JP3339499B2 - Electronic component mounting method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting method for transferring and mounting an electronic component on a substrate by using two heads.

[0002]

2. Description of the Related Art As an electronic component mounting apparatus, there is known a two-head system in which electronic components are transferred and mounted on a substrate using two heads (for example, Japanese Patent Application Laid-Open No. 3-203294). Hereinafter, an electronic component mounting method using a conventional two-head type electronic component mounting apparatus will be described.

FIG. 6 is a plan view of a conventional electronic component mounting apparatus.
FIG. 7 is a side view of a first head of a conventional electronic component mounting apparatus. In FIG. 6, reference numeral 1 denotes a substrate, which is positioned on a guide rail 2 as a positioning portion of the substrate 1. A first component supply unit 3 is provided on one side of the substrate 1, and a second component supply unit 4 is provided on the other side. The first component supply unit 3 is configured by arranging a large number of part feeders 31 to 3n equipped with electronic components such as a tape feeder and a tube feeder, and the second component supply unit 4 has similar parts. A large number of feeders 41 to 4n are arranged side by side.

[0004] Reference numeral 5 denotes a first head. A nut 6 is integrally connected to the first head 5. Nut 6
Is screwed to the feed screw 7 in the X direction. The feed screw 7 is driven by a first X-direction motor 8 to rotate. The feed screw 7 and the first X-direction motor 8 are provided on an elongated table 9. Both sides of the table 9 are slidably provided on a guide rail 9a in the Y direction. A nut 10 is connected to an end of the table 9. The nut 10 is screwed to a feed screw 11 in the Y direction. The feed screw 11 is driven by a first Y-direction motor 12 to rotate. Therefore, when the first X-direction motor 8 is driven and the feed screw 7 is rotated, the first head 5 moves in the X-direction,
When the first Y-direction motor 12 is driven and the feed screw 11 rotates, the first head 5 moves in the Y-direction. That is, the nut 6, the feed screw 7, the first X-direction motor 8,
The table 9, the nut 10, the feed screw 11, and the first Y-direction motor 12 constitute a first XY-direction moving device for moving the first head 5 in the X and Y directions.

[0005] Reference numeral 13 denotes a second head. Similarly to the first head 5, the second head 13 has a nut 14, a feed screw 15, a second X-direction motor 16, a table 17,
It is moved in the X and Y directions by a second XY direction moving device including a nut 18, a feed screw 19 and a second Y direction motor 20. Reference numeral 21 denotes a first camera provided below the movement path of the first head 5, and reference numeral 22 denotes a second camera provided below the movement path of the second head 13.

In FIG. 7, a first head 5 has a nozzle 2
The electronic component 24 provided in the first component supply unit 3 is vacuum-adsorbed and picked up by the nozzle 23. 25 is a Z-direction motor, 26 is a Z-direction motor 2
5 is a feed screw that rotates by being driven by 5, 5 is a feed screw 26
Numeral 28 is a lifting block integrated with the nut 27. The nozzle 23 is suspended from the elevating block 28. When the Z-direction motor 25 is driven and the feed screw 26 rotates forward and backward, the nozzle 23 moves up and down. The nozzle 23 is connected to the θ-direction motor 30 by a transmission system such as a belt 29. When the θ-direction motor 30 is driven, the nozzle 2
3 rotates about its axis. The second head 13 also has the same structure as the first head 5, and has one nozzle.

The conventional electronic component mounting apparatus is configured as described above, and the operation will be described next. First, the first head 5 moves in the X direction or the Y direction, picks up an electronic component of any of the parts feeders (for example, the parts feeder 32) of the first component supply unit 3, and moves the electronic component to a predetermined coordinate position on the substrate 1. It is transported and mounted (see the trajectory indicated by arrow N1). Then the second
The head 13 moves in the X direction or the Y direction, picks up an electronic component of any of the part feeders (for example, the part feeder 42) of the second component supply unit 4, and transfers the electronic component to a predetermined coordinate position on the substrate 1. (See arrow N2). Hereinafter, similarly, the first head 5 and the second head 13 alternately move in the X direction and the Y direction, respectively, and the electronic components of the first component supply unit 3 and the second component supply unit 4 respectively. Are sequentially transferred and mounted on the substrate 1.

