものである。According to the first aspect of the present invention, there is provided a transparent or translucent support member capable of supporting a semiconductor chip, an illuminating device having a light source and guiding the light to the surface of the support member, An imaging device disposed on the side opposite to the support member with respect to the semiconductor chip, capturing light transmitted through the support member around the semiconductor chip supported by the support member and capturing an image of the semiconductor chip; An image processing apparatus for processing a captured image to detect a position of a semiconductor chip, wherein the lighting device includes a reflecting member that guides light from the light source to a surface of the supporting member. It is prepared for.
【０００６】請求項２の発明は、半導体チップを搭載し
ているウエハシートを半導体チップ搭載面の裏面より支
持可能とする透明又は半透明の支持部材と、光源を有し
その光を前記支持部材の表面に導く照明装置と、前記半
導体チップに対して前記ウエハシートとは反対側に配置
され、前記ウエハシートを介して前記支持部材に支持さ
れた半導体チップの周辺のウエハシート透過光を捕えて
その半導体チップの画像を取り込む撮像装置と、この撮
像装置が取り込んだ画像を処理して半導体チップの位置
を検出する画像処理装置と、前記半導体チップを前記ウ
エハシートの半導体チップ搭載面の裏面側より突き上げ
る突き上げ手段と、突き上げ手段に突き上げられた半導
体チップをピックアップしてウエハシートから取出すピ
ックアップ手段とを有してなる半導体製造装置におい
て、前記照明装置は、前記光源からの光を前記支持部材
の表面に導く反射部材を備えるようにしたものである。According to a second aspect of the present invention, there is provided a transparent or translucent support member capable of supporting a wafer sheet on which semiconductor chips are mounted from the back surface of the semiconductor chip mounting surface, and a light source having a light source for transmitting the light. An illumination device for guiding to the surface of the semiconductor chip, and arranged on the opposite side of the semiconductor chip to the wafer sheet, and capturing light transmitted through the wafer sheet around the semiconductor chip supported by the support member via the wafer sheet. An imaging device that captures an image of the semiconductor chip; an image processing device that processes the image captured by the imaging device to detect the position of the semiconductor chip; and the semiconductor chip is mounted on the wafer sheet from the back side of the semiconductor chip mounting surface. A push-up means for pushing up, a pickup means for picking up a semiconductor chip pushed up by the push-up means and taking it out of the wafer sheet; In the semiconductor manufacturing device in which a, the lighting device is obtained by such a reflective member for guiding light from the light source to the surface of the support member.
【０００７】請求項３の発明は、請求項２の発明におい
て更に、前記支持部材を備えるとともに、突き上げ手段
の保持部を収容する支持胴に、光源からの光を支持胴内
部に導く窓部を設けるようにしたものである。According to a third aspect of the present invention, in the second aspect of the present invention, a window for guiding the light from the light source into the inside of the support cylinder is provided on the support cylinder which includes the support member and accommodates the holding portion of the push-up means. It is provided.
【０００８】請求項４の発明は、請求項２又は３の発明
において更に、前記反射部材が突き上げ手段を保持する
保持部に設けた反射ミラーであるようにしたものであ
る。According to a fourth aspect of the present invention, in the second or third aspect, the reflection member is a reflection mirror provided on a holding portion for holding the push-up means.
【０００９】請求項５の発明は、請求項１から３のいず
れかの発明において更に、前記反射部材が支持部材の内
部に分散されて埋設された反射性を有する粒状物である
ようにしたものである。According to a fifth aspect of the present invention, in the first aspect of the present invention, the reflective member is a reflective granular material dispersed and embedded in the support member. It is.
【００１０】請求項６の発明は、請求項５の発明におい
て更に、前記粒状物が支持部材の中央側でより密に分散
されて埋設されるようにしたものである。According to a sixth aspect of the present invention, in the fifth aspect of the present invention, the granular material is more densely dispersed and buried at the center of the supporting member.
【００１１】[0011]
【作用】請求項１、２の発明によれば下記の作用があ
る。 照明装置が光源からの光を支持部材の表面に導く反射
部材を備えた。従って、光源からの光はほとんど全てが
反射部材により支持部材の表面、ひいては半導体チップ
に向けて導かれるものとなり、光源からの光を効率よく
半導体チップに照射できる。According to the first and second aspects of the present invention, the following effects are provided. The lighting device includes a reflecting member that guides light from the light source to the surface of the supporting member. Therefore, almost all of the light from the light source is guided toward the surface of the support member and eventually to the semiconductor chip by the reflecting member, and the light from the light source can be efficiently radiated to the semiconductor chip.
