JP2007019139A - Feedback correction method and unit, part mounting method and device, and part mounting system - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a feedback correction method which is capable of displaying the correction effect of feedback in the minimum production number of pieces in a part mounting process of mounting electronic parts on the side edges of a liquid crystal panel. <P>SOLUTION: A feedback correction unit 100 reads out from a deviation inspection unit F the inspection result of a deviation volume as a position difference between the center point of an electronic part and the center point of a mounting target position, and the feedback volume of the electronic part whose deviation volume is checked when it is mounted on a board. Furthermore, the feedback correction unit 100 is equipped with a calculation unit 101 calculating the feedback volume of a board that is manufactured next, a memory unit 102 storing parameters used in a temporary crimping operation, and a control unit 103 carrying out a mounting position correcting operation etc of the electronic part on the basis of a feedback volume for a temporary crimping unit C based on a calculation result from the calculation unit 101. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a feedback correction method when an electronic component is mounted on a substrate, and more particularly, to a feedback correction method used in a component mounting process for mounting an electronic component on a liquid crystal panel.

  Conventionally, a display panel of an electronic device such as a liquid crystal panel is assembled by bonding an electrode of an electronic component such as a driver IC to an electrode formed along an end portion of the display panel. Since the driver IC of the electronic component and the electrode of the display panel have a narrow pitch and high alignment accuracy is required, an anisotropic conductive sheet (hereinafter referred to as “ACF”) is provided between the driver IC and the electrode of the display panel. ) Is often used for bonding.

  The ACF is made of an adhesive synthetic resin sheet. The ACF is previously attached to the upper surface of the display panel electrode or the lower surface of the driver IC, and the driver IC is attached to the display panel electrode by a crimping tool. Prior to bonding, an electrode such as a camera IC and a display panel is observed in advance by a measuring device such as a camera to detect a relative displacement between the electronic component and the display panel. For example, an XYθ table on which the display panel is mounted After correcting the above-mentioned misalignment by moving the display panel in the X, Y, and θ directions (horizontal rotation direction) using alignment means such as the above, the driver IC is crimped onto the electrodes of the display panel using a crimping tool. Bond.

  Conventionally, there has been disclosed an apparatus including means for bonding a driver IC to an electrode of a display panel in consideration of a shift that occurs when the driver IC is crimped to an electrode of a display panel (LCD) (for example, Patent Documents). 1).

  This bonding apparatus includes a temporary crimping section, a first main crimping section, and a second main crimping section. In the electronic component bonding apparatus, the electronic component is expected to be misaligned when the electronic component is crimped to the LCD. And LCD alignment.

  FIG. 19 is an explanatory diagram of a feedback correction method in the conventional feedback correction apparatus 1900.

  As shown in the figure, the component mounting process includes, for example, a temporary pressure bonding process in which electronic components are aligned and temporarily pressure-bonded on the ACF, a main pressure bonding process 1 in which a liquid crystal panel is subjected to a pressure bonding process in the gate direction and the source direction, and This includes a displacement inspection step of detecting a displacement amount between an actual mounting position of the electronic component and a target mounting position.

The feedback correction apparatus 1900 sequentially stores the inspection results in the deviation inspection unit, takes an average value after a certain number of deviation inspection results are accumulated, and adds a predetermined feedback coefficient (for example, 0) to the average value of the deviation amounts. .1, etc.) is calculated as a feedback amount, and in the temporary press-bonding step, temporary press-bonding is performed on the corrected mounting position based on this feedback amount. Specifically, in this figure, for example, in the temporary press-bonding process of the substrate 14, the average value of the detected displacement amounts of the substrates 1 to 10 is calculated, and the electronic component mounting is performed by multiplying this value by the feedback coefficient. A feedback amount used for position correction is calculated.
JP-A-7-201932

  However, in the conventional feedback correction apparatus 1900 shown in FIG. 19, since a feedback amount is calculated based on a deviation amount obtained by averaging a plurality of inspection results, a certain number of substrates are required until the correction becomes effective. There is a problem that position correction by time and feedback cannot be reflected at an early stage. In particular, in mounting electronic components on a liquid crystal panel in a recent component mounting process, a high mounting accuracy of about 3 to 5 microns is required, and it is necessary to reflect an appropriate mounting position correction earlier.

  In addition, in the conventional feedback correction method, since the feedback amount is simply calculated based on the average value of the deviation amounts even for the substrate that has already been subjected to the mounting position correction by the feedback amount, it is already performed in the temporary crimping process. The correlation between the feedback correction and the amount of deviation detected by the deviation inspection machine is not taken into account, and as a result, unintended correction may be performed. There is also a problem that it is necessary to correct by multiplying by a feedback coefficient, and it is necessary to produce many substrates before the mounting position is appropriately corrected.

