JP2000036694A - Parts mounting method and device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable mounting of only good ones of various sorts of parts and also enable discarding and collection of defective parts as required. SOLUTION: A parts treating tool 12, while repetitively moving along a predetermined locus 16, picks up a part to be supplied and mounts it on an object 2 to be mounted, and the mounting of the parts on the object is judged by an inspection part 13. It is judged by the inspection part 13 whether the part is a good 1a or defective. The defective part is discharged at a defective part discharging part 15, but treatment of the part is changed depending as required. When the defective part is required to be collected, the defective part discharged from the tool 12 is accepted and collected by a defective part collecting part 17 so as not to be accepted and discarded by a defective part discarding part 18.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for mounting a component, for example, a method of temporarily mounting or mounting various electronic components on a circuit board and mounting the components to manufacture an electronic circuit board. Applies to cases.

[0002]

2. Description of the Related Art FIG. 7A shows a typical example of a conventional electronic component mounting apparatus.

This device is suitable for handling various kinds of electronic components f at high speed, and is equipped with a plurality of suction nozzles c as a component handling tool in the circumferential direction of a mounting head b on which a component handling mechanism a rotates. A first d is arranged around a center d (FIG. 7 (b)) corresponding to the rotation axis of the mounting head b.
The stations 1 to 16 for performing the sixteenth various operations are sequentially and repeatedly moved in a direction shown by arrows in FIGS. 7A and 7B along a fixed circular orbit, and each suction nozzle c is moved to each station. The rotation is temporarily stopped each time the rotation reaches 1 to 16. In each of the stations 1 to 16, work to be performed on the electronic component f held by the stopped suction nozzle c is assigned as necessary.

[0004] As shown in FIGS.
The station 8 corresponds to the component supply unit e, and sucks, holds and picks up a predetermined electronic component f supplied by the component supply unit e by the corresponding suction nozzle c. The electronic component f picked up by the suction nozzle c is
When you stop at the station 10
A rotation operation of θ1 is performed to adjust the orientation of the electronic component f in order to perform necessary inspections such as a posture, a defect, and a thickness.

When the vehicle arrives at the twelfth station 12 and stops temporarily, the suction position of the electronic component f is image-recognized by the recognition section j having the recognition camera. When the electronic component f reaches the fourteenth station 14 and is temporarily stopped, the electronic component f is rotated by θ2 based on the recognition result of the suction posture so that the electronic component f has the predetermined suction posture. Further, a two-dimensional inspection such as the thickness of the electronic component f is performed by the inspection unit k. When the station 16 is temporarily stopped after reaching the sixteenth station 16, the circuit board h to be mounted is orthogonally moved in response to the fact that the suction nozzle c only moves along a fixed trajectory between the stations 1 to 16. By moving the table i that moves in the XY2 directions, the position where the electronic component f of the circuit board h is to be mounted next is moved to a position that matches the axis of the suction nozzle c stopped at the sixteenth station 16. The electronic component f, which is held by the suction nozzle c and is determined to be non-defective in the inspection, is mounted at a predetermined position on the circuit board h by lowering the suction nozzle c and releasing suction.

The electronic component f determined to be defective is the second electronic component f.
Carried to station 2 of the second station 2
, And is temporarily stopped in the component disposal box m by suction release to be disposed. At the same time, the suction nozzle c is returned to its original position by the rotation of θ1 and θ2, −θ rotation is performed, and the suction nozzle c is cleaned to prepare for the next suction of the electronic component f. Utilizing the temporary stop at the third station 3 to the fifth station 5, the switching of the size S, L, M or the type of the suction nozzle c corresponds to the type information of the electronic component f to be suctioned next. Done. When reaching the sixth station 6 and temporarily stopping, the size and type of the suction nozzle c that has arrived are checked. Next, when the electronic component f reaches the eighth station 8 and is temporarily stopped, the supplied electronic component f is sucked, held, and picked up by the suction nozzle c of the type and size corresponding to the electronic component f. Thereafter, the above operation is repeated, and various electronic components f are sequentially and temporarily mounted or mounted on the circuit board h to manufacture an electronic circuit board.