【００１２】請求項３の発明によれば下記の作用があ
る。 突き上げ手段の保持部を収容する支持胴に窓部を設
け、該支持胴に支持部材を備えるものとしたから、光源
からの光を支持胴の内部に通して支持部材の表面に導く
光路を形成できる。According to the third aspect of the invention, the following operation is provided. A window is provided in the support body that holds the holding portion of the push-up means, and the support body is provided with a support member. Thus, an optical path for guiding light from a light source through the inside of the support body and leading it to the surface of the support member is formed. it can.
【００１３】請求項４の発明によれば下記、の作用
がある。 突き上げ手段の保持部に、反射部材を構成する反射ミ
ラーを設けたから、突き上げ手段の内部に光源を配置す
ることなく、突き上げ手段による突き上げ対象となる半
導体チップに対し、その突き上げ作業位置で、しかも真
下から光源からの光を照射し撮像することができる。こ
のため、突き上げ手段を大型化することなく良好に半導
体チップを撮像できる。According to the fourth aspect of the invention, the following operations are provided. Since the holding portion of the push-up means is provided with a reflection mirror constituting a reflection member, the light source is not disposed inside the push-up means, and the semiconductor chip to be pushed up by the push-up means is at the push-up work position and directly below. From the light source to illuminate the image. For this reason, the semiconductor chip can be favorably imaged without increasing the size of the push-up means.
【００１４】突き上げ手段の保持部に反射ミラーを設
けたことから、突き上げ手段の構成を複雑にすることの
ない簡素な構成により光源からの光を支持部材の表面に
確実に導くことができる。Since the reflection mirror is provided on the holding portion of the push-up means, the light from the light source can be reliably guided to the surface of the support member by a simple structure without complicating the structure of the push-up means.
【００１５】請求項５の発明によれば下記の作用があ
る。 支持部材の内部に反射性粒状物を埋設してこれを反射
部材とすることにより、構成を簡素にできる。According to the fifth aspect of the present invention, the following operations are provided. The structure can be simplified by embedding the reflective granular material inside the support member and using this as a reflective member.
【００１６】請求項６の発明によれば下記の作用があ
る。 反射性粒状物が支持部材の中央側でより密に分散され
て埋設されるものとすることにより、光源から遠方にな
るために到達光量が少なめになる支持部材の中央で反射
光量は多めになり、結果として、支持部材の全体で半導
体チップを照明するに十分な反射光量を生成できる。According to the sixth aspect of the present invention, the following operations are provided. The reflective particles are more densely dispersed and buried in the center of the support member, so that the amount of light that reaches the light source becomes smaller because it is far from the light source. As a result, it is possible to generate a sufficient amount of reflected light to illuminate the semiconductor chip with the entire support member.
【００１７】[0017]
【発明の実施の形態】図１は第１実施形態の半導体製造
装置を示す断面図、図２は半導体チップを撮像した画像
を示す模式図、図３は第２実施形態の半導体製造装置を
示す断面図である。1 is a sectional view showing a semiconductor manufacturing apparatus according to a first embodiment, FIG. 2 is a schematic view showing an image of a semiconductor chip taken, and FIG. 3 is a view showing a semiconductor manufacturing apparatus according to a second embodiment. It is sectional drawing.
【００１８】（第１実施形態）（図１、図２） 半導体製造装置１０は、半導体チップ１を搭載している
透明或いは半透明なるウエハシート２から半導体チップ
１を取出し、この半導体チップ１をリードフレームにボ
ンディングする。このとき、半導体製造装置１０は、半
導体チップ１の位置を読取る作業と、半導体チップ１を
ウエハシート２から突き上げる作業と、突き上げられた
半導体チップ１を取出す作業とがなされる。First Embodiment (FIGS. 1 and 2) A semiconductor manufacturing apparatus 10 takes out a semiconductor chip 1 from a transparent or translucent wafer sheet 2 on which the semiconductor chip 1 is mounted, and removes the semiconductor chip 1. Bond to lead frame. At this time, the semiconductor manufacturing apparatus 10 performs an operation of reading the position of the semiconductor chip 1, an operation of pushing up the semiconductor chip 1 from the wafer sheet 2, and an operation of taking out the pushed up semiconductor chip 1.
