JP4735532B2 - Component mounting apparatus and component mounting method - Google Patents

Description

  The present invention relates to a component mounting apparatus and a component mounting method for mounting a component with a bump having a bump formed on a lower surface on a substrate.

When a component with a bump having a metal bump formed on the lower surface, such as a flip chip or BGA, is mounted on a substrate, a bonding aid such as flux or solder paste (hereinafter simply referred to as “paste”) is used as the metal bump. In this state, the metal bump is landed on the electrode of the substrate. For this reason, a paste transfer unit for transferring the paste is arranged in such a component mounting apparatus for a component with a bump (see, for example, Patent Documents 1, 2, and 3). In any of the patent document examples, as a method for supplying the paste to be transferred to the metal bumps, the shape of the coating film is prepared by moving the squeegee on a flat surface such as a transfer stage so that the paste is adjusted to a certain film thickness. We are trying to supply with.
Japanese Patent No. 3289604 Japanese Patent No. 3399225 Japanese Patent No. 3235755

  By the way, when mounting components with bumps, poor transfer of paste to metal bumps can lead to poor bonding between metal bumps and circuit electrodes. Management considerations are required. However, in the prior art, the transfer state of the paste has not been a target for quality control in the component mounting process in which the transfer operation itself is executed. For this reason, it is often found after the fact that problems such as poor bonding have occurred in the subsequent process and the cause has been traced retroactively, and the paste transfer problem has occurred. There has been a demand for a method for preventing the transfer failure.

  Therefore, an object of the present invention is to provide a component mounting apparatus and a component mounting method that can effectively prevent a transfer failure of paste in a component mounting process.

  The component mounting apparatus of the present invention is a component mounting apparatus that holds a component with a bump having a bump formed on a lower surface by a mounting head and mounts the component on a substrate, and is disposed in a movement path of the mounting head. A paste transfer unit that supplies paste applied by transfer onto the bumps of the component held by the mounting head in the form of a coating film formed on the coating film forming surface of the transfer stage, and a transfer operation that transfers the paste to the bumps. The operation count means for counting the number of times or the operation accumulated time and outputting the count value, and if the count value reaches a preset specified value, the state of the coating film and / or the bump on the coating film In order for the machine operator to visually confirm the state of the transfer mark generated by the contact, the notifying unit is informed and the paste transfer is informed. And control means for performing the coating film transfer state confirmation process of stopping the film formation operation for forming a in the unit.

  Further, the component mounting method of the present invention is a coating formed on the coating film forming surface of the transfer stage with paste applied by transfer onto the bumps of the component held on the mounting head and transferred on the mounting head. A component mounting method in which a component with a bump having a bump formed on a lower surface is held by the mounting head and mounted on a substrate by a component mounting apparatus including a paste transfer unit that supplies the film in the form of a film. If the count value obtained by counting the number of transfer operations or the accumulated operation time for transferring the paste reaches a preset specified value, it is caused by bringing the bump into contact with the state of the coating film and / or the coating film. In order to allow the machine operator to visually confirm the state of the transfer mark, the notifying unit is informed and the paste transfer unit Performing transfer state confirmation process of stopping the film formation operation for forming a Kinurimaku.

  According to the present invention, when the paste transfer unit and the transfer to the bump in the paste transfer unit transfer the number of transfer operations or the count value of the operation accumulated time reaches a predetermined specified value, The image data obtained by imaging the image is recognized and processed to determine the quality of the state of the coating film and the state of the transfer mark, or the operator visually observes the state of the coating film and the state of the transfer mark. Thus, it is possible to effectively prevent the paste transfer failure in the component mounting process.

(Embodiment 1)
FIG. 1 is a front view of a component mounting apparatus according to a first embodiment of the present invention, FIG. 2 is a structural explanatory view of a paste transfer unit in the component mounting apparatus according to the first embodiment of the present invention, and FIG. 3 is an embodiment of the present invention. 4 is a block diagram showing the configuration of the control system of the component mounting apparatus 1, FIG. 4 is a diagram showing a display screen in the component mounting apparatus according to the first embodiment of the present invention, and FIG. 5 is a component mounting method according to the first embodiment of the present invention. It is a flowchart of the transfer state quality determination of the paste in.

