JP2000261194A - Apparatus and method for mounting electronic components and clamp head for picking up the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an apparatus and a method for mounting electronic components and a clamp head for picking up the electronic components which ensures recognition accuracy and mounting accuracy thereof, including electronic components having shapes not suited to vacuum chucking. SOLUTION: A transfer head for picking up electronic components from a supply of electronic components comprises a vacuum head for picking up the electronic component by vacuum chucking and a clamp head 8B for mechanically clamping the component by vacuum suction, and the clamp head 8B comprises clamp claws 26a driven by a piston 23 to open or close and clamp the electronic component sidewards and a block 22b which butts the top face of the electronic component to hold its attitude when clamped. Thus, it is possible to use the same electronic component mounting apparatus for many types of electronic components and hold a correct attitude of the electronic component in clamping to avoid mounting failures.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and method for mounting an electronic component on a substrate, and a clamp head for picking up an electronic component.

[0002]

2. Description of the Related Art In a mounting process of an electronic component, an electronic component is picked up from a parts feeder provided in a supply unit and is transferred and mounted on a substrate. As a method of picking up electronic parts, a method of vacuum suction using a suction head is generally widely used, but for electronic parts that are not suitable for vacuum suction due to their shape, a method of mechanically clamping the electronic parts using a clamp head. Is used. In this method, an electronic component is sandwiched between a plurality of open / close clamp claws.

[0003]

When mounting an electronic component held by a clamp head on a substrate, the clamp head is positioned at a mounting position and lowered to release a clamp claw that sandwiches the electronic component. The electronic component lands on a predetermined position of the substrate. However, the timing of the opening operation of the clamp claws often has a slight deviation due to a mechanical error, and in such a case, the posture of the electronic component becomes unstable when the clamp claws are opened,
There is a case where a displacement occurs without landing at a correct position.
In addition, even when the electronic component is sandwiched and held, the posture of the electronic component is not always stable, and the deviation of the posture also causes an error when the camera recognizes the component. As described above, when picking up and mounting an electronic component using the conventional clamp head, there is a problem that it is difficult to ensure the recognition accuracy and the mounting accuracy of the electronic component.

Accordingly, the present invention provides an electronic component mounting apparatus and a mounting method capable of securing recognition accuracy and mounting accuracy even for an electronic component having a shape in which vacuum suction is inappropriate, and a clamp head for electronic component pickup. With the goal.

[0005]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus for picking up an electronic component from a supply section of the electronic component by a transfer head and transferring and mounting the electronic component on a substrate. Then, a suction head for picking up electronic components by vacuum suction and a clamp head for mechanically clamping the electronic components by vacuum suction force are selectively mounted on the transfer head.

According to a second aspect of the present invention, there is provided a method of mounting an electronic component, wherein the electronic component is picked up by a transfer head from a supply section of the electronic component, and is mounted on a substrate. A method of picking up by vacuum suction using a head and a method of picking up by a clamp head that mechanically clamps an electronic component by a vacuum suction force are selected according to the type of electronic component to be picked up.

According to a third aspect of the invention, there is provided a clamp head for picking up an electronic component, the clamp head being mounted on a transfer head for picking up an electronic component from a supply unit and transferring the electronic component onto a substrate. And a driving means for driving the clamp claw to open and close by a vacuum suction force, and a posture holding means for holding the posture of the electronic component by contacting the upper surface of the electronic component during clamping.

According to the first and second aspects of the present invention, a suction head for picking up an electronic component by vacuum suction and a clamp head for mechanically clamping the electronic component by a vacuum suction force are provided. The same electronic component mounting apparatus can be used together with other electronic components picked up by vacuum suction even if the electronic component has no shape.

According to the third aspect of the present invention, when the electronic component is clamped, the electronic component is maintained in a correct posture by being provided with a posture holding means for holding the posture of the electronic component by contacting the upper surface of the electronic component. Can be.

[0010]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a side view of a mounting head of the electronic component mounting apparatus, FIG. 3 is a side sectional view of the clamp head, and FIG. , (B), (c), and (d) are explanatory views of the mounting operation by the clamp head.