【００１９】半導体製造装置１０は、半導体チップ１を
搭載しているウエハシート２を保持するウエハシート保
持部（不図示）を有し、このウエハシート保持部をＸＹ
移動装置（不図示）により移動し、各半導体チップ１を
突き上げ作業位置に位置付ける。尚、ウエハシート保持
部は、ウエハシート２を引き伸ばした状態で保持し、ウ
エハシート２に搭載された各半導体チップ１の間に微小
な間隙を形成可能とされる。The semiconductor manufacturing apparatus 10 has a wafer sheet holding section (not shown) for holding a wafer sheet 2 on which the semiconductor chips 1 are mounted.
The semiconductor device 1 is moved by a moving device (not shown) to position each semiconductor chip 1 at a push-up operation position. The wafer sheet holding section holds the wafer sheet 2 in a stretched state, and can form a minute gap between the semiconductor chips 1 mounted on the wafer sheet 2.
【００２０】半導体製造装置１０は、ウエハシート保持
部の下方に配置された半導体チップ突き上げ装置１１
（以下、単に「突き上げ装置」という）を有する。突き
上げ装置１１は、ウエハシート２の半導体チップ搭載面
の裏面を吸着保持可能とする透明又は半透明のガラス、
樹脂等からなる支持部材１２を有する。支持部材１２は
支持胴１３の上端部に気密に固着される。支持胴１３の
下端部に気密に固着された底部材１４には真空供給口１
５が設けられ、支持部材１２の上面には真空供給口１５
が供給した真空力を分配されてウエハシート２を吸着保
持する環状の吸着溝１２Ａが形成される。The semiconductor manufacturing apparatus 10 includes a semiconductor chip push-up device 11 disposed below the wafer sheet holding section.
(Hereinafter, simply referred to as “thrust device”). The push-up device 11 is made of a transparent or translucent glass capable of holding the back surface of the semiconductor chip mounting surface of the wafer sheet 2 by suction,
It has a support member 12 made of resin or the like. The support member 12 is air-tightly fixed to the upper end of the support cylinder 13. The bottom member 14 hermetically fixed to the lower end of the support cylinder 13 has a vacuum supply port 1
5, a vacuum supply port 15 is provided on the upper surface of the support member 12.
Are distributed to form an annular suction groove 12A for holding the wafer sheet 2 by suction.
【００２１】突き上げ装置１１は、光源１６Ａを有し、
この光を支持部材１２の裏面に導く照明装置１６を有す
る。照明装置１６は、支持胴１３の側壁に設けられた窓
部１３Ａに接続された光ファイバ１７、窓部１３Ａを密
閉するように気密に装着されるガラスレンズ１８を備
え、光源１６Ａからの光を支持胴１３の内部に導き、更
に後述する反射部材２６により支持部材１２の裏面から
内部を通って表面へ導くこととしている。The push-up device 11 has a light source 16A,
An illumination device 16 for guiding the light to the back surface of the support member 12 is provided. The lighting device 16 includes an optical fiber 17 connected to a window 13A provided on a side wall of the support body 13, and a glass lens 18 hermetically mounted so as to seal the window 13A, and emits light from the light source 16A. The support member 13 is guided to the inside, and is further guided from the back surface of the support member 12 to the front surface by the reflection member 26 described later.
【００２２】突き上げ装置１１は、後述の画像処理装置
にて画像処理されて検出された半導体チップ１の重心等
の特定位置をウエハシート２の裏面から突き上げる突き
上げ針２２を有する。突き上げ装置１１は、昇降ロッド
２３を支持胴１３の底部材１４に設けたブッシュ２４か
ら挿入し、昇降ロッド２３に固定した針保持部２５に突
き上げ針２２を保持し、突き上げ針２２を支持部材１２
の中央孔からチップ突き上げ方向に突き出し可能として
いる。The push-up device 11 has a push-up needle 22 that pushes up a specific position, such as the center of gravity of the semiconductor chip 1, which is image-processed and detected by an image processing device described later, from the back surface of the wafer sheet 2. The push-up device 11 inserts the lifting rod 23 from a bush 24 provided on the bottom member 14 of the support barrel 13, holds the push-up needle 22 in a needle holder 25 fixed to the lifting rod 23, and pushes the push-up needle 22 into the support member 12.
From the center hole in the chip push-up direction.
