JP4607610B2 - Electronic component disposal method and electronic component mounting machine - Google Patents

Description

  The present invention relates to an electronic component disposal method and an electronic component mounting machine that separate and discard electronic components based on whether or not an application member is applied to the electronic components.

  In general, in an electronic component mounting machine, before mounting an electronic component sucked by a mounting head on a substrate, the electronic component suction state and the like are inspected, and the inspection result is determined to be NG, that is, a substrate Electronic components that are determined to be unsuitable for mounting are excluded.

As this type of electronic component mounting machine, for example, those described in Patent Document 1 and Patent Document 2 are known. The one described in Patent Document 1 separates and collects electronic parts determined to be NG into waste parts and reusable parts (reusable parts are further separated and collected according to part shape, part type, failure factor, etc.) In addition, the device described in Patent Document 2 determines whether or not a flux having an oxide film removing action is applied to the electronic component, and the flux is applied to the electronic component that requires application of the flux. After that, when the suction state of the electronic component is inspected and is not normal, the electronic component is discarded.
JP-A-3-36800 JP 2003-298291 (paragraphs 0034 to 0036, FIGS. 1 and 6)

  By the way, it is desirable to dispose of the electronic component to which the flux is attached differently from the component to which the flux is not attached due to the influence on the environment, but the one described in Patent Document 1 is determined to be NG. It is only necessary to classify the parts into waste parts and reusable parts, and further sort the reusable parts according to the type of the part, the cause of failure, and the like. Moreover, the thing described in patent document 2 is only mixed and discarded, regardless of the electronic component to which the flux is attached and the electronic component to which the flux is not attached, as the component determined as NG.

  Therefore, when an electronic component judged to be NG and treated as an industrial waste is processed, there is a problem that it is necessary to separate the electronic component coated with a flux from the other electronic component. is there.

  The present invention has been made to solve the above-described conventional problems, and when discarding an electronic component determined to be NG, sorting is performed based on the determination result of whether or not an application member is applied to the electronic component. An object of the present invention is to provide an electronic component sorting and discarding method and an electronic component mounting machine which are to be discarded.

In order to solve the above-described problems, the invention according to claim 1 includes at least a storage area for storing an electronic component coated with an application member and a storage area for storing the electronic component not coated with the coating member. has a fractionation container was partitioned, between the period from the adsorbing the electronic component mounting head to be mounted on the substrate, together with the application member to the electronic component to determine whether it is applied, the electronic component determines whether or not attached to the substrate, in the case of discarding the electronic component is determined to not be mounted, on the basis of the application member is whether it is applied the determination result, the electrons the coating member is applied The electronic component discarding method is characterized in that the electronic component to which the component and the application member are not applied is separated into the separate storage areas of the separate container and discarded.

  A second aspect of the present invention is the electronic component disposal method according to the first aspect, wherein the determination as to whether or not the electronic component can be mounted on a substrate is performed before an application member is applied to the electronic component.

The invention according to claim 3, coating the mounting head to be mounted on the substrate adsorbs the electronic components, and an image recognizing the image recognition unit the electronic component sucked to said mounting head, the coating member to the electronic component A separating container that is divided into a coating unit that houses at least the electronic component coated with the coating member, and a housing area that houses the electronic component not coated with the coating member, and the image recognition discarded fractionating said electronic component in which the electronic components of the electronic component and the coating member to which the coating member is applied when the mounting is recognized as impossible to the substrate by means not applied to the respective containment area An electronic component mounting machine characterized in that the electronic component mounting machine is constituted by a separate disposal accommodating means.

According to the first aspect of the present invention, when an electronic component that is determined to be unmountable on the board is discarded, the electronic device to which the coating member is applied is determined based on the determination result of whether or not the coating member is applied. Since the electronic component to which the component and the application member are not applied is separated and disposed in separate storage areas of the sorting container , the electronic component and the application member to which the application member is applied are disposed when the electronic component is discarded. There is an effect that it is possible to accurately cope with a different post-process in an uncoated electronic component.

