CN101621919A - Method and device for mounting electronic component, auxiliary substrate supply device - Google Patents
Method and device for mounting electronic component, auxiliary substrate supply device Download PDFInfo
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- CN101621919A CN101621919A CN200910151328A CN200910151328A CN101621919A CN 101621919 A CN101621919 A CN 101621919A CN 200910151328 A CN200910151328 A CN 200910151328A CN 200910151328 A CN200910151328 A CN 200910151328A CN 101621919 A CN101621919 A CN 101621919A
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Abstract
A device for mounting an electronic component is capable of answering a sudden variation of a production method in a short time to improve the production efficiency. In the device (1) for mounting the electronic component having a substrate conveyer (5) for conveying a main substrate (M) coated with connecting material to a mounting position and a mounting head section (11) for mounting the electronic component on the main substrate (M) locating on the substrate conveyer (5), an auxiliary substrate (S) is mounted on the main substrate (M) carried to the mounting position by the mounting head section (11), the auxiliary substrate (S) is supplied by an auxiliary substrate supply device (32) for supplying the auxiliary substrate (S) to be mounted on the main substrate (M) and is in request to mount the electronic component (P) or coat the connecting material.
Description
Technical field
The present invention relates to a kind of electronic component mounting apparatus that the function of auxiliary substrate is installed that has on main substrate.
Background technology
In the past, when becoming the module substrate (module substrate) of modular unit be loaded in the parts that installation needs on the auxiliary substrate on main substrate, presetting system modeling piece substrate stored it, took out when needed and loaded.
In addition, as utilizing an equipment on circuit substrate, to apply the electronic component mounting apparatus of paste scolder (cream solder) and installation electronic unit, be disclosed in the patent documentation 1.The electronic component mounting apparatus of being put down in writing for patent documentation 1, shown in Figure 1 as patent documentation 1, the circuit substrate 7 that remains on the Y workbench 6 is reciprocating motion on the Y direction in the direction vertical with securement head 5 and the direction (directions X) that moves back and forth of coating head 4, after by coating head 4 coating paste scolders, utilize securement head 5 on circuit substrate 7, electronic unit to be installed, thereby realize applying the paste scolder and electronic unit being installed with an equipment.
In addition, for the electronic component mounting apparatus in the patent documentation 2 of being disclosed in as other examples, shown in Figure 1 as patent documentation 2, by being used to make substrate bear the lifting of the Z axle workbench 10 of portion's 11 liftings, remain on substrate and bear substrate 9 in the portion 11 up by paste solder printing device 12 coating paste scolders, below be installed through the electronic unit that transfer 4 is picked up from supply unit 7, so also apply paste scolder and installation electronic unit with an equipment for realizing.Thus, can not implement the coating of paste scolder and the installation of electronic unit, thereby can improve productivity by different devices.
Patent documentation 1:JP spy opens the 2001-326453 communique;
Patent documentation 2:JP spy opens the 2000-151088 communique.
But, in the device that above-mentioned patent documentation 1 and patent documentation 2 are put down in writing, when becoming the module substrate of modular unit on main substrate, being loaded in the parts that installation needs on the auxiliary substrate, need presetting system modeling piece substrate that it is stored, the module substrate that takes out requirement as required loads, thus, existence can not be tackled the problem that production method changes at once.In addition, in order to solve the above problems, can be by making the module substrate on the auxiliary substrate simultaneously to the installation portion of installing on the main substrate, but auxiliary substrate is being loaded on the main substrate, when being loaded in parts on the auxiliary substrate again, need on auxiliary substrate, supply with connection materials such as paste scolder.There are the following problems in this case, promptly, when utilizing point gum machine (dispenser) on auxiliary substrate, to apply the connection material, when perhaps carrying out pin-array printing (pin transcription), need operate separately each electrode, the production time of each main substrate is elongated, thereby causes productivity to reduce.
Summary of the invention
The present invention proposes in view of the above-mentioned problems, and its purpose is, a kind of unexpected variation that can tackle production method at short notice is provided, and the electronic component mounting method of auxiliary substrate can be installed on main substrate efficiently.
In order to solve the above problems, the structural of the invention of technical scheme 1 is characterised in that, be carried to the substrate transfer apparatus of installation site having the main substrate that is used for to be coated with connecting material, with the described main substrate that is used for to remaining on the described substrate transfer apparatus electronic component mounting apparatus of the securement head of electronic unit is installed, the auxiliary substrate that will be installed on the described main substrate by described securement head is installed on the described main substrate that is carried to described installation site, described auxiliary substrate is supplied with from the auxiliary substrate feedway, and needs to install electronic unit or coating connection material.
The structural of the invention of technical scheme 2 is characterised in that, on the basis of technical scheme 1, described electronic component mounting apparatus also has the parts that are used to supply with electronic unit and supplies with feed appliance, will supply with described electronic unit that feed appliance supplies with from described electronic unit by described securement head and be installed in described main substrate or be installed on the described auxiliary substrate on the described main substrate.
The structural of the invention of technical scheme 3 is characterised in that, on the basis of technical scheme 2, before on the described main substrate described auxiliary substrate being installed, apply the connection material by connecting the material applying device on described auxiliary substrate, the described auxiliary substrate that will be coated with described connection material by described securement head is installed on the main substrate that is carried to described installation site.
The structural of the invention of technical scheme 4 is characterised in that, electronic component mounting apparatus has: substrate transfer apparatus, be used for being coated with the main substrate that connects material and be carried to the installation site, securement head is used for to the described main substrate that remains on described substrate transfer apparatus electronic unit being installed; Also have: the auxiliary substrate accommodating device, be used for the ccontaining auxiliary substrate that will be installed on the described main substrate, the auxiliary substrate Handling device is carried to auxiliary substrate with described auxiliary substrate from described auxiliary substrate accommodating device and supplies with the position; By described securement head, the described auxiliary substrate that is supplied to described auxiliary substrate supply position is installed on the described main substrate that is carried to described installation site.