【００２３】半導体製造装置１０は、ウエハシート保持
部（不図示）の上方に設置され、ウエハシート２を介し
て支持部材１２に支持された半導体チップ１の周辺を上
方へと通過する光（ウエハシート透過光）を捕えて該半
導体チップ１の画像を取り込む撮像装置２１を有する。
撮像装置２１は、ＣＣＤカメラ２１Ａ、光学レンズ２１
Ｂからなる。The semiconductor manufacturing apparatus 10 is installed above a wafer sheet holding section (not shown), and receives light (wafer) that passes upward around the semiconductor chip 1 supported by the support member 12 via the wafer sheet 2. An imaging device 21 that captures an image of the semiconductor chip 1 by capturing a sheet transmitted light).
The imaging device 21 includes a CCD camera 21A, an optical lens 21
B.
【００２４】半導体製造装置１０は、撮像装置２１が取
り込んだ画像を処理して半導体チップ１の位置や形状を
検出する画像処理装置（不図示）を有する。The semiconductor manufacturing apparatus 10 has an image processing device (not shown) for processing the image captured by the imaging device 21 and detecting the position and shape of the semiconductor chip 1.
【００２５】半導体製造装置１０は、突き上げ針２２に
突き上げられた半導体チップ１をピックアップして該半
導体チップ１をウエハシート２から取出すピックアップ
装置（不図示）を有する。ピックアップ装置は、取出し
た半導体チップ１をリードフレームのボンディング作業
位置へと搬送し、リードフレームにボンディングする。The semiconductor manufacturing apparatus 10 has a pickup device (not shown) for picking up the semiconductor chip 1 pushed up by the push-up needle 22 and taking out the semiconductor chip 1 from the wafer sheet 2. The pickup device transports the semiconductor chip 1 taken out to a bonding operation position of the lead frame, and bonds the semiconductor chip 1 to the lead frame.
【００２６】従って、半導体製造装置１０にあっては、
突き上げ針２２による突き上げ作業位置に位置付けら
れ、ウエハシート２を介して支持部材１２に支持された
半導体チップ１の画像を撮像装置２１により取り込み、
この撮像装置２１が取り込んだ画像を処理して得られた
該半導体チップ１の位置に基づき、ウエハシート２を不
図示のＸＹ移動装置により移動調整することで、半導体
チップ１の特定位置を突き上げ針２２に位置合わせし、
そして突き上げ、突き上げられた半導体チップ１をピッ
クアップ装置により取出してボンディングに供する。Therefore, in the semiconductor manufacturing apparatus 10,
The imaging device 21 captures an image of the semiconductor chip 1 positioned at the push-up operation position by the push-up needle 22 and supported by the support member 12 via the wafer sheet 2,
By moving and adjusting the wafer sheet 2 by an XY moving device (not shown) based on the position of the semiconductor chip 1 obtained by processing the image captured by the imaging device 21, a specific position of the semiconductor chip 1 is pushed up. Align to 22,
Then, the semiconductor chip 1 pushed up is taken out by a pickup device and provided for bonding.
【００２７】然るに、半導体製造装置１０の照明装置１
６にあっては、突き上げ針２２の針保持部２５の45度に
カットされた上面に全反射ミラー２６Ａを貼り付け、こ
の反射ミラー２６Ａを反射部材２６としている。ここ
で、反射部材２６の位置は、図１に示す突き上げ針２２
が下降状態において、光ファイバ１７、ガラスレンズ１
８によって支持胴１３の側方から支持胴１３の内部に導
かれた光源１６Ａからの光の光軸が、この反射ミラー２
６Ａにより90度曲げられ上方の支持部材１２の裏面、ひ
いてはその内部を通って表面へ導かれるような位置関係
とされる。支持部材１２の表面に導かれた光は、ウエハ
シート２を透過し、更に相隣る半導体チップ１の隙間を
上方へと通過し、撮像装置２１により捕えられる。撮像
装置２１が捕えた半導体チップ１の画像は、半導体チッ
プ１の部分が暗く、相隣る半導体チップ１の間の隙間が
明るく写り、図２に示す如くの影絵画像になる。この影
絵画像は、半導体チップ１の表面の凹凸や反射率等の状
態変化に無関係に常に変化の少ない非常に高コントラス
トの安定した白黒画像である。この画像を画像処理装置
で画像処理することにより、半導体チップ１の形状、位
置を常に高精度に検出できる。The lighting device 1 of the semiconductor manufacturing apparatus 10
In 6, the total reflection mirror 26A is attached to the upper surface of the needle holder 25 of the push-up needle 22 cut at 45 degrees, and the reflection mirror 26A is used as the reflection member 26. Here, the position of the reflection member 26 is determined by the push-up needle 22 shown in FIG.