On the other hand, the number of electronic components f mounted on the circuit board h is steadily increasing, and the number of pins is increased and the size is increased as in the case of QFP (Quad Flat Package) with the miniaturization of components. I have. This includes
A large number of component supply units e are provided, and various component supply mechanisms corresponding to the various types of electronic components are juxtaposed and selectively used, and a large number of suction nozzles c for handling electronic components f are provided. The type and size are selected and used. As a result, even an electronic circuit board that requires various types of electronic components can be manufactured by one or a small number of component mounting devices.

[0008]

However, in the above-described conventional component mounting apparatus, all of the electronic components f determined to be defective are randomly discharged into the disposal box m and discarded. This was not a particular problem while the electronic components f to be handled mainly handled from small electronic components f called chip components to fine electronic components f.

However, large electronic components such as QFPs
When special electronic components f are handled, if these are determined to be defective based on the same standards as those for small electronic components f and discarded, they will be discarded even when repair is difficult, resulting in high cost. The use efficiency of the electronic component f is greatly reduced, which greatly affects the product cost. It is also becoming a problem in resource saving.

It is an object of the present invention to provide a component mounting method and an apparatus for mounting various components only on good products and discarding and collecting defective products according to the necessity of collection.

[0011]

In order to achieve the above object, a component mounting method according to the present invention picks up a component supplied by a component supply unit using a component handling tool, carries the picked-up component, and causes the inspection unit to carry it. Inspection of parts, mounting of non-defective products to the mounting target in the component mounting section, and the handling of sequentially discharging defective products in the defective product discharging section are repeated on a certain movement locus, and only non-defective products are mounted on the mounting target. Then, depending on the necessity of collecting the defective products discharged to the defective product discharge unit, the defective products are sorted and discharged to the defective product collection unit and the defective product disposal unit. One of the features of the present invention is that defective products are provided for collection by discharging wastewater.

As described above, while the component handling tool repeatedly moves on the predetermined movement trajectory, it picks up the component supplied by the component supply unit and mounts the component on the mounting target. Performed on the determined parts, and the parts that were determined to be defective are ejected by the defective product discharge unit so that they are not mounted or obstructed, and only non-defective products are mounted on the mounting target. The handling of defective products discharged at the discharge unit is changed according to the necessity of collection, and when the defective product needs recovery, the defective product discharged from the parts handling tool is received and collected by the defective product collection unit. The defective product to be ejected is received by the defective product disposal unit for disposal without the special operation of the component handling tool that moves along a predetermined movement trajectory. At the same time, large or special and expensive electronic components can be collected and reused without being discarded. Can be prevented.

When the defective product collecting section and the defective product discarding section are selectively used according to the necessity of collecting the defective products discharged from one defective product discharging section, one operation for temporarily stopping the component handling tool is performed. At the station, two treatments for the disposal and recovery of the discharged parts can be achieved without mutual influence.

The above-mentioned method comprises a component supply unit, an inspection unit for inspecting the quality of components, a component mounting unit for holding components to be mounted and providing non-defective products, and a defective product for discharging defective products. The parts supplied by the discharge unit and the parts supply unit are picked up by the parts handling tool and carried,
It has a parts handling mechanism that repeats the inspection in the inspection section, the mounting of non-defective products in the component mounting section, and the discharge of defective products in the defective product discharge section, sequentially with a certain movement trajectory. The discharge unit is provided with a defective product collection unit and a defective product disposal unit that individually receive the defective products to be discharged according to the necessity of collection. One side that responds to the need to collect defective products,
In a component mounting apparatus, comprising a moving mechanism for switching and moving to a defective product discharging position from a component handling tool, the components, the component handling mechanism, and the moving mechanism are operated in association with each other according to a predetermined program. Achieved automatically and stably.