  Therefore, the present invention has been made in consideration of the above-described circumstances, and in the process of crimping an electronic component to an electrode of a liquid crystal panel in a crimping process of the electronic component to a liquid crystal panel or the like that requires finer precision. It is an object of the present invention to provide a feedback correction method that more appropriately prevents the generated positional deviation.

  In order to solve the above-described problems, the feedback correction method according to the present invention uses the amount of deviation of the mounting position of the actually mounted electronic component in the component mounting process for mounting the electronic component on the board, and subsequently produces A feedback correction method for correcting the mounting position of the electronic component on the substrate, the storage step storing the feedback amount made when the electronic component is mounted on the substrate, and the actual mounting of the electronic component on the substrate Based on the amount of deviation between the mounting position and the target mounting position, and the amount of feedback stored in the storage step and already made when the electronic component is mounted on the substrate, the amount of feedback to the newly produced substrate is calculated. A calculation step; and a control step for controlling a mounting position of the electronic component on the substrate based on a calculation result in the calculation step. And wherein the Mukoto.

  Further, in the control step of the feedback correction method according to the present invention, the mounting position of the electronic component on the board to be produced in the component mounting step is corrected using the feedback amount that is the calculation result in the calculation step. It is characterized by that.

  With these configurations, in the calculation step, the feedback amount for the newly produced substrate can be calculated based on the correlation between the inspection result of the deviation amount and the feedback amount already performed. Feedback correction can be performed directly on the board to be produced next without multiplication, and feedback correction of the mounting position of the electronic component can be performed more quickly.

  In addition, a signal line for exchanging a contact signal related to feedback correction is provided between the component mounting steps in the component mounting method according to the present invention. In the temporary press-bonding step, the signal line is obtained in the shift inspection step. Each time the feedback amount based on the deviation amount is updated, ON / OFF of the communication signal is alternately changed. In the deviation inspection process, ON / OFF of the communication signal is switched using the communication signal as a trigger. To determine whether the feedback correction has been performed.

  With this configuration, it is possible to add one signal line for transmitting a communication signal between each component mounting process, and to realize the component mounting method of the present invention by the configuration of the conventional component mounting process.

  In order to achieve the above object, the present invention can be used as a feedback correction apparatus having the characteristic steps of the feedback correction method as a constituent means, or as a component mounting apparatus provided with this feedback correction method.

  In the feedback correction method according to the present invention, when the electronic component is mounted on the liquid crystal panel, the mounting position is corrected based on more accurate data, and the occurrence of positional deviation in the pressure bonding of the electronic component to the liquid crystal panel is reduced. Mounting accuracy can be improved.

  In addition, accurate feedback correction can be realized with a minimum number of substrates to be produced, without detecting a predetermined amount or more time and performing time for feedback correction.

  Furthermore, it is possible to detect a more accurate displacement amount of the electronic component to the target mounting position, and it is possible to more accurately perform feedback correction by statistically processing the inspection results of a plurality of substrates.

  Furthermore, the feedback correction method according to the present invention can also realize the feedback correction according to the present invention using the configuration of the conventional component mounting process without providing a dedicated feedback correction device for performing feedback correction.

  Embodiments of a feedback correction apparatus according to the present invention will be described below with reference to the drawings.

(Embodiment 1)
FIG. 1 is a plan view showing an overall configuration of a component mounting process using the feedback correction apparatus according to the first embodiment.

  The component mounting process in this figure includes a liquid crystal panel (LCD) supply unit A, an anisotropic conductive sheet adhering unit B, a temporary crimping unit C, a first primary crimping unit D, and a second final crimping unit E. , Misalignment inspection unit F, collection unit G for collecting LCD with electronic parts bonded thereto, line controller H for managing the operation status of the entire apparatus and communication of various data, communication cable I for connecting the line controller H and each unit, etc. It is composed of

  In the drawing, the liquid crystal panel 1 is transported in a transport section 2 provided along each section. The transport unit 2 is provided with a large number of arms 3 at a constant pitch, and a pad 4 for vacuum-sucking the liquid crystal panel 1 is attached to the tip of the arm 3. Each pad 4 vacuum-sucks the liquid crystal panel 1 on the mounting tables W1, W2, W3, W4, and reciprocates in the X direction to transfer the liquid crystal panel 1 to an XYθ table provided in each part, The liquid crystal panel 1 on the XYθ table is carried out to the next mounting table W2, W3, W4.

  FIG. 2 is a partial perspective view of a temporary crimping portion C which is a bonding apparatus for the electronic component 28 according to the first embodiment.

  FIG. 2 shows a state in which the first electronic component 28 is mounted on the liquid crystal panel 1. The liquid crystal panel 1 is formed by bonding a lower plate 1a made of a glass plate and an upper plate 1b, and the lower plate 1a. Electrodes 27 are formed at a narrow pitch at the end of each. The suction head 21 vacuum-sucks the first film carrier 20a on its lower surface. The nozzle shaft 22 is coupled to the suction head 21, and the first film carrier 20 a is vacuum-sucked through the nozzle shaft 22.

