JP3243973B2 - Electronic component bonding apparatus and bonding method - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component bonding apparatus and a bonding method for bonding outer leads of an electronic component made of a film carrier to electrodes of a display panel.

[0002]

2. Description of the Related Art A display panel of an electronic device such as a liquid crystal panel is assembled by bonding outer leads of an electronic component as a driver to electrodes formed along an end of the display panel. Electronic components for the driver include TAB (Tape Automated Bond).
Electronic components manufactured by mounting chips on a film carrier by the ing) method are often used. In addition, since the outer leads of the electronic component and the electrodes of the display panel have a narrow pitch and high alignment accuracy is required, an anisotropic conductive sheet (hereinafter referred to as “AC”) is provided between the outer leads and the electrodes.
F ") for bonding.

The ACF is made of an adhesive synthetic resin sheet. The ACF is previously adhered to the upper surface of the electrode or the lower surface of the outer lead, and prior to bonding the outer lead to the electrode by a crimping tool. Then, the outer lead and the electrode are observed in advance by a measuring device such as a camera, and the relative displacement between the outer lead and the electrode is detected. For example, the display panel is positioned by a positioning means such as an XYθ table on which the display panel is mounted. After correcting the above positional deviation by moving in the X direction, the Y direction, and the θ direction (horizontal rotation direction), the outer lead is crimped to the electrode by a crimping tool for bonding.

FIG. 17 is a distribution diagram of a relative displacement between an outer lead and an electrode in a conventional method of bonding electronic components. The horizontal axis represents the amount of displacement in the X direction, and the vertical axis represents the frequency. Further, in the drawing, a shows the distribution of the positional deviation between the outer lead and the electrode after the positional deviation in the X direction has been corrected by the above-described positioning means, and this distribution a is centered on 0 as shown in the figure. Is a normal distribution.
Also, b is the distribution of the displacement between the outer lead and the electrode after the above-mentioned crimping, and this distribution b is also a normal distribution, and the distribution b is deviated from the distribution a by the TX position. That is, ACF
When the outer lead is crimped to the electrode via the through hole, a displacement TX occurs. Various factors such as the mismatch of the parallelism between the lower surface of the crimping tool and the electrode surface of the display panel, the crimping load, the temperature, and the physical characteristics of the ACF can be considered as causes of the displacement TX. Displacement T after crimping
If X is within the allowable value ± DX, it is OK, but the allowable value ±
If it is DX or more, it is NG. In the figure, the hatched portions indicate NG where the positional deviation amount TX in the X direction is equal to or more than the allowable value ± DX. In FIG. 17, the displacement in the X direction has been described as an example, but the displacement in the Y direction is the same.

[0005]

As described above, in the conventional method for bonding electronic components, when the outer lead is pressed against the electrode, a relative displacement TX is likely to occur between the outer lead and the electrode. The mechanical adjustment and the like are repeatedly performed each time the electronic component is bonded to the display panel so that the displacement TX is within the allowable value ± DX. For this reason, there is a problem that a great deal of time and labor is required, productivity is not improved, and the cost of the display panel is increased.

In FIG. 17, the distribution a
And the distribution b after compression are both normal distributions, and there is a certain correlation between them. Therefore, the present invention has been made focusing on this point, and an electronic device that can perform bonding by performing alignment between the outer lead and the electrode while automatically correcting the positional deviation between the outer lead and the electrode using this correlation. An object of the present invention is to provide a component bonding apparatus and a bonding method.

[0007]

SUMMARY OF THE INVENTION To this end, the present invention provides a positioning means for positioning an electronic component made of a film carrier and a display panel, and an outer lead for the aligned electronic component on a display panel. Temporarily attach to the electrode
Crimping tool for temporary tacking and final crimping for final crimping after tacking
A pressing means having a tool, and observation means for observing the relative positional deviation of the electronic component and the display panel after the bonding, position
Positioning means (1) No position between display panel and electronic components
Offset to align them so that they are zero
A data acquisition mode, to align by shifting the relative position of the electronic component and the display panel based on (2) the offset data obtained from the positional deviation observed by the observation means
Two modes, offset data feedback mode
And a control means for controlling the electronic component bonding apparatus.

[0008]

According to the above construction, the displacement caused when the outer lead is crimped to the electrode is observed by the observation means, and the position of the electronic component and the display panel is adjusted based on the displacement. In addition, the displacement of the outer lead can be suppressed within an allowable range.

