JP5311755B2 - Transfer material transfer inspection method in electronic component mounting apparatus - Google Patents

Description

  The present invention relates to an inspection method for transferring a transfer material onto an electronic component in an electronic component mounting apparatus.

Conventionally, a flux transfer inspection method in an electronic component mounting apparatus described in Patent Document 1 is known. With this flux transfer inspection method in the electronic component mounting apparatus, the flux is transferred to the bumps of the electronic component in the electronic component mounting apparatus, and the image of the flux transfer portion is processed to determine the quality of the flux transfer.
JP 2006-19380 A

  However, the flux transfer inspection method in the conventional electronic component mounting apparatus requires a long time in order to accurately determine the quality of the transfer material transfer. In other words, a side light source is usually used when imaging a bump. Here, the central part of the bump is a curved surface, and the light reflected by this part is difficult to enter the camera. Therefore, the central part of the bump becomes a dark image, but when the flux is transferred, the image becomes darker. Therefore, it is difficult to specify the flux transfer region based on the image, and it takes a lot of processing time.

  The present invention has been made in view of the above-described conventional problems, and can prevent the transfer material transfer failure from being overlooked, and can easily determine whether the transfer material transfer is good or not in a short time. A transfer inspection method is provided.

In order to solve the above problems, the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 1 is characterized in that the transfer material is transferred and an electronic component having a bump whose central portion is a curved surface is mounted on a substrate. In the transfer material transfer inspection method in the electronic component mounting apparatus, the transfer material includes a fluorescent material that absorbs ultraviolet rays and emits visible light, and the electronic component before the transfer material is transferred is determined by a predetermined image recognition station. A pre-transfer positioning step of positioning at a position; and lighting a plurality of visible light sources arranged on a circle on the light source device to irradiate visible light; and imaging the electronic component at the predetermined position; and image information of the bumps a pre-transfer imaging step of acquiring, a transfer step of transferring the transfer material on the bump, after transfer positioning Engineering for positioning the electronic component in which the transfer material is transferred at the predetermined position If, lights a plurality of ultraviolet light sources disposed on the light source device on the visible light source and the concentric circles arranged on the circle, ultraviolet was irradiated with imaging the electronic component at the predetermined position, it transferred the and posttranscriptional imaging step of acquiring image information of the transfer material, for each of the bumps, by comparing the image information of the bumps the transfer material and the image information of the bump before the transfer material transfer has been transferred, the And a transfer determination step for determining whether the transfer material transferred to the bumps is good or bad.

Features of the transfer material transfer test method in an electronic component mounting apparatus according to claim 2, in claim 1, in the pre-transfer imaging process, the image information of the bumps, is to perform the coordinate adjustment of the position of the bump .

A transfer material transfer inspection method in the electronic component mounting apparatus according to claim 3 is characterized in that, in claim 1 or 2, the image information acquired in the pre-transfer imaging step and the post-transfer imaging step is the electronic component It is a position, a diameter, and an area of the transfer material transferred to the bump or the bump .

A feature of the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 4 is that, in any one of claims 1 to 3, the transfer material is a flux.

A feature of the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 5 is that, in any one of claims 1 to 4, the transfer material is solder.

In the transfer material transfer inspection method in the electronic component mounting apparatus according to the first aspect, the image information of the bump is acquired in the pre-transfer imaging process, and the image information of the transfer material is acquired in the post-transfer imaging process. In particular, in the post-transfer imaging process, since the electronic component is imaged by irradiating ultraviolet rays, the image information of the transfer material can be acquired reliably and easily. That is, a transfer material containing a fluorescent material absorbs ultraviolet rays and emits visible light, whereas a bump only reflects ultraviolet rays, so that only an image of the transfer material can be easily obtained. Therefore, the bump and the transfer material can be reliably and easily distinguished from the image information of the bump acquired in the pre-transfer imaging process and the image information of the transfer material acquired in the post-transfer imaging process. Therefore, according to this transfer material transfer inspection method, it is possible to prevent the transfer material transfer failure from being overlooked, and to determine whether the transfer material transfer is good or not in a short time.

