JP3622642B2 - Electronic component mounting method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to the implementation method of the electronic component for mounting electronic components on a substrate.
[0002]
[Prior art]
A mounting device that mounts electronic components on a substrate is provided with a supply unit in which a number of parts feeders such as tape feeders for storing electronic components are arranged in parallel, and the electronic components are picked up from these parts feeders by a transfer head. Then, the mounting operation of transferring onto the substrate is repeated. In order to improve the efficiency of the mounting operation, a transfer head provided with a plurality of suction nozzles for holding electronic components is often used.
[0003]
[Problems to be solved by the invention]
By the way, there are various types of electronic components mounted on the same mounting board, and the shapes and sizes are also different. Therefore, it is necessary to use a suction nozzle that picks up and picks up these electronic components according to the suction target. However, in the conventional multiple suction nozzle type transfer head, it is difficult to rationally arrange a plurality of suction nozzles for parts of different sizes and shapes, and it is difficult to arrange electronic components to be mounted on the same mounting apparatus. There was a problem that the range of types was limited and improvement in mounting efficiency was hindered.
[0004]
The present invention expands the type range of electronic component to be mounted, and an object thereof is to provide a implementation method of the electronic component which can improve the mounting efficiency.
[0006]
[Means for Solving the Problems]
Electronic part mounting method according to claim 1, wherein the electronic components in the X and Y directions by an integer multiple of the arrangement pitch of the adsorbed multiple suction nozzle that holds in a predetermined basic pitch and or the fundamental pitch With a transfer head mounted on a multi-row nozzle head, a plurality of electronic components of different sizes are simultaneously picked up from a parts feeder arranged in the X direction in the electronic component supply unit and mounted on a substrate When mounting a suction nozzle for non-large components and a suction nozzle for large components on the nozzle head, and mounting a suction nozzle for large components, By not attaching suction nozzles to the nozzle heads adjacent to both X and Y, positional interference between the imaging reflector provided in the suction nozzles and the adjacent suction nozzles does not occur. It was.
[0007]
According to the present invention, the suction head for the non-large component and the suction nozzle for the large component are detachably mounted on the nozzle head of the transfer head, and when the suction nozzle for the large component is mounted, By not attaching suction nozzles to the nozzle heads adjacent to both X and Y, it is possible to prevent positional interference between the reflection plate and the suction nozzles adjacent to each other, and to efficiently mount electronic components of various sizes. be able to.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Next, embodiments of the present invention will be described with reference to the drawings. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a perspective view of a transfer head of the electronic component mounting apparatus according to an embodiment of the present invention, and FIG. FIG. 3B is a front view of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 3B is a side view of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention. FIG. 5 is a sectional view of the suction nozzle unit of the electronic component mounting apparatus according to the embodiment of the present invention, FIG. 5 is a partial detailed view of the suction nozzle unit of the electronic component mounting apparatus according to the embodiment of the present invention, and FIG. 7 is a partial cross-sectional view of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention; FIG. 7 is a partial perspective view of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention; FIG. 9 is an explanatory diagram of the nozzle arrangement of the transfer head of the electronic component mounting apparatus according to the embodiment of the present invention.
[0009]
First, the overall structure of the electronic component mounting apparatus will be described with reference to FIG. In FIG. 1, a transport path 2 is disposed in an electronic component mounting apparatus 1, and the transport path 2 transports and positions a substrate 3 on which the electronic component is mounted. An electronic component supply unit 4 is disposed on the side of the conveyance path 2, and the supply unit 4 is provided with a plurality of tape feeders 5 which are parts feeders.
[0010]
An X-axis table 6 and a Y-axis table 7 are disposed above the supply unit 4 and the conveyance path 2. The X-axis table 6 and the Y-axis table 7 are provided with feed screws 8X and 8Y and drive motors MX and MY, respectively, and the X-axis table 6 moves in the Y direction by driving the Y-axis drive motor MY. A transfer head 9 is mounted on the X-axis table 6, and the transfer head 9 picks up an electronic component from the tape feeder 5 of the supply unit 4 and transfers and mounts it on the substrate 3 positioned in the transport path 2. The X-axis table 6 and the Y-axis table 7 are moving means for moving the transfer head 9 horizontally.
