JPH10326807A - Solder ball mount equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To confirm the position of a target mark or land position on which a solder ball is mounted, to confirm the residual amount of solder balls and to confirm whether a solder ball has been placed on a substrate by holding an image recognition camera with a holding body as same as that for a solder ball absorption head. SOLUTION: A solder ball mount equipment has a mount head group 2, a solder ball absorption head 13, a flux transfer head 14, and an image recognition camera 15 fixed in the same head base 16 in the group 2. The head base 16 performs the position control in X and Y-directions for the solder ball absorption head 13, a flux transfer head 14, and an image recognition camera 15, by controlling the movement in X-axis direction and Y-axis direction by an XY-axes drive mechanism 20. The image recognition camera 15 is not only movable in the XY-axis directions together with its base 16 as a single body but also independently has a Z-axis drive mechanism (motions in the vertical direction).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to positioning of a board by soldering before solder ball mounting by image recognition and inspection after ball mounting, confirmation of the remaining amount of solder balls, and residual flux. The present invention relates to a solder ball mounting device capable of performing an accompanying inspection such as confirmation of an amount using the same image recognition camera.

[0002]

2. Description of the Related Art A conventional solder ball mounting apparatus recognizes a target mark or the like on a substrate before mounting a solder ball.
The position was corrected on the XY table, and then the solder balls were mounted. Further, after the solder balls are mounted, the solder ball mounting inspection is performed by image processing in another station or a completely different unit.

Accordingly, the conventional solder ball mounting apparatus requires two cameras, an image recognition camera for board recognition and an image recognition camera for solder ball mounting inspection, and respective controllers. Furthermore, in a solder ball mounting inspection on a substrate having no target mark or the like, only the relative position is visible because the substrate itself is moving, and a positional shift with respect to a land (a ball mounting position on the substrate) cannot be inspected.

[0004]

SUMMARY OF THE INVENTION According to the present invention, a single image recognition camera is used for positioning by image recognition of a board before solder ball mounting and inspection after solder ball mounting, as well as for checking the remaining amount of solder balls and flux. In addition to performing the accompanying inspection such as checking the remaining amount, the positioning of the board and the inspection of the mounting of the solder ball can be performed in the same place, and the absolute position can be detected even when there is no target mark etc. An object of the present invention is to provide a solder ball mounting device capable of performing a ball tower mounting inspection.

[0005]

In order to solve the above problem, in a solder ball mounting apparatus for mounting a solder ball at a predetermined position on a substrate, an image recognition camera is held by the same holding member as a solder ball suction head. Then, the same image recognition camera checks the position of the target mark on the board or the land position where the solder ball is mounted, the remaining amount of the solder ball, and whether the solder ball is properly mounted on the board. And a solder ball mounting device characterized by performing the following. Among the items to be confirmed by the above-mentioned image recognition camera, one for confirming the remaining amount of flux instead of confirming the remaining amount of solder balls, and one for confirming both remaining amounts are also provided.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of the present invention will be described below together with a first embodiment. The solder ball mounting apparatus has a mount stage 1 shown in FIG. 2 and a mount head group 2 shown in FIG. As shown in FIG. 2, the mount stage 1 includes, as main elements, a substrate 3 on which a solder ball is to be mounted, a substrate stage 6 on which the substrate 3 is fixedly mounted, a solder ball supply tray 4, and a flux supply tray 5. ing.

[0007] Further, an input conveyor 7 and an output conveyor 8 for carrying in and out the substrate 3 are arranged on the mount stage 1. Is mounted on the output conveyor 8
The substrate transfer units 9 and 10 for unloading are arranged. In FIG. 2, reference numeral 11 denotes a missing ball detecting light source, and reference numeral 12 denotes a flux squeegee. The missing ball detection light source 11, the solder ball supply tray 4, the substrate stage 6, and the flux supply tray 5 are arranged at regular intervals in this order.

On the other hand, as shown in the front view of FIG. 3, the mount head group 2 has a solder ball suction head 13, a flux transfer head 14, and an image recognition camera 15 fixed to the same head base 16. Head base 16
Corresponds to the holder described in the claims. The solder ball suction head 13, the image recognition camera 15, and the flux transfer head 14 are arranged at positions and intervals corresponding to the solder ball supply tray 4, the substrate 3, and the flux supply tray 5, respectively.

