JP2874386B2 - Board appearance inspection method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for inspecting the appearance of a substrate for performing an appearance inspection using a camera and a bad mark with a bad marker with good workability.

[0002]

2. Description of the Related Art After an electronic component (hereinafter, referred to as a chip) is mounted on a substrate by an electronic component mounting apparatus, a board inspection such as a displacement of the chip, a missing item, and a soldered state is performed. Conventionally,
This board inspection is generally performed visually by an operator, but in recent years, an automatic inspection using an optical unit such as a camera or a laser device has been gradually performed.

FIG. 4 shows a conventional board inspection apparatus. In the figure, reference numeral 101 denotes a conveyor for transferring a board S (S1, S2), on which a chip P is mounted. An XY table 103 has a camera 104 and a bad marker 105 mounted thereon.

[0004] This apparatus inspects a position shift, a missing item, a good soldering state, and the like of the chip P on the substrate S1 while driving the XY table 103 to move the camera 104 in the XY directions.

When the appearance inspection by the camera 104 is completed, the XY table 103 is driven again, and while the bad marker 105 is moved in the XY directions, a bad mark is added to the defective chip on the substrate S1. I have.

[0006] In this way, the substrate S1 for which the substrate inspection has been completed is conveyed to a separator (not shown) by the conveyor 101, and is separated into a non-defective substrate and a defective substrate by the separator. And to be collected.

[0007]

However, in the above-mentioned conventional means, after the appearance inspection by the camera 104 is completed, the defective product is marked with the bad marker 105 at the same stage as the appearance inspection. The substrate S2 for the next inspection has to wait on the carry-in side, and this standby time becomes a loss time, and there is a problem that the working efficiency is not improved.

Therefore, an object of the present invention is to provide means capable of solving the above-mentioned problems of the conventional means.

[0009]

For this purpose, the present invention is to move two substrates, that is, a substrate to be subjected to an appearance inspection and a substrate to which a bad mark is to be provided after the appearance inspection is completed, in the XY directions together.
An XY table , a camera above the target board for the visual inspection, and a camera for capturing a plurality of chips mounted on the board into a field of view, and a camera above the target board for the bad mark, Judged as defective by the above visual inspection
Of a board using a board appearance inspection apparatus, comprising: a bad marker for giving a bad mark to the chip thus obtained; and an XY direction moving device for moving the bad marker in at least the area corresponding to the field of view of the camera in the XY directions . Outside
A visual inspection method, wherein the XY table is driven to
Move the two substrates together in the X and Y directions, and
Multiple chips on the target board within the field of view of the camera
While inspecting the appearance of these chips,
With respect to the substrate to be provided with the bad mark,
Drive the moving device to move the bad marker in the X and Y directions.
And move it to the position corresponding to the
Bad marks for chips determined to be bad
I gave it .

[0010]

According to the above construction, the substrate is observed by the camera, and the appearance of the chip is inspected for each field of view of the camera. While the visual inspection of the chip in the field of view of the camera is performed in this way, the bad marker moves in the XY direction in an area corresponding to the field of view of the already inspected substrate, and the bad marker is attached to the defective chip in this area. Marks are added.

[0011]

Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a perspective view of a visual inspection apparatus. Reference numeral 1 denotes an XY table including an XY table 1A and a Y table 1B, on which a positioning unit 2 is provided.
MX is an X motor, and MY is a Y motor.

The positioning unit 2 includes two substrates S1 and S2
Is positioned. One substrate S1 is a substrate for which the appearance inspection has been completed, and a bad mark is given to a defective chip. The other substrate S2 is a substrate on which an appearance inspection is performed. The substrates S1 and S2 are of the same type, and the same chips P (P1 to Pn) are mounted on the respective substrates S1 and S2 at the same coordinate positions.

Reference numeral 3 denotes a camera, which is disposed above the substrate S2.
Inspect the soldering condition. Reference numeral 4 denotes a bad marker, which is held by the XY direction moving device 5. The bad marker 4 is located above the substrate S1 and has a defective chip P
Is given a bad mark B (see also FIG. 3).