[0015] A defective product discharging section is provided in the component mounting section so that mounting and dismounting of the component can be performed in accordance with the quality of the component and the necessity of collection.
By discharging defective products to the defective product collection unit and discharging defective products to the defective product disposal unit, three types of processing corresponding to the quality of parts and the necessity of collection can be performed in one work station. I can do it. For this purpose, it is only necessary to provide a defective product discharging unit in the component mounting unit, and the moving mechanism can share a moving table for holding the mounting target of the component mounting unit and moving it to various component mounting positions. There is no need to provide it separately,
The moving table can correspond to a normal moving table that moves in the orthogonal XY2 directions.

The defective product collection unit has a plurality of component holding units that individually receive the defective products. When the defective products that need to be collected and discharged are individually received and held in the plurality of component holding units,
In handling the defective products that need to be collected, they can prevent mutual interference and damage due to them, which is advantageous for reuse, and confuses the defective products held individually in each component holder. And can be used for collection. In addition, by keeping the positional relationship between the component holding portions constant, the position where the defective product that needs to be collected is specified is specified, which is convenient for performing the collecting operation by an automatic mechanism.

By sucking and holding the defective products received by the component holding unit, the held defective products can be kept and held in a predetermined posture and position until the collected defective products are used for collection. Can be ensured that it is achieved. In order to do this, the component holding unit is connected to one suction source, and an automatic valve for opening the suction port in response to receiving the defective product and sucking the defective product, and a separate connection line for the suction source. If an on-off valve that opens and closes is provided, when an inferior product to be discharged is held, the automatic valve works to achieve suction holding automatically and in a timely manner. Can be prevented from being caused by the timing shift. When the held defective products are used for collection, the connection with the suction source is individually cut off by operating an open / close valve, etc. It can be carried and collected.

A judging means for judging that the condition that the component holding portion is full is reached, and the mounting operation of the component is temporarily interrupted by the judgment by the judging means, and / or the reuse of the defective product to be collected is promoted. By providing recovery preparation means for issuing a warning, for example, by taking up and recovering the component holding section when it becomes full,
It is possible to prevent a situation in which the component holding unit is continuously filled with defective products and cannot respond to defective products subsequently discharged.

A component handling mechanism includes a suction nozzle as a component handling tool, and a switching valve for switching the suction nozzle between a suction source and a blow source for connection, and a blow pressure in a connection line between the suction nozzle and the blow source in two stages. By using a suction nozzle as a component handling tool, a suction valve is used as a component handling tool. When switching the nozzle from suction to blow with a higher blow pressure than when switching the suction nozzle from suction to blow when mounting a good product to the mounting target, and blowing off the defective product, the parts can be removed. The blow pressure at the time of mounting is maintained by releasing the suction state of the suction nozzle that has The parts are kept at a strength that does not cause the parts to be displaced from the predetermined position to be mounted, and are separated from the suction nozzle without fail. Therefore, it is possible to prevent the discharge failure from occurring and the component recovering unit from being unrecoverable or falling to a problem area.

Further objects and features of the present invention will become apparent from the following detailed description and the accompanying drawings. Each feature of the present invention can be used alone or combined in various combinations as much as possible.

[0021]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS One representative embodiment of the present invention, together with its embodiment, will be described below with reference to FIGS. 1 to 6 for an understanding of the present invention.

In this embodiment, as shown in FIGS. 1 and 2, an electronic circuit board is manufactured by mounting various electronic components 1 on a circuit board 2 to be mounted, for example, in a temporarily mounted or mounted state. It is. If the mounting is temporary, post-processing such as reflow processing is required to make the mounting state. The present invention is not limited to these, and can be similarly applied to various cases in which various parts are handled variously and mounted on a mounting target to manufacture, finish, or assemble various products.