[0009]

Next, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a plan view showing the overall configuration of an electronic component bonding apparatus according to one embodiment of the present invention. This electronic component bonding apparatus includes a supply section A, an anisotropic conductive sheet bonding section B, an outer lead bonding section C, a first section of a liquid crystal panel (hereinafter, referred to as “LCD”) as a display panel.
The defective product collection section G, which collects LCDs determined to be NG in the inspections by the final crimping section D, the second final crimping section E, the position shift inspection section F, and the position shift inspection section F, and collects the LCDs determined to be OK. It includes a non-defective product collection section H, a line controller I for managing the operation status of the entire apparatus, communication of various data, and the like, and a communication cable J for connecting the line controller I to each section.

In FIG. 1, reference numeral 1 denotes an LCD, and reference numeral 2 denotes a transport section provided along each section. A large number of arms 3 are provided at a constant pitch in the transport unit 2, and a pad 4 for vacuum-absorbing the LCD 1 on the mounting tables W 1, W 2, W 3. Each pad 4 vacuum-absorbs the LCD 1 on the mounting table W1, W2, W3.
By reciprocating in the X direction, the LCD 1 is transferred to an XYθ table provided in each section, or the LCD 1 on the XYθ table is carried out to the next mounting table W1, W2, W3. Next, each part will be described.

First, the outer lead bonding portion C will be described. FIG. 2 is a plan view of an outer lead bonding portion C of the electronic component bonding apparatus according to one embodiment of the present invention, and FIG. 3 is a partial perspective view of the same. In FIG. 2, 11
Is an XYθ table, on which the X table 13 is placed on the Y table 12 and the θ table 14 is placed on the X table 13.
And the LCD is placed on the θ table 14.
1 is placed. table 14 sucks and fixes LCD 1 by a suction means (not shown). When the motor 15 of the Y table 12 is driven, the LCD 1 moves in the Y direction. When the motor 16 of the X table 13 is driven, the LCD 1 moves in the X direction. When the actuator (not shown) of the θ table 14 is driven, the LCD 1 moves Rotate (horizontal rotation).
By moving the LCD 1 in the XYθ directions in this manner, the positioning is performed. LC by the transport unit 2
The transport direction of D1 is the X direction.

An index head 20 is provided beside the XYθ table 11. Index head 2
Numeral 0 is provided with four arms 21 extending radially outward, and at the tip of the arm 21 is provided a suction head 22 for vacuum-sucking electronic components. The arms 21 are attached to the index head 20 at intervals of 90 °, and the index head 20 rotates the index every 90 °. A first film carrier supply unit 23 and a second film carrier supply unit 24 are provided on both sides of the index head 20. A first mold 25 is provided between the index head 20 and the first film carrier supply unit 23, and a second mold 26 is provided between the index head 20 and the second film carrier supply unit 24. Is provided.

The first film carrier supply unit 23 has L
First electronic component 6a bonded to the long side of CD1
(Hereinafter, also simply referred to as electronic component 6a)
The film carrier 7a is provided. The first film carrier 7 a led out from the first film carrier supply section 23 is punched into a first mold 25. The first electronic component 6a obtained by punching is vacuum-sucked by the suction head 22, and the index head 20 is driven to 90 °
By horizontally rotating in the direction of the solid line arrow, the LCD 1 is transported above the long side end, and the LCD 1 is rotated by means described later.
Is bonded to the end.

The second film carrier 7b led out from the second film carrier supply section 24 is punched into a second mold 26. The second electronic component 6b (hereinafter, also simply referred to as “electronic component 6b”) obtained by punching is sucked in vacuum by the suction head 22, and the index head 20 is driven in the direction of the dashed arrow. It is conveyed upward and bonded to this end. Note that L
When bonding the second electronic component 6b to the end of the short side of the CD1, the θ table 14 is driven to
The CD 1 is previously rotated horizontally by 90 °, and the short side thereof is moved to a position facing the index head 20.

FIG. 3 shows a state in which the first electronic component 6a is mounted on the LCD 1. The LCD 1 is formed by laminating a lower plate 1a and an upper plate 1b made of a glass plate, and electrodes 9 are formed at an end of the lower plate 1a at a narrow pitch. An anisotropic conductive sheet (hereinafter referred to as AC
F) (see FIG. 1).
F27 is attached in advance. The first electronic component 6a is
A first chip 8a is provided on the upper surface of the first film carrier 7a.
And the first film carrier 7a
Outer leads 28 are formed at the ends at a narrow pitch. Further, the suction head 22 has a first film carrier 7a vacuum-sucked on the lower surface thereof. 29 is the suction head 22
The first film carrier 7a is vacuum-sucked through the nozzle shaft 29 through the nozzle shaft 29.

