JPS61264793A - Automatic electronic part mounting apparatus - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an automatic electronic component mounting device for automatically mounting electronic components onto a printed circuit board.

BACKGROUND OF THE INVENTION In recent years, many devices have been proposed for automatically mounting electronic components onto printed circuit boards, and there is a growing demand for devices that can be mounted reliably and that the mounting time can be shortened. The traditional configuration is
As shown in FIG. 4, the printed circuit board 6 is placed on the board rail 67.
is transported in the Y direction (arrow) and positioned. At the front is an adhesive supply device (hereinafter abbreviated as epoxy unit) 27
A coating head 68 of the transfer device 1 that moves in the XY direction (arrow Q) is provided above it.

A coating head 68 moves an appropriate amount of adhesive from the epoxy unit 27 to a predetermined position on the waiting printed circuit board 6 and applies the adhesive. Furthermore, the printed circuit board 6 is transported to the board holder 7 in the Y direction (arrow) and positioned. Electronic components 11 are stocked in an electronic component supply device 12 that moves forward in the XY direction (arrow A), an electronic component positioning device 71 is provided behind it, and the printed circuit board 6 is placed on standby behind it. are doing. A transfer device 72 is provided on the left side, and the arm of the transfer device 72 rotates in the P direction (arrow), and the transfer head 70 transfers the electronic components 11 from the electronic component supply device 12 to the positioning device 71. Transfer. The positioned electronic component 11 is transferred by the transfer head 69 of the transfer device 1 in the N direction (arrow), mounted on the printed circuit board 6 to a predetermined position, and mounted on the printed circuit board 6.
is carried out in the L direction (arrow).

Problems to be Solved by the Invention However, in this configuration, each head is independent, so the transfer speed cannot be increased, resulting in high costs, and two systems of drive devices for each head are required. However, there were problems in that the electronic components could not be mounted stably on the printed circuit board because of the complexity, and the electronic components could not be made compact.

Therefore, the present invention aims to simplify the structure, increase the transfer speed of electronic components using a single compact drive means, and enable stable and reliable mounting.

Means for solving the problems and the technical means of the present invention for solving the above problems are to arrange an adhesive supply device, a substrate holder, an electronic component positioning device, and an electronic component supply device in a straight line at equal intervals. The transfer head is simultaneously driven and transferred.

For production The effect of this technical means is as follows.

Since each of the devices is arranged in a straight line at equal intervals,
The transfer heads can also be arranged in a straight line at equal intervals, and by sliding back and forth, transfer can be performed simultaneously, and each head can be attached and sucked at the same time.

Embodiment Hereinafter, one embodiment of the present invention will be described based on the accompanying drawings. In FIGS. 1 and 2, a board stock 4 for stocking the printed circuit boards 6 from the front, a lifter device (loader) 3, an extrusion device 2 for pushing out and supplying the printed circuit boards 5, and a conveyor 6 are shown on the left side from the front. established,
At the center, a printed circuit board 6 is positioned by a circuit board holder 7 that moves in X and Y directions, and an electronic component 3 is mounted thereon. Note that the mounting process will be described later. The printed circuit board 5 on which the electronic component 11 is mounted is inserted into the board stock 4 held by the lifter device (unloader) 14 by the unloading guide rail 17 and the conveyance device 15.

An electronic component supply device 9 and an indexing device 12 are provided on an XY table 10 in front of the center, a jig 21 is attached and fixed to the indexing device 12 with screws 22, and an electronic component 11 is attached to the jig 21. ing. A bin 24 of a push-up device 23 (hereinafter referred to as an ejector) for pushing up the electronic component 11 in the C direction (arrow) is provided at the bottom thereof, and an electronic component positioning device 39 (hereinafter referred to as a pre-center) is provided behind it. . In addition, the XY of the motor 26 that drives the X axis and the motor 26 that drives the Y axis
The substrate holder 7 is provided on the table, and B
Move in the direction (arrow).