When the optical fiber 17 and the glass lens 1
8, the optical axis of the light from the light source 16A guided into the support cylinder 13 from the side of the support cylinder 13
The support member 12 is bent by 90 degrees by 6A and has a positional relationship such that the support member 12 is guided to the front surface through the back surface of the upper support member 12 and the inside thereof. The light guided to the surface of the support member 12 passes through the wafer sheet 2, further passes upward through the gap between the adjacent semiconductor chips 1, and is captured by the imaging device 21. In the image of the semiconductor chip 1 captured by the imaging device 21, the portion of the semiconductor chip 1 is dark, the gap between the adjacent semiconductor chips 1 is bright, and a shadow picture as shown in FIG. 2 is obtained. This shadow picture image is a very high-contrast, stable black-and-white image with little change irrespective of changes in the state of the surface of the semiconductor chip 1, such as unevenness and reflectance. By processing this image with an image processing device, the shape and position of the semiconductor chip 1 can always be detected with high accuracy.
【００２８】尚、図１において、２７はＯリングであ
る。In FIG. 1, reference numeral 27 denotes an O-ring.
【００２９】本実施形態によれば、以下の作用がある。 照明装置１６が光源１６Ａからの光を支持部材１２の
表面に導く反射部材２６を備えた。従って、光源１６Ａ
からの光はほとんど全てが反射部材２６により支持部材
１２の表面、ひいては半導体チップ１に向けて導かれる
ものとなり、光源からの光を効率よく半導体チップ１に
照射できる。According to this embodiment, the following operations are provided. The lighting device 16 includes a reflecting member 26 that guides light from the light source 16 </ b> A to the surface of the support member 12. Therefore, the light source 16A
Almost all of the light from the light source is guided toward the surface of the support member 12 and eventually to the semiconductor chip 1 by the reflecting member 26, so that the light from the light source can be efficiently applied to the semiconductor chip 1.
【００３０】突き上げ針２２の針保持部２５を収容す
る支持胴１３に窓部１３Ａを設け、該支持胴１３に支持
部材１２を備えるものとしたから、光源からの光を支持
胴１３の内部に通して支持部材１２の表面に導く光路を
形成できる。A window 13A is provided in the support body 13 for accommodating the needle holding portion 25 of the push-up needle 22, and the support body 13 is provided with the support member 12, so that the light from the light source enters the inside of the support body 13. An optical path leading through the surface of the supporting member 12 through the supporting member 12 can be formed.
【００３１】突き上げ針２２の針保持部２５に、反射
部材２６を構成する反射ミラー２６Ａを設けたから、突
き上げ装置１１の支持胴１３の内部に光源１６Ａを配置
することなく、突き上げ針２２による突き上げ対象とな
る半導体チップ１に対し、その突き上げ作業位置で、し
かも真下から光源１６Ａからの光を照射し撮像すること
ができる。このため、突き上げ装置１１を大型化するこ
となく良好に半導体チップ１を撮像できる。Since the reflection mirror 26A constituting the reflection member 26 is provided on the needle holding portion 25 of the push-up needle 22, the object to be pushed up by the push-up needle 22 can be used without disposing the light source 16A inside the support body 13 of the push-up device 11. The light from the light source 16 </ b> A can be radiated from directly below the semiconductor chip 1 to be imaged at the position where the semiconductor chip 1 is pushed up. Therefore, it is possible to satisfactorily image the semiconductor chip 1 without increasing the size of the push-up device 11.
【００３２】突き上げ針２２の針保持部２５に、反射
ミラー２６Ａを設けたことから、突き上げ装置１１の構
成を複雑にすることのない簡素な構成により、光源１６
Ａからの光を支持部材の表面に確実に導くことができ
る。Since the reflecting mirror 26A is provided on the needle holding portion 25 of the push-up needle 22, the light source 16 has a simple structure that does not complicate the structure of the push-up device 11.
Light from A can be reliably guided to the surface of the support member.