  According to the second aspect of the present invention, the determination as to whether or not the electronic component can be mounted on the substrate is made before the application member is applied to the electronic component, so that the electronic component cannot be mounted on the substrate. The member is not attached, and there is an effect that the separation and disposal process can be performed more easily.

According to the invention of claim 3, the classification container that is divided into a housing area that houses at least an electronic component to which the coating member is coated and a housing area that houses an electronic component to which the coating member is not coated, and image recognition Separating and storing accommodation means for separating and discarding an electronic component coated with a coating member and an electronic component coated with no coating member when each means recognizes that the electronic component cannot be mounted on the substrate. Thus, there is an effect that it is possible to realize an electronic component mounting machine capable of accurately separating and discarding an electronic component applied with an application member having a different post-process and an electronic component not applied with an application member.

  A first embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 is a schematic diagram of an electronic component mounting machine, FIG. 2 is a control block diagram of the electronic component mounting machine, 10 is a mounting head, and the mounting head 10 is a suction nozzle 12 that sucks an electronic component 11 at the tip. The suction nozzle 12 can be rotated around the nozzle axis by a θ-axis motor 16. The mounting head 10 can be moved in a horizontal XY plane by an X-axis motor 13 and a Y-axis motor 14, and is moved up and down in the Z-axis direction perpendicular to the XY plane by a Z-axis motor 15. It is possible.

  The electronic component 11 includes an electronic component having a bonding portion such as a bump or an electronic component with a lead. When the electronic component having the bonding portion is mounted on the substrate 17, the bonding portion has an oxide film removing action. Flux is applied.

  The electronic component mounting machine is provided with an image recognition station ST1, a flux application station ST2, and a sorting accommodation station ST3. The image recognition station ST1 is provided with an imaging device 21 such as a CCD camera for inspecting the suction state of the electronic component 11, the chipping of the joint (bump), the application state of the flux, or the like. The image captured by the imaging device 21 is recognized by the image recognition device 22, and the recognition result is output to the control device 23.

  The flux application station ST2 is provided with a flux application device 27 including a flux tank 26 in which the flux 25 is accommodated. When the electronic component 11 that needs to be coated with the flux 25 is sucked and held by the suction nozzle 12, the mounting head 10 is transported to the flux coating station ST2, and is sucked by the relative movement of the mounting head 10 and the flux tank 26 in the vertical direction. The flux 25 in the flux tank 26 is applied to the joint portion of the electronic component 11 that is sucked and held by the nozzle 12.

  The sorting accommodation station ST3 is provided with a sorting container 30 for sorting and storing the electronic components 11 determined to be NG. Here, the electronic component mounting machine in the embodiment is to mount the electronic component 11 that requires the application of flux, such as a flip chip, and the electronic component 11 that does not require the application of the flux in a mixed manner. Therefore, the inside of the separation container 30 is divided into four accommodation areas as an example.

  That is, a reusable electronic component 11 out of the electronic components 11 to which the flux is attached is attached to the first storage area 30a of the separation container 30, and a flux is attached to the second storage area 30b. Electronic components 11 that cannot be reused are accommodated. Further, among the electronic components 11 to which the flux is not attached to the third accommodation area 30c, those that can be reused, and to the fourth accommodation area 30d, the electronic components 11 to which the flux is not attached. Of these, those that cannot be reused are accommodated.

  In FIG. 1, reference numeral 31 denotes a component supply device. The component supply device 31 is a tray component supply device 33 that supplies electronic components stored in a tray 32, and a tape component that supplies electronic components sealed in a tape 34. A supply device 35 is used. In the tray component supply device 33, a plurality of trays 32 are stored in storage shelves partitioned in the vertical direction, and predetermined trays 32 storing electronic components to be mounted on the substrate 17 are pulled out step by step.

  Next, the operation of the above-described embodiment will be described.