Furthermore, an adhesive supply device (hereinafter referred to as an epoxy unit) 27 is provided behind it, and adhesive is injected into the groove of the groove ring 29 and rotated by a motor 28. These devices are arranged in a straight line at equal intervals. A transfer device 1 is provided on the upper part, and a guide rail 76 is provided on the block 31.
is provided, and the plate 4 is connected via the guide rail nut 38.
4a or 44b is provided.

The plate 44a is provided with a transfer head 4ob that is positioned at the pre-center 39 and performs adhesion to the printed circuit board 6, and a transfer head 40c that applies adhesive from the epoxy unit 27 to the printed circuit board 6.
b and C, the nozzle 74 or 76 is rotated by the motor 42 or 43 and stops at a predetermined position according to the size and shape of the electronic component 11, and each nozzle 74 or 75 is moved in the H direction (arrow) by an external drive. Move only the target nozzle up and down. Further, the plate 44b is provided with a transfer head 40a, the nozzle 73 moves up and down in the H direction (arrow), and an angle setting device is provided for correcting the angle of the nozzle 73 that has attracted the electronic component 11 by the motor 41. It is being

A shaft 33 that rotates in the C direction (arrow) through a bearing in the block e6 is provided on the side surface of the block 31, and the shaft 33 has a lever at each predetermined position, that is, the position where the transfer head 40 stops. 36, and a solenoid 34 that independently controls operation in response to troubles and the like.

A plate 36 is provided on the lever 36, and the plate 36 is connected to each of the transfer heads 40a, 40b.

The nozzles 73 and 74 of 40c and the flow are connected to the shaft 3.
Vertical movement is performed by rotation of 3. In Fig. 3, motor 5
4, the rod 56 and the lever 67 are connected by the cam drive device 66, and the lever 67 is connected to the plate 44 via the rod 69 using the shaft 58 as a fulcrum, and the transfer heads 4oa and 4ob140c move. Further, the cam drive device 55 is connected to an arm 66 via a rod 6o and a ball joint 64 to drive the shaft 33. Furthermore, the cam drive device 65 is connected to a lever 63 via a rod 61 and uses the shaft 62 as a fulcrum to drive the lever 62. Push up the pin 24 of the ejector device 23 connected to.

In the above configuration, as shown in Fig. 1 and Fig. 3 A,
Motor 64. The cam drive device 65 drives the Shirorad 66 in one direction (arrow), and the rod 59 is moved to E via the lever 67.
When pushed in the direction, the plates 44a and 44b move along the guide rail 38. The transfer head 40a is placed above the electronic component supply device 9 or the ejector device 23, and the transfer head 40b is placed above the jig 39 of the precenter 13.
The transfer head 40c moves to the top of the printed circuit board 5 waiting on the board holder 7, and the electronic components 1.1 of the jig 21 arbitrarily selected by the electronic component supply device 9 are moved in the input direction (arrow ) and waits at the adsorption position of an arbitrary transfer head 40a.

The electronic component 11 is positioned by the jig 39 of the pre-center 13, and moved to a predetermined suction position where the transfer head 4ob performs suction. The board holder 7 moves to a predetermined mounting position for the printed circuit board 6 and waits. Cam drive device 6
6, Shirorad 60° pole joint 64. arm 66
When the shaft 33 is rotationally driven via the arm 36, the plate 36 is lowered downward (arrow) and the nozzles 73, 74 of each transfer head 40a, 4ob, 4Qc.
75 descends in the H direction (arrow), the transfer head 40a first picks up the electronic component 11, the transfer head 40b picks up the electronic component 11 positioned at the pre-center 3, and the transfer head 40c The adhesive adsorbed in the previous process is applied to the printed circuit board.

When the cam drive device 55 further rotates, each transfer head 4
0a, 40b, 40c nozzle? 3,74°75 rises, and at the same time the rod 61 is pushed in the direction (arrow), the pin 24 of the ejector 23 pushes up the electronic part 11 in the direction C through the lever 63, and as the nozzle 73 rises, the electronic part 11 is peeled off. supply. Each transfer head 40a
The nozzle 73 sucks the electronic component 11, and the angle is set as described in the above configuration, and the transfer head 4ob places the electronic component 11 positioned from the precenter 13 onto the printed circuit board. 6, the transfer head 40c further moves to the top of the epoxy unit 27.