First, the configuration of the component mounting apparatus 1 will be described with reference to FIG. The component mounting apparatus 1 has a function of mounting a component with a bump having a bump formed on the lower surface on a substrate by holding it with a mounting head. In FIG. 1, the component mounting apparatus 1 includes a component supply unit 2, a paste transfer unit 4, and a substrate holding unit 9 arranged in a plane in the Y direction, and a component mounting unit configured to move a mounting head 13 by a head moving mechanism 12 above them. A camera 15 that is moved by a mechanism 11 and a camera moving mechanism 16 is provided. In the present specification, the substrate transport direction (perpendicular to the paper surface) in the substrate holder 9 is defined as the X direction.

  The component supply unit 2 is provided with a component tray 2a for storing a plurality of chips 3 in a regular arrangement in a plane. The chip 3 is a component with bumps having bumps 3a formed on the lower surface by solder. A paste transfer unit 4 and a chip disposal box 8 are disposed on the side of the component supply unit 2. The paste transfer unit 4 has a configuration in which a squeegee unit 6 is disposed above the transfer stage 5 so as to reciprocate in the Y direction. A film of a flux 7 as a paste is formed on the transfer stage 5 by the squeegee unit 6. Is done.

  By lifting and lowering the chip 3 held by the mounting head 13 with respect to the transfer stage 5 on which the coating film of the flux 7 is formed, the flux 7 is applied to the bumps 3a of the chip 3 by transfer. That is, the paste transfer unit 4 is disposed in the movement path of the mounting head 13, and the flux 7 applied by transfer onto the bumps 3 a of the chip 3 held by the mounting head 13 is applied to the coating film forming surface of the transfer stage 4. It has a function to supply by forming the formed coating film. A chip disposal box 8 is disposed between the component supply unit 2 and the paste transfer unit 4. After the flux 7 is transferred to the bumps 3 a in the paste transfer operation, a predetermined time has passed without being mounted on the substrate 10. In this case, the chip 3 is thrown into the chip disposal box 8 and discarded.

  The substrate holding unit 9 includes a transport rail 9a disposed in the X direction, and positions and holds the substrate 10 transported from the upstream device. Above the component supply unit 2, paste transfer unit 4, chip disposal box 8, and substrate holding unit 9, a component mounting mechanism 11 having a mounting head 13 is disposed. The mounting head 13 is moved by the head moving mechanism 12. Move in the X and Y directions. The mounting head 13 includes a suction nozzle 14 that sucks and holds the chip 3, and the suction nozzle 14 can be raised and lowered by a lifting mechanism built in the mounting head 13.

  The component mounting operation is performed by combining the horizontal movement of the mounting head 13 in the X and Y directions by the head moving mechanism 12 and the lifting / lowering operation of the suction nozzle 14. That is, the mounting head 13 takes out the chip 3 from the component supply unit 2 by the suction nozzle 14, transfers the flux 7 to the bump 3 a in the paste transfer unit 4, and then transfers the chip 7 to the substrate holding unit 9. 3 is implemented. The camera 15 performs imaging for recognizing the substrate 10 in the component mounting operation, and also performs imaging for determining the quality of the transfer stage 5 in the paste transfer unit 4.

  Next, the structure of the paste transfer unit 4 will be described with reference to FIG. FIG.2 (b) has shown the AA arrow view in Fig.2 (a). The paste transfer unit 4 includes a squeegee unit 6 having a configuration including a rectangular transfer stage 5 having a recess 5 a formed on the upper surface and a pair of squeegees 21 that are lifted and lowered by a squeegee lifting mechanism 20. The bottom surface of the recess 5a is a smooth coating film forming surface 5b, and the coating film 7a is formed on the coating film forming surface 5b by the flux 7 and the squeegee unit 6.

That is, on the transfer stage 5 to which the flux 7 has been supplied in advance, a film forming operation is performed in which the squeegee 21 is moved in the Y direction with a film forming gap maintained between the lower end portion of the squeegee 21 and the coating film forming surface 5b. By doing so, the coating film 7a in which the flux 7 is extended with a predetermined film thickness is formed on the coating film forming surface 5b. Then, by raising and lowering the chip 3 held by the suction nozzle 14 with respect to the transfer area A (see FIG. 2B) set in advance at a certain position on the coating film forming surface 5b, the flux 3 is applied to the bump 3a. Is applied by transfer. By this transfer operation, the bump 7a comes into contact with the coating film 7a, whereby the flux 7 is transferred to the bump 3a to form a transfer mark 7b that is partially removed, and the film forming operation / transfer operation is executed repeatedly. When the flux 7 is consumed, the flux 7 is discharged and supplied onto the coating film forming surface 5b by the flux supply device 22.

