KR101438697B1 - Mounting state examination method of Chip mounter - Google Patents

Abstract

According to the present invention, there is provided a mounting accuracy inspection method for a component sealant, comprising: executing a substrate inspection mode through operation of a control unit of the component sealant; Wherein the recognition camera moves to a substrate position to which the recognition camera is supplied in a state in which the operation of the component body is stopped and analyzes the acquired image to determine the placement state of the substrate or the mounting accuracy of the components mounted on the substrate Checking; The method comprising the steps of: (a) advancing operation of the component body if there is no problem in the placement of the substrate or the mounting accuracy of components mounted on the substrate; And if the type of the problem is an error that can be corrected by itself, inputting the correction value to the control unit and applying the corrected value to the next substrate or component to be supplied.

Parts, mounting, recognition, camera, lighting, mounting, inspection

Description

Technical Field [0001] The present invention relates to a mounting state examination method of a chip mounter,

The present invention relates to a substrate inspecting apparatus, and more particularly, to a mounting accuracy checking method of an effective component inspecting apparatus, by which it is possible to inspect the placement state of a substrate or the mounting accuracy of components mounted on a substrate in a component body itself.

In general, a component chip (chip mounter) is a device for mounting a component such as a semiconductor package on a substrate (PCB). The process of determining that the part can be mounted at the correct position of the substrate before mounting the part in the component body should be preceded.

Thus, in order for the component to be mounted on the precise position of the substrate, the pickup state and the center position of the picked-up component must be accurately confirmed before mounting the component supplied from the component supply unit onto the substrate. To do this, proceed with the component recognition process.

In the component recognizing process, a recognition camera for photographing a component, a light source for irradiating light to the component, and a control unit for controlling the brightness value irradiated by the light source are provided. Therefore, the image of the part photographed by the recognition camera is analyzed, so that the part can be accurately mounted on the substrate.

Meanwhile, the process of inspecting the printed circuit board using the substrate inspection equipment separately from the mounting process is performed separately.

Conventional substrate inspection equipment SMT (Surface Mount Technology) is a device that inspects whether various parts surface-mounted on a printed circuit board by equipment or the like are defective in mounting position and whether solder is defective or not. There is a function to grasp the yield, a function to remove the cause of the defect in advance, and a function to promptly repair the part if a defect of the part is confirmed during the inspection.

As shown in FIG. 1, the conventional substrate inspecting apparatus 1 photographs a virtual transparent substrate 2, which is the same as the substrate to be inspected, or the substrate with the recognizing camera 3. Then, the virtual transparent substrate 2 or the external pattern of the substrate or a reference mark serving as a reference is analyzed through the obtained image.

Next, through the results obtained through the analysis, it is possible to find an error with respect to the position and arrangement state of the transparent substrate and the mounting accuracy of the component. In other words, the image can be checked through a computer monitor and the correction value for the error can be found.

However, the above-described conventional mounting accuracy inspection apparatus 1 is used as a component mounting apparatus and an individual apparatus, and only displays errors and correction values that may occur in the mounting stage of the substrate to inform the inspection results. Therefore, there is a problem that active measures are impossible.

That is, when a problem arises in the placement state of the substrate supplied to the mounting position or in the mounting accuracy of the components mounted on the substrate, it is necessary to inspect the substrate in a state in which the line of the component body long- There is.

Particularly, when several component mounting machines constitute one mounting line, all component mounting machines must be checked separately for each component body in a state of being stopped, and the correction value for the problem must also be applied to each component body individually There is a difficulty.

Therefore, the process of restarting all the equipment after applying the correction value becomes very cumbersome, which reduces the efficiency of the inspection. This consumes a lot of time in the substrate inspecting process, which is a factor of deteriorating the productivity in the component mounting process.

SUMMARY OF THE INVENTION Accordingly, the present invention has been made keeping in mind the above problems occurring in the prior art, and it is an object of the present invention to provide a method of inspecting mounting accuracy of a component mounted on a substrate, And to provide a method of inspecting the mounting accuracy of a component in a component body capable of immediately correcting the error value by directly correcting the error value by a control unit input method with respect to a type of self-calibrating problem.

In order to accomplish the above object, the present invention provides a method of manufacturing a semiconductor device, comprising: (S100) executing a substrate inspection mode through operation of a controller of a component body; The image pickup device moves to a position of a substrate to which a recognition camera is supplied in a pick-up head of the component body in a state in which the operation of the component body is stopped, and acquires an image, analyzes the obtained image, (S200) of mounting accuracy of a component mounted on the PCB; (S300), if there is no problem in the placement state of the board or the mounting accuracy of the components mounted on the board, proceeding with operation of the component body and judging the type of the problem if there is an error in the mounting accuracy; And a step (S400) of inputting a correction value for the type of the problem to the control unit (S400), when the type of the problem is an error that can be corrected by itself, , 400 are performed during line operation of the component body, and the step (200) is characterized by confirming whether or not the component is improperly mounted in accordance with a change in the position of the substrate.

In the step S400 of applying the correction value, if the type of the problem is an error that can be corrected by itself, such as displacement of the X axis and the Y axis, it is preferable that the correction is performed by the controller input method.

