JP2007036162A - Electronic component attaching equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To detect suction state of an electronic component by a suction nozzle by means of a detector before the electronic component is attached, and to collect an electronic component under poor suction state certainly by detecting the suction state again by means of the detector following to collecting operation. <P>SOLUTION: As shown on Fig. 4, electronic component attaching equipment 1 comprises an open/close valve 49B for switching between air supply from an air supply source and interruption of air supply, a valve 49A for switching interconnection with a vacuum source and the air supply source, an air switching valve provided in correspondence with each suction nozzle and interconnected with the open/close valve or the switching valve, a line sensor unit 37 for detecting suction state of each electronic component before it is attached, and a CPU 90 controlling each air switching valve to perform operation for collecting an electronic component under poor suction state detected by the sensor unit to a collection box and to detect an electronic component again by means of the sensor unit, and controlling all air switching valves to perform operation for collecting the electronic component to the collection box if the suction state detected again by the sensor unit is also poor. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting apparatus that picks up an electronic component by a suction nozzle provided in a mounting head and mounts the electronic component on a printed board.

This kind of electronic component mounting device is widely known in Patent Document 1 and the like, and the suction holding state of the electronic component sucked and held by the suction nozzle is detected by a detection device such as a line sensor before mounting, and in a so-called standing state. If there is, the electronic component is collected in a collection box or the like without being mounted on the printed circuit board.
JP 2001-156498 A

  However, at the time of recovery, the suction nozzle is dropped and recovered by switching from the suction state by air suction to the blowout state, but sometimes it may remain sucked and held without dropping. .

  Therefore, the present invention detects the suction holding state of the electronic component sucked and held by the suction nozzle by the detection device before mounting, and when the suction state is defective, after the recovery operation is detected by the detection device again, An object of the present invention is to provide an electronic component mounting apparatus that can be reliably collected.

  For this reason, the first invention includes a plurality of component supply units for supplying electronic components to the component suction position, and a mounting head having a suction nozzle for sucking electronic components from the component supply unit and mounting them on a printed circuit board. In the electronic component mounting device provided, a detection device that detects the suction state of the electronic component sucked and held by the suction nozzle before mounting, and if the suction state is determined to be defective by the detection device, the recovery to the recovery box And a control device that controls the detection device to detect again after the operation.

  A second invention includes a plurality of component supply units that supply electronic components to a component suction position, and a mounting head having a plurality of suction nozzles that suck electronic components from the component supply units and mount them on a printed circuit board. In the electronic component mounting apparatus provided, a detection device for detecting the suction state of the electronic component sucked and held by each suction nozzle before the mounting, and if the suction state is determined to be defective by the detection device, for each suction nozzle The control is performed so that the detection device detects again after the recovery operation to the recovery box, and the recovery operation to the recovery box is collectively performed when the detection result is defective again. An apparatus is provided.

  A third invention includes a plurality of component supply units that supply electronic components to a component suction position, and a mounting head that has a plurality of suction nozzles that suck electronic components from the component supply units and mount them on a printed circuit board. In the electronic component mounting apparatus provided, a vacuum source, an air supply source, a first switching device that switches between air supply from the air supply source or supply stop, and either the vacuum source or the air supply source A second switching device that switches to communicate, and a communication between the first switching device and the second switching device that is provided corresponding to each of the suction nozzles and that is switched to the air blowing side or the suction side. An air switching device for detecting the suction state of the electronic component sucked and held by each suction nozzle before mounting, and if the suction state is determined to be defective by this detection device, After controlling the air switching device corresponding to each nozzle and performing the recovery operation to the recovery box, it is controlled to detect again by the detection device, and when the detection result is defective again, all the air switching devices are And a control device that performs control so as to collectively perform the collection operation into the collection box.

  In the present invention, the suction holding state of the electronic component sucked and held by the suction nozzle is detected by the detection device before mounting, and when the suction state is defective, the recovery operation is performed and then the detection device detects again and reliably Can be recovered.

  Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described with reference to the accompanying drawings. 1 is a plan view of the electronic component mounting apparatus 1, FIG. 2 is a front view of a lower main body of the electronic component mounting apparatus 1, and FIG. 3 is a right side view of the electronic component mounting apparatus 1 on the base 2 of the apparatus 1. On the feeder bases 3A, 3B, 3C, and 3D, a plurality of component supply units 3 that supply various electronic components one by one to the component take-out position (component suction position) are fixed in parallel and detachable in a stationary state. ing. A supply conveyor 4, a positioning unit 5, and a discharge conveyor 6 are provided between the groups of opposing units 3. The supply conveyor 4 sequentially conveys the printed board P received from the upstream to the positioning unit 5, and after electronic components are mounted on the board P positioned by a positioning mechanism (not shown) in the positioning unit 5, Be transported.

  Reference numeral 8 denotes a pair of front and rear beams which are provided in the left and right portions of the mounting apparatus 1 and which are long in the X direction, and sliders 11 fixed to the beams 8 along the pair of left and right guides 10 by driving each linear motor 9. It slides and individually moves in the Y direction above the printed circuit board P on the positioning unit 5 and the component take-out position (component suction position) of the component supply unit 3. The linear motor 9 includes a pair of upper and lower stators 9A fixed to the base 2 and a mover 9B fixed to lower portions of mounting plates provided at both ends of the beam 8.

