JP2578936B2 - Electronic component mounting equipment - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an electronic component mounting apparatus, and more particularly, to an electronic component mounted on a sub-stage provided with a displacement correction member for an electronic component.
The present invention relates to a means for adjusting the angle in the θ direction of a die collet for properly attracting and taking up the die collet of a mount head.

(Prior Art) As an electronic component mounting apparatus, a sub-transfer head for transferring an electronic component from a supply unit of an electronic component such as a wafer or a tray to a sub-stage, and an electronic component on a substrate positioned on a mount from the sub-stage. A device equipped with a mount head for transferring is known (JP-A-61-264793). The sub-stage is a stage for mechanically correcting the position shift in the xyθ direction by pressing the position shift correction member against the electronic component transferred by the sub transfer head, and the position-corrected electronic component. The die collet of the mount head is attracted and transferred to the substrate.

An electronic component is generally a rectangular box. Therefore, a suction hole of a die collet for sucking the electronic component is also formed in a rectangular shape. When the electronic component is sucked into the suction hole, the four sides of the suction hole are four sides of the electronic component. Must exactly match
If they do not completely match, the dicollet must be rotated about its axis to adjust the angle in the θ direction (the direction of rotation about the axis).

Conventionally, the adjustment of the angle in the θ direction of such a die collet is as follows.
The electronic components on the substage are transferred and mounted on the board by the mount head, and the mounted electronic components are observed for any displacement in the θ direction. If any, the angle of the die collet is eliminated so that this is eliminated. Was done by adjusting.

(Problems to be Solved by the Invention) However, the above-mentioned conventional means detects the displacement of the die collet by actually mounting the electronic component on the board, and the electronic component and the board are wasted. In addition, there is a problem that the adjustment of the angle requires considerable effort.

Accordingly, it is an object of the present invention to provide means for easily detecting and adjusting the displacement of this type of die collet in the θ direction.

(Means for Solving the Problems) In order to achieve this, the present invention provides an electronic component mounting apparatus of this type in which a mount head is used to raise and lower a die collet for adsorbing an electronic component, and the die collet is rotated about an axis. A θ-direction rotating device and a landing detection device for detecting that the lower surface of the die collet has landed on the substage are provided.

(Operation) In the above configuration, the elevating device is driven to lower the die collet of the mount head to the sub-stage. If the landing detection device detects that the lower surface of the die collet has landed on the sub-stage, it is determined that the position of the die collet is correct, and if not detected, the position of the die collet is corrected. The θ-direction rotating device is driven to rotate the dicollet in the θ direction until it is determined that the dicollet has landed on the member and the landing detection device detects that the dicollet lands on the substage.

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus, which comprises a sub-transfer head 1, a mount head 2, and a transfer head 3.
Are provided. Each of the heads 1 to 3 is a multi-head equipped with a plurality of nozzles, and selectively uses the nozzles according to the size of the electronic component. 4,5,6,7
Are a supply part, a substage, a mount part, and a bond supply part for electronic components provided below each of the heads 1 to 3.
The electronic component supply unit 4 includes a turntable 8 and support plates 9a and 9b mounted on the turntable 8, and the support plates 9a and 9b hold trays 10 and wafers 11 containing electronic components. Equipped. Reference numeral 12 denotes a die ejector which pushes up electronic components on the wafer 11 by pins.

The sub-stage 5 is supplied by the sub-transfer head 1 to the supply unit 4.
This is a stage for mechanically correcting a position shift in the xyθ direction of the electronic component transferred from the device by a position shift correcting member (described later). The mounting unit 6 includes table moving devices 13 and 14,
It is composed of a clamp member 15 and the like, and positions the substrate 17. 16
Denotes a conveyor for carrying out the substrate 17. Reference numeral 18 denotes an observation device which is located between the substage 5 and the mount unit 6 and observes the electronic components adsorbed on the nozzles of the mount head 2.
Reference numeral 19 denotes a camera disposed above the mount unit 6 for observing a positional shift of a printed pattern on the substrate 17. The bond supply unit 7 is configured by placing a bond plate 21 on a table 20. 22 is a squeegee for smoothing the liquid level of the bond. The three heads 1 to 3 reciprocate in the horizontal direction by driving means (not shown), the sub-transfer head 1 transfers the electronic components of the supply unit 4 to the sub-stage 5, and the mount head 2 corrects the position at the sub-stage 2. The transferred electronic component is transferred to the substrate 17, and the transfer head 3 transfers the bond of the bond plate 21 to the substrate 17.

FIG. 2 is a cross-sectional view of a main part of the die collet mounted on the mount head 2 in a raised state, and FIG. 3 is a cross-sectional view of the die collet in a lowered state. Reference numeral 20 denotes a die collet provided with a box-shaped suction portion 21 at a lower end thereof, and a rectangular suction hole 22 formed in a lower surface of the suction portion 21. Reference numeral 23 denotes a member for correcting the displacement of the electronic component P provided on the sub-stage 5 and has a key-shaped inner side 23a, and is a driving means (not shown).
, And slides in the xy direction, the key-shaped inner side 23a presses against two sides of the electronic component P, and corrects the positional deviation in the xyθ direction.