In FIG. 2, a temporary pressure bonding head 30 is provided above the LCD 1. In FIG. 3, reference numeral 31 denotes a temporary crimping tool provided in the temporary crimping head 30. The temporary crimping tool 31 presses the outer lead 28 against the ACF 27 to perform temporary crimping. This temporary crimping is performed prior to the final crimping of the first electronic component 6a by the first final crimping section D and the final crimping of the second electronic component 6b by the second final crimping section E, which will be described later. That is, by performing the temporary crimping and the final crimping of the electronic components 6a and 6b in different places, the workability of the bonding is improved. The temporary crimping tool 31 is heated by a heater (not shown) so that the outer lead 28 can be lightly temporarily crimped to the ACF 27. The ACF 27 is previously adhered on the electrode 9 in the anisotropic conductive sheet attaching portion B (see FIG. 1).

In FIG. 3, a first camera 32 and a second camera 33 are provided below the temporary crimping tool 31. Circle marks 34 and 35 are formed near the electrode 9 of the lower plate 1a. FIG. 4 is a bottom view of the lower plate of the LCD according to the embodiment of the present invention, showing the first camera 3.
2 and 2 show an observation state by the second camera 33. In the figure, reference numerals 36 and 37 denote spot-like marks formed on both sides of the first film carrier 7a. The first camera 32 observes the marks 34 and 36 on the left side in the figure, and the second camera 33 observes the marks 35 and 37 on the right side. The marks 34 and 35 on the lower plate 1a side are in a circle shape.

FIG. 5 is a block diagram of a control system of the outer lead bonding section C of the electronic component bonding apparatus according to one embodiment of the present invention. Reference numeral 41 denotes a CPU that controls the entire outer lead bonding section C, and calculates the displacement Sx in the X direction and the displacement Sy in the Y direction between the outer leads 28 and the electrodes 9. A ROM 42 stores a program for operating the apparatus. 43 is RAM
And the offset data T calculated by the CPU 41
X, TY, etc. are stored. Sx, Sy, TX, TY
Will be described later. A recognition unit 44 is connected to the above-described first camera 32 and second camera 33, and has marks 34 and 3 based on the obtained image data.
Center coordinates Ga, Gb, Fa, Fb of 5, 36, 37
(Described later). An XYθ table controller 45 controls the XYθ table 11. A suction head controller 46 controls the suction head 22. Reference numeral 47 denotes a temporary pressure bonding head controller, which controls the temporary pressure bonding head 30. Each of the above-described units is connected to a bus 48, and further includes a communication unit 49 for controlling communication with the outside.
Through the communication cable J.

Next, a first final crimping section D and a second final crimping section E
Will be described. FIG. 6 shows a first crimping portion D and a second crimping portion E of the electronic component bonding apparatus according to one embodiment of the present invention.
FIG. 7 is a perspective view of the vicinity of the final crimping tool provided in the first final crimping section D. In FIG. 6, a first final press-bonding unit D press-bonds the first electronic component 6 a to the end of the long side of the LCD 1. In addition, the second final crimping section E horizontally rotates the LCD 1 by 90 °, and performs final crimping of the second electronic component 6b to the end of the short side.

First, the structure of the first final crimping section D will be described. In FIG. 6, reference numeral 51A denotes an XYθ table, which comprises a Y table 52A, an X table 53A, and a θ table 54A. When the motor 55A of the Y table 52A is driven, the LCD 1 moves in the Y direction. When the motor 56A of the X table 53A is driven, the LCD 1 moves in the X direction.
When an actuator (not shown) of the table 54A is driven, the LCD 1 rotates by θ. A Y table 52B constituting an XYθ table 51B having the same structure as the second final crimping section E,
X table 53B, θ table 54B, each motor 5
5B, 56B and the like are provided.

The first final crimping section D has a first final crimping head section 6.
1 is provided. The first final crimping head 61 includes a first main body 62 having a drive system built therein, and a first final crimping tool 63 held by the first main body 62. The first actual pressure bonding tool 63 has a plurality (3 in the present embodiment) according to the number of the first electronic components 6a to be pressure-bonded to the long side of the LCD 1.
) Are provided. In FIG. 7, an arm 64 extends from the first main body 62, and a first final crimping tool 63 is held at the tip of the arm 64. The first final crimping tool 63 has a built-in heater 65 for heating the first final crimping tool 63. Reference numeral 66 denotes a lower receiving member provided below the first final pressure bonding tool 63, which is driven by an elevating means (not shown) to move up and down. The lower receiving member 66 supports the end of the lower plate 1a of the LCD 1 from below by performing a lifting operation. In this state, the first final crimping tool 63 descends,
The outer leads 28 of the first film carrier 7a are pressed against the electrodes 9 of the lower plate 1a to perform full pressure bonding.