  Next, the configuration of the control system will be described with reference to FIG. The control unit 30 is a control calculation processing unit by the CPU, and controls each unit described below. The storage unit 31 stores various programs and data necessary for executing the component mounting operation. The operation / input unit 32 is a human-powered device such as a keyboard or a touch panel, and inputs various data and instructions for operations. The display unit 33 is a display device, and displays a screen such as a warning screen when a paste transfer state confirmation process described later is executed. This display provides necessary notification to the machine operator. That is, the display unit 33 functions as a notification unit that performs necessary notification. An instruction input required in this process is performed by operating a selection button (see FIG. 7) set on the touch panel of the display screen.

  The counting unit 34 counts the number of transfer operations in the paste transfer unit 4, that is, the operation of applying the flux 7 to the bumps 3a by transfer. This count value is used to determine an interval for executing confirmation of the transfer state of the flux 7. That is, the count unit 34 counts the transfer operation executed in the paste transfer unit 4 and outputs a count value, and the control unit 30 compares this count value with a predetermined value stored in the storage unit 31 in advance. Whether the transfer table 5 should be checked for quality, that is, the state of the coating film 7a on the coating film forming surface 5b and the state of the transfer mark 7b generated by bringing the bump 3a into contact with the coating film 7a. Judge whether or not.

  The specified numerical values stored in the storage unit 31 are input according to a desired confirmation interval when setting the operating conditions of the component mounting apparatus 1. Instead of counting the number of transfer operations, the above-mentioned confirmation execution timing may be determined by counting the total operation time of the transfer operation by the counting unit 34. Therefore, the count unit 34 is an operation counting unit that counts the number of transfer operations or the accumulated operation time.

  The head driving unit 35 drives the mounting head 13 and the head moving mechanism 12 that moves the mounting head 13. The squeegee driving unit 36 drives the squeegee unit 6 provided in the paste transfer unit 4. The camera driving unit 37 drives the camera 15 and the camera moving mechanism 16 that moves the camera 15. The recognition unit 38 performs imaging data recognition processing by the camera 15. In other words, the recognition of the position of the substrate 10 is performed by performing recognition processing on the imaging data obtained by imaging the substrate 10 with the camera 15. Further, after the paste transfer operation, the camera 15 recognizes image data obtained by imaging the transfer area A of the transfer stage 5, thereby determining whether the state of the transfer table 5 in the paste transfer unit 4 is good or bad.

  Here, as described above, the state of the coating film 7a on the coating film forming surface 5b, the transfer mark 7b generated when the bump 3a contacts the coating film 7a, or both of them are to be recognized. In other words, the camera 15 and the recognition unit 38 recognize and process the image data acquired by imaging the coating film forming surface 7a after the transfer operation of transferring the flux 7 to the bumps 3a, and thereby the state of the coating film 7a and / or the coating film 7a. A transfer state pass / fail determination means for determining the state of the transfer mark 7b generated by bringing the bump 3a into contact with the film 7a is configured. The execution timing of this pass / fail judgment is instructed by the control unit 30 monitoring the count value of the count unit 34, and if the count value reaches a preset specified value, the transfer state pass / fail judgment means described above. The pass / fail judgment by means of is performed.

With reference to FIG. 4, an example of pass / fail judgment will be described. FIG. 4A shows a case where the state of the transfer mark 7b is normal. The determination screen 40 shows a screen obtained by imaging the transfer area A of the coating film forming surface 5b by the camera 15. In the determination screen 40, the flux image 42 corresponding to the coating film 7a is used as a background image of the chip 3. A transfer mark image 43 corresponding to the transfer mark 7b appears in the component range 41 indicating the outer shape. In FIG. 4A, the transfer trace image 43 appears in an arrangement corresponding to the arrangement of the bumps 3a on the chip 3 without omission, and it is determined that the flux 7 has been normally transferred to all the bumps 3a. .

  On the other hand, in the example shown in FIG. 4B, there is a transfer mark missing portion 43 * in which the transfer mark image 43 does not appear normally despite the position corresponding to the bump 3a in the component range 41. Therefore, it is determined that the flux 7 is not normally transferred to the bump 3a of this portion. This defective example occurs when the chip 3 is on standby with foreign matter adhering to the component suction surface of the suction nozzle 14 or when the transfer stage 5 is slightly inclined for some reason.