Reference numeral 25 denotes a shaft on which the die collet 20 is mounted, 26 denotes a guide pipe thereof, 27 denotes a sleeve slidably mounted on the guide pipe 26, and 28 denotes a coil spring for urging the sleeve 27 upward. Reference numeral 29 denotes an elevator mounted on the upper part of the shaft 25, reference numeral 30 denotes a coil spring for urging the shaft 25 downward, and reference numeral 33 denotes a frame of a mount head. The spring force of the coil spring 28 is greater than the spring force of the coil spring 30. Reference numeral 31 denotes a lifting rod, and 32 denotes a pressing element. As shown in FIG. 1, above the elevating rod 31, there is a lever 41 attached to the rotating shaft 40, and when the rotating shaft 40 rotates, the elevating rod is
The shaft 31 and the die collet 20 are lowered by the lever 31 being pressed downward by the lever 41 and the pressing element 32 being lowered to press the sleeve 27. Make up. 34 is the shaft
25 is a gear mounted on the lower part, 35 is a gear that meshes with this gear 34, 36 is a pulse motor that drives this gear 35,
When the motor 36 is driven, the shaft 25 rotates about the axis in the θ direction, and adjusts the angle of the die collet 20 in the θ direction. Therefore, these 34 to 36 constitute a θ-direction rotating device.

37, 38 are die collets 20 opposed to each other with a lifter 29
A light emitting element and a light receiving element 39 as a landing detection device are a control circuit of the motor 36, and the driving of the motor 36 is stopped by a signal emitted from the light receiving element 38. Shaft 25
In the ascending position, the light-emitting element 37 and the light-receiving element 38 are blocked by the elevator 29, so that light emitted from the light-emitting element 37 does not enter the light-receiving element 38, but the shaft 25 descends, and the When the stage 5 is completely landed, the light emitted from the light emitting element 37 enters the light receiving element 38. In FIG. 2, the substage 5 is depicted as a perspective view for easy understanding.

The present apparatus is configured as described above. Next, a method of adjusting the angle of the die collet 20 in the θ direction will be described.

After moving the correction member 23 to a predetermined position on the substage 5, the mount head 2 is moved onto the substage 5, and the shaft 25 is lowered. Then, if the light emitted from the light emitting element 37 is received by the light receiving element 38, the die collet 20
It is determined that the two sides of the suction section 21 completely land on the sub-stage in perfect agreement with the key-shaped inner side 23a of the correction member 23 (see imaginary lines in FIGS. 4 and 5). When the light receiving element 38 does not receive light, it is determined that the suction unit 21 has landed on the correction member 23 (see solid lines in FIGS. 4 and 5), the motor 36 is driven, and the suction unit 21 rotates in the θ direction. And two sides of the correction member 23
, The suction portion 21 lands on the sub-stage, the light receiving element 38 receives light, and the driving of the motor 36 is stopped by a signal generated from this.

Thus, according to the present apparatus, the suction section of the die collet 20
The angle adjustment in the θ direction can be easily performed so that the two sides 21 match the key-shaped inner side 23a of the correction member 23.
If the suction unit 21 does not land on the sub-stage 5 even when rotated by 360 °, the position of the correction member 23 is considerably shifted. Therefore, in this case, the position adjustment of the correction member 23 is performed again. As a method of adjusting the angle of the die collet 20, a pulse may be sent to the motor 36 until the suction unit 21 lands on the substage 5, and the pulse feed may be stopped when the suction unit 21 lands. As described above, various operation methods of the present apparatus can be considered. In the above embodiment, a multi-head has been described as an example, but a single head having one nozzle may be used.

(Effects of the Invention) As described above, the present invention relates to an electronic component mounting apparatus of this type, in which a mount for a die collet for adsorbing an electronic component to a mount head and a θ for rotating the dicollet about an axis. Since the direction rotating device and the landing detection device that detects that the lower surface of the die collet has landed on the substage are provided, the angle adjustment of the suction part of the die collet can be easily performed.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 and FIG. 3 are cross-sectional views of main parts when the die collet is being raised and lowered, and FIG. FIG. 5 and FIG. 5 are a plan view and a side view during the position adjustment of the die collet. DESCRIPTION OF SYMBOLS 1 ... Sub-transfer head 2 ... Mount head 4 ... Electronic component supply part 5 ... Sub-stage 6 ... Mount part 17 ... Substrate 20 ... Dicollet 23 ... Position shift correction member 25-32 ... Lifting device 34-36… θ-direction rotating device 37, 38… Landing detection device

Claims (1)

(57) [Claims] A sub-transfer head for transferring an electronic component from a supply section of the electronic component to a sub-stage provided with a member for correcting a displacement of the electronic component, and the electronic component is transferred from the sub-stage to a substrate positioned on a mount. In the electronic component mounting device having a mount head to perform, the mount head, a die collet lifting device that sucks the electronic component,
An electronic component mounting apparatus, comprising: a θ-direction rotating device that rotates a die collet around an axis; and a landing detection device that detects that the lower surface of the die collet has landed on the substage.