  The mounting head 10 first sucks the electronic component 11 to be mounted on the substrate 17 to the suction nozzle 12. When it is necessary to apply a flux to the electronic component 11 sucked by the suction nozzle 12, the mounting head 10 is transferred to the flux application station ST2, and when it is not necessary to apply the flux to the electronic component 11, the mounting head. 10 is conveyed to the image recognition station ST1. The mounting head 10 conveyed to the flux application station ST2 is moved relative to the flux tank 26 in the vertical direction, and the flux 25 is applied to the joint (bump) of the electronic component 11. Thereafter, the mounting head 10 is conveyed to the image recognition station ST1.

  In the image recognition station ST1, the electronic component 11 is picked up by the image pickup device 21 and the image is recognized by the image recognition device 22. By such image recognition, the suction state of the electronic component 11, the chipping of the bump, the application state of the flux, or the like is recognized, and the result of the image recognition is output to the control device 23.

  FIG. 3 is a flowchart showing an example of the sorting and discarding of the electronic component 11 executed by the control device 23 based on the image recognition. The processing operation will be described below.

  First, in step 100, it is determined whether or not the electronic component 11 requires flux application. In the case of the electronic component 11 that does not require the application of flux (when the determination result is NO), the process proceeds to step 102 and it is determined whether or not the bump is missing. In the case of the electronic component 11 in which bumps are missing (when the determination result is YES), the fourth storage area 30d of the sorting container 30 as a defective product (reuse of the electronic component 11 without flux adhesion is reused). A sorting and discarding process is instructed to an area that accommodates impossible electronic components (step 104). As a result, the mounting head 10 that sucks and holds the electronic component 11 is transported to the sorting housing station ST3, and the electronic component 11 is sorted and discarded in the fourth housing area 30d of the sorting container 30.

  If the decision result in the step 102 is NO, in a succeeding step 106, it is judged whether or not the suction state of the electronic component 11 is normal. If the determination result is NO (absorption state abnormality), it cannot be mounted on the substrate 17, but the component itself is not defective, so the third accommodation area 30c of the separation container 30 (the electronic component 11 without flux adhesion). A sorting / disposal process is instructed to an area containing electronic components that can be reused (step 108). As a result, the mounting head 10 that sucks and holds the electronic component 11 is transported to the sorting housing station ST3, and the electronic component 11 is sorted and discarded in the third housing area 30c of the sorting container 30.

  If the determination result in step 106 is YES (normal suction state), the component is normal and suitable for mounting on the substrate 17, and therefore the execution of the electronic component mounting process is commanded in step 110, and the electronic component mounting is performed. The process is started.

  On the other hand, if it is determined in step 100 that the electronic component 11 requires flux application (if the determination result is YES), the process proceeds to step 112 to determine whether or not a bump defect has occurred. The In the case of the electronic component 11 in which the bumps are missing (when the determination result is YES), the first accommodation area 30d of the sorting container 30 as a defective product (reuse of the electronic component 11 with flux adhesion is reused). The sorting and discarding process to the area in which the unusable electronic component is accommodated is instructed (step 114), and the mounting head 10 that sucks and holds the electronic component 11 is transported to the sorting housing station ST3, and the electronic component 11 is separated into the sorting container 30 The first storage area 30a is separated and discarded.

  If the decision result in the step 112 is NO, in a succeeding step 116, it is judged whether or not the component suction state is normal. If the determination result is NO (absorption state abnormality), it cannot be mounted on the substrate 17, but the component itself is not defective, so the second accommodation area 30b of the separation container 30 (the electronic component 11 with flux adhesion). The separation disposal process to an area that accommodates electronic components that can be reused is instructed (step 118), and the mounting head 10 that sucks and holds the electronic component 11 is transported to the separation accommodating station ST3, where the electronic component 11 is removed. The waste is separated into the second storage area 30b of the separation container 30.

  If the determination result in step 116 is YES (adsorption state normal), it is further determined in step 120 whether or not the flux application state is appropriate. If the determination result is YES (application state appropriate), the part Is normal and suitable for mounting on the substrate 17, the process proceeds to step 110. However, if the determination result is NO (inappropriate application state), the process proceeds to step 118, and the sorting and discarding process to the second storage area 30b of the sorting container 30 is commanded.