In FIG. 6, the second final pressure bonding section E is provided with a second final pressure bonding head 71. The second final press head 71 is a second main body 7 having a second final press tool 73.
2 is provided. Two second final pressure bonding tools 73 are provided. The structure and operation of the second final crimping section E are the same as those of the first final crimping section D. While the first final crimping section D permanently clamps the first electronic component 6a to the long side of the LCD 1, The second final pressing portion E is different in that the second electronic component 6b is finally pressed on the short side of the LCD1.

Next, the position shift inspection unit F will be described.
FIG. 8 is a plan view of a position shift inspection unit of the electronic component bonding apparatus according to one embodiment of the present invention, and FIG. 9 is a perspective view of the same. 81 is an XYθ table, which is a Y table 82;
An X table 83, a θ table 84, a motor 85a of the Y table 82, and a motor 8 of the X table 83.
5b, By driving the actuator of the θ table 84, the LCD 1 is moved in the XYθ directions to adjust the position thereof.

Reference numeral 86 denotes an observation unit. In FIG. 9, the observation unit 86 includes a third camera 87 and a fourth camera 88. Reference numeral 89 denotes a storage box for the third camera 87 and the fourth camera 88. Third camera 8
7 and the fourth camera 88 connect the outer lead 28 to the electrode 9
After the final press bonding, the marks 34, 35, 36,
By observing 37, the relative displacement between the outer lead 28 and the electrode 9 is detected. In FIG. 8, 2a
Denotes an NG substrate transport unit, which is provided orthogonal to the transport unit 2 and transports and collects the LCD 1 which has failed in the inspection result of the position shift inspection unit F to the defective product recovery unit G.

FIG. 10 is a block diagram of a control system of the displacement detecting unit F of the electronic component bonding apparatus according to one embodiment of the present invention. Reference numeral 91 denotes a CPU that controls the entire position shift inspection unit F and the like. A ROM 92 stores a program for operating the apparatus. The RAM 93 stores the result of the displacement inspection. The recognizing unit 94 determines the center coordinates Ga, G of the marks 34, 35, 36, 37 based on the image data of the third camera 87 and the fourth camera 88.
b, Fa, and Fb (described later) are obtained. An XYθ table controller 95 controls the XYθ table 81.
Reference numeral 96 denotes an NG substrate transport unit controller that controls the NG substrate transport unit 2a.

This electronic component bonding apparatus is configured as described above. Next, the overall operation will be described. First, an offset data obtaining mode for obtaining the offset data TX and TY will be described. In FIG. 1, the LCD 1 provided in the supply unit A is sent to the anisotropic conductive sheet sticking unit B, and the ACF 27 is placed on the electrode 9 of the LCD 1.
Is affixed. Next, the LCD 1 is sent to the outer lead bonding section C. In FIG. 2, the LCD 1 on the mounting table W1 is vacuum-sucked on the pad 4 and transferred onto the XYθ table 11. In the present embodiment, first, the outer lead 2 of the first electronic component 6a is
The temporary attachment step is described below.

The first film carrier 7a led out of the first film carrier supply section 23 is used for the first mold 25.
And the first electronic component 6a is obtained. This first
The electronic component 6a is vacuum-adsorbed and picked up by the suction head 22, and the index head 20 is horizontally rotated in the direction of the solid line arrow 90 ° in FIG.
It is transferred above one electrode 9. Then, the marks 34, 35 of the LCD 1 and the marks 36, 37 of the first electronic component 6a
The first electronic component 6a is positioned on the LCD 1 such that the two overlap (see FIG. 3).

FIG. 3 shows the state at this time. In this state, the first camera 32 and the second camera 33 observe the marks 34, 35, 36, and 37, and detect the relative displacement between the outer lead 28 and the electrode 9 in the X and Y directions. After correcting the positional deviation, the outer lead 28 is temporarily bonded to the electrode 9. FIG. 4 shows the first camera 3
FIG. 11 is a bottom view of the lower plate 1a and the outer lead 9 being observed by the second and second cameras 33;
Referring to (c), before the temporary compression bonding, that is, the suction head 22
Electronic component 6a and XYθ table 11 held in
A method of detecting a displacement of the upper LCD 1 will be described.

FIGS. 11 (a), 11 (b) and 11 (c) are image diagrams of LCD and outer lead marks according to an embodiment of the present invention. In FIG. 11A, the marks 34 and 36 are observed by the first camera 32, and the marks 35 and 37 are observed by the second camera 33.
(XGa.YGa), Gb (XGb.YGb), Fa
(XFa.YFa) and Fb (XFb.YFb) are obtained by the recognition unit 44 (FIG. 5). The detection of the center coordinates of such an image can be easily performed by a well-known image processing technique, and therefore, the description thereof is omitted.

The center coordinates Ga, Gb,
Based on Fa and Fb, the displacements dx between the marks 34 and 35 and the marks 36 and 37 in the X and Y directions are calculated by the following equations.
1, dy1, dx2, and dy2 are obtained.