[0011]
A line camera 10 for electronic component recognition is disposed between the transport path 2 and the supply unit 4, and when the transfer head 9 picking up the electronic component from the supply unit 4 passes over the line camera 10, The line camera 10 images electronic components from below. The obtained imaging data is subjected to image processing, thereby recognizing the electronic component. That is, the line camera 10 serves as a recognition unit that recognizes an electronic component held by the suction nozzle of the transfer head 9 from below.
[0012]
Next, the transfer head 9 will be described with reference to FIGS. As shown in FIGS. 2 and 3, the transfer head 9 is a multiple head in which a plurality of suction nozzles move integrally, and the suction nozzle is integrated with a lifting mechanism and a suction mechanism in a common vertical base portion 11. A plurality of suction nozzle units 12 are arranged in parallel. In the example shown in the present embodiment, the nozzle rows formed by arranging the four suction nozzle units 12 in series in the X direction (the direction in which the tape feeders 5 are arranged in parallel) are arranged in two rows in the Y direction. ing.
[0013]
By adopting such an arrangement of the suction nozzle unit 12, the length of the transfer head in the X direction compared to a conventional multiple nozzle type transfer head in which a plurality of suction nozzles are arranged in series in a single row. The dimensions can be greatly shortened. Accordingly, the stroke of the transfer head in the X direction can be shortened to reduce the apparatus space. In addition, since the number of nozzles arranged in series decreases, accumulation of pitch errors between the nozzles can be suppressed, and problems caused by misalignment when simultaneously picking up a plurality of parts as will be described later. Can be reduced.
[0014]
As shown in FIG. 3, a guide rail 13 a is horizontally disposed on the side surface of the frame 6 a of the X-axis table 6, and a slider 13 b slidably fitted to the guide rail 13 a is fixed to the base portion 11. Has been. Further, the nut 14 screwed into the feed screw 8X is fixed to the base portion 11, and when the feed screw 8X is rotationally driven by the X-axis drive motor MX, the base portion 11 moves horizontally in the X direction. As a result, the plurality of suction nozzle units 12 move integrally.
[0015]
The structure of the transfer head 9 will be described. A box-shaped upper frame 15 and a variable cross-sectional lower frame 16 are fixed to the side surface of the base portion 11. On the upper surface of the upper frame 15, a nozzle lifting / lowering motor 20 that constitutes the suction nozzle unit 12 is disposed vertically. The rotation of the nozzle lifting / lowering motor 20 is transmitted to a lifting / lowering mechanism 25 provided below the upper frame 15, where the rotational movement of the nozzle lifting / lowering motor 20 is converted into the vertical movement of the lifting / lowering shaft member 30. By individually controlling the nozzle lifting motor 20 by the control unit 39, the plurality of suction nozzles of the transfer head 9 can be lifted and lowered individually with variable strokes.
[0016]
Thus, in the transfer head 9 provided with a plurality of suction nozzles, it is not necessary to cause the entire transfer head 9 to move up and down by individually lifting and lowering the suction nozzles with variable strokes. Accordingly, the driving load of the lifting mechanism can be reduced as compared with the conventional mechanism for lifting and lowering the entire transfer head 9, and the lifting and lowering operation of the suction nozzle in the mounting operation is made a single operation of only one drive system, Implementation tact time can be reduced.
[0017]
The elevating shaft member 30 is provided with a shaft rotating portion 32, and the rotation is transmitted to the shaft rotating portion 32 via the endless belts 51 a and 51 b by a nozzle rotating motor 50 fixed to the lower frame 16. Thereby, the elevating shaft member 30 rotates around the axis. The lower end portion of the elevating shaft member 30 is inserted into the swivel portion 36 and coupled to the nozzle head 37, and a suction tool 38 that is a suction nozzle having a reflecting plate 38a and a suction portion 38b is detachably attached to the nozzle head 37. It is attached to. That is, the suction tool 38 is attached to the lower end portion of the lifting shaft member 30.