The structural of the invention of technical scheme 5 is characterised in that, on the basis of technical scheme 4, described electronic component mounting apparatus also has the parts that are used to supply with electronic unit and supplies with feed appliance, will supply with described electronic unit that feed appliance supplies with from described electronic unit by described securement head and be installed in described main substrate or be installed on the described auxiliary substrate on the described main substrate.
The structural of the invention of technical scheme 6 is characterised in that, on the basis of technical scheme 4 or 5, has the material of connection applying device, this connection material applying device is arranged on described auxiliary substrate accommodating device and described auxiliary substrate is supplied with between the position, is used for connecting material in the described auxiliary substrate coating of supplying with from described auxiliary substrate accommodating device; Described auxiliary substrate Handling device is carried to the connection material coating position that is arranged on the described connection material applying device with described auxiliary substrate from described auxiliary substrate accommodating device, and will be coated with the described auxiliary substrate that connects material by described connection material applying device and be carried to described auxiliary substrate and supply with the position.
The structural of the invention of technical scheme 7 is characterised in that, the auxiliary substrate feedway is used in the electronic component mounting apparatus, this electronic component mounting apparatus has: substrate transfer apparatus, be used for to be coated with the main substrate that connects material and be carried to the installation site, securement head, be used for electronic unit being installed to the described main substrate that remains on the described substrate transfer apparatus, it is characterized in that, described auxiliary substrate feedway has: the auxiliary substrate accommodating device, be used for the ccontaining auxiliary substrate that will be installed on the described main substrate, the auxiliary substrate Handling device, be used for that described auxiliary substrate is carried to auxiliary substrate from described auxiliary substrate accommodating device and supply with the position, connect the material applying device, be arranged on described auxiliary substrate accommodating device and described auxiliary substrate and supply with between the position, be used for connecting material in the described auxiliary substrate coating of supplying with from described auxiliary substrate accommodating device; Described auxiliary substrate accommodating device has: shelf, shelve on matrix and can move up and down, can be with the ccontaining a plurality of auxiliary substrates of mode stacked on above-below direction, lowering or hoisting gear, described shelf is moved along the vertical direction position, make by ccontaining described a plurality of auxiliary substrates respectively be arranged on described body upper surface on the carrying path align; Described connection material applying device has: described matrix, upper surface is provided with the described carrying path of described auxiliary substrate, seal net contact separation device, make connect be provided with figuratum screen mask be supplied to described carrying path describedly be connected the described auxiliary substrate contact of material coating position or separate, connect the material printing equipment, see through the described screen mask that is connected on the described auxiliary substrate, printing connects the pattern of material on described auxiliary substrate.
The structural of the invention of technical scheme 8 is characterised in that on the basis of technical scheme 7, described matrix and described parts are supplied with feed appliance and are adjacent to be loaded on the described electronic component mounting apparatus.
The structural of the invention of technical scheme 9 is characterised in that on the basis of technical scheme 7, described matrix is on the slot part with the handling part that the mode that can load and unload is loaded in the described parts supply feed appliance of described electronic component mounting apparatus.
According to the invention of above-mentioned such technical scheme that constitutes 1, auxiliary substrate is installed on the main substrate that is carried to the installation site by securement head, described auxiliary substrate is the substrate that electronic unit or coating connection material are installed from the needs that the auxiliary substrate feedway is supplied with.Thus,, then can automatically auxiliary substrate be installed on the main substrate, electronic unit or coating connection material be installed on this auxiliary substrate that is mounted, thereby device is oversimplified, and operating efficiency is improved if auxiliary substrate is supplied to the auxiliary substrate accommodating device.
According to the invention of above-mentioned such technical scheme that constitutes 2, will supply with that electronic unit that feed appliance supplies with is installed in main substrate or on the auxiliary substrate that this main substrate is installed from electronic unit by securement head.Thus, needn't in advance electronic unit be installed on the auxiliary substrate and the modular unit made remains in the warehouse, just can rationally tackle the unexpected variation of production method, enhance productivity.
According to the invention of above-mentioned such technical scheme that constitutes 3, on the basis of technical scheme 2, auxiliary substrate connects material before installing on the main substrate by connecting the coating of material applying device, and the auxiliary substrate that is coated with this connection material is installed on the main substrate.Thus, when on main substrate electronic unit being installed, coating connects material on auxiliary substrate simultaneously, therefore can save time, and improves productivity.In addition, because on the auxiliary substrate that electronic unit is installed on the main substrate to be installed, the modular unit of making so do not need in advance electronic unit to be installed on the auxiliary substrate remains in the warehouse, just can tackle the unexpected variation of production method, enhances productivity.
Invention according to above-mentioned such technical scheme that constitutes 4, auxiliary substrate is contained in the auxiliary substrate accommodating device, be carried to auxiliary substrate by the auxiliary substrate Handling device from the auxiliary substrate accommodating device and supply with the position, supply with the position by securement head from auxiliary substrate and be installed on the main substrate.Thus,, then can automatically auxiliary substrate be installed on the main substrate, therefore can improve operating efficiency if supply with auxiliary substrate to the auxiliary substrate accommodating device.In addition, as required, can and auxiliary substrate be carried to auxiliary substrate from the auxiliary substrate accommodating device with the auxiliary substrate accommodating device and supply with the auxiliary substrate Handling device of position and constitute to load and unload one-piece type, thereby can improve versatility with the shared grade of other electronic component mounting apparatus.
Invention according to above-mentioned such technical scheme that constitutes 5, on the basis of technical scheme 4, also have parts and supply with feed appliance, will supply with that electronic unit that feed appliance supplies with is installed in main substrate or on the auxiliary substrate that this main substrate is installed from electronic unit by securement head.Thus, do not need in advance electronic unit to be installed on the auxiliary substrate and the modular unit made remains in the warehouse, just can tackle the unexpected variation of production method, enhance productivity.
