JPS6148703A - Holding position confirming device of automatic component mounting device - Google Patents

Abstract

PURPOSE:To correct accurately positions of various components which vary in size and shape by providing a lighting system which illuminates the contour part of a component and an optical path conversion optical system which guides the outward shape image of the component held by a component holder to an image pickup device. CONSTITUTION:The holding position confirming device consists of a light guide 31 which irradiates the contour part of the component P1, the optical path conversion optical system 33 which guides the outward shape image of the component to the image pickup device 32, and the lighting system 34 which irradiates the center part and contour part of the component held by the component holder 22. The image of the component P1 is reflected by a reflection mirror 33a and passed through a relay lens 33c, and the reflected image is further reflected by a reflection mirror 33b, formed in space, and projected on a monitor 42 through a camera head 32. In this case, the holding position of the component of held by the component holder is discriminated and the deviation from its basic position is confirmed, so corrections in component mounting are easily made.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to an automatic component mounting device that automatically mounts a component onto a member to be mounted after holding one component with a component holder, and particularly relates to The present invention relates to a holding position confirmation device that can facilitate correction by confirming the holding position of a component by a holder and knowing the deviation from a reference position.

[Conventional technology]

In such automatic component mounting devices, mechanical methods have conventionally been used to correct misalignment of components held by component holders.

Figure 6 shows a holding position correction device in a conventional automatic component mounting device that can mount IC chips and various types of chip-type electronic components, such as capacitors, resistors, diodes, and transistors, at predetermined positions on a printed circuit board. This is an example.

In the figure, the component holder 1 is moved vertically and horizontally in a horizontal plane and positioned visually so that its axial direction passes approximately through the center of the component P.

The tip part 2 is brought into contact with the component P by lowering it with compressed air, etc., and negative pressure is supplied to the negative pressure passage 2a, so that the tip part 2 is brought into contact with the part P.
to be adsorbed.

In this state, when the ring 4 is lowered against the spring 5 using an air cylinder or the like while raising the tip 2 against the spring 3, the tapered surface 4a of the ring 4 or The fingers 7 are released from the restraint of the pivoted fingers 7, so each finger 7 converges to the state shown by the imaginary line due to the contraction force of the spring 8, and after the pumping is finished, the part P, which is in the raised position together with the tip 2, is moved forward, backward, left, and right. Hold it in place and rotate it in a horizontal plane to correct the bend and align its center with the center of the tip.

[The problem that the invention attempts to solve]

However, in such a conventional automatic component mounting device, extremely high precision is required in the shape of the tapered surface 4a of the link 4 and the finger 7, the position of the shaft 6, etc., and the 41-piece structure is complicated. It has been extremely difficult to accurately correct the positions of various parts having various thicknesses and shapes.

In addition, it is completely impossible to detect defects such as missing parts in the part P prior to holding the part except by visual inspection.

This invention attempts to solve such problems.

[Means for solving problems]

Therefore, the holding position confirmation device for an automatic component mounting device according to the present invention mounts an imaging device on the same head as the component holder at a predetermined distance, and also illuminates the outline of the component held by the component holder. An illumination system is provided, and an external image of the component held by the component holder is guided to the imaging device by an optical path conversion optical system provided in the fixed part.

[Embodiment J] Hereinafter, the present invention will be described in detail with reference to FIGS. 1 to S of the drawings with ta.

Figure 1 shows the parts to which this invention is applied! l! 2 is a plan view of the mounting device, in which the component supply device 10 supplies chip-shaped electronic components, ICs, etc., and after holding the supplied components with a component holder, the components to be mounted are Controls the holding position confirmation device Tl1ji, Otsu0゜, and each of these devices according to a predetermined program to ensure the holding position of the component held by the component mounting device 20 and the one-component holder to be mounted at a predetermined position. Additionally, a control device 40 is provided which confirms the component holding position through image data processing and automatically corrects the error from the reference position when mounting the component.