  The parts that are separated and discarded in the second storage area 30b of the separation container 30 are reused after the flux is removed by the cleaning process.

  According to the first embodiment described above, since the electronic component 11 to which the flux is attached can be separated into the predetermined area of the separation container 30, the electronic component 11 to which the flux is attached is discarded. It is possible to accurately cope with the case where the post-process is different due to environmental influences.

  Note that when separating parts that do not require flux application, not only whether the above-mentioned component adsorption state is normal, but in the case of bumped parts, the position of the bumps, and in the case of leaded parts, If the lead bend or lead bend is recognized by image recognition and the lead bend can be easily corrected, it is separated into the reusable storage area 30c, and the bump position is incorrect. Those with defects or those whose lead bending cannot be corrected can be sorted into the waste accommodation area 30d, and the determination elements shown in FIG. 3 are merely examples for ease of explanation. It's just a thing.

  4 and 5 show a second embodiment of the present invention. The difference from the first embodiment is that image recognition is performed before the flux application process. Thereby, in 2nd Embodiment, when it is judged that the electronic component 11 is inferior goods by the image recognition before a flux application | coating process, it is not necessary to apply | coat a flux. Therefore, the separation container 30 described in the first embodiment has a reusable housing area (30e) and a non-reusable housing area (30f) for housing the electronic component 11 to which flux is not attached, and flux is attached. It is divided into three areas, a reusable accommodation area (30 g) for accommodating the used parts.

  In the second embodiment, when the electronic component 11 is attracted to the mounting head 10, the mounting head 10 is first moved to the image recognition station ST1, and the first image recognition is performed. By this image recognition, the suction state of parts to which flux is not applied, the chipping of bumps, and the like are recognized, and the result of image recognition is output to the control device 23.

  FIG. 4 is a flowchart showing an example of the sorting and discarding of the electronic component 11 executed by the control device 23 based on the first image recognition. First, in step 200, it is determined whether or not the bump is missing, and the bump In the case where there is a missing chip, a sorting and discarding process is commanded to the area (30f) in which the electronic component 11 in which the sorting container 30 cannot be reused as a defective product is stored (step 202). If the bump is not missing, it is determined in step 204 whether the component suction state is normal. If the determination result is NO (absorption state abnormality), it cannot be mounted on the substrate 17, but the component itself is not defective. Therefore, the area (30e) for accommodating the electronic component 11 in which the separation container 30 can be reused. The sorting and discarding process is ordered (step 206). If the determination result is YES (adsorption state normal), the process proceeds to step 208 to determine whether or not the electronic component 11 requires flux application. In the case of the electronic component 11 requiring flux application, the execution of the flux application process is commanded (step 210), and the flux is applied to the joint (bump) of the electronic component 11 by being conveyed to the flux application station ST2. The In the case of the electronic component 11 that does not require the application of flux, the execution of the electronic component mounting process is commanded (step 212) as being suitable for mounting on the substrate 17.

  When the application of the flux to the electronic component 11 is completed, the mounting head 10 is moved again to the image recognition station ST1, and the second image recognition is performed. In the second image recognition, there is a possibility that the position of the component has shifted during flux application, so it is recognized whether the component adsorption state is normal and whether the flux application state is appropriate. Is done. The result of the image recognition is output to the control device 23.

  FIG. 5 is a flowchart showing an example of sorting and discarding of the electronic component 11 executed by the control device 23 based on the second image recognition. First, in step 220, it is determined whether or not the suction state of the electronic component 11 is normal. Is done. If the electronic component 11 is not normally sucked, the electronic component 11 cannot be mounted on the board 17, but the component itself is not defective. The sorting and discarding process to the area (30g) to be processed is instructed (step 222). If the suction state of the electronic component 11 is normal, it is determined in step 224 whether or not the flux application state is appropriate. If the determination result is YES (application state appropriate), all the electronic components 11 are normal. Therefore, execution of the electronic component mounting process is commanded (step 226). When the determination result in step 224 is NO (application state is inappropriate), the process proceeds to step 222.