According to the invention of above-mentioned such technical scheme that constitutes 6, on the basis of technical scheme 4 or 5, have: connect the material applying device, supply with between the position at auxiliary substrate accommodating device and auxiliary substrate, coating connects material on auxiliary substrate; The auxiliary substrate Handling device is carried to auxiliary substrate and is arranged on the connection material coating position that connects on the material applying device from the auxiliary substrate accommodating device, and will be coated with the auxiliary substrate that connects material and be carried to auxiliary substrate and supply with the position by connecting the material applying device.Thus, after auxiliary substrate being supplied in the auxiliary substrate accommodating device, on auxiliary substrate, apply the connection material automatically, after coating, be carried to auxiliary substrate by the auxiliary substrate Handling device and supply with the position, then be installed on the main substrate, therefore can significantly improve operating efficiency.In addition, when on main substrate, electronic unit being installed, can connect material to the auxiliary substrate coating simultaneously, therefore, save time, improve productivity.And then, do not need in advance electronic unit to be installed on the auxiliary substrate and the modular unit made remains in the warehouse, just can tackle the unexpected variation of production method, enhance productivity.
Invention according to above-mentioned such technical scheme that constitutes 7, the auxiliary substrate feedway that is used for coating connection material on auxiliary substrate and supplies with constitutes one and is attached to electronic component mounting apparatus, therefore can not make to have the electronic component mounting apparatus maximization that connects the function of material to the auxiliary substrate coating, electronic component mounting apparatus simple in structure can be provided.And then, can make the auxiliary substrate feedway form to load and unload one-piece type, raising can with the versatility of the shared grade of other electronic component mounting apparatus, wherein, described auxiliary substrate feedway connects material in the auxiliary substrate coating of supplying with from the auxiliary substrate accommodating device, by the auxiliary substrate Handling device auxiliary substrate is carried to auxiliary substrate and supplies with the position.In addition, change being supplied to the screen mask that printing on the auxiliary substrate that connects material coating position connects the pattern of material, can promptly tackle the situation of the different pattern of on each product printing thus, make the productivity raising being used for.
According to the invention of above-mentioned such technical scheme that constitutes 8, on the basis of technical scheme 7, it is adjacent that matrix and parts are supplied with feed appliance, is loaded on the electronic component mounting apparatus.Thus, in production line, do not need to append in addition and remove the device that is used for connecting material, therefore can reduce production line length in the auxiliary substrate coating.In addition, shared to each other by production line when having many production lines at needs, thus, can reduce equipment investment.
According to the invention of above-mentioned such technical scheme that constitutes 9, on the basis of technical scheme 7, matrix is on the slot part with the handling part that the mode that can load and unload is loaded in the parts supply feed appliance of electronic component mounting apparatus.Thus, when not needing auxiliary substrate, can pull down matrix at short notice, production line is turned round expeditiously, enhance productivity as common electronic component mounting apparatus owing to production substrate generation change etc.
Description of drawings
Fig. 1 is the stereogram that makes the electronic component mounting apparatus that employed fitting machine is arranged side by side in the execution mode.
Fig. 2 is that the auxiliary substrate of execution mode is installed the partial perspective stereogram with electronic component mounting module.
Fig. 3 is that the electronic unit of execution mode is installed the partial perspective stereogram with electronic component mounting module.
Fig. 4 is the vertical view that schematically shows the auxiliary substrate feedway of execution mode.
Fig. 5 is the side sectional view that schematically shows the auxiliary substrate feedway of execution mode.
Embodiment
Below, according to Fig. 1～Fig. 5 the execution mode of electronic component mounting method of the present invention and device is described.Fig. 1 is that expression erecting device of the present invention is the figure of the electronic component mounting apparatus 1 of modular type.In addition, front, back, left, right, up, down in the literary composition and X, Y, Z mark are in the accompanying drawings.
In the present embodiment, for electronic component mounting apparatus 1, make an electronic component mounting module 2 and a plurality of (being 7 in the present embodiment) electronic component mounting module 3 adjacent and be set up in parallel on base station 13, to constitute the electronic unit hookup wire, wherein, a described electronic component mounting module 2 is used for the coated auxiliary substrate S that connects material is installed in main substrate M, and described a plurality of electronic component mounting modules 3 are used for going up or going up electronic unit P is installed to being installed in auxiliary substrate S on the main substrate M to main substrate M.
At first, according to Fig. 2, Fig. 4 and Fig. 5 electronic component mounting module 2 is described.Electronic component mounting module 2 has electronic components mounting machine 22 and auxiliary substrate feedway 32.
As shown in Figure 2, electronic components mounting machine 22 has: substrate transfer apparatus 5 is used to keep main substrate M, and main substrate M is carried to the installation site; Securement head 11 keeps auxiliary substrate S by adsorption head 9 absorption, auxiliary substrate S is installed in substrate transfer apparatus 5 clamps on the main substrate M that keeps; Control device 12 is controlled the installation of securement head 11.
Securement head 11 is parts of XY machinery hand-type, has Y direction moving slider 41, described Y direction moving slider 41 the auxiliary substrate of substrate transfer apparatus 5 and auxiliary substrate feedway 32 described later supply with position 71 above, shelve on base frame 4, and Y-axis servo motor 42 makes this Y direction moving slider 41 move along the Y direction.Have directions X moving slider 43 on this Y direction moving slider 41, X-axis servo motor 40 makes this directions X moving slider 43 move along the directions X perpendicular to the level of Y direction.Y-axis servo motor 42 and 12 controls of X-axis servo motor 40 controlled devices are moved.
As shown in Figure 2, adsorption head 9 is installed on directions X moving slider 43, described adsorption head 9 is provided with absorption auxiliary substrate S it is installed in suction nozzle 44 on the main substrate M.This adsorption head 9 has the headstock (head frame) 46 that is installed on the directions X moving slider 43.Mouth retainer 49 cylindraceous is installed in the bottom of the headstock 46, this mouth retainer 49 cylindraceous can be that the center is rotated with the axis, and this mouth retainer 49 cylindraceous maintains a plurality of (for example 8) main shaft (spindle) 47, and described a plurality of main shafts 47 can be gone up reciprocating motion at above-below direction (Z-direction).Omitted illustrated compression spring upward to each main shaft 47 application of force, suction nozzle 44 has been installed in the lower end of each main shaft 47.Supply with negative pressure to each suction nozzle 44 respectively by having omitted illustrated suction nozzle movement device.
