JP2929926B2 - Electronic component bonding apparatus and bonding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus and a bonding method for bonding outer leads of an electronic component made of a film carrier to electrodes of a display panel.

[0002]

2. Description of the Related Art A display panel of an electronic device such as a liquid crystal panel is assembled by bonding outer leads of an electronic component as a driver to electrodes formed along an end of the display panel. Electronic components for the driver include TAB (Tape Automated Bond).
Electronic components manufactured by mounting chips on a film carrier by the ing) method are often used. In addition, since the outer leads of the electronic component and the electrodes of the display panel have a narrow pitch and high alignment accuracy is required, an anisotropic conductive sheet (hereinafter referred to as “AC”) is provided between the outer leads and the electrodes.
F ") for bonding.

The ACF is made of an adhesive synthetic resin sheet. The ACF is previously adhered to the upper surface of the electrode or the lower surface of the outer lead, and prior to bonding the outer lead to the electrode by a crimping tool. Then, the outer leads and the electrodes are observed in advance by a measuring device such as a camera to detect a relative displacement between the electronic component and the display panel. For example, the display panel is positioned by an alignment means such as an XYθ table on which the display panel is mounted. Is moved in the X direction, the Y direction, and the θ direction (horizontal rotation direction) to correct the positional deviation, and then the outer lead is crimped to the electrode by a crimping tool for bonding.

FIG. 17 is a distribution diagram of relative displacement between an electronic component and a display panel in a conventional method of bonding electronic components. The horizontal axis represents the amount of displacement in the X direction, and the vertical axis represents the frequency. Further, in the drawing, a shows the distribution of the positional deviation between the outer lead and the electrode after the positional deviation in the X direction has been corrected by the above-described positioning means, and this distribution a is centered on 0 as shown in the figure. Is a normal distribution.
Also, b is the distribution of the displacement between the outer lead and the electrode after the above-mentioned crimping, and this distribution b is also a normal distribution, and the distribution b is deviated from the distribution a by the TX position. That is, ACF
When the outer lead is crimped to the electrode via the through hole, a displacement TX occurs. Various factors such as the mismatch of the parallelism between the lower surface of the crimping tool and the electrode surface of the display panel, the crimping load, the temperature, and the physical characteristics of the ACF can be considered as causes of the displacement TX. If the displacement between the electronic component and the display panel after crimping is within the allowable value ± DX, O
Although it is K, it is NG if it is equal to or more than the allowable value ± DX. In the figure, the hatched portions indicate NG where the positional deviation amount in the X direction is equal to or more than the allowable value ± DX. In FIG. 17, the displacement in the X direction has been described as an example, but the displacement in the Y direction is the same.

[0005]

As described above, in the conventional method for bonding electronic components, when the outer lead is pressed against the electrode, a relative displacement TX is likely to occur between the outer lead and the electrode. In order to minimize this displacement, mechanical adjustments and the like are repeatedly performed each time an electronic component is bonded to a display panel. For this reason, there is a problem that a great deal of time and labor is required, productivity is not improved, and the cost of the display panel is increased.

In FIG. 17, the distribution a
And the distribution b after compression are both normal distributions, and there is a certain correlation between them. Therefore, the present invention has been made focusing on this point, and an electronic device that can perform bonding by performing alignment between the outer lead and the electrode while automatically correcting the positional deviation between the outer lead and the electrode using this correlation. An object of the present invention is to provide a component bonding apparatus and a bonding method.

[0007]

SUMMARY OF THE INVENTION To this end, the present invention provides a positioning means for positioning an electronic component made of a film carrier and a display panel, and an outer lead for the aligned electronic component on a display panel. Crimping means for crimping to the electrode, a storage unit for storing relative displacement between the outer lead and the electrode caused when performing the crimping as offset data, and positioning of the electronic component and the display panel based on the offset data. Control means for controlling the positioning means so as to form an electronic component bonding apparatus , and as the crimping means, the outer lead
A crimping tool for temporarily attaching the electrode to the electrode;
And a final crimping tool for performing final crimping .

