A7 B7 五、發明說明（1 ) 【發明所屬之技術領域】 (請先閱讀背面之、注意事項再填寫本頁) 本發明有關於用Μ載置晶體坯件等之晶體基板之晶體基 板用載置台，和Κ光學式檢測被裝載在載置台上之晶體基 板之缺陷之晶體基板之缺陷檢查裝置，尤其有關於可Μ使 晶體基板之處理變為容易之晶體基板用載置台和晶體基板 之缺陷檢查裝置。 【習知之技術】 晶體振盪器由晶體坯件形成，晶體坯件只要有稍徵之缺 陷就會使晶體振盪器成為不良品，所Μ晶體坯件之缺陷檢 測非常重要。 到目前為止，晶體坯件之缺陷係由人員進行目視檢查， 因為依賴目視，所Μ要檢測數十w m Μ下之傷痕（缺陷）非 常困難。另.外，因為長時間的繼續進行作業，所Μ作業員 會疲勞，其结果是不能獲得穩定之檢查結果，成為要由2 人、3人重複進行檢查之狀態。因此，要求要有利用圖像 處理之缺陷檢查裝置。 利用圖像處理之習知之缺陷檢查裝置有如被記載在日本 經濟部智慧財產局員工消費合作社印製 專利特開平7 - 1 0 3 9 0 5號公報者。 亦即，如圖11所示，在互相偏離9 0 °之不同之位置配置 照明6 1〜6 3，從3個方向將光照射在晶體坯件等之被檢查 物6 0，和在各個照明之間配置C C D攝影機6 4 ·、6 5。該等之 C C D攝影機6 4、6 5和照明6 1〜6 3被配置在對被檢查物6 0之 水平面具有45 °角之位置。要檢査缺陷時，使攝影機二台 中之一台和該攝影機 兩側之二台照明中之一台同時變成 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） κι Β7_ 五、發明說明（2 ) Ο N，其他者變0 F F。進行4種之Ο N / 0 F F組合，K攝影機6 4、 (請先閱讀背面之注意事項再填寫本頁) 6 5攝影4個圖像，涵蓋3 6 0 °之檢測範圚。將各個圔像記憶 在圖像輸入裝置66，該等之全部圏像信號分別經由特徵抽 出裝置67和良否之判定裝置68進行判定，用來檢測與龜裂 方向無關之刮傷等之缺陷。 但是在上述之習知技術中會有下列之問題。 ⑴因為使用多台之照明和攝影機從傾斜方尚進行照射和 攝影，所Μ對於全體之像不能將焦點對準和光之條件設定 在同一位準，因此不能正確的檢測。 ⑵因為將攝影機設置在傾斜方向，所Κ圖像變成橢圓形 ，不能獲得正確之尺寸和計測。為了要獲得正確之尺寸和 計測 > 必需進行複雜之校正處理。 (3)因為要變換摄影機和照明，所Μ其控制變為複雜。另 外，檢查1個之被檢查物時，變成需要多個之圖像，檢測 之演算亦變為複雜，不能使圖像處理速度變快。 經濟部智慧財產局員工消費合作社印製 ⑷因為攝影機和照明均被配置在對水平面具有4 5 °角之 位置，所Κ會有放置被檢查物之載置台之底層模樣被輸入 之問題。當載置台之底層模樣被輸入時，對於缺陷或缺陷 之像的S / Ν比會劣化，因此檢測變得很困難。 其中，為著解決該等間題，曾檢討過一種缺陷檢查装置 ，從晶體坯件等之被檢物之側面全周方向，Μ ± 3 0 °之範 圚內之照射角度，將散亂光照射在被檢查物面，從被檢查 物面之正上方進行攝影。採用此種方式時，因為從被檢查 物之側面全周方向被暗視野照明，而且其照明光變成散亂 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 5 A7 B7_ 五、發明說明（3 ) (請先閱讀背面之"意事項再填寫本頁) 光，所Μ缺陷或邊緣所反射之反射光被強調，只有缺陷或 邊緣在圆像上明顯的浮上。因為被測定物之表面/背面之 大於30°之照射角度不照射，所Κ通過被檢査物之在表面 反射之光不會被攝影，因此被檢查物之全體圖像不能被攝 影成為影像。被攝影之光成為存在於被檢查物之缺陷，或 是只成為在被檢査物之側面（邊緣）反射之反射光。經由對 該反射光進行圖像處理，就可Μ很容易檢查缺陷。 【發明所欲解決之問題】 經濟部智慧財產局員工消費合作社印製 因為晶體坯件有缺陷時就不能使用，所Κ不能使用抽樣 *而是要求全數檢查。近年來因為晶體坯件之需要量急遽 增加，所Κ需要使上述之被檢討之缺陷檢查裝置自動化和 高速化。在這種情況，晶體坯件對基板載置台之設置/除 去成為作業之瓶頸。亦即*因為晶體坯件和基板載置台均 被鏡面加工，所Μ在裝載時，在晶體坯件和基板載置台之 間形成大致同一厚度之空氣層，晶體坯件會在基板載置台 滑動，在裝載後排除空氣層，晶體坯件會密著在基板載置 台。此種現象在被測定基板之厚度為30«m〜500/im，邊 或直徑之長度為3mm〜50 mm之晶體坯件之情況時變成特別 顯著。 因此，利用自動化裝置之搬蓮機器人手臂搬蓮來之晶體 坯件，在將其裝載在基板載置台時，該晶體坯件會在載置 台上滑動，載置位置不固定，變成為不穩定，因而影響精 密測定。另外，在裝載後造成與基板載置台密著，檢查後 不能利用搬蓮機器人手臂進行良好之檢拾（P i c k u p )，所K 本纸張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） " ~ Ο - A7 B7_ 五、發明說明（4 ) 會影響檢查之高速化和自動化。 其中曾檢討過在基板載置台之載置面Μ砂粒施加研磨成 具有刮傷之玻璃狀。但是，在使載置面只具有刮傷形成微 小凹凸之情況時，因為在載置面隨機的具有小的尖端突起 部，所Μ與晶體接觸容易被破壞，即使載置台使用與水晶 '同樣硬度之石英玻璃時，突起部之前端經過數小時之摩耗 進行測定，變成很難與晶體坯件之缺陷區別之狀態，會有 影響陷檢測之問題。另外，灰塵會進入徽小之凹部，即使 進行掃除亦不容易將其取出，當有灰塵附著在晶體坯件時 ，不容易與缺陷區別為其問題。 本發明用來消除上述之習知技術之問題，其目的是提供 晶體基板對載萱台之操作容易進行之晶體基板用載置台和 晶體基板之缺陷檢查裝置。 【解浃問題之手段】 本發明之晶體基板用載置台用來裝載晶體基板藉Κ在基 板處理部對被搬運機構搬入/搬出之晶體基板施加所需要 之處理；其中上述之載置台由透明構件構成，和在用Μ裝 載上逑晶體基板之平坦之載置面形成有溝，孔等之凹部。 晶體基板被搬蓮機構搬入到基板處理部藉Μ接受光學式 檢查等之處理，該晶體基板被裝載在基板處理部之載置台 上。這時，因為在載置台之平坦之載置面設有溝，孔等之 凹部，所Μ在晶體基板下面全體不會形成能夠使晶體基板 產生滑動之均一厚度之空氣層，因為晶體基板不會滑動所 Μ可設置在載置面上之指定位置。另外，在裝載後因為可 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ 7 _ (請先閲讀背面之注意事頊再填寫本頁) 裘--------訂----f------線| 經濟部智慧財產局員工消費合作社印製 A7 _B7_ 五、發明說明（5 ) (請先閱讀背面之注意事項再填寫本頁) Μ確保晶體基板和載置台之凹部之間之空氣層，所Μ晶體 基板不會密箸（附著）在載置台，在處理後，當利用搬運機 構等檢拾晶體基板時，晶體基板可Μ很容易脫離載置台。 另外，因為Μ平坦之載置面支持晶體基板，所Κ載置面不 會因為與晶體基板接觸而受傷。 載置面之凹部亦可Μ在被研磨成鏡面等之平坦之載置面 ，利用研磨加工或蝕刻形成溝，孔，凹陷等。在載置面之 凹部之大小，布置，和凹部之深度等，在晶體基板不會產 生滑動和密著之範圍內，可Κ依照晶體基板之尺寸等設定 。另外，在晶體基板除了晶體坯件和過濾用之晶體坯件外 ，亦包含電視攝影機和D V D用之晶體透鏡等。 經濟部智慧財產局員工消費合作社印製 在本發明中，使用藍寶石（氧化鋁）作為..載置台之透明構 件，因為藍寶石（氧化鋁）比晶體硬*所以不會受晶體基板 刮傷，可Μ涵蓋長期間的實施穩定之檢查等。另外，亦可 Μ使上述載置台之平坦之載置面和凹部之境界部連接成可 Κ描繪圓滑之曲線。當載置面和凹部之境界部（邊緣部）具 有尖銳之邊緣時，在光學測定等時，在邊緣部會產生反射 ，所Κ會產生晶體基板受傷之問題。 另外，本發明之晶體基板之缺陷檢測裝置根據使光照射 在晶體基板進行攝影所獲得之晶體基板之圖像信號，用來 進行缺陷之檢測；其中具備有：載置台，由透明構件所構 成，在用以水平裝載晶體基板之平坦之載置面形成有溝， 孔；照明裝置，在對晶體基板之水平之基板面形成上下方 尙± 3 0 °之照射角度之範圍内，從晶體基板之側面側全周 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ q _ A7 B7_ 五、發明說明（6 ) 方向，照射被擴散之散亂光；和攝影裝置，從對晶體基板 之基板面成為垂直之方向，對晶體基板進行攝影。 (請先閱讀背面之注意事項再填寫本頁) 在本發明中，攝影裝置從晶體基板之基板面之垂直方向 對晶體基板進行攝影，在對晶體基板之水平基板面成為上 下方向± 3 0 °之照射角度之範圍內，利用照明裝置，從晶 體基板之側面側全周方向，Μ被擴散之散亂光進行暗視野 照明。因此，通過晶體基板，在基板面進行反射之光不會 到達攝影裝置，不能攝得晶體基板之全體圖像。到達攝影 裝置之光成為存在於晶.體基板之缺陷，或是只為被晶體基 板之側面（邊緣）反射之反射光或散亂光。該光從晶體基板 之全周方向照射，而且在對基板面之上下方向±30°之照 射角度之範圍內照射，而且該光是被擴散之散亂光或擴散 光，所Μ缺陷或邊緣所反射之反射光被強調，只有缺陷或 邊緣明顯的浮在圖像上。經由對該圖像進行處理，可Μ很 容易檢測出缺陷。另外，因為在本發明亦使用有由透明構 件製成之載置台，在用Κ水平裝載晶體基板之平坦之載置 面，形成有溝，孔等之凹部，所Μ可Μ防止晶體基板之滑 經濟部智慧財產局員工消費合作社印製 動和密著，可以容易而且迅速的對晶體基板進行處理。 在上述之發明之缺陷檢查裝置中，當將照明裝置設在晶 體基板之下方時，於晶體基板移動時照明裝置不會成為障 礙物，可Μ進行順利之檢査。另外，最好使用發光二極體 作為上述之照明裝置。當與鹵素燈等之習知之照明光源比 較時，發光二極體之壽命較長，而且發熱量亦少因此易於 操作。另外，發光二極體亦可Μ使用集光型，擴散型之任 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ~ A7 B7_ 五、發明說明（7 ) (請先閱讀背面之注意事項再填寫本頁) 何一種。對於因為照射在晶體基板之光產生不均因而不能 測定時，經由在二極體之周圍利用鏡等之反射板，可 均一之光照射在晶體基板，除了光源外，亦可Μ不使用擴 散板。 【發明之實施形態】 下面將使用附圖用來說明本發明之實施形態。圖1是概 略構造画，用來表示使本發明之晶體基板之缺陷檢查裝置 適用在晶體振盪器用之晶體坯件之一實施形態。 在圖1中，符號1是被鏡面加工之短長方形之晶體坯件， 通常其大小為IX 3πιιπ〜3X 10mm，厚度為30m m〜500/i m之 程度。該晶體坯件1之形狀並不只限於短長方形，或矩形 ，亦可K為直徑4〜8mm程度之圓形或其他形狀。 經濟部智慧財產局員工消費合作社印製 晶體坯件1被水平的裝載在載置台2上。該載置台2由藍 寶石（氧化鋁）製成，在被鏡面加工後之載置台2之載置面3 ，如圏2所示，形成有溝4作為凹部用Μ避免晶體坯件1之 滑動和密著。溝4 Μ等間隔在載置台2之一邊平行的形成多 個。實質上，對於大小2 0 X 2 0 m m，厚度1 m m之載置台2，如 圖2 ( b )之A部位擴大剖面圖之圖2 ( c )所示，以1 m m之間隔， 利用研磨加工製成溝寬0 . 5 m m，深度5〜1 0 w m之溝4。另外 ，如圖2 ( c )之B部份擴大剖面圖之圖2 ( d )所示，載置面3和 溝4之邊緣部（境界部）5具有光滑之圓形，在缺陷檢査時不 會有光學式之反射。 作為藍寶石之載置台2者係使用比晶體更硬質之藍寶石 (氧化鋁），不會因為晶體坯件1而受傷。但是，因為構建 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ , Λ _ A7 B7_;_ 五、發明說明（8 ) (請先閱讀背面之注意事項再填寫本頁) 成將晶體坯件1裝載在鏡面加工之載置面3上，所Μ作為載 置台2之材料者並不只限於藍寶石（氧化鋁），即使使用納 玻璃、石英玻璃等之通常之玻璃時，亦不容易受傷。另外 ，在載置台2亦可Μ使用鑽石或對撿查光透明之陶瓷。 載置台2之溝4因為依照同一方向形成互相平行，所Μ假 如依照溝4之方向吹噴空氣等時，可Μ很簡單的除去進入 到溝4之灰塵。另外，在上述之實施形態中是使溝4形成互 相平行，但是也可Μ使該溝交叉，例如形成格子狀。另外 ，作為凹部者，除了溝外，其形成亦可Μ經由在載置面適 當的配置圓形等之孔。 在晶體坯件1之下方，如圖1所示的配置發光二極體6形 成包圍晶體坯件1之方式。來自發光二極體6之光，Μ對晶 體坯件1之基板面形成上下方向0°〜- 30°之範圍內之照 射角度Θ ，通過載置台2，從水晶坯件1之側面全周方向照 射。照射角度Θ是Μ晶體坯件1之表面側作為正側，以背 面側作為負側。當在發光二極體6之周圍配置鏡子時，可 Μ使來自全周方向之光均匀的照射在晶體坯件1。另外， 經濟部智慧財產局員工消費合作社印製 發光二極體6可Μ使用高亮度者，亦可Μ使用發出紅色光 〜紅外光之發光二極體。在載置台2之下側配置作為照明 裝置之發光二極體6，當使晶體坯件1移動時不會有妨礙物 來到上側，用來因應檢查工程之自動化、和大量生產化。 另外一方面，對於晶體坯件1之表面，在攝影方向之垂 直正上方位置，配置攝钐裝置11。在該攝鉍裝置1 l·使用有 C C D攝影機1 3和透鏡糸統1 2 (例如用來使來自晶體坯件1之 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ~ 經濟部智慧財產局員工消費合作社印製 A7 _B7_ 五、發明說明（9 ) 光成像在C C D攝影機1 3之C C D面上），設定成只將晶體坯件1 之附近收納在視野內。依照這種方式時，從發光二極體6 傾斜射入到晶體坯件1之光，不會直接進入到透鏡糸統1 2 ，變成暗視野之狀態。 利用C C D攝影機1 3所攝得之圖像信號被輸入到圖像處理 裝置1 4。該圖像處理裝置1 4具備有：特徵抽出部，從被輸 入之圖像信號中，抽出存在於晶體坯件1之缺陷之特徵； 和判定部，根據被抽出之信號用來判定缺陷之存在。攝影 裝置11用來只將晶體之附近收納在視野內》在圖像處理裝 置14K高速對視野之亮度變化進行圖像處理，可K用來檢 測出缺陷。 晶體坯件1被真空夾頭1 6吸著和被搬蓮機器人手臂1 5搬 入到載置台2，在進行過缺陷檢查後，再度的被真空夾頭 16吸著和被搬運機器人手臂15搬出。 亦即，在上述方式之構造中，被真空夾頭16吸著和被機 器人手臂1 5搬蓮到載置台2之晶體坯件1，被裝載在載置台 2之指定位置。這時在載置台2之載置面3因為形成有多個 溝4，所以晶體坯件1在載置台2上不會滑動，因為被正確 的裝載在指定之位置，所以可Μ進行缺陷之精密測定。 當被配置在載置台2之下側之多個發光二極體6朝向水晶 坯件1照射擴散後之散亂光時，形成由散亂光包圍水晶坯 件1之側面全周之方式。在這種情況，不會從晶體坯件1之 正上或正下方间照射光線。當從正上或正下照射時，造成 利用透過光或反射光將晶體坯件1之圖像轉寫到C C D攝影機 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ~ ίι — illll--- - 裝-— II ―- I I I ^ ---------- (請先閱讀背面之注意事項再填寫本頁) - A7 B7_ 五、發明說明（10 ) (請先閱讀背面之洼意事項再填寫本頁) 1 3。另外，用Μ支持晶體坯件1之載置台2之底層模樣被明 顯的寫入，造成存在於晶體坯件1之缺陷（缺陷部位）之判 別變為困難。 如圖3所示，當將來自側面全周之光照射在晶體坯件1時 ，晶體坯件1之缺陷（或缺陷部位）3 1和邊緣加工部之反射 光能量變大。