  Then, using the temporary pressure bonding tool 26 provided in the temporary pressure bonding head, the outer leads of the electronic component 28 are pressed against the ACF 23 for temporary pressure bonding. This temporary crimping is performed prior to the final crimping of the first electronic component by the first regular crimping portion D and the final crimping of the second electronic component by the second final crimping portion E, which will be described later. The temporary crimping tool 26 is heated by a heater (not shown) so that the outer lead can be lightly temporarily crimped to the ACF 23. In addition, ACF23 is affixed beforehand on an electrode in the anisotropic conductive sheet sticking part B. FIG.

  In FIG. 2, a first camera 24 a and a second camera 24 b are installed below the temporary crimping tool 26. In addition, marks 25a and 25b on the circle are formed in the vicinity of the electrode on the lower plate.

  FIG. 3 is a bottom view of the liquid crystal panel 1 and the electronic component 28 immediately before provisional pressure bonding in the first embodiment, and shows a state of observation by the first camera 24a and the second camera 24b. In the figure, marks 25a and 25b on the spots are formed at both ends of the film carrier, the first camera 24a observes the left mark 25a in the figure, and the second camera 24b observes the right mark 25b. . Further, the portion of the outer lead 30 of the electronic component 28 is aligned with the electrode 27 formed on the liquid crystal panel 1 and a temporary pressure bonding process is performed.

  FIG. 4 is a block diagram of a control system of the temporary crimping section C according to the first embodiment.

  As shown in the figure, the CPU 41 of the temporary crimping section C performs overall control of the temporary crimping section C, calculation of the positional deviation Sx in the X direction and the positional deviation Sy in the Y direction of the electronic component 28 and the liquid crystal panel 1, and the like. Do. The ROM 42 stores a program for operating the apparatus. The RAM 43 stores offset data Tx, Ty and the like. Sx, Sy, Tx, and Ty will be described later. The recognizing unit 44 is connected to the first camera 24a and the second camera 24b described above, and obtains the coordinates of the mark based on the obtained image data. The XYθ table controller 45 controls the XYθ table 50. The suction head controller 46 controls the suction head 21. The temporary pressure bonding head controller 47 controls the temporary pressure bonding head 51. Each means described above is connected to the bus 48, and is further connected to the communication cable H via a communication unit 49 that controls external communication.

  FIG. 5 is a plan view of the liquid crystal panel 1 to which the electronic component 28 according to the first embodiment is bonded, and FIG. 6 is a perspective view of a main part of a displacement inspection unit F in the component mounting process according to the first embodiment.

  As shown in FIG. 5, an electronic component 28 is bonded to bonding positions # 1 to # 8. In addition, these electronic components 28 may be misaligned during temporary pressure bonding and main pressure bonding, and thus may be bonded at positions deviated from normal positions. Accordingly, after the second main crimping portion E, the positional displacement amounts Tx and Ty of the positional displacement described above are measured by the displacement inspection portion F provided with the two cameras 61 and 62 in the observation portion 60 as shown in FIG. .

  FIG. 7 is a block diagram of a control system of the deviation inspection unit F in the component mounting process of the first embodiment. The CPU 71 performs overall control of the deviation inspection unit F, calculation of the positional deviation Sx in the X direction between the electronic component 28 and the liquid crystal panel 1, the positional deviation Sy in the Y direction, and the like. The ROM 72 stores a device operation program and the like. The RAM 73 stores offset data Tx, Ty and the like. The recognition unit 74 is connected to the third camera 61 and the fourth camera 62 described above, and obtains the center coordinates of the mark based on the obtained image data. The XYθ table controller 75 controls the XYθ table 50. The NG substrate transport unit controller 76 controls the NG substrate transport unit 79. Each means described above is connected to the bus 78 and further connected to the communication cable H via a communication unit 77 that controls external communication.

  8 and 9 are explanatory diagrams of a method for calculating the positional deviation amount of the electronic component 28 used in the deviation inspection unit F according to the first embodiment.

  The displacement detection is performed by observing the mark formed on the liquid crystal panel 1 and the mark formed on the electronic component 28 using the cameras 61 and 62 provided in the displacement inspection unit F. It is possible to calculate the positional deviation between the marks and the positional deviations of the center points 81 and 82 in the connected measuring unit.

  FIG. 9 is an explanatory diagram when the angle of the liquid crystal panel 1 is parallel to the coordinate system on the equipment.

FIG. 9A shows a case where the center point 91 of the target mounting position overlaps the coordinates of the center point 90 of the actual mounting position. In this case, the amount of displacement (X , Y, V) = (0, 0, 0). FIG. 9B shows a case where the angle of the liquid crystal panel 1 is parallel to the coordinate system on the equipment. In this case, the amount of deviation (X, Y, V) after the electronic component 28 is crimped. = (Xa, Ya, Va).
However, as shown in FIG. 8, when the angle of the liquid crystal panel 1 is not parallel to the coordinate system on the equipment, the coordinate system of the liquid crystal panel 1 is different from the coordinate system on the equipment.

In such a case, when the shift amount is calculated using the four marks formed on the liquid crystal panel 1 and the electronic component 28 based on the coordinate system on the equipment, the shift amount (X, Y, V) = ( Xb, Yb, Va). However, when this amount of deviation is applied as a feedback amount, it cannot be corrected correctly depending on the relationship between the angle of the liquid crystal panel 1 and the coordinate system on the equipment.
Therefore, the angle of the liquid crystal panel 1 with respect to the coordinate system on the equipment is obtained from the two marks on the liquid crystal panel 1, and the amount of deviation (X on the coordinate system (the coordinate system based on the liquid crystal panel 1) based on the obtained angle is calculated. , Y, V) = (Xa, Ya, Va) is calculated. That is, as shown in this figure, the amount of deviation (X, Y, V) = (Xa, Ya, Va) ≠ (Xb, Yb, Va), and the target mounting position based on the reference coordinate system of the liquid crystal panel 1 By obtaining the difference between the coordinates of the center point 82 and the center point 81 of the actual mounting position, the true deviation amount between the center points 80 and 81 can be detected even when the orientation of the liquid crystal panel 1 is different from the equipment coordinates. .

  As described above, in the deviation inspection unit F according to the first embodiment, the deviation between the center point of the electronic component 28 and the center point of the mounting position on the liquid crystal panel 1 is calculated based on the reference coordinate system of the liquid crystal panel 1. Therefore, even when the orientation of the liquid crystal panel 1 is different from the equipment coordinates, the amount of deviation can be calculated correctly. In addition, since the amount of deviation can be detected without being affected by the equipment configuration in the component mounting process, even if the equipment configuration is changed, there is no error in the correction amount in the temporary crimping section C and the amount of deviation in the deviation inspection section F. .

  FIG. 10 is a reference diagram for explaining a correction method of the feedback correction apparatus 100 according to the first embodiment. In the description of the first embodiment, a configuration is shown in which the feedback correction apparatus 100 is provided externally as a host controller in the component mounting process, but the present invention is not limited to this, The crimping part C and the displacement inspection part F can also be provided with a feedback correction device.

  The feedback correction apparatus 100 according to the present invention includes a calculation unit 101 that calculates a feedback amount of a substrate to be produced next, and a parameter in provisional pressure bonding, for example, a feedback amount, a mounting position, Controls correction based on the feedback amount for the temporary press-bonding portion C based on the calculation result from the storage unit 102 and the calculation unit 101 based on the calculation result from the calculation unit 101 in association with the mounting substrate, which is information about the number of substrates. It consists of a control unit 103. The arithmetic unit 101 acquires from the misalignment inspection unit F the inspection result of the misalignment amount that is the difference between the center point of the electronic component and the center point of the target mounting position, and the electronic component substrate whose misalignment amount has been inspected from the storage unit 102. The feedback amount at the time of mounting is read, and the feedback amount of the board to be produced next is calculated and notified to the control unit 103. The control unit 103 controls correction based on the feedback amount with respect to the temporary crimping unit C based on the calculation result from the calculation unit 101 and transports the temporary crimping unit C, the first crimping unit D, and the second final crimping unit E. To ensure the consistency between the substrate and the feedback amount. Note that the controller 103 may be provided in each of the provisional crimping section C, the first crimping section D, and the second final crimping section E.

  FIG. 11 is a reference diagram illustrating an example of the data table 110 stored in the storage unit 102 of the feedback correction apparatus 100. The data table 110 stores a unique substrate ID 110a assigned to each substrate, a feedback amount 110b corrected when the substrate is temporarily bonded, a mounting position 110c in the X and Y directions on the liquid crystal panel, and the like.

  FIG. 12 is a reference diagram of the table 120 showing the feedback amount calculated by using the inspection result in the deviation inspection unit F in the arithmetic unit 101.

  The table 120 records a substrate ID 120a for each substrate, a feedback amount 120b actually performed for each substrate, a displacement amount 120c detected for each substrate in the displacement inspection unit F, an actual displacement amount 120d for each substrate, and the like. The

And as shown in this figure, although the electronic component crimping process is performed with the feedback amount 0 for the substrates 1 to 4, the displacement amount Fa is detected for the substrate 1 in the displacement inspection unit F. .
The calculation unit 101 calculates a feedback amount (−Fa) actually performed on the substrate 5 based on the inspection result of the substrate 1 in the displacement inspection unit F, and transmits the calculated feedback amount (−Fa) to the control unit 103. The control unit 103 corrects the mounting position of the electronic component as a feedback amount (−Fa) with respect to the temporary crimping portion C.
Further, the arithmetic unit 101 calculates a feedback amount (−) by calculating an actual deviation amount Fb of the substrate 5 in the deviation inspection unit F and a feedback amount (−Fa) given to the substrate 5 with respect to the substrate 9. Fa) + (− Fb) is calculated. That is, in the feedback correction apparatus 100 of the present invention, the feedback amount (−Fa) has already been added to the substrate 5, and is detected by the deviation inspection unit F when performing feedback correction on the substrate 9. The detected deviation amount Fb of the substrate 9 is detected, and the arithmetic unit 101 calculates the true deviation amount = Fb + Fa, and this “true deviation amount” is set as the feedback amount. Then, the control unit 103 performs control so as to correct the mounting position of the electronic component with respect to the provisional pressure-bonding portion C so that the feedback amount is − (Fa + Fb).

  In the description of the first embodiment, the amount of deviation is described as Fa. However, in actuality, as shown in FIG. 5B, in the deviation inspection unit F, the positional deviation Sx in the X direction and Y Next, the calculation unit 101 adds the actual feedback amounts Tx and Ty stored in the storage unit 102 to the Sx and Sy as correction values and detects the final correction value. Processing for obtaining Ux and Uy is performed.

FIG. 13 is a flowchart showing the operation procedure of the temporary crimping section C that has received feedback correction control from the feedback correction apparatus 100 according to the present invention described above.
First, positioning processing between the outer lead of the electronic component and the electrode of the liquid crystal panel is performed (S1301).

  Next, the mounting position mark is observed to obtain a positional shift of the electronic component relative to the liquid crystal panel (S1302), and the XYθ table is driven by reflecting the feedback amount from the feedback correction device 100 to determine the electronic component. The mounting position is corrected (S1303).

  Then, a temporary pressure bonding process of the electronic component is performed on the determined mounting position on the liquid crystal panel (S1304).

  As described above, in the feedback correction apparatus 100 according to the present invention, the calculation unit 101 calculates the correlation between the inspection result of the deviation inspection unit F and the feedback amount actually performed on each substrate stored in the storage unit 103. The calculation of the feedback amount for the substrate to be produced next is performed.

  For this reason, the consistency between the inspection result by the deviation inspection unit F and the mounting parameters of the board to be produced next can be ensured, and the next production substrate can be directly produced using the deviation amount detected by the deviation inspection unit F. On the other hand, feedback correction can be performed, and feedback correction of the mounting position of the electronic component can be performed earlier. Therefore, the mounting position of the electronic component on the liquid crystal panel is corrected earlier, and a highly accurate mounting process can be realized.

  Further, even when the feedback correction is performed by performing the statistical processing, the correction considering the feedback amount that has already been performed can be performed, so that the mounting position correction of the electronic component based on the more accurate deviation amount data can be realized.

  In the first embodiment, the correction in the feedback correction apparatus 100 is reflected in the provisional crimping section C. However, the crimping conditions may be corrected in other processes, for example, the final crimping section D or E. I can think.

(Embodiment 2)
Next, a second embodiment of the feedback correction apparatus according to the present invention will be described with reference to the drawings. In addition, since each process of component mounting using the feedback correction apparatus of this Embodiment 2 is the same as that of Embodiment 1 mentioned above, the description is abbreviate | omitted.

  Further, in the second embodiment, when the electronic component is mounted on the board, the feedback amount for the newly produced board is calculated using the average value of the deviation amount of the liquid crystal panel corrected by the same feedback amount. It is characterized by calculating.

  FIG. 14 is a reference diagram for explaining a correction method of feedback correction apparatus 1400 according to the second embodiment.

  The feedback correction apparatus 1400 includes the calculation unit 101, the storage unit 102, and the control unit 1401, as in the first embodiment. In the second embodiment, the control unit 1401 performs feedback control only on the temporary crimping part C.

  In the second embodiment, the calculation unit 101 uses the average value of the shift amounts of the substrates 1 to 4 detected by the shift inspection unit F as the feedback amount Fa of the substrates 9 to 12.

  For the substrate 13 and subsequent substrates, Fa + Fb obtained by adding the average value Fb of the shift amounts of the substrates 5 to 8 to the average value Fa of the shift amounts of the substrates 1 to 4 detected in the shift inspection unit F is set to the substrates 13 to 16. Feedback amount.

  FIG. 15 is a reference diagram of a table 150 showing the feedback amount calculated using the inspection result in the deviation inspection unit F in the arithmetic unit 101 of the feedback correction apparatus 1400 according to the second embodiment.

  The table 150 records a substrate ID 150a for each substrate, a feedback amount 150b actually performed for each substrate, a displacement amount 150c detected for each substrate in the displacement inspection unit F, an average value 150d of the displacement amount, and the like.