[0008]

According to the above arrangement, the electronic component and the display panel are aligned in anticipation of a positional shift occurring when the outer lead is crimped to the electrode.
The displacement between the electronic component and the display panel can be suppressed within an allowable range.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the overall configuration of an electronic component bonding apparatus according to one embodiment of the present invention. This electronic component bonding apparatus includes a supply section A, an anisotropic conductive sheet bonding section B, an outer lead bonding section C, a first section of a liquid crystal panel (hereinafter, referred to as “LCD”) as a display panel.
The main crimping section D, the second main crimping section E, a collecting section F for collecting the LCD to which the electronic components are bonded, a line controller G for managing the operation status of the entire apparatus and communication of various data, and the like. It is composed of a communication cable H to be connected.

In FIG. 1, reference numeral 1 denotes an LCD, and reference numeral 2 denotes a transport section provided along each section. A large number of arms 3 are provided at a constant pitch in the transport unit 2, and a pad 4 for vacuum-sucking the LCD 1 is attached to the tip of the arm 3. Each pad 4 is an LCD 1 on a mounting table W1, W2, W3.
By vacuum suction and reciprocating in the X direction,
The CD1 is transferred to an XYθ table provided in each section, or the LCD 1 on the XYθ table is
Take out to 3. Next, each part will be described.

First, the outer lead bonding portion C will be described. FIG. 2 is a plan view of an outer lead bonding portion C of the electronic component bonding apparatus according to one embodiment of the present invention, and FIG. 3 is a partial perspective view of the same. In FIG. 2, 11
Is an XYθ table, on which the X table 13 is placed on the Y table 12 and the θ table 14 is placed on the X table 13.
And the LCD is placed on the θ table 14.
1 is placed. table 14 sucks and fixes LCD 1 by a suction means (not shown). When the motor 15 of the Y table 12 is driven, the LCD 1 moves in the Y direction. When the motor 16 of the X table 13 is driven, the LCD 1 moves in the X direction. When the actuator (not shown) of the θ table 14 is driven, the LCD 1 moves Rotate (horizontal rotation).
By moving the LCD 1 in the XYθ directions in this manner, the positioning is performed. LC by the transport unit 2
The transport direction of D1 is the X direction.

An index head 20 is provided beside the XYθ table 11. Index head 2
Numeral 0 is provided with four arms 21 extending radially outward, and at the tip of the arm 21 is provided a suction head 22 for vacuum-sucking electronic components. The arms 21 are attached to the index head 20 at intervals of 90 °, and the index head 20 rotates the index every 90 °. A first film carrier supply unit 23 and a second film carrier supply unit 24 are provided on both sides of the index head 20. A first mold 25 is provided between the index head 20 and the first film carrier supply unit 23, and a second mold 26 is provided between the index head 20 and the second film carrier supply unit 24. Is provided.

The first film carrier supply unit 23 has L
First electronic component 6a bonded to the long side of CD1
(Hereinafter, also simply referred to as electronic component 6a)
The film carrier 7a is provided. The first film carrier 7 a led out from the first film carrier supply section 23 is punched into a first mold 25. The first electronic component 6a obtained by punching is vacuum-sucked by the suction head 22, and the index head 20 is driven to 90 °
By horizontally rotating in the direction of the solid line arrow, the LCD 1 is transported above the long side end, and the LCD 1 is rotated by means described later.
Is bonded to the end.

The second film carrier 7b led out from the second film carrier supply section 24 is punched into a second mold 26. The second electronic component 6b (hereinafter, also simply referred to as “electronic component 6b”) obtained by punching is sucked in vacuum by the suction head 22, and the index head 20 is driven in the direction of the dashed arrow. It is conveyed upward and bonded to this end. Note that L
When bonding the second electronic component 6a to the end of the short side of the CD1, the θ table 14 is driven to
The CD 1 is previously rotated horizontally by 90 °, and the short side thereof is moved to a position facing the index head 20.