In step S400 of applying the correction value, steps S410 and S410 'of re-inspecting the placement state of the substrate or the placement accuracy of the components mounted on the substrate to check the accuracy of the self correction .

In addition, it is preferable that the step of re-inspecting the mounting accuracy (S410, S410 ') is repeated 2 to 3 times.

In the step S400 of applying the correction value, if the type of the problem is equal to or greater than the device of the component part, step S420 of informing the type of the problem; And performing the action separately according to the type of the problem (S430).

In addition, the step S400 of applying the correction value may further include a step S440 of storing history information on the type of the problem and the action to be taken.

In addition, the step of checking the mounting accuracy (S200) may further include adjusting a photographing distance of the recognition camera to secure a focal distance and a lens view angle (FOV) of the substrate or a component mounted on the substrate .

As described above, since the mounting accuracy of the board and the parts can be inspected during the line operation of the component body, the time for stagnation in the component mounting process of the parts can be shortened and the productivity can be improved.

In addition, the error value can be immediately corrected through the control unit input method for the problem type that can be self-calibrated, so that the user can immediately take measures against frequently occurring problems.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.

Fig. 2 is a front view showing a pick-up head of a component body of a method of inspecting mounting accuracy of a component body according to the present invention, Fig. 3 is a side view according to Fig. 2, Fig. 7 is a diagram showing inspection steps of a method for checking the mounting accuracy.

As shown in the drawing, the present invention includes a step S100 of executing a substrate inspection mode, a step S200 of checking a mounting accuracy, a step S300 of determining a type of a problem, and a step S400 of applying a correction value .

As shown in FIGS. 1 and 2, the component chassis (not shown) includes a pickup head 100 moving along a mounting line, a pickup head 100 installed vertically to the pickup head 100, A plurality of spindles 110 and a suction nozzle 111 selectively connected to the lower end of the spindle 110 to pick up the components.

In addition, the pickup head 100 may include a recognition camera 120 for photographing a substrate supplied to the lower part, and a plurality of light sources (LED, halogen lamp, etc.) for irradiating light.

That is, by analyzing the image of the substrate photographed through the recognition camera 120, it is possible to accurately analyze the arrangement state of the supplied substrate or the mounting accuracy of the components mounted on the substrate. For example, problems with mounting conditions, such as errors in the X and Y axis displacements of the substrate and part, can be found.

Here, in order to inspect the board and the parts, it is possible to determine the board and the part by using a reference fiducial mark or the like formed by the board and the photographing surface of the part are formed with a predetermined mark, (Overall shape).

Hereinafter, each step of the present invention will be described in detail with reference to FIG.

First, in the step S100 of executing the substrate inspection mode, the process of executing the substrate inspection mode is performed through the operation of the control unit of the component body.

In the step S100 of executing the substrate inspection mode, the substrate placed on the mounting stage or the components mounted on the substrate is photographed by the recognition camera 120 to analyze the placement state of the substrate or the mounting accuracy of the components.

In other words, in a general mode in which the pickup state of a component mounted on the pick-up head 100 is photographed by a lower recognition camera to determine the suitability of supply, mounting of a component mounted on a substrate or a substrate for mounting the component It is a process of changing to the board inspection mode which can check the accuracy.

 Next, in the inspection step S200, the operation moves to the substrate position where the recognition camera is supplied in the state where the operation of the component body is stopped, the image is acquired, and the acquired image is analyzed .

In the inspecting step S200, the recognition camera 120 is moved to acquire an image of a corresponding component mounted on the substrate or the substrate. At this time, the control unit analyzes the image of the component to determine whether the substrate is misaligned, the position is changed, whether the mounting position of the component is defective (X axis and Y axis displacement error value), whether soldering is bad or not.

The inspection step S200 may further include a step of adjusting a photographing distance of the recognition camera to secure a focal length and a lens view angle (FOV) of the component mounted on the substrate or the substrate .

That is, when the recognition camera 120 has a structure in which the recognition camera 120 is vertically moved up and down, when the recognition accuracy of the parts is low, So that it can be taken close-up. On the other hand, the recognition camera 120 can ascend and descend for a component having a large size or a large size so that the component can be photographed with a certain distance.

Therefore, it is possible to take a photograph while adjusting the focal length of the lens and the angle of view of the lens which should be varied according to various conditions such as the shape, size and thickness of the parts.

As described above, the inspection method in the inspecting step (S200) may be performed by judging through the reference fiducial mark or the like formed by the substrate and the part photographing surface of the predetermined mark, (Overall shape), such as the number and the shape of the parts.

Next, in the step S300 of determining the type of the problem, if there is no problem in the placement state of the substrate or the mounting accuracy of the components mounted on the substrate, the operation of the component yarn is continued, and if there is the error, The process of determining the type of the user is performed.

The step of determining the type of the problem (S300), if the problem type of the mounting accuracy is more than the devices that can not be calibrated by itself, is to stop the operation of the parts supply line and check the manufacturer or engineer .

That is, problems of the apparatus itself such as deflection of the spindle 110 of the component body due to obsolescence, tension of the spring, breakage of the spring, etc. can not be corrected in a manner of applying a correction value. Do.

