JP2000151088A - Apparatus for mountiing electronic component and method of mounting - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain an apparatus for mounting electronic components and a method of mounting the same, which are capable of efficiently mounting electronic components at a low cost in small-lot production. SOLUTION: In an apparatus for mounting electronic components in which cream solder is printed on a substrate 9 and the electronic components are mounted on the printed cream solder, a cream-solder printing device 12 that prints the cream solder on the substrate 9 and that is arranged in an upper space of a mounting means which picks up electronic components from a feeding member 7 and transfers them to the substrate 9 for mounting by a transfer head 4, a common substrate susceptor 11 for holding the substrate 9 when the cream solder is printed and when the electronic components are mounted, and a Z-axis table 10 for moving the substrate susceptor 11 up and down, are provided. With this constitution, the space occupied by the apparatus can be saved while the substrate susceptor 11 can be used commonly, and efficient mounting of electronic components suitable for small-lot production is possible with a low cost.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus and an electronic component mounting method for mounting an electronic component on a substrate.

[0002]

2. Description of the Related Art As a method for mounting electronic components, a soldering method using cream solder is widely used.
In this method, first, cream solder is printed on a predetermined portion on a substrate, and an electronic component is mounted on the cream solder. Conventionally, such cream solder printing and electronic component mounting have been performed by individual dedicated devices. These dedicated devices are designed to continuously and efficiently process a large number of substrates of the same type, so that the tact time of net work such as individual printing operation and mounting operation can be shortened as much as possible. Was taken into account.

[0003]

In recent years, the diversification of product types has led to an increase in the ratio of small lot production in the field of electronic equipment production, and in many cases, a small number of substrates are used in electronic component mounting processes. When such a small lot production is performed by a conventional dedicated device, there is a problem in production efficiency due to incompatibility between a production target and a production system including the dedicated device as described below.

That is, in the small lot production, although the ratio other than the net work time such as the type change is relatively increased in the small lot production, the conventional dedicated apparatus is focused on shortening the net time. If the type is changed at a time, the productivity is greatly reduced. In addition, when a plurality of dedicated devices are used, the equipment space is inevitably increased, and a substrate receiver for holding a substrate and a mechanism for transporting the substrate are required redundantly for each process. Was not suitable for small-lot production in terms of equipment cost.

SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and an electronic component mounting method capable of efficiently mounting electronic components at low cost in small lot production.

[0006]

According to a first aspect of the present invention, there is provided an electronic component mounting apparatus that prints cream solder on a substrate and mounts the electronic component on the printed cream solder. A substrate mounting part for mounting the substrate, elevating means for elevating the substrate mounting part, and printing means for printing cream solder with a screen mask on the substrate on the substrate mounting part which is raised by the elevating means; And mounting means for mounting the electronic component picked up from the supply unit on the substrate on the substrate mounting part which is lowered by the elevating means and disposed below the printing means.

A method of mounting an electronic component according to a second aspect of the present invention is a method of mounting an electronic component by printing cream solder on a substrate and mounting the electronic component on the printed cream solder. The cream solder is printed on the substrate on the substrate mounting part by the printing means, and then supplied to the substrate on the substrate mounting part lowered by the elevating means by the mounting means disposed below the printing means. The electronic components picked up from the section are mounted.

According to the present invention, cream solder is printed on the substrate on the substrate mounting portion by the printing means, and the substrate mounting portion is lowered to mount the substrate mounting portion provided below the printing means. By mounting the electronic components on the substrate on the mounting portion, the equipment space can be saved and the substrate mounting portion can be shared, so that the electronic components can be mounted efficiently at low cost.

[0009]

Embodiments of the present invention will now be described with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, and FIGS. 2 and 3 are side sectional views of the electronic component mounting apparatus.

First, the structure of an electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, two Y-axis tables 2A and 2B are arranged on a base 1 so as to face each other. On the Y-axis tables 2A and 2B, an X-axis table 3 is supported and supported at both ends. A transfer head 4 is mounted on the X-axis table 3.
And a suction head 6.

An electronic component supply unit 7 is provided at an end of the base 1, and the supply unit 7 includes a large number of tape feeders 8. The tape feeder 8 feeds the electronic component to the pickup position of the suction head 6 by feeding the tape holding the electronic component at a pitch. Supply unit 7 of base 1
The Z-axis table 10 which is a lifting means
Are arranged vertically. A board receiver 11 is mounted on the Z-axis table 10, and a board 9 on which electronic components are mounted is placed and held on the board receiver 11. Therefore, the substrate receiver 11 serves as a substrate mounting portion. By driving the Z-axis table 10, the substrate receiver 11 holding the substrate 9 moves up and down.