FIG. 3 shows a state in which the first electronic component 6a is mounted on the LCD 1. The LCD 1 is formed by laminating a lower plate 1a and an upper plate 1b made of a glass plate, and electrodes 9 are formed at an end of the lower plate 1a at a narrow pitch. An anisotropic conductive sheet (hereinafter referred to as AC
F) (see FIG. 1).
F27 is attached in advance. The first electronic component 6a is
A first chip 8a is provided on the upper surface of the first film carrier 7a.
And the first film carrier 7a
Outer leads 28 are formed at the ends at a narrow pitch. Further, the suction head 22 has a first film carrier 7a vacuum-sucked on the lower surface thereof. 29 is the suction head 22
The first film carrier 7a is vacuum-sucked through the nozzle shaft 29 through the nozzle shaft 29.

In FIG. 2, a temporary pressure bonding head 30 is provided above the LCD 1. In FIG. 3, reference numeral 31 denotes a temporary crimping tool provided in the temporary crimping head 30. The temporary crimping tool 31 presses the outer lead 28 against the ACF 27 to perform temporary crimping. This temporary crimping is performed prior to the final crimping of the first electronic component 6a by the first final crimping section D and the final crimping of the second electronic component 6b by the second final crimping section E, which will be described later. That is, by performing the temporary crimping and the final crimping of the electronic components 6a and 6b in different places, the workability of the bonding is improved. The temporary crimping tool 31 is heated by a heater (not shown) so that the outer lead 28 can be lightly temporarily crimped to the ACF 27. The ACF 27 is previously adhered on the electrode 9 in the anisotropic conductive sheet attaching portion B (see FIG. 1).

In FIG. 3, a first camera 32 and a second camera 33 are provided below the temporary crimping tool 31. Circle marks 34 and 35 are formed near the electrode 9 of the lower plate 1a. FIG. 4 is a bottom view of the LCD and the electronic component immediately before the temporary crimping in one embodiment of the present invention, and shows an observation state by the first camera 32 and the second camera 33. In the drawing, 36 and 37 are spot-shaped marks formed on both sides of the film carrier 7a. The first camera 32 has a mark 34,
Observe 36, and the second camera 33
Observe 5,37. The marks 34 and 35 on the lower plate 1a side are in a circle shape.

FIG. 5 is a block diagram of a control system of the outer lead bonding section C of the electronic component bonding apparatus according to one embodiment of the present invention. Reference numeral 41 denotes a CPU which controls the entire outer lead bonding section C and controls the electronic components 6a,
The calculation of the X-direction displacement Sx and the Y-direction displacement Sy of the LCD 6 and the LCD 1 is performed. A ROM 42 stores a program for operating the apparatus. 43 is RA
M, and stores offset data TX, TY, and the like. Note that Sx, Sy, TX, and TY will be described later. Reference numeral 44 denotes a recognition unit, and the first camera 32
And the second camera 33, and obtains center coordinates Ga, Gb, Fa, Fb (described later) of the marks 34, 35, 36, 37 based on the obtained image data. 4
An XYθ table controller 5 controls the XYθ table 11. A suction head controller 46 controls the suction head 22. Reference numeral 47 denotes a temporary pressure bonding head controller, which controls the temporary pressure bonding head 30. The above-described units are connected to a bus 48, and further connected to the communication cable H via a communication unit 49 that controls communication with the outside.

Next, a first final crimping section D and a second final crimping section E
Will be described. FIG. 6 shows a first crimping portion D and a second crimping portion E of the electronic component bonding apparatus according to one embodiment of the present invention.
FIG. 7 is a perspective view of the vicinity of the final crimping tool provided in the first final crimping section D. In FIG. 6, a first final press-bonding unit D press-bonds the first electronic component 6 a to the end of the long side of the LCD 1. In addition, the second final crimping section E horizontally rotates the LCD 1 by 90 °, and performs final crimping of the second electronic component 6b to the end of the short side.

First, the structure of the first final crimping section D will be described. In FIG. 6, reference numeral 51A denotes an XYθ table, which comprises a Y table 52A, an X table 53A, and a θ table 54A. When the motor 55A of the Y table 52A is driven, the LCD 1 moves in the Y direction. When the motor 56A of the X table 53A is driven, the LCD 1 moves in the X direction.
When an actuator (not shown) of the table 54A is driven, the LCD 1 rotates by θ. The XYθ table 51B having the same structure is also provided in the second final crimping section E.

