JP2725701B2 - Electronic component mounting equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION (Industrial application field) The present invention relates to an electronic component mounting apparatus, in which a flip chip is turned upside down, its positional displacement is corrected, and the flip chip is transferred and mounted on a substrate. is there.

(Prior Art) As an electronic component, a flip chip in which a bump (protruding electrode) is provided on a die by soldering or the like is known. 4th
The figure shows a conventional means for mounting a flip chip of this type on a substrate. A flip chip 102 is provided on the lower surface of a wafer 101 with a surface on which a bump 103 is formed as a front surface. Is held in hand, and while visually recognizing the working point by the microscope 105, the chip 102 is pushed down by the pins 106 and mounted on the substrate 107.

(Problems to be Solved by the Invention) However, since the above-mentioned conventional means is a manual operation, there is a problem that mounting efficiency and mounting accuracy are not improved.

Accordingly, an object of the present invention is to provide an electronic component mounting apparatus capable of mounting a flip chip mounted on a wafer or the like with a bump forming surface on a substrate at a high speed and with high accuracy.

(Means for Solving the Problems) For this purpose, in the present invention, a plurality of flip chips arranged on a first level with a bump formation surface facing upward are moved in a horizontal direction to select one of the flip chips, and a first level is selected. An electronic component mounting apparatus mounted on a substrate positioned at a second level higher than a level, comprising: a chip supply unit for horizontally moving a flip chip at a first level; and a flip chip moved by the chip supply unit. And a flip-up device that raises one of the first and second flip-chips from the first level to approach the second level while taking up and flipping the flip chip by a suction unit, and a flip chip flipped upside down at the second level. A mounting head that adsorbs the non-bump forming surface to the lower end of the nozzle, takes it up and mounts it on the substrate, and a lower end of the nozzle of the mounting head A camera that horizontally moves relative to the flip chip adsorbed on the camera, observes the flip chip from below, and detects a displacement in the X, Y, and θ directions. A horizontal movement device is provided for correcting a displacement between the X direction and the Y direction detected by the camera by horizontally moving relative to the substrate, and the mounting head is provided with the nozzle at its axis. And a θ-direction driving device for correcting a position shift in the θ-direction detected by the camera by rotating the camera around the center.

(Operation) In the above configuration, the front / back inverting device takes up a flip chip mounted on a chip supply unit such as a wafer to invert the flip chip, and raises the flip chip from the first level to the second level. Next, the nozzle of the mounting head attracts the flip chip, which is turned upside down at the second level, on the non-bump-formed surface of the flip chip to take it up.
The direction displacement is detected from below. Next, the horizontal direction moving device and the θ direction driving device are driven, and the X direction, the Y direction, θ
After correcting the misalignment in the direction, the flip chip is mounted on the substrate.

Example Next, an example of the present invention will be described with reference to the drawings. FIG. 1 shows an electronic component mounting apparatus.
Is a table, and 2 is a main body box installed on the table. Reference numeral 3 denotes a transport path for a substrate 4 composed of an endless chain, and the substrate 4 on which electronic components are mounted is loaded on the table 1 and is unloaded therefrom. Reference numeral 14 denotes a positioning portion of the substrate 4 provided in the transport path 3, which is formed of a clamp plate. Reference numeral 5 denotes a wafer serving as a chip supply unit disposed on a base 13 in front of the conveyor 3, and a large number of flip chips are provided on the upper surface thereof. The level at which the wafer 5 is provided is called a first level L1.

Reference numeral 6 denotes a mounting head, from which a nozzle 6a for vacuum-sucking a flip chip projects. 8 and 9 X
XY direction moving devices as horizontal moving devices for horizontally moving in the direction and the Y direction, and 10 and 11 are driving motors thereof.

Reference numeral 18 denotes a .theta.-direction driving device mounted on the mounting head 6, which comprises a motor 18a and a belt 18b, and rotates the nozzle 6a in the .theta.-direction around its axis. Reference numeral 17 denotes a camera integrally mounted on the mounting head 6, which moves integrally with the mounting head 6 and observes a displacement or the like of a print pattern on the substrate 4. Reference numeral 7 denotes a die ejector disposed below the wafer 5, and reference numeral 7a denotes a pin thereof. The flip chip on the wafer 5 is pushed up by the pin 7a. Reference numeral 20 denotes a box on the side of the wafer 5 in which the flip-chip reversing device is stored, 21 denotes a visual inspection device,
Next, these will be described in detail with reference to FIG.

Reference numeral 22 denotes a front / back reversing device disposed inside the box 20, reference numeral 23 denotes a fan-shaped gear, reference numeral 24 denotes a gear that meshes with the gear 23 and rotates along the gear, and reference numeral 25 denotes a rotating rod. 26
Is an arm extending from the gear 24, and a suction part 27 is attached to the tip of the arm. F denotes a flip chip mounted on the wafer 5, B denotes a bump thereof, and the flip chips F are arranged side by side on the wafer 5 of the first level L1 with the bump forming surface facing the surface. The nozzle 6a of the mounting head 6 approaches the flip chip F which has been turned upside down by the upside down device 22 and sucks up on the bump non-formed surface to take up.

The visual inspection device 21 includes a camera 21a, an eyepiece 21b, and a light source 21c. The mounting head 6, which has taken up the flip chip F, is driven by the XY direction moving devices 8, 9 and moves on the eyepiece 21b, temporarily stops there, observes the flip chip F from below, and moves the flip chip F in the X direction. Detects displacement in the Y and θ directions. Reference numeral 30 denotes a control device such as a computer, which is connected to the cameras 17 and 21a, and controls each of the motors 10, 11, and 18a as a device for correcting a displacement of the flip chip F based on the observation result. .

