JP3328760B2 - Chip image recognition device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an improvement of a chip image recognizing apparatus in a bonding apparatus, and mainly relates to a chip image recognizing apparatus for accurately recognizing an image on an upper surface of a chip (adsorption surface by a bonding tool). Device.

[0002]

2. Description of the Related Art In a conventional bonding apparatus, a chip and substrate recognition apparatus uses an IC chip 9 as shown in FIG. 4 for controlling by recognizing the upper surface of the IC chip and the surface of the substrate when bonding the IC chip to the substrate. Before picking up the IC chip 9 with a bonding tool, the IC chip 9 is recognized from above by a chip recognition camera 18, the IC chip 9 is picked up by vacuum suction, and the board 10 is recognized by a separate board recognition camera 17. Was performed, the position of the IC chip 9 was corrected based on the IC chip image and the substrate image, and bonding was performed.

[0003]

However, in this conventional method, the IC chip 9 is picked up after the IC chip 9 is recognized by the chip recognition camera 18, so that the position of the IC chip 9 is shifted by the pickup. And the alignment accuracy at the time of bonding tends to be reduced.

Accordingly, the present invention also provides a bonding apparatus for correcting the position of a chip based on an image on the upper surface of the chip and a substrate image, after adsorbing the chip on a bonding tool.
An object of the present invention is to provide a chip image recognizing device capable of recognizing a chip, thereby performing accurate position correction with a small chip position shift.

[0005]

According to the present invention, in order to solve the above-mentioned problems, a lower side of a bonding tool is provided with a reflecting side surface which forms a right angle at an upper portion so that a lower surface is an incident side surface and at the same time an output side surface. Bonding consisting of a prism formed, a bonding tool with a chip suction hole provided at a position where the chip is biased so that the chip is located below one reflection side on the lower surface of the prism, and a chip recognition camera arranged upward An apparatus for recognizing a chip image in an apparatus is provided.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a schematic perspective view of a bonding apparatus to which the present invention is applied. A bonding tool 3 that moves up and down according to a Z-axis driving device 1 that uses a Z-axis motor 11 as a driving source, and that rotates according to a 駆 動 -axis driving device 2 that uses a Θ-axis motor 12 as a driving source; A substrate stage 6 and a bonding tool that move left and right by operating the X-axis stage 4 enabled to move in the X-axis direction at 14 and the Y-axis stage 5 enabled to move in the Y-axis direction by the Y-axis motor 15. 3 together with a board recognition camera 7 mounted downward on the Z-axis driving device 1 and a chip recognition camera 8 mounted upward on the Y-axis stage 5.

A prism 13 is fitted into the lower end of the bonding tool 3 as shown in FIG.
The prism 13 is an ordinary right-angle prism whose section is an isosceles right triangle and is frequently used, and the lower surface 22 is an incident side surface and an output side surface at the same time. The side surfaces 20, 21 are reflection side surfaces.

[0008] As shown in FIG.
A suction hole 23 is provided at the one-sided position. The position of the suction hole 23 is a position where the IC chip 9 to be sucked is biased so as to be located below one of the reflection side surfaces 20.
The suction hole 23 is connected to a vacuum suction device (not shown) at a connection port 33.

As a work procedure of the bonding apparatus, X
The axis stage 4 and the Y-axis stage 5 operate to position the bonding tool 3 above the chip supply unit 16. Thereafter, the bonding tool 3 is moved down by the operation of the Z-axis driving device 1 to suck the IC chip 9. After the chip is sucked, the bonding tool 3 is raised. At this time, if the suction hole 23 is located on the left side of the bonding tool 3 as shown in FIG.
It is adsorbed below the reflection side surface 20 on the left side of the prism 13.

Further, an X axis stage 4 and a Y axis stage 5
Operates, and the substrate recognition camera 7 is positioned above the substrate 10 placed on the substrate stage 6 to recognize the image of the substrate 10. Subsequently, the X-axis stage 4 and the Y-axis stage 5 are operated, and the bonding tool 3 is located above the chip recognition camera 8.
The chip 9 that has been sucked is positioned and the image of the IC chip 9 is recognized. The principle of the image recognition of the IC chip 9 is that the image of the IC chip 9 enters from the suction part located on the left half of the lower surface 22 of the prism 13 as shown by the broken arrow on the left side of FIG. The light is refracted by the reflection side surface 21, emitted from the right half of the lower surface 22 of the prism 13, and recognized by the upward chip recognition camera 8.

After performing image processing calculations on the chip 9 and the substrate 10 captured by the recognition cameras 7 and 8, the position of the IC chip 9 is corrected, and the IC chip 9 is bonded onto the substrate 10.

As another embodiment of the present invention, if the back surface of the IC chip 9 and the substrate 10 are plated with gold, heat and pressure bonding with gold and gold will be performed. It is possible to form a bonding tool for thermocompression bonding by being made of conductive glass and embedding a heater in the bonding tool 3 body.

[0013]

According to the present invention, first, a prism is used at the lower end portion of the bonding tool, and a suction hole is provided at a position where the chip is offset so that the chip is located at the lower surface of the prism below one of the reflection side surfaces. That, by recognizing with the chip recognition camera arranged upward, it is possible to perform image processing in a state where the chip is sucked, and it is possible to prevent displacement between the image recognition time and the pickup time,
High-precision bonding has become possible.

Although the present invention has been developed on the premise of a chip image recognizing device which requires image recognition of the upper surface of the IC chip 9, the present invention utilizes the chip recognizing camera 8 installed upward, It can also be used as a chip image recognition device that requires image recognition of the lower surface of the chip.
Therefore, the chip image recognition device in the bonding device can be used both when image recognition of the upper surface of the chip is required and when image recognition of the lower surface of the chip is required.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view of a bonding apparatus to which the present invention is applied.

FIG. 2 is an explanatory view showing the present invention.

FIG. 3 is a plan view of a tip surface of a bonding tool.

FIG. 4 is an explanatory view of a conventional chip and board image recognition device.

[Explanation of symbols]

 1. . . . . 1. Z-axis drive device . . . . Θ axis drive device 3. . . . . 3. Bonding tool . . . . X-axis stage . . . . 5. Y-axis stage . . . . Substrate stage 7, 17. . Board recognition camera 8, 18. . 8. Chip recognition camera . . . . IC chip 10. . . . . Substrate 11. . . . . Z-axis motor 12. . . . . Θ axis motor 13. . . . . Prism 14. . . . . X-axis motor 15. . . . . Y-axis motor 16. . . . . Chip supply unit 19. . . . . Right angles 20, 21. . Reflective side surface 22. . . . . Bottom of prism 23. . . . . Suction hole

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 H01L 21/52 G01B 11/00 G06T 1/00 H04N 5/225

Claims (1)

(57) [Claims] 1. A lower end portion of a bonding tool is formed by a prism having a reflection side surface forming a right angle on an upper side so that a lower surface is an incident side surface and an output side surface at the same time, and a chip is formed on the lower surface of the prism. A chip image recognition device in a bonding device comprising: a bonding tool having a chip suction hole provided at a position offset to be positioned below a reflection side surface of the chip; and a chip recognition camera arranged upward.