The first final crimping section D has a first final crimping head section 6.
1 is provided. The first final crimping head 61 includes a first main body 62 having a drive system built therein, and a first final crimping tool 63 held by the first main body 62. The first actual pressure bonding tool 63 has a plurality (3 in the present embodiment) according to the number of the first electronic components 6a to be pressure-bonded to the long side of the LCD 1.
) Are provided. In FIG. 7, an arm 64 extends from the first main body 62, and a first final crimping tool 63 is held at the tip of the arm 64. The first final crimping tool 63 has a built-in heater 65 for heating the first final crimping tool 63. Reference numeral 66 denotes a lower receiving member provided below the first final pressure bonding tool 63, which is driven by an elevating means (not shown) to move up and down. The lower receiving member 66 supports the end of the lower plate 1a of the LCD 1 from below by performing a lifting operation. In this state, the first final crimping tool 63 descends,
The outer leads 28 of the first film carrier 7a are pressed against the electrodes 9 of the lower plate 1a to perform full pressure bonding.

A mounting table W3 on which the LCD 1 which has been completely bonded by the first final bonding section D is temporarily placed is disposed between the first final bonding section D and the second final bonding section E. And transport section 2
Is transferred to the mounting table W3 from the XYθ table 51A. LC mounted on mounting table W3
D1 is sucked by the next suction pad 4, and is transferred onto the XYθ table 51B of the second final pressure bonding section E.

In FIG. 6, the second final pressure bonding section E is provided with a second final pressure bonding head 71. The second pressure bonding head 71 includes a second main body 72 having a second pressure bonding tool 73. Two second final pressure bonding tools 73 are provided. The structure and operation of the second final crimping section E are as follows.
In the same manner as in the first embodiment, the first final crimping section D permanently press-bonds the first electronic component 6a to the long side of the LCD 1, while the second final crimping section E presses the second electronic component 6b to the short side of the LCD1. Is completely bonded.

LCD for which the final press bonding is completed in the second final press bonding section E
1 is conveyed from the XYθ table 51B to the collection unit F by the conveyance unit 2.

This electronic component bonding apparatus is configured as described above. Next, the overall operation will be described. First, a description will be given of a normal bonding mode that does not consider the displacement during crimping. In FIG. 1, the LCD 1 provided in the supply unit A is sent to the anisotropic conductive sheet sticking unit B, and the ACF 27 is stuck on the electrode 9 of the LCD 1. Next, the LCD 1 is sent to the outer lead bonding section C. In FIG. 2, the LCD 1 on the mounting table W1 is vacuum-sucked on the pad 4 and transferred onto the XYθ table 11. In the present embodiment, first, the outer leads 28 of the first electronic component 6a are temporarily attached to the long-side electrodes 9 of the LCD 1. This temporary attaching step will be described below.

The first film carrier 7a led out of the first film carrier supply section 23 is used for the first mold 25.
And the first electronic component 6a is obtained. This first
The electronic component 6a is vacuum-adsorbed and picked up by the suction head 22, and the index head 20 is horizontally rotated in the direction of the solid line arrow 90 ° in FIG.
It is transferred above one electrode 9. Then, the electronic component 6a is provisionally positioned on the LCD 1 so that the marks 34, 35 of the LCD 1 and the marks 36, 37 of the electronic component 6a overlap (see FIG. 3).

FIG. 3 shows the state at this time. In this state, the first camera 32 and the second camera 33 observe the marks 34, 35, 36, and 37, and detect the relative displacement between the electronic component 6a and the LCD 1 in the X and Y directions. After correcting the positional deviation, the outer lead 28 is temporarily bonded to the electrode 9. FIG. 4 shows the LCD 1 immediately before the temporary compression bonding.
And FIG. 8A is a bottom view of the electronic component 6a.
Referring to (b), before the temporary compression bonding, that is, the suction head 22
Electronic component 6a and XYθ table 11 held in
A method of detecting a displacement of the upper LCD 1 will be described.