In FIG. 2, A (A1 to A4) is the field of view of the camera 3 on the substrate S2.
The images of a plurality of chips P in the inside are taken in and the appearance inspection is performed. The visual fields A1 to A4 are switched by driving the XY table 1 and moving the substrate S2 in the XY directions.

In FIG. 2, A '(A'1 to A'4)
Is an area on the substrate S1 corresponding to the fields of view A1 to A4. When the XY direction moving device 5 drives the bad marker 4, X in each of the areas A ′ 1 to A ′ 4 is moved.
Moving in the Y direction, a bad mark B is given to the defective chip P.

In this apparatus, the target substrate S2 to be subjected to the appearance inspection and the target substrate S1 to which the bad mark is to be attached are jointly positioned by the positioning unit 2.
And the XY table 1 is driven to move together in the XY directions. Therefore, when the camera 3 performs, for example, the appearance inspection of the chips P1 and P2 in the visual field A1, by driving the XY direction moving device 5, the bad marker 4 moves the area A′1 corresponding to the visual field A1. The chip is moved in the XY directions, and a bad mark B is given to a chip which has been previously determined to be defective by an appearance inspection of the camera 3.

Similarly, when the camera 3 performs the appearance inspection of the chips P3 to P5 in the field of view A2, the bad marker 4 gives the bad mark B to the corresponding defective chip in the area A'2. .

According to this means, the camera S3 is used for the substrate S2.
While performing the visual inspection of the upper chip P for each visual field A, XY
By driving the direction moving device 5, at the same time,
Since the bad mark B can be added to the defective chip on the substrate S1 whose appearance has been inspected, the workability is extremely good. Moreover, since the bad marker 4 only needs to be able to move within the area A 'corresponding to the field of view A of the camera 3, the moving stroke of the XY direction moving device 5 may be short, so that not only the XY direction moving device 5 can be downsized, Since the moving stroke of the bad marker 4 in the XY directions is short, the bad mark B can be provided at a high speed.

[0020]

As described above , according to the present invention , the substrate to be subjected to the appearance inspection and the substrate to be provided with the bad mark are XY.
While moving the XY directions together by table look
Inspection of the appearance of the chip on the substrate to be inspected and the addition of a bad mark to the chip determined to be defective by this appearance inspection
In parallel, Ru can be performed with good workability at the same time. Moreover, the size of the XY-direction moving device for moving the bad marker can be reduced, and the bad mark can be provided at a high speed.

[Brief description of the drawings]

FIG. 1 is a perspective view of a visual inspection device according to the present invention.

FIG. 2 is a plan view of a visual inspection device according to the present invention.

FIG. 3 is a front view of a visual inspection device according to the present invention.

FIG. 4 is a perspective view of a visual inspection device according to a conventional means.

[Explanation of symbols]

 2 Positioning unit 3 Camera 4 Bad marker 5 XY direction moving device A Field of view A 'area S Substrate P Chip

Claims (1)

(57) [Claims] 1. An object board for appearance inspection and an appearance inspection are completed.
The two substrates of the target substrate to which the bad mark is to be added together by X
An XY table to be moved in the Y direction, a camera above the target board for the visual inspection, and a camera for capturing a plurality of chips mounted on the board into a field of view, and a camera above the target board for the bad mark addition, The above visual inspection on this board
A bad marker conferring bad marks on chips judged to be defective in this XY direction moving device for a bad marker move within the area corresponding to at least the camera field of view in the XY direction and the appearance inspection device for the substrate having a For
A method for inspecting the appearance of a substrate, wherein the XY table is
Drive to move the two substrates together in the XY directions
The multiple chips on the target board
Into the field of view of the camera for visual inspection of these chips
While performing the process,
And driving the XY-direction moving device to move the bad marker
Move the camera in the XY directions and move it to a position
For chips that were determined to be defective in the above visual inspection
A base characterized by providing a bad mark
Board appearance inspection method .