JP2002176295A - Part mounting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a part mounting device wherein a reflecting part is provided for precision mounting of a part. SOLUTION: There are provided a part recognizing means 5 which recognizes the image on a part supply head 4 side, a substrate recognizing means 12 which recognizes the sight field in the direction opposite to the part recognizing means 5 to recognize the image on a substrate 7 side, and a reflecting part 11 which reflects an incident optical flux to project it in the direction opposite to the incident direction. The board recognizing means 12 recognizes an image on the part supply head 4 side through the reflecting part 11. The reflecting part 11 allows both the part recognizing means 5 and the board recognizing means 12 to recognize the same reference point on the part supply head 4. So, the dislocation amount of the part recognizing means 5 and the board recognizing means 12 is precisely calculated. With the calculated data used, the correction amount of a part 2 and the board 7 in a production process is precisely calculated.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a component mounting apparatus for mounting a component such as an electronic component on a circuit formed body such as an electronic circuit board.

[0002]

2. Description of the Related Art Conventionally, an IC with a bump (protruding electrode) is provided.
2. Description of the Related Art A component mounting apparatus is used to mount a (semiconductor integrated circuit) on a substrate on which a circuit is formed. FIG. 11 is a perspective view of an example of a conventional component mounting apparatus, and FIG.
It is a perspective view which shows the principal part of. The component supply unit 110 is supplied with a large number of ICs 111 that are divided and held by an expand plate 112. These IC111
Is recognized by the supply unit recognition camera 113, and the component 111a to be mounted next is positioned at a predetermined position under the control of the control device 170 based on the recognition information.

[0003] Next, the component delivery head 120 is
It moves to just above 11a, descends and sucks the component 111a, then ascends and moves rightward on the X-axis to the component delivery position as shown by the arrow 114. After that, the component delivery head 120 is turned upside down as shown by the arrow 121, and holds the sucked component 111a in the opposite direction. This is because the IC 111 supplied to the component supply unit 110
The reason for this is that the bumps are held with the bumps facing upward, so that the bumps are transferred to the component mounting head 130 with the surfaces to be joined facing downward in preparation for later mounting. The component mounting head 130 descends, approaches the IC 111a from above, sucks the IC 111a, and moves toward the component mounting position in the right direction on the X axis.

On the other hand, the component delivery head 120 that has completed the delivery of the IC 111a moves to the left on the X-axis and starts the next component suction operation. FIG. 12 illustrates a state where the component delivery head 120 faces the component mounting head 130 at the component delivery position.

While the above operation is being performed, the circuit forming body 151 is supplied to the circuit forming body holding section 150 and is positioned at a predetermined position, and has been moved to a position facing the circuit forming body 151. The reference position formed on the circuit body 151 is recognized by the circuit body recognition camera 160, and the information is sent to the control device 170. As shown in FIG. 12, the circuit-formed body recognition camera 160 is mounted on the recognition optical head 180 together with the component recognition camera 140.

The recognition optical head 180 that has completed the reference position recognition of the circuit forming body 151 moves to the left on the X-axis and thereafter moves to the right on the X-axis.
Stop at a position where they approach each other and approach each other.

At the stopped position, the holding state of the component 111 a sucked and held by the component mounting head 130 is checked by the component recognition camera 140 mounted on the recognition optical head 180.
And the recognized information is sent to the control device 170. At this time, the component mounting head 1 that has absorbed the component 111a
The 30 nozzles are lifted upward in the Z-axis direction so that they do not interfere with the component recognition camera 140 and the picked-up component 111a is within the field of view of the component recognition camera 140.

When the recognition operation is completed, the component 111
The component mounting head 130 that has sucked “a” starts to move rightward again on the X axis toward the component mounting position. During this movement, the control device 170 uses the recognition information of the holding state of the component 111a and the recognition information of the reference position of the circuit formation body 151 to mount the component 111a at a predetermined position of the circuit formation body 151. The required moving distance of the component mounting head 130 in the X-axis direction, the θ rotation amount of the nozzle holding the component 111a around the Z axis, and the correction amount of the regulated position of the circuit forming body 151 are calculated.

The moving component mounting head 130 is stopped after reaching a predetermined position facing the circuit formed body whose position has been corrected in the Y-axis direction in accordance with a command from the control device 170 based on the calculation result. Next, the component mounting head lowers the nozzle holding the component 111a and mounts the component 111a at a predetermined position on the circuit forming body 151.

[0010]

However, the above component mounting apparatus has the following problems.
In the device as described above, the component recognition camera 140
The reference position formed on the component 111a is recognized, and the circuit formation recognition camera 160 recognizes the reference position formed on the circuit formation 151. In this case, in order to calculate the amount of deviation of these reference positions from the normal position, taking the case of a component as an example, the position between the reference position of the component recognition camera 140, for example, the camera center, and the reference position of the component Recognizing the relationship, comparing this positional relationship with the positional relationship between the camera center when the reference position of the part is at the normal position and the reference position of the part, the reference position of the part is shifted from the normal position. Calculate how much the difference is.

If the camera center of the component recognition camera 140 does not move, the above-described shift amount can be accurately calculated. However, the supporting portion supporting the component recognition camera 140 is thermally expanded due to a temperature change in the apparatus. It is difficult to set the camera center of the component recognition camera 140 as a fixed point because the component recognition camera 140 changes over time.

For example, if the camera center is shifted by Δx in the X-axis direction, even if the reference position of the component is at the normal position,
Since Δx is added when recognizing the positional relationship between the camera center and the reference position of the component, the reference position of the component is calculated as being shifted by Δx. When calculated in this way, extra correction is performed, and there is a problem that components cannot be accurately mounted on the circuit formed body.