First, an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is provided in the center of a base 1 in the X direction. The transport path 2 transports and positions the substrate 3. On both sides of the transport path 2, first electronic components
Supply units 4A and 4B are arranged, and each supply unit 4
A and 4B have a large number of tape feeders 5 arranged side by side. The tape feeder 5 stores the electronic components held on the tape, and feeds the electronic components to a pickup position by a mounting head by feeding the tape at a pitch. The electronic components supplied by the tape feeder 5 are picked up by a pick-up method using vacuum suction.

On the X-axis table 6, a mounting head 7 for electronic components is mounted. The mounting head 7 is a multi-head having a plurality of pickup heads 8. The X-axis table 6 is supported at two ends by two Y-axis tables 9 arranged side by side to face each other. Accordingly, by driving the X-axis table 6 and the Y-axis table 9A, the mounting head 7 moves horizontally, and the electronic components are picked up from the pickup position 5a of the tape feeder 5 by the respective pickup heads 8 and mounted on the substrate 3. Conveyance path 2 and first
A camera 10 for recognizing electronic components is provided between the supply units 4B.

A second supply unit 12 is provided on the side of the base 1. A tray 14 for storing electronic components is placed on a tray placement section 13 provided in the second supply section 12. A tray feeder 15 for stacking and storing the trays 14 is provided adjacent to the tray placement unit 13. The tray 14 is supplied from the tray feeder 15 and placed on the tray placement unit 13. Tray 1 on tray mounting part 13
The electronic components housed in 4 are taken out by the transfer head 17 mounted on the moving table 16 and are conveyed to a pick-up position by the mounting head 7 by conveying means (not shown). The electronic components supplied by the tray 14 are not suitable for vacuum suction in shape, and are picked up by a method of mechanically clamping by the pickup head 8 of the mounting head 7.

Next, the pickup head 8 mounted on the mounting head 7 will be described with reference to FIG. As shown in FIG. 2, the mounting head 7 includes three pickup heads 8, two of which are suction heads 8A that suction and pick up electronic components by vacuum suction.
The other is a clamp head 8B that picks up electronic components by mechanically clamping the electronic components. These suction head 8A and clamp head 8B
Are operated by a vacuum suction force, and are mounted in mounting holes provided in a mounting block 7a of the mounting head 7 by a taper shank portion having a common shape. That is, the suction head 8A and the clamp head 8B have mounting compatibility, and one or both of them are selectively mounted on the mounting head 7 depending on the type of electronic component to be picked up. For example, when all the electronic components to be mounted are of a type that can be picked up by suction, only the suction head 8A is mounted on the mounting head 7, and electronic components that require pickup by mechanical clamping are mixed in the mounting target. , One or two of the three pickup heads 8 are used as clamp heads 8B according to the ratio of the number of parts.

Next, the structure of the clamp head 8B will be described with reference to FIG. In FIG. 3, the clamp head 8B includes a taper shank 20 and a clamp mechanism 21.
It consists of. Tapered surface 2 of tapered shank 20
Reference numeral 0a fits into a mounting hole provided in the mounting block 7a of the mounting head 7. The suction hole 20 is formed in the taper shank portion 20.
b, and communicates with a suction hole 7b provided in the mounting block 7a when mounted on the mounting head 7. A flange portion 20c is provided below the tapered shank portion 20, and a lower surface of the flange portion 20c is a reflector that reflects illumination light emitted from below.

The lower part of the suction hole 20b is the tapered shank part 2.
0 is connected to the inner hole 20a provided in the inner hole 20d.
Together with the inner hole 22d provided in the block 22 of the clamp mechanism 21, an operation chamber of the piston 23 is formed. A rod 23a is connected to the lower part of the piston 23, and the rod 23a is
4 are pinned together.

By vacuum suction through the suction hole 7b, the piston 23 moves upward due to the negative pressure, whereby the clamp claws 26a at the lower ends of the two clamp members 26 supported by the pin fulcrum 25 approach each other. Perform the closing operation to move horizontally. When the vacuum suction is released, the piston 23 descends, whereby the clamp member 2 is released.
The sixth clamp claw 26a performs an opening operation. Therefore, the electronic component is mechanically clamped by the vacuum suction force by vacuum suction from the suction hole 7b with the electronic component positioned between the clamp claws 26a of the clamp member 26. The piston 23 serves as driving means for driving the clamp claw 26a to open and close by a vacuum suction force.