[0018]
The swivel unit 36 is connected to a vacuum suction device, and vacuum suction is performed from the lower end portion of the suction unit 38b while allowing the suction tool 38 to rotate around the axis by vacuum suction from the swivel unit 36. The suction tool 38 sucks and holds the electronic component by vacuum suction with the electronic component in contact with the lower end. The reflecting plate 38a reflects illumination light irradiated from below during imaging by the line camera 10, and transmits and illuminates the electronic component held by the suction unit 38b.
[0019]
Next, the structure of the suction nozzle unit 12 will be described with reference to FIGS. In FIG. 4, the top plate 15a of the upper frame 15 is provided with a shaft hole 15c of the nozzle lifting / lowering motor 20, and a rotating shaft 20a to which a coupling member 21 is attached is inserted into the shaft hole 15c. The housing member 22 of the elevating mechanism 25 is pivotally supported via bearings 24a and 24b in the shaft hole 15c and the shaft hole 15d provided in the bottom plate 15b of the upper frame 15, respectively. As shown in FIG. 5A, a slit 22a is provided at the upper end of the housing member 22, and the spur tooth portion 21a of the coupling member 21 is fitted into the slit 22a. Therefore, when the rotary shaft 21a rotates, the housing member 22 also rotates.
[0020]
The housing member 22 is provided with an inner hole 22b penetrating vertically. As shown in FIG. 5B, the lower portion of the inner hole 22b communicates with a mounting hole 22c into which the nut member 26 is fitted. . By fitting the nut member 26 into the mounting hole 22c and pressing the collar plate 43 with the pressing member 41 through the ring 42 made of an elastic material, the nut member 26 has a stepped portion indicated by an arrow in FIG. Is fixed to the housing member 22.
[0021]
A feed screw 23 inserted through the inner hole 22b is screwed into the nut member 26, and a lower end portion of the feed screw 23 is connected to the lifting shaft member 30 via holding members 27 and 29 that hold the bearing 28 from above and below. It is connected freely. Therefore, by driving the nozzle lifting / lowering motor 20, the nut member 26 fixed to the housing member 22 rotates. The nozzle lifting / lowering motor 20 serves as a driving means for driving the nut member 26 to rotate. As a result, the feed screw 23 moves up and down, and this up-and-down movement is transmitted to the elevating shaft member 30 coupled to the feed screw 23, and the feed screw 23 and the elevating shaft member 30 both move up and down. At this time, the elevating shaft member 30 is allowed to rotate relative to the feed screw 23 by the bearing 28.
[0022]
A spring member 31 is mounted on the outer periphery of the elevating shaft member 30, and the spring member 31 contacts the holding member 29 and transmits an upward biasing force. This urging force is further transmitted to the feed screw 23 via the holding member 27. As a result, when the nut member 26 rotates and moves the feed screw 23 up and down, the feed screw 23 moves up and down while being pressed against the nut member 26 in the axial direction, and the feed screw 23 is moved together with the nut member 26. Around is prevented. That is, the spring member 31 serves as a detent means for preventing the feed screw 23 from being rotated.
[0023]
As shown in FIG. 5C, a housing member 44 is pivotally supported in the shaft hole 16a provided in the lower frame 16 via bearings 45a and 45b. The housing member 44 is provided with an inner hole 44a penetrating vertically, and a slide guide 35 is fitted into a mounting hole 44b provided below the inner hole 44a. A lift shaft member 30 is inserted into the slide guide 35 while restraining displacement in the rotational direction. That is, when the housing member 44 is rotated, the elevating shaft member 30 is also rotated.