In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 3 , the position and diameter of the transfer material on which the image information acquired in the pre-transfer imaging step and the post-transfer imaging step is transferred to the electronic component bumps or the bumps. And the area, it is easy to compare and the process is simple.

In the transfer material transfer inspection method in the electronic component mounting apparatus, the electrode to which the transfer material of the electronic component is transferred is a bump, and in this case as well, the transfer material transfer inspection method is suitable.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to the fourth aspect, since the transfer material is a flux, it is possible to determine the quality of the flux transfer.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to claim 5, since the transfer material is solder, it is possible to determine whether the solder transfer is good or bad.

  An embodiment embodying a transfer material transfer inspection method in an electronic component mounting apparatus according to the present invention will be described below with reference to the drawings. As shown in FIG. 1, the electronic component mounting apparatus 100 used in the transfer material transfer inspection method of Embodiment 1 includes a component supply device 70, a substrate transport device 80, and a component transfer mounting 90.

  The component supply apparatus 70 is configured by arranging a plurality of cassette type feeders 71 in parallel on a base frame 99. The cassette type feeder 71 includes a main body 72 detachably attached to the base frame 99, a supply reel 73 provided at the rear portion of the main body 72, and a component take-out portion 74 provided at the tip of the main body 72. An elongated tape (not shown) in which electronic components are enclosed at a predetermined pitch is wound and held on the supply reel 73, and this tape is pulled out at a predetermined pitch by a sprocket (not shown), so that the electronic component is released from the enclosed state. The components are sequentially sent to the component extraction unit 74.

  In addition, between the component supply device 70 and the substrate transfer device 80, the imaging device 20 including the light source device 21 and the flux tank 30 that stores the flux 31 are provided. As shown in FIG. 2, the position of the imaging device 20 is the image recognition station ST1, and the position of the flux tank 30 is the flux transfer station ST2. The imaging device 20 is electrically connected to the control device 10. In the image recognition station ST <b> 1, the electronic component 40 attracted to the tip of the suction nozzle 16 of the mounting head 15 is imaged by the imaging device 20, and image data is input to the control device 10. The light source device 21 has a hemispherical shape, and includes a visible light source 22 and an ultraviolet light source 23 arranged concentrically. The visible light source 22 and the ultraviolet light source 23 are disposed above the light source device 21 and illuminate the electronic component 40 sucked at the tip of the suction nozzle 16 of the mounting head 15 from the lateral direction. However, the visible light source 22 emits visible light, and the ultraviolet light source 23 emits ultraviolet light. Further, in the flux transfer station ST2, the mounting head 15 is moved in the vertical direction with respect to the flux tank 30 rotating as indicated by an arrow, whereby the electronic component 40 adsorbed to the tip of the suction nozzle 16 is attached to the flux tank 30. The flux 31 is transferred. The flux 31 includes a fluorescent material that absorbs ultraviolet rays and emits visible light. The component transfer device 90 is retracted rearward in FIG. 1, but when the electronic component 40 is imaged, the image recognition station ST1, and when the flux 31 is transferred to the electronic component 40, the flux transfer station ST2. Is moving above. Here, the flux 31 is a “transfer material”.

  As shown in FIG. 1, the board transport device 80 is of a so-called double conveyor type in which a printed circuit board is transported in the X-axis direction and a first transport device 81 and a second transport device 82 are arranged in two rows. The first transport device 81 (second transport device 82) has a pair of guide rails 84a and 84b (85a and 85b) arranged parallel to each other on the base 83 in parallel with each other. A pair of conveyor belts (not shown) that support and convey the printed circuit boards respectively guided by 84b (85a, 85b) are arranged to face each other. Also, the substrate transport device 80 is provided with a clamp device (not shown) that pushes up and clamps the printed circuit board transported to a predetermined position, and the printed circuit board is positioned and fixed at the mounting position by the clamp device.