從晶體坯件1之周圍照射之光之方尙由於散 亂而變成水平方向之全方向，但是假如在晶體坯件1沒有 缺陷時，因為光路未被遮斷 > 所以散亂光成為透過光的通 過。與此相對的，當有邊緣或缺陷31時，在該處被光照射 ，成為反射光3 3的被強調。 經濟部智慧財產局員工消費合作社印製 散亂光3 2照射在該缺陷3 1時就進行反射，用來使該缺陷 出現在晶體坯件1之表面。因使來自全方位之光3 2照射在 缺陷3 1，所Μ缺陷3 1之反射光之能量被強調，當從晶體坯 件1之上方看時，會看到缺陷3 1明顯的浮現。因為晶體之 缺陷具有全部之方向性，所Κ在照射一方尚之光之情況時 ，與光平行之缺陷不會產生反射，要進行檢測會有困難， 另外，即使在照射之方向之光之情況時，因為S Ν比變差， 所Μ要Μ良好之精確度檢測缺陷會有困難。但是，依照本 實施形態之方式，從四方或八方對缺陷31照射，而且使擴 散之光集中的照射，利用光之相乘效果可Μ更進一步的改 善S Ν比，即使對於小的缺陷亦可Κ以良好之精確度進行檢 測。特別是對於Κ人之眼睛檢測會有困難之小缺陷（1 0〜 2 0 w m Μ下），經由相對的使光量變強，變成可Μ檢測。 另外，因為可Κ Μ晶體坯件全體作為視野進行攝影和進 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ , Q _ A7 B7_ 五、發明說明（u) (請先閱讀背面之注意事項再填寫本頁) 行圖像處理，所Μ對於小的缺陷（1 0 /i m Μ下）亦可Μ Μ高 速進行檢測。例如，對5 1 2 X 5 1 2之圖像進行處理之情況時 ，可Μ Μ 2 0 0 m s Μ內之速度進行檢測，即使在1個之晶體坯 件中有數個缺陷時，其方式亦同。另外，對於10〜 以下之小缺陷，因為光能量變大，可Μ穩定的進行檢測， 所Κ可Μ很容昜使圖像處理自動化。 另外，假如晶體坯件之周面之邊緣加工精確度變為粗雜 時，邊緣之光之反射變大，相反的假如精確度良好時，反 射就變小，所Κ本實施形態之缺陷檢查裝置亦可Μ應用在 晶體坯件之加工精確度之檢查。另外，假如利用邊緣加工 面之反射時，則亦可Μ應用在晶體坯件之形狀或尺寸之測 定0 光對晶體坯件之表面之照射角度最好在+ 3 0 °〜-3 0 °之 範圍。在該範圍之理由是照射角度在± 3 0 °時S Ν變大，可 Μ明確的判別缺陷3 1，在超越該範圍時，因為載置台之底 層模樣會明顯出現，所Κ其判別變為困難，例如在土 45 ° 經濟部智慧財產局員工消費合作社印製 時，缺陷3 1之圖像完全被底層模樣吸收，所以不能檢測缺 陷31。 完成缺陷檢查後之晶體坯件1再度的被真空夾頭1 6吸著 ，經由搬運機器人手臂1 5被搬運到下一個工程。這時，因 為在載置台2之載置面3形成有溝4，所Μ晶體坯件1不會密 著在載置台2，可Μ脫離和圓滑的撿拾，藉Μ進行順利之 搬運ΰ 在上述方式之本實施形態中，因為在載置台2之載置面3 本紙張尺度適用令國國家標準（CNS)A4規格（210 X 297公釐） -14 - 經濟部智慧財產局員工消費合作社印製 A7 _：_B7_ 五、發明說明（12 ) 設有多個溝4，所以不會形成空氣層因而使晶體坯件1滑動 ，晶體坯件1在載置台2上不會滑動。因此，只需要使搬蓮 機器人手臂下降，解除吸著，就可以將晶體坯件1裝載在 載置台2上之指定位置，藉Μ進行正確之缺陷檢查。另外 ，不會由於空氣層完全被逐出而使晶體坯件1密著在載置 台2。因此，不會有檢查後之撿拾失敗，可Μ Μ高速進行 真空夾頭之輸送。 圖4表示從下方將光照射在晶體坯件1之照明裝置（光源） 之另一實施形態。該照明裝置在箱形之本體21之上部安裝 有發生二極體6，具有八角維體狀之安裝體2 2，沿著安裝 體22之傾斜面全周配置有多個之發光二極體6。用Κ裝載 晶體坯件1之載置台2如圖4 (b )所示，經由台座2 3被設置在 本體21上，來自發光二極體6之光，被圔中未顯示之鏡反 射，形成從晶體坯件1之下方朝向其側面全周均一的照射 。通常，晶體坯件經由研磨可K階段式的提高透明度。當 利用2 0 0 0〜4 0 0 0號之研磨粒子進行研磨使表面成為模猢不 清狀態時，稍微減少來自照明裝置之光量，使缺陷更容易 浮現，在研磨粒子為4 0 0 0號Μ上加工成透明之狀態，相反 的，可Μ使光増強藉Μ強調缺陷。因此，利用調光紐2 4可 Μ調節發光二極體6之光量。 圖5表示照明裝置之更另一實施形態。在該實施形態中 ，使用環狀燈2 5作為光源用來將光朝向晶體坯件1之側面 全周照射，將環狀燈25配置在載置台2之下側。通常該環 狀燈2 5可Μ使用最簡易和廉價之環狀之螢光燈。當環狀燈 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） ~ -1 5 - --------------裝--------訂--------.—線 (請先閱讀背面之注意事項再填寫本頁) - 經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（13 ) 25使用螢光燈之情況時，因為螢光燈所發出之光已經是散 亂光，所Μ不需要擴散板2 6，但是為著更進一步的提高散 亂效果，可Κ在環狀燈25之照射方向配置環狀之擴散板26 ，使從環狀燈2 5照射在晶體坯件1之光擴散，藉Μ將散亂 光照射在晶體坯件1。另外，為著對不施加照射之環狀燈 2 5之一部份進行遮光，可以在環狀燈2 5之周圍設置遮光板 2 7，利用對晶體坯件1之表面為0 °〜3 0 °之範圍内之照射 角度Θ ，從晶體坯件1之側面全周方向進行光之照射。 另外，在被鏡面加工之載置台之載置面，經由研磨加工 用來製成溝，在載置面和溝之境界部具有圚滑之圓形，如 上所述，在缺陷檢查時不會有光學式之反射。在此處將對 此點進行更具體之說明。要在由藍寶石（氧化鋁）彤成之載 置製作溝時，使用刷拭研磨劑進行刷拭研磨，然後進行化 學研磨，刷拭研磨時間對於溝之光學式反射之有無具有很 大之影響。 圖6表示厚度Ιιηιπ之藍寶石（氧化鋁）載置台之載置面和溝 之境界部之具體之剖面形狀，橫軸表示載置台之寬度方向 ，單位是Μ 2個刻度表示0 . 2 m m，縱軸表示溝深，單位是Μ 2個刻度表示2 0 w m。_ 6 ( a )表示0 . 5小時（Η )刷拭研磨時， 溝深1 3 w id。圖6 ( b )表示1 . Ο Η刷拭研磨時，溝深1 1 w m，當 與圖6 ( a )比較時，研磨時間較長之部份使載置面和溝之境 界部具有更圓滑之圓形。 圖7表示使用圖6所示之載置台時之載置台和晶體坯件之 照射圖像，圖7 ( a )是使用0 . 5丨彳刷拭研磨載置台時之圖像， 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -ΛΙΙ Bn -1 n If I UK «^1 fB 1 n 1 m n n m 訂_丨 1^1 1^1 n 1^1 n n I (請先閱讀背面之注音？事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 A7 B7_ 五、發明說明（14 ) 圖7 ( b)是使用〗.Ο Η刷拭研磨載置台時之圖像。由該等圖中 可Κ明白，當使用0 . 5 Η刷拭研磨載置台時，在缺陷檢查時 ，在溝中會產生光學式反射，該溝浮到画像上，不能分辨 與缺陷之區別。與此相對的，當使用1 . Ο Η刷拭研磨載置台 時，與上述方式不同的，不會有暗視野之溝之邊緣效應， 被攝影之光成為存在於被檢查物之缺陷，或是只為被檢查 物之惻面（邊緣）所反射之反射光，因此，為著避免滑動和 密著，必需要確保所需要之溝深，經由選擇研磨時間藉Κ 在境界部產生最佳之圚形亦變為非常重要。 圖8表示藍寶石（氧化鋁）載置台之另一實施形態，亦即 使載置台2之溝4交叉形成格子狀。如圖2所示之溝當依一 方向形成互相平行時，進人到溝内之灰塵可Μ很簡單的除 去，但是當重複的使用時，塵埃和灰塵會堆積在溝間之山 部，經過1日至2日後會有不容易除去之傾向。其原因可Μ 視為是因為山部形成線狀，山部之面積很大。其中如圖8 所示，經由使溝4形成格子狀可Μ用來使山部之面積變小 。其结果是堆積在山部之塵埃和灰塵變少，可Μ延長載置 台之維修週期。 圖9表示照明裝置之另一實施形態，除了有發光二極體6 用來從下方將光照射在晶體坯件1外，更設有補肋發光二 極體7用來從上方照射光。在短矩形之晶體坯件1之情況， 當長邊之長度超過8 πι πι時，如圖9 ( c )所示，因為晶體坯件1 之兩端部（斜線部份）之光之強度比中央部弱，所以邊緣之 檢測變為困難。假如使包圍晶體坯件1之發光二極體6之配 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ , 7 _ ,—*---------装--------訂—^ —_—線 (請先閱讀背面之注意事項再填寫本頁) - 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明說明（15 ) 置直徑變大時，可K使兩端部之光之強度變強，但是需要 改造現存之裝置，而且會造成裝置之大型化。因此，如圖 9 (a )所示《在上部設置補肋發光二極體7，用來照射晶體 坯件之兩端部份（四個角落），如圖9 ( b )所示，可Μ獲得與 中央部相同之光量。上下之發光二極體6，7之發光強度之 比率假如在7 : 3〜3 : 7之範圚時，不會有光平衡方面之問 題。通常亦可Μ調整成為5: 5。在將發光二極體6設在載 置台2之上側時，需要配置成不會妨礙搬運機器人手臂15 之搬運路徑。另外，在對晶體坯件面形成+ 3 0°之照射角 度之範圍內進行照射。 圖10是平面圖，用來表示補肋發光二極體7之具體之配 置狀況，用Μ安裝補肋發光二極體7之安裝板8形成覆蓋載 置台之全部，在中央具有開口 ，用來確保搬蓮機器人手臂 1 5之搬運路徑9。補肋發光二極體7被安裝在安裝板8之4個 位置面對晶體坯件1之四個角落，可Μ從上方照射晶體坯 件1之兩端部。因為使照射角度在+ 3 0 ° Μ內，所Μ Μ圖中 顯示之鏡用來限制光路。 【發明之效果】 如上所述，依照本發明時，因為在載置台之平坦之載置 面形成溝，孔等之凹部，所Μ當裝載時晶體基板不會在載 置台上滑動，可Μ穩定在載置台上之載置位置。另外，晶 體基板不會密著在載置台，在檢拾時可Μ順利的將晶體基 板搬出。因此，可以使晶體基板之缺陷檢査等高速化。 【圖式之簡單說明】 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ . Q _ - ----^---------裝--------訂·---Π--- (請先閱讀背面之注意事項再填寫本頁)A7 B7 V. Description of the invention (1) [Technical field to which the invention belongs] (Please read the back and the precautions before filling out this page) The present invention relates to a crystal substrate carrier for placing a crystal substrate such as a crystal blank on the substrate. Table mounting, and K substrate defect inspection apparatus for optically detecting defects of a crystal substrate mounted on a mounting table, particularly regarding defects of a mounting table and a crystal substrate for a crystal substrate that can facilitate processing of the crystal substrate Check the device. [Known technology] The crystal oscillator is formed by a crystal blank. As long as the crystal blank has a few defects, it will make the crystal oscillator a defective product. Defect detection of the crystal blank is very important. So far, the defects of crystal blanks have been visually inspected by personnel, because it is very difficult to detect the flaws (defects) at several tens of millimeters depending on visual inspection. In addition, because the operation is continued for a long time, all operators will be fatigued. As a result, stable inspection results cannot be obtained, and the inspection will be repeated by two or three people. Therefore, a defect inspection device using image processing is required. A conventional defect inspection device using image processing is described in Japanese Patent Publication No. 7-103 0 5 as printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs of Japan. That is, as shown in FIG. 11, illuminations 6 1 to 6 3 are arranged at different positions that are offset from each other by 90 °, and light is irradiated onto the inspection object 60 such as a crystal blank from three directions, and the illumination is provided at each illumination. CCD cameras 6 4 ·, 6 5 are arranged between them. The C C D cameras 6 4 and 6 5 and the illumination 6 1 to 6 3 are arranged at an angle of 45 ° to the horizontal plane of the inspection object 60. To check for defects, make one of the two cameras and one of the two lights on both sides of the camera at the same time become the paper standard