An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a component mounting apparatus capable of mounting components with high accuracy by providing a reflecting portion.

[0014]

In order to achieve the above object, a first component mounting apparatus of the present invention conveys a component held by a component supply head onto a substrate, and transfers the component to the substrate. A component recognizing device for recognizing an image on the component supply head side, and a substrate recognizing the image on the substrate side arranged so as to recognize a visual field in a direction opposite to the component recognizing device. Recognition means, and a reflecting portion for reflecting the incoming light beam and emitting the light beam in a direction opposite to the incident direction, wherein the substrate recognizing means includes an image on the component supply head side via the reflecting portion. Can be recognized.

According to the component mounting apparatus as described above, since the component recognition means and the board recognition means can recognize the same reference point on the component supply head by having the reflection portion. The displacement amount of the component recognition means and the board recognition means can be calculated with high accuracy, and using this calculation data, the correction amount of the component and the board in the production process can be calculated with high accuracy.

The component mounting apparatus further includes a control unit for performing arithmetic processing on the recognition information recognized by the component recognition unit and the recognition information recognized by the board recognition unit, and a production process of mounting the component on the board. In the state where the component supply head and the component recognition unit face each other, the component recognition unit recognizes a reference position on the component supply head, and the component supply head and the incident part of the reflection unit. Are opposed to each other, and the board recognition unit and the emission unit of the reflection unit are opposed to each other, and the board recognition unit recognizes the reference position on the component supply head via the reflection unit, and performs the control. The unit includes data ΔC1 of a shift amount between a reference position on the component supply head and a reference position of the component recognition unit, a reference position on the component supply head, and a reference position of the substrate recognition unit. It is preferable to calculate the shift amount of the data ΔC2 between. According to the component mounting apparatus as described above, the shift amount of each recognition unit can be obtained before shifting to the production process.

In the production process of mounting the component on the board, the component recognizing means sets the reference position of the component in a state where the component supply head holding the component and the component recognizing means face each other. Recognize, in a state where the board recognition means and the board face each other, the board recognition means recognizes a reference position of the board, and the control section outputs data of the recognized reference position of the component, Using the data of the reference position in the case of the normal position and the data ΔC1 of the shift amount, a correction amount of the position of the component is calculated, and the data of the recognized reference position of the board and the board is in the normal position. It is preferable that the correction amount of the position of the substrate is calculated using the data of the reference position and the data ΔC2 of the shift amount in a certain case. According to the component mounting apparatus as described above, the correction amount includes the shift amount of each recognition unit, so that an accurate correction amount can be calculated.

The horizontal axis is the X axis, the vertical axis is the Y axis, and among the deviation amount data ΔC1, the X axis direction data is Δx1, the Y axis direction data is Δy1, and the deviation amount is Δy1. Of the data ΔC2, the data in the X-axis direction is Δx
2. Assuming that the data in the Y-axis direction is Δy2, it is preferable that the preceding control unit calculates the value of Δx1−Δx2 and the value of Δy1−Δy2.

The control unit may further include: data in the X-axis direction of the recognized reference positions of the component and the board; data of the reference positions in the X-axis direction when the component and the board are at the normal positions; And calculating a relative correction amount in the X-axis direction between the board and the component using the value of the Δx1−Δx2, and data in the Y-axis direction of the reference positions of the recognized component and the board; The relative correction amount in the Y-axis direction between the board and the component using the data in the Y-axis direction of each of the reference positions when the component and the board are at the normal position, and the value of Δy1−Δy2. Is preferably calculated.

Further, the reference position on the component supply head is determined by determining a trajectory of a predetermined point on the component supply head while rotating the component supply head, and determining a rotation center of the component supply head calculated from the trajectory. Preferably, there is.

Next, a second component mounting apparatus of the present invention is a component mounting apparatus that transports a component held by a component supply head onto a substrate and mounts the component on the substrate. Recognizing means for recognizing an image on the substrate side, and a reflecting portion that reflects an incident light beam and emits the light beam in a direction opposite to the incident direction, the recognition device includes: The image on the component supply head side can be recognized. According to the component mounting apparatus as described above, since the reflection unit is provided, both the substrate and the component on the component supply head can be recognized by one recognition unit, so that the cost is reduced. Further, since a plurality of recognition means are not required, there is no need to consider a shift in the center between the recognition means as in the case of two recognition means, and it is not necessary to calculate a shift amount of the recognition means before the production process. become.

In the second component mounting apparatus,
A control unit that performs arithmetic processing on the recognition information recognized by the recognition unit; and in a production step of mounting the component on the board, the recognition unit includes the board in a state where the recognition unit and the board face each other. In the state where the component supply head and the incident part of the reflection part face each other, and the recognition means and the emission part of the reflection part face each other, the recognition means recognizes the reflection part. Recognizing the reference position of the component held by the component supply head through the control unit, using the data of the recognized reference position of the component, the data of the reference position when the component is at the normal position Calculating the correction amount of the position of the component, and calculating the correction amount of the position of the board using the data of the recognized reference position of the board and the data of the reference position when the board is at the normal position. That Masui.

In each of the component mounting apparatuses, the reflecting portion reflects the light beam reflected by the first reflecting surface and the first reflecting surface that reflects the incident light beam. It is preferable to have a second reflection surface that reflects light in a direction opposite to the incident direction.

The first reflecting surface is a surface of a deflecting plate that reflects a light beam incident from one direction and transmits a light beam incident from a direction opposite to the one direction. It is preferable that a light source is provided on the opposite side of the light source, and a light beam from the light source can be transmitted through the first reflecting surface to irradiate the object on the incident part side. According to the component mounting apparatus as described above, the imaging target can be clearly recognized.