For example, as shown in FIG. 2, the component supply device 10 stores several kinds of IC chip expansion frames 12 necessary for mounting in a tray magazine 11, moves the tray magazine 11 up and down by a motor, and extracts the necessary extracts according to the mounting order. The band frame 12 is set in a position where a pick amplifier is possible using a mortar.

Further, the board 13 on which the expandable frame 12 is set is driven in the X and Y directions by a ball screw II mt using a step motor, etc., and the component P1 to be mounted on the expandable frame 12 is moved to a predetermined position. X-Y drive device 14. and a lifting pin 15 provided directly below the part P in a predetermined position.

The component mounting device 20, as shown in FIGS. 1 and 6,
A component holder 22 and an adhesive applicator 23 fixed to the head 21. And an X-Y drive that drives the head 21 in the XY direction by a ball screw drive etc. using a step motor!
l! It consists of an II device 24.

Further, the holding position confirmation device 30 is provided on the outer periphery of the above-mentioned component lifting pin IS, and
A light guide 51 (see FIG. 2) that illuminates the outline of the component P1 at a predetermined position above, and the component holder 22
A camera head, which is an h'' image device such as a small TV camera, is fixed to the head 21 at a distance a from the camera head and captures an image of the component P1, converts it into an electrical signal, and sends it to the image processing section of the control device 40. 62, and two reflecting mirrors 33a, which are placed at the fixed part 'J' and face each other at an angle of 45 degrees with respect to the Z-axis direction with the same distance a as above.

33b and an optical path conversion optical system provided between these reflecting mirrors or consisting of a lasing lens group 33c, and an illumination system 34 that illuminates the center and outline of the component held by the component holder 22. has been done.

The illumination system 34 is connected to the communication port 2, as shown in detail in FIG.
The center hole 2 of the component holder 22 communicates with negative pressure via 2a.
Light 1 such as a light-emitting tie auto or miniature bulb installed on the top of 2b
35 and 1 part retention J1. ．． A light diffusing plate 36, such as a milky white oval crow or an acrylic plate, is fixed concentrically near the tip of the light diffusing plate 36. It also has a light kite 7 made of a plurality of optical fibers that brightens the entire surface almost uniformly by irradiating the light diffusing plate 36 at a plurality of locations.

Furthermore, the control device 40 controls the component supply device 101, component mounting device 20. and a controller 41 and a monitor 42, which are electrically connected to the holding position confirmation device 30 and supplied with a basic program from a floppy disk.

In the embodiment of this invention having the above configuration,
The components P set on the expandable frame 12 from the tray magazine 11 are moved to a predetermined position above the component lifting pin 15 by the operation of the X-Y drive device 14 in response to a command from the control device 40. After moving to
Or almost simultaneously, by a command from the control device 40,
- The Y drive device 24 moves the head 21 to position the camera head 32 directly above the component P1.

When the part P1 is illuminated by the light guy 1-31 in this state, the outline of the part P1 is imaged by the camera head 32 and displayed on the monitor 42, making it possible to identify chipping or deformation of the part at a glance. If the part P1 is determined to be defective by the image processing at step 40, the X-Y drive device is operated again to move the adjacent part P2 to a predetermined position.

If the part P1 is a good product, the head 21 is moved by a distance a in the direction of Lower the tip of No. 22.

The lifting bottle 15 is pushed out and the head 21 is moved while holding the component P1 by suction, and the component holder 22 holding the component P1 and the camera head 32 are placed directly above each of the reflecting mirrors 33a and 33b of the optical path conversion optical system 36. When the light 35 is turned on, the light diffuser plate 3 is irradiated through the light kite 37 at 112 to brighten the entire surface.

As a result, the image of the component P1 held by the component holder 22 is reflected by the reflection M133a, passes through the relay lens Otsu 6C, is reflected by the reflector 33b, is imaged in the air, and is imaged by the camera head 62. It is displayed on the monitor 42.

FIG. 5 shows an example of the image on the monitor 42 at that time.
Figure a) shows a normal component holding state, <b> shows a state in which the component is held bent during suction, and Figure (C) shows a state in which the component is incorrectly mounted.