applicable to China National Standard (CNS) A4 (210 X 297 mm) κι Β7_ V. Description of the invention (2) 0 N, others become 0 FF. Make 4 kinds of 0 N / 0 F F combinations, K camera 6 4. (Please read the precautions on the back before filling out this page) 6 5 Take 4 images, covering the detection range of 360 °. Each artifact is stored in the image input device 66, and all the artifact signals are judged by the feature extraction device 67 and the good or bad judgment device 68, respectively, for detecting defects such as scratches that are not related to the crack direction. However, the above-mentioned conventional techniques have the following problems. ⑴Because multiple lighting and cameras are used for illumination and photography from the oblique side, the focus and light conditions cannot be set at the same level for the entire image, so it cannot be detected correctly. ⑵Because the camera is set in the oblique direction, the image becomes oval, and the correct size and measurement cannot be obtained. In order to obtain the correct size and measurement > complicated correction processing is required. (3) Since the camera and lighting are changed, the control becomes complicated. In addition, when inspecting one object to be inspected, a plurality of images are required, and the calculation of detection becomes complicated, which cannot make the image processing speed faster. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs ⑷ Because the cameras and lighting are arranged at a 45 ° angle to the horizontal plane, there is a problem that the bottom shape of the mounting table on which the inspection object is placed is input. When the bottom pattern of the mounting table is input, the S / N ratio for a defect or a defective image is deteriorated, and therefore detection becomes difficult. Among them, in order to solve these problems, a defect inspection device has been reviewed. From the side of the entire surface of the object such as a crystal blank, the irradiation angle within the range of M ± 30 ° will scatter light. The object is irradiated on the surface of the inspection object, and imaging is performed from directly above the surface of the object to be inspected. When this method is adopted, it is illuminated by a dark field from the side of the object to be inspected, and its illumination light becomes scattered. The paper size applies the Chinese National Standard (CNS) A4 (210 X 297 mm) 5 A7 B7_ V. Description of the invention (3) (Please read the "Issue" on the back before filling in this page) Light, the reflected light reflected by the defects or edges is emphasized, and only the defects or edges are obviously floating on the circular image. Because the surface / back surface of the object to be measured is not illuminated at an angle greater than 30 °, the light reflected by the surface of the object to be inspected will not be photographed, so the entire image of the object cannot be photographed as an image. The light to be photographed becomes a defect existing in the object to be inspected, or it is only reflected light reflected on the side (edge) of the object to be inspected. By performing image processing on the reflected light, defects can be easily inspected. [Problems to be Solved by the Invention] Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs. Because the crystal blanks cannot be used, sampling cannot be used. * Full inspection is required. In recent years, the demand for crystal blanks has increased sharply, so it is necessary to automate and speed up the defect inspection device under review. In this case, the installation / removal of the crystal blank to the substrate mounting table becomes a bottleneck in operation. That is, * because the crystal blank and the substrate mounting table are both mirror-finished, during the loading, an air layer of approximately the same thickness is formed between the crystal blank and the substrate mounting table, and the crystal blank will slide on the substrate mounting table. After the air layer is removed after loading, the crystal blank is closely adhered to the substrate mounting table. This phenomenon becomes particularly noticeable in the case of a crystal blank having a thickness of the substrate to be measured of 30 «m to 500 / im and a length of sides or diameters of 3 to 50 mm. Therefore, when using a robotic robotic robot to move a crystal blank from a lotus arm, when the wafer is loaded on a substrate mounting table, the crystal blank slides on the mounting table, the mounting position is not fixed, and becomes unstable. As a result, precision measurement is affected. In addition, after loading, it is in close contact with the substrate mounting table. After the inspection, a good pickup cannot be performed with the robot arm of the lotus. Therefore, the paper size of this paper applies the Chinese National Standard (CNS) A4 (210 X 297). (Mm) " ~ 〇-A7 B7_ 5. Description of the invention (4) will affect the speed and automation of inspection. Among them, it has been reviewed that the abrasive grains on the mounting surface M of the substrate mounting table are ground into a glass shape with scratches. However, when the mounting surface is only scratched to form minute irregularities, because the mounting surface has a small tip protrusion randomly, the contact with the crystal is easily broken, even if the mounting table is used with the same hardness as the crystal In the case of quartz glass, the wear of the front end of the protrusion is measured for several hours, and it becomes a state that is difficult to distinguish from the defects of the crystal blank, which may affect the detection of the depression. In addition, dust will enter the recess of the emblem, and it is not easy to remove it even if it is cleaned. When dust adheres to the crystal blank, it is not easy to distinguish it from defects as its problem. The present invention is intended to eliminate the problems of the above-mentioned conventional techniques, and an object thereof is to provide a crystal substrate mounting table and a crystal substrate defect inspection device which are easy to perform the operation of the crystal substrate on the mounting table. [Means for solving the problem] The crystal substrate mounting table of the present invention is used to load the crystal substrate and apply the required processing to the crystal substrate carried in / out by the conveyance mechanism in the substrate processing section; the above-mentioned mounting table is made of a transparent member. Structures, and recesses such as grooves, holes and the like are formed on the flat mounting surface on which the top crystal