JP2003060398A - Method and apparatus for mounting component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method and an apparatus for mounting components which can check flux transfer amount, using a simple constitution, which can position the component and which can accurately mount the component. SOLUTION: The method for mounting the component comprises the steps of transferring the flux 20b to a bump 20a of the component 20, imaging the component by an imaging unit, and obtaining a diameter (d) of the flux 20b through image recognition. The diameter corresponds to the flux transfer amount. The method further comprises the steps of calculating the center of the component from diameter D of the bump, with respect to the component having the diameter in a predetermined range, and mounting the component. With such a constitution, since checking of the flux transfer amount and positioning of the component are executed based on recognition of the same image, the overall apparatus can be constituted to be low cost.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting method and device, and more particularly to a component mounting method and device for positioning and mounting a component (electronic component) having a bump portion to which flux is transferred onto a substrate. .

[0002]

2. Description of the Related Art Conventionally, solder bonding has been widely used for mounting electronic parts such as flip chips.
In soldering, before mounting the component, flux is applied by transfer to the joint between the electrode bump of the component and the substrate in order to improve the solder jointability. Then, after mounting the component on the substrate, the component is pressed against the substrate by a thermocompression bonding tool, the bumps are solder-bonded, and the component is mounted on the substrate.

In this case, the coplanarity of the bump of the adsorbed component is inspected, the flux is transferred to the bump portion of the accepted component, the component is recognized by an image pickup device, and the component is positioned by image processing. , Components are mounted on the board.

[0004]

In such a conventional component mounting apparatus, the coplanarity of bumps is inspected,
For non-defective products, flux is transferred to the bumps for image recognition and component mounting. However, since the transfer amount of flux is not checked, there is a problem that a bridge is formed when the transfer amount of the flux is large in the reflow bonding and a bonding failure occurs when the transfer amount of the flux is small.

The present invention has been made in order to solve such a problem, and it is possible to inspect the flux transfer amount and position the components with a simple structure and to mount the components accurately, and a component mounting method and apparatus. The task is to provide.

[0006]

SUMMARY OF THE INVENTION In order to solve the above problems, the present invention provides a component mounting method for positioning a component having a bump portion to which flux is transferred and mounting it on a substrate. The step of transferring
The step of recognizing the image of the bump portion to which the flux has been transferred, the step of inspecting the flux transfer amount based on the image recognition, the step of obtaining the component center from the bump portion subjected to the image recognition, the inspection of the flux transfer amount, and the step of And a step of mounting a component on a board based on the obtained component center.

Further, according to the present invention, in a component mounting apparatus for positioning and mounting a component having a bump portion to which flux is transferred onto a substrate, a transfer device for transferring the flux to the bump portion of the component and the flux are transferred. An image pickup device for picking up an image of the bump portion; an inspection means for recognizing an image obtained by the image pickup device to inspect a flux transfer amount;
A structure having a computing means for recognizing an image obtained by the image pickup device to compute a component center, and a control means for inspecting the flux transfer amount and controlling mounting of a component on a substrate based on the computed component center. Has also adopted.

With such a structure, the inspection of the flux transfer amount and the positioning of the parts can be obtained by the same image recognition processing, and the entire apparatus can be made inexpensive.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention will be described in detail below based on the embodiments shown in the drawings.

FIG. 1 is a schematic diagram of a component mounting apparatus (mounter), and FIG. 2 is a block diagram showing its control configuration. The component mounting apparatus has a head unit 3 having a suction nozzle 3a that sucks a component (electronic component) 20 supplied from a feeder 8, and the head unit 3 is driven by a control unit 10 including a CPU. The X-axis motor 11 is moved along the X-axis 1, and the X-axis 1 is moved along the Y-axis 2, 2'by the Y-axis motor 12, whereby the head unit 3 is moved. , And is configured to be movable in the XY axis directions. The head unit 3 is driven in the Z-axis direction by the Z-axis motor 13 to move up and down, and the suction nozzle 3
a is configured to be rotatable about the nozzle axis by the θ-axis motor 14.

Further, the component mounting device includes a transfer device 4 for transferring the flux to the electrode bump portion 20a of the component 20,
An image pickup device 5 such as a CCD camera for picking up an image of the component 20 to which the flux has been transferred is arranged (the image pickup device 5 can also be mounted on the head portion 3). After the component is adsorbed, the head unit 3 moves to the place of the flux transfer device 4, and a predetermined amount of flux is transferred to the bump unit 20a of the component 20 by transfer. The part 20 to which the flux has been transferred is picked up by the image pickup device 5, the image is recognized by the image recognition device 7, the flux transfer amount is inspected by the controller 10 as described later, and the part center is calculated. Positioning is performed and the component 20 is mounted on the conveyed substrate 6.

In such a structure, as shown in FIG. 3, the component 20 supplied from the feeder 8 is the head unit 3.
Is sucked by the suction nozzle 3a (step S1),
The head part 3 moves to the flux transfer device 4, and under the control of the control part 10, the flux is transferred to the bump part 20a of the component 20 (step S2). Then, the component 20 to which the flux has been transferred is picked up by the image pickup device 5, and the image is taken into the recognition device 7 for image recognition (step S3).