It is preferable that the light source emits a light beam via an optical fiber.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be specifically described below with reference to the drawings.

(First Embodiment) FIG. 1 is a perspective view of a component mounting apparatus according to a first embodiment of the present invention. FIG. 2 is a perspective view of a main part of the apparatus shown in FIG. The outline of the apparatus will be described with reference to FIGS. I arranged in the component supply unit 1
C2 is conveyed by the delivery head 3 and delivered to the component mounting head 4. The component mounting head 4 holds the IC 2 with the suction surface 4 of the tool 4a by suction or the like by vacuuming.
b. The component mounting head 4 is attached to the head support 39 via a ball screw 36, and can be moved in the X-axis direction by a motor 40 as a driving source.

When the component mounting head 4 moves in the direction of arrow a, it passes over a component recognition camera 5 which is a component recognition means arranged so as to have a visual field on the upper side. That is, the component recognition camera 5 is disposed so as to be able to face the head suction surface 4b of the component mounting head 4, and can capture an image of the suction surface side of the component mounting head 4. The component recognition camera 5 has a CCD (Charge Coupled Device) inside, and can capture an image captured in the camera.

In the component mounting section 6, the board 7 is sandwiched and held by the board holding section 8, and is placed on the stage 9 in this state. Substrate 7 has IC2
Are formed. The stage 9 can be moved in the Y-axis direction by a motor 10 as a driving source. Further, on the stage 9, a reflection unit 11, which will be described in detail later, is attached, and moves integrally with the movement of the stage 9 in the Y-axis direction.

On the upper side of the stage 9, a board recognizing camera 12 as a board recognizing means is arranged so as to have a field of view on the lower side. The board recognition camera 12 has a CCD inside, and can capture an image captured in the camera.
Therefore, if the stage 9 is moved so as to face the board recognition camera 12, the board recognition camera 12 can capture an image of the board 7.

Next, an imaging process before shifting to a production process will be described. In the following description, of the X-axis direction, the direction from the component supply unit 1 to the component mounting unit 6 is the positive direction of the X-axis, and the direction from the substrate 7 to the reflection unit 11 is the positive direction of the Y-axis. That. The imaging process is actually an IC
Is a step prior to the production step of mounting the component on the board. In this step, the relative positional relationship between the component recognition camera 5 and the board recognition camera 12 is found. Note that “before the production process” includes a period from when the production is interrupted in the production process to when the process shifts to the next production process.

First, in FIG. 2, the component mounting head 4 moves in the positive direction of the X axis, and stops at a position where the component mounting head 4 and the component recognition camera 5 face each other. FIG. 3A shows this state. The component recognition camera 5 having a visual field on the upper side can capture an image of the suction surface 4b of the tool 4a. The tool 4a is rotatable around a center axis in the Z-axis direction by a motor (not shown) as a drive source, and imaging is performed while rotating the tool 4a.

According to such imaging, the rotation center of the suction surface 4b of the tool 4a can be obtained. FIG. 4 (a)
Shows the locus of the reference point 14 formed on the suction surface 4b of the tool 4a when the tool 4a is rotated by 90 °. In this figure, the inside of a circle 30 is an imaging region,
The camera center 13 is the center of the component recognition camera 5 and has a known value. 14a to 14d have angles of 0 °, 90 °, 180 ° when the tool 4a is rotated, respectively.
5 shows the captured image of the reference point 14 at 270 °. In the state shown in FIG. 4A, the angle is positive in the clockwise direction with respect to the horizontal line 15.

The imaging information at each angle is transmitted to the control unit 29.
(FIG. 1) to perform the arithmetic processing. As shown in FIG. 4, since the trajectories of the four reference points 14 are recognized, the rotation center 37 of the suction surface 4b of the tool 4a can be obtained by calculation. The control unit 29 further compares the data of the rotation center 37 with the data of the known camera center 13 to calculate the amount of displacement between the rotation center 37 and the camera center 13. Assuming that the displacement in the X-axis direction is Δx1 and the displacement in the Y-axis direction is Δy1, the data of this displacement amount is Δ
C1 = (Δx1, Δy1). If the camera center 13 and the rotation center 37 of the tool 4a are set to be coincident, this shift amount corresponds to the shift amount of the component recognition camera 5 due to a change in temperature, a change with time, or the like.

Next, the component mounting head 4 moves further in the positive direction of the X axis. FIG. 3 shows this moving state.
(B). In the state shown in the figure, the position adjustment is performed so that the imaging side of the board recognition camera 12 and the emission unit 16 of the reflection unit 11 face each other. Such a position adjustment is performed by moving the board recognition camera 12 by the motor 18 as a driving source.
The stage 9 on which the reflection unit 11 is mounted in the axial direction
Can be moved in the Y-axis direction by the motor 10 as a drive source.

From this state, the component mounting head 4 is further moved in the positive X-axis direction (arrow b),
And the incident part 17 of the reflection part 11 are opposed to each other. The position of the component mounting head 4 in the X-axis direction at this time corresponds to a component mounting position in a production process. Further, the position of the board recognition camera 12 in the X-axis direction corresponds to a board recognition position in the production process.

FIG. 5A shows the incident portion 17 of the reflecting portion 11,
The injection unit 16 is provided with the tool 4 of the component mounting head 4.
5A is a perspective view in a state where the board recognition camera 12 faces each other, and FIG. 5B is a side view illustrating the configuration illustrated in FIG. In both figures, the configuration inside the reflection unit 11 is shown by a solid line for easy understanding. In the reflecting portion 11, a first reflecting surface 19, a first reflecting surface 19,
The lens 20 and the second reflection surface 21 are arranged.