[0008]

As described above, the conventional 2
In the head-type electronic component mounting apparatus, the first head 5 and the second head 13 alternately move in the X direction and the Y direction,
The electronic components of the component supply unit 3 and the second component supply unit 4 are alternately transferred and mounted on the substrate 1. Therefore, the first head 5 transfers and mounts the electronic components on the substrate 1. During the upward movement, the second head 13 is retracted to the side so as not to hinder the movement of the first head 5 in the X and Y directions. The head 13 picks up an electronic component to be mounted on the substrate from the second electronic component supply unit 4 next.

Similarly, when the second head 13 has entered above the substrate 1 in order to transfer and mount electronic components on the substrate 1, the first head 5 is in the X direction of the second head 13. And the first head 5 is next retracted to the substrate 1 so as not to obstruct the movement operation in the Y direction.
An electronic component to be mounted on the device is picked up from the first electronic component supply unit 3. As described above, the first head 5 and the second head 13 enter the upper part of the substrate 1 or retreat from the upper part of the substrate 1 each time one electronic component is mounted on the substrate, so that the total movement of each head is Since the distance becomes longer and the time required for this movement is increased, there is a problem that the efficiency of mounting electronic components on the substrate 1 is not improved.

Accordingly, the present invention provides a first head and a second head.
It is an object of the present invention to provide an electronic component mounting method capable of improving the mounting efficiency of transferring and mounting an electronic component to a substrate by reducing the number of forward and backward operations of the head with respect to the substrate.

[0011]

For this purpose, the present invention provides a plurality of nozzles for a first head and a second head to vacuum-suction an electronic component, and these nozzles are rotated by rotating these nozzles. comprising a rotation means for correcting the positional deviation in the rotational direction of the electronic component by vacuum suction to the nozzle, and a lifting means for causing the vertical movement on each nozzle, before
Z-direction motor for moving up and down all nozzles
And a cylinder that raises and lowers each nozzle,
Further, a first camera is provided below a movement path of the first head, and a second camera is provided below a movement path of the second head. And one of the first head and the second head is above the first component supply unit or the second component supply unit, and the electronic components of these component supply units are When picking up by the plurality of nozzles or when recognizing the electronic component picked up by the first camera or the second camera, the other head is above the substrate and The electronic components vacuum-adsorbed to the nozzles are mounted on the substrate , and the electronic components are picked up by each nozzle.
When lowering only one nozzle by the cylinder
In both cases, drive the Z-direction motor to lower this one
Vacuum suction of electronic components by the nozzle protruding to
This nozzle is provided by the Z-direction motor and the cylinder.
To pick up electronic components .

According to the above-mentioned structure, when the first head sequentially mounts a plurality of electronic components vacuum-adsorbed on the plurality of nozzles on the substrate, the second head supplies the second component. Above the unit, electronic components are vacuum-adsorbed to a plurality of nozzles and picked up, or the picked-up electronic components are recognized by a second camera. And the first
Head mounts all the electronic components on the substrate and returns above the first component supply unit, and the second head moves above the substrate, and applies the electronic components vacuum-adsorbed to the plurality of nozzles to the substrate. Installed one after another.

[0013]

Next, embodiments of the present invention will be described with reference to the drawings. FIG. 1 is a plan view of an electronic component mounting apparatus according to one embodiment of the present invention. FIG. 2 is a perspective view of a first head of the electronic component mounting apparatus according to one embodiment of the present invention.
FIG. 4 is a sectional view of a first head of the electronic component mounting apparatus according to one embodiment of the present invention, FIG. 4 is a block diagram of a control system of the electronic component mounting apparatus according to one embodiment of the present invention, and FIG. 5 is a time chart of the operation of the electronic component mounting apparatus according to one embodiment.