Dx1 = XFa−XGa (1) dy1 = YFa−YGa (2) dx2 = XFb−XGb (3) dy2 = YFb−YGb (4) Next, based on the above results, the LCD1 and the first electron Part 6
The position shift Sx in the X direction and the relative position shift Sy in the Y direction are obtained by the following equation.

Sx = (dx1 + dx2) ÷ 2 (5) Sy = (dy1 + dy2) ÷ 2 (6) Equation (5) shows the displacement d detected by the first camera 32.
x1 and the average value of the displacements dx2 detected by the second camera 33 are defined as the displacements of the LCD 1 and the first electronic component 6a in the X direction. The average value of the displacement dy2 is used as the displacement in the Y direction between the LCD 1 and the first electronic component 6a. After the positional shifts Sx and Sy are obtained in this manner, the X table 13 and the Y table 12 are driven in FIG.
The position shifts Sx and Sy are corrected by moving D1 by -Sx and -Sy.

FIG. 11 (b) shows the corrected marks 34,
The positional relationship between 35, 36 and 37 is shown. In the figure, mx
a and mya are the center coordinates Ga and F of the marks 34 and 36, respectively.
a is the distance between the X direction and the Y direction, and mxb and myb are marks 3
The distances in the X and Y directions of the center coordinates Gb and Fb of 5, 37, where mxa = mxb and mya = myb. The distance L1 between the center coordinates of the marks 34 and 35
Is larger than the distance L2 between the center coordinates of the marks 36 and 37. The reason is that when the outer lead 28 is thermocompression-bonded to the electrode 9 in a later step, the film carrier 7
Since a and 7b are extended and the distance L2 is increased, this extension is expected. Incidentally, if it is not necessary to anticipate this growth, L1 = L2 in FIG. 11B.

After the positional shifts Sx and Sy between the LCD 1 and the first electronic component 6a have been corrected as described above, the suction head 22 is lowered in FIG.
Is landed on the ACF 27, and then the temporary crimping tool 31 is lowered to press the outer lead 28 against the ACF 27 for temporary crimping. As described above, in the temporary crimping, the outer leads 28 are previously set so that the outer leads 28 are not unnecessarily displaced when performing the final crimping with the first final crimping tool 63 and the second final crimping tool 73 in a step described later. This is performed for temporary attachment on the electrode 9.

As described above, the first electronic component 6a is
After the temporary attachment on the long side electrode 9 of the CD 1, the second electronic component 6b is temporarily attached on the short side electrode 9 subsequently. Second
The method of temporarily attaching the electronic component 6b is the same as the method of temporarily attaching the first electronic component 6a described above, and will be briefly described below. In FIG. 2, if all of the first electronic components 6a (three in this embodiment) are temporarily attached on the electrode 9 on one long side of the LCD 1, the θ table 14 is driven to move the LCD 1 to 9
0 ° horizontal rotation, the short side of the index head 20
To the side. Second film carrier supply unit 2
4, the second film carrier 7 b is led out to the second mold 26, and the second film carrier 7 b is punched to obtain the second electronic component 6 b. Therefore, the suction head 22
The second electronic component 6b is transferred onto the short-side electrode 9 of the LCD 1 by picking up the electronic component 6b, and rotating the index head 20 in the direction of the dashed arrow, while referring to FIG. First electronic component 6 described
As in the case of a, the displacements Sx and Sy between the LCD 1 and the second electronic component 6b are obtained. Next, the displacements Sx, S
After correcting y, the outer lead 28 is temporarily attached to the ACF 27 by the temporary crimping tool 31. That is, in the offset data acquisition mode, the LCD 1 and the electronic component 6
Temporary attachment is performed after aligning both of them so that the positional deviation from a and 6b becomes zero. This makes it possible to know the new positional deviation amounts caused by the temporary attachment and the final pressure bonding as the positional deviation amounts Tx and Ty measured by the positional deviation inspection unit F.

FIG. 13 is a flowchart showing a temporary attaching step in the offset data obtaining mode of the outer lead bonding portion of the electronic component bonding apparatus according to one embodiment of the present invention. When the first electronic component 6a and the second electronic component 6b are all temporarily attached to the LCD 1 as described above, the XYθ table 11 is driven in FIG. 2 to move the LCD 1 below the central pad 4 in FIG. Transfer. Therefore, this pad 4 is the L on the XYθ table 11
The CD1 is picked up by vacuum suction and transferred to the next mounting table W2 as indicated by an arrow N1. So next pad 4
Picks up the LCD 1 by vacuum suction.