The luminous flux of the image of the suction surface 4b of the tool 4a incident from the incident portion 17 is incident on the incident portion 17, is reflected by the first reflection surface 19, passes through the lens 20, and passes through the second reflection surface 2
1 is projected. Further, the light is reflected by the second reflection surface 21, passes through the emission section 16, and forms an image at the two-dot chain line section 22.

The formed image is picked up by the board recognition camera 12. The magnification is adjusted by the lens 20, and the luminous flux of the image incident from the incident unit 17 exits from the exit unit 16 at 1 × magnification. For this reason, the magnification adjustment on the board recognition camera 12 side becomes unnecessary. in this way,
Providing the reflection unit 11 enables an image that cannot be directly captured by the board recognition camera 12 to be captured.

In some cases, the position of the reflecting surfaces 19 and 21 fluctuates due to thermal expansion (shrinkage) of the reflecting portion 11 due to a temperature change. Even in this case, the position of the formed image fluctuates. Since it does not, the accuracy of imaging is not affected. Also,
Since the magnification adjustment of the captured image can be performed on the substrate recognition camera 12 side, a configuration without the lens 20 may be adopted.

FIG. 4A shows the state obtained by the board recognition camera 12.
In the same manner as in the case of, the amount of displacement between the center of the board recognition camera 12 and the rotation center of the tool 4a is calculated. That is, imaging is performed while rotating the tool 4a about the center axis in the Z-axis direction.

According to such imaging, the rotation center of the suction surface 4b of the tool 4a can be obtained. FIG. 4 (b)
Shows the locus of the reference point 14 formed on the suction surface 4b of the tool 4a when the tool 4a is rotated by 90 °. In this figure, the inside of a circle 31 is an imaging region, and the positions in the up, down, left, and right directions are shown as in FIG. 4A. The camera center 23 is the center of the board recognition camera 12, and is a known value. 14e to 14h each have an angle of 0 when the tool 4a is rotated.
Reference point 1 at °, 90 °, 180 °, and 270 °
4 shows a captured image. The angle setting is the same as in the case of FIG.

The imaging information at each angle is sent to the control unit 29, and the arithmetic processing is performed. As shown in FIG. 4B, since the trajectories of the four reference points 14 are recognized, the rotation center 37 of the suction surface 4b of the tool 4a can be obtained by calculation. The control unit 29 further compares the data of the rotation center 37 with the data of the known camera center 23, and calculates the amount of displacement of the position between the rotation center 37 and the camera center 23. Assuming that the shift in the X-axis direction is Δx2 and the shift in the Y-axis direction is Δy2, the data of the shift amount is ΔC2
= (Δx2, Δy2). If the camera center 23 and the rotation center 37 of the tool 4a are set to be coincident, this shift amount corresponds to the shift amount of the board recognition camera 12 due to a temperature change or the like.

Through the above steps, the control unit 29
Data of the deviation amount ΔC1 = (Δx1, Δy1) between the camera center 13 of the component recognition camera 5 and the rotation center 37 of the suction surface 4b, and the deviation between the camera center 23 of the board recognition camera 12 and the rotation center 37 of the suction surface 4b. Quantity ΔC2 = (Δx2, Δy
It has the data of 2). ΔC1, ΔC2
Are the rotation center 3 of the suction surface 4b, which are the same reference point.
Since the data is obtained by measuring with reference to 7, there is no need to consider the shift of the reference point.

Here, the recognition of the IC by the component recognition camera 5 in the production process will be described with reference to FIG. Yen 24
The inside is an imaging area, 25 indicates an outline of a captured image of the IC, and 26 is an image of a reference point formed on the IC. FIG. 6A shows a case where the rotation center 37 of the suction surface 4b and the camera center 13 of the component recognition camera 5 match. In this example, the camera center 13 is set at the origin (0,
If the reference point 26 is at the normal position and the coordinates are (A, B), the IC is adsorbed at the normal position on the adsorption surface 4b.

FIG. 6B shows the camera center 1 as described above.
3 shows a state where the reference numeral 3 is shifted from the rotation center 37 by (Δx1, Δy1). Also in this state, the reference point 26 is at the position of the coordinates (A, B) with respect to the rotation center 37, and the IC is sucked at a regular position on the suction surface 4b. However, since the position of the reference point 26 is actually calculated based on the camera center 13,
The position of the reference point 26 is recognized as coordinates (A1, B1). That is, the IC is recognized as being shifted by (Δx1, Δy1) even though the IC is at the normal position.

In the present embodiment, as described above, in the imaging step before the production step, the shift amount ΔC1 of the camera center 13 =
Since the data of (Δx1, Δy1) is calculated, the coordinates (A1, B2) of the obtained reference point 26 in the production process.
By subtracting the reference coordinates (A, B) from 1) and further subtracting the shift amounts (Δx1, Δy1), the reference point 26
Can be calculated. That is, the correction amount Δx3 in the X-axis direction is represented by the following expression (1), and the correction amount Δy3 in the Y-axis direction is represented by the following expression (2).

Equation (1) Δx3 = A1-A-Δx1 Equation (2) Δy3 = B1-B-Δy1 In the case of FIG. 6B, Δx3 = 0 and Δy3 = 0,
Indicates that no correction is required.