The R axle motor 50 that is installed on the headstock 46 intermittently rotates mouth retainer 49, so that suction nozzle 44 stops on the assigned position.When Z axle motor 51 drives 52 rotations of Z axle feed screws and when nozzle decline bar 53 is descended, stop at the elastic force that main shaft 47 on the mounting points of the installation auxiliary substrate S in the assigned position overcomes described compression spring, suction nozzle 44 is also descended.When Z axle feed screw 52 carries out reverse rotation and nozzle decline bar 53 when rising, main shaft 47 rises by the elastic force of compression spring, and suction nozzle 44 is also risen.
Next, auxiliary substrate feedway 32 is described.The matrix 84 of auxiliary substrate feedway 32 is inserted into the parts of the front side of the substrate transfer apparatus 5 that is arranged on electronic components mounting machine 22 and supplies with feed appliance with the slot part of handling part from the front side, be easy to load and unload by operating not shown bar etc.At this moment, by not shown socket chimeric be connected of the communication on the rear end face 84c that will be arranged on matrix 84, can make the auxiliary substrate feedway 32 and the control device 12 of electronic components mounting machine 22 communicate (Fig. 2, Fig. 5) with plug 90 and the slot part rear that is arranged on electronic components mounting machine 22.
As Fig. 4, shown in Figure 5, auxiliary substrate feedway 32 has: auxiliary substrate accommodating device 60 is used to deposit auxiliary substrate S; Auxiliary substrate Handling device 72 is carried to auxiliary substrate supply position 71 from auxiliary substrate accommodating device 60 via connecting material coating position 70 with auxiliary substrate S; Connect material applying device 73, be used for being carried to coating connection material on the auxiliary substrate S that connects material coating position 70.
Auxiliary substrate accommodating device 60 has: shelf (rack) 61, shelve on matrix 84, and can move up and down, and can be with the ccontaining a plurality of auxiliary substrate S of mode stacked on above-below direction; Lowering or hoisting gear 62 moves shelf 61 along the vertical direction, and can position shelf 61 on above-below direction; Supporting bracket 77 is used for shelf 61 and lowering or hoisting gear 62 are supported on matrix 84.In addition, auxiliary substrate S can directly be contained in the shelf 61, but considers the difficulty of ccontaining auxiliary substrate S, can indirectly auxiliary substrate S be contained in the shelf 61 through box (cartridge) 80, in the present embodiment, the mode through box 80 ccontaining auxiliary substrate S is described.
Supporting bracket 77 is made by the material with regulation Strong degree (for example aluminium, iron etc.), stands in mode parallel on fore-and-aft direction and establishes.In addition,, will be fixed on the left surface of matrix 84, supporting bracket 77 and matrix 84 are become one at protuberance 77a outstanding below the rearward end of supporting bracket 77 by not shown bolt.Overlook under the observation, the formation of shelf 61 is " コ " font, and top, the front of shelf 61 and the part of back are by opening.The right flank 77c of supporting bracket 77 is provided with guiding sliding tray 77b, and leading is formed with the peristome of T font with sliding tray 77b 77d on supporting bracket 77, and this guiding extends near the following 77e of supporting bracket 77 along the vertical direction with sliding tray 77b.Dispose on shelf 61 by fixing guide part 78 such as screw clamp, the guiding of the T word 78a of portion and supporting bracket 77 of left surface that is formed on guide part 78 is with sliding tray 77b tabling, guiding shelf 61 mobile on above-below direction.In addition, it is not come off in order to make shelf 61 stop at the below that guiding does not connect to following 77e with sliding tray 77b, therefore, if form block (stopper), guiding is connected to following 77e with sliding tray 77b by other device such as for example slip-off preventing pin.
In shelf 61, be filled with the box 80 that is used to exchange.Overlook under the observation, the shape of box 80 is " コ " font, a part of opening of front and back.The left outer surface of box 80 is provided with protuberance 80a, and described protuberance 80a is chimeric with the recess 61b of left inner surface that is arranged on shelf 61, the guide part when becoming box 80 and moving up and down.In order to deposit auxiliary substrate S, on the medial surface of the left and right sides of box 80, carve the cut-in groove that is provided with a plurality of levels, the thickness of the cut-in groove of described level is a bit larger tham the thickness of auxiliary substrate S, and connects to the back from the front.Thus, deposit a plurality of printings and connect auxiliary substrate S before the materials in box 80, described auxiliary substrate S keeps the interval of regulation, and arranges on above-below direction.After the operator is left in auxiliary substrate S in the box 80, make recess 61b and protuberance 80a chimeric, the peristome of box 80 from the upside of shelf 61 is filled to the shelf 61, wherein, described recess 61b extends to lower surface from the upper surface of the left inner surface 61a of shelf 61 and forms, and described protuberance 80a is formed on the left outer surface of box 80.Be connected to carrying case 80 on the backing pin 79 by the lower surface that makes box 80, box 80 is positioned on above-below direction, wherein, described backing pin 79 connects the pin-and-hole that is provided with from the assigned position on the outer surface 61c of the right side of shelf 61 and inserts, and projects to the inner space of shelf 61.When stored auxiliary substrate S all uses in the box 80, extract backing pin 79 out, extract each box 80 out from the bottom of shelf 61, box 80 is broken away from from shelf 61, and then auxiliary substrate S left in the box 80, afterwards with above-mentioned the same, the top of box 80 from shelf 61 is filled to the shelf 61.
Lowering or hoisting gear 62 drives shelf 61 up and down, on above-below direction, makes the upper surface in carrying path 83 of the auxiliary substrate S on lower surface and the upper surface 84a that is arranged on matrix 84 of auxiliary substrate S of supply roughly consistent.For lowering or hoisting gear 62, band 62a is erected on two belt wheels 85,86, and described belt wheel 85,86 is bearing in the above and below of forward end of the right flank 77c of supporting bracket 77 by axle, and can rotate.On supporting bracket 77, with above belt wheel 85 opposite sides be fixed with electro-motor 81, the output shaft of electro-motor 81 is connected with belt wheel 85.The part of the side surface part thereafter of band 62a is connected with guide part 78 on being fixed on shelf 61.Thus, be rotated in the rotation of belt wheel 85 along with electro-motor 81, when the rear side face of band 62a moved up and down, shelf 61 moved up and down, and the lower surface of desired auxiliary substrate S is aimed at the upper surface in carrying path 83.In addition, 12 pairs of electro-motors 81 of control device are controlled.