The component mounting method according to the present embodiment will be described with reference to the component mounting apparatus shown in FIGS. 1 and 2. Various component supply mechanisms corresponding to the types of electronic components 1 to be handled, similarly to the conventional case. The various electronic components 1 supplied by the various component supply units 11 equipped with the components are picked up by the component handling tool 12, carried, and inspected by the inspection unit 13, and inspected by the inspection unit 13, and the circuit board 2 by the component mounting unit 14 of the non-defective product 1 a. And the handling for discharging the defective product 1b in the defective product discharging unit 15 is repeatedly performed on a certain movement locus 16,
Only the non-defective product 1a is mounted on the circuit board 2. At this time, depending on the necessity of collecting the defective product 1b discharged to the defective product discharge unit 15, the defective product 1b is distributed to the defective product collection unit 17 and the defective product disposal unit 18 and discharged. Good 1
b is discarded, and the defective product 1b is collected by discharging to the defective product collection unit 17.

As described above, the electronic component 1 determined to be defective
The defective product 1b is discharged by the defective product discharge unit 15 so that only the non-defective product 1a is mounted on the circuit board 2 while preventing the defective product 1b from being mounted on the circuit board 2 or obstructing another. Defective product 1 discharged by non-defective product discharge unit 15
Regarding b, the handling was changed according to the necessity of collection,
When the defective product 1b needs to be collected, the defective product 1b discharged from the component handling tool 12 is received by the defective product collection unit 17 and is provided for collection. Without special operation, the defective product 1b to be discharged is received by the defective product disposal unit 18 and provided for disposal, and at the same time, the large or special and expensive electronic components 1 and the like are provided for collection without disposal. It can be reused. Therefore,
The use efficiency of the expensive electronic component 1 can be increased to reduce the product cost, and it is also preferable in terms of resource saving. In addition, it is possible to prevent the impact on other things such as the environment that may occur by disposal.

The defective product collecting section 17 and the defective product discarding section 18 have the same defective product discharging section 15 as shown in FIG. Where the parts are discharged from the machine, that is, the parts handling tool 1
The defective product 1b is switched and moved to a position corresponding to the temporary stop position in the defective product discharge unit 15 to receive and use the defective product 1b, and is used for discarding and collecting the defective product 1b. As a result, at one work station where the component handling tool 12 is temporarily stopped, two types of handling for discarding and collecting the defective discharge product 1b can be performed without mutual influence of the defective product collection unit 17 and the defective product disposal unit 18. Can be achieved.

In addition, a defective product discharging unit 15 is provided alongside the component mounting unit 14 as shown in FIGS. 1 and 2 so that the quality of the electronic component 1 and the necessity of collecting the defective product 1b can be determined. 1
a, the defective product 1b is discharged to the defective product collection unit 17, and the defective product 1b is discharged to the defective product disposal unit 18. Thus, the three types of processing corresponding to the quality of the electronic component 1 to be handled and the necessity of collecting the defective product 1b can be performed in one work station. Therefore, the number of necessary work stations is reduced, and the size of the apparatus can be reduced. In addition, this does not cause a time loss without increasing the required operation.

The defective product 1b that does not need to be collected may be randomly received by the box-type defective product discarding unit 18. The defective product 1b that needs to be collected and discharged to the defective product collecting unit 17 is, for example, shown in FIGS. A plurality of component holders 1 as shown in FIG.
7a to 17e and individually receive and hold them. Thereby, in handling the discharged defective products 1b which need to be collected, mutual interference and damage due to the interference can be prevented, which is advantageous for reuse, and each of the component holders 17a to 17 can be used.
The defective products 1b individually held in e can be individually handled without confusion and collected. In this case, the position at which the defective product 1b that needs to be collected is specified by fixing the positional relationship between the component holding portions 17a to 17e by attaching it to the board 17f or the like, so that the collecting operation is automatically performed. There are also advantages that can be achieved by the mechanism.

The defective products 1b received by the component holding units 17a to 17e are sucked and held as shown in FIG. 5 (b), so that the held defective products 1b can be held as shown in FIG. 5 (c). Until it is carried around for collection, it can be held and maintained at a predetermined posture and position, so that even when the collection is automatically performed, it can be surely achieved.