This is the same for the board recognition, and the coordinates (C) of the reference point on the board obtained in the production process.
1, D1), the reference coordinates (C, D) of the reference point are subtracted, and the shift amount (Δx) of the camera center 23 of the board recognition camera 12 already determined in the imaging process as described above.
2, Δy2), the correction amount can be calculated. That is, the correction amount Δx4 in the X-axis direction is represented by the following equation (3), and the correction amount Δy4 in the Y-axis direction is represented by the following equation (4).

Equation (3) Δx4 = C1−C−Δx2 Equation (4) Δy4 = D1−D−Δy2 As described above, in the production process, after correcting the apparent shift amount, the imaging process is further performed. The calculated shift amount is taken into account. In the apparatus according to the present embodiment, the component mounting head 4 and the stage 9 are not individually moved in the X and Y axis directions.
By moving the component mounting head 4 in the X-axis direction, correction in the Y-axis direction is performed by moving the stage 9 in the Y-axis direction. Therefore, the correction amount only needs to know the relative movement amount between the IC and the substrate in each of the X and Y axis directions. That is, X of the component mounting head 4
The correction amount Δx5 in the axial direction is (Δx3−Δx4), and is represented by the following equation (5). The correction amount Δy5 of the stage 9 in the Y-axis direction is (Δy3−Δy4), and is expressed by the following equation (6). Is done.

Equation (5) Δx5 = (A1-A)-(C1-
C)-(Δx1-Δx2) Expression (6) Δy5 = (B1-B)-(D1-D)-(Δy
1−Δy2) where Δx = Δx1−Δx2, Δy = Δy1−Δy2
Assuming that ΔC = (Δx, Δy), in the production process, the component mounting head 4 and the stage 9 are moved by an amount obtained by subtracting a correction amount corresponding to ΔC from an apparent correction amount calculated by each camera. You just have to move it.

When the above-described imaging process is completed, the process shifts to the production process. Hereinafter, the production process will be described. In FIGS. 1 and 2, the component supply unit 1 has a large number of I
C2 is supplied. These ICs 2 are recognized by the supply unit recognition camera 28, and the IC 2 to be mounted next is positioned at a predetermined position under the control of the control unit 29 based on the recognition information.

Next, the component delivery head 3 moves to just above the IC 2, descends and sucks the IC 2, then rises and moves in the X-axis positive direction to the component delivery position as shown by arrow c. Thereafter, the component transfer head 3 is turned upside down as shown by the arrow d, and holds the sucked IC 2 upside down. This is because the IC 2 supplied to the component supply unit 1 is held with the bumps facing upward, so that the surface to be joined faces downward in preparation for later mounting, that is, the bumps face downward. This is because the IC 2 is transferred to the component mounting head 4 in a state where the IC 2 is mounted.

The component mounting head 4 descends and approaches the IC 2 from above, picks up the IC 2 and moves toward the component mounting section 6 in the positive X-axis direction. On the other hand, the component delivery head 3 that has completed the delivery of the IC 2 moves in the negative direction of the X-axis and starts the next component suction operation.

The component mounting head 4 stops at a position where the component mounting head 4 and the component recognition camera 5 face each other, as shown in FIG. In this state, the component recognition camera 5
Recognizes two reference points formed at different positions on the IC2. The reason why the two reference points are recognized is to calculate not only the deviation of the IC 2 in the X-axis direction and the Y-axis direction but also the deviation of the angle of the IC 2 on the XY plane. Information on the recognized reference position is sent to the control unit 29. Control unit 2
9 is the camera center 1 for the two reference positions recognized.
Position data from position 3 (A1, B1), (A2, B2)
Ask for. Further, based on the reference point data (A1, B1) values, the reference data (A, B) when this reference point is at the normal position.
Is subtracted, the apparent correction amount of IC2 (A1-
A, B1-B) are obtained.

While the above operation is being performed, the substrate 7 is supplied to the substrate holding unit 8 and is positioned at a predetermined position. The substrate is recognized by the substrate recognition camera 12 which has moved to a position facing the substrate 7. 7 is recognized, and the information is sent to the control unit 29. Control unit 29
Calculates data (C1, D1) of the amount of deviation from the camera center 23 with respect to the recognized reference position.

Further, by subtracting the reference data (C, D) when the reference point of the substrate 7 is at the normal position from this value, the apparent correction amounts (C1-C, D1-D) of the substrate 7 are obtained.
Is found. At this point, since the data for calculating Δx5 and Δy5 has been obtained in the equations (5) and (6), the control unit 29 calculates the correction amounts (Δx5 and Δy5).

In the IC 2, from the data (A 1, B 1) and (A 2, B 2) of the position from the camera center 13 already obtained for the two reference positions,
The amount of displacement of the camera center 13 obtained in the imaging step (Δx1, Δ
By subtracting y1), the suction surfaces 4b at the two reference positions
The coordinate data based on the rotation center 37 is obtained. By using the coordinate data and the reference data (A, B) and (A ′, B ′) when the two reference positions are at the normal positions,
Since the amount of change between the two reference positions is known, the correction amount Δθ of the angle about the Z axis can be calculated.

After the completion of the recognition of the reference position of the substrate 7, the stage 9 moves by a predetermined amount in the negative direction of the Y axis and stops at the mounting position. The predetermined amount is a correction amount Δ from a movement amount for moving to the mounting position when the displacement amount of the IC 2 and the substrate 7 is zero.
This is the amount obtained by subtracting y5. On the other hand, the component mounting head 4 that has completed the recognition of the reference position of the IC 2 moves by a predetermined amount in the X-axis positive direction and stops at the mounting position facing the substrate 7. FIG. 7A shows this state. The predetermined amount of the component mounting head 4 is defined as a correction amount Δx5 from a movement amount for moving to the mounting position when the displacement amount of the IC 2 and the substrate 7 is zero.
Is the amount after subtracting Further, by rotating the tool 4a about the Z-axis by the correction amount Δθ obtained as described above, the angle deviation can also be corrected.