【００３３】（第２実施形態）（図３） 第２実施形態が第１実施形態と異なる点は、照明装置１
６を照明装置３０に代えたことにある。照明装置３０
は、支持部材１２の周辺側壁面に光源３１を接続し、光
源３１の光を支持部材１２の表面に導く反射部材３２と
して、支持部材１２の内部に分散させて埋設した反射性
を有する複数の粒状物３２Ａを用いたことにある。光源
３１から支持部材１２に照射された光は、支持部材１２
の内部の粒状物３２Ａによって反射され、支持部材１２
の内部からその表面に導かれる。このとき、粒状物３２
Ａは、支持部材１２の中央側でより密に分散されて埋設
される。(Second Embodiment) (FIG. 3) The second embodiment is different from the first embodiment in that
6 is replaced with a lighting device 30. Lighting device 30
The light source 31 is connected to the peripheral side wall surface of the support member 12, and as the reflection member 32 for guiding the light of the light source 31 to the surface of the support member 12, a plurality of reflective members dispersed and embedded inside the support member 12. That is, the granular material 32A is used. The light emitted from the light source 31 to the support member 12
Is reflected by the particulate matter 32A inside the support member 12A.
From the inside to the surface. At this time, the granular material 32
A is more densely dispersed and embedded on the center side of the support member 12.
【００３４】尚、反射性粒状物３２Ａとしては、表面が
鏡面研磨された金属球、支持部材１２と異なる材質の粒
状物（例えばガラスの支持部材１２に対し樹脂の粒状
物）等を採用できる。As the reflective granular material 32A, a metal ball having a mirror-polished surface, a granular material different from the material of the support member 12 (eg, a resin granular material for the glass support member 12), or the like can be used.
【００３５】本実施形態によれば、以下の作用がある。 支持部材１２の内部に反射性粒状物３２Ａを埋設して
これを反射部材３２とすることにより、構成を簡素にで
きる。According to the present embodiment, the following operations are provided. The configuration can be simplified by embedding the reflective granular material 32 </ b> A inside the support member 12 and using this as the reflective member 32.
【００３６】反射性粒状物３２Ａが支持部材１２の中
央側でより密に分散されて埋設されるものとすることに
より、光源から遠方になるために到達光量が少なめにな
る支持部材１２の中央で反射光量は多めになり、結果と
して、支持部材１２の全体で半導体チップ１を照明する
に十分な反射光量を生成できる。Since the reflective granular material 32A is more densely dispersed and buried at the center of the support member 12, it becomes distant from the light source, so that the amount of light that can reach the center of the support member 12 becomes smaller. The amount of reflected light is relatively large, and as a result, the amount of reflected light sufficient to illuminate the semiconductor chip 1 with the entire support member 12 can be generated.
【００３７】以上、本発明の実施の形態を図面により詳
述したが、本発明の具体的な構成はこの実施の形態に限
られるものではなく、本発明の要旨を逸脱しない範囲の
設計の変更等があっても本発明に含まれる。例えば、実
施形態では、半導体チップがウエハシートに搭載された
ものを示したが、半導体チップが透明或いは半透明のト
レイなどに収納されて供給されるものであっても良く、
また、本発明は、半導体製造装置において、半導体チッ
プ突き上げ装置以外の装置にも広く適用できる。The embodiment of the present invention has been described in detail with reference to the drawings. However, the specific configuration of the present invention is not limited to this embodiment, and the design can be changed without departing from the scope of the present invention. The present invention is also included in the present invention. For example, in the embodiment, the semiconductor chip is mounted on the wafer sheet. However, the semiconductor chip may be supplied while being stored in a transparent or translucent tray or the like.
Further, the present invention can be widely applied to devices other than the semiconductor chip push-up device in the semiconductor manufacturing device.
【００３８】[0038]
【発明の効果】以上のように本発明によれば、支持部材
に支持された半導体チップを裏面側から照明して半導体
チップを影絵の状態で撮像するに際し、光源からの光を
効率よく半導体チップに照射することができる。As described above, according to the present invention, when the semiconductor chip supported by the support member is illuminated from the back side and the semiconductor chip is imaged in the form of a shadow picture, the light from the light source is efficiently emitted from the semiconductor chip. Can be irradiated.
【図１】図１は第１実施形態の半導体製造装置を示す断
面図である。FIG. 1 is a sectional view showing a semiconductor manufacturing apparatus according to a first embodiment.
【図２】図２は半導体チップを撮像した画像を示す模式
図である。FIG. 2 is a schematic diagram showing an image obtained by imaging a semiconductor chip.
【図３】図３は第２実施形態の半導体製造装置を示す断
面図である。FIG. 3 is a cross-sectional view illustrating a semiconductor manufacturing apparatus according to a second embodiment.