FIGS. 8A and 8B show L of one embodiment of the present invention.
It is an image figure of a mark of CD and an outer lead. FIG.
In (a), each mark 3 is
4, 36, and marks 35,
37, and the center coordinates Ga (XGa.
YGa), Gb (XGb.YGb), Fa (XFa.Y
Fa) and Fb (XFb.YFb) are recognized by the recognition unit 44 (FIG. 5).
Ask by The detection of the center coordinates of such an image can be easily performed by a well-known image processing technique, and therefore, the description thereof is omitted.

The center coordinates Ga, Gb,
Based on Fa and Fb, the center coordinate Ga of the mark 34 is calculated.
(XGa.YGa) and the center coordinate Fa of the mark 36
(XFa.YFa) misalignment dx3 (X direction), d
y3 (Y direction) and the center coordinate Gb (X
Gb. YGb) and the center coordinates Fb (XF
b. YFb), dx4 (X direction), dy4
(Y direction) is obtained from the following equation.

Dx1 = XFa−XGa (1) dy1 = YFa−YGa (2) dx2 = XFb−XGb (3) dy2 = YFb−YGb (4) Next, based on the above results, the LCD1 and the first electron Part 6
The position shift Sx in the X direction and the relative position shift Sy in the Y direction are obtained by the following equation.

Sx = (dx1 + dx2) ÷ 2 (5) Sy = (dy1 + dy2) ÷ 2 (6) The equation (5) represents the displacement d detected by the first camera 32.
x1 and the average value of the displacements dx2 detected by the second camera 33 are defined as the displacements of the LCD 1 and the first electronic component 6a in the X direction. The average value of the displacement dy2 is used as the displacement in the Y direction between the LCD 1 and the first electronic component 6a. After the positional shifts Sx and Sy are obtained in this manner, the X table 13 and the Y table 12 are driven in FIG.
The position shifts Sx and Sy are corrected by moving D1 by -Sx and -Sy.

FIG. 8B shows the marks 34 and 3 after the correction.
5, 36, and 37 are shown. In the figure, mx
a and mya are the center coordinates Ga and F of the marks 34 and 36, respectively.
a is the distance between the X direction and the Y direction, and mxb and myb are marks 3
The distances in the X and Y directions of the center coordinates Gb and Fb of 5, 37, where mxa = mxb and mya = myb. The distance L1 between the center coordinates of the marks 34 and 35
Is larger than the distance L2 between the center coordinates of the marks 36 and 37. The reason is that when the outer lead 28 is thermocompression-bonded to the electrode 9 in a later step, the film carrier 7
Since a and 7b are extended and the distance L2 is increased, this extension is expected. Incidentally, if it is not necessary to anticipate this growth, L1 = L2 in FIG. 8B.

After the positional deviations Sx and Sy between the LCD 1 and the first electronic component 6a have been corrected as described above, the suction head 22 is lowered in FIG.
Is landed on the ACF 27, and then the temporary crimping tool 31 is lowered to press the outer lead 28 against the ACF 27 for temporary crimping.

As described above, the first electronic component 6a is
After the temporary attachment on the long side electrode 9 of the CD 1, the second electronic component 6b is temporarily attached on the short side electrode 9 subsequently. Second
The method of temporarily attaching the electronic component 6b is the same as the above-described process of temporarily attaching the first electronic component 6a, and will be briefly described below. In FIG. 2, if all of the first electronic components 6a (three in this embodiment) are temporarily attached on the electrode 9 on one long side of the LCD 1, the θ table 14 is driven to move the LCD 1 to 9
0 ° horizontal rotation, the short side of the index head 20
To the side. Second film carrier supply unit 2
4, the second film carrier 7 b is led out to the second mold 26, and the second film carrier 7 b is punched to obtain the second electronic component 6 b. Therefore, the suction head 22
The second electronic component 6b is transferred onto the short-side electrode 9 of the LCD 1 by picking up the electronic component 6b, and rotating the index head 20 in the direction of the dashed arrow, with reference to FIG. First electronic component 6a described
As in the case of (1), the positional deviations Sx and Sy between the LCD 1 and the second electronic component 6a are obtained. Next, the displacements Sx, Sy
Is corrected, and the outer lead 28 is temporarily bonded to the ACF 27 by the temporary bonding tool 31. That is, in the normal bonding mode, the LCD 1 and the electronic components 6a, 6b
After the two are aligned so that the positional deviation from the above becomes zero, temporary crimping is performed.