FIGS. 1 to 3 show the component handling tool 12.
The suction nozzle 21 as shown in FIG. 1 is used to hold and carry the supplied electronic component 1 by suction, carry it around, mount it, discharge a defective product, etc., and mount the non-defective product 1a on the circuit board 2 or the defective product 1b. Defective product collection unit 17 and defective product disposal unit 18
When the electronic component 1 is sucked and held, the suction nozzle 21 is switched to a blow state by switching the suction nozzle 21 by electromagnetic operation or cam operation of the switching valve 22. Blow source 2
The blow pressure is switched in two stages by switching the blow pressure in the connection line 24 with the valve 3 by electromagnetic operation of the switching valve 25 or the like.

For example, when the non-defective product 1a is mounted on the circuit board 2, the blow pressure shown in FIG. 3B is higher than the blow pressure V1 shown in FIG. The defective product 1b is discharged at the pressure V2. The blow pressure V1 at the time of mounting the electronic component 1 is released from the suction state of the suction nozzle 21 that has been holding the electronic component 1 up to that point, that is, the vacuum breaking is performed. The nozzle 1 is separated from the suction nozzle 21 with such a strength as not to be displaced to a predetermined position. However, since the blow pressure V2 at the time of discharging the defective product is larger than that, the defective product 1b can be blown off more reliably. In addition, it is possible to prevent the discharge failure from occurring and the component recovering unit from being removed and becoming unrecoverable or falling to a problem area.

The component mounting apparatus according to the present embodiment, as shown in FIGS. 1 and 2,
The component supply unit 11 described above, an inspection unit 13 for inspecting the quality of the electronic component 1, a component mounting unit 14 for holding the circuit board 2 on which the electronic component 1 is to be mounted and for mounting the non-defective product 1 a, and discharging the defective product 1 b The defective component discharge unit 15 and the electronic component 1 supplied by the component supply unit 11 are picked up by the suction nozzle 21 which is the component handling tool 12, carried, and inspected by the inspection unit 13, and inspected by the component mounting unit 14. 1a
And a component handling mechanism 26 that sequentially and repeatedly carries out the mounting of the defective product 1b and the discharging of the defective product 1b by the defective product discharging unit 15 with a constant movement trajectory 16. The movement trajectory 16 of the present embodiment is a circular trajectory caused by the rotation of the mounting head 31 equipped with a number of suction nozzles 21. However, the present invention is not limited to this, and may be a linearly reciprocating device in principle. In addition to the suction nozzle 21, the component handling tool 12 may be of another type such as a chuck type (not shown) that holds the electronic component 1 therebetween.

The defective product discharging unit 15 is provided with the defective product collecting unit 1.
7 and a defective product discarding unit 18, and the entirety of the defective product discharging unit 15 is provided in the component mounting unit 14. The moving table 27 holds the circuit board 2 of the component mounting unit 14 and moves to various component mounting positions. It is held together with the circuit board 2. The moving table 27 moves in the orthogonal XY2 directions. However, any other moving mechanism may be employed. The moving table 27 includes the circuit board 2 and the defective product collection unit 17.
In addition, the entirety of the defective product disposal unit 18 is moved integrally. If the electronic component 1 held by the suction nozzle 21 which reaches the station of the component mounting unit 14 and is stopped is a good product 1a, the circuit board 2 When the corresponding component mounting position is moved to a position coinciding with the axis of the suction nozzle 21 and the defective product 1b needs to be collected, the component holding unit 17 of the defective product collection unit 17
A predetermined one of a to 17e moves to a position coinciding with the axis of the suction nozzle 21. If the defective product 1b does not need to be collected, the defective product discarding unit 18 is moved to a position coincident with the axis of the suction nozzle 21. Moving.