substrate is mounted with M. The crystal substrate is carried into the substrate processing section by the lotus mechanism to undergo processing such as optical inspection, and the crystal substrate is mounted on a mounting table of the substrate processing section. At this time, because recesses such as grooves and holes are provided on the flat mounting surface of the mounting table, an air layer having a uniform thickness that can cause the crystal substrate to slide will not be formed below the crystal substrate, because the crystal substrate will not slide. The M can be set at a specified position on the mounting surface. In addition, since the paper size can be applied to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) after loading, _ 7 _ (Please read the precautions on the back before filling this page) Qiu -------- --Order ---- f ------ line | Printed by A7 _B7_ of the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economy V. Invention Description (5) (Please read the precautions on the back before filling this page) Μ Make sure The air layer between the crystal substrate and the concave portion of the mounting table will not be tightly attached (attached) to the mounting table. After processing, when the crystal substrate is picked up by a transport mechanism or the like, the crystal substrate can be easily detached. Mounting table. In addition, since the M-flat mounting surface supports the crystal substrate, the K-mounting surface is not injured by contact with the crystal substrate. The recessed portion of the mounting surface may be formed on a flat mounting surface which is polished to a mirror surface, etc., and grooves, holes, depressions, etc. may be formed by grinding or etching. The size, arrangement, and depth of the recesses on the mounting surface can be set in accordance with the size of the crystal substrate within a range where the crystal substrate does not cause sliding and adhesion. In addition to crystal blanks and crystal blanks for filtration, crystal substrates also include television cameras and crystal lenses for DVD. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. In the present invention, sapphire (alumina) is used as the transparent member of the mounting table. Because sapphire (alumina) is harder than the crystal *, it will not be scratched by the crystal substrate. M covers long-term stable inspections. In addition, it is also possible to connect the flat mounting surface of the mounting table and the boundary portion of the recess to form a smooth curve. When the boundary (edge) of the mounting surface and the recess has sharp edges, reflections may occur at the edges during optical measurement, etc., and the crystal substrate may be damaged. In addition, the defect detection device for a crystal substrate of the present invention is used for detecting defects based on an image signal of the crystal substrate obtained by irradiating light on the crystal substrate for photography; it includes: a mounting table composed of a transparent member, Grooves and holes are formed on the flat mounting surface for horizontally mounting the crystal substrate; the lighting device forms an upper and lower irradiating angle of ± 30 ° to the horizontal substrate surface of the crystal substrate from the surface of the crystal substrate. The side of the paper throughout the week applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) _ q _ A7 B7_ V. Description of the invention (6) Direction, irradiate diffused scattered light; and photographic devices, from The substrate surface of the crystal substrate is oriented perpendicularly, and the crystal substrate is photographed. (Please read the precautions on the back before filling this page) In the present invention, the photographing device photographs the crystal substrate from the vertical direction of the substrate surface of the crystal substrate, and the horizontal substrate surface of the crystal substrate becomes the vertical direction ± 3 0 ° Within the range of the irradiation angle, the illumination device is used to illuminate the dark field of vision from the scattered scattered light diffused from the side surface side of the crystal substrate. Therefore, through the crystal substrate, light reflected on the substrate surface does not reach the imaging device, and the entire image of the crystal substrate cannot be captured. The light reaching the photographic device becomes a defect existing in the crystal substrate, or it is only reflected light or scattered light reflected by the side (edge) of the crystal substrate. The light is irradiated from the entire peripheral direction of the crystal substrate, and is irradiated within a range of an irradiation angle of ± 30 ° above and below the substrate surface, and the light is diffused scattered light or diffused light, which is caused by defects or edges. The reflected light is emphasized, and only defects or edges are apparently floating on the image. By processing this image, defects can be easily detected. In addition, since a mounting table made of a transparent member is also used in the present invention, recesses such as grooves and holes are formed on a flat mounting surface where a crystal substrate is horizontally loaded with K, so that the crystal substrate can be prevented from slipping. Employees' cooperatives in the Intellectual Property Bureau of the Ministry of Economic Affairs can easily and quickly process crystal substrates. In the defect inspection device of the above invention, when the illumination device is provided below the crystal substrate, the illumination device does not become an obstacle when the crystal substrate is moved, and the inspection can be performed smoothly. In addition, it is preferable to use a light emitting diode as the above-mentioned lighting device. When compared with conventional lighting sources such as halogen lamps, the life of the light-emitting diode is longer and the amount of heat generated is less, so it is easy to operate. In addition, light-emitting diodes can also use the light-concentrating type. Any paper size of the diffuse type is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ~ A7 B7_ V. Description of the invention (7) (please first Read the notes on the back and fill out this page). When the measurement cannot be performed because the light irradiated on the crystal substrate is not uniform, by using a reflecting plate such as a mirror around the diode, uniform light can be irradiated on the crystal substrate. In addition to the light source, a diffuser can be used without . [Embodiments of the Invention] Embodiments of the present invention will be described below with reference to the drawings. Fig. 1 is a schematic structural drawing showing an embodiment of a crystal blank for making a crystal substrate defect inspection apparatus of the present invention applicable to a crystal oscillator. In Fig. 1, the symbol 1 is a short rectangular crystal blank that is mirror-finished, and usually has a size of IX 3πm to 3X 10mm and a thickness of 30m to 500 / i m. The shape of the crystal blank 1 is not limited to a short rectangle or a rectangle, and K may be a circle or other shape having a diameter of about 4 to 8 mm. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The crystal blank 1 is horizontally loaded on the mounting table 2. The mounting table 2 is made of sapphire (alumina). After the mirror-processed mounting surface 3 of the mounting table 2, as shown in FIG. 2, a groove 4 is formed as a recess to prevent sliding of the crystal blank 1 and Close. A plurality of grooves 4M are formed in parallel on one side of the mounting table 2 at equal intervals. In essence, as shown in FIG. 2 (c) of the enlarged sectional view of part A of FIG. 2 (b), the mounting table 2 with a size of 20 × 20 mm and a thickness of 1 mm is processed by grinding at intervals of 1 mm. A trench 4 having a width of 0.5 mm and a depth of 5 to 10 wm was made. In addition, as shown in FIG. 2 (d) of the enlarged sectional view of part B of FIG. 2 (c), the edge portion (boundary portion) 5 of the mounting surface 3 and the groove 4 has a smooth round shape, and it is not used during defect inspection. There will be optical reflection. The sapphire mounting table 2 uses sapphire (aluminum oxide), which is harder than the crystal, and will not be injured by the crystal blank 1. However, because the paper size used in this paper applies the Chinese National Standard (CNS) A4 (210 X 297 mm) _, Λ _ A7 B7 _; _ 5. Description of the invention (8) (Please read the precautions on the back before filling this page ) The crystal blank 1 is loaded on the mirror-processed mounting surface 3, and the material used as the mounting table 2 is not limited to sapphire (alumina), even when ordinary glass such as nano glass, quartz glass, etc. are used, It is not easy to be injured. In addition, diamonds or ceramics that are transparent to the inspection light may be used on the mounting table 2. The grooves 4 of the mounting table 2 are formed in parallel with each other in the same direction. Therefore, if air or the like is blown in the direction of the grooves 4, the dust entering the grooves 4 can be easily removed. In the above-mentioned embodiment, the grooves 4 are formed in parallel with each other. However, the grooves may be intersected, for example, in a grid pattern. In addition, as the recessed portion, in addition to the groove, it can be formed by appropriately arranging a circular hole or the like on the mounting surface. Below the crystal blank 1, a light emitting diode 6 is arranged as shown in Fig. 1 so as to surround the crystal blank 1. The light from the light-emitting diode 6 forms an irradiation angle Θ on the substrate surface of the crystal blank 1 in a range of 0 ° to-30 ° in the up-down direction, and passes through the mounting table 2 from the side of the crystal blank 1 to the entire periphery. Irradiation. The irradiation angle? Is the front side of the M crystal blank 1 as the positive side and the back side as the negative side. When a mirror is arranged around the light-emitting diode 6, the crystal blank 1 can be uniformly irradiated with light from the entire peripheral direction. In addition, the light emitting diode 6 printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs can be used with high brightness, or light emitting diodes that emit red light to infrared light. A light emitting diode 6 as an illuminating device is arranged below the mounting table 2. When the crystal blank 1 is moved, there are no obstructions to the upper side, and it is used in response to the automation of inspection processes and mass production. On the other hand, the camera 11 is arranged on the surface of the crystal blank 1 at a position directly above the imaging direction. A CCD camera 13 and a lens system 12 are used in the bismuth photographing device 11 (for example, to make the paper size from the crystal blank 1 apply the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ~ Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _B7_ V. Description of the Invention (9) The light is imaged on the CCD surface of the CCD camera 1 3), and is set to store only the vicinity of the crystal blank 1 in the field of view. In this way, the light incident from the light emitting diode 6 to the crystal blank 1 at an angle does not directly enter the lens system 12 and becomes a dark field of view. The image signal captured by the CC camera D3 is input to the image processing device 14. The image processing device 14 includes a feature extraction unit that extracts features of defects existing in the crystal blank 1 from the inputted image signal, and a determination unit that determines the existence of defects based on the extracted signals. . The photography device 11 is used to store only the vicinity of the crystal in the field of view. The image processing device 14K performs image processing on the brightness change of the field of view at high speed, and K can be used to detect defects. The crystal blank 1 is sucked by the vacuum chuck 16 and the robot arm 15 is moved into the mounting table 2. After the defect inspection is performed, the crystal blank 1 is sucked by the vacuum chuck 16 and carried out by the transfer robot arm 15 again. That is, in the above-mentioned configuration, the vacuum chuck 16 is sucked and the robot arm 15 is moved to the crystal blank 1 of the mounting table 2 and is loaded at the designated position of the mounting table 2. At this time, because a plurality of grooves 4 are formed on the mounting surface 3 of the mounting table 2, the crystal blank 1 does not slide on the mounting table 2. Since it is correctly loaded at a designated position, precise measurement of defects can be performed. . When a plurality of light-emitting diodes 6 arranged on the lower side of the mounting table 2 emit diffused scattered light toward the crystal blank 1, the side surface of the crystal blank 1 is surrounded by the scattered light. In this case, no light is irradiated from directly above or below the crystal blank 1. When illuminated from above or below, the image of crystal blank 1 is transferred to the CCD camera using transmitted light or reflected light. The paper size applies the Chinese National Standard (CNS) A4 specification (210 X 297 mm) ~ ίι — illll ----Loading -— II ---- III ^ ---------- (Please read the notes on the back before filling this page)-A7 B7_ V. Description of the invention (10) (Please (Read the ins and outs on the back before filling out this page) 1 3. In addition, the bottom pattern of the mounting table 2 supporting the crystal blank 1 with M is clearly written, making it difficult to discriminate a defect (defective portion) existing in the crystal blank 1. As shown in FIG. 3, when light from the entire circumference of the side surface is irradiated on the crystal blank 1, the defects (or defect portions) 31 and the reflected light energy of the edge processed portion of the crystal blank 1 become large. The squares of light radiated from around the crystal blank 1 become omnidirectional in the horizontal direction due to scattering, but if the crystal blank 1 is not defective, the scattered light becomes transmitted light because the optical path is not blocked> Passed. In contrast, when there is an edge or a defect 31, it is irradiated with light there, and the reflected light 33 is emphasized. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs The scattered light 3 2 is reflected when the defect 31 is irradiated, so that the defect appears on the surface of the crystal blank 1. Since the light 31 from all directions is irradiated to the defect 31, the energy of the reflected light of the M defect 31 is emphasized. When viewed from above the crystal blank 1, the defect 31 is clearly seen. Because the defects of the crystal have all directionality, when the light is irradiated by one side, the defects parallel to the light will not be reflected, and it will be difficult to detect. In addition, even in the case of light in the direction of irradiation Because the SN ratio becomes worse, it will be difficult to detect defects with good accuracy. However, according to the method of this embodiment, the defects 31 are irradiated from the four or eight directions, and the diffused light is concentrated. The multiplication effect of light can further improve the SN ratio, even for small defects. K was tested with good accuracy. In particular, there are small defects (under 10 to 20 w m Μ) that are difficult to detect in the eyes of K people, and the relative amount of light is strengthened to become detectable. In addition, because the entire KM crystal blank can be taken as a field of view for photography and paper size, the Chinese National Standard (CNS) A4 (210 X 297 mm) is applicable. _, Q _ A7 B7_ V. Description of the invention (u) (Please Read the precautions on the back before filling in this page) for image processing, so small defects (at 10 / im Μ) can also be detected at high speed. For example, when processing the 5 1 2 X 5 1 2 image, the detection can be performed at a speed of Μ 200 μs, even if there are several defects in one crystal blank. with. In addition, for small defects of 10 to below, because the light energy becomes larger, the detection can be performed stably, so it is very easy to automate image processing. In addition, if the edge processing accuracy of the peripheral surface of the crystal blank becomes rough, the reflection of the light at the edge becomes large. On the contrary, if the accuracy is good, the reflection becomes small, so the defect inspection device of this embodiment It can also be used to check the accuracy of processing of crystal blanks. In addition, if the reflection of the edge processing surface is used, it can also be applied to the measurement of the shape or size of the crystal blank. The angle of light irradiation on the surface of the crystal blank is preferably + 3 0 ° ~ -3 0 °. range. The reason for this range is that the SN becomes larger when the irradiation angle is ± 30 °, and the defect 31 can be clearly identified. When exceeding this range, because the appearance of the bottom layer of the mounting table will obviously appear, the judgment becomes Difficult, for example, when printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs at 45 °, the image of defect 31 is completely absorbed by the underlying pattern, so defect 31 cannot be detected. After the defect inspection is completed, the crystal blank 1 is sucked by the vacuum chuck 16 again, and is transferred to the next project through the transfer robot arm 15. At this time, since the groove 4 is formed on the mounting surface 3 of the mounting table 2, the crystal blank 1 will not be closely adhered to the mounting table 2, and can be detached and smoothly picked up, and smooth transportation can be performed by the above method. In this embodiment, because the paper size on the mounting surface 3 of the mounting table 2 is applicable to the national standard (CNS) A4 specification (210 X 297 mm) -14-printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 _: _ B7_ V. Description of the invention (12) A plurality of grooves 4 are provided, so an air layer is not formed and the crystal blank 1 slides, and the crystal blank 1 does not slide on the mounting table 2. Therefore, simply by lowering the arm of the lotus robot and releasing the suction, the crystal blank 1 can be loaded at a designated position on the mounting table 2 to perform a correct defect inspection. In addition, the crystal blank 1 does not adhere to the mounting table 2 because the air layer is completely expelled. Therefore, there will be no pickup failure after inspection, and the vacuum chuck can be conveyed at a high speed. FIG. 4 shows another embodiment of an illuminating device (light source) for irradiating light on the crystal blank 1 from below. The lighting device is provided with a generating diode 6 on the upper part of the box-shaped body 21, an octagonal mounting body 22, and a plurality of light emitting diodes 6 arranged along the entire circumference of the inclined surface of the mounting body 22. . As shown in FIG. 4 (b), the mounting table 2 for loading the crystal blank 1 with K is set on the body 21 via the pedestal 23, and the light from the light-emitting diode 6 is reflected by a mirror not shown in the frame to form Uniform irradiation from below the crystal blank 1 toward its sides. Generally, crystal blanks can be K-staged to increase transparency by grinding. When the abrasive particles with a size of 2 0 0 to 4 0 0 are used to grind the surface into an unclear state, the amount of light from the lighting device is slightly reduced, and defects are more likely to appear. The abrasive particles are 4 0 0 0 It is processed into a transparent state on the contrary. On the contrary, it can make the optical fiber emphasize the defects by using M. Therefore, the light amount of the light emitting diode 6 can be adjusted by using the dimming button 24. FIG. 5 shows still another embodiment of the lighting device. In this embodiment, the ring lamp 25 is used as a light source to irradiate light toward the entire side surface of the crystal blank 1, and the ring lamp 25 is arranged below the mounting table 2. Usually the ring lamp 25 can be used as the simplest and cheapest ring fluorescent lamp. When the paper size of the ring lamp is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) ~ -1 5--------------- installation ------- -Order --------.