１ 半導体チップ ２ ウエハシート １０ 半導体製造装置 １１ 突き上げ装置 １２ 支持部材 １３ 支持胴 １３Ａ 窓部 １６ 照明装置 ２１ 撮像装置 ２２ 突き上げ針（突き上げ手段） ２６ 反射部材 ２６Ａ 反射ミラー ３０ 照明装置 ３１ 光源 ３２ 反射部材 ３２Ａ 粒状物 REFERENCE SIGNS LIST 1 semiconductor chip 2 wafer sheet 10 semiconductor manufacturing apparatus 11 push-up device 12 support member 13 support body 13A window 16 lighting device 21 imaging device 22 push-up needle (push-up means) 26 reflecting member 26A reflecting mirror 30 lighting device 31 light source 32 reflecting member 32A Granular material
Claims (6)
半透明の支持部材と、 光源を有しその光を前記支持部材の表面に導く照明装置
と、 前記半導体チップに対して前記支持部材とは反対側に配
置され、前記支持部材に支持された半導体チップの周辺
の支持部材透過光を捕えてその半導体チップの画像を取
り込む撮像装置と、 この撮像装置が取り込んだ画像を処理して半導体チップ
の位置を検出する画像処理装置とを有してなる半導体製
造装置において、 前記照明装置は、前記光源からの光を前記支持部材の表
面に導く反射部材を備えたことを特徴とする半導体製造
装置。A transparent or translucent support member capable of supporting a semiconductor chip, an illuminating device having a light source and guiding the light to the surface of the support member, and the support member for the semiconductor chip. An imaging device that is disposed on the opposite side and captures an image of the semiconductor chip by capturing light transmitted through the support member around the semiconductor chip supported by the support member; and processes the image captured by the imaging device to capture the image of the semiconductor chip. A semiconductor manufacturing apparatus comprising: an image processing device that detects a position; wherein the illumination device includes a reflection member that guides light from the light source to a surface of the support member.
トを半導体チップ搭載面の裏面より支持可能とする透明
又は半透明の支持部材と、 光源を有しその光を前記支持部材の表面に導く照明装置
と、 前記半導体チップに対して前記ウエハシートとは反対側
に配置され、前記ウエハシートを介して前記支持部材に
支持された半導体チップの周辺のウエハシート透過光を
捕えてその半導体チップの画像を取り込む撮像装置と、 この撮像装置が取り込んだ画像を処理して半導体チップ
の位置を検出する画像処理装置と、 前記半導体チップを前記ウエハシートの半導体チップ搭
載面の裏面側より突き上げる突き上げ手段と、 突き上げ手段に突き上げられた半導体チップをピックア
ップしてウエハシートから取出すピックアップ手段とを
有してなる半導体製造装置において、 前記照明装置は、前記光源からの光を前記支持部材の表
面に導く反射部材を備えたことを特徴とする半導体製造
装置。2. A transparent or translucent support member capable of supporting a wafer sheet on which a semiconductor chip is mounted from a back surface of a semiconductor chip mounting surface, and an illumination having a light source and guiding light to the surface of the support member. An apparatus, disposed on the side opposite to the wafer sheet with respect to the semiconductor chip, capturing the transmitted light of the wafer sheet around the semiconductor chip supported by the support member via the wafer sheet, and capturing an image of the semiconductor chip. An image processing device that processes the image captured by the imaging device to detect the position of the semiconductor chip; and a push-up unit that pushes up the semiconductor chip from the back surface side of the semiconductor chip mounting surface of the wafer sheet. Pick-up means for picking up the semiconductor chip pushed up by the push-up means and taking it out of the wafer sheet. In the body manufacturing apparatus, the lighting device, a semiconductor manufacturing apparatus characterized by comprising a reflective member for guiding light from the light source to the surface of the support member.
げ手段の保持部を収容する支持胴に、光源からの光を支
持胴内部に導く窓部を設けた請求項２記載の半導体製造
装置。3. The semiconductor manufacturing apparatus according to claim 2, further comprising a window for guiding light from a light source into the inside of the support body, the support body including the support member and accommodating the holding portion of the push-up means.
保持部に設けた反射ミラーである請求項２又は３記載の
半導体製造装置。4. The semiconductor manufacturing apparatus according to claim 2, wherein said reflection member is a reflection mirror provided on a holding portion for holding said push-up means.
れて埋設された反射性を有する粒状物である請求項１か
ら３のいずれかに記載された半導体製造装置。5. The semiconductor manufacturing apparatus according to claim 1, wherein said reflective member is a reflective granular material dispersed and embedded in a support member.