In the embodiment shown in the figure, the inspection unit 13 further detects the position of the electronic component 1 by the suction position and the pin position in the image recognition unit 13a having a recognition camera, as shown in FIGS. 1 (a) and 1 (b). The presence or absence of a defect such as a bend is detected, and the thickness of the electronic component 1 is detected by the thickness inspection unit 13b using a line sensor or the like.
It is determined that the suction direction is incorrect and cannot be corrected. However, the present invention is not limited to this, and the type of inspection, the number of inspections, the number of work stations for performing inspection, and the like can be freely set in accordance with the type of inspection and the number of inspection devices required for the inspection. In FIG. 1B, an example of work assigned to each work station is shown in a simplified manner, but it goes without saying that various necessary works including conventional cases can be performed.

The switching head 2 is mounted on the mounting head 31.
2 and 25, a switching section 32 for switching between suction and blow of the suction nozzle 21 and for switching the blow pressure is provided.
Two pressure regulating circuits 24a, 24b branched to obtain two-stage blow pressures V1, V2 are also provided. As shown in FIGS. 4A and 4B, the component holders 17a to 17e
Automatic valves 35a to 35e which are individually connected to one suction source 34, open suction ports 17a1 to 17e1 in response to receipt of defective product 1b, and suction defective products, and individual connection lines with suction source 34 Opening / closing valves 37a to 37e for opening and closing 36a to 36e. As a result, when the defective product 1b to be discharged is held as shown in FIGS. 5A to 5B, the automatic valve 35 is connected to the suction ports 17a1 to 17a1.
Since the part protruding from 7e1 is pushed by the electronic component 1 and pressed down against the springs 38a to 38e, the suction ports 17a1 to 17e1 are opened.
The component holding parts 17a to 17a through the suction ports 17a1 to 17e1
A suction source 3 is attached to the mouth portions 17a2 to 17e2 at the upper end of 17e.
As shown in FIG. 5B, the defective product 1b, which has been sucked from the nozzle 4 and discharged and blown away from the suction nozzle 21, is held by suction.

It is to be noted that the suction holding is performed with good compatibility between the electronic part 1 and the mouse parts 17a2 to 17e2, and further, in order to prevent the electronic part 1 from being overly damaged due to excessive force. 17e2 is formed from a sponge-like rubber or resin material. But,
It is not limited to this. Various designs are possible. Further, in order to recover the defective product 1b held by the component holding units 17a to 17e, it is preferable to release the suction and make it easy to carry. Therefore, on-off valves 37a-3
Reference numeral 7e denotes a three-way valve. When the held defective product 1b is used for collection, the suction ports 17a1 to 17e1 are disconnected from the suction source 34 and can be opened to the atmosphere at the same time as shown in FIG. It is preferred that this be done. However, the defective product collection unit 17 can be detached independently and replaced with an empty one each time it becomes full.

The control section 39 for controlling the above operation
Are mounted on the base 41. The control unit 39 determines the condition that the component holding units 17a to 17e of the defective product collection unit 17 are full by managing the number of discharged defective products 1b that need to be collected, and the determination unit 39a. There is provided a collection preparation unit 39b for temporarily suspending the mounting operation of the electronic component 1 according to the judgment of the unit 39a and / or issuing a warning for reusing the defective product 1b to be collected. Thus, when the condition that the component holders 17a to 17e are full is reached, the component holders 17a to 17e are picked up and collected, so that the state where the component holders 17a to 17e are full with the defective product 1b continues. It can be prevented that the defective product 1b discharged thereafter cannot be handled.

However, if such full management is also performed for the defective product disposal unit 18, it is possible to prevent the defective product 1b from overflowing the defective product disposal unit 18 and affecting the others.