FIG. 12 shows an outer lead bonding portion C showing a temporary bonding step in the normal bonding mode described above.
It is a flowchart of FIG. When the first electronic component 6a and the second electronic component 6b are all temporarily attached to the LCD 1 as described above, the XYθ table 11 is driven in FIG. 2 to move the LCD 1 below the central pad 4 in FIG. Transfer. Then, the pad 4 picks up the LCD 1 on the XYθ table 11 by vacuum suction and transfers it to the next mounting table W2 as shown by the arrow N1. Then, the next pad 4 picks up the LCD 1 by vacuum suction.

Referring to FIG. 6, the XYθ table 51A provided in the first final pressure bonding section D is driven to move below the LCD 1 vacuum-adsorbed to the pad 4, and the pad 4 is released from the vacuum suction state. To transfer the LCD 1 onto the XYθ table 51A. Next, the XYθ table 51A is L
The first electronic component 6a temporarily attached to the long side of CD1 is
The main crimping tool 63 is moved below to perform the main crimping. FIG. 7 shows a state in which the final press bonding is performed by the first final press tool 63. In the figure, the first final pressure bonding tool 63 is pre-heated by a heater 65,
, The lower plate 1a is supported from below, and pressed firmly against the outer leads 28 to perform full pressure bonding on the electrode 9.

As described above, the LCD 1 on which the first electronic component 6a has been completely compression-bonded in the first final compression bonding section D is once
After being transferred onto the mounting table W3, the sheet is successively sent by the transport unit 2 onto the XYθ table 51B provided in the second final pressure bonding unit E. LCD transferred on XYθ table 51B
1 is that the θ table 54B is rotated by 90 °,
The second electronic component 6b on the short side is attached to the second final crimping tool 73.
Located below. Therefore, similarly to the case of the final crimping by the first final crimping tool 63 described with reference to FIG.
The outer lead 28 is completely press-bonded to the electrode 9 by the second final press tool 73.

FIG. 9 shows an LCD in which a first electronic component 6a and a second electronic component 6b are bonded according to an embodiment of the present invention.
FIG. 10 is a perspective view of a main part of a displacement measuring apparatus according to an embodiment of the present invention. As shown in FIG. 9, a first electronic component 6a is bonded to bonding positions # 1 to # 3 and # 6 to # 8, and a second electronic component 6b is bonded to bonding positions # 4 and # 5.

These electronic components 6a and 6b are displaced during the temporary attachment and the final pressure bonding, and are therefore bonded at positions deviated from their regular positions. Then, the electronic parts 6a, 6
A plurality of the LCDs 1 to which b is bonded are taken out, and the displacements Tx and Ty of the displacement described above are measured by a displacement measuring device as shown in FIG. In FIG.
An observation unit 81 includes two cameras 82 and 83. The cameras 82 and 83 are provided with the mark 3 on the LCD 1.
4 and 35 and the marks 36 and 37 of the electronic components 6a and 6b are observed. A measuring unit (not shown) to which the cameras 82 and 83 are connected shifts the marks and shifts the positions Tx and Ty. Is calculated.

In FIG. 11, the left side shows the image of the camera 82, and the right side shows the image of the camera 83.

In FIG. 11, the positional deviations dx3 (X direction) and dy3 (Y direction) between the center coordinates Ga (XGa.YGa) of the mark 34 and the center coordinates Fa (XFa.YFa) of the mark 36 and the mark 35 Center coordinates Gb (XGb.YGb) and center coordinates F of mark 37
b (XFb.YFb), a displacement dx4 (X direction),
dy4 (Y direction) is obtained from the following equation.

Dx3 = XFa−XGa (7) dy3 = YFa−YGa (8) dx4 = XFb−XGb (9) dy4 = YFb−YGb (10) Therefore, the electronic component 6a (6b) and the LCD 1 after the final compression bonding
The displacement amount Tx in the X direction and the displacement amount Ty in the Y direction are expressed by the following equations.

Tx = (dx3 + dx4) ÷ 2 (11) Ty = (dy3 + dy4) ÷ 2 (12) (Table 1) shows that each of the bonding positions # 1 to # 1
The inspection data of the displacement amount measured for each # 8 is shown.