Referring to FIG. 6, the XYθ table 51A provided in the first final pressure bonding section D is driven to move below the LCD 1 vacuum-adsorbed to the pad 4, and the pad 4 is released from the vacuum suction state. To transfer the LCD 1 onto the XYθ table 51A. Next, the XYθ table 51A is L
The first electronic component 6a temporarily attached to the long side of CD1 is
The main crimping tool 63 is moved below to perform the main crimping. FIG. 7 shows a state in which the final press bonding is performed by the first final press tool 63. In the figure, the first final pressure bonding tool 63 is pre-heated by a heater 65,
, The lower plate 1a is supported from below, and pressed firmly against the outer leads 28 to perform full pressure bonding on the electrode 9.

The LCD 1 on which the first electronic component 6a has been permanently crimped in the first final crimping section D as described above is temporarily
After being transferred onto the mounting table W3, the sheet is successively sent by the transport unit 2 onto the XYθ table 51B provided in the second final pressure bonding unit E. LCD transferred on XYθ table 51B
1, the θ table 54 is rotated by 90 °, so that the second electronic component 6b on the short side is positioned below the second final crimping tool 73. Thus, the outer lead 28 is connected to the electrode 9 by the second final crimping tool 73 in the same manner as in the case of the final final crimping tool 63 described with reference to FIG.
Completely crimped.

The LCD 1 in which the first electronic component 6a and the second electronic component 6b are all bonded as described above.
Is the X of the displacement inspection unit F shown in FIG.
The table is sent to the Yθ table 81, and a position shift inspection is performed. FIG. 9 shows the state of this position shift inspection,
The left and right marks 34, 35, 36, 37 are observed by the camera 87 and the fourth camera 88.

In FIG. 11C, the left side shows the image of the third camera 87, and the right side shows the image of the fourth camera 88. Since the outer lead 28 has been completely crimped by the first final crimping tool 63 and the second final crimping tool 73, the marks 36 and 37 on the outer lead 28 side are shown in FIG.
The position is displaced from the position shown in FIG. 1B to the position shown in FIG. As described in the section (Prior Art), the reason is that the parallelism between the first and second bonding tools 63 and 73 and the surface of the electrode 9 of the LCD 1 does not match, the compression load, the temperature, and the physical This is because of characteristics.

Now, in FIG. 11C, the marks 34,
The displacement between the mark 35 and the marks 36 and 37 is obtained from the following equation.

Dx3 = XFa−XGa (7) dy3 = YFa−YGa (8) dx4 = XFb−XGb (9) dy4 = YFb−YGb (10) where dx3, dy3, dx4, and dy4 are marks 36, respectively. , 37 center coordinates Fa, Fb and mark 3
These are the positional deviations in the X and Y directions of the center coordinates Ga and Gb of 4, 35.

Therefore, the electronic component 6a (6
b), the displacement amount Tx of the LCD 1 in the X direction and the displacement amount Ty of the LCD 1 in the Y direction are given by the following equations.

Tx = (dx3 + dx4) ÷ 2 (11) Ty = (dy3 + dy4) ÷ 2 (12) Tx is the average value of dx3 and dx4, and Ty is dy3 and dy4
The average value of the positional deviation between the left marks 34 and 36 and the right marks 35 and 37 is obtained, and Tx and Ty are defined as the relative positional deviation between the LCD 1 and the first electronic component 6a. Things. As described above, the positional deviation amounts Tx and Ty can be regarded as the positional deviation amounts generated during the temporary attachment and the final pressure bonding. FIG. 12 is a plan view of an LCD in which a first electronic component and a second electronic component according to one embodiment of the present invention are fully bonded. 12, six first electronic components 6a and two second electronic components 6b are bonded to the LCD 1 as shown in bonding positions # 1 to # 8. Therefore, a large number (50 in this embodiment) of LCs
With respect to D1, the displacement amounts Tx and Ty are measured for each of # 1 to # 8. And each bonding position # 1 to #
The average value of the displacement amounts Tx and Ty is calculated as TX and TY for each 8. (Table 1) shows the data.

[0045]

[Table 1]

The data in (Table 1) is the R
Stored in AM93. As described with reference to FIG. 17, the displacement amounts Tx and Ty have a certain tendency.
The average values TX and TY serve as offset data for correcting positional deviation. After the average values TX and TY of the positional deviation are sent to the line controller I, they are sent from the line controller I to the RAM 43 of the outer lead bonding section C as offset data. (Table 2) shows the offset data.

[0047]

[Table 2]

The outer lead bonding section C feeds back the offset data to the XYθ table controller 45 when the electronic component is temporarily pressure-bonded to the next LCD 1, and thereafter, corrects the offset data TX and TY as correction values. While the electrodes 9 of the outer leads 28
After performing positioning with respect to
Is performed. This correction is desirably performed for each of the bonding positions # 1 to # 8 according to the offset data TX and TY shown in (Table 2).