  Each beam 8 is provided with a mounting head body 7 that moves along a guide 13 by a linear motor 14 in the longitudinal direction, that is, in the X direction. As shown in FIG. 3, the linear motor 14 includes a pair of front and rear stators 14A fixed to the beam 8, and a movable element 14B provided on the mounting head body 7 and positioned between the stators 14A. Is done.

  Each mounting head body 7 includes a mounting head 16 having a suction nozzle 15 which is provided at the lower portion and is biased downward by 12 springs 12. Each mounting head 16 of each mounting head body 7 is provided with a substrate recognition camera 19 and images a positioning mark (not shown) attached to the printed circuit board P located in the positioning unit 5.

  Hereinafter, the lifting device of the mounting head 16 and the mounting head 16 will be described in detail with reference to FIGS. 5 and 6. Reference numeral 20 denotes a base of the mounting head body 7 that moves along the guide 13, and 21 denotes a beam-side base fixed to the base 20. Reference numeral 22 denotes a mounting head side base fixed to the upper and lower portions of the mounting head 16, and a head lifting device 23 is provided between the mounting head side base 22 and the beam side base 21.

  The head lifting device 23 includes a guide 24 for guiding the mounting head 16 when the mounting head 16 is moved up and down, a ball screw 25 attached to the beam-side base 21, and a rotation motor (hereinafter referred to as “rotating motor”) that lifts and lowers the mounting head 16. The head lifting motor 27 is called a “head lifting motor” 26, a lifting nut 27 screwed with the ball screw 25, a head lifting motor 26 is attached and a support 28 that rotatably supports the upper portion of the ball screw 25, etc. It is fixed to 22 on the head side base. For this reason, by the rotation of the ball screw 25 by the rotation of the head lifting / lowering motor 26, the lifting / lowering nut 27 is lifted / lowered. As a result, the mounting head 16 is lifted / lowered.

  Reference numeral 30 denotes a slip ring. The slip ring 30 is provided for communication between the mounting apparatus main body and the mounting head 16 and for supplying electric power to a rotation motor of a nozzle support portion described later. Further, 31 is a nozzle support provided at the lower part of the mounting head 16 and supports 12 suction nozzles 15 arranged on the circumference at predetermined intervals so as to be movable up and down, and 32 is also the lower part of the mounting head 16. The outer cylindrical body 33 is a nozzle rotation motor which is, for example, a pulse motor for theta rotation of the suction nozzle 15 provided between the outer cylindrical body 32 and the nozzle support 31. The rotor 34 of the nozzle rotation motor 33 is provided on the outer peripheral surface of the nozzle support 31 and is provided so as to be rotatable in the θ direction together with the nozzle support 31 inside a stator 35 provided on the outer cylinder 32.

  Reference numeral 37 denotes a line sensor unit that protrudes downward from the center of the head support 31 and serves as a means for detecting the presence / absence of components and a suction posture (suction state), and a detection means for detecting the lower end position of the electronic component D. A light emitting element 42 such as an LED is disposed in the upper portion of a cylindrical light emitting unit mounting body 41 provided at the lower end of a support 38 provided at a substantially central portion of the lens 16, and a lens 43 below the lens 43 and below the lens 43. A light emitting unit 45 configured by disposing a reflector 44 having a conical reflection surface 44 a and light from the light emitting element 42 that is fixed to the bottom surface of the outer cylindrical body 32 and passes through the reflector 44 are received. The light receiving unit 46 includes a plurality of CCD elements as light receiving elements.

  For example, when the component provided on the mounting head 16 performs suction, the suction operation of the electronic component D by the selected suction nozzle 15 ends, and the height of the lower end surface of the electronic component D every time the nozzle support 31 rotates. By detecting the position as the boundary position where the light receiving state of each CCD element changes from light shielding to light receiving, the part is normally sucked as shown in FIG. It is detected separately from the case where it is attached or the case where it is adsorbed obliquely. That is, the suction nozzle 15 descends and picks up and picks up the electronic component D from the component supply unit 3. After the lift, the nozzle support 31 is rotated by driving the nozzle rotation motor 33 to suck and hold the electronic component D. 15, the electronic component D attracted by the suction nozzle 15 during the turning is located between the reflector 44 and the light receiving unit 46, so that the height position of the lower end surface of the electronic component D at a plurality of positions. By detecting this, it is possible to detect the presence / absence of a component and the suction posture. The detection is performed when the nozzle support 31 moves while rotating. However, when the electronic component D is positioned between the reflector 44 and the light receiving unit 46, the rotation is stopped and detected. It may be.

  When the suction nozzle 15 does not suck the electronic component D, light to be shielded (by the sucked electronic component) out of the light from the light emitting element 42 is received by the light receiving unit 46. Therefore, the absence of the electronic component D is detected, and the suction nozzle 15 communicates with the vacuum source 47 by the operation of a solenoid valve 82 which is a vacuum valve on / off operation body (described later) provided on the side of each nozzle shaft 64. The flow path is cut off, the vacuum passage from the vacuum source 47 is cut off to stop the vacuum suction operation to prevent leakage, and the surface that should not be sucked is sucked and is so-called standing or sucked diagonally If it is detected that the mounting head 16 and the suction nozzle 15 are moved upward, the electronic component D is dropped.