In FIG. 1, the same components as those of the conventional electronic component mounting apparatus shown in FIG. Although the basic structure of the electronic component mounting apparatus of FIG. 1 is the same as that of the conventional electronic component mounting apparatus of FIG. 6, the structure of the first head 31 and the second head 32 is the same as that of the first conventional head.
Head 5 and the second head 13 are different. The first head 31 and the second head 32 have the same structure.
The structure of the first head 31 will be described with reference to FIG.

In FIG. 2, reference numeral 33 denotes a block having an L-shaped cross section, which is provided on the front surface of the support plate 34. On the support plate 34, a Z-direction motor 35 is provided. The Z-direction motor 35 rotates a vertical feed screw 36 passing through the support plate 34. A nut 37 is connected to the back surface of the block 33, and the nut 37 is screwed to the feed screw 36. Therefore, the Z-direction motor 3
When the drive screw 5 rotates forward and backward and the feed screw 36 rotates forward and backward, the block 33 moves up and down.

A plate 38 is provided on the block 33. A motor 39 for θ correction is disposed in the center of the upper surface of the plate 38, and four cylinders 41, 42, 43, 44 are disposed around the motor 39 for θ correction. In FIG. 3, the rotation axis 4 of the
The gear 46 is mounted on the lower end of the gear 5. An engaging element 47 is connected to lower ends of the rods 41a, 43a of the cylinders 41, 43. The engaging element 47 is engaged with the engaged element 48. The engaged element 48 is a vertical shaft 4
9 is mounted on the upper end. The engaged element 48 is repelled downward by the spring 50, and the engaging element 47 is engaged with the engaged element 48, thereby preventing the engaged element 48 from descending due to the spring force of the spring 50. .

A gear 51 is connected to the lower end of the shaft 49 so as to be slidable in the vertical direction. The gear 51 is engaged with the gear 46. A vertical nozzle 52 is connected to a lower portion of the gear 51. The nozzle 52 is connected to a vacuum device (not shown) through a suction path 53, and the electronic device 24 is vacuum-sucked to the lower end of the nozzle 52 by driving the vacuum device.

Here, when the θ correction motor 39 is driven and the rotating shaft 45 rotates, the gear 46 rotates and the other gears 5 rotate.
One also rotates. Then, the nozzle 52 rotates about its axis, and corrects the angle in the θ direction (horizontal rotation direction) of the electronic component 24 vacuum-adsorbed to the lower end. In addition, cylinder 4
When the locks 41a and 43a project downward, the engaged element 48 is lowered by the spring force of the spring 50, and the nozzle 52 is also lowered. When the rods 41a and 43a are pulled upward, the nozzle 52 moves up. In FIG. 3,
The other cylinders 42, 44 are not shown, but the other cylinders 42, 44 have the same structure as the cylinders 41, 43.

When the electronic component 24 is picked up by the nozzle 52, first, any one of the rods of the cylinders 41, 42, 43, and 44 is protruded to lower the nozzle 52 by one nozzle. Next, the Z-direction motor 35 (see FIG. 1) is driven to lower the nozzle 52 together with the block 33 so that one nozzle protruding downward lands on the upper surface of the electronic component 24, and the electronic component 24 is vacuum-sucked. I do. Then, the block 33 is raised by the Z-direction motor 35, and the protruding cylinder rod is pulled in.
2 to pick up the electronic component 24.

When the electronic component 24 vacuum-adsorbed to the nozzle 52 is mounted on the substrate 1, the electronic component 24 is lowered by lowering the nozzle 52 similarly to the case of the pickup described above.
Is mounted on the substrate 1 and the vacuum suction is released. Then, the nozzle 52 is raised as in the case of the pickup.