A main operation control example by the control unit 39 will be described with reference to a flowchart shown in FIG. In step 1, the suction nozzle 21 suction-holds and picks up the electronic component 1 supplied by the component supply unit 11. In step 2, the suction nozzle 21 is positioned at the image recognition unit 13a, and the quality of the electronic component 1 held is determined by image recognition of the held electronic component 1. If it is a non-defective product 1a, the process proceeds to step 3, where the suction nozzle 21 is positioned in the thickness inspection section 13b, and an inspection based on the detection of the thickness of the held electronic component 1 is performed. If it is a non-defective product 1a, the process proceeds to step 4 and is positioned in the component mounting section 14, and then in step 5, the blow pressure is switched to a low blow pressure for component mounting. Next, in step 6, the non-defective product 1 held by moving the suction nozzle 21 up and down and positioning the circuit board 2
a) is mounted on the circuit board 2, and
Return to

If it is determined in steps 2 and 3 that the defective component 1b is defective, the process proceeds to step 7, in which the suction nozzle 21 is positioned at the component mounting portion 14, and in step 8, the electronic component 1 discharged as the defective component 1b does not need to be collected. Determine whether the part is a large part that needs to be collected.

If it is a small part, the process proceeds to the left side of step 9 to position the defective product disposal unit 18 at a position corresponding to the suction nozzle 21, and if it is a large component, the process proceeds to the right side of step 9 and the defective product collection unit 17 is removed. It is positioned at a position corresponding to the suction nozzle 21.

Next, after the suction nozzle 21 is switched to a high blow pressure for discharging in step 10, the process proceeds to step 11, and the defective product 1b held by the suction nozzle 21 is removed from the defective product disposal section 18 which has been positioned. The defective product 1b is discharged to the defective product collection unit 17 for disposal and collection according to the necessity of collection of the defective product 1b.

[0042]

According to the present invention, only the non-defective parts are mounted on the mounting object while the parts determined to be defective are not discharged and mounted in the defective part discharge section or interfere with other parts. In particular, for defective products, handling is changed according to the necessity of collection, and at the same time that the discharged defective products are received by the defective product disposal section and provided for disposal, large or special and expensive electronic components are discarded. It can be collected and reused without being used, and the influence on the environment and the like that may occur by disposal can be prevented.

[Brief description of the drawings]

FIGS. 1A and 1B show an example of the first embodiment of the present invention, in which FIG. 1A is a perspective view showing a schematic configuration of a component supply device, and FIG. FIG. 3 is an explanatory diagram showing an arrangement of stations.

FIG. 2 is a perspective view of the device of FIG.

FIG. 3 shows a circuit configuration for switching suction and blow of a suction nozzle provided in the apparatus of FIG. 1 and for switching flow pressure;
(A) shows when the component is mounted, and (b) shows when the component is discharged.

FIGS. 4A and 4B are perspective views showing a defective product collection unit provided in the apparatus of FIG. 1, wherein FIG. 4A is an overall perspective view and FIG. 4B is a cross-sectional view of one component holding unit;

5A and 5B show an operation state of the component holding unit in FIG. 4, wherein FIG. 5A is a cross-sectional view of a state before suction of a defective product, FIG. 5B is a cross-sectional view of the suction state, and FIG. FIG. 6 is a cross-sectional view of a defective product lifted for recovery.

FIG. 6 is a flowchart illustrating a main operation control example of a control unit of the apparatus in FIG. 1;

7A and 7B show a conventional apparatus, in which FIG. 7A is a perspective view showing a schematic configuration of a component supply apparatus, and FIG. 7B is an explanatory view showing a movement locus of a component handling tool and an arrangement of each work station.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 electronic component 1a good product 1b defective product 2 circuit board 11 component supply unit 12 component handling tool 13 inspection unit 14 component mounting unit 15 defective product discharge unit 16 movement locus 17 defective product collection unit 17a to 17e component holding unit 17a1 to 17e1 suction port 18 Refuse disposal section 21 Suction nozzle 22, 25 Switching valve 34 Suction source 27 Moving table 31 Mounting head 35a-35e Automatic valve 36a-36e Connection line 37a-37e Open / close valve

 ──────────────────────────────────────────────────続 き Continued on the front page (72) Murayoshi Fujiwara, 1006 Odaka, Kadoma, Osaka Prefecture, Matsushita Electric Industrial Co., Ltd. (72) Inventor: Hiroshi Ota 1006, Odaka, Kadoma, Kadoma, Osaka, Matsushita Electric Industrial Co., Ltd. 72) Inventor Seiichi Mogi 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture F-term in Matsushita Electric Industrial Co., Ltd. 5E313 AA01 AA11 CC02 CC03 CC04 CD03 CD06 DD03 DD08 EE24 FF24 FF28

Claims (13)

[Claims] 1. A component supplied by a component supply unit is picked up by a component handling tool and is carried.
Inspection in the inspection unit, mounting of non-defective products to the mounting target in the component mounting unit, and handling for discharging defective products in the defective product discharging unit are repeated by moving on a certain movement locus, and only non-defective products are mounted as mounting targets. In the component mounting method for mounting defective parts, whether or not it is necessary to collect defective products
A component mounting method comprising: distributing and discharging a defective product to a defective product collection unit and a defective product disposal unit; discharging the defective product to the disposal unit; and discharging the defective product to the collection unit. 2. The component mounting method according to claim 1, wherein the defective product collecting section and the defective product discarding section are selectively used according to the necessity of collecting the defective products discharged from the same defective product discharging section. . 3. A defective product discharging unit is provided in parallel with the component mounting unit to mount a component, discharge a defective product to the defective product collecting unit, and check whether a defective product is collected or not. 3. The component mounting method according to claim 2, wherein the non-defective product is discharged to a defective product disposal section. 4. The component mounting method according to claim 1, wherein the defective product collection unit receives and holds the defective products individually in a plurality of component holding units. 5. The component mounting method according to claim 4, wherein the component holding unit sucks and holds a defective product to be received. 6. A suction nozzle is used as a component handling tool, and the suction nozzle is switched from suction to blow when discharging to a defective product discharging unit or a defective product collecting unit for sucking, holding and carrying a supplied component. The method according to any one of claims 1 to 5, wherein, when a non-defective product is mounted on the mounting target, the defective nozzle is blown off by performing a blow pressure higher than a blow pressure when the suction nozzle is switched from suction to blow. Component mounting method. 7. A component supply unit, an inspection unit for inspecting the quality of a component, a component mounting unit for holding a component mounting target and providing a non-defective product, a defective product discharging unit for discharging a defective product, and a component. The parts supplied by the supply unit are picked up by the parts handling tool and carried, and the inspection is performed by the inspection unit, the non-defective products are discharged by the defective parts discharge unit, and the defective products are discharged by the defective parts discharge unit. Defective product collection unit, which has a component handling mechanism that repeats sequentially with the movement trajectory, and receives defective products discharged individually to the defective product discharge unit according to the necessity of collection. And a defective product disposal department.
A component mounting apparatus, comprising: a moving mechanism for switching one of the components corresponding to the necessity of collecting discharged defective products to a defective product discharging position from a component handling tool. 8. The component mounting apparatus according to claim 7, wherein the defective product collection unit has a plurality of component holding units that individually receive the defective products. 9. The defective product discharging section is provided in a component mounting section, and the moving mechanism is a moving table for holding a mounting target of the component mounting section and moving it to various component mounting positions. Item mounting device according to the item. 10. The component mounting apparatus according to claim 9, wherein the moving table moves in orthogonal XY2 directions. 11. A component holding unit is connected to one suction source, and opens a component suction port in response to receipt of a defective product, and opens an automatic valve for sucking the defective product, and separately connects a connection line with the suction source. An on-off valve that opens and closes at an angle.
The component mounting device according to any one of claims 1 to 4. 12. A deciding means for deciding that a condition in which the component holding section is full is reached, and the component mounting operation is temporarily interrupted by the deciding means and / or the defective product to be collected is reused. The component mounting apparatus according to any one of claims 8 to 11, further comprising a collection preparation unit that issues a warning that prompts the user. 13. A component handling mechanism comprising a suction nozzle as a component handling tool, and a switching valve for switching and connecting the suction nozzle to a suction source and a blow source, and a blow pressure of 2 in a connection line between the suction nozzle and the blow source. The component mounting apparatus according to any one of claims 10 to 12, further comprising a switching valve that switches between stages.