  The component transfer device 90 is of the XY robot type, is mounted on the base frame 99 and disposed above the substrate transfer device 80 and the component supply device 70 and is moved in the Y-axis direction by the Y-axis motor 12. Y-axis slider 93 is provided. A mounting head 15 for attaching the electronic component 40 to the printed circuit board is attached to the Y-axis slider 93. As shown in FIG. 2, the mounting head 15 has a suction nozzle 16 that sucks the electronic component 40 at the tip, and the suction nozzle 16 can be rotated around the nozzle axis by a θ-axis motor 14. The mounting head 15 can be moved in the horizontal XY plane by the X-axis motor 11 and the Y-axis motor 12, and is moved up and down in the Z-axis direction perpendicular to the XY plane by the Z-axis motor 13. It is possible. These X-axis motor 11, Y-axis motor 12, Z-axis motor 13 and θ-axis motor 14 are electrically connected to the control device 10 and are driven by commands from the control device 10.

  FIG. 3 is a diagram illustrating an image of the electronic component 40 before the flux transfer, which is captured by the imaging device 20 with the visible light source 22 of the light source device 21 turned on. The electronic component 40 has a plurality of bumps 42 disposed on a body 41. In the image of the electronic component 40, the bumps 42 are bright and the body 41 is dark. From the image shown in FIG. 3, the position, diameter, and area of each bump 42 are obtained. FIG. 4 is a diagram illustrating an image of the electronic component 40 after flux transfer, which is captured by the imaging device 20 with the ultraviolet light source 23 of the light source device 21 turned on. In the image of the electronic component 40, the flux transfer portion 42a (flux 31) of the bump 42 is bright, and the flux 41 non-transfer portion 42b of the body 41 and the bump 42 is dark. From the image shown in FIG. 4, the position, diameter, and area of each flux transfer portion 42a (flux 31) are obtained. When the flux transfer portion 42a (flux 31) is inside the bump 42 and the area of the flux transfer portion 42a (flux 31) is equal to or greater than a predetermined value, it is determined that the transfer of the flux 31 has been performed normally. . Further, when the flux transfer portion 42a (flux 31) protrudes from the bump 42 or when the area of the flux transfer portion 42a (flux 31) is smaller than a predetermined value, it is determined that the transfer of the flux 31 is not performed normally. Is done. Here, the bumps 42 are “electrodes”.

  5A, 5B, and 5C are enlarged views of one bump 42 in FIG. FIG. 5A shows that the flux transfer portion 42a (flux 31) is inside the bump 42, and the area of the flux transfer portion 42a (flux 31) is equal to or larger than a predetermined value, so that the flux 31 is normally transferred. It is a thing. In FIG. 5B, the area of the flux transfer portion 42a (flux 31) is smaller than a predetermined value, and the transfer of the flux 31 is not performed normally. In FIG. 5C, the flux 31 is missing and the transfer of the flux 31 is not performed normally.

  Next, the transfer material transfer inspection method of the embodiment will be described with reference to the flowchart of the flux transfer program shown in FIG. When the execution of the flux transfer program is started, first, in step S10, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the image recognition station ST1. It is positioned at a predetermined position. Here, step S10 is a “pre-transfer positioning step”.

  In step S11, the visible light source 22 of the light source device 21 is turned on and irradiated with visible light. In step S <b> 12, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. In step S13, the coordinate adjustment of the position of the bump 42 is performed from the image data of the entire bump 42. That is, the coordinates of the position of the bump 42 at a predetermined position of the image recognition station ST1 are stored in advance in the control device 10, and the coordinates of the actual position of the bump 42 are adjusted with reference to the image data of the entire bump 42. It is done. Instead of using the image of the entire bump 42, the coordinates of the position of the bump 42 may be adjusted based on the images of the bumps 42 at the four corners.

  In step S <b> 14, the position, diameter, and area of the bump 42 as image information are calculated and stored in the memory of the control device 10 for one bump 42. In step S15, it is checked whether the positions, diameters, and areas of all the bumps 42 have been obtained. When the position, diameter, and area are obtained for all the bumps 42 (YES), step S16 is executed. If the position, diameter, and area have not been obtained for all the bumps 42 (NO), the process returns to step S14, and the position, diameter, and area of the next bump 42 are calculated. Here, steps S11 to S15 are “pre-transfer imaging process”.