The head base 16 is driven by an XY-axis driving mechanism 20 in the X-axis direction (left-right direction in FIG. 3) and the Y-axis direction (FIG. 3).
The position of the solder ball suction head 13, the flux transfer head 14, and the image recognition camera 15 in the XY directions is controlled by controlling the movement of the solder ball suction head 13, the flux transfer head 14, and the image recognition camera 15. In the figure, 21 is an X-axis drive motor, and 22 is a Y-axis drive motor.

The solder ball suction head 13, the flux transfer head 14, and the image recognition camera 15 can not only move in the X and Y directions integrally with the base 16 but also independently move in the Z direction.
It has a shaft drive mechanism (movement in the vertical direction in FIG. 3), and the Θ drive mechanism (rotation in the horizontal direction) includes the solder ball suction head 13 and the flux transfer head 14. FIG. 4 shows the Z-axis drive mechanism 23 and the Θ drive mechanism 24 of the solder ball suction head 13. The Z-axis drive mechanism of the flux transfer head 14, the Θ drive mechanism, and the Z-axis drive of the image recognition camera 15 are shown. The mechanism has almost the same configuration. In the figure, 25 is a Z-axis drive motor, and 26 is a Θ drive motor. The image recognition camera 15 is equipped with image recognition cameras 17 and 18 below and on the front end of the lens. The image recognition camera light sources 17 and 18 may have a Z-axis drive mechanism independently of the image recognition camera 15.

The operation procedure will be described below with reference to the operation explanatory diagram shown in FIG. First, FIG. 1A shows a board recognition state. As an operation before reaching this state, the board 3 is introduced into the mount stage 1 by the input conveyor 7 and is transferred from the input conveyor 7 to the board stage 6 by the board transfer unit 9. Then, it is positioned and fixed at the mount position.

Here, the position of the substrate 3 is recognized by the image recognition camera 15 and the light source 18 for the image recognition camera. Recognition of the position of the substrate 3 is performed by recognizing the position of a target mark on the substrate 3 or the position of a land on the substrate 3 on which a solder ball is mounted. According to the result, the XY position correction by the XY axis driving mechanism 20 and the solder ball suction head 1
3. Θ correction by rotation of the flux transfer head 14 is performed. Thereafter, as shown in FIG. 1B, the solder ball suction head 13 and the flux transfer head 14 descend to perform the suction of the solder ball and the supply of the flux.

Next, the mount head group 2 is moved by the XY-axis driving mechanism 20 so that the flux transfer head 14 is positioned above the substrate 3 as shown in FIG. I do. At this time, since the image recognition camera 15 is located above the solder ball supply tray 4, the image recognition camera light source 18 is switched to 17 to check the remaining amount of the solder balls. At the same time, the solder ball suction head 13 is connected to the missing ball detecting light source 1.
1, the solder ball suction inspection is performed.

The remaining amount of the solder balls is confirmed by irradiating with the light source 17 for the image recognition camera and confirming the remaining amount of the solder balls in the solder ball supply tray 4 from above by the image recognition camera 15. If the bottom and side surfaces inside the solder ball supply tray 4 are painted black, the solder balls are silver. Therefore, if the solder balls are sufficient in the ball supply tray 4, the solder balls will be bright and will be bright by the binarization processing of the image processing apparatus. Can be detected when it is determined that there is a large number.

Next, as shown in FIG. 1D, the solder ball suction head 13 is moved above the substrate 3 by the XY axis driving mechanism 20, and then descends to mount the solder balls on the substrate 3. At this time, the image recognition camera 15 is located above the flux supply tray 5 and checks the remaining flux.