Next, as shown in FIG. 7A, the component mounting head 4 is lowered (arrow e), and the IC 2 is temporarily bonded to the substrate 7. After the temporary joining, the component mounting head 4 retreats in the negative X-axis direction, and the main joining head 38 moves in the negative X-axis direction.
As shown in FIG. 7B, the main bonding head 38 and the substrate 7
It stops at the position where the upper IC2 faces. In this state,
By moving in the direction of arrow f, the IC2 is fully bonded to the substrate 7,
The mounting on the substrate 7 of C2 is completed.

The reference point for determining the rotation center 37 of the suction surface 4b is the reference point 14 formed on the suction surface 4b.
However, the reference point may be a reference point formed on an adsorbent such as a component or a jig that adsorbs the above. Even in this case,
Since the adsorbate rotates integrally with the adsorbing surface 4b, the rotation center 37 of the adsorbing surface 4b can be obtained by recognizing the trajectory of the reference point on the adsorbent while rotating the tool 4a.

Although the reference point on the recognition camera side is set at the camera center, the present invention is not limited to this, and a known reference point may be used.

(Embodiment 2) The present embodiment relates to the configuration of the reflecting section. FIGS. 8A and 8B are side views showing a state in which the board recognition camera 32 captures an image of the suction surface 4b of the tool 4a via the reflection unit 11. FIG. In both figures, the reflection portion 11
The internal configuration is shown by a solid line.

The reflecting surface 19 inside the reflecting section 11 shown in FIG. 8A is one surface of a deflecting plate that reflects a light beam incident from one direction and transmits a light beam incident from the opposite direction. . In the arrangement of the reflecting surface 19 as shown in the figure, the light beam incident from above the reflecting surface 19 is reflected by the reflecting surface 19 as shown by the dotted line, and the light beam incident from below the reflecting surface 19 is: As shown by the arrow, the light passes through the reflection surface 19. In the reflection section 11 of this figure, a light source 33 such as an LED is disposed below the reflection surface 19, and a light beam from the light source 33 passes through the reflection surface 19 and irradiates the suction surface 4b. Therefore, the board recognition camera 32 can clearly recognize the imaging target.

The configuration of the reflecting surface 19 of the reflecting section 11 shown in FIG. 8B is the same as that of FIG. 8A, and the light beam incident from below the reflecting surface 19 is indicated by an arrow. As described above, it can be transmitted. In the example of this figure, the light beam transmitted through the reflection surface 19 is obtained by passing the light beam of the light source 34 through the optical fiber 35. Also in this example, it is possible to irradiate the suction surface 4b using the light beam transmitted through the reflection surface 19, and the board recognition camera 32 can clearly recognize the imaging target.

(Embodiment 3) In the first embodiment, the component recognition camera for component recognition and the board recognition camera for board recognition are provided respectively.
In the present embodiment, recognition of components and recognition of a board are performed by one camera.

FIG. 9 is a perspective view of a main part of the device according to the third embodiment. The configuration shown in this figure is different from the first embodiment in that it does not have the component recognition camera 5 shown in FIG. That is, in the third embodiment, both the component recognition and the board recognition are performed using the recognition camera 12 '.

First, the production process will be described. As shown in FIG. 10A, the board recognition in the production process is performed by moving the stage 9 in the Y-axis direction,
This is performed in a state where the imaging side 2 ′ faces the imaging side. In the following description, the coordinates of the camera center on the XY plane are set as the origin (0, 0), and the substrate 7
Let the coordinates of the upper reference point be (E, F). The camera center is
This corresponds to the camera center 23 in FIG. In the state shown in FIG. 10A, the recognition camera 12 'captures an image of the substrate 7, and calculates the coordinates of the reference point. If the coordinates of this reference point are (E1, F1), the correction amount is (E1-E, F1).
1-F).

When the board recognition is completed, the flow shifts to component recognition. FIG. 10B shows a state of component recognition. The stage 9 is further moved in the negative Y-axis direction (left side in the figure) from the state of FIG. 10A, and the recognition camera 12 ′ and the emission unit 16 of the reflection unit 11 are opposed to each other. Also, the component mounting head 4 to which the IC has been delivered from the component delivery head 3 moves in the X-axis positive direction, and the suction surface 4b of the tool 4a.
And stops at a position where the light and the incident part 17 of the reflection part 11 face each other. The position of the component mounting head 4 is a position at the mounting position when the amount of displacement between the IC 2 and the substrate 7 is zero. In this state, the recognition camera 12 ′ can recognize the IC sucked on the suction surface 4 b via the reflection unit 11.

Also in the present embodiment, two different reference points formed on the IC are calculated in order to calculate the deviation of the angle of the IC. The correction amount in the XY directions can be calculated from data of one of the two reference points. Assuming that the coordinates of one reference point on the IC when the IC is at the normal position are (G, H), if the coordinates of this reference point captured by the recognition camera 12 'are (G1, H1), the correction amount Is (G1-G, H1-H).

In the present embodiment, the component mounting head 4 and the stage 9 are not individually moved in the X and Y axis directions.
, The correction in the Y-axis direction is performed by the movement of the stage 9 in the Y-axis direction. Therefore, the correction amount is IC for each of the X and Y axis directions.
What is necessary is just to know the relative movement amount between the substrate and the substrate. That is, the correction amount Δ in the X-axis direction of the component mounting head 4
x6 and the correction amount Δy6 of the stage 9 in the Y-axis direction are expressed by the following equations (7) and (8), respectively.