Furthermore, the rod 60. Ball si line intro 4. When the shaft 33 rotates via the arm 65, the arm 36 also rotates, the plate 35 descends, and the nozzle 73 of the transfer head 40a is pushed down in the F direction (arrow). Then, by lowering the nozzle 74 of the transfer head 40b, the electronic component 11 is transferred to the printed circuit board 6 coated with the adhesive.
The adhesive is attached to the epoxy unit 27 by lowering the nozzle 76 of the transfer head 400. Furthermore, when the cam drive device 66 rotates, the shaft 33 returns to each transfer head 40a, 40b.

The nozzles 73, 74, 75 of 40c move up, and the cam drive device 66 further moves the transfer head 40a4ob,
4oc moves in the same way as the above action, adsorbs the electronic component 11, sets the angle or positions it, and repeats the action of applying adhesive to the printed circuit board 5 and mounting it.
The electronic component 11 can be more stably and reliably mounted on the printed circuit board.

As described above, the electronic component supply device 9, the precenter 13, the ejector device 23, the board holder 7, and the epoxy unit 27 are arranged in a straight line at equal intervals, and above the electronic component supply device 9, the electronic components 11 are sent to the precenter 13. A transfer head 40a transfers the electronic components 11 from the pre-center 13 to the printed circuit board 6 and mounts the electronic components 11, and a transfer head 40a applies adhesive from the epoxy unit 27 to the printed circuit board 6. They are arranged at equal intervals on a straight line, and the sliding of the respective transfer heads 40 or the vertical movement of the nozzles 73, 74, 75 are operated by the same cam drive device, and each nozzle 73, 74, 75 is operated independently when a trouble occurs. Lenoid 34 that prevents the operation of 74°75
This makes it easy to synchronize the tie and mink, eliminates mounting errors, and speeds up the mounting speed.

Effects of the Invention As described above, the present invention is capable of simultaneously performing a plurality of processes by arranging each device in a straight line at equal intervals, and placing and moving the transfer head above it in a straight line at equal intervals. Do it,
In addition, by unifying the driving parts, it is possible to supply or pick up electronic components at high speed, position them, set their angle, and apply adhesive, and it is possible to realize a simple and compact electronic component automatic mounting device. be.

[Brief explanation of drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 2 is a partially cutaway perspective view of an automatic electronic component mounting device, FIG. 3 is a front view of a transfer device of the same device, and FIG. 4 is a plan view of a conventional electronic component automatic mounting device. be. 1... Transfer device, 6... Printed circuit board, 7... Board holder, 8... Transfer device, 9... Electronic components Supply device, 11...
・Electronic parts, 27... Adhesive supply device (epoxy), 34... Renoid, 40a
, 4ob, 40cm...-transfer head, 65...
...Cam drive device.

Claims (3)

[Claims] (1) An electronic component supply device that stocks several types of electronic components, a push-up device that pushes up the electronic components, an electronic component positioning device that corrects the posture of the electronic components, and the electronic components mounted on a rectangular coordinate table. a board holder for holding and positioning a printed circuit board; an adhesive supply device for supplying adhesive; two transfer devices for transferring the electronic components; and a substrate holder for applying the adhesive to the printed circuit board. A transfer device, a drive means for driving the three transfer devices and the pushing up device, and the electronic component supply device, the pushing up device, the electronic component positioning device, the substrate holder, and the adhesive supply device are arranged in a line at equal intervals. An electronic component automatic mounting device characterized by the following: (2) The electronic component automatic mounting device according to claim 1, wherein three transfer devices are arranged in a line at equal intervals. (3) The electronic component automatic mounting device according to claim 1, further comprising a device for forcibly blocking vertical movement of a nozzle for sucking electronic components of the transfer device.