  Reference numeral 50 denotes a nozzle lifting device provided in the mounting head 16, and this nozzle lifting device will be described below. Reference numeral 51 denotes a nozzle lifting / lowering motor (hereinafter referred to as “nozzle lifting / lowering motor”) attached to the head-side base 22, and 52 denotes a rotary shaft 511 of the nozzle lifting / lowering motor 51 connected by a connecting member 59 to be rotated by the nozzle lifting / lowering motor 51. The ball screw 53 is engaged with the ball screw 52 and is raised and lowered by the rotation of the ball screw 52, 55 is a guide attached to the head side base 22 to guide the raising and lowering of the elevation body 53, and 56 is the lower end of the elevation body 53. The roller is rotatably attached to the roller.

  Reference numeral 57 denotes a first cylinder having a central axis 60 of the mounting head 16 passing through the center. An annular flange 58 formed on the first cylinder 57 is positioned on the roller 56, and the first cylinder is formed. 57 is supported by a roller 56. Here, the first cylindrical body 57 is composed of, for example, a ball spline, and is biased downward by a spring 61 whose lower end is in contact with the upper surface of the flange portion 58, and is rotated by θ along with θ rotation of the pulley described later, In addition, the roller 56 moves up and down as the roller 56 moves up and down. Reference numeral 62 denotes a nozzle support member that is fixed to the lower portion of the first cylinder 57 and rotates θ with the first cylinder 57. At the lower end of the nozzle support member 62, an elevating support piece 63 that extends horizontally in the circumferential direction is provided. Is formed. The elevating support piece 63 moves up and down as the first cylindrical body 57 moves up and down, and the lowering of the elevating support piece 63 lowers the predetermined suction nozzle 15 among the plurality of suction nozzles.

  That is, a roller 65 is rotatably attached to the upper end of each nozzle shaft 64 extending upward from each suction nozzle 15, and the upper end of the nozzle shaft 64 of one suction nozzle 15 selected by a nozzle selection device described later. While the roller 65 is on the upper surface of the lifting support piece 63, the roller 65 moves up and down by the lowering of the nozzle support member 62 and the lifting support piece 63 as the first cylindrical body 57 is lowered. That is, when the elevating support piece 63 and the roller 65 are lowered to the position indicated by the elevating support piece 63A and the roller 65A, for example, the predetermined nozzle 15 is lowered along with the lowering. Further, the suction nozzle 15 is lowered by a predetermined stroke by controlling the rotation amount of the nozzle lifting / lowering motor 51 and adjusting the stop height when the lifting / lowering body 53 is lowered.

  Reference numeral 66 denotes a third cylindrical body which is provided under the nozzle support member 62 and can be rotated by θ. The upper portion of the third cylindrical body 66 has the same height as the elevation support piece 63 of the nozzle support member 62 before being lowered. A substantially disc-shaped fixed support piece 67 is formed at this position. As shown in FIG. 7, the fixed support piece 67 is formed with a notch 68 corresponding to the lift support piece 63, and each roller 65 at the upper end of the nozzle shaft 64 of the nozzle 15 excluding the descending nozzle 15 is fixed. It is supported by a support piece 67. That is, in the fixed support piece 67, a notch 68 is formed at a position at an angle equally divided by the number of nozzles 15 in the circumferential direction, or at a position of approximately 30 °, which is an angle divided by 12 in this embodiment. The lift support piece 63 of the nozzle support member 62 is located at the notch 68.

  70 is a nozzle selection device provided in the mounting head 16, 71 is a nozzle selection motor for selecting a descending nozzle, 72 is a first pulley fixed to a rotation shaft 73 of the nozzle selection motor 71, and 74 is a central shaft 60. A second pulley 75 rotatably supported on the belt, 75 is a belt passed between the first pulley 72 and the second pulley 74, and 76 is located outside the central shaft 60 and is the center of the second pulley 74. The spring 61 is provided between the second pulley 74 and the flange portion 58 of the first cylinder 57.

  The first cylinder 57 is positioned outside the outer peripheral surface of the lower part of the rotating body 76, and the first cylinder 57 rotates as the second pulley 74 rotates due to the action of the first cylinder 57 as a ball spline. When the body 76 rotates with the rotation of the body 76 and the lifting / lowering body 53 is lifted / lowered, the body 76 descends along with the lifting / lowering 76.

  In other words, when the nozzle selection motor 71 rotates when the electronic component D is picked up and mounted, the first cylinder 57 rotates via the first pulley 72 belt 75, the second pulley 74, and the rotating body 76 when the nozzle selection motor 71 rotates. Further, the nozzle support member 62 connected to the first cylinder 57 rotates together with the third cylinder 66, and the lifting support piece 63 of the nozzle support member 62 is below the nozzle shaft 64 extending from the selected nozzle 15. To position. In such a state, when the nozzle lifting / lowering motor 51 rotates and the lifting / lowering body 53 descends according to the thickness of the electronic component to be sucked and mounted, the first cylinder 57 and the nozzle support member 62 are lowered accordingly. Only the nozzle 15 selected by the lowering of the support piece 63 is lowered by a predetermined stroke according to the thickness of the electronic component.