- line (please read the notes on the back before filling this page)-Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7_ V. Description of the invention (13) 25 Use fluorescent In the case of a lamp, because the light emitted by the fluorescent lamp is already scattered, the diffuser plate 26 is not required, but in order to further improve the scattering effect, it can be arranged in the irradiation direction of the ring lamp 25 The ring-shaped diffuser plate 26 diffuses the light irradiated from the ring lamp 25 to the crystal blank 1, and irradiates the scattered light to the crystal blank 1 by M. In addition, in order to shield a part of the ring-shaped lamp 25 which is not irradiated, a light-shielding plate 27 can be provided around the ring-shaped lamp 25, and the surface of the crystal blank 1 is 0 ° ~ 30. The irradiation angle Θ in the range of ° is irradiated with light from the entire peripheral direction of the side surface of the crystal blank 1. In addition, the mounting surface of the mounting table that has been mirror-finished is used to make grooves by grinding. The surface of the mounting surface and the groove has a smooth round shape. As described above, there will be no defects during defect inspection. Optical reflection. This point will be explained in more detail here. When the groove is made of a sapphire (alumina) substrate, a brush-abrasive agent is used to perform brush-grinding, followed by chemical grinding. The brush-grinding time has a great influence on whether the groove has optical reflection. Figure 6 shows the specific cross-sectional shape of the mounting surface of the sapphire (alumina) mounting platform and the boundary portion of the ditch with a thickness of 1 μm. The horizontal axis represents the width direction of the mounting platform, and the unit is M. 2 scales represent 0.2 mm. The axis represents the depth of the groove, and the unit is M. 2 scales represent 20 wm. _ 6 (a) represents the groove depth of 13 w id when brushing and grinding for 0.5 hour (Η). Fig. 6 (b) shows that the groove depth is 1 1 wm when rubbing and rubbing. When compared with Fig. 6 (a), the longer grinding time makes the mounting surface and the boundary between the grooves smoother. The round. Fig. 7 shows the irradiation image of the mounting table and the crystal blank when the mounting table shown in Fig. 6 is used, and Fig. 7 (a) is an image when the mounting table is rubbed with 0.5 丨 彳 brush. China National Standard (CNS) A4 Specification (210 X 297 mm)-ΛΙΙ Bn -1 n If I UK «^ 1 fB 1 n 1 mnnm Order_ 丨 1 ^ 1 1 ^ 1 n 1 ^ 1 nn I (Please first Read the phonetic on the back? Matters and then fill out this page) A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 5. Description of the invention (14) Figure 7 (b) is used. . From these figures, it can be understood that when a 0.5 Η brush is used to polish the polishing table, during the defect inspection, optical reflection will occur in the groove, and the groove floats on the image, and the difference between the defect and the defect cannot be distinguished. In contrast, when the polishing table is wiped with 1.0 Η ，, unlike the above method, there is no edge effect of the dark field groove, and the light being photographed becomes a defect existing in the inspection object, or Only the reflected light reflected by the surface (edge) of the object to be inspected. Therefore, in order to avoid sliding and adhesion, it is necessary to ensure the required groove depth. By selecting the grinding time, KK will generate the best ridge in the boundary. Shape has also become very important. Fig. 8 shows another embodiment of the sapphire (alumina) mounting table, that is, the grooves 4 of the mounting table 2 intersect to form a grid. When the ditch shown in Figure 2 is formed in parallel with each other, the dust entering the ditch can be easily removed, but when repeatedly used, dust and dust will accumulate in the mountain between the ditch and pass After 1 to 2 days, it tends to be difficult to remove. The reason for this can be considered as the linear formation of the mountain and the large area of the mountain. Among them, as shown in FIG. 8, by forming the trenches 4 in a grid shape, the area of the mountain portion can be reduced. As a result, the amount of dust and dust accumulated on the mountain is reduced, and the maintenance period of the mounting table can be extended. Fig. 9 shows another embodiment of the illuminating device. In addition to the light emitting diode 6 for radiating light to the crystal blank 1 from below, a ribbed light emitting diode 7 is provided for radiating light from above. In the case of a short rectangular crystal blank 1, when the length of the long side exceeds 8 πι πm, as shown in FIG. 9 (c), because the light intensity ratio of the two ends (slashed portions) of the crystal blank 1 The center is weak, so detection of edges becomes difficult. If the paper size of the light-emitting diode 6 surrounding the crystal blank 1 is adapted to the Chinese National Standard (CNS) A4 (210 X 297 mm) _, 7 _, — * --------- -------- Order — ^ —_— line (please read the precautions on the back before filling this page)-printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Description of the invention (15) Diameter When it becomes larger, K can increase the intensity of the light at both ends, but the existing device needs to be modified, and the device will become larger. Therefore, as shown in FIG. 9 (a), “a ribbed light-emitting diode 7 is provided on the upper part to illuminate both ends (four corners) of the crystal blank, as shown in FIG. 9 (b). Get the same amount of light as the center. If the ratio of the luminous intensity of the upper and lower light-emitting diodes 6, 7 is in the range of 7: 3 ~ 3: 7, there will be no light balance problem. It can also be adjusted to 5: 5. When the light-emitting diodes 6 are provided on the upper side of the mounting table 2, it is necessary to arrange the light-emitting diodes 6 so as not to interfere with the transport path of the transport