The lower end 22b of the block 22 is flat and has a shape positioned at the same height as the two clamp claws 26a. When clamping the electronic component, the lower end of the block 22 contacts the upper surface of the electronic component. That is, the lower end 22b of the block 22 is in contact with the electronic component 22b.
It has a function of holding the posture of the electronic component at the time of clamping and unclamping. Therefore, the contact portion 22b serves as a posture holding unit.

Next, the mounting operation of the electronic component by the clamp head 8B will be described with reference to FIG. FIG.
(A) is a clamp head 8B mounted on the mounting head 7
3 shows a state in which the electronic component 30 is clamped and held by the clamp claws 26a of FIG. At this time, since the contact portion 22b is in contact with the upper surface of the electronic component 30, the posture of the electronic component 30 is maintained in a stable state.

Next, the mounting head 7 is lowered and the electronic components 3
0 is landed on the upper surface of the substrate 3. Next, as shown in FIG. 4C, the clamp by the clamp claws 26a is released.
At this time, the clamp claw 26a is opened while the contact portion 22b is kept in contact with the upper surface of the electronic component 30, so that the operation timing of the two clamp claws 26a is not completely synchronized. Even if there is, the posture of the electronic component 30 is always stable, and no displacement occurs on the substrate 3. Thereafter, after mounting the electronic component 30 on the substrate 3, the mounting head 7 is raised with the clamp claw 26a opened, and the mounting of the electronic component by the clamp head 8B is completed. At this time, since the displacement of the electronic component 30 is prevented, a mounting failure due to the displacement can be prevented.

[0021]

According to the present invention, the suction head for picking up the electronic parts by vacuum suction and the clamp head for mechanically clamping the electronic parts by the vacuum suction force are provided. The same electronic component mounting apparatus can be used together with other electronic components that are picked up by vacuum suction.
In addition, when the electronic component is clamped, it has a posture holding member that contacts the upper surface of the electronic component and holds the posture of the electronic component,
Mounting defects can be prevented by keeping the electronic components in the correct posture.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side view of a mounting head of the electronic component mounting apparatus according to one embodiment of the present invention;

FIG. 3 is a side sectional view of the clamp head according to the embodiment of the present invention;

4A is a diagram illustrating a mounting operation by a clamp head according to one embodiment of the present invention; FIG. 4B is a diagram illustrating a mounting operation by a clamp head according to one embodiment of the present invention; (D) An explanatory view of a mounting operation by a clamp head according to an embodiment of the present invention.

[Explanation of symbols]

 3 Substrate 4A, 4B First supply unit 7 Mounting head 8 Pickup head 8A Suction head 8B Clamp head 12 Second supply unit 22b Contact unit 23 Piston 26a Clamp claw

Continued on the front page (72) Inventor Hironori Kitajima 1006 Kazuma Kadoma, Kadoma-shi, Osaka Matsushita Electric Industrial Co., Ltd. F-term (reference) 5E313 AA01 AA11 AA15 AA23 CC03 CC04 DD41 EE03 EE23 EE24 EE34 FF24 FF28

Claims (3)

[Claims] An electronic component mounting apparatus for picking up an electronic component from a supply unit of the electronic component by a transfer head and transferring and mounting the electronic component on a substrate, wherein the transfer head picks up the electronic component by vacuum suction. An electronic component mounting apparatus characterized by selectively mounting a head and a clamp head for mechanically clamping an electronic component by a vacuum suction force. 2. A method of mounting an electronic component by picking up an electronic component from a supply unit of the electronic component by a transfer head and transferring and mounting the electronic component on a substrate, wherein the electronic component is picked up by vacuum suction using a suction head. And a method of picking up an electronic component by a clamp head that mechanically clamps the electronic component by a vacuum suction force, according to the type of electronic component to be picked up. 3. A clamp head mounted on a transfer head that picks up an electronic component of a supply unit and transfers and mounts the electronic component on a substrate. A clamp head for an electronic component pickup, comprising: a driving unit that opens and closes by an attraction force; and a posture holding unit that abuts on an upper surface of the electronic component during clamping to hold the posture of the electronic component.