In the present embodiment, the Z-direction motor 35 and the cylinders 41, 42, 43, 44
Corresponds to a lifting means. In addition, the θ correction motor 39 corresponds to a correction unit that corrects a rotational displacement of the electronic component 24 that is vacuum-adsorbed to the nozzle 52 in the rotation direction.

In FIG. 4, the first head 31 side first
The X-direction motor 8, the first Y-direction motor 12, the Z-direction motor 35, and the θ correction motor 39
It is controlled by the control unit 65 via 1, 62, 63, 64. A bus 66 includes a storage unit 67 for storing necessary data, a first recognition unit 68 of the first camera 21, a second recognition unit 69 of the second camera 22, and an operation unit 70 such as a keyboard. It is connected. The cylinders 41 to 44 are also connected to the bus 66 via the drive circuit 71. The control system of the second head unit 32 is the same as the control system of the first head 31 shown in FIG.

This electronic component mounting apparatus has the above-described configuration. Next, referring to the time chart of FIG.
The overall operation will be described. Note that in FIG. 5, X movement, Y
The movement means the horizontal movement of the head units (31, 32) by the respective XY-direction moving devices, the θ rotation means the rotation of the nozzle 52 by the θ correction motor 39,
Z movement refers to Z direction motor 35 and cylinder 4
1 shows the raising and lowering operation of the nozzle 52 by 1, 42, 43 and 44. 1 and 5, the first head 31
Is moved in the X direction and the Y direction above the first component supply unit 3 and the nozzles 52 are lowered and raised at the pickup position, so that the four nozzles 52 sequentially feed the electronic components of the part feeders 31 to 3n. 24 is picked up by vacuum suction (see timings T2 to T5 in FIG. 5). The X movement and the Y movement at the timings T1 and T2 are the first movement.
This is the movement of the electronic component to the pickup position, and the θ rotation at timing T1 returns the nozzle 52 to the initial position in the θ direction.

Next, the first head 31 is connected to the first camera 21.
, And the position of the electronic component 24 vacuum-adsorbed to the four nozzles 52 is recognized by the first camera 21 (see timings T6 and T7). Subsequently, the first head 31 moves above the substrate 1 and moves there in the X direction and the Y direction, and lowers and raises the nozzles 52 at a predetermined coordinate position, thereby attracting the four nozzles 52 with vacuum. The mounted electronic components 24 are mounted one after another at predetermined coordinate positions on the substrate 1 (see timings T8 to T12). If the electronic component 24 is mounted on the substrate 1 as described above, the first
The head 31 returns to the position above the first component supply unit 3, and the operations at the timings T1 to T12 described above are repeated.

On the other hand, the second head 32
While the first head 31 is performing recognition and mounting from 7 to T11, it moves above the second component supply unit 4 in the X and Y directions, and moves down / up the nozzle 52 above the pickup position. By doing so, the electronic components 24 of the parts feeders 41 to 4n are sequentially vacuum-adsorbed and picked up by the four nozzles 52. Next, at timings T12 to T2, the electronic component 24 that has been vacuum-adsorbed to the four nozzles 52 is observed by the second camera 22 to recognize its position. Subsequently, the second head 32 moves above the substrate 1, moves there in the X direction and the Y direction, and lowers and raises the nozzle 52 on a predetermined coordinate position.
The electronic components 24 vacuum-adsorbed by the four nozzles 52 are mounted one after another at predetermined coordinate positions on the substrate 1 (timing T3).
~ T6). Hereinafter, the same operation is repeated.

In FIG. 5, A1 is a timing at which the first head 31 is located above the first component supply unit 3 and picks up electronic components, and A2 is a timing at which the first head 31 is mounted on the substrate 1 At the timing when the electronic component is mounted on the substrate 1. B1 is a timing at which the second head 32 is located above the second component supply unit 4 and is picking up an electronic component.
Is the timing when the second head 32 is above the substrate 1 and the electronic component is mounted on the substrate 1. in this way,
The first head 31 and the second head 32 alternately move above the substrate 1 to perform an operation of mounting an electronic component on the substrate 1.