On the other hand, if the type of the problem is a type of problem that can be corrected by itself, such as a defective placement of the substrate or a defective mounting position of the component (error such as displacement of the X axis and Y axis) .

Next, in step S400 of applying the correction value, if the type of the problem is an error that can be corrected by itself, a correction value for the type of the problem is input to the control unit, So that it can be supplied in an applied state.

That is, in the step of applying the correction value (S400), if the type of the problem is an error that can be corrected by itself, by inputting the correction value to the control unit, the arrangement state of the substrate, The mounting accuracy can be corrected immediately.

In addition, it is possible to apply the correction value to the type of the problem that can be corrected by itself, such as the defective arrangement of the substrate or the defective mounting position of the component (error such as the displacement of the X axis and the Y axis).

In the step S400 of applying the correction value, a step S410 or S410 'of re-examining the mounting state of the substrate or the mounting accuracy of the components mounted on the substrate is performed to confirm the accuracy of the self correction can do.

It is preferable that the number of repetitions of the re-inspecting steps (S410, S410 ') is 2 to 3 times, but the user can arbitrarily select and set it according to the type of the mounting process.

The reason for carrying out the reinspection steps (S410 and S410 ') is as described above, even if the mounting error of the component is corrected, a slight error may occur even after the corrective action due to environmental influences.

In the step S400 of applying the correction value to the substrate or the component, a step S420 of notifying the type of the problem in the case where the type of the problem is equal to or greater than the device in the component realization stage, (S430).

That is, if the error is not corrected also through the re-inspecting steps (S410 and S410 '), the user can determine that the problem type is a problem that can not be corrected by himself or herself, and can be resolved by checking the manufacturer or the engineer of the component real part as described above.

In addition, it is preferable to further include a step S440 of storing history information on the type of the self-calibrating problem, the type of the self calibrating non-calibrating problem, and the action items.

That is, by using the information obtained through the step of storing the history information (S440), it is possible to more quickly deal with the types of problems that occur later.

As a result, the present invention is capable of checking the mounting accuracy of the board and the parts during line operation of the component body, and it is possible to reduce the stagnation time in the component mounting process of the parts, thereby improving the productivity. In addition, the error value can be immediately corrected through the control unit input method for the problem type that can be self-calibrated, so that the user can immediately take measures against frequently occurring problems.

While the present invention has been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the disclosed embodiments, but, on the contrary,

Accordingly, it is a matter of course that various changes and modifications can be made in the form of dimensions, shapes and structures without departing from the technical scope of the present invention by those skilled in the art, Are included in the technical scope of the present invention.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view showing an apparatus for checking mounting accuracy of a conventional component body. FIG.

2 is a front view showing a pick-up head of a component body of a method of inspecting mounting accuracy of a component body according to the present invention.

Figure 3 is a side view according to Figure 2;

4 is a diagram showing steps of inspecting a method of inspecting the accuracy of mounting on a component body according to the present invention.

Description of the Related Art

100: pickup head 110: spindle

120: Recognition camera

Claims (7)

A step (S100) of executing a substrate inspection mode through operation of a control unit of a component real time; The image pickup device moves to a position of a substrate to which a recognition camera is supplied in a pick-up head of the component body in a state in which the operation of the component body is stopped, and acquires an image, analyzes the obtained image, (S200) of mounting accuracy of a component mounted on the PCB; (S300), if there is no problem in the placement state of the board or the mounting accuracy of the components mounted on the board, proceeding with operation of the component body and judging the type of the problem if there is an error in the mounting accuracy; And If the type of the problem is an error that can be corrected by itself, inputting the correction value to the control unit (S400), and applying the correction value to the substrate or component to be supplied next time (S400) The steps (S100, S200, S300, S400) are performed during line operation of the component body, and the step (S200) checks whether the mounting of the component is poor or not in accordance with the change of the position of the board Method of inspecting the mounting accuracy of components. The method according to claim 1, In the step of applying the correction value (S400), if the type of the problem is an error that can be corrected by self-correction such as displacement of the X-axis and Y-axis, Way. 3. The method of claim 2, In step S400 of applying the correction value, step S410 and step S410 'of re-inspecting the placement state of the substrate or the placement accuracy of the components mounted on the substrate in order to check the accuracy of the self correction And the mounting accuracy of the component body is checked. The method of claim 3, And the step of re-inspecting the mounting accuracy (S410, S410 ') is repeated two to three times. The method according to claim 1, In the step S400 of applying the correction value, if the type of the problem is equal to or greater than the device of the component realization stage, the type of the problem is notified S420; And (S430) of performing an action according to the type of the problem (S430). The method according to claim 1, The method of claim 4, wherein the step (S400) of applying the correction value further comprises a step S440 of storing history information on the type of the problem and the action to be taken. Claim 7 has been abandoned due to the setting registration fee. The method according to claim 1, The step of checking the mounting accuracy (S200) further includes adjusting a photographing distance of the recognition camera to secure a focal distance and a lens viewing angle (FOV) of the board or a component mounted on the board A method of inspecting the mounting accuracy of a component seal.

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