  In the example shown in FIG. 4C, the transfer mark image 43 appears normally in the part range 41, and the transfer of the flux 7 to the bump 3a is normal, but the coating film 7a is displayed in the determination screen 40. Is missing a flux image 42, that is, there is a flux missing portion 42 * corresponding to “scratch” of the coating film 7a. In this case, it can be seen that an abnormality has occurred in the coating film formation by the squeegee unit 6. This defective example occurs due to a decrease in the amount of flux 7 stored in the transfer stage 5 or a sliding abnormality of the squeegee 21.

  Next, a flow for determining the quality of the transfer table 5 in the component mounting method by the component mounting apparatus 1 will be described with reference to FIG. In this component mounting method, the chip 3 is taken out from the component supply unit 2 by the mounting head 13, the flux 7 is transferred to the bumps 3 a of the chip 3 by the paste transfer unit 4, and then the mounting head 13 is moved to the substrate holding unit 9. The component mounting operation for mounting the chip 3 on the substrate 10 is repeated. FIG. 5 shows a transfer state determination process in the transfer table 5 performed in the course of executing the transfer operation and transfer operation of the flux 7 in the component mounting operation.

  When the operation starts in FIG. 5, first, a squeegee operation, that is, a film forming operation for moving the squeegee 21 on the transfer stage 5 in the paste transfer unit 4 to form the coating film 7a is executed (ST1). Next, transfer is performed (ST2). That is, the chip 3 is moved up and down with respect to the coating film 7a on the coating film forming surface 5b, and the flux 7 is applied to the bumps 3a by transfer. Then, each time (ST1) and (ST2) are executed, it is determined whether or not the transfer has been executed a predetermined number of times by comparing the count value of the count section 34 with a predetermined numerical value set in advance as the number of interval for state confirmation. However, if the count value does not reach the specified value (ST1), (ST2) is repeated. In (ST3), if the number of transfer operations or the count value of the accumulated operation time has reached a preset specified value, the transfer state pass / fail determination means performs the pass / fail determination.

  That is, the camera 15 is moved onto the transfer stage 5, the transfer area A (see FIG. 2B) is imaged, and the image data is recognized to recognize the state of the transfer table 5 by the camera 15 (ST4). . Then, it is determined whether or not the recognition result is normal, that is, whether or not the defect shown in FIGS. 4B and 4C has occurred (ST5). If normal, the process returns to (ST1) and the normal operation is repeated. If it is determined in (ST5) that it is not normal, the following processing is performed.

First, at this timing, the chip 3 held by the suction nozzle 14, that is, the chip 3 on which the transfer of the flux 7 has not been normally performed, is discarded in the chip disposal box 8 (ST6). Along with this operation, after the apparatus is stopped, it is notified that the recognition result is not normal (ST8).
After discarding the chip, it is determined whether or not the supply number of the flux 7 already executed by the flux supply device 22 is within a predetermined number set as the upper limit number in advance (ST7).

  If the number of times of supply is not within the predetermined number of times, it is determined that the flux 7 has already been sufficiently supplied and some abnormality other than the shortage of flux has occurred. Notify you. If the number of times of supply is within the predetermined number of times, it is determined that a flux shortage may have occurred, and the flux supply device 22 is operated to supply the flux (ST9). Then, the number of times of supply is incremented (ST10), and then a trial for confirming the transfer state is executed.

  That is, the squeegee operation (ST11) and transfer (ST12) are executed in the same manner as in (ST1) and (ST2), and thereafter, the process returns to (ST4) and the state of the transfer table 5 is recognized by the camera 15. When the notification that the recognition result is not normal is issued after the apparatus is stopped in (ST8), the machine operator confirms the state of the transfer stage 5 and performs necessary processing. The above-described processing is executed by the control unit 30 controlling each unit shown in FIG. Therefore, the control unit 30 is a control unit that executes a pass / fail determination by the transfer state pass / fail determination unit when the number of times of transfer operation or the count value of the operation accumulated time reaches a predetermined specified value.

  As described above, in the first embodiment, the count value obtained by counting the number of transfer operations or the accumulated operation time in the formation of the coating film of the flux 7 in the paste transfer unit 4 and the transfer to the bumps 3a is set in advance. When the specified numerical value is reached, the image data acquired by imaging the coating film forming surface 5b is recognized, and the quality of the transfer stage 5 is automatically determined. Thereby, the defect of the coating film 7a and the transfer mark 7b can be reliably detected, and the paste transfer defect can be effectively prevented in the component mounting process.