[0044]

[Table 1]

In Table 1, TX and TY represent positional deviation amounts Tx and Tx measured for each of bonding positions # 1 to # 8.
This is an average value of Ty, which is obtained from data of 50 LCDs in this embodiment. As described with reference to FIG. 17, the displacement amounts Tx and Ty have a certain tendency, and the average values TX and TY are used as offset data for displacement correction. Therefore, the average values TX and TY are stored as offset data in the RAM 43 of the outer lead bonding section C. (Table 2) shows the offset data.

[0046]

[Table 2]

In Tables 1 and 2, "*" is used, which indicates a numeral.

Next, the offset data feedback mode will be described with reference to FIGS. FIG.
3 (a) and 3 (b) are image diagrams of LCD and electronic component marks according to one embodiment of the present invention, FIG. 14 is a diagram of LCD and electronic component marks after final compression bonding, and FIG. 15 is an embodiment of the present invention. FIG. 4 is an explanatory diagram of a method of correcting a positional shift. FIG. 13A shows the state shown in FIG.
The image is similar to that of the outer lead 28 shown in FIG.
Camera 33 and second camera 3 before performing temporary attachment of
4 shows the image of FIG. The first film carrier 7a derived from the first film carrier supply unit 23 is the first film carrier 7a.
And the first electronic component 6a is obtained. The first electronic component 6a is vacuum-sucked by the suction head 22 and picked up, and is transferred above the electrode 9 of the LCD 1 by rotating the index head 20 horizontally in the direction of the solid line arrow at 90 ° in FIG. And L
Marks 34 and 35 of CD1 and mark 3 of electronic component 6a
The electronic component 6a is positioned on the LCD 1 so that the electronic components 6 and 37 overlap (see FIG. 3).

In this state, the displacement Sx in the X direction can be obtained from the above equations (1) to (6) in the same manner as during normal bonding.
And the displacement Sy in the Y direction are obtained. Next, the offset data TX and TY stored in the RAM 43 are added to these Sx and Sy as correction values to obtain final correction values Ux and Uy (see also FIG. 15).

Next, the XYθ table 11 is driven to drive the LCD
1 is moved by -Ux in the X direction and -Uy in the Y direction to perform position correction. That is, in the offset data feedback mode, the LCD 1 and each of the electronic components 6a and 6b are displaced and position adjustment is performed in advance by estimating the average values TX and TY of the position deviations generated during the temporary attachment and the final pressure bonding. FIG. 13B shows the position-corrected LCD 1 and electronic component 6.
It is an image of mark 34,35,36,37 of a (6b). After the position is corrected in this manner, the outer leads 28 are connected to the outer leads 28 by the temporary crimping tool 31 as described above.
Press F27 to temporarily attach to LCD1. Then LC
D1 is transported by the transport unit 2 to the first final crimping unit D and the second final crimping unit E, and the first final crimping tool 63 and the second final crimping tool 73 perform final crimping. FIG. 14 is a view of the LCD and the mark of the electronic component after the final pressure bonding. The displacement amount Tx after the final pressure bonding is
Ty is as shown in the formulas (11) and (12), and the relative displacement between the LCD 1 and the electronic components 6a and 6b is shifted during the process of performing the temporary attachment and the final pressure bonding, so that the displacement amounts Tx and Ty are within the allowable range ±. D or less. Thereafter, the LCD 1 is conveyed to the collection unit F by the conveyance unit 2 and collected.

FIG. 16 is a flowchart of the outer lead bonding section C in the offset data feedback mode described above.

The present invention is not limited to the above embodiment, and various design changes and operating methods are conceivable. For example, in Table 1, the number of LCDs 1 for obtaining offset data TX and TY is 50. However, this number may be any number. In addition, the mark for detecting the positional shift is not limited to the marks 34, 35, 36, and 37 as long as it can be a target for observation. Further, in the present embodiment, the position correction in the X and Y directions at the time of position alignment is performed by the XYθ table 11, but the suction head 22
A mechanism that performs position correction by moving the side may be used. In the present embodiment, the displacement S
Although x and Sy have been determined, it may be configured to observe with one camera. As described above, the present invention allows various design changes.