Then, auxiliary substrate Handling device 72 is described, described auxiliary substrate Handling device 72 will be contained in auxiliary substrate S on the shelf 61 of auxiliary substrate accommodating device 60 and be carried to and connect material coating position 70, in addition, will apply the auxiliary substrate S that connects material in connection material coating position 70 and be carried to auxiliary substrate supply position 71.
Auxiliary substrate Handling device 72 has: carrying has piston rod 63a with cylinder body 63; The carrying path 83 of auxiliary substrate S is formed on the upper surface of matrix 84; Block has piston rod 65a with cylinder body 65; Block 76 moves with cylinder body 65 by block.
The carrying path 83 of auxiliary substrate S that is formed on the upper surface 84a of matrix 84 extends to the front 84h that the auxiliary substrate that is arranged on the back square end stops the 84g of portion with the degree of depth of regulation from the forward end of the upper surface 84a of matrix 84.
Block is configured among the inner space 84k of matrix 84 below connection material coating position 70 with cylinder body 65, is fixed on the lower surface in the carrying path 83 on the upper surface 84a that is formed at matrix 84 through support 97.Chimeric by connecting pin 76c and slotted hole, through the piston rod 65a that block is had with cylinder body 65, block 76 is connected with cylinder body 65 with block, and can rotate.In addition, support limit stop 76 makes its back shaft that can rotate 98 extend at left, and is fixed on the support (bracket) 97.
Carrying is fixed on the leading flank 77f of supporting bracket 77 through support 91 with cylinder body 63.The air driven carrying of supplying with from the outside makes piston rod 63a advance and retreat with cylinder body 63.12 pairs of carryings of control device are controlled with cylinder body 63.The leading section 63b of piston rod 63a is the front end face Sa butt that is used for auxiliary substrate S, promotes the position of carrying auxiliary substrate S.
Connecting material applying device 73 has: seal net (screen) contact separation device 87 is used to make screen mask (screen mask) 68 and is positioned in being connected the auxiliary substrate S contact on the material coating position 70 or separating of carrying path 83; Connect material printing equipment 75, see through the screen mask 68 that is connected on the auxiliary substrate S, printing connects the pattern of material on auxiliary substrate S.
Matrix 84 is configured in the rear of auxiliary substrate accommodating device 60, and, keep little gap between the front 84d of matrix 84 and the back 61d of shelf 61, at this, matrix 84 is connected with the protuberance 77a of the supporting bracket 77 of auxiliary substrate accommodating device 60 by bolt.6 faces of front and back up and down of matrix 84 are covered by metal wall.As described above, be formed with carrying path 83 at the upper surface 84a of matrix 84.For auxiliary substrate S is positioned it is stopped on the connection material coating position 70, connect on carrying path 83 and be provided with slot part 84j, described slot part 84j is used to make the front end of block bar 76 to haunt on carrying path 83.
Seal net contact separation device 87 is for printing on the auxiliary substrate S that is supplied to the connection material coating position 70 on the carrying path 83 connects material, makes to connect figuratum screen mask 68 is set moves up and down, with auxiliary substrate S contact or separate.Seal net contact separation device 87 comprises screen mask 68, mask frame 92, supporting bracket 93, has the screen mask lifting cylinder body 64 of piston rod 64a.
Connect material printing equipment 75 and supply with the connection material, will connect material by brushing and print to the surface of auxiliary substrate S to the upper surface that is connected to the screen mask 68 on the auxiliary substrate S.Connect that material printing equipment 75 comprises squeegee (squeegee) 89, squeegee with piston rod 66a switches with cylinder body 66, has the printing usefulness cylinder body 67 of piston rod 67a.
Squeegee 89 is supported on the back shaft 95 and can rotates, and described back shaft 95 is provided with to right-hand flatly giving prominence to from the right flank 94a of support 94; Chimeric by pin 89a and slotted hole, the rearward end of squeegee 89 and squeegee are switched piston rod 66a with cylinder body 66 and are connected and can rotate.The squeegee switching is fixed on the right flank 94a of support 94 with cylinder body 66.
Printing is flatly shelved on the right flank of giving prominence to the installation portion 92a that is provided with from the left end of mask frame 92 upward with cylinder body 67 and can be moved along the vertical direction, by having omitted illustrated cylinder body printing is shifted along the vertical direction with cylinder body 67.And, be fixed with the bend 94b that is bent into the L font of support 94 with the leading section of the piston rod 67a of cylinder body 67 in printing.Thus, by the action of printing with cylinder body 67, the squeegee 89 and the squeegee switching that are fixed on the support 94 are moved along fore-and-aft direction with cylinder body 66 and support 94 with becoming one.
In addition, in the above description, whole cylinder bodies all is to be the cylinder of drive source with the air, moves by supplying with air-out, and control device 12 is controlled their action.
Next, describe being used for going up a plurality of electronic component mounting modules 3 that electronic unit P is installed according to Fig. 1 and Fig. 3 to main substrate M.Electronic component mounting module 3 has electronic components mounting machine 22 and assembly supply device 7.
Electronic components mounting machine 22 for electronic component mounting module 3, compare with employed electronic components mounting machine 22 in above-mentioned electronic component mounting module 2, only be to be replaced into electronic unit P in order to go up the parts of installing and supplying with by auxiliary substrate S to main substrate M, other structure is identical, therefore, identical structural element is attached with identical Reference numeral, and detailed.
As Fig. 1 and shown in Figure 3, assembly supply device 7 in the omission on the base frame 4 on the illustrated slot part, in the mode that can load and unload a plurality of boxlike feed appliances 21 are installed.Boxlike feed appliance 21 has: main body 23 is installed on the base frame 4 in the mode that can load and unload; Supply spool 25 is arranged on the rear portion of main body 23; Parts taking-up portion 27 (parts supply with position B) is arranged on the front end of main body 23.On supply spool 25, reel to maintain and omitted illustrated elongated band, described elongated band is enclosed electronic unit P with prescribed distance, omitted illustrated sprocket wheel (sprocket) and drawn this band with prescribed distance, electronic unit is disengaged the inclosure state and is fed through parts taking-up portion 27 (parts are supplied with position B) successively, as illustrated in the above-mentioned electronic component mounting module 2, adsorption head 9 absorption keep electronic unit P to be installed in successively on the main substrate M.