Expression (7) Δx6 = (E1−E) − (G1−G) Expression (8) Δy6 = (F1−F) − (H1−H) After the completion of the component recognition, the stage 9 is moved in the Y-axis direction. It moves by a predetermined amount in the direction (right side in the figure) and stops at the mounting position. FIG. 10C shows this state, in which the substrate 7 and the suction surface 4b
Are opposed to each other. The predetermined amount is an amount obtained by subtracting the correction amount Δy6 from the movement amount for moving to the mounting position when the displacement amount of the IC 2 and the substrate 7 is zero.

As described above, the component mounting head 4
Is stopped at the mounting position when the displacement between the IC 2 and the substrate 7 is zero.
, The correction in the X-axis direction is completed.

Here, in the present embodiment, the imaging step as in the first embodiment becomes unnecessary. This is because there is only one recognition camera, and there is no need to consider the shift of the camera center between cameras as in the case of two recognition cameras. Assuming that the imaging process is performed, in the positional relationship as shown in FIG. 10B, the amount of deviation (Δx7, Δx7,
Δy7) can be calculated. In order to calculate the correction amount, the shift amounts (Δx7, Δy7) are subtracted from the measured values of the reference point of the substrate and the IC in the production process. Therefore, in the case of the present embodiment, the correction amount of the substrate 7 is (E1−E−Δx7, F1−F−Δy7).
The correction amount of C2 is (G1-G-Δx7, H1-H-Δy
7).

As described above, the correction amount only needs to know the relative movement amount in each of the X- and Y-axis directions. Therefore, the component is calculated by the same method as that used to obtain the equations (5) and (6). Correction amount Δx8 of mounting head 4 in X-axis direction, stage 9
The correction Δy8 in the Y-axis direction is given by the following equation (9),
It is represented by (10).

Equation (9) Δx8 = (E1−E−Δx7)
− (G1−G−Δx7) Equation (10) Δy8 = (F1−F−Δy7) − (H1−H
−Δy7) By rearranging equations (9) and (10), the following equation (9 ′),
(10 '), and eventually each of the deviation amounts Δx7 and Δy7 are canceled out, and the equations (7), which do not consider the deviation amounts,
The result is the same as (8).

Equation (9 ′) Δx8 = (E1−E) − (G1−G) Equation (10 ′) Δy8 = (F1−F) − (H1−H) As described above, according to the third embodiment, , IC and board can be recognized by one camera, which is advantageous in cost as compared with the first embodiment. In addition, an imaging step before production is not required, which is advantageous in this respect. However, when comparing the production processes, in the first embodiment, the recognition of the IC and the substrate can be performed simultaneously,
In the first embodiment, it is necessary to individually recognize them.

For example, in the third embodiment, the reflecting section 11
After moving the stage 9 so that the tool 4a and the recognition camera 12 'face each other, the stage 9 is moved in the opposite direction so that the substrate 7 and the tool 4a face each other as shown in FIG. Although it is necessary to move, such an operation is unnecessary in the first embodiment. Therefore, the first embodiment is more advantageous in terms of production efficiency. Therefore, the first and third embodiments may be selected depending on what is important.

In the above embodiments, the components held by the component mounting head have been described as examples of ICs. However, the present invention is not limited to this, and the present invention is useful for components that need to be aligned with the mounting side. . Further, although the substrate has been described as an example of a circuit forming body, the present invention is not limited to this, and a component including a substrate to which the components held by the component mounting head are joined, adhered, fitted, or the like can be used.

[0080]

As described above, according to the present invention, by having the reflecting portion, by having the reflecting portion, both the component recognizing means and the board recognizing means have the same reference point on the component supply head. , The amount of displacement between the component recognizing means and the board recognizing means can be calculated with high accuracy. Using this calculated data, the correction amount of the component and the board in the production process can be calculated with high accuracy.

In addition, by recognizing both the board and the component on the component supply head by one recognition means, the number of recognition means can be reduced and the cost can be reduced. Also, in this case,
Since a plurality of recognition means are not required, there is no need to consider the shift of the center between the recognition means as in the case of two recognition means, and it is not necessary to calculate the shift amount of the recognition means before the production process. .

[Brief description of the drawings]

FIG. 1 is a perspective view of a component mounting apparatus according to a first embodiment of the present invention.

FIG. 2 is a perspective view of a main part of the component mounting apparatus shown in FIG.

FIG. 3A is a perspective view illustrating a state where the component mounting head according to the first embodiment of the present invention and the component recognition camera are opposed to each other. FIG. Inside perspective view

4A is a diagram illustrating a recognition state of a suction surface of a component mounting head of the component recognition camera according to the first embodiment of the present invention. FIG. 4B is a diagram illustrating a recognition state of a suction surface of the component mounting head of the board recognition camera.

FIG. 5 is a perspective view showing a state in which a tool of a component mounting head and a board recognition camera face a light incident portion and a light emitting portion of the reflection portion according to the first embodiment of the present invention, respectively.

FIG. 6 is a diagram showing IC recognition in a production process.

FIG. 7 is a perspective view showing component mounting according to the first embodiment of the present invention.

FIG. 8 is a side view showing a reflecting section according to the second embodiment of the present invention.

FIG. 9 is a perspective view of a main part of a component mounting apparatus according to a third embodiment of the present invention.

FIG. 10 is a diagram illustrating a part of a production process of the component mounting apparatus according to the third embodiment of the present invention.

FIG. 11 is a perspective view of an example of a conventional component mounting apparatus.