FIG. 4 shows a state of imaging the component 20. The flux 20 is applied to the bump portion 20a of the component 20.
The state where b is transferred and the component 20 illuminated by the illumination light 21 is imaged by the imaging device 5 is shown. Also, FIG.
In (A), the image of the component 20 of the plurality of bumps 20a to which the flux 20b is transferred is shown by the imaging device 5.

By recognizing the image of the component 20 thus picked up, the flux transfer amount of the bump portion 20a is first inspected (step S4). When the flux is transferred to the bump portion 20a, the diameter φd of the flux 20b changes according to the transfer amount, as shown in FIG. 5B. Then, the image is scanned to determine the intensity or change in intensity of the pixel, and the image recognition device 7 performs image recognition by a known method to determine the diameter φd of the flux 20b.
Is calculated, and α>φd> β in the control unit (inspection means) 10.
It is checked whether or not the relationship (α and β can be set) is satisfied. For the diameter φd, the average value of the diameters corresponding to the flux transfer amounts of several typical bump portions 20a is calculated in order to reduce the calculation time. When accuracy is required, the average value of the diameters corresponding to the flux transfer amounts of all the bump portions 20a may be obtained, and the flux transfer amount of only one bump portion 20a at the center of the component may be obtained. The diameter may be determined and used for inspection.

The control unit 10 inspects whether or not the obtained diameter φd of the flux 20b satisfies the relationship α>φd> β (step S4). If not, the component is judged as defective (NG). Is rejected (step S6), and if satisfied, the component center is calculated by the image recognition device (calculation means) 7 using various known methods. For example, the component center is calculated from the center of each bump portion obtained from the diameter φD of each bump portion 20a (step S5). Then, the control unit (control means) 10 corrects the deviation between the center of the component and the suction center to position the component, obtains the inclination of the suction of the component and corrects it as well, and mounts the component 20 on the predetermined position of the substrate 6. Yes (step S7).

In the above-described embodiment, the diameter φd of the transferred flux 20b gradually decreases as the amount of flux consumed by the flux transfer device 4 increases. Therefore, the change in the flux transfer amount over time is recorded, and when the transfer amount decreases below a predetermined value, it is determined that there is an abnormality in the flux supply, for example, a flux deficiency, and this is notified to the operator. Good. With such a configuration, by continuously checking the flux transfer amount, it is possible to detect an abnormality such as a lack of flux or a lack of flux in the flux transfer device.

[0017]

As described above, according to the present invention, the bump portion to which the flux is transferred is image-recognized to inspect the flux transfer amount, and the parts are positioned. The positioning of the parts can be performed with a simple structure, and the entire device can have a low-cost structure.

Further, in the present invention, since the flux transfer amount is inspected, this inspection can be used as a substitute for the coplanarity inspection of the bump portion, so that the cost of the device can be reduced and the tact time at the time of mounting can be shortened.

[Brief description of drawings]

FIG. 1 is a top view showing a schematic configuration of a component mounting apparatus.

FIG. 2 is a block diagram showing a control system of the component mounting apparatus.

FIG. 3 is a flowchart showing a flow of component mounting.

FIG. 4 is an explanatory diagram showing a state of capturing an image of a component having flux transferred to a bump portion.

FIG. 5A is an explanatory diagram showing an image of a component in which flux is transferred to a bump portion, and FIG. 5B is an explanatory diagram showing an image of a bump portion in which flux is transferred.

[Explanation of symbols] 3 head 3a suction nozzle 4 Flux transfer device 5 Imaging device 6 substrate 7 Image recognition device 8 feeders 20 parts 20a bump part 20b flux

Claims (6)

[Claims] 1. A component mounting method for positioning a component having a bump portion to which flux is transferred and mounting it on a substrate, the step of transferring the flux to the bump portion of the component, and image recognition of the bump portion to which the flux is transferred. And the step of inspecting the flux transfer amount based on the image recognition, the step of obtaining the component center from the bump portion where the image is recognized, the inspection of the flux transfer amount, and the component board based on the obtained component center. And a step of mounting the component on the component mounting method. 2. The component mounting method according to claim 1, wherein the component center is determined only for a component that has passed the flux transfer amount inspection. 3. The component mounting method according to claim 1, wherein the image for inspecting the flux transfer amount and the image for determining the center of the component are obtained by the same imaging device. 4. The component mounting method according to claim 1, wherein an abnormality in the flux supply from the flux transfer device is determined by obtaining a temporal change in the flux transfer amount. . 5. A component mounting apparatus that positions and mounts a component having a bump portion to which flux is transferred onto a substrate, and a transfer device that transfers the flux to the bump portion of the component and an image of the bump portion to which the flux is transferred. An image pickup apparatus, an inspection unit that recognizes an image obtained by the image pickup apparatus, and inspects the flux transfer amount; a calculation unit that recognizes the image obtained by the image pickup apparatus and calculates a component center; And a control means for controlling mounting of the component on the board based on the component center calculated above. 6. The component mounting apparatus according to claim 5, wherein an abnormality in the flux supply from the flux transfer device is determined by obtaining a temporal change in the flux transfer amount.