The present electronic component mounting apparatus has the above configuration, and the operation will be described next. First, the XY direction moving devices 8 and 9 are driven to move the camera 17 above the substrate 4 positioned by the positioning unit 14, and the positional deviation of the print pattern printed on the substrate 4 is detected. In FIG. 2, when the arm 26 is rotated clockwise by the drive of the motor M and the suction portion 27 at the tip thereof approaches the wafer 5, the pins 7a of the lower die ejector 7 protrude and the wafer 5 The upper flip chip F is pushed up, and the suction section 27 sucks the flip chip F to take up the flip chip F (the reference numeral in the drawing). Next, the arm 26 is rotated counterclockwise to a position shown by a chain line, and the flip chip F is turned upside down to the first position.
Increase from level L1 to second level L2 (sign).

Then, the mounting head 6 and the nozzle 6a approach each other to take up the flip chip F (reference numeral). In this case, since the flip chip F is turned upside down as described above, the flip chip F is sucked by the nozzle 6a with the bump forming surface facing down.

As described above, at the first level L1, the flip chip F is sucked up by the suction portion 27 and taken up, and the arm 26 is rotated in the counterclockwise direction from the solid line position to the position indicated by the dashed line, whereby the flip chip F is moved. The flip chip F is raised and lowered from the first level L1 to the second level L2, which is higher than the first level L2, and transferred to the mounting head 6 at the second level L2. The distance is gained by the height difference H. Accordingly, the vertical stroke for the nozzle 6a of the mounting head 6 waiting above to take up the flip chip F can be shortened, and the tact time can be shortened accordingly.

Next, the mounting head 6 moves to the visual inspection device 21 to move the eyepiece unit.
After temporarily stopping above 21b, the displacement of the flip chip F adsorbed by the nozzle 6a in the X, Y, and θ directions is observed (indicated by,). Next, the mounting head 6 moves onto the substrate 4 positioned by the positioning section 14, where the nozzle 6a moves up and down to move the flip chip F to the substrate 4.
(Sign). In this case, the positional deviation in the X, Y, and θ directions detected by the visual inspection device 21 as described above, and the X, Y, and θ directions of the print pattern of the substrate 4 detected by the camera 17 in advance. Of the positional deviations, the positional deviations in the X and Y directions are corrected by driving the XY direction moving devices 8 and 9 to horizontally move the mounting head 6 in the X and Y directions, and the positional deviation in the θ direction. The flip chip 6 is mounted on the substrate 4 after correcting by rotating the nozzle 6a by θ by driving the θ direction driving device 18.

As described above, according to this means, the flip chip F mounted on the wafer 5 with the bump formation surface facing upside down can be flipped upside down to correct the position, and then mounted on the substrate 4 with high accuracy. The flip chip F may be mounted on the tray 28 as shown in FIG.

(Effects of the Invention) According to the present invention, a flip chip mounted on a chip supply unit with a bump forming surface facing up is taken up and turned upside down to ascend from a first level to a second level. At the level, it takes up by sucking to the lower end of the nozzle of the mounting head, observes the flip chip with a camera from below, detects the displacement in the X, Y, and θ directions, and detects the detected displacement. Of which X
The displacement in the Y direction and the displacement in the Y direction are corrected by a horizontal moving device, and the displacement in the θ direction is corrected by driving the θ direction driving device to rotate the nozzle around its axis, and then to the substrate. Since the mounting is performed, the tact time required for the entire operation can be shortened, and the flip chip can be mounted on the substrate at high speed with good workability and high positional accuracy.

[Brief description of the drawings]

FIG. 1 is an overall perspective view of an electronic component mounting apparatus according to one embodiment of the present invention, FIG. 2 is a development view showing a working state in this embodiment, and FIG. 3 is another embodiment of a chip supply section in this embodiment. FIG. 4 is a side view of the conventional means. 4 Substrate 5, 28 Chip supply unit 6 Mounting head 10, 11, 18a Position deviation correction device 21 Appearance inspection device 22 Front / reverse inversion device 30 Control device B Bump F ...... Flip chip

Claims (1)

(57) [Claims] 1. A plurality of flip chips arranged on a first level with a bump forming surface facing upward are moved in a horizontal direction to select one of the flip chips and positioned at a second level higher than the first level. An electronic component mounting apparatus mounted on a substrate, comprising: a chip supply unit for horizontally moving a flip chip at a first level; and a suction unit for sucking one of the flip chips moved by the chip supply unit by a suction unit. An upside down reversing device that rises from the first level to approach the second level while upside down and turning over;
A mounting head for sucking the flip-chip non-bump-forming surface turned upside down at the second level at the lower end of the nozzle, taking it up and mounting it on the substrate, and being sucked at the lower end of the nozzle of the mounting head. A camera that horizontally moves relative to the flip chip, observes the flip chip from below, and detects a displacement in the X direction, the Y direction, and the θ direction. A horizontal movement device that corrects the displacement between the X direction and the Y direction detected by the camera by relatively moving the nozzle relative to the mounting head; An electronic component mounting apparatus, comprising: a θ-direction driving device for correcting a position shift in the θ direction detected by the camera by rotating the electronic component mounting device.