(Embodiment 2)
FIG. 6 is a flowchart of the paste transfer state confirmation process in the component mounting method of the second embodiment of the present invention, and FIG. 7 is a diagram showing a display screen in the component mounting method of the second embodiment of the present invention. In the second embodiment, a machine operator replaces the method of imaging the coating film forming surface 5b with the camera 15 used in the component mounting method by the component mounting apparatus 1 and determining the quality of the transfer stage 5 by recognizing the state. In this example, the state of the transfer stage 5 is confirmed visually. Other configurations are the same as those in the first embodiment.

  In FIG. 6, (ST21) to (ST23) are the same as (ST1) to (ST3) in FIG. If it is determined in (ST23) that the transfer has been executed a predetermined number of times, an operator call is made by displaying a predetermined warning screen set in advance on the display unit 33, and the apparatus is stopped (ST24). At the time of this operator call, a message screen 44 shown in FIG. 7A is displayed, prompting the machine operator to execute the treatment of the contents displayed on the screen, and the predetermined time set as the allowable use time of the flux 7 has already been reached. A determination is made as to whether or not the time has elapsed (ST25).

If the predetermined time has already passed after the transfer of the flux 7 to the chip 3 held by the suction nozzle 14 at the timing accessed by the machine operator, the message screen 44 shown in FIG. Is displayed. That is, by displaying the message screen 44 of FIG. 7B, in the determination of (ST25), it is clearly shown to the machine operator that the time has already passed over the predetermined time, and the chip discarding is performed. The state waits for input (ST26). Here, when the machine operator operates the selection button 47 on the message screen 44, chip disposal (ST27) is performed in which the mounting head 13 is moved to the chip disposal box 8 and the chip 3a is thrown into the chip disposal box 8 and discarded. Thereafter, a squeegee operation (ST28) and transfer (ST29) for trial are executed. Thereafter, an operator call for visual confirmation of the state of the transfer stage 5 is performed again.

  If the machine operator can confirm the state of the apparatus within the predetermined time after receiving the operator call (ST24), the machine operator follows the display content of the message screen 44 shown in FIG. Then, after visually confirming the state of the transfer stage 5, the following processing is performed (ST30). That is, according to the confirmation result of the state of the transfer stage 5, if necessary, state improvement work such as supply of flux 7 is performed. At this time, the component mounting apparatus 1 is in a state of waiting to determine whether or not the selection button 45 has been pressed, and the machine operator selects to continue production so far and presses the selection button 45 on the message screen 44. By operating, that is, by performing a first instruction input indicating that production by the component mounting apparatus 1 should be continued as usual, the process returns to (ST21) and normal production is continued.

  When the machine operator selects not to immediately return to normal production but to execute the above-described transfer state confirmation process again, this is a selection for confirming the state of the transfer stage 5 immediately after production is resumed. The button 46 is operated. That is, when the selection button 46 is operated in the state where the selection button 45 is not operated in (ST31) and the selection button 46 is waiting for input (ST32), the film forming operation and the transfer to the bump 3a are tried. After that, a second instruction input indicating that the transfer state confirmation process should be executed again is performed. As a result, a trial for checking the state is executed, and after the squeegee operation (ST33) and transfer (ST34) are executed, the process returns to the operator call / device stop (ST24) again. Thereafter, the same processing is repeated.

  The above-described processing is executed by the control unit 30 controlling each unit shown in FIG. Therefore, when the number of transfer operations or the count value of the accumulated operation time reaches a preset specified value, the control unit 30 brings the bump 3a into contact with the state of the coating film 7a and / or the coating film forming surface 5b. In order to allow the machine operator to visually confirm the state of the transfer stage 5 including the generated transfer mark 7b, the display unit 33 having the function of a notification unit is notified of this, and the film transfer operation in the paste transfer unit 4 is stopped. This is a control means for performing the status confirmation process.

  By adopting a configuration in which such a transfer state confirmation process is automatically executed at predetermined intervals, the coating film 7a and the transfer mark 7b are reliably stored in the transfer stage 5. As a result, when there is some defect in the state of the coating film 7a or the transfer mark 7b, the machine operator can surely observe these defect states. That is, in the conventional apparatus, the film transfer operation is always repeatedly performed in the paste transfer unit 4 while the production is continued. Therefore, even when there are some defects in the coating film 7a and the transfer mark 7b, these defects are eliminated. It was difficult to detect by visual observation. On the other hand, in the component mounting apparatus 1 shown in the present embodiment, the timing of visual observation for monitoring these defects is always automatically provided to the machine operator.