At this time, the back of the component P1 is brightened by the light diffusing plate 36, so the monitor image clearly shows the silhouette of the component P1, and image processing is extremely easy. When the information is input to the control device 40, the eccentricity ff1ctc+d from the normal position is determined by image data processing in the case shown in FIG.
y and the bending angle O are calculated, and after first correcting the rotation of the component holder 22 by the bending angle θ, or in the case shown in FIG.
In the case of (a), the component holder 22 is placed directly above the predetermined position of the board 52, which is the mounted member placed in the fixed position on the board tray 51 in FIG. ), move the component holder 22 from the predetermined position in the X-axis direction directly above the corrected position by dxsecO, then lower the tip and mount the component P1 at the predetermined position on the board 52. let

In the case of FIG. 5(c), the above process starting from holding the component by the one-component holder 22 is repeated, and the substrate 52 is
The parts are mounted at the specified positions on the top.

When the mounting of the component is completed, the tip of the component holder 22 is raised, and the next mounting operation is started.

When the type of component to be mounted on the board 52 changes, an expandable frame 12 for another component is supplied from the tray magazine 11 onto the board 13, and the same operation is repeated. Note that before this component mounting work, the adhesive applicator 23 applies adhesive to a predetermined position, and the mounted components are fixed with the adhesive.

By the way, in the above embodiment, the light diffusing plate 36 fixed to the two-component holder 22 is irradiated by the light guide 37, or the light diffusing plate 36 may be irradiated by a plurality of light emitting tie lights. It is also possible to use a surface light emitter instead of the light source and light diffusion.

Furthermore, if the outer diameter of the component to be mounted is larger than the outer diameter of the tip of the component holder 22, the light source 35 that illuminates the center of the component held may be omitted.

[Effect of the invention j As described above, according to the present invention, an imaging device is provided on the same head as a component holder of an automatic component mounting device at a predetermined distance apart, and the components held by the component holder are An illumination system that illuminates the outline of the component held by the component holder and an optical path conversion optical system that guides the image of the component held by the component holder to the imaging device are provided. An imaging device for determining pass/fail can also determine the holding position of the component held in the component holder and check for deviation from its basic position, making it easy to make corrections when mounting components. This makes it easy to handle parts of various shapes and sizes.

In addition, the monitor image of the component held in the one-component holder has an extremely clear contrast between the component and the background.
It becomes possible to perform image processing in the control device with high precision.

[Brief explanation of drawings]

FIG. 1 is a plan view showing an embodiment of the present invention. FIG. 2 is a perspective view showing the component supply device and holding position confirmation device, FIG. 3 is a perspective view showing the component mounting device, and FIG.
Figures (a), (b), and (c) are explanatory diagrams showing the illumination system of the component holder and the holding position confirmation device, where (a) is a longitudinal cross-sectional view, and (b) is a diagram of (a). A cross-sectional view taken along line BB of FIG. Figures 5 (a), (b), and (c) are explanatory diagrams illustrating various monitor images of the control device in this embodiment as well. It is a front view illustrating an apparatus. S... Component automatic mounting device 10... Component supply device 20... Component mounting device 21... Head 22.
...Component holder 3o...Holding position confirmation device 32.
... Camera head (imaging device) 33 ... Optical path conversion optical system 34 ... Illumination system 36.
...Light diffuser plate 37...Light guide P...
・Parts No. + Diagram (G) (b) No. 5
Figure ((1) (b)d
× (C)

Claims (1)

[Claims] 1. In an automatic component mounting device that automatically mounts a component fed by a component feeding device at a predetermined position on a member to be mounted after holding the component by a component holder, a component is placed on the same head as the component holder. An imaging device installed at a distance,
an illumination system that is fixed concentrically to the component holder and illuminates the outline of the component held by the component holder; and an optical path conversion optical system that guides an external image of the component held by the component holder to the imaging device. A holding position confirmation device characterized in that it is provided with a system.