robot arm 15. In addition, irradiation was performed within a range of an irradiation angle of + 30 ° to the crystal blank surface. FIG. 10 is a plan view showing the specific configuration of the ribbed light-emitting diode 7. The mounting plate 8 for mounting the ribbed light-emitting diode 7 is used to form the entire mounting table and has an opening in the center to ensure that Transport path 9 of the lotus robot arm 15. The ribbed light-emitting diodes 7 are installed at four positions of the mounting plate 8 facing the four corners of the crystal blank 1, and both ends of the crystal blank 1 can be illuminated from above. Because the irradiation angle is within + 30 ° M, the mirror shown in the MM diagram is used to limit the light path. [Effects of the Invention] As described above, according to the present invention, since recesses such as grooves, holes, and the like are formed on the flat mounting surface of the mounting table, the crystal substrate does not slide on the mounting table during loading, and is stable Mounting position on the mounting table. In addition, the crystal substrate is not closely adhered to the mounting table, and the crystal substrate can be smoothly carried out during inspection. Therefore, it is possible to speed up defect inspection and the like of the crystal substrate. [Brief description of the drawing] This paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) _. Q _----- ^ --------- packing ---- ---- Order · --- Π --- (Please read the notes on the back before filling this page)
線I A7 經濟部智慧財產局員工消費合作社印製 B7_五、發明說明（16 ) 圖1表示本發明之晶體基板之缺陷檢査裝置之一實施形 態，（a)是概略構造圖，（b)是從下側看到之（a)之發光二 極體和載置台。 圖2表示圖1之載置台，（a)是平面画，（b)是側面圖， (c )是（b )之A部份之擴大剖面圖，（d )是（c )之B部份之擴大 剖面圖。 圏3表示朝向晶體坯件側面全周照射光時，使缺陷浮上 之原理，（a)是平面圖，（b)是側面圖。 圖4表示本發明之晶體基板之缺陷檢査裝置所使用之照 明裝置之另一實施形態，（a)是平面圖* (b)是裝載有晶體 坯件之狀態之縱向剖面圖。 圆5是概略構造圖，用來表示本發明之晶體基板之缺陷 檢查裝置所使用之照明裝置之另一實施形態。 画6表示由於刷拭研磨時間之不同，在載置台之載置面 台凹部之境界部（邊緣部）之形狀，（a)是0.5H刷拭研磨之 剖面_，（ b )是1 . Ο Η刷拭研磨之剖面圖。 圖7表示與圖6對應之載置台和晶體S件之照射圖像， (a)是使用0.5Η刷拭研磨載置台時之圖像圖，（b)是使用 1.0H刷拭研磨載置台時之圖像圖。 圖8是載置台之平面圖，用來表示使溝交叉形成格子狀 之另一實施形態。 圖9表示照明裝置之另一實施形態，（a)是在上下雙方設 置照明裝置之概略構造圖，（b )表示從上下雙方照射時之 晶體坯件之光之強度，（c )表示只從下方照射時之晶體坯 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） _ ι 〇 _ ._ n n ΐ I ! ϋ I 1 s n t > I I n (請先閱讀背面之注咅？事項再填寫本頁) 訂iLine I A7 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs B7_V. Description of the invention (16) Figure 1 shows an embodiment of a defect inspection device for a crystal substrate of the present invention, (a) is a schematic structural diagram, (b) It is the light emitting diode (a) and the mounting table seen from the lower side. Figure 2 shows the mounting table of Figure 1, (a) is a plan view, (b) is a side view, (c) is an enlarged sectional view of part A of (b), and (d) is part B of (c) An enlarged sectional view.圏 3 shows the principle of making defects float when the light is irradiated toward the entire side surface of the crystal blank, (a) is a plan view, and (b) is a side view. Fig. 4 shows another embodiment of a lighting device used in a defect inspection device for a crystal substrate of the present invention. (A) is a plan view * (b) is a longitudinal sectional view of a state in which a crystal blank is loaded. The circle 5 is a schematic structural diagram showing another embodiment of the lighting device used in the defect inspection device of the crystal substrate of the present invention. Figure 6 shows the shape of the boundary portion (edge portion) of the recessed portion of the mounting surface of the mounting surface due to the difference in the brush polishing time, (a) is a cross section of 0.5H brush polishing, and (b) is 1.0. Η Brush cross section view. FIG. 7 shows the irradiation images of the mounting table and the crystal S pieces corresponding to FIG. 6, (a) is an image diagram when the mounting table is polished with a 0.5Η brush, and (b) is when the mounting table is polished with a 1.0H brush. The image diagram. Fig. 8 is a plan view of a mounting table for illustrating another embodiment in which grooves intersect in a grid shape. Fig. 9 shows another embodiment of the illuminating device. (A) is a schematic structural diagram of the illuminating device provided at the upper and lower sides, (b) shows the intensity of light of the crystal blank when irradiated from the upper and lower sides, and (c) shows only The paper size of the crystal blank at the time of irradiation below is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) _ ι 〇_ ._ nn ΐ I! Ϋ I 1 snt > II n (Please read the note on the back first咅? Please fill in this page for matters) Order i
n aj· n I n- n I 線 五、發明說明（Π A7 B7 經濟部智慧財產局員工消費合作社印製 件之 光 之 強 度 0 圖 10 是 平 面 圖 9 用 來 表 圖 11 是 習 知 之 透 明 基 板 【元 件 編 號 之 說 明 3 1 晶 體 坯 件 2 載 置 台 3 載 置 面 4 溝 5 邊 緣 部 (境界部） 6 發 光 二 極 體 7 補 助 發 光 二 極 體 8 安 裝 板 9 搬 運 路 徑 11 攝 影 装 置 12 透 m .系 統 13 CCD攝影機 14 圖 像 處 理 裝 置 15 搬 運 m 器 人 手 臂 16 真 空 夾 頭 21 本 體 22 安 裝 體 23 台 座 24 調 光 紐 25 m 狀 燈 -^^1 m n ^^1 1 n an n n n n 1^1 I ϋΒ 訂------- (請先閱讀背面之注咅？事項再填寫本頁)n aj · n I n- n I Line V. Description of the invention (Π A7 B7 The intensity of light printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 0 Figure 10 is a plan view 9 is used to represent Figure 11 is a conventional transparent substrate [ Description of the component number 3 1 Crystal blank 2 Mounting table 3 Mounting surface 4 Groove 5 Edge section (boundary section) 6 Light-emitting diode 7 Auxiliary light-emitting diode 8 Mounting plate 9 Transport path 11 Photographic device 12 Transparent m. System 13 CCD camera 14 Image processing device 15 Carrying robot arm 16 Vacuum chuck 21 Body 22 Mounting body 23 Pedestal 24 Dimming button 25 m Shaped lamp-^^ 1 mn ^^ 1 1 n an nnnn 1 ^ 1 I ϋΒ Order ------- (Please read the note on the back? Matters before filling out this page)
1¾ n I 線3T. 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） 20 Ο Λ - ΚΙ 五、發明說明（18 ) 經濟部智慧財產局員工消費合作社印製 26 擴 散 板 27 遮 光 板 31 缺 陷 32 散 亂 光 60 被 檢 查 物 6 1 〜6 3 眧 明 64，65 攝 影 機 66 圖 像 輸 人 裝 置 67 特 徵 抽 出 裝 置 68 判 定 裝 置 ...------------ί 裝—— (請先閱讀背面之，注音？事項再填寫本頁) 0. 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） -21 -1¾ n I line 3T. This paper size is in accordance with Chinese National Standard (CNS) A4 (210 X 297 mm) 20 Ο-ΚΙ V. Description of the invention (18) Printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 26 Diffusion board 27 Shading plate 31 Defect 32 Stray light 60 Inspection object 6 1 ～ 6 3 眧 明 64，65 Camera 66 Image input device 67 Feature extraction device 68 Judging device ...---------- --ί Loading—— (Please read the note on the back, phonetic? Matters before filling out this page) 0. This paper size applies to China National Standard (CNS) A4 (210 X 297 mm) -21-