[0024]
The upper portion of the housing member 44 is a shaft rotation portion 32 to which rotation is transmitted from the nozzle rotation motor 50. The shaft rotating portion 32 is provided with a transmission pulley portion 33 and an idler pulley portion 34. The transmission pulley portion 33 includes a pulley 33a fixed to the housing member 44, and rotation is transmitted to the housing member 44 by an endless belt 51a tuned to the pulley 33a.
[0025]
On the other hand, the pulley 34b provided in the idler pulley portion 34 is attached to the housing member 44 via the bearing 34a. For this reason, rotation is not transmitted to the housing member 44 from the endless belt 51b tuned to the idler pulley section 34, and it functions only as an idler for guiding the endless belt 51b.
[0026]
Here, the arrangement of the nozzle rows in the transfer head 9 and the nozzle rotation motor 50 that rotates the suction nozzles of each nozzle row will be described. As shown in FIGS. 6 and 7, the transfer head 9 is provided with a first nozzle row L1 and a second nozzle row L2 each including four suction nozzles in order from the X-axis table 6 side, that is, the supply unit 4 side. It has been. A nozzle rotation motor 50 is disposed at an intermediate position between the first nozzle row L1 on the supply unit 4 side and the second nozzle row L2 on the substrate 3 side. The nozzle rotation motor 50 is a single θ rotation drive unit that rotates the suction nozzles of these nozzle rows around the nozzle axis.
[0027]
The rotation of each suction nozzle by the nozzle rotation motor 50 is one of the two endless belts 51a and 51b that are tuned in two stages according to the pulley position of the shaft rotating portion 32 as shown in FIGS. Each nozzle row is rotationally driven by a nozzle rotation motor 50 via two endless belts. That is, as shown in FIG. 6 (a), the lower endless belt 51a has four suction nozzles in the second nozzle row L2, and the upper endless belt 51b has a first nozzle row as shown in FIG. 6 (b). Each of the four suction nozzles L1 is rotationally driven. A tension pulley 53 is provided at each of the upper and lower stages so that the belt tension can be adjusted.
[0028]
Here, the type of the shaft rotating portion 32 of each suction nozzle unit 12 will be described. As shown in FIG. 6 (c), there are four types of types A to D in the combination of the transmission pulley portion 33 and the idler pulley portion 34 of the shaft rotating portion 32, and each of the nozzle rows L1 and L2 includes these four types. Various types are arranged in combination.
[0029]
Type A has a pulley 33a on the upper stage and a pulley 34b on the lower stage via a bearing 34a, and Type B has a pulley 33a on the upper stage and only the bearing 34a on the lower stage. In addition, types C and D have configurations in which the upper and lower stages of types B and A are interchanged. As shown in FIG. 6, the first nozzle row L1 and the second nozzle row L2 have the types A to D in an arrangement of (A, B, B, A) and (D, C, C, D), respectively. It is a combination.
[0030]
By adopting such a configuration and arrangement of the shaft rotating unit 32, the tooth surfaces of the endless belts 51a and 51b are brought into contact with the transmission pulleys 33a attached to the respective shafts of the nozzle row to be rotationally driven. The shaft rotating part 32 of the other nozzle row can be used as a guide idler. Here, the pulley 34b is used for the position where the endless belts 51a and 51b are guided on the tooth surface side, and only the bearing 34a is used for the position where the endless belts 51a and 51b are guided on the back side. As can be seen from FIG. 6, the arrangement of the transmission pulleys and idler pulleys in the upper and lower stages is symmetrical, so that endless belts 51a and 51b having the same length can be used in the upper and lower stages. This makes it easy to manage maintenance parts.
[0031]
In this way, by rotating and driving the nozzle shafts of a plurality of suction nozzles in the same nozzle row with one endless belt, it is possible to perform highly accurate θ rotation with a small rotation transmission error, and a compact multiple nozzle type The transfer head is realized. Further, in the above configuration, by arranging the nozzle rotation motor 50 of the θ-axis rotation means at the intermediate position of each nozzle row, the symmetry in the transmission arrangement is ensured and the protruding portion of the transfer head 9 from the X-axis table 6 The mass moment can be reduced as much as possible, and the generation of vibration during driving can be suppressed to enable high-speed driving.