  The operation / input unit 32 receives the above notification, and after the machine operator performs the above-mentioned visual confirmation, the instruction input means for the machine operator to selectively perform the first instruction input or the second instruction input. Configure. Here, a touch panel including selection buttons 45 and 46 set on the message screen 44 displayed on the display unit 33 is the operation / input unit 32.

In the flow shown in FIG. 6, if the count value obtained by counting the number of transfer operations or the accumulated operation time reaches a preset specified value, the state of the coating film 7 a and / or the bump 3 a is brought into contact with the coating film 7 a. In order to allow the machine operator to visually confirm the state of the transfer stage 5 including the transfer mark 7b generated by this, a notification state is notified and a transfer state confirmation process for stopping the film forming operation is performed. Further, after the visual confirmation of the state of the transfer stage 5 is executed, the display unit 33 displays that the machine operator should selectively perform the first instruction input or the second instruction input described above. Yes.

  By adopting such a configuration, the machine operator reliably confirms the state of the transfer table 5 to detect defects in the coating film 7a and the transfer mark 7b without requiring functions such as image recognition by a camera. Therefore, transfer failure of the paste can be effectively prevented in the component mounting process.

  INDUSTRIAL APPLICABILITY The component mounting apparatus and the component mounting method according to the present invention have an effect of effectively preventing paste transfer failure in a component mounting process, and are useful in the field of mounting a component on which a bump is formed on a substrate. .

The front view of the component mounting apparatus of Embodiment 1 of this invention Structure explanatory drawing of the paste transcription | transfer unit in the component mounting apparatus of Embodiment 1 of this invention The block diagram which shows the structure of the control system of the component mounting apparatus of Embodiment 1 of this invention The figure which shows the display screen in the component mounting apparatus of Embodiment 1 of this invention Flow chart of pass / fail judgment of paste transfer state in component mounting method of Embodiment 1 of the present invention Flow chart of paste transfer state confirmation process in component mounting method of embodiment 1 of the present invention The figure which shows the display screen in the component mounting apparatus of Embodiment 1 of this invention

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 2 Component supply part 3 Chip (component)
3a Bump 4 Paste transfer unit 5 Transfer stage 5a Coating film forming surface 6 Squeegee unit 7 Flux (paste)
7a Coating film 7b Transfer mark 9 Substrate holding part 10 Substrate 13 Mounting head 15 Camera 21 Squeegee

Claims (4)

A component mounting apparatus for holding a bumped component with a bump formed on the lower surface by a mounting head and mounting the component on a substrate,
Paste transfer, which is disposed in the movement path of the mounting head and supplies paste applied by transfer to the bumps of the components held by the mounting head in the form of a coating film formed on the coating film forming surface of the transfer stage Unit,
The operation count means for counting the number of transfer operations or the operation accumulated time for transferring the paste to the bumps and outputting the count value, and if the count value reaches a preset specified value, the state of the coating film And / or forming the coating film in the paste transfer unit and informing the notification section so that a machine operator can visually confirm the state of the transfer mark generated by bringing the bump into contact with the coating film. A component mounting apparatus comprising: a control unit that performs a transfer state confirmation process for stopping the operation. After the machine operator has performed the visual confirmation in response to the notification, the first instruction input that the production by the component mounting apparatus should be continued as usual, or the film forming operation and the transfer to the bumps are tried. the transfer status second instruction inputs the confirmation processing that should be executed again, the machine operator component mounting apparatus according to claim 1, comprising the instruction input means for performing selectively after . A paste transfer unit that is disposed in the movement path of the mounting head and supplies the paste applied by transfer onto the bumps of the components held by the mounting head in the form of a coating film formed on the coating film forming surface of the transfer stage. A component mounting method comprising: mounting a component with a bump having a bump formed on a lower surface thereof by the component mounting apparatus, and mounting the component on a substrate.
If the count value obtained by counting the number of transfer operations or the accumulated operation time for transferring the paste to the bumps reaches a predetermined specified value, the state of the coating film and / or the bump is brought into contact with the coating film In order to allow the machine operator to visually confirm the state of the transfer mark generated by the above, the notification unit is informed so that the transfer state confirmation process for stopping the film forming operation for forming the coating film in the paste transfer unit is performed. A component mounting method characterized by the above. After executing the visual confirmation, the first instruction input that the production by the component mounting apparatus should be continued as usual, or the transfer state confirmation process after the film formation operation and the transfer to the bump are tried. 4. The component mounting method according to claim 3 , wherein a second instruction input to be executed again is displayed on the display unit so that the machine operator should selectively perform.

Images