[0053]

As described above, the present invention obtains, as offset data, the positional shift that occurs when the outer leads of the electronic component are permanently bonded to the electrodes of the display panel, and this offset data is estimated in advance to determine the position of the electronic component. The outer leads are crimped to the electrodes while aligning the display panel, so that the displacement of the outer leads with respect to the electrodes can be kept within an allowable range, and the bonding of electronic components to the LCD can be performed with good yield. it can.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an outer lead bonding portion of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 3 is a partial perspective view of an outer lead bonding portion of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 4 is an LCD immediately before temporary compression bonding according to an embodiment of the present invention.
And bottom view of electronic components

FIG. 5 is a block diagram of a control system of an outer lead bonding section of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 6 is a plan view of the first and second crimping sections of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 7 is a perspective view of the vicinity of a final crimping tool provided in a first final crimping unit of the electronic component bonding apparatus according to one embodiment of the present invention.

8A is an image diagram of an LCD and an electronic component mark according to an embodiment of the present invention; FIG. 8B is an image diagram of an LCD and an electronic component mark according to an embodiment of the present invention;

FIG. 9 is a plan view of an LCD in which a first electronic component and a second electronic component according to one embodiment of the present invention are permanently bonded.

FIG. 10 is a perspective view of a main part of a displacement measuring apparatus according to an embodiment of the present invention.

FIG. 11 is an LCD after final compression bonding according to an embodiment of the present invention.
And electronic parts mark illustration

FIG. 12 is a flowchart showing a temporary attaching step in a normal bonding mode of the electronic component bonding apparatus according to one embodiment of the present invention;

13A is an image diagram of an LCD and an electronic component mark according to an embodiment of the present invention. FIG. 13B is an image diagram of an LCD and an electronic component mark according to an embodiment of the present invention.

FIG. 14 is an LCD after final compression bonding according to an embodiment of the present invention.
And electronic parts mark illustration

FIG. 15 is a diagram illustrating a method for correcting a displacement of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 16 is a flowchart of an offset data feedback mode of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 17 is a distribution diagram of relative displacement between an electronic component and a display panel in a conventional electronic component bonding method.

[Explanation of symbols]

 C Outer lead bonding section D First final crimping section E Second final crimping section 1 Display panel (LCD) 6a First electronic component 6b Second electronic component 7a First film carrier 7b Second film carrier 9 Electrode 11 , 51A, 51B XYθ table 22 Suction head 27 Anisotropic conductive sheet (ACF) 28 Outer lead 30 Temporary pressure bonding head 31 Temporary pressure bonding tool 32 First camera 33 Second camera 34, 35, 36, 37 Mark 41 CPU 43 RAM 44 Recognition unit 45 XYθ table controller 63 First crimping tool 73 Second crimping tool

Claims (2)

(57) [Claims] A positioning means for positioning an electronic component made of a film carrier with a display panel; a crimping means for crimping an outer lead of the aligned electronic component to an electrode of the display panel; A storage unit that stores, as offset data, data relating to a relative displacement between the outer lead and the electrode that occurs when performing the crimping, and to align the electronic component and the display panel based on the offset data. Control means for controlling the positioning means , the crimping means and
And temporarily attaching the outer lead to the electrode.
Crimping tool and final crimping tool for final crimping after tacking
Electronic component bonding apparatus characterized by comprising:
Place. 2. A first step of temporarily aligning an electronic component made of a film carrier and a display panel, and observing the electronic component and the display panel, which have been temporarily aligned, with a camera and comparing the two with each other. 2nd to detect dynamic displacement
And, based on the offset data relating to the displacement generated when the outer leads of the electronic component are pressed against the electrodes of the display panel, and the displacement detected in the second step.
A third step of calculating a final position correction value of the electronic component relative to the display panel; and, based on the final position correction value, moving the electronic component and the display panel by a distance corresponding to the offset data. A fourth step of positioning the electronic component at the shifted position; and a fifth step of crimping the outer leads of the electronic component positioned in the fourth step to electrodes of the display panel. Electronic component bonding method.