The remaining amount of the flux is confirmed by irradiating the light source 17 for the image recognition camera and checking the remaining amount of the flux on the flux supply tray 5 from above by the image recognition camera 15. The flux supply tray 5 is made of stainless steel. Because the inner bottom surface is silver color, and the flux is usually colored, the flux layer becomes thinner when the remaining amount of flux decreases, gradually the silver color of the bottom surface appears, becomes brighter, and image processing The remaining amount of the flux can be detected by the area of the light portion by the binarization processing of the apparatus. The inner bottom surface of the flux supply tray 5 may be black depending on the color of the flux.

Thereafter, as shown in FIG. 1E, the image recognition camera 15 is moved to the first camera position above the substrate 3 by the XY axis driving mechanism 20, and
Then, a solder ball mounting test is performed according to Step 5. The confirmation of the solder balls mounted on the substrate 3 includes checking for solder ball mounting leakage, solder ball mounting position failure, solder ball overloading, solder ball size defect, solder ball appearance defect, and the like.
The board 3 after the confirmation is transferred to the output conveyor 8 by the board transport unit 10 and carried out.

In the present embodiment, the drive in the XY direction is performed by the drive mechanism of the mount head group 2. A mount stage is formed on the Θ table on the XY table, and the drive mechanism is driven by the drive mechanism on the substrate 3 side. You may. Further, a drive mechanism in the XY axis direction is provided on the substrate stage 6, and only the drive mechanism is mounted on the solder ball suction head 13 of the mount head group 2.
Alternatively, the flux transfer head 14 may be provided.

In the above embodiment, the flux transfer head 14 is used.
This is an example of a solder ball mounting device which is separately equipped, but when a flux transfer pin is not required, the flux transfer head 14 is unnecessary, and the flux is directly transferred to the solder ball by the operation of the solder ball suction head 13. It may be a method.

The operation in this case is shown in FIG. 5 and FIG. In the example of FIG. 5, first, the image recognition camera 15
(FIG. 5A), and then adsorbs the solder ball (FIG. 5A).
B), flux is applied to the solder balls (FIG. 5C),
The solder balls are mounted on the substrate 3 (FIG. 5D). Thereafter, the operation procedure is such that the remaining amount of the flux is confirmed (FIG. 5E), the mounting of the solder ball is confirmed (FIG. 5F), the substrate 3 is carried out, and the remaining amount of the solder ball is confirmed (FIG. 5G).

In the third embodiment shown in FIG. 6, the positional relationship between the solder ball suction head 13 and the image recognition camera 15 is as follows.
This is a mount head group 2 set under the same conditions as the positional relationship between the substrate 3 and the flux supply tray 5, and the image recognition camera 15 first recognizes the substrate 3 (FIG. 6).
A) Then, the solder balls are adsorbed (FIG. 6B), flux is attached to the solder balls (FIG. 6C), and then the solder balls are mounted on the substrate 3. At the same time, the remaining flux is checked (FIG. 6B). 6D), confirm solder ball mounting (FIG. 6)
E). Thereafter, the operation procedure is such that the substrate 3 is transported and the remaining amount of the solder balls is confirmed (FIG. 6F).

Although the first to third embodiments use the mount stage 1 shown in FIG. 2, the mount stage 1 is not limited to this. It can also be used in the mount stage 1. Also in this case, as shown in FIG. 8, the same mount head group 2 as the previous example can be used.

If an example of the operation procedure in the mount stage 1 in FIG. 7 is shown, the substrate 3 is introduced, the substrate 3 is moved to the mount position, and the position is determined by clamping. At this time, the flux transfer head 14 and the solder ball suction head 13 simultaneously perform flux supply and solder ball suction. The solder ball suction head 13 receives the missing ball detection light source 11 and performs a missing inspection and a double ball inspection. If the inspection fails, the sucked solder balls are returned to the solder ball discharge box 27.

XY axis drive mechanism 20 of mount head group 2
, The image recognition camera 15 moves above the board 3 which is a camera position, recognizes the position of the board 3 by the image recognition camera 15, and according to the result, the XY-axis driving mechanism 2
XY position correction using 0 is performed. The position correction is also performed by Θ correction by rotation of the solder ball suction head 13 and the flux transfer head 14. Note that the position recognition performed here is the same as in the first embodiment.