  Reference numeral 80 denotes an air switching valve, which is provided at an equiangular interval corresponding to each nozzle 15 at a position on the outer side in the circumferential direction from each nozzle 15 and can individually switch between air suction and blowing. The air switching valve 80 includes a case 81 provided in the upper part, and a solenoid valve 82 in which the upper part is located in the case 81 and the energization is controlled by a signal from the CPU 90. The solenoid valve 82 is an annular electromagnet 83 provided on the inner surface of the case 81, and moves up and down in the case 81 by energizing and de-energizing the electromagnet 83, and a cylindrical permanent magnet 84 corresponding to the electromagnet 83 at the upper part. It is comprised from the channel | path switching body 85 etc. in which this was provided. An air blow passage 86, a nozzle communication passage 87, and a evacuation passage 88 are formed in this order from the top to the bottom between the passage switching body 85 and the cylinder portion 81A below the case 81. In addition, the nozzle shaft 64 is formed with a nozzle shaft passage 100 communicating with the internal passage of the nozzle 15 and the nozzle communication passage 87, and the nozzle passage 100 and the nozzle passage 100 are evacuated via the nozzle communication passage 87 by raising and lowering the passage switching body 85. The communication with the passage 88 or the air blow passage 86 is switched.

  That is, when the passage switching body 85 is raised by energization of the electromagnet 83 of the solenoid valve 82, the evacuation passage 88 and the nozzle communication passage 87 communicate with each other, and the nozzle communication passage 87 and the air blow passage 86 communicate with each other. The suction nozzle 15 is closed, and the internal passage of the suction nozzle 15 communicates with the vacuum source 47 via the nozzle shaft passage 100, the nozzle communication passage 87, and the evacuation passage 88, and the suction nozzle 15 maintains vacuum suction of the electronic components. Further, when the electromagnet 83 is de-energized and the passage switching body 85 is lowered, the evacuation passage 88 and the nozzle communication passage 87 communicated with the vacuum source 47 are blocked, and the nozzle communication passage 87 and the air blower are used. The passage 86 communicates to stop the vacuum suction of the electronic component D by the suction nozzle 15, and air from the air supply source 48 enters the internal passage of the suction nozzle 15, the air blow passage 86, the nozzle communication passage 87, and the nozzle shaft passage 100. Is blown through.

  As described above, the energization / non-energization of the air switching valve 80 (electromagnet 83 of the solenoid valve 82) provided corresponding to each adsorption nozzle 15 causes the adsorption nozzle 15 and the vacuum source 47 or the air supply source 48 to be connected. The communication can be switched, and the air switching valve 80 corresponding to the selected suction nozzle 15 can be switched individually.

  49A is a switching valve whose one end communicates with the air switching valve 80, and switches the other end between communicating with the vacuum source 47 and sucking the suction nozzle 15 or communicating with the air supply source 48 and blowing out the suction nozzle 15. It is a valve. 49B is an open / close valve having one end communicating with the air switching valve 80 and the other end communicating with the air supply source 48. When the electronic component is mounted by the suction nozzle 15, the air switching valve 80 switches from air suction to air blowing. The vacuum is broken when the air switching valve 80 is switched to the air blowing when the suction nozzle 15 starts sucking and sucking the electronic component by opening the air supply source 48 before the air is turned on. It is a valve to do.

  Reference numeral 89 denotes a component recognition camera, which is provided on the mounting plate 99 of the base body 2 in correspondence with each of the mounting heads 16 so that the electronic components are displaced and held with respect to the suction nozzle 15. In order to recognize the position in the XY direction and the rotation angle, all the electronic components D sucked and held by the plurality of suction nozzles 15 are collectively imaged, but a plurality of electronic components can be simultaneously imaged. is there. The component recognition camera 89 can also check whether the electronic component D is sucked and held by the suction nozzle 15 by taking an image.

  Next, a description will be given below based on a control block diagram of the electronic component mounting apparatus 1 of FIG. Reference numeral 90 denotes a CPU (mounting control unit) as a control unit that performs overall control of the mounting apparatus 1, and the CPU 90 is connected to a RAM (Random Access Memory) 92 and a ROM (Read Only) via a bus line. Memory) 93 is connected. Based on the data stored in the RAM 92, the CPU 90 controls the operation related to the component mounting operation of the electronic component mounting apparatus 1 according to the program stored in the ROM 93. That is, the CPU 90 receives the linear motors 9 and 14, the head lifting / lowering motor 26, the nozzle rotation motor 33, the nozzle lifting / lowering motor 51, the nozzle selection motor 71, the solenoid valve 82, and each mounting head 16 via the interface 94 and the drive circuit 95. The driving of the opening / closing valve 49B, the switching valve 49A and the like provided in the control is controlled.