While the substrate receiver 11 is held at the lowered position, the Y-axis tables 2A and 2B and the X-axis table 3 are driven to move the transfer head 4 horizontally. The electronic component can be picked up from the pick-up position by suction, and then mounted on the substrate 9 on the substrate receiver 11. Therefore, the X-axis table 3, the Y-axis tables 2A and 2B, and the transfer head 4 serve as mounting means for electronic components.

Above the base 1, a screen printing device 12, which is a printing means, is provided. The screen printing apparatus 12 includes a screen mask 13 in which pattern holes 14 are formed, and a squeegee 15 that slides on the screen mask 13. The substrate 9 is brought into contact with the lower surface of the screen mask 13 by driving the Z-axis table 10 to raise the substrate receiver 11. In this state, the screen mask 13 is positioned with respect to the substrate 9 by a positioning means (not shown), and the squeegee 15 is slid on the screen mask 13 so that the cream solder is provided on the substrate 9 through the pattern holes 14. Is printed.

That is, this electronic component mounting apparatus has a structure in which electronic component mounting means is disposed below printing means for printing cream solder.
The operation will be described with reference to FIG. First, in FIG. 1, a substrate 9 to be mounted is manually placed on a substrate receiver 11.
Thereafter, the substrate receiver 11 is raised, and as shown in FIG.
Abuts on the lower surface of the screen mask 13. At this time, the screen mask 13 is simultaneously adjusted by a positioning means (not shown).
Is aligned with the substrate 9. Also, cream solder 16 is supplied on the screen mask 13,
The squeegee 15 is slid in the horizontal direction so that the cream solder 16
, The cream solder 16 is printed on the substrate 9.

Next, the Z-axis table 10 is driven to lower the substrate receiver 11, and the substrate 9 is positioned at the level of the pickup position of the tape feeder 8, as shown in FIG. That is, at this time, the substrate 9 is at a height level for mounting electronic components. In this state, the transfer head 4 is moved to image the recognition mark provided on the substrate 9 by the substrate recognition camera 5, and thereby the position of the substrate 9 is recognized.

Next, the transfer head 4 is moved to the supply section 7, and the electronic component P is picked up from the pickup position of the tape feeder 8 by the suction head 6. Thereafter, the transfer head 4 moves to above the substrate 9 and mounts the electronic component P at a predetermined mounting position. The board 9 on which the electronic components have been mounted in this way is detached from the board receiver 11 by an operator and taken out of the mounting apparatus.

As described above, in the electronic component mounting apparatus according to the present embodiment, the electronic component mounting means is disposed below the screen printing device 12 and the common substrate receiver 11 on which the substrate 9 is mounted. The substrate can be held during cream solder printing and electronic component mounting by lifting and lowering. With this configuration, screen printing and mounting of electronic components, which previously required a dedicated device, can be performed by a single device. Therefore, it is necessary to reduce equipment space and hold and transport substrates. This eliminates the duplication of the required mechanism, thereby reducing the equipment cost. By applying such an electronic component mounting apparatus to small-lot production, it is possible to prevent inevitable decrease in productivity when conventional equipment for mass production of the same kind is used for small-lot production.

[0018]

According to the present invention, cream solder is printed on the substrate on the substrate mounting portion by the printing means, and the substrate mounting portion is lowered to be mounted on the substrate by the mounting means provided below the printing means. Since the electronic components are mounted on the substrate on the substrate mounting portion, the equipment space can be saved, and the substrate mounting portion can be shared. Good electronic components can be mounted.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a side sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a side sectional view of an electronic component mounting apparatus according to an embodiment of the present invention.

[Explanation of symbols]

 Reference Signs List 4 Transfer head 6 Suction head 7 Supply unit 9 Substrate 10 Z-axis table 11 Substrate receiver 12 Screen printing device 16 Cream solder

Claims (2)

[Claims] 1. An electronic component mounting apparatus for printing cream solder on a substrate and mounting the electronic component on the printed cream solder, comprising: a substrate mounting portion for mounting the substrate; and a substrate mounting portion. Lifting means for raising and lowering, printing means for printing cream solder by a screen mask on the substrate on the substrate mounting portion which is raised by the lifting means, and disposed below the printing means and lowered by the lifting means Mounting means for mounting the electronic component picked up from the supply unit on the substrate on the substrate mounting unit in the above-mentioned state. 2. A method of mounting an electronic component on a substrate by printing cream solder on the substrate and mounting the electronic component on the printed cream solder, the method comprising: Means for printing cream solder, and then mounting the electronic component picked up from the supply unit by the mounting means disposed below the printing means on the substrate on the substrate mounting part lowered by the elevating means. An electronic component mounting method characterized by the above-mentioned.