[0032]
Next, the arrangement of the substrate recognition camera 17 in the transfer head 9 will be described. As shown in FIG. 6, the transfer head 9 includes a camera 17 that moves integrally. The camera 17 is arranged on the same straight line as the nozzle row on the supply unit 4 side, that is, the first nozzle row L1. . By driving the X-axis table 6 and the Y-axis table 7, the camera 17 moves horizontally together with the transfer head 9 and images the substrate 3 positioned on the transport path 2 to recognize the position of the substrate 3. To do. The camera 17 is an imaging unit that images the substrate 3.
[0033]
The electronic component mounting apparatus is configured as described above. Hereinafter, the mounting of the electronic component by the mounting apparatus will be described. In this mounting operation, when electronic components having different shapes and sizes are targeted, different types of suction tools corresponding to the components are mounted on the transfer head 9. In the transfer head 9 shown in the present embodiment, various types of suction tools can be combined according to the target component as illustrated in FIGS. 8 and 9.
[0034]
FIG. 8A shows a state in which the most common suction tool 38 of the same type is attached to the nozzle heads of all the suction nozzle units. FIGS. 8B and 8C show states in which four kinds of electronic components P1, P2, P3, and P4 are held using the transfer head 9 having this suction nozzle arrangement. As shown in FIG. 8, even a large electronic component P2 that protrudes from the range of one suction tool 38 has a size such that the electronic components held by the adjacent suction tool 38 do not interfere with each other. (Electronic components P1, P3) can be sucked and held at the same time.
[0035]
FIG. 9 shows an example in which different types of suction tools are mounted on the transfer head 9. That is, in FIG. 9 (a), two of the four nozzle heads in each nozzle row each have a general type (non-large-sized component) suction tool 38 and a large-sized component suction tool 38 'at an arrangement pitch 2P. In FIG. 9B, a general-type suction tool 38 and a suction tool 38 'for large parts are mounted at arrangement pitches P and 3P, respectively. Further, in FIG. 9C, a suction tool 38 ′ for a large component is attached to one nozzle head of the first nozzle row L1.
[0036]
In these examples, when it is necessary to attach a suction tool 38 'for a large part, the suction tool for the large part is not attached by not attaching the suction tool to the nozzle head adjacent in both the X and Y directions. The suction tool 38 'for large parts can be mounted without causing positional interference between the reflection plate of the tool 38' and other suction tools adjacent in the X and Y directions .
[0037]
In the actual example, when various types of electronic components are targeted, various various combinations other than the combinations illustrated in FIGS. 8 and 9 are possible. That is, a nozzle in which a plurality of suction nozzles having different sizes for sucking and holding electronic components are arranged in series in the X direction at a predetermined basic pitch P of the suction nozzle unit 12 or an array pitch that is an integer multiple of the basic pitch P. Various forms in which a plurality of rows are provided are possible. Thereby, it is possible to transfer different types of electronic components in the same mounting turn, and the mounting efficiency can be improved.
[0038]
When the attaching operation of the suction tool is completed, the mounting operation is started. First, in FIG. 1, the transfer head 9 is moved to the supply unit 4, and an electronic component is picked up from each tape feeder 5 by the suction tool 38 or 38 ′. At this time, if the arrangement of the electronic parts of the tape feeder 5 in the supply unit 4 matches the arrangement of the suction tools 38 in the transfer head 9, simultaneous suction is possible. In this case, the suction tool 38 is lowered simultaneously in the plurality of suction nozzle units 12, and a plurality of electronic components having different shapes and sizes are picked up simultaneously. In other cases, the electronic components to be picked up are individually picked up by the individual suction tools corresponding to the components in accordance with the mounting sequence data.