Then, the action to the electronic component mounting apparatus 1 of present embodiment describes.At first, when electronic component mounting module 2 and electronic component mounting module 3 startings, the auxiliary substrate feedway 32 that is loaded in electronic components mounting machine 22 inside starts simultaneously with electronic components mounting machine 22.For auxiliary substrate feedway 32, confirm to supply with on the position 71 whether have auxiliary substrate S by not shown transducer at auxiliary substrate, if can confirm that supplying with position 71 at auxiliary substrate does not exist auxiliary substrate S, then will apply the auxiliary substrate S that connects material and be supplied to connection material coating position 70.At first, instruction according to control device 12, the electro-motor 81 of lowering or hoisting gear 62 makes belt wheel 85 rotations, so that shelf 61 moves up and down with being erected at the mobile interlock of the band 62a on the belt wheel 85, the lower surface height that is contained in the auxiliary substrate S in the shelf 61 by box 80 is alignd with the upper level of carrying path 83.At this moment,, for example can use transducer, also can estimate by the operator as the method for the position of detecting auxiliary substrate S, wherein, described transducer box 80 the lower surface height of ccontaining each auxiliary substrate S move when aliging with the upper level in carrying path 83.When range estimation, the operator confirms first auxiliary substrate S, and first auxiliary substrate S carried out aligning highly, afterwards, makes shelf 61 each distances of depositing the interval that move the auxiliary substrate S that leaves in the box 80 downwards, aims at.
Then,, the auxiliary substrate block that is configured in the below that connects material coating position 70 is rearward extended with the piston rod 65a of cylinder body 65, make block 76 rotations according to the instruction of control device 12.Thus, the leading section 76a of block 76 is on carrying path 83, and is under the state than the low ormal weight of the upper surface of auxiliary substrate S only, outstanding upward from slot part 84j.
Then, carrying is moved with cylinder body 63, piston rod 63a rearward extends, the leading section 63b of piston rod 63a and the front surface S a butt that leaves the auxiliary substrate S in the shelf 61 of auxiliary substrate accommodating device 60 in, rearward promote above-mentioned auxiliary substrate S, auxiliary substrate S slides on carrying path 83 thus, is carried to connect material coating position 70.Then, the rearward end Sb of auxiliary substrate S is connected on the front end face of auxiliary substrate block 76a, and auxiliary substrate S is positioned.With the action of cylinder body 63, piston rod 63a is through after the predefined stipulated time by carrying, retreats to be holding state.
Then, the seal net lifting of seal net contact separation device 87 retreats with the piston rod 64a of cylinder body 64, and screen mask 68 descends, and screen mask 68 connects with the upper surface that is positioned in the auxiliary substrate S that is connected material coating position 70.At this moment, squeegee 89, squeegee switch with cylinder body 66 and print with cylinder body 67 with screen mask 68 declines.Direction when the print direction of squeegee 89 printed with the last time is opposite, therefore, for the connection material that utilizes squeegee 89 will remain on the screen mask 68 is printed onto on the printing surface of auxiliary substrate S, need residual connection material is placed on the direction that squeegee 89 moves.Therefore, printing is shifted upward with cylinder body 67, squeegee 89 is broken away from from screen mask 68, elongation or shortening squeegee switch the piston rod 66a with cylinder body 66, making squeegee 89 is to reverse in the center with back shaft 95, then, printing is shifted with cylinder body 67 downwards, squeegee 89 is connected on the screen mask 68.
Then, if at the upper surface of screen mask 68, connect material (for example paste soldering material) deficiency, then manual operations is supplied with and is connected material, makes printing with cylinder body 67 actions then, goes up printing to auxiliary substrate S and connects material.After printing, seal net lifting is advanced, with the piston rod 64a of cylinder body 64 so that screen mask 68 risings and breaking away from from auxiliary substrate S.Then, the auxiliary substrate block is retreated with the piston rod 65a of cylinder body 65, block 76 retreats from carrying path 83, removes the positioning function of block 76.Then, to carrying cylinder body 63 air supplies, piston rod 63a is advanced, utilize leading section 63b to promote auxiliary substrate S, the rear end face Sb of auxiliary substrate S is connected to be arranged at the auxiliary substrate on the rearward end in carrying path 83 to stop on the front 84h of the 84g of portion, thereby carries out auxiliary substrate S supplies with location from position 71 to auxiliary substrate.Then, after the predefined stipulated time of process, piston rod 63a retreats, and turns back to the state of expection, finishes auxiliary substrate S supplies with supply from position 71 to auxiliary substrate.
Then, substrate transfer apparatus 5 drives conveyer belt 19, and M moves into the installation site with main substrate, has omitted illustrated clamping device main substrate M is risen, and main substrate M is carried out clamping and positioning.Y-axis servo motor 42 drives Y direction moving slider 41, and X-axis servo motor 40 drives directions X moving slider 43, and thus, adsorption head 9 moves to the auxiliary substrate of the auxiliary substrate feedway 32 of electronic component mounting module 2 and supplies with position 71.Then, mouth retainer 49 carries out the calibration rotation, and the auxiliary substrate that makes the main shaft 47 that the corresponding suction nozzle 44 of and instruction auxiliary substrate S to be installed is installed be dispensed on auxiliary substrate S is supplied with 71 tops, position.Then, the elastic force that nozzle decline bar 53 overcomes the compression spring descends, and the front end of the suction nozzle 44 of the main shaft 47 that engages with nozzle decline bar 53 drops to the position extremely approaching with the upper surface of auxiliary substrate S.Then, omitted illustrated nozzle movement device and supplied with negative pressure to suction nozzle 44, auxiliary substrate S absorption remains on the lower surface of suction nozzle 44.
Then, drive Y-axis servo motor 42 and X-axis servo motor 40, adsorption head 9 moves into place in the installation site of main substrate M top, and auxiliary substrate S is installed on the main substrate M.