Next, referring to FIGS. 14 and 15,
The offset data feedback mode will be described. 14 (a), (b) and (c) are image diagrams of marks of an LCD and an outer lead according to an embodiment of the present invention, and FIG. 15 is a diagram showing a method of correcting a displacement of an electronic component bonding apparatus according to an embodiment of the present invention. FIG. FIG. 14A is an image similar to FIG. 11A, showing the images of the first camera 32 and the second camera 33 before the temporary attachment of the outer lead 28 shown in FIG. 3 is performed. I have. First, a displacement Sx in the X direction and a displacement Sy in the Y direction are obtained from the above equations (1) to (6). Next, the offset data T stored in the RAM 43
X and TY are added to these Sx and Sy as correction values to obtain final correction values Ux and Uy (see also FIG. 15).

Next, the XYθ table 11 is driven to drive the LCD
1 is moved by -Ux in the X direction and -Uy in the Y direction to perform position correction. That is, in the offset data feedback mode, the LCD 1 and each of the electronic components 6a and 6b are displaced and position adjustment is performed in advance by estimating the average values TX and TY of the position deviations generated during the temporary attachment and the final pressure bonding. FIG. 14B shows the LCD 1 and the electronic component 6 whose position has been corrected.
It is an image of mark 34,35,36,37 of a (6b). After the position is corrected in this manner, the outer leads 28 are connected to the outer leads 28 by the temporary crimping tool 31 as described above.
Temporarily attach to F27. Subsequently, the LCD 1 is moved by the transport unit 2 to the first position.
The sheet is conveyed to the final crimping section D and the second final crimping section E, and is finally crimped by the first final crimping tool 63 and the second final crimping tool 73. FIG.
FIG. 4 (c) is an image after the final pressure bonding. The displacement amounts Tx and Ty after the final press bonding are as shown in Expressions (11) and (12).
The displacements Tx and Ty become smaller due to the displacement of the relative positions with respect to a and 6b. After that, the transport unit 2 transports the LCD 1 to the positional deviation inspection unit F, and inspects the positional deviation between the LCD 1 and the electronic component 6a (6b). When the positional deviations Tx and Ty are equal to or smaller than the allowable value ± D, the LCD 1 is collected as a non-defective item in the non-defective item collecting section H shown in FIG.
If it is greater than D, it is sorted as a defective product and the defective product collection section G
Will be collected.

FIG. 16 is a flowchart of the offset data feedback mode of the outer lead bonding section C of the electronic component bonding apparatus according to the embodiment of the present invention.

The present invention is not limited to the above embodiment, and various design changes and operating methods are conceivable. For example, in Table 1, the number of LCDs 1 for obtaining offset data TX and TY is 50. However, this number may be any number. Furthermore, in this embodiment, the bonding apparatus is provided with the position shift inspection unit F. However, the position shift inspection unit F may be provided separately and used alone. Further, the outer lead bonding section C and the displacement detecting section F are connected by a communication cable J and various data are transferred by communication. However, even if data is exchanged using a storage medium such as a magnetic disk, the data can be exchanged. Good. In addition, the mark for detecting the positional shift is not limited to the marks 34, 35, 36, and 37 as long as it can be a target for observation. As described above, the present invention allows various design changes.

[0053]

As described above, the present invention obtains, as offset data, the positional shift that occurs when the outer leads of the electronic component are permanently bonded to the electrodes of the display panel, and this offset data is estimated in advance to determine the position of the electronic component. The outer leads are crimped to the electrodes while aligning the display panel, so that the displacement of the outer leads with respect to the electrodes can be kept within an allowable range, and the bonding of electronic components to the LCD can be performed with good yield. it can.

[Brief description of the drawings]

FIG. 1 is a plan view showing the overall configuration of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of an outer lead bonding portion of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 3 is a partial perspective view of an outer lead bonding portion of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 4 is a bottom view of the lower plate of the LCD according to one embodiment of the present invention.

FIG. 5 is a block diagram of a control system of an outer lead bonding section of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 6 is a plan view of the first and second crimping sections of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 7 is a perspective view of the vicinity of a final crimping tool provided in a first final crimping unit of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 8 is a plan view of a displacement detection unit of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 9 is a perspective view of a main part of a displacement detecting unit of the electronic component bonding apparatus according to one embodiment of the present invention.

FIG. 10 is a block diagram of a control system of a displacement detection unit of the electronic component bonding apparatus according to one embodiment of the present invention.