[0039]
In the electronic component pickup, since the length dimension in the X direction of the transfer head 9 is set to be small, the moving distance of the transfer head 9 in the pickup operation can be reduced to shorten the mounting tact time. . In addition, since the accumulation of pitch errors between the plurality of suction nozzles in the transfer head 9 is small, the occurrence of pick-up problems due to the positional deviation between the suction nozzles and the electronic components is minimized, and a plurality of suction nozzles are arranged in a single row. The probability of simultaneous pick-up can be improved as compared with a multi-nozzle type transfer head of a system in which the two are arranged in series.
[0040]
In this way, the transfer head 9 holding a plurality of electronic components is moved above the substrate 3 by the X-axis table 6 and the Y-axis table 7. In this movement path, the transfer head 9 passes above the line camera 10 at a predetermined movement speed. Thereby, the electronic component held by the transfer head 9 is imaged from below by the line camera 10, and each electronic component is recognized by performing image processing on the imaging result.
[0041]
Then, the electronic component whose position is recognized and the position shift is detected is mounted on each mounting point on the substrate 3 after correcting the position shift. In this mounting operation, when the pitch of the held electronic components, that is, the arrangement pitch of the suction nozzle units 12 and the pitch of the mounting points on the substrate 3 are the same, the suction tool 38 holding these electronic components is used. Lower at the same time. In other cases, the suction tool holding each electronic component is sequentially lowered based on the mounting sequence data, and the electronic component is mounted at each mounting point.
[0042]
【The invention's effect】
According to the present invention, the suction head for the non-large component and the suction nozzle for the large component are detachably mounted on the nozzle head of the transfer head, and when the suction nozzle for the large component is mounted, By not attaching suction nozzles to the nozzle heads adjacent to both X and Y, it is possible to prevent positional interference between the reflection plate and the suction nozzles adjacent to each other, and to efficiently mount electronic components of various sizes. be able to.
[Brief description of the drawings]
FIG. 1 is a plan view of an electronic component mounting apparatus according to an embodiment of the present invention. FIG. 2 is a perspective view of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention. ) Front view of transfer head of electronic component mounting apparatus according to one embodiment of the present invention (b) Side view of transfer head of electronic component mounting apparatus of one embodiment of the present invention FIG. 5 is a partial detailed view of the suction nozzle unit of the electronic component mounting apparatus according to the embodiment of the present invention. 7 is a partial cross-sectional view of a transfer head of an electronic component mounting apparatus according to an embodiment. FIG. 7 is a partial perspective view of a transfer head of an electronic component mounting apparatus according to an embodiment of the present invention. Explanatory drawing of nozzle arrangement | positioning of the transfer head of the electronic component mounting apparatus of one Embodiment FIG. Illustration of a nozzle arrangement of the transfer head of the mounting apparatus for electronic components in the form [Description of symbols]
2 Transfer path 3 Substrate 4 Supply unit 5 Tape feeder 6 X-axis table 7 Y-axis table 9 Transfer head 10 Line camera 12 Suction nozzle unit 17 Camera 20 Nozzle lifting motor 23 Feed screw 25 Lifting mechanism 30 Lifting shaft member 32 Axis rotating unit 38 Suction Tool 39 Control Unit 50 Nozzle Rotating Motor 51a, 51b Endless Belt

Claims (1)

Transferring the suction nozzle of the multiple that holds by suction the electronic component is provided by mounting a plurality of rows nozzle heads in the X and Y directions by an integer multiple of the arrangement pitch of the predetermined basic pitch and or the fundamental pitch An electronic component mounting method in which a plurality of electronic components having different sizes are simultaneously picked up from a parts feeder arranged in parallel in the X direction on the electronic component supply unit by a head and mounted on a substrate. The suction nozzle for non-large parts and the suction nozzle for large parts are detachably attached. When attaching the suction nozzle for large parts, the nozzle head adjacent to both X and Y is suctioned. by not attaching the nozzle, mounting of the electronic component, characterized in that so as not to cause positional interference between the suction nozzle and an adjacent reflector plate for imaging provided in the suction nozzle Law.

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