The main substrate that substrate transfer apparatus 5 will be equipped with auxiliary substrate S is carried in the electronic component mounting module 3 that is set up in parallel successively, in each electronic component mounting module 3, according to the information of the electronic unit that should install, electronic unit is installed on main substrate M and the auxiliary substrate S.Like this, the modularization of auxiliary substrate S and the installation of main substrate are carried out simultaneously, thereby finish installation.
As from above-mentioned explanation, learning, in the present embodiment, utilize securement head 11 that auxiliary substrate S is installed on the main substrate M, and, utilize securement head 11 that electronic unit P is installed on the auxiliary substrate S, thereby realize the modularization of auxiliary substrate S.Thus, the modular unit as making at auxiliary substrate S installation electronic unit P does not in advance need to be kept at separately in the warehouse, the reasonably unexpected variation of corresponding production method, thus enhance productivity.
In addition, in the present embodiment,, connect material by connecting material applying device 73 coating on auxiliary substrate S before on the main substrate M auxiliary substrate S being installed.Thus, need not supply with the connection material to each auxiliary substrate separately, and can unify to supply with, therefore save time, enhance productivity.And then, when on main substrate M, electronic unit P being installed, carry out the operation of coating connection material on auxiliary substrate simultaneously, therefore, do not lose time, can improve productivity.
In addition, in the present embodiment, for substrate feedway 32, auxiliary substrate accommodating device 60, auxiliary substrate Handling device 72 and connection material applying device 73 constitute one, wherein, described auxiliary substrate accommodating device 60 is used to deposit auxiliary substrate S, the auxiliary substrate S that described auxiliary substrate Handling device 72 is used for leaving auxiliary substrate accommodating device 60 in is carried to connection material coating position 70 and auxiliary substrate supply position 71, and described connection material applying device 73 is used for coating connection material on auxiliary substrate S.Thus, auxiliary substrate feedway 32 can form movably one-piece type, thus the versatility of raising and other the shared grade of electronic component mounting apparatus.
In addition, in the present embodiment, auxiliary substrate feedway 32 is loaded in the electronic component mounting apparatus 1 as independent member.Thus, because need in production line, not append other isolated plant, the length of production line can be suppressed short.In addition, shared to each other by production line when having many production lines at needs, can suppress equipment investment low.
In addition, in the present embodiment, auxiliary substrate feedway 32 is loaded in as parts in the mode that can load and unload and supplies with in the slot part of handling part of feed appliance.Thus, when not needing auxiliary substrate S, can pull down auxiliary substrate feedway 32 at short notice, production line is turned round expeditiously, enhance productivity as common electronic component mounting apparatus owing to production substrate generation change etc.
In addition, in the present embodiment, the electronic component mounting module 2 that is used to install auxiliary substrate S is configured in the left end of electronic component mounting apparatus 1, but allocation position considers structure and the operating efficiency be installed in the electronic unit P on the main substrate M and determines, the electronic component mounting module 2 that is used to install auxiliary substrate S can be configured in other position.And being used for going up the electronic component mounting module 2 that auxiliary substrate S is installed to main substrate M is one, but can increase the platform number of electronic component mounting module 2 according to the kind from the auxiliary substrate S that installs to main substrate M and the quantity that go up.In addition, can use single electronic component mounting module 2.
In addition, connect material to auxiliary substrate S coating and be not limited to printing, can use pin-array printing or other method.
In addition, in the present embodiment, to before auxiliary substrate S is installed on the main substrate M, coating connection examples of material is illustrated on auxiliary substrate S, but be not limited thereto, has the device that is used to apply the applying device that connects material for inside at electronic components mounting machine 22, perhaps additional projection on the auxiliary substrate S that supplies with at the very start, do not need to apply the device that connects material, before installing on the main substrate M, do not connect the coating of material at auxiliary substrate S, thereby can be used as the automatic supplier of the device of present embodiment as auxiliary substrate S.Thus, because auxiliary substrate is installed on the main substrate automatically, so operating efficiency improves.
In addition, in the present embodiment, constitute electronic component mounting apparatus by electronic component mounting module 2 and electronic component mounting module 3, wherein, described electronic component mounting module 2 is used for auxiliary substrate S is installed in main substrate M, described electronic component mounting module 3 is used for electronic unit P is installed in auxiliary substrate S or main substrate M, but, can come to go up coating with an electronic components mounting machine and connect material to auxiliary substrate S by having assembling auxiliary substrate feedway 32 on the electronic components mounting machine 22 of assembly supply device 7, go up installation auxiliary substrate S and electronic unit P is installed to main substrate M to auxiliary substrate S and main substrate M.
Claims (9)
1. an electronic component mounting method is characterized in that,
Be carried to the substrate transfer apparatus of installation site and be used for the electronic component mounting apparatus of the securement head of electronic unit being installed having the main substrate that is used for will be coated with connecting material to the described main substrate that remains on the described substrate transfer apparatus,
The auxiliary substrate that will be installed on the described main substrate by described securement head is installed on the described main substrate that is carried to described installation site, and described auxiliary substrate is supplied with from the auxiliary substrate feedway, and needs to install electronic unit or coating connection material.
2. electronic component mounting method as claimed in claim 1 is characterized in that,
Described electronic component mounting apparatus also has the parts supply feed appliance that is used to supply with electronic unit,
To supply with described electronic unit that feed appliance supplies with from described electronic unit by described securement head be installed in described main substrate or be installed on the described auxiliary substrate on the described main substrate.
3. electronic component mounting method as claimed in claim 2 is characterized in that,
Before on the described main substrate described auxiliary substrate being installed, apply the connection material by connecting the material applying device on described auxiliary substrate, the described auxiliary substrate that will be coated with described connection material by described securement head is installed on the main substrate that is carried to described installation site.