11A is an image diagram of an LCD and an outer lead mark according to an embodiment of the present invention. FIG. 11B is an image diagram of an LCD and an outer lead mark according to an embodiment of the present invention. Image of example LCD and outer lead mark

FIG. 12 is a plan view of an LCD in which a first electronic component and a second electronic component according to one embodiment of the present invention are fully bonded.

FIG. 13 is a flowchart showing a temporary attachment step in an offset data acquisition mode of an outer lead bonding portion of the electronic component bonding apparatus according to one embodiment of the present invention;

14A is an image diagram of an LCD and an outer lead mark according to an embodiment of the present invention. FIG. 14B is an image diagram of an LCD and an outer lead mark according to an embodiment of the present invention. Image of example LCD and outer lead mark

FIG. 15 is a diagram illustrating a method for correcting a displacement of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 16 is a flowchart of an offset data feedback mode of an outer lead bonding section of an electronic component bonding apparatus according to an embodiment of the present invention.

FIG. 17 is a distribution diagram of relative displacement between an outer lead and an electrode in a conventional method of bonding electronic components.

[Explanation of symbols]

 C Outer lead bonding section D First final crimping section E Second final crimping section F Position shift inspection section 1 Display panel (LCD) 6a First electronic component 6b Second electronic component 7a First film carrier 7b Second Film carrier 9 Electrode 11, 51A, 51B, 81 XYθ table 22 Suction head 27 Anisotropic conductive sheet (ACF) 28 Outer lead 30 Temporary pressure bonding head 31 Temporary pressure bonding tool 32 First camera 33 Second camera 34, 35, 36, 37 mark 41, 91 CPU 43, 93 RAM 44, 94 recognition unit 45 XYθ table controller 63 first crimping tool 73 second crimping tool 87 third camera 88 fourth camera

──────────────────────────────────────────────────続 き Continuation of the front page (56) References JP-A-8-114812 (JP, A) JP-A-3-46244 (JP, A) JP-A-3-72645 (JP, A) JP-A-5-114 11263 (JP, A) JP-A-7-78852 (JP, A) JP-A-7-201932 (JP, A) JP-A-7-231008 (JP, A) JP-A 8-330393 (JP, A) (58) Field surveyed (Int.Cl. ⁷ , DB name) H01L 21/60 G02F 1/1345 G09F 9/00 H05K 1/14 H05K 3/34 H05K 13/04

Claims (6)

(57) [Claims] 1. A positioning device for positioning an electronic component made of a film carrier and a display panel, and a temporary mounting device for temporarily mounting an outer lead of the aligned electronic component to an electrode of the display panel . Crimping tool and temporary attachment
Crimping means with a final crimping tool for final crimping after
And observation means for observing the relative displacement of the said electronic component after the crimping and the display panel, the alignment hand
Step (1) Positional deviation between display panel and electronic component is zero
Obtain offset data that aligns the two so that
And mode, misalignment was observed in (2) said observation means
Offsets to align by shifting the relative position of the electronic component and the display panel on the basis of the offset data obtained Ri
Control means for performing control in two modes, ie, a data feedback mode . 2. An XYθ table for positioning the display panel, a suction head for vacuum-holding and holding the electronic component, and an electronic head and the XYθ table held by the suction head. The electronic component bonding apparatus according to claim 1, further comprising: a camera for observing a relative displacement of the positioned display panel. 3. A bonding method in which an anisotropic conductive sheet is interposed between an outer lead of an electronic component made of a film carrier and an electrode of a glass substrate.
A first step of aligning a relative position between the electronic component and the glass substrate, and a crimping tool for temporarily attaching the electronic component to the anisotropic conductive sheet;
A second step of attaching the glass substrate using this compression bonding tool to the crimp only later, and a third step of detecting the relative positional deviation of the said electronic component after the bonding between the glass substrate in unrealized, (1) the offset data acquisition mode, the first
In the process, the misalignment between the glass substrate and the electronic components becomes zero.
The two are aligned so that they are detected in the third step.
It was obtained offset data based on the positional deviation, (2) offset data feedback mode smell
In the first step, the position detected in the third step
A method of bonding an electronic component, wherein the electronic component and the glass substrate are misaligned based on offset data calculated from the misalignment . 4. The method for bonding electronic components according to claim 3 , wherein said offset data is calculated from an average value of positional deviation detected from a plurality of glass substrates. The method according to claim 5, wherein said offset data is calculated respectively for each bonding location to mount the electronic components on the glass substrate, the <br/> the first step in the offset data feedback mode, the offset data for each bonding location 4. The method for bonding electronic components according to claim 3, wherein the electronic component and the glass substrate are misaligned on the basis of the following . Wherein when said positional deviation detected in the third step exceeds the allowable value, the bonding method of the electronic component of claim 3, wherein the selecting the glass substrate as a bonding failure.