  And as shown in this figure, with respect to the board | substrates 1-8, the crimping | compression-bonding process of an electronic component is performed by the feedback amount of 0. FIG.

In addition, the calculation unit 101 transmits the average value Fa of the shift amounts of the substrates 1 to 4 in the shift inspection unit F to the substrates 9 to 12 as a feedback amount that is actually performed. For the substrates 9 to 12, the control unit 103 corrects the mounting position of the electronic component as the feedback amount Fa with respect to the temporary crimping portion C.
Further, the arithmetic unit 101 adds the average value Fa of the actual shift amount of the substrates 1 to 4 and the average value Fb of the actual shift amount of the substrates 5 to 8 to the substrates 13 to 16. The calculated feedback amount (Fa + Fb) is calculated as the feedback amount. And the control part 103 correct | amends the mounting position of the electronic component made into feedback amount Fa + Fb with respect to the temporary crimping | compression-bonding part C with respect to the boards 13-16.
Further, as shown in the table 160 of FIG. 16, after applying the average value of the shift amounts of the substrates 1 to 4 to the substrate 9, the inspection results after the substrate 5 may be sequentially integrated and averaged to obtain the feedback amount.

  As described above, the feedback correction apparatus 1400 according to the second embodiment calculates the feedback amount using the average value of the deviation amounts detected by the deviation inspection unit F of the board, and mounts the electronic component. By performing the correction, it is possible to mitigate the influence of the mounting position shift due to a sudden factor such as a defective shape of the electronic component. The feedback correction apparatus 1400 according to the present invention is not necessarily required to perform feedback correction based on the average value of the deviation amounts of a plurality of substrates. For example, the feedback correction apparatus 1400 may calculate the feedback amount based on a peak value based on a normal distribution. obtain.

  Further, the number of data used for obtaining the average value of the mounting position deviation amount is not limited to this embodiment, and can be set freely. The mounting position is stabilized by feedback, and the average value is obtained as production proceeds. You may change the number of data used for.

(Embodiment 3)
Next, a third embodiment of the feedback correction method according to the present invention will be described with reference to the drawings. Note that the feedback correction method according to the third embodiment provides a notification of information related to feedback correction to the next process apparatus at the same time as the board transfer in the component mounting process, so that a feedback correction apparatus as a host system is not provided. The feedback correction method according to the present invention is realized by the configuration of the conventional component mounting process.

FIG. 17 is an explanatory diagram for explaining a feedback correction method according to the third embodiment. In this figure, the liquid crystal panels 1 to 4 are corrected with a feedback amount of 0 in the temporary press-bonding step, the liquid crystal panels 5 to 14 are corrected with the feedback amount Fa in the temporary press-bonding step, and the liquid crystal panels 15 to 16 are corrected with the feedback amount Fb. It is assumed that.
The third embodiment is characterized in that one feedback signal is added to the exchange of signals during panel handling between the processes. This signal is a state for the panel, and the temporary crimping section C alternately updates ON / OFF of the signal every time the feedback amount by feedback is updated. The signal state is maintained until the offset by the next feedback is updated.

  In FIG. 17, the signal states of the substrates 1 to 4 are “OFF”, the signal states of the substrates 5 to 14 for which the feedback amount Fa has been corrected are changed to “ON”, and the feedback amount Fb The signal states of the corrected substrates 15 to 16 are changed to “OFF”.

  Further, in the processes after the temporary crimping section C, when the liquid crystal panel is received, the signal state is received, and when the liquid crystal panel is unloaded, the signal state similar to the received state is notified to the downstream side. And carry it out.

  When receiving the liquid crystal panel, the displacement inspection unit F can determine the timing for switching the arithmetic expression using the signal as a trigger for determining whether or not the liquid crystal panel has an updated feedback amount.

  FIG. 18 is a flowchart showing an operation procedure of the deviation inspection unit F according to the third embodiment.

  First, the displacement inspection unit F carries in a new substrate (S1801).

  Next, the deviation inspection unit F determines whether there is a change in the signal state (S1802). If there is a change in the signal state (Yes in S1802), the amount of deviation detected in the deviation inspection unit F using the same method as in the first or second embodiment described above and the electronic component already in the temporary crimping unit C are used. The feedback amount given to the component is notified (S1803). When the signal state is not changed (No in S1802), the deviation inspection unit F performs a new substrate loading process.

As described above, the feedback correction method according to the third embodiment adds one signal line for transmitting a communication signal between each process of component mounting, and thus the configuration of the conventional component mounting process is used. A feedback correction method is realized, and there is no need to provide a feedback correction device as a host system in the component mounting process as in the first or second embodiment described above, and the present invention uses a simple system configuration. Feedback correction can be performed.
In addition, by changing the contact signal to ON / OFF, the deviation inspection unit F can confirm the trigger of the substrate that has been subjected to feedback correction. Therefore, the deviation inspection unit F appropriately accumulates data relating to feedback correction that has already been performed. It is possible to correct the mounting position of the electronic component by calculating an appropriate feedback amount.
In the feedback correction method according to the third embodiment, the number of liquid crystal panels held between the temporary crimping portion C and the displacement inspection portion F varies depending on the line configuration, or the liquid crystal panel is installed on the device in the middle. Even if the substrate is removed from the line, the substrate serving as a trigger for performing feedback correction can be determined.

  The feedback correction method according to the present invention can be used, for example, in a component mounting process for mounting an electronic component such as a semiconductor component on a liquid crystal panel.

The top view which shows the whole structure of the component mounting process using the feedback correction apparatus which concerns on Embodiment 1. FIG. The fragmentary perspective view of the temporary crimping | compression-bonding part which is the electronic device bonding apparatus which concerns on Embodiment 1. FIG. Bottom view of liquid crystal panel and electronic component immediately before provisional pressure bonding in Embodiment 1 Block diagram of the control system of the temporary crimping portion of the first embodiment Plan view of a liquid crystal panel to which the electronic component of the first embodiment is bonded The principal part perspective view of the shift | offset | difference test | inspection part of the component mounting process in Embodiment 1 Block diagram of a control system of a deviation inspection unit in the component mounting process of the first embodiment Explanatory drawing of the calculation method of the positional offset amount of the electronic component used in the shift | offset | difference inspection part which concerns on Embodiment 1. FIG. Explanatory drawing of calculation of displacement amount of conventional displacement inspection machine Reference diagram for explaining a correction method of the feedback correction apparatus according to the first embodiment Reference diagram showing an example of a data table stored in the storage unit of the feedback correction device Reference diagram of the table showing the feedback amount calculated using the inspection result in the deviation inspection unit F in the arithmetic unit The flowchart which shows the operation | movement procedure of the temporary crimping | compression-bonding part which received control of feedback correction from the feedback correction apparatus which concerns on this invention. Reference diagram for explaining a correction method of the feedback correction apparatus according to the second embodiment FIG. 6 is a reference diagram of a table showing the feedback amount calculated using the inspection result in the deviation inspection unit in the arithmetic unit of the feedback correction apparatus according to the second embodiment. Reference diagram of a table showing another example of the feedback amount calculated using the inspection result in the deviation inspection unit in the arithmetic unit of the feedback correction device according to the second embodiment. Explanatory drawing for demonstrating the feedback correction method which concerns on Embodiment 3. FIG. The flowchart which shows the operation | movement procedure of the deviation test | inspection part which concerns on Embodiment 3. FIG. Explanatory drawing of the feedback correction method in the conventional feedback correction device

Explanation of symbols

C Temporary pressure bonding part D First main pressure bonding part E Second main pressure bonding part F Misalignment inspection part 1 Liquid crystal panel 2 Transport part 21 Suction head 22 Nozzle shaft 23 ACF
27 Electrode 28 Electronic component 30 Outer lead 41, 71 CPU
42,72 ROM
43, 73 RAM
44, 74 Recognition unit 45, 75 XYθ table controller 46 Suction head controller 47 Temporary pressure bonding head controller 48, 78 Bus 49, 77 Communication unit 76 NG substrate transport unit controller 100, 1400 Feedback correction device 101 Calculation unit 102 Storage unit 103, 1401 Control unit

Claims (14)

In the component mounting process for mounting electronic components on a board, a feedback correction method is used to correct the mounting position of electronic components to be produced on the board using the amount of deviation of the mounting position of the actually mounted electronic component. There,
A storage step of storing a feedback amount made at the time of mounting the electronic component on the substrate;
Based on the amount of deviation between the actual mounting position of the electronic component on the board and the target mounting position, and the feedback amount stored in the storage step and already performed when the electronic component is mounted on the board, new production is performed. A calculation step for calculating a feedback amount to the substrate;
And a control step of controlling a mounting position of the electronic component on the substrate based on a calculation result in the calculation step. 2. The mounting position of an electronic component with respect to a board to be produced in the component mounting step is corrected using the feedback amount that is a calculation result in the calculating step in the control step. Feedback correction method. In the calculation step, based on the average value of the deviation amount of electronic component mounting positions on a plurality of substrates or the peak value of a normal distribution, and the feedback amount performed previously, the feedback amount of a newly produced substrate is calculated. The feedback correction method according to claim 1, wherein calculation is performed. In the storing step,
The feedback correction method according to claim 1, wherein the mounting parameter, which is the feedback amount, the mounting position, and the mounting board information indicating the number of boards are stored in association with each board. The component mounting method includes a first step of monitoring a conveyance state of the substrate by a feedback correction device that performs feedback correction in a mounting process of the electronic component on the substrate, and a second step of mounting the electronic component on the substrate. And
The first step includes
A storage step of storing a feedback amount made at the time of mounting the electronic component on the substrate;
Based on the amount of deviation between the actual mounting position of the electronic component on the board and the target mounting position, and the feedback amount stored in the storage step and already performed when the electronic component is mounted on the board, new production is performed. A calculation step for calculating a feedback amount to the substrate;
A control step of controlling a mounting position of the electronic component on a substrate based on a calculation result in the calculation step,
The second step includes
A temporary crimping step of temporarily crimping the electronic component to a side edge of the substrate based on the control from the control step;
A main pressure bonding step of pressure bonding the electronic component after the temporary pressure bonding onto a substrate;
Including a deviation inspection process for inspecting a deviation amount between the actual mounting position of the electronic component on the substrate and the target mounting position,
The component mounting method, wherein the calculation step acquires the deviation amount at the time of calculation in the calculation step. 6. The control step includes correcting a mounting position of an electronic component with respect to a board to be produced next in the component mounting step by using a feedback amount that is a calculation result in the calculation step. Component mounting method. The component mounting method according to claim 5, wherein in the control step, the mounting position of the electronic component in the temporary crimping process is corrected based on the feedback amount. Between each process of the component mounting process, a signal line for exchanging a communication signal related to feedback correction is provided,
In the temporary crimping step, each time the feedback amount based on the deviation amount obtained in the deviation inspection step is updated, ON / OFF of the contact signal is alternately changed,
6. The component mounting method according to claim 5, wherein in the misalignment inspection step, it is determined whether the feedback correction has been performed by switching the ON / OFF of the communication signal using the communication signal as a trigger. The component mounting method according to claim 5, wherein, in the deviation inspection step, when the deviation amount is inspected in parallel with the production of the board, the calculation step is notified again. In a component mounting process for mounting electronic components on a board, a feedback correction device that corrects the mounting position of the electronic component to be produced on the board using the amount of deviation of the mounting position of the actually mounted electronic component. There,
Storage means for storing a feedback amount made when the electronic component is mounted on the substrate;
Based on the amount of deviation between the actual mounting position of the electronic component on the board and the target mounting position, and the feedback amount stored in the storage unit and already made when the electronic component is mounted on the board, new production is performed. A feedback correction apparatus comprising: a calculation means for calculating a feedback amount to the substrate. In the component mounting process for mounting electronic components on a board, a feedback correction method for correcting the mounting position of electronic components to be produced on the board using the amount of deviation of the mounting position of the actually mounted electronic component is provided. A component mounting apparatus for mounting electronic components using:
Storage means for storing a feedback amount made when the electronic component is mounted on the substrate;
Based on the amount of deviation between the actual mounting position of the electronic component on the board and the target mounting position, and the feedback amount stored in the storage unit and already made when the electronic component is mounted on the board, new production is performed. A computing means for computing the amount of feedback to the substrate;
A component mounting apparatus comprising: a control unit that controls a mounting position of the electronic component on a substrate based on a calculation result in the calculation unit. The component according to claim 11, wherein the control unit corrects the mounting position of the electronic component with respect to the board to be produced in the component mounting step next, using a feedback amount that is a calculation result in the calculation unit. Mounting device. Between each process of the component mounting process, a signal line for exchanging a communication signal related to feedback correction is provided,
In the temporary crimping step, each time the feedback amount based on the deviation amount obtained in the deviation inspection step is updated, ON / OFF of the contact signal is alternately changed,
The component mounting apparatus according to claim 11, wherein in the misalignment inspection step, it is determined whether the feedback correction has been performed by switching the ON / OFF of the communication signal using the communication signal as a trigger. A component mounting system comprising a first step of monitoring the state of conveyance of the substrate by a feedback correction device that performs feedback correction in the mounting process of the electronic component on the substrate, and a second step of mounting the electronic component on the substrate. And
The first step includes
A storage step of storing a feedback amount made at the time of mounting the electronic component on the substrate;
Based on the amount of deviation between the actual mounting position of the electronic component on the board and the target mounting position, and the feedback amount stored in the storage step and already performed when the electronic component is mounted on the board, new production is performed. A calculation step for calculating a feedback amount to the substrate;
A control step of controlling a mounting position of the electronic component on a substrate based on a calculation result in the calculation step,
The second step includes
A temporary crimping step of temporarily crimping the electronic component to a side edge of the substrate based on the control from the control step;
A main pressure bonding step of pressure bonding the electronic component after the temporary pressure bonding onto a substrate;
Including a deviation inspection process for inspecting a deviation amount between the actual mounting position of the electronic component on the substrate and the target mounting position,
The component mounting system, wherein the calculation step acquires the deviation amount at the time of calculation in the calculation step.

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