JPH1168396A - Electronic component packaging system - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a simply structured electronic component packaging system excellent in high speed, packaging accuracy, and operational reliability. SOLUTION: A cylindrical cam (a first cam) 22 and a plate cam (a second cam) 23 are attached to a first rotary shaft 21 driven by a motor 26. The cylindrical cam 22 is gear-connected to a roller gear 31. The roller gear rotates forward and backward with the rotation of the cylindrical cam 22, and a first head 1 and a second head 2 reciprocate between a chip supply section 6 and a position deviation correction stage 7, and the position deviation correction stage 7 and a positioning section 8 on a substrate 12 respectively. An arm 44 swings upward and downward with the rotation of the plate cam 23, a first push element 51, a second push element 52, and a third push element 53 swing in the same direction, and make a nozzle 4 of the first head 1 and a nozzle 5 of the second head 2 travel upward and downward.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for transferring and mounting electronic components on a substrate.

[0002]

2. Description of the Related Art An electronic component mounting apparatus is provided with two heads, and a first head transfers and mounts a chip of an electronic component (chip) supply section to a displacement correction stage, and a second head.
There is known a device in which a chip whose position has been corrected by a position correction stage by means of a head is transferred and mounted on a substrate (for example, Japanese Patent Application Laid-Open No. H2-130898).
issue).

[0003]

This type of electronic component mounting apparatus requires not only high speed and high mounting accuracy but also simplicity of the apparatus and high reliability of operation. Therefore, the present invention
An object of the present invention is to provide an electronic component mounting apparatus that satisfies such requirements.

[0004]

According to the present invention, there is provided an electronic component mounting apparatus comprising a motor, a first rotating shaft driven by the motor to rotate, and a cylindrical cam mounted on the first rotating shaft. Cam and the second cam, and 9
A second rotating shaft disposed in a twisted direction of 0 °, and a roller mounted on the second rotating shaft and engaged with a cam groove of the first cam; The second
A roller gear for rotating the rotating shaft forward and backward, a head for moving the chip laterally by rotating the second rotating shaft forward and backward, and transferring a chip, and a chip pickup position and a position above the substrate positioning portion, respectively. A presser that is disposed and presses the electronic component vacuum suction nozzle provided on the head that has been moved to the pickup position and the positioning portion from above, a cam follower that engages with the second cam, and a cam follower. And a transmission mechanism for causing the presser to perform an up-down operation by rolling on the cam surface of the second cam.

In the present invention having the above structure, when the motor is driven to rotate the first rotating shaft, the second rotating shaft is rotated forward and backward by the first cam and the roller gear, whereby the head moves the chip to the substrate. It moves in the horizontal direction to mount it on the board positioned by the positioning unit. When the first rotating shaft rotates and the second cam rotates, the pressing element presses the nozzle of the head to cause the nozzle to perform an up-and-down operation, whereby the nozzle picks up and mounts the chip.

[0006]

Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the drive system,
FIG. 3 is a timing chart of the operation.

In FIG. 1, a first head 1 and a second head 2 are mounted on the same back plate 3. Each of the first head 1 and the second head 2 has vertical nozzles 4 and 5 for vacuum-sucking a chip (electronic component). The first head 1 and the second head 2 incorporate a spring that urges the nozzles 4 and 5 upward. Rollers 13 and 14 are mounted on the upper ends of the nozzles 4 and 5, respectively. Below the first head and the second head 2, a chip supply unit 6 is provided.
And a chip displacement correction stage 7 and a substrate positioning section 8 are arranged in a horizontal row. The chip supply unit 6 is provided with a wafer 9.

The first head 1 reciprocates in the horizontal direction between the chip supply unit 6 and the misalignment correction stage 7, and picks up the chips 10 of the wafer 9 by vacuum suction at the lower end of the nozzle 4. It is transferred and mounted on the displacement correction stage 7. Chip 10 mounted on misalignment correction stage 7
, The position shift correction claw 11 is pressed, and the position shift of the chip 10 is corrected. The second head 2 reciprocates in the horizontal direction between the misalignment correction stage 7 and the positioning part 8 of the substrate, and moves the chip 10 having the misalignment corrected on the misalignment correction stage 7 to the lower end of the nozzle 5. It is picked up by vacuum suction, transferred and mounted on the substrate 12 of the positioning unit 8.