  In step S16, the X-axis motor 11, the Y-axis motor 12, and the θ-axis motor 14 are driven, and the electronic component 40 is moved to the flux transfer station ST2. In step S <b> 17, the mounting head 15 is moved in the vertical direction by driving the Z-axis motor 13, and the flux 31 is transferred to the electronic component 40. Here, step S17 is a “transfer process”.

  In step S18, the X-axis motor 11, the Y-axis motor 12, the Z-axis motor 13 and the θ-axis motor 14 are driven to position the electronic component 40 at a predetermined position in the image recognition station ST1. Here, step S18 is a “post-transfer positioning process”.

  In step S19, the ultraviolet light source 23 of the light source device 21 is turned on and irradiated with ultraviolet rays. In step S <b> 20, the electronic component 40 is imaged by the imaging device 20, and the image data is input to the control device 10. At this time, the fluorescent material contained in the flux 31 transferred to the flux transfer portion 42a absorbs ultraviolet rays and emits visible light, whereas the flux non-transfer portion 42b and the body 41 to which the flux 31 is not transferred are ultraviolet rays. Is only reflected. Therefore, it is possible to obtain an image in which only the flux transfer portion 42a (flux 31) is bright and the flux non-transfer portion 42b and the body 41 are dark.

  In step S <b> 21, the position, diameter, and area as image information of the flux transfer portion 42 a (flux 31) are calculated for one bump 42 and stored in the memory of the control device 10. In step S22, it is checked whether the position, diameter, and area of the flux transfer portion 42a (flux 31) have been obtained for all the bumps 42. When the position, diameter, and area of the flux transfer portion 42a (flux 31) are obtained for all the bumps 42 (YES), step S23 is executed. If the position, diameter, and area of the flux transfer portion 42a (flux 31) are not obtained for all the bumps 42 (NO), the process returns to step S21, and the flux transfer portion 42a (flux 31) of the next bump 42 is returned. The position, diameter and area are calculated. Here, steps S19 to S22 are “post-transfer imaging process”.

  In step S23, for one bump 42, the position, diameter and area of the bump 42 before flux transfer stored in the memory of the control device 10, and the position of the flux transfer portion 42a (flux 31) after flux transfer. The quality of the flux transfer is determined by comparing the diameter and the area. That is, when the flux transfer portion 42a (flux 31) is inside the bump 42 and the area of the flux transfer portion 42a (flux 31) is equal to or larger than a predetermined value (YES), the transfer of the flux 31 is normally performed. Step S24 is executed. When the flux transfer portion 42a (flux 31) protrudes from the bump 42, or when the area of the flux transfer portion 42a (flux 31) is smaller than a predetermined value (NO), the transfer of the flux 31 is performed normally. If it is determined that there is not, step S25 is executed. In step S24, it is checked whether or not the flux transfer quality determination has been completed for all the bumps. When the quality determination of flux transfer is completed for all the bumps 42 (YES), the flux transfer program is ended. If the determination of the quality of the flux transfer is not completed for all the bumps 42 (NO), the process returns to step S23, and the quality of the flux transfer is determined for the next bump 42. In step S25, after error processing is performed, the flux transfer program is terminated. Here, steps S23 and S24 are “transfer determination process”.

  In the transfer material transfer inspection method in the electronic component mounting apparatus according to the embodiment, the position, diameter, and area as image information of the bump 42 are acquired in steps S11 to S15, and the flux transfer unit 42a (flux 31) is acquired in steps S19 to S22. ) As the image information. At this time, since the electronic component 40 is imaged by irradiating ultraviolet rays in steps S19 to S22, the flux transfer part 42a to which the flux 31 containing the fluorescent material is transferred absorbs the ultraviolet rays and emits visible light. On the other hand, the flux non-transfer part 42b and the body 41 to which the flux 31 is not transferred only reflect ultraviolet rays, only the flux transfer part 42a (flux 31) is bright, and the flux non-transfer part 42b and the body 41 are dark. An image can be obtained. Thereby, the position, diameter, and area of the flux transfer part 42a (flux 31) can be obtained reliably and easily. Then, the flux non-transfer portion is reliably and easily determined from the position, diameter, and area of the bump 42 acquired in steps S19 to S22 and the position, diameter, and area of the flux transfer portion 42a (flux 31) acquired in steps S19 to S22. 42b and the flux transfer part 42a (flux 31) can be distinguished. Therefore, according to the transfer material transfer inspection method in the electronic component mounting apparatus according to the embodiment, the transfer material transfer failure can be prevented from being overlooked, and the transfer material transfer quality can be determined easily and in a short time.