に分散されて埋設された請求項５記載の半導体製造装
置。6. The semiconductor manufacturing apparatus according to claim 5, wherein said granular material is buried in a more densely dispersed manner at a center side of said support member.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000256418A JP4151816B2 (en) | 2000-08-25 | 2000-08-25 | Semiconductor manufacturing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000256418A JP4151816B2 (en) | 2000-08-25 | 2000-08-25 | Semiconductor manufacturing equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2002076031A true JP2002076031A (en) | 2002-03-15 |
| JP4151816B2 JP4151816B2 (en) | 2008-09-17 |
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ID=18745033
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000256418A Expired - Fee Related JP4151816B2 (en) | 2000-08-25 | 2000-08-25 | Semiconductor manufacturing equipment |
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| Country | Link |
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| JP (1) | JP4151816B2 (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007035937A (en) * | 2005-07-27 | 2007-02-08 | Shindengen Electric Mfg Co Ltd | Semiconductor manufacturing device |
| JP2008311430A (en) * | 2007-06-14 | 2008-12-25 | Nec Electronics Corp | Semiconductor chip detection device, and semiconductor chip detection method using it |
| JP2009016455A (en) * | 2007-07-02 | 2009-01-22 | Nec Corp | Substrate position detecting device and substrate position detecting method |
| JP2010045296A (en) * | 2008-08-18 | 2010-02-25 | Ueno Seiki Kk | Upthrust stage of upthrust device |
| US7824932B2 (en) | 2006-09-06 | 2010-11-02 | Renesas Electronics Corporation | Fabrication method of semiconductor device |
| JP2014107555A (en) * | 2012-11-23 | 2014-06-09 | Vesi Switzerland Ag | Method of removing semiconductor chip from foil |
| JP2014517539A (en) * | 2011-06-15 | 2014-07-17 | ミュールバウアー アクチェンゲゼルシャフト | Apparatus and method for positioning an electronic component and / or carrier relative to a discharge device |
| WO2015037081A1 (en) * | 2013-09-11 | 2015-03-19 | 富士機械製造株式会社 | Pickup apparatus |
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| JP7510701B2 (en) | 2022-01-05 | 2024-07-04 | 株式会社 東京ウエルズ | Semiconductor Manufacturing Equipment |
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2000
- 2000-08-25 JP JP2000256418A patent/JP4151816B2/en not_active Expired - Fee Related
Cited By (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007035937A (en) * | 2005-07-27 | 2007-02-08 | Shindengen Electric Mfg Co Ltd | Semiconductor manufacturing device |
| JP4514667B2 (en) * | 2005-07-27 | 2010-07-28 | 新電元工業株式会社 | Semiconductor manufacturing equipment |
| US8574933B2 (en) | 2006-09-06 | 2013-11-05 | Renesas Electronics Corporation | Fabrication method of semiconductor device |
| US7824932B2 (en) | 2006-09-06 | 2010-11-02 | Renesas Electronics Corporation | Fabrication method of semiconductor device |
| US8367433B2 (en) | 2006-09-06 | 2013-02-05 | Renesas Electronics Corporation | Fabrication method of semiconductor device |
| JP2008311430A (en) * | 2007-06-14 | 2008-12-25 | Nec Electronics Corp | Semiconductor chip detection device, and semiconductor chip detection method using it |
| JP2009016455A (en) * | 2007-07-02 | 2009-01-22 | Nec Corp | Substrate position detecting device and substrate position detecting method |
| JP2010045296A (en) * | 2008-08-18 | 2010-02-25 | Ueno Seiki Kk | Upthrust stage of upthrust device |
| JP2014517539A (en) * | 2011-06-15 | 2014-07-17 | ミュールバウアー アクチェンゲゼルシャフト | Apparatus and method for positioning an electronic component and / or carrier relative to a discharge device |
| JP2014107555A (en) * | 2012-11-23 | 2014-06-09 | Vesi Switzerland Ag | Method of removing semiconductor chip from foil |
| WO2015037081A1 (en) * | 2013-09-11 | 2015-03-19 | 富士機械製造株式会社 | Pickup apparatus |
| JP6033965B2 (en) * | 2013-09-11 | 2016-11-30 | 富士機械製造株式会社 | Pickup device |
| CN109585355A (en) * | 2019-01-24 | 2019-04-05 | 深圳市杰普特光电股份有限公司 | Single tube stripping machine and single tube system of processing |
| JP7510701B2 (en) | 2022-01-05 | 2024-07-04 | 株式会社 東京ウエルズ | Semiconductor Manufacturing Equipment |
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