4. electronic component mounting apparatus has: substrate transfer apparatus is used for being coated with the main substrate that connects material and is carried to the installation site, securement head, be used for electronic unit being installed, it is characterized in that having to the described main substrate that remains on the described substrate transfer apparatus:
The auxiliary substrate accommodating device is used for the ccontaining auxiliary substrate that will be installed on the described main substrate,
The auxiliary substrate Handling device is used for that described auxiliary substrate is carried to auxiliary substrate from described auxiliary substrate accommodating device and supplies with the position;
By described securement head, the described auxiliary substrate that is supplied to described auxiliary substrate supply position is installed on the described main substrate that is carried to described installation site.
5. electronic component mounting apparatus as claimed in claim 4 is characterized in that,
Described electronic component mounting apparatus also has the parts supply feed appliance that is used to supply with electronic unit,
To supply with described electronic unit that feed appliance supplies with from described electronic unit by described securement head be installed in described main substrate or be installed on the described auxiliary substrate on the described main substrate.
6. as claim 4 or 5 described electronic component mounting apparatus, it is characterized in that,
Have the material of connection applying device, this connection material applying device is arranged on described auxiliary substrate accommodating device and described auxiliary substrate is supplied with between the position, be used for connecting material in the described auxiliary substrate coating of supplying with from described auxiliary substrate accommodating device,
Described auxiliary substrate Handling device is carried to the connection material coating position that is arranged on the described connection material applying device with described auxiliary substrate from described auxiliary substrate accommodating device, will be coated with the described auxiliary substrate that connects material by described connection material applying device and be carried to described auxiliary substrate supply position.
7. auxiliary substrate feedway, be used in the electronic component mounting apparatus, this electronic component mounting apparatus has: substrate transfer apparatus, be used for to be coated with the main substrate that connects material and be carried to the installation site, securement head, be used for electronic unit being installed, it is characterized in that to the described main substrate that remains on the described substrate transfer apparatus
Described auxiliary substrate feedway has:
The auxiliary substrate accommodating device is used for the ccontaining auxiliary substrate that will be installed on the described main substrate,
The auxiliary substrate Handling device is used for that described auxiliary substrate is carried to auxiliary substrate from described auxiliary substrate accommodating device and supplies with the position,
Connect the material applying device, be arranged on described auxiliary substrate accommodating device and described auxiliary substrate and supply with between the position, be used for connecting material in the described auxiliary substrate coating of supplying with from described auxiliary substrate accommodating device;
Described auxiliary substrate accommodating device has:
Shelf is shelved on matrix and can be moved up and down, can be with the ccontaining a plurality of auxiliary substrate of mode stacked on above-below direction,
Lowering or hoisting gear can make described shelf move along the vertical direction and position, make by ccontaining described a plurality of auxiliary substrates respectively be arranged on described body upper surface on the carrying path align;
Described connection material applying device has:
Described matrix, upper surface are provided with the described carrying path of described auxiliary substrate,
Seal net contact separation device, make connect be provided with figuratum screen mask be supplied to described carrying path describedly be connected the described auxiliary substrate contact of material coating position or separate,
Connect the material printing equipment, see through the described screen mask that is connected on the described auxiliary substrate, printing connects the pattern of material on described auxiliary substrate.
8. auxiliary substrate feedway as claimed in claim 7 is characterized in that,
Described matrix and described parts are supplied with feed appliance and are adjacent to be loaded on the described electronic component mounting apparatus.
9. auxiliary substrate feedway as claimed in claim 7 is characterized in that,
Described matrix is loaded on the slot part in the mode that can load and unload, and described slot part is the handling part that the described parts of described electronic component mounting apparatus are supplied with feed appliance.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2008174177A JP5305762B2 (en) | 2008-07-03 | 2008-07-03 | Electronic component mounting method and electronic component mounting apparatus |
| JP2008174177 | 2008-07-03 | ||
| JP2008-174177 | 2008-07-03 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101621919A true CN101621919A (en) | 2010-01-06 |
| CN101621919B CN101621919B (en) | 2014-04-02 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200910151328.2A Active CN101621919B (en) | 2008-07-03 | 2009-06-30 | Method and device for mounting electronic component, auxiliary substrate supply device |
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| Country | Link |
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| JP (1) | JP5305762B2 (en) |
| CN (1) | CN101621919B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188333A (en) * | 2014-06-19 | 2015-12-23 | 亚企睦自动设备有限公司 | Assembling device and assembling method |
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|---|---|---|---|---|
| JPH11145693A (en) * | 1997-11-05 | 1999-05-28 | Matsushita Electric Ind Co Ltd | Electronic part mounting equipment and method therefor |
| JP2000151088A (en) * | 1998-11-18 | 2000-05-30 | Matsushita Electric Ind Co Ltd | Apparatus for mountiing electronic component and method of mounting |
| JP2001326453A (en) * | 2000-05-12 | 2001-11-22 | Matsushita Electric Ind Co Ltd | Component packaging device |
| CN1575108A (en) * | 2003-06-09 | 2005-02-02 | 松下电器产业株式会社 | Method of making mounting plates |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08166985A (en) * | 1994-03-28 | 1996-06-25 | Matsushita Electric Ind Co Ltd | Substrate package designing device |
| JP3588444B2 (en) * | 2000-10-26 | 2004-11-10 | 松下電器産業株式会社 | Electronic component, component mounting device and component mounting method |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11145693A (en) * | 1997-11-05 | 1999-05-28 | Matsushita Electric Ind Co Ltd | Electronic part mounting equipment and method therefor |
| JP2000151088A (en) * | 1998-11-18 | 2000-05-30 | Matsushita Electric Ind Co Ltd | Apparatus for mountiing electronic component and method of mounting |
| JP2001326453A (en) * | 2000-05-12 | 2001-11-22 | Matsushita Electric Ind Co Ltd | Component packaging device |
| CN1575108A (en) * | 2003-06-09 | 2005-02-02 | 松下电器产业株式会社 | Method of making mounting plates |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105188333A (en) * | 2014-06-19 | 2015-12-23 | 亚企睦自动设备有限公司 | Assembling device and assembling method |
| CN105188333B (en) * | 2014-06-19 | 2019-09-27 | 亚企睦自动设备有限公司 | Assemble device and assembly method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101621919B (en) | 2014-04-02 |
| JP2010016145A (en) | 2010-01-21 |
| JP5305762B2 (en) | 2013-10-02 |
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