  The RAM 92 stores mounting data related to component mounting. For each mounting order (step number), the X direction (indicated by X), the Y direction (indicated by Y), and the angle within the printed circuit board. Information (indicated by Z), arrangement number information of each component supply unit 3, and the like are stored. The RAM 92 stores component arrangement data, which stores the types of electronic components (component IDs) and the arrangement coordinates of the supply units 3 corresponding to the arrangement numbers of the component supply units 3. Has been.

  Reference numeral 91 denotes a component recognition processing apparatus connected to the CPU 90 via an interface 94. The recognition processing of the image captured by the component recognition camera 89 and the image captured by the substrate recognition camera 19 are captured. Recognition processing is performed by the component recognition processing device 91.

  The images taken by the component recognition camera 89 and the board recognition camera 19 are displayed on a monitor 96 as a display device. The monitor 96 is provided with various touch panel switches 97, and when the operator operates the touch panel switch 97, various settings including settings for teaching designation can be performed.

  The touch panel switch 97 has a transparent conductive film coated on the entire surface of a glass substrate, and electrodes are printed on four sides. Therefore, when a very small current is passed through the surface of the touch panel switch 97 and the operator touches, current changes are caused in the electrodes on the four sides, and the coordinate value touched by the circuit board connected to the electrodes is calculated. Therefore, if the coordinate value matches a coordinate value in a coordinate value group stored in advance in the RAM 92 as a switch unit for performing a certain operation, the operation is performed.

  With the configuration described above, a screen as shown in FIG. 10 is displayed on the monitor 96 to detect whether the electronic component is held by the suction nozzle 15 after the electronic component is mounted on the printed circuit board P. The selection is made between the line sensor unit 37 alone, the component recognition camera 89 alone, or both. Here, it is assumed that only the line sensor unit 37 is used. First, when the operator presses the switch unit 100A and presses the decision switch unit 100D, the setting is performed, and the setting contents are stored in the RAM 92 and stored in the ROM 93. The CPU 90 controls the program according to the set contents.

  The setting can be performed for each type of electronic component or for each mounting order of electronic component mounting data.

  Hereinafter, the operation of sucking and mounting the electronic component D by the electronic component mounting apparatus 1 will be described in detail. First, the printed circuit board P is carried into the positioning unit 5 from the upstream device via the supply conveyor 4, and the positioning operation is started by the positioning mechanism.

  Next, the CPU 90 generates suction sequence data from the mounting data stored in the RAM 92. That is, the CPU 90 first reads data from the mounting data, determines the suction procedure by the suction nozzle 15, and performs the final electronic component of the chain suction (up to 12 pieces can be sucked per one mounting head 16). The component supply unit 3 that supplies D is determined, the arrangement coordinates of the final suction position are stored in the RAM 92, and the mounting coordinate position of the electronic component D to be mounted first after completion of the chain suction (mounting before correction of component suction displacement) The position of the data) is determined, and the coordinates are stored in the RAM 92.

  Then, the suction operation of the electronic component D is executed. That is, the suction nozzle 15 corresponding to the component type of the electronic component should be mounted in accordance with the mounting data in which the XY coordinate position where the printed circuit board is to be mounted, the rotation angle position around the vertical axis, the arrangement number, and the like are specified in the RAM 92. The electronic component is picked up and taken out from a predetermined component supply unit 3.

  At this time, the linear motors 9 and 14 are controlled by the CPU 90 so that the suction nozzle 15 of each mounting head 16 of each mounting head body 7 is located above the top electronic component of each component supply unit 3 that stores the electronic component to be mounted. In the Y direction, the linear motor 9 is driven by the drive circuit 95 to move each beam 8 along the pair of guides 10. In the X direction, the linear motor 14 is also driven by the drive circuit 95. Each mounting head body 7 moves along the guide 13.

  Since each predetermined supply unit 3 has already been driven and components can be taken out at the component suction position, the head lifting motor 26 is based on signals output from the CPU 90 via the interface 94 and the drive circuit 95. Rotates, and the mounting head 16 moves down along the guide 24 to a predetermined height. Next, a suction nozzle (hereinafter referred to as “first suction nozzle”) 15 that first sucks an electronic component is a suction position, that is, a suction position shown in FIG. If it is deviated from 101), the CPU 90 outputs a signal for moving the suction nozzle 15 to the suction position 101 shown in FIG. 8, which is the suction position. Rotate. The nozzle support 31 of the mounting head 16 rotates θ around the central axis 60 by driving the nozzle rotation motor 33.

  Then, when the roller 65 rides on the lifting support piece 63, the CPU 90 is based on the rotation angle of the nozzle support 31 and the angle of the side edge of the lifting support piece 63 (position shifted by 15 ° from the center of the lifting support piece). Then, a signal is output to the nozzle lifting / lowering motor 51 via the interface 94 and the drive circuit 95. Based on this signal, the nozzle lifting / lowering motor 51 rotates in the direction of lowering the first suction nozzle 15 and moves up / down by the rotation of the ball screw 52. The body 53 and the lifting support piece 63 are lowered, and the first suction nozzle 15 is lowered toward a predetermined height, that is, a height suitable for sucking electronic components from the supply unit 3 set in advance. That is, by the θ rotation of the nozzle support 31 and the descending of the lifting support piece 63, the first suction nozzle 15 turns and descends, the roller 65 reaches the center of the lifting support piece 63, and the first suction nozzle 15 sucks. The position 101 is reached and lowered to a height suitable for sucking the electronic component.

  Thus, during the turning of the first suction nozzle 15 to the suction position 101, the first suction nozzle 15 starts to descend, and the turn of the first suction nozzle 15 to the suction position 101 and the lowering are performed in parallel. Therefore, the time required for the operation of attracting the electronic component D can be shortened, and as a result, the time for mounting the electronic component on the printed circuit board can be shortened. The swiveling and lowering of the suction nozzle 15 is started during the movement of the mounting head 16 in the XY direction.

  It is possible to start the lowering of the first suction nozzle 15 earlier at the time of θ rotation of the nozzle support 31 as described above, and control for that will be described. That is, the CPU 90 outputs a signal for moving the suction nozzle 15 to the suction position 101 shown in FIG. 8 as the suction position, and at the same time, the nozzle selection motor 71 corresponds to the first suction nozzle 15 based on the signal from the CPU 90. A signal is output so as to come to the position. Therefore, the nozzle support 31 of the mounting head 16 is rotated around the central axis 60 by the drive of the nozzle rotation motor 33, and the rotation of the nozzle selection motor 71 is rotated by the first pulley 72, the belt 75, and the second pulley. 74 and the first cylinder 57 are transmitted to the nozzle support member 62, and the lifting support piece 63 is rotated by the rotation of the nozzle support member 62 and reaches a position corresponding to the first suction nozzle 15 that moves up and down.

  At this time, since the first suction nozzle 15 has not reached the suction position 101, the nozzle support 31 continues to rotate θ around the central axis 60. Further, the CPU 90 outputs a signal so that the lift support piece 63 rotates and maintains the position corresponding to the first suction nozzle 15, and the lift support piece 63 rotates theta of the nozzle support 31 by the rotation of the nozzle support member 62. It rotates with.

  When the lift support piece 63 reaches a position corresponding to the first suction nozzle 15, the CPU 90 outputs a signal to the nozzle lift motor 51 via the interface 94 and the drive circuit 95, and based on this signal, the nozzle lift motor 51 is rotated in the direction of lowering the first suction nozzle 15, and the lifting body 53 and the lifting support piece 63 are lowered by the rotation of the ball screw 52, and the first suction nozzle 15 is set to a predetermined height, that is, preset. It descends to a height suitable for adsorbing electronic components from the supply unit 3. That is, by the θ rotation of the nozzle support 31 and the lowering of the lifting support piece 63, the first suction nozzle 15 turns and descends, and the first suction nozzle 15 reaches the suction position 101 and sucks the electronic components. Descends to a height suitable for

  In this way, the first suction nozzle 15 is turning to the suction position 101, and the first suction nozzle 15 starts to descend from the time when the first suction nozzle 15 is displaced by 15 ° or more from the suction position 101. Since the swiveling and lowering of the numbering suction nozzle 15 to the suctioning position 101 are performed in parallel, the starting point of the lowering of the numbering suction nozzle 15 is further advanced, and the time required for the suction operation of the electronic component D is further shortened. As a result, it is possible to further reduce the time for mounting electronic components on the printed circuit board.

  As described above, when the first suction nozzle 15 reaches the suction position 101 and descends to a height suitable for sucking electronic components, the solenoid valve 82 corresponding to the first suction nozzle 15 receives a signal from the CPU 90. The passage switching body 85 is raised, the evacuation passage 88 and the nozzle communication passage 87 communicate with each other, the nozzle communication passage 87 and the air blow passage 86 are blocked, and the internal passage of the suction nozzle 15 Communicates with the vacuum source 47 via the nozzle shaft passage 100, the nozzle communication passage 87, the vacuum passage 88, and the switching valve 49A switched to the suction side, and the suction nozzle 15 maintains the vacuum suction of the electronic components.

  As described above, when the electronic component suction operation by the first suction nozzle 15 is completed, the CPU 90 outputs a signal to the nozzle lifting motor 51, and the nozzle lifting motor 51 lifts the first suction nozzle 15 based on this signal. The elevating body 53 is raised to a predetermined height, that is, the height before being lowered, by the rotation of the ball screw 52.

  Further, the CPU 90 outputs a signal for sucking the electronic component by the second suction nozzle 15 adjacent to the first suction nozzle 15 at the same time as outputting a signal to the nozzle lifting / lowering motor 51. That is, the CPU 90 sends a signal so that the second suction nozzle 15 is positioned above the component supply unit of the component supply unit 3 that supplies the electronic component to be sucked and is positioned at the suction position of the nozzle support 31. Output. Then, by driving the linear motors 9 and 14 based on this signal and the rotation of the nozzle rotating motor 33, the second suction nozzle 15 moves above the component supply unit 3 for supplying electronic components, and the first suction nozzle. It turns to the same adsorption position as 15. Further, in parallel with the rotation of the nozzle support 31 by the rotation of the nozzle rotation motor 33, the nozzle selection motor 71 rotates based on a signal from the CPU 90, and this rotation is transmitted to the nozzle support member 62, and the nozzle support member. The rotation of 62 causes the first support piece 63 to rotate as in the case of the first suction nozzle, and stops at a position corresponding to the second suction nozzle 15 that moves up and down this time.

  Thereafter, similarly to the case of the first suction nozzle 15, when the nozzle raising / lowering motor 51 rotates and the solenoid valve 82 corresponding to the second suction nozzle 15 operates based on the signal from the CPU 90, the path switching body 85. And the vacuum passage 88 and the nozzle communication passage 87 communicate with each other, and the internal passage of the suction nozzle 15 is switched to the nozzle shaft passage 100, the nozzle communication passage 87, the vacuum passage 88 and the suction side. The suction nozzle 15 communicates with the vacuum source 47 via 49A, and maintains vacuum suction of the electronic components.

  Thereafter, when the electronic components can be chain-sucked by the mounting head 16, as in the case of the first suction nozzle and the second suction nozzle 15, of the 12 suction nozzles 15 provided on the nozzle support 31 as described above. That is, the remaining selected suction nozzles from the third suction nozzle to the twelfth suction nozzle are also subjected to multi-chain suction (as many electronic components D as possible are continuously sucked). That is, electronic components are supplied from the component supply unit 3 to the remaining suction nozzles 15, and the nozzle support 32 rotates intermittently by the rotation of the nozzle rotation motor 33, and each suction nozzle 15 is stopped when the nozzle support 32 is stopped. 15 moves up and down and sucks and holds the electronic components.

  Then, presence / absence detection of the electronic component and detection of the suction posture are performed by the line sensor unit 37 accompanying the suction operation of the electronic component by each suction nozzle 15. That is, the light receiving unit 46 of the line sensor unit 37 is provided at a position shifted by, for example, 45 ° from the suction position 101 shown in FIG. 8, and sucks electronic components as the nozzle support 32 is intermittently rotated in the arrow direction. When the suction nozzle 15 has passed the detection position 102 shown in FIG. 8, the line sensor unit 37 detects the presence / absence of all electronic components at the lower end of the suction nozzle 15 and the detection of the suction posture as described above. No. 16 is rotated once.

  If there is an electronic component that detects an abnormal posture state when the surface that should not be sucked is picked up and is in a so-called standing state or picked up at an angle, before recognition and mounting of the electronic component, The individual disposal (collection) operation of moving the mounting head 16 and the suction nozzle 15 above the collection box 79 and dropping the electronic component D is performed for each electronic component.

  That is, the CPU 90 does not switch the air switching valve 80 (the electromagnet 83 of the solenoid valve 82) corresponding to the target suction nozzle 15 for which the line sensor unit 37 has detected an abnormal posture of the electronic component from the air suction side to the air blowing side. Before energization, the open / close valve 49B is opened to blow air from the air supply source 48. Then, when the suction nozzle 15 that sucks and holds the electronic components starts to descend, the air switching valve 80 is switched to the air blowing side, and the vacuum suction of the suction nozzle 15 is broken by the air from the air supply source 48 via the opening / closing valve 49B. Then, the electronic component D is dropped into the collection box 79 and an individual disposal (collection) operation is performed. That is, air from the air supply source 48 is blown into the internal passage of the suction nozzle 15 from the suction nozzle 15 through the air blow passage 86, the nozzle communication passage 87, and the nozzle shaft passage 100, and the electronic component D is dropped. The individual disposal (collection) operation is performed. At this time, in consideration of the stability of components during the component mounting operation and the like, the path from the opening / closing valve 49B to the air switching valve 80 is not closed, so the air blowing pressure from the suction nozzle 15 is small.

  After this individual disposal operation, the CPU 90 energizes the air switching valve 80 (electromagnet 83 of the solenoid valve 82) corresponding to the target suction nozzle 15 to switch from the air blowing side to the air suction side, and further the nozzle support 32. Is output to the nozzle rotation motor 33 to pass the target suction nozzle 15 through the detection position 102 shown in FIG. 8, and the electronic components at the lower end of the suction nozzle 15 by the line sensor unit 37 again as described above. The presence / absence detection or the like is performed. When it is detected that there is an electronic component, the CPU 90 checks whether there is a next (other) electronic component to be individually discarded, and if there is, the individual disposal operation similar to that described above is performed on the component. However, if it is detected that there is no electronic component, the air switching valve 80 (the electromagnet 83 of the solenoid valve 82) corresponding to the target suction nozzle 15 is switched from the air suction side to the air blowing side. For this reason, it is possible to prevent the suction nozzle 15 that is not sucking the electronic component from being vacuum-sucked wastefully.

  Then, after all the individual disposal operations are performed, the component recognition operation such as the imaging of the electronic component by the component recognition camera 89 and the recognition processing of the recognition processing device 91 is performed, or the component recognition operation is performed when there is no abnormal posture of the electronic component. To perform the mounting operation on the printed circuit board P.

  That is, the CPU 90 controls the linear motors 9 and 14 so that the suction nozzle 15 moves to the mounting coordinate position on the printed circuit board P positioned by the positioning unit 5 in consideration of the recognition processing result from the recognition processing device 91. In the Y direction, the linear motor 9 is driven by the drive circuit 95 to move each beam 8 along the pair of guides 10. In the X direction, the linear motor 14 is also driven by the drive circuit 95 along the guide 13. Each mounting head body 7 moves and controls the nozzle rotation motor 33, the head lifting / lowering motor 26 and the nozzle lifting / lowering motor 51 to mount electronic components on the printed circuit board P.

  When the electronic component is mounted, the air switching valve 80 corresponding to when the suction nozzle 15 sucking and holding the electronic component starts to move down is switched to the air blowing side, and the open / close valve 49B from the air supply source 48 is switched. The vacuum suction of the suction nozzle 15 is broken by the intervening air and mounted on the printed circuit board P. That is, when the suction nozzle 15 is lowered, the solenoid valve 82 corresponding to the suction nozzle 15 is switched from the energized state to the non-energized state based on a signal from the CPU 90, the vacuum source 47 is shut off, and the suction nozzle 15 performs the vacuum suction operation. Then, the air from the air supply source 48 is blown into the internal passage of the suction nozzle 15 through the air blow passage 86 and the nozzle communication passage 87 and is mounted on the printed circuit board P.

  However, as described above, the individual disposal is performed, but when there are still electronic components to be discarded, the following operation is performed.

  That is, the air switching valve 80 of all the suction nozzles 15 (the electromagnet 83 of the solenoid valve 82) is switched to the air suction side. Next, the switching valve 49 </ b> A is switched to the positive pressure side (blowing side) and communicated with the air supply source 48. As a result, air is blown from the air supply source 48 into the internal passages of all the suction nozzles 15 through the evacuation passage 88 of the switching valve 80, blown out from all the suction nozzles 15, and sucked into the component collection box 79. All the electronic components to be collectively discarded that are sucked and held by the nozzle 15 are dropped. At this time, since the path from the air supply source 48 to the air switching valve 80 via the switching valve 49A is closed, the air blowing pressure from each suction nozzle 15 is large, that is, the air blowing pressure during the batch disposal operation is Since it is larger than that at the time of the individual discarding operation described above, it becomes possible to discard the parts more reliably. Thereafter, the switching valve 49A is switched to the negative pressure side (suction side), and the air switching valves 80 (electromagnets 83 of the solenoid valve 82) of all the suction nozzles 15 are switched to the air blowing side.

  Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the above-described alternatives, modifications, or modifications. It includes modifications.

It is a top view of an electronic component mounting apparatus. It is a front view of an electronic component mounting apparatus. It is a right view of an electronic component mounting apparatus. It is a control block diagram of an electronic component mounting apparatus. It is a vertical front view of a mounting head body. It is a vertical side view of a mounting head body. It is a top view which shows a fixed support piece and a raising / lowering support piece. It is a schematic bottom view of a mounting head. It is an enlarged vertical front view of the lower part of a mounting head. It is a figure which shows the operation screen displayed on the monitor. It is a figure which shows a flowchart.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Component mounting apparatus 7 Mounting head body 15 Adsorption nozzle 16 Mounting head 37 Line sensor unit 47 Vacuum source 48 Air supply source 49A Switching valve 49B Open / close valve 79 Collection box 80 Air switching valve 82 Solenoid valve 83 Electromagnet 90 CPU

Claims (3)

  In an electronic component mounting apparatus comprising a plurality of component supply units that supply electronic components to a component suction position, and a mounting head having a suction nozzle that sucks electronic components from the component supply unit and mounts them on a printed circuit board. A detection device for detecting the suction state of the electronic component sucked and held by the suction nozzle before mounting, and when the suction state is determined to be defective by this detection device, the detection device again performs a recovery operation in a recovery box. An electronic component mounting apparatus, comprising: a control device that performs control so as to detect the electronic component.   Electronic component mounting apparatus comprising a plurality of component supply units for supplying electronic components to a component suction position, and a mounting head having a plurality of suction nozzles for sucking electronic components from the component supply units and mounting them on a printed circuit board In the above, a detection device for detecting the suction state of the electronic component sucked and held by each suction nozzle before mounting, and when the suction state is determined to be defective by this detection device, the suction nozzle collects each suction nozzle in a collection box. A control device is provided that controls to detect again with the detection device after the operation, and controls to collect in the collection box when the detection result is defective again. An electronic component mounting apparatus characterized by the above. Electronic component mounting apparatus comprising a plurality of component supply units for supplying electronic components to a component suction position, and a mounting head having a plurality of suction nozzles for sucking electronic components from the component supply units and mounting them on a printed circuit board The first switching device for switching between the vacuum source, the air supply source, the supply of air from the air supply source or the supply stop, and the switching to communicate with either the vacuum source or the air supply source A second switching device and an air switching device which is provided corresponding to each of the suction nozzles and communicates with either the first switching device or the second switching device by switching between the air blowing side and the suction side. And a detection device for detecting the suction state of the electronic component sucked and held by each suction nozzle before mounting, and if the suction state is determined to be defective by this detection device, Control the air switching device to perform recovery to the recovery box, and control the detection so that it is detected again by the detection device. If the result of the detection again is defective, all the air switching devices are controlled and batched. And a control device that controls to perform the recovery operation into the recovery box.

Images