FIG. 12 is a perspective view of a main part of the component mounting apparatus shown in FIG. 11;

[Explanation of symbols]

 2 IC 4 Component mounting head 4a Tool 4b Suction surface 5 Component recognition camera 6 Component mounting section 7 Substrate 9 Stage 11 Reflector 12 Board recognition camera 12 'Recognition camera 13, 23 Camera center 16 Emission section 17 Incident section 19 First reflection Surface 21 Second reflective surface 29 Control unit 37 Center of rotation

 ──────────────────────────────────────────────────の Continuing on the front page (72) Inventor Satoshi Shida 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Kazushi Sakai 1006 Kazuma Kazuma, Kazuma, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd.

Claims (11)

[Claims] 1. A component mounting apparatus for transporting a component held by a component supply head onto a substrate and mounting the component on the substrate, comprising: component recognition means for recognizing an image on the component supply head side; ,
A board recognizing means arranged so as to recognize a visual field in a direction opposite to the component recognizing means and recognizing an image on the board side; and a reflection for reflecting an incident light beam and emitting the light beam in a direction opposite to the incident direction. A component mounting device, wherein the board recognition unit can recognize an image on the component supply head side via the reflection unit. 2. A control unit for performing arithmetic processing on the recognition information recognized by the component recognition unit and the recognition information recognized by the board recognition unit, wherein before the production process of mounting the component on the board, In a state where the component supply head and the component recognition unit face each other, the component recognition unit recognizes a reference position on the component supply head, and the component supply head faces the incident part of the reflection unit;
And in a state where the board recognition unit and the emission unit of the reflection unit are opposed to each other, the board recognition unit recognizes the reference position on the component supply head via the reflection unit, Data ΔC1 of the deviation amount between the reference position on the component supply head and the reference position of the component recognition means
2. The component mounting apparatus according to claim 1, wherein data of a shift amount ΔC2 between a reference position on the component supply head and a reference position of the board recognizing unit is calculated. 3. In a production process of mounting the component on the board, the component recognizing unit sets the reference position of the component in a state where the component supply head holding the component and the component recognizing unit face each other. Recognizing, in a state where the board recognizing means and the board face each other, the board recognizing means recognizes a reference position of the board, and the control unit outputs data of the recognized reference position of the component;
A correction amount of the position of the component is calculated using the data of the reference position when the component is at the normal position and the data ΔC1 of the shift amount, and the data of the recognized reference position of the board, Using the data of the reference position when in the normal position and the data ΔC2 of the shift amount,
The component mounting apparatus according to claim 2, wherein a correction amount of the position of the board is calculated. 4. The horizontal axis is the X axis and the vertical axis is the Y axis.
, The data in the X-axis direction is Δx1, the data in the Y-axis direction is Δy1, and the data in the X-axis direction is Δx2,
Assuming that the data in the Y-axis direction is Δy2,
The component mounting apparatus according to claim 2, wherein a value of Δx1−Δx2 and a value of Δy1−Δy2 are calculated. 5. The control unit according to claim 1, wherein the recognized data of the reference position of the component and the board in the X-axis direction, and the X of the reference position when the component and the board are at the normal position.
A relative correction amount in the X-axis direction between the board and the component is calculated using the data in the axial direction and the value of Δx1−Δx2, and the Y of the recognized component and the reference position of the board is calculated. Using the data in the axial direction, the data in the Y-axis direction of each of the reference positions when the component and the board are at the normal position, and the value of Δy1−Δy2 in the Y-axis direction between the board and the component. The component mounting apparatus according to claim 4, wherein a relative correction amount is calculated. 6. A reference position on the component supply head is obtained by determining a trajectory of a predetermined point on the component supply head while rotating the component supply head, and using a rotation center of the component supply head calculated from the trajectory. The component mounting apparatus according to any one of claims 2 to 5. 7. A component mounting apparatus that transports a component held by a component supply head onto a substrate and mounts the component on the substrate, wherein a recognition unit that recognizes an image on the substrate side is incident. A reflection unit that reflects the light beam and emits the light beam in a direction opposite to the incident direction, wherein the recognition unit can recognize an image on the component supply head side via the reflection unit. Component mounting equipment. 8. A production unit for mounting the component on the board, wherein the control unit performs arithmetic processing on the recognition information recognized by the recognizing unit. Means for recognizing a reference position of the substrate, wherein the component supply head faces an incident portion of the reflection portion,
And in a state where the recognition unit and the emission unit of the reflection unit face each other, the recognition unit recognizes a reference position of a component held by the component supply head via the reflection unit, and the control unit includes: Data of the reference position of the recognized component,
Using the data of the reference position when the component is at the normal position, a correction amount of the position of the component is calculated, and the data of the recognized reference position of the board, and the reference when the board is at the normal position. The component mounting apparatus according to claim 7, wherein a correction amount of the position of the board is calculated using the position data. 9. The reflection section includes a first reflection surface that reflects an incident light beam, and a light beam that is reflected by the first reflection surface to further reflect the light beam in a direction opposite to the incident direction. The component mounting apparatus according to any one of claims 1 to 8, further comprising a second reflection surface that reflects light. 10. The first reflecting surface is one surface of a deflecting plate that reflects a light beam incident from one direction and transmits a light beam incident from a direction opposite to the one direction, and the first reflecting surface. 10. The component mounting apparatus according to claim 9, further comprising: a light source on a side opposite to the light source, and allowing the light flux from the light source to pass through the first reflection surface to irradiate the object on the incident unit side. 11. The component mounting apparatus according to claim 10, wherein the light source emits a light beam via an optical fiber.