Subsequently, the flux transfer head 14 is moved to the flux position of the substrate 3 by the XY-axis drive mechanism 20, and transfers the flux. Further, the XY-axis drive mechanism 20 moves the solder ball suction head 13 to a ball position on the substrate 3, and mounts the solder ball on the substrate 3. Then, the image recognition camera 15 is moved to the above-mentioned camera position by the XY-axis drive mechanism 20, and performs a solder ball mounting inspection on the substrate 3.

Thereafter, the image recognition camera 15 is moved to the solder ball supply tray 4 at the ball tray position by the XY axis drive mechanism 20, and the image recognition camera 15 confirms the remaining amount of the solder balls. 1
5 is moved to the flux supply tray 5 which is a flux tray position, and the remaining amount of the flux is confirmed by the image recognition camera 15.

Thus, one cycle of the operation is completed, and the XY-axis driving mechanism 20 returns to the origin. Subsequently, the steps from the step of sucking the flux supply ball corresponding to the mounting position are repeated.

[0028]

The present invention has the following effects.
First, since the image recognition camera is held on the same holder as the solder ball suction head, it moves onto the solder ball supply tray or the flux supply tray on the mount stage without providing an independent drive mechanism. According to the first aspect of the present invention, the remaining amount of the solder balls can be confirmed by one image recognition camera.
According to the invention, the remaining amount of flux can be confirmed, and in the invention of claim 3, both remaining amounts can be confirmed.

Second, if various kinds of driving are performed by the solder ball suction head and the image recognition camera, the recognition of the board, the position correction accompanying the same, and the inspection after the solder ball is mounted can be performed without moving the board. The absolute position can be detected even on a substrate having no mark, and accurate solder ball mounting inspection can be performed.

[Brief description of the drawings]

FIG. 1 is a diagram illustrating the operation of a first embodiment according to the present invention.

FIG. 2 is a plan view of a mount stage.

FIG. 3 is a front view of a mount head group.

FIG. 4 is a side view of a solder ball suction head.

FIG. 5 is an operation explanatory diagram of a second embodiment of the present invention.

FIG. 6 is an operation explanatory diagram of a third embodiment of the present invention.

FIG. 7 is a plan view showing another example of the mount stage.

FIG. 8 is a plan view showing a relationship between the stage and a mount head group.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mount stage 2 Mount head group 3 Substrate 4 Solder ball supply tray 5 Flux supply tray 6 Substrate stage 7 Input conveyor 8 Output conveyor 9, 10 Substrate transfer unit 11 Missing ball detection light source 12 Flux squeegee 13 Solder ball suction head 14 Flux Transfer head 15 Image recognition camera 16 Head base 17, 18 Light source for image recognition camera 20 XY axis drive mechanism 21 X axis drive motor 22 Y axis drive motor 23 Z axis drive mechanism 24 Θ Drive mechanism 25 Z axis drive motor 26 Θ drive motor 27 Solder ball discharge box

Claims (3)

[Claims] In a solder ball mounting apparatus for mounting a solder ball at a predetermined position on a substrate, an image recognition camera is held by the same holder as a solder ball suction head, and the image recognition camera is mounted on the substrate by the same image recognition camera. A solder ball characterized by confirming the position of the target mark or the land position where the solder ball is mounted, checking the remaining amount of the solder ball, and checking whether the solder ball is properly mounted on the substrate. Mounting device. 2. In a solder ball mounting apparatus for mounting a solder ball at a predetermined position on a substrate, an image recognition camera is held by the same holder as a solder ball suction head, and the image recognition camera is mounted on the substrate by the same image recognition camera. A solder ball mount characterized by checking the position of the target mark or the land position where the solder ball is mounted, checking the remaining amount of flux, and checking whether the solder ball is properly mounted on the board. apparatus. 3. A solder ball mounting apparatus for mounting a solder ball at a predetermined position on a substrate, wherein the image recognition camera is held by the same holder as the solder ball suction head, and the image recognition camera is mounted on the substrate by the same image recognition camera. Check the target mark position or land position where the solder ball is mounted, check the remaining solder ball, check the remaining flux, and check whether the solder ball is properly mounted on the board. A solder ball mounting apparatus.