  Further, in the transfer material transfer inspection method in the electronic component mounting apparatus according to the embodiment, the flux 31 in which the image information acquired in steps S11 to S15 and steps S19 to S22 is transferred to the bumps 42 or the bumps 42 of the electronic component 40. Because of the position, diameter and area, the comparison is easy and the processing is simple.

  In the embodiment, an electronic component whose electrode is a bump is used, but an electronic component whose electrode is a lead may be used. The transfer material may be solder.

  In the above, the transfer material transfer inspection method of the present invention has been described according to the embodiments. However, the present invention is not limited to these, and can be applied with appropriate modifications as long as the technical idea of the present invention is not violated. Needless to say, it can be done.

The perspective view of the electronic component mounting apparatus according to the transfer material transfer inspection method of the embodiment. The block diagram of the electronic component mounting apparatus according to the transfer material transfer inspection method of the embodiment. The figure which concerns on the transfer material transcription | transfer inspection method of embodiment, and shows the image before the flux transcription | transfer of an electronic component. The figure which shows the image after the flux transcription | transfer of an electronic component in connection with the transfer material transcription | transfer inspection method of embodiment. FIG. 4 is an enlarged view of a bump after flux transfer according to the transfer material transfer inspection method of the embodiment. 6 is a flowchart of a flux transfer program according to the transfer material transfer inspection method of the embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 31 ... Transfer material (flux), 40 ... Electronic component, 41 ... Body, 42 ... Electrode (bump), 100 ... Electronic component mounting apparatus, S10 ... Pre-transfer positioning process, S11-S15 ... Pre-transfer imaging process, S17 ... Transfer Step, S18 ... Post-transfer positioning step, S19 to S22 ... Post-transfer imaging step, S23, S24 ... Transfer determination step.

Claims (5)

In the transfer material transfer inspection method in the electronic component mounting apparatus in which the transfer material is transferred and an electronic component having a bump whose central portion is a curved surface is mounted on the substrate.
The transfer material includes a fluorescent material that absorbs ultraviolet rays and emits visible light;
A pre-transfer positioning step of positioning the electronic component before the transfer material is transferred at a predetermined position of an image recognition station;
A pre-transfer imaging step of turning on a plurality of visible light sources arranged on a circle in the light source device, irradiating visible light, imaging the electronic component at the predetermined position, and acquiring image information of the bumps;
A transfer step of transferring the transfer material to the bumps ;
A post-transfer positioning step of positioning the electronic component to which the transfer material has been transferred at the predetermined position;
A plurality of ultraviolet light sources disposed in the light source device are turned on concentrically with a visible light source disposed on the circle, and the electronic material is imaged at the predetermined position by irradiating the ultraviolet light, and the transferred transfer material A post-transfer imaging process for acquiring image information of
For each of the bumps, the image information of the bump before the transfer material is transferred and the image information of the bump to which the transfer material is transferred are compared to determine whether the transfer material transferred to the bump is good or bad. A transfer material transfer inspection method in an electronic component mounting apparatus. In claim 1,
In the pre-transfer imaging step, a coordinate adjustment of the bump position is performed from the image information of the bump, and the transfer material transfer inspection method in the electronic component mounting apparatus is characterized. In claim 1 or 2,
Electronic component mounting, wherein the image information acquired in the pre-transfer imaging step and the post-transfer imaging step is a bump, or a position, a diameter, and an area of the transfer material transferred to the bump of the electronic component Transfer material transfer inspection method in the apparatus. In any one of Claims 1 thru | or 3,
The transfer material transfer inspection method in an electronic component mounting apparatus, wherein the transfer material is a flux. In any one of Claims 1 thru | or 4,
A transfer material transfer inspection method in an electronic component mounting apparatus, wherein the transfer material is solder.

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