  As described above, when NG is detected in the second image recognition, there is no problem in the component itself, and the electronic component 11 to which the flux adheres is cleaned and reused.

  As described above, in the second embodiment, since the image recognition is performed twice, the tact time becomes long. However, since the quality of the component itself can be determined before the flux application process, the mounting on the substrate 17 is not necessary. The flux does not adhere to the impossible electronic component 11.

  Note that the flowcharts shown in FIGS. 3 to 5 are merely examples of the present invention, and the present invention is not limited to these, and can take various forms without departing from the gist of the present invention.

  In the above-described embodiment, the example in which the flux is applied to the joint portion of the electronic component 11 has been described. However, as the application member applied to the electronic component 11, in addition to the flux, an application member such as solder or adhesive may be used. In addition, the present invention can be applied to the case where the electronic parts coated with solder, adhesive, and the like are separated and discarded.

  Furthermore, in the above-described embodiment, from the viewpoint of reusing what can be reused, it is possible to reuse electronic components that can be reused and electronic components that cannot be reused, independently of whether the flux is attached. In this example, the separation container 30 is divided into four or three areas so as to be separated. However, when all the electronic components that cannot be mounted are discarded without being reused, the electronic components may be separated into two, that is, those with attached flux and those that are not attached.

  Contrary to the above, it is also possible to further subdivide the accommodation area of the separation container 30 and separate the parts to which the flux is applied and the reusable parts according to the kind of component, the cause of failure, and the like. .

  Although the method for separating and discarding chemical substances such as flux is somewhat different, the above-described method for separating and discarding stores information in an electronic component such as an IC, reads this information with a reader, and stores the information. The present invention can also be applied to a technology for determining whether or not a product is good and sorting and discarding electronic components that are determined to be defective.

It is a schematic diagram of the electronic component mounting machine which shows the 1st Embodiment of this invention. It is a control block diagram of an electronic component mounting machine. It is a flowchart which sorts and discards an electronic component based on image recognition. 12 is a flowchart illustrating a second embodiment in which electronic components are separated and discarded based on the first image recognition. It is a flowchart which discards an electronic component separately based on the image recognition of the 2nd time.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 10 ... Mounting head, 11 ... Electronic component, 12 ... Adsorption nozzle, 17 ... Substrate, 21 ... Imaging device, 22 ... Image recognition device, 23 ... Control device, 25 ... Flux, 26 ... Flux tank, 27 ... Flux coating device, 30 ... Separation container, 30a, 30b, 30c, 30d ... Storage area, 31 ... Part supply device, ST1 ... Image recognition station, ST2 ... Flux application station, ST3 ... Separation storage station.

Claims (3)

A separation container that is divided into a housing area that houses at least an electronic component to which a coating member has been coated and a housing area that houses the electronic component to which the coating member has not been coated; during the period from to to be mounted on the substrate above, together with the application member to the electronic component to determine whether it is applied, which determines whether or not attached to the substrate of the electronic component, is determined not be mounted When discarding an electronic component, based on a determination result of whether or not the application member is applied, the electronic component to which the application member is applied and the electronic component to which the application member is not applied are separated and accommodated. electronics Shinahai棄方method and discards it fractionated into separate the housing area of the vessel. In claim 1, the electronic unit Shinahai棄方method to perform before the determination of whether or not attached to the substrate of the electronic component, wherein the electronic component applying member is applied. A mounting head for mounting a substrate to suck the electronic component, and the image recognizes the image recognition means the electronic component sucked to said mounting head, and application means for applying a coating member to the electronic component, at least the coating member A separation container that is divided into a storage area that stores the electronic component to which the electronic component is applied and a storage area that stores the electronic component to which the application member is not applied, and the image recognition means applies the electronic component to the substrate. wearing said application member when it is recognized impossible constituted by the separate disposal accommodating means for discarding by fractionating said electronic component in which the coating member and the electronic component that has been applied is not applied to the respective containment area An electronic component mounting machine characterized by that.

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