As is clear from the time chart of FIG.
The first head 31 and the second head 32 always operate almost full time without stopping operation. In particular,
When one of the heads (for example, the first head 31) moves above the substrate 1 in the X direction or the Y direction and mounts the electronic component 24 on the substrate 1, the other second head 32 The electronic component 2 is retracted onto the second camera 22 and the second component supply unit 4 so as not to hinder the moving operation of the head 31.
4 and pick up. Similarly, when the second head 32 mounts the electronic component 24 above the substrate 1, the first head 31
It retreats to the top and the first component supply unit 3 to perform recognition and pickup. Further, since the number of forward and backward movements of the heads 31 and 32 with respect to the substrate 1 is reduced, the heads 31 and 3 are correspondingly reduced.
2, the total moving distance is shortened and the moving time is shortened accordingly, so that the work efficiency of mounting the electronic component 24 on the substrate 1 is significantly improved as compared with the conventional electronic component mounting method shown in FIG.

[0028]

As described above, according to the present invention, the number of forward and backward operations of the first head and the second head with respect to the substrate can be reduced, so that the mounting efficiency of electronic components can be significantly improved.

[Brief description of the drawings]

FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a perspective view of a first head of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a sectional view of a first head of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 4 is a block diagram of a control system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 5 is a time chart of the operation of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 6 is a plan view of a conventional electronic component mounting apparatus.

FIG. 7 is a side view of a first head of a conventional electronic component mounting apparatus.

[Explanation of symbols]

 Reference Signs List 1 board 2 guide rail (board positioning section) 3 first component supply section 4 second component supply section 8 first X-direction motor 12 first Y-direction motor 16 second X-direction motor 20 second Y direction motor 21 First camera 22 Second camera 31 First head 32 Second head 35 Z direction motor 39 θ correction motor 41 to 44 cylinder

Continuation of the front page (58) Field surveyed (Int. Cl. ⁷ , DB name) H05K 13/04 H05K 13/00

Claims (2)

(57) [Claims] 1. A positioning part for a substrate, a first component supply part and a second component supply part provided on both sides of the positioning part, and driven in a XY direction by a first XY direction moving device. A first head that transfers and mounts the electronic component of the first component supply unit on the substrate by moving;
A second head that is driven by a direction moving device and moves in the XY directions to transfer and mount components of the second component supply unit on the substrate; and the first head and the second head A plurality of nozzles for vacuum-sucking electronic components, rotating means for correcting the positional deviation of the electronic components vacuum-sucked to these nozzles in the rotation direction by rotating these nozzles, and each nozzle and a lifting means for causing the vertical movement, the said lifting means
Has a Z-direction motor that raises and lowers all nozzles,
A first camera is provided below a path of movement of the first head, and a second camera is provided below a path of movement of the second head. An electronic component mounting method using a component mounting apparatus, wherein one of the first head and the second head is located above the first component supply unit or the second component supply unit. When the electronic components of these component supply units are picked up by the plurality of nozzles or when the electronic components picked up by the first camera or the second camera are recognized, the other head is Electronic components above the substrate and vacuum-sucked to the plurality of nozzles are mounted on the substrate.
And when picking up electronic components with each nozzle
While lowering only one nozzle by the cylinder,
Driving the Z-direction motor and protruding only this one downward
Vacuum suction of the electronic component by the nozzle
The nozzle is raised by the directional motor and the cylinder.
And picking up an electronic component. 2. The method according to claim 1, wherein the rotating means is a θ correction motor.
A gear is mounted on the rotating shaft of the θ correction motor, and
Each said nozzle is connected to a gear that engages with this gear
And the nozzles are vacuum-adsorbed to each nozzle by the θ correction motor.
To correct the rotational misalignment of the
2. The electronic component mounting method according to claim 1, wherein: