JPH07201932A - Bonding equipment and bonding method for electronic parts - Google Patents

Abstract

PURPOSE:To provide means of bonding outer leads to electrodes by anticipating a positional deviation created when pressurebonding an outer lead of an electrical part produced by TAB method to a display panel (LCD). CONSTITUTION:This machine is equipped with an outer lead bonding portion C, a first bonding portion D and a second bonding portion E and performs the final bonding with the first bonding portion D and the second bonding portion E after positioning with the outer lead bonding portion C. In the bonding equipment for electronic parts, a positional deviation created when pressure bonding an electronic part to LCD is anticipated in advance and the positioning between the electronic part and LCD is performed thereby realizing accurate bonding.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a bonding apparatus and bonding method for an electronic component, which is used to bond outer leads of an electronic component made of a film carrier to electrodes of a display panel.

[0002]

2. Description of the Related Art A display panel of an electronic device such as a liquid crystal panel is assembled by bonding outer leads of an electronic component, which is a driver, to electrodes formed along an end portion of the display panel. The electronic components for this driver include TAB (Tape Automated Bond).
ing) method, an electronic component made by mounting a chip on a film carrier is widely used. Further, since the outer leads of the electronic component and the electrodes of the display panel have a narrow pitch and high alignment accuracy is required, an anisotropic conductive sheet (hereinafter referred to as “AC”) is provided between the outer leads and the electrodes.
The method of bonding with the interposition of "F") is widely used.

The ACF is made of an adhesive synthetic resin sheet. The ACF is adhered to the upper surface of the electrode or the lower surface of the outer lead in advance, and the outer lead is bonded to the electrode by a pressure bonding tool. Then, the outer lead and the electrode are observed in advance by a measuring device such as a camera to detect a relative positional deviation between the electronic component and the display panel, and the display panel is displayed by a positioning means such as an XYθ table on which the display panel is mounted. Is corrected in the X direction, the Y direction, and the θ direction (horizontal rotation direction) to correct the positional deviation, and then the outer leads are pressure-bonded to the electrodes by a pressure bonding tool for bonding.

FIG. 17 is a distribution diagram of relative displacement between the electronic component and the display panel in the conventional method for bonding electronic components. The horizontal axis represents the amount of positional deviation in the X direction, and the vertical axis represents the frequency. Further, in the figure, a indicates a distribution of the positional deviation between the outer lead and the electrode after the positional deviation in the X direction is corrected by the above-mentioned alignment means, and this distribution a is centered around 0 as shown in the figure. It is a normal distribution.
Further, b is a distribution of the positional deviation between the outer lead and the electrode after the above-mentioned pressure bonding, the distribution b is also a normal distribution, and the distribution b is displaced from the distribution a by the TX position. Ie ACF
When the outer lead is pressure-bonded to the electrode via the, the positional deviation TX occurs. Various causes such as misalignment of the parallelism between the lower surface of the crimping tool and the electrode surface of the display panel, the crimping load, the temperature, the physical characteristics of the ACF, and the like can be considered as the causes of the misalignment TX. O if the amount of positional deviation between the electronic component and the display panel after crimping is within the allowable value ± DX
K, but NG if the allowable value is ± DX or more. In the figure, the hatched portion is NG when the amount of positional deviation in the X direction is equal to or greater than the allowable value ± DX. Although the positional shift in the X direction has been described as an example in FIG. 17, the positional shift in the Y direction is also the same.

[0005]

As described above, in the conventional bonding method for electronic parts, relative displacement TX is likely to occur between the outer lead and the electrode when the outer lead is pressure-bonded to the electrode. In order to prevent this misalignment as much as possible, mechanical adjustments and the like are repeated every time an electronic component is bonded to the display panel. Therefore, there is a problem that it takes a lot of time and labor, the productivity is not improved, and the cost of the display panel is increased.

Incidentally, in FIG. 17, the distribution a before crimping is shown.
And the distribution b after pressure bonding are both normal distributions, and there is a certain correlation between them. Therefore, the present invention has been made with this point in mind, and it is possible to perform bonding by aligning the outer lead and the electrode while automatically correcting the positional deviation between the outer lead and the electrode by utilizing this correlation. An object of the present invention is to provide a component bonding apparatus and a component bonding method.

[0007]

To this end, the present invention provides an alignment means for aligning an electronic component made of a film carrier with a display panel, and an outer lead of the aligned electronic component for a display panel. Crimping means for crimping to the electrode, a storage unit for storing relative positional deviation between the outer lead and the electrode generated when performing the crimping as offset data, and the electronic component and the display panel are aligned based on the offset data. In order to do so, a bonding device for electronic components is constituted by the control means for controlling the alignment means.

[0008]

According to the above structure, the position of the electronic component and the display panel are aligned by preliminarily allowing for the positional deviation that occurs when the outer leads are pressure-bonded to the electrodes.
The positional deviation between the electronic component and the display panel can be suppressed within the allowable range.

[0009]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will now be described with reference to the drawings. FIG. 1 is a plan view showing an overall configuration of an electronic component bonding apparatus according to an embodiment of the present invention. This bonding apparatus for electronic components includes a supply section A of a liquid crystal panel (hereinafter referred to as "LCD") which is a display panel, an anisotropic conductive sheet attaching section B, an outer lead bonding section C, a first section.
The main pressure bonding unit D, the second main pressure bonding unit E, the recovery unit F for recovering the LCD to which the electronic components are bonded, the line controller G that manages the operation status of the entire device and communication of various data, and the line controller G and other units. It is composed of a communication cable H to be connected.

In the figure, 1 is an LCD, and 2 is a conveying section provided along each section. A large number of arms 3 are provided in the transport section 2 at a fixed pitch, and a pad 4 for vacuum-sucking the LCD 1 is attached to the tip of the arm 3. Each pad 4 is an LCD 1 on the mounting table W1, W2, W3.
By vacuum suction and reciprocating in the X direction, L
The CD1 is transferred to the XYθ table provided in each part, or the LCD1 on the XYθ table is moved to the next mounting table W2, W.
Carry out to 3. Next, each part will be described.

First, the outer lead bonding portion C will be described. 2 is a plan view of an outer lead bonding portion C of an electronic component bonding apparatus according to an embodiment of the present invention, and FIG. 3 is a partial perspective view of the same. In FIG. 2, 11
Is an XYθ table, the X table 13 is placed on the Y table 12, and the θ table 14 is placed on the X table 13.
On the θ table 14
Place 1. The θ table 14 sucks and fixes the LCD 1 by suction means (not shown). When the motor 15 of the Y table 12 is driven, the LCD 1 moves in the Y direction, when the motor 16 of the X table 13 is driven, the LCD 1 moves in the X direction, and when the actuator (not shown) of the θ table 14 is driven, the LCD 1 becomes θ. Rotate (horizontal rotation).
Positioning is performed by moving the LCD 1 in the XYθ directions in this manner. In addition, LC by the transport unit 2
The transport direction of D1 is the X direction.

An index head 20 is provided on the side of the XYθ table 11. Index head 2
Reference numeral 0 has four arms 21 extending radially outward, and a suction head 22 for vacuum-sucking electronic components is provided at the tip of the arm 21. The arms 21 are attached to the index head 20 at intervals of 90 °, and the index head 20 makes an index rotation every 90 °. A first film carrier supply 23 and a second film carrier supply 24 are installed on both sides of the index head 20. A first mold 25 is provided between the index head 20 and the first film carrier supply unit 23, and a second mold 26 is provided between the index head 20 and the second film carrier supply unit 24. It is provided.

The first film carrier supply section 23 has an L
First electronic component 6a bonded to the long side of CD1
The first material (hereinafter also simply referred to as electronic component 6a)
The film carrier 7a is provided. The first film carrier 7 a led out from the first film carrier supply unit 23 is punched into the first mold 25. The first electronic component 6a obtained by punching is vacuum-sucked by the suction head 22, and the index head 20 is driven to move 90 °.
By horizontally rotating in the direction of the solid line arrow, it is conveyed above the end of the long side of the LCD 1, and the LCD 1 is moved by means to be described later.
Is bonded to the end of.

The second film carrier 7b led out from the second film carrier supply section 24 is punched into the second die 26. The second electronic component 6b obtained by punching (hereinafter, also simply referred to as electronic component 6b) is vacuum-sucked by the suction head 22, and the index head 20 is driven in the direction of the broken line arrow so that the end portion of the short side of the LCD 1 It is transported upward and bonded to this end. L
When the second electronic component 6a is bonded to the end of the short side of the CD 1, the L table is driven by the θ table 14.
The CD 1 is horizontally rotated by 90 ° in advance and moved to a position where its short side faces the index head 20.

FIG. 3 shows a state in which the first electronic component 6a is mounted on the LCD 1. The LCD 1 is formed by bonding a lower plate 1a made of a glass plate and an upper plate 1b, and electrodes 9 are formed at a narrow pitch at the end of the lower plate 1a. An anisotropic conductive sheet (hereinafter referred to as AC
(Also referred to as F) 27 at the attachment portion B (see FIG. 1) of AC
F27 is attached in advance. The first electronic component 6a is
The first chip 8a is formed on the upper surface of the first film carrier 7a.
Is made by mounting the first film carrier 7a
Outer leads 28 are formed at the ends at a narrow pitch. Further, the suction head 22 vacuum-sucks the first film carrier 7a on its lower surface. 29 is the suction head 22
The nozzle shaft is connected to the nozzle shaft 29, and the first film carrier 7a is vacuum-sucked through the nozzle shaft 29.

In FIG. 2, a temporary pressure bonding head 30 is provided above the LCD 1. In FIG. 3, reference numeral 31 denotes a temporary crimping tool provided in the temporary crimping head 30. The temporary crimping tool 31 presses the outer lead 28 against the ACF 27 to perform temporary crimping. This temporary pressure bonding is performed prior to the main pressure bonding of the first electronic component 6a by the first main pressure bonding portion D and the main pressure bonding of the second electronic component 6b by the second main pressure bonding portion E, which will be described later. That is, the workability of the bonding is improved by performing the temporary pressure bonding and the main pressure bonding of the electronic components 6a and 6b at different places. The outer lead 28 is heated by a heater (not shown) on the temporary pressing tool 31 so that the outer lead 28 can be lightly temporarily pressed onto the ACF 27. The ACF 27 is previously attached on the electrode 9 at the anisotropic conductive sheet attaching portion B (see FIG. 1).

In FIG. 3, a first camera 32 and a second camera 33 are installed below the temporary pressure bonding tool 31. Circle-shaped marks 34 and 35 are formed in the vicinity of the electrodes 9 on the lower plate 1a. FIG. 4 is a bottom view of the LCD and electronic components immediately before the provisional press-bonding in one embodiment of the present invention, showing an observation state by the first camera 32 and the second camera 33. In the figure, 36 and 37 are spot-like marks formed on both sides of the film carrier 7a. The first camera 32 has a mark 34 on the left side in the drawing,
36, and the second camera 33 shows the mark 3 on the right side.
Observe 5,37. The marks 34, 35 on the side of the lower plate 1a have a circle shape.

FIG. 5 is a block diagram of a control system of the outer lead bonding portion C of the electronic component bonding apparatus according to the embodiment of the present invention. Reference numeral 41 denotes a CPU, which controls the outer lead bonding section C as a whole, electronic parts 6a,
6b and the LCD 1 position shift Sx in the X direction, position shift Sy in the Y direction, and the like are calculated. Reference numeral 42 denotes a ROM, which stores programs for operating the apparatus. 43 is RA
M, which stores offset data TX, TY, and the like. Note that Sx, Sy, TX, and TY will be described later. Reference numeral 44 denotes a recognition unit, which is the first camera 32 described above.
Is connected to the second camera 33 and the center coordinates Ga, Gb, Fa, Fb (described later) of the marks 34, 35, 36, 37 are obtained based on the obtained image data. Four
An XYθ table controller 5 controls the XYθ table 11. A suction head controller 46 controls the suction head 22. Reference numeral 47 denotes a temporary pressure bonding head controller, which controls the temporary pressure bonding head 30. Each of the above-mentioned means is connected to the bus 48, and further connected to the communication cable H via a communication section 49 that controls communication with the outside.

Next, the first main crimp portion D and the second main crimp portion E
Will be described. FIG. 6 is a first main crimping section D and a second main crimping section E of a bonding apparatus for electronic components according to an embodiment of the present invention.
FIG. 7 is a perspective view of the vicinity of the main pressure bonding tool provided in the first main pressure bonding section D. In FIG. 6, the first final press-bonding section D permanently press-bonds the first electronic component 6a to the end of the long side of the LCD 1. Further, the second final press-bonding portion E horizontally rotates the LCD 1 by 90 °, and finally press-bonds the second electronic component 6b to the end portion of the short side thereof.

First, the structure of the first final pressure bonding portion D will be described. In FIG. 6, 51A is an XYθ table, which includes a Y table 52A, an X table 53A, and a θ table 54A. When the motor 55A of the Y table 52A is driven, the LCD 1 moves in the Y direction, and when the motor 56A of the X table 53A is driven, the LCD 1 moves in the X direction, θ
When the actuator (not shown) of the table 54A is driven, the LCD 1 rotates by θ. The XYθ table 51B having the same structure is also provided in the second final pressure bonding section E.

The first main pressure bonding section D has a first main pressure bonding head section 6
1 is provided. The first main pressure bonding head portion 61 includes a first main body portion 62 having a drive system incorporated therein, and a first main pressure bonding tool 63 held by the first main body portion 62. According to the number of the first electronic components 6a to be crimped to the long side of the LCD 1, a plurality of the first final crimping tools 63 (3 in the present embodiment).
It is provided). In FIG. 7, an arm 64 extends from the first main body portion 62, and a first final crimping tool 63 is held at the tip of the arm 64. A heater 65 is built in the first final crimping tool 63 to heat the first final crimping tool 63. Reference numeral 66 denotes a lower receiving member provided below the first main crimping tool 63, and is vertically moved by being driven by an elevating means (not shown). The lower receiving member 66 supports the end portion of the lower plate 1a of the LCD 1 from below by performing a raising operation. In that state, the first main crimping tool 63 descends,
The outer leads 28 of the first film carrier 7a are pressed against the electrodes 9 of the lower plate 1a for main compression bonding.

Between the first main pressure bonding section D and the second main pressure bonding section E, there is provided a mounting table W3 on which the LCD 1 whose main pressure bonding has been completed is temporarily mounted. Cage, transport section 2
Of the XYθ table 51A and is transferred to the mounting table W3. LC mounted on the mounting table W3
D1 is adsorbed by the next adsorption pad 4 and transferred onto the XYθ table 51B of the second final press-bonding section E.

In FIG. 6, the second final crimping section E is provided with a second final crimping head 71. The second main crimping head 71 includes a second main body 72 having a second main crimping tool 73. Two second full pressure bonding tools 73 are provided. The structure and operation of the second main crimping portion E are as follows.
In the same manner as described above, the first final press-bonding section D performs final press-fitting of the first electronic component 6a on the long side of the LCD 1, while the second final press-fitting section E performs second press-fitting of the second electronic component 6b on the short side of the LCD1. Are different in that they are fully crimped.

LCD whose main pressure bonding is completed at the second main pressure bonding section E
1 is transported from the XYθ table 51B to the recovery unit F by the transport unit 2.

This electronic component bonding apparatus is constructed as described above. Next, the overall operation will be described. First, the normal bonding mode that does not consider the positional deviation during pressure bonding will be described. In FIG. 1, the LCD 1 provided in the supply section A is sent to the anisotropic conductive sheet sticking section B, and the ACF 27 is stuck on the electrode 9 of the LCD 1. Next, the LCD 1 is sent to the outer lead bonding section C. In FIG. 2, the LCD 1 on the mounting table W1 is vacuum-sucked by the pad 4 and transferred onto the XYθ table 11. In the present embodiment, first, the outer lead 28 of the first electronic component 6a is temporarily attached to the electrode 9 on the long side of the LCD 1, and the temporary attaching step will be described below.

The first film carrier 7a derived from the first film carrier supply section 23 is a first mold 25.
Then, the first electronic component 6a is obtained. This first
The electronic component 6a of the LCD is vacuum-sucked by the suction head 22 and picked up, and the index head 20 horizontally rotates in the direction of the solid arrow of 90 ° in FIG.
1 is transferred above the electrode 9. Then, the electronic component 6a is provisionally aligned on the LCD 1 so that the marks 34 and 35 of the LCD 1 and the marks 36 and 37 of the electronic component 6a overlap (see FIG. 3).

FIG. 3 shows the state at this time. In this state, the marks 34, 35, 36, 37 are observed by the first camera 32 and the second camera 33 to detect the relative positional deviation between the electronic component 6a and the LCD 1 in the XY directions. Then, after correcting the positional deviation, the outer lead 28 is temporarily pressure-bonded to the electrode 9. FIG. 4 shows the LCD 1 just before the temporary pressure bonding.
FIG. 8A is a bottom view of the electronic component 6a, and FIG.
Referring to (b), before the temporary pressure bonding, that is, the suction head 22.
The first electronic component 6a and the XYθ table 11 held by
A method for detecting the displacement of the LCD 1 will be described.

FIGS. 8A and 8B show L of an embodiment of the present invention.
It is an image figure of a mark of CD and an outer lead. Figure 8
In (a), each mark 3 is taken by the first camera 32.
4, 36, and the mark 35,
37 are observed, and the respective center coordinates Ga (XGa.
YGa), Gb (XGb.YGb), Fa (XFa.Y
Fa) and Fb (XFb.YFb) recognition unit 44 (FIG. 5)
Ask by. The detection of the center coordinates of such an image can be easily performed by a known image processing technique, and therefore the description thereof will be omitted.

Next, the obtained center coordinates Ga, Gb,
Based on Fa and Fb, the center coordinate Ga of the mark 34
(XGa.YGa) and the center coordinate Fa of the mark 36
(XFa.YFa) misalignment dx3 (X direction), d
y3 (Y direction) and the center coordinate Gb (X of the mark 35
Gb. YGb) and the center coordinate Fb of the mark 37 (XF
b. YFb) position shift dx4 (X direction), dy4
(Y direction) is calculated from the following equation.

Dx1 = XFa-XGa (1) dy1 = YFa-YGa (2) dx2 = XFb-XGb (3) dy2 = YFb-YGb (4) Next, based on the above results, the LCD 1 and the first electron Part 6
The positional deviation Sx in the X direction and the relative positional deviation Sy in the Y direction of a are obtained from the following equations.

Sx = (dx1 + dx2) / 2 (5) Sy = (dy1 + dy2) / 2 (6) Formula (5) is the positional deviation d detected by the first camera 32.
The average value of x1 and the positional deviation dx2 detected by the second camera 33 is used as the positional deviation in the X direction between the LCD 1 and the first electronic component 6a, and the equation (6) is similar to the positional deviation dy1. The average value of the positional deviation dy2 is the positional deviation between the LCD 1 and the first electronic component 6a in the Y direction. When the positional deviations Sx and Sy are obtained in this manner, the X table 13 and the Y table 12 in FIG.
By moving D1 by −Sx, −Sy, the positional deviations Sx, Sy are corrected.

FIG. 8B shows the marks 34 and 3 after the above correction.
The positional relationship between 5, 36 and 37 is shown. Mx in the figure
a and mya are center coordinates Ga and F of the marks 34 and 36.
a is the distance between X and Y directions, mxb and myb are marks 3
Distances of the center coordinates Gb and Fb of 5, 37 in the X direction and the Y direction, and mxa = mxb and mya = myb. The distance L1 between the center coordinates of the marks 34 and 35
Is larger than the distance L2 between the center coordinates of the marks 36 and 37. The reason is that when the outer lead 28 is thermocompression-bonded to the electrode 9 in a later step, the film carrier 7
Since a and 7b are elongated and the distance L2 is increased, this elongation is expected. Incidentally, if it is not necessary to expect this extension, L1 = L2 in FIG. 8B.

When the positional deviations Sx and Sy between the LCD 1 and the first electronic component 6a are corrected as described above, the suction head 22 is lowered in FIG.
Is landed on the ACF 27, and then the temporary pressure bonding tool 31 is lowered to press the outer lead 28 against the ACF 27 for temporary pressure bonding.

As described above, the first electronic component 6a is set to L
After being temporarily attached to the electrode 9 on the long side of the CD 1, the second electronic component 6b is subsequently attached to the electrode 9 on the short side. Second
The method of temporarily attaching the electronic component 6b is the same as the above-described temporary attaching process of the first electronic component 6a, and will be briefly described below. In FIG. 2, if all the first electronic components 6a (three in this embodiment) are temporarily attached on the electrode 9 on one long side of the LCD 1, the θ table 14 is driven to turn the LCD 1 9 on.
Rotate 0 ° horizontally, and index head 20 on the short side.
Face to side. The second film carrier supply unit 2
The second film carrier 7b is led out from 4 to the second mold 26, and the second film carrier 7b is punched out to obtain the second electronic component 6b. Therefore, the suction head 22 is
This electronic component 6b is picked up and driven by the index head 20 to rotate in the direction of the broken arrow to transfer the second electronic component 6b onto the electrode 9 on the short side of the LCD 1, and referring to FIG. First electronic component 6a described
Similar to the case of, the positional deviations Sx and Sy between the LCD 1 and the second electronic component 6a are obtained. Next, this positional deviation Sx, Sy
Then, the outer lead 28 is temporarily pressure-bonded to the ACF 27 by the temporary pressure-bonding tool 31. That is, in the normal bonding mode, the LCD 1 and the electronic components 6a and 6b are
The two are aligned so that the positional deviation between and becomes zero, and then temporary pressure bonding is performed.

FIG. 12 shows an outer lead bonding portion C showing a temporary bonding process in the above-mentioned normal bonding mode.
It is a flowchart of. If the first electronic component 6a and the second electronic component 6b are all temporarily attached to the LCD 1 as described above, the XYθ table 11 is driven in FIG. 2 to move the LCD 1 to below the central pad 4 in FIG. Transfer. Then, the pad 4 picks up the LCD 1 on the XYθ table 11 by vacuum suction and transfers it to the next mounting table W2 as shown by an arrow N1. Then, the next pad 4 picks up the LCD 1 by vacuum suction.

In FIG. 6, the XYθ table 51A provided in the first final press-bonding section D is driven to move below the LCD 1 vacuum-adsorbed by the pad 4, and the pad 4 is released from the vacuum-adsorbed state. Thus, the LCD 1 is transferred onto the XYθ table 51A. Next, the XYθ table 51A is L
First electronic component 6a temporarily attached to the long side of CD1
The main pressure bonding tool 63 is moved to the lower side to perform the main pressure bonding. FIG. 7 shows a state in which the main press bonding tool 63 is performing the main press bonding. In the figure, the first final crimping tool 63 has been preheated by a heater 65, and
Thus, the lower plate 1a is supported from below and is strongly pressed against the outer leads 28 to be permanently pressure-bonded onto the electrodes 9.

The LCD 1 on which the first electronic component 6a is fully pressure-bonded in the first final pressure-bonding section D as described above is temporarily
After being transferred onto the mounting table W3, it is subsequently transferred by the transport unit 2 onto the XYθ table 51B provided in the second final pressure bonding unit E. LCD transferred on XYθ table 51B
1 is because the θ table 54B rotates 90 °,
The second electronic component 6b on the short side of the second main crimping tool 73
Located below. Therefore, as in the case of the main pressure bonding with the first main pressure bonding tool 63 described with reference to FIG. 7,
The outer lead 28 is permanently pressure-bonded to the electrode 9 by the second final pressure bonding tool 73.

FIG. 9 is an LCD in which the first electronic component 6a and the second electronic component 6b of one embodiment of the present invention are bonded.
FIG. 10 is a perspective view of a main part of the positional deviation measuring device according to the embodiment of the present invention. As shown in FIG. 9, the first electronic component 6a is bonded to the bonding positions # 1 to # 3, # 6 to # 8, and the second electronic component 6b is bonded to the bonding positions # 4 and # 5.

The electronic components 6a and 6b are misaligned at the time of temporary attachment and final pressure bonding, and are therefore bonded at positions deviated from the regular positions. Therefore, the electronic parts 6a, 6
A plurality of LCDs 1 to which b is bonded are taken out, and the above-mentioned positional deviation amounts Tx and Ty of the positional deviation are measured by a positional deviation measuring device as shown in FIG. In FIG.
Reference numeral 81 denotes an observation unit, which includes two cameras 82 and 83. The cameras 82 and 83 are the marks 3 on the LCD 1.
4, 35 and the marks 36, 37 of the electronic components 6a, 6b are observed, and the positional deviation between the marks and the positional deviation amounts Tx, Ty are measured by a measuring unit (not shown) to which the cameras 82, 83 are connected. To calculate.

In FIG. 11, the left side shows the image of the camera 82, and the right side shows the image of the camera 83.

Now, in FIG. 11, the positional deviation dx3 (X direction), dy3 (Y direction) between the center coordinate Ga (XGa.YGa) of the mark 34 and the center coordinate Fa (XFa.YFa) of the mark 36 and the mark 35. Center coordinates Gb (XGb.YGb) and center coordinates F of mark 37
b (XFb.YFb) position deviation dx4 (X direction),
dy4 (Y direction) is calculated by the following equation.

Dx3 = XFa-XGa (7) dy3 = YFa-YGa (8) dx4 = XFb-XGb (9) dy4 = YFb-YGb (10) Therefore, the electronic component 6a (6b) and the LCD 1 after the main pressure bonding.
The positional deviation amount Tx in the X direction and the positional deviation amount Ty in the Y direction are expressed by the following expressions.

Tx = (dx3 + dx4) / 2 (11) Ty = (dy3 + dy4) / 2 (12) (Table 1)
The inspection data of the amount of positional deviation measured for each # 8 is shown.

[0044]

[Table 1]

In Table 1, TX and TY are the positional deviation amounts Tx measured for each of the bonding positions # 1 to # 8.
This is the average value of Ty, and is calculated from the data for 50 LCDs in this embodiment. As described with reference to FIG. 17, the positional deviation amounts Tx and Ty have a constant tendency, and the average values TX and TY are used as offset data for positional deviation correction. Therefore, the average values TX and TY are stored in the RAM 43 of the outer lead bonding portion C as offset data. This offset data is shown in (Table 2).

[0046]

[Table 2]

Incidentally, "*" is used in (Table 1) and (Table 2), but this indicates a numeral.

Next, the offset data feedback mode will be described with reference to FIGS. 13 to 16. Figure 1
3 (a) and (b) are image diagrams of the LCD and electronic component marks of one embodiment of the present invention, FIG. 14 is a diagram of the LCD and electronic component marks after the main pressure bonding, and FIG. 15 is one embodiment of the present invention. FIG. 7 is an explanatory diagram of a positional deviation correction method of FIG. FIG. 13 (a) is shown in FIG. 8 (a).
An image similar to that of the outer lead 28 shown in FIG.
First camera 33 and second camera 3 before the temporary attachment of
4 shows an image of No. 4. The first film carrier 7a derived from the first film carrier supply unit 23 is the first
The die 25 is punched out to obtain the first electronic component 6a. The first electronic component 6a is vacuum-sucked by the suction head 22 and picked up, and is transferred to above the electrode 9 of the LCD 1 by horizontally rotating the index head 20 in the direction of the solid arrow of 90 ° in FIG. And L
Marks 34 and 35 of CD1 and mark 3 of electronic component 6a
The electronic component 6a is aligned on the LCD 1 so that the electronic components 6 and 37 are overlapped with each other (see FIG. 3).

In this state, the positional deviation Sx in the X direction is calculated from the above equations (1) to (6) in the same manner as in normal bonding.
And the positional deviation Sy in the Y direction is obtained. Next, the offset data TX and TY stored in the RAM 43 are added as correction values to these Sx and Sy to obtain final correction values Ux and Uy (above, also refer to FIG. 15).

Next, the XYθ table 11 is driven to drive the LCD.
The position is corrected by moving 1 by −Ux in the X direction and −Uy in the Y direction. That is, in the offset data feedback mode, the LCD 1 and the electronic components 6a and 6b are displaced from each other to perform the alignment in consideration of the average values TX and TY of the positional deviations that occur during the temporary attachment and the final pressure bonding. FIG. 13B shows this position-corrected LCD 1 and electronic component 6.
It is an image of the marks 34, 35, 36, 37 of a (6b). When the position is corrected in this way, the outer lead 28 is AC-bonded by the temporary crimping tool 31 as described above.
Press it to F27 and temporarily attach it to LCD1. Then LC
D1 is conveyed to the first main crimping section D and the second main crimping section E by the conveying section 2, and the first main crimping tool 63 and the second main crimping tool 73 perform main crimping. FIG. 14 is a view of the marks on the LCD and electronic components after the main pressure bonding. The amount of positional deviation Tx after the main pressure bonding,
Ty is given by the equations (11) and (12), and the relative displacement between the LCD 1 and the electronic components 6a and 6b during the process of temporary attachment and final pressure bonding causes the displacement amounts Tx and Ty to be within the allowable values ±. It becomes D or less. After that, the LCD 1 is conveyed to the collecting section F by the conveying section 2 and collected.

FIG. 16 is a flowchart of the outer lead bonding section C in the offset data feedback mode described above.

The present invention is not limited to the above embodiment, and various design changes and operating methods are conceivable. For example, in (Table 1), the number of LCDs 1 for obtaining the offset data TX and TY is 50. However, this number can be any number. Further, the mark for detecting the positional deviation is not limited to the marks 34, 35, 36, 37 as long as it can be an observation target. Further, in the present embodiment, the position correction in the X and Y directions at the time of alignment is performed by the XYθ table 11, but the suction head 22
A mechanism that moves the side to correct the position may be used. Further, in the present embodiment, the positional shift S using two cameras is used.
Although x and Sy are obtained, the observation may be performed with one camera. As described above, the present invention can be modified in various ways.

[0053]

As described above, according to the present invention, the positional deviation generated when the outer leads of the electronic component are permanently pressure-bonded to the electrodes of the display panel is obtained as the offset data, and the offset data is estimated in advance to be used as the electronic component. Since the outer leads are pressure-bonded to the electrodes while aligning the display panel, the positional deviation of the outer leads from the electrodes can be suppressed within an allowable range, and the electronic components can be bonded to the LCD with high yield. it can.

[Brief description of drawings]

FIG. 1 is a plan view showing the overall configuration of a bonding apparatus for electronic components according to an embodiment of the present invention.

FIG. 2 is a plan view of an outer lead bonding portion of the electronic component bonding apparatus according to the embodiment of the present invention.

FIG. 3 is a partial perspective view of an outer lead bonding portion of a bonding apparatus for electronic components according to an embodiment of the present invention.

FIG. 4 is an LCD immediately before temporary pressure bonding according to an embodiment of the present invention.
And bottom view of electronic components

FIG. 5 is a block diagram of a control system of an outer lead bonding section of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 6 is a plan view of a first main crimping portion and a second main crimping portion of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 7 is a perspective view of the vicinity of the main pressure bonding tool provided in the first main pressure bonding unit of the electronic component bonding apparatus according to the embodiment of the present invention.

FIG. 8A is an image view of an LCD and an electronic component mark according to an embodiment of the present invention. FIG. 8B is an image view of an LCD and an electronic component mark according to an embodiment of the present invention.

FIG. 9 is a plan view of an LCD in which a first electronic component and a second electronic component according to an embodiment of the present invention are permanently pressure-bonded.

FIG. 10 is a perspective view of a main part of the positional deviation measuring device according to the embodiment of the present invention.

FIG. 11 is an LCD after final compression bonding according to an embodiment of the present invention.
And electronic component mark illustration

FIG. 12 is a flowchart showing a temporary attaching process in the normal bonding mode of the electronic component bonding apparatus according to the embodiment of the present invention.

FIG. 13A is an image view of an LCD and an electronic component mark according to an embodiment of the present invention. FIG. 13B is an image view of an LCD and an electronic component mark according to an embodiment of the present invention.

FIG. 14 is an LCD after final pressure bonding according to an embodiment of the present invention.
And electronic component mark illustration

FIG. 15 is an explanatory diagram of a method for correcting a positional deviation of a bonding apparatus for electronic components according to an embodiment of the present invention.

FIG. 16 is a flowchart of an offset data feedback mode of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 17 is a distribution diagram of relative displacement between the electronic component and the display panel in the conventional method for bonding electronic components.

[Explanation of symbols]

 C Outer lead bonding portion D First main pressure bonding portion E Second main pressure bonding portion 1 Display panel (LCD) 6a First electronic component 6b Second electronic component 7a First film carrier 7b Second film carrier 9 Electrode 11 , 51A, 51B XYθ table 22 Adsorption head 27 Anisotropic conductive sheet (ACF) 28 Outer lead 30 Temporary crimping head 31 Temporary crimping tool 32 First camera 33 Second camera 34, 35, 36, 37 Mark 41 CPU 43 RAM 44 Recognition unit 45 XYθ Table controller 63 First main crimping tool 73 Second main crimping tool

Claims (5)

[Claims] 1. An alignment means for aligning an electronic component made of a film carrier with a display panel, and a crimping means for crimping an outer lead of the aligned electronic component to an electrode of the display panel. In order to align the electronic component and the display panel with a storage unit that stores, as offset data, data relating to a relative positional deviation between the outer lead and the electrode that occurs when performing this pressure bonding, An electronic component bonding apparatus, comprising: a control unit that controls the alignment unit. 2. The electronic component bonding apparatus according to claim 1, wherein the offset data is offset data stored for each bonding position for bonding an electronic component to the display panel. 3. The crimping means includes a tacking crimping tool for temporarily tacking the outer lead to the electrode, and a main crimping tool for final crimping after the tacking. Bonding equipment for electronic parts. 4. The XYθ table for positioning the display panel, the suction head for holding the electronic component by vacuum suction, and the electronic component and the XYθ table held by the suction head. The electronic component bonding apparatus according to claim 1, further comprising: a camera for observing a relative displacement of the positioned display panel. 5. A first step of temporarily aligning an electronic component made of a film carrier and a display panel, and observing the temporarily aligned electronic component and the display panel with a camera so that the two are relative to each other. Based on the positional deviation detected in the second step and the offset data relating to the positional deviation that occurs when the outer leads of the electronic component are pressure-bonded to the electrodes of the display panel. hand,
A third step of calculating a final position correction value of the electronic component relative to the display panel, and a distance corresponding to the offset data between the electronic component and the display panel based on the final position correction value. A fourth step of aligning at a shifted position, and a fifth step of crimping the outer lead of the electronic component aligned in the fourth step to an electrode of the display panel, Bonding method for electronic components.