The substrate 12 is a printed circuit board or a lead frame. The positioning section 8 is composed of a movable table and moves the substrate 12 in the horizontal direction, thereby mounting the chip 10 vacuum-adsorbed on the nozzle 5 at a predetermined coordinate position.
A description of a vacuum suction system for vacuum suctioning the chip 10 and the like will be omitted.

Next, a first head 1 and a second head 2
A mechanism for reciprocating in the lateral direction and the nozzle 4,
A mechanism for causing the vertical movement 5 to be performed will be described. In FIG. 1, reference numeral 21 denotes a first rotating shaft, which is disposed horizontally. A cylindrical cam 22 as a first cam is mounted at a substantially central portion of the first rotary shaft 21, and a plate cam 23 made of an eccentric cam as a second cam is mounted at a side end thereof. ing. A gear 24 is mounted on the other end of the first rotating shaft 21, and a gear 25 is engaged with the gear 24 (see also FIG. 2). The gear 24 and the gear 25 are a reduction unit. Reference numeral 26 denotes a motor, which rotates the gear 25 by a transmission system such as a belt 27. Therefore, when the motor 26 is driven, the first rotating shaft 21 rotates, and the cylindrical cam 22 and the plate cam 23 simultaneously rotate in the same direction.

In FIGS. 1 and 2, a second rotating shaft 30 is provided in front of the cylindrical cam 22. The second rotating shaft 30 is disposed upright in a direction twisted by 90 ° with respect to the first rotating shaft 21, and a roller gear 31 is mounted on an upper portion thereof. A plurality (six in this example) of rollers 32 are mounted on the peripheral surface of the roller gear 31 at equal intervals. The roller 32 is engaged with a cam groove 28 formed in a large number on the body surface of the cylindrical cam 22. The cylindrical cam 22 is a motor 26
The cam groove 28 is formed so that the roller gear 31 rotates forward and backward by this rotation.

In FIGS. 1 and 2, the second rotating shaft 3
A lever 33 is attached to the lower end of the “0”. FIG. 2
In the figure, the upper half side and the lower half side of the second rotating shaft 30 are drawn with their positions shifted. A base plate 34 is provided below the distal end of the lever 33, and a horizontal guide rail 35 is provided on the base plate 34. A slider 36 slidably fitted on the guide rail 35 is pivotally mounted on the tip of the lever 33 with a pin 37. The back plate 3 is connected to the tip of the base plate 34.

As described above, when the motor 26 is driven and the roller gear 31 rotates forward and backward, the lever 33 rotates 180 ° forward and backward about the second rotating shaft 30 in the horizontal direction. FIG. 2 shows a state where the lever 33 indicated by a chain line is rotated by 180 °. When the lever 33 rotates in the normal and reverse directions, the back plate 3 reciprocates in the horizontal direction between the solid line position and the chain line position in FIG. 2 (arrows a and b). As a result, the first head 1 reciprocates in the horizontal direction (the directions of arrows a and b) between the chip supply unit 6 and the displacement correction stage 7, and the second head 2 moves the displacement correction stage 7 and the substrate. Reciprocate in the horizontal direction (directions of arrows a and b) between the positioning portions 8.

Next, a mechanism for vertically moving the nozzles 4 of the first head 1 and the nozzles 5 of the second head 2 will be described. In FIG. 1, a cam follower 40 is in elastic contact with the plate cam 23. The cam follower 40 is pivotally attached to a tip of a frame 41 bent in a key shape. Reference numeral 42 denotes a spring for urging the frame 41 to make the cam follower 40 elastically contact the peripheral surface of the plate cam 23.

Three rollers 43 are mounted on the frame 41 at pitches. Reference numeral 44 denotes an arm that swings up and down around a pin 45, and a plate 46 that is in elastic contact with the roller 43 is mounted on the upper end thereof. 47 is an arm 4 for making the plate 46 elastically contact the roller 43.
4 is a spring for urging the spring. A first pressing element 51, a second pressing element 52, and a third pressing element 53 are mounted on the distal ends of the three arms 44. The first pressing element 51 is located directly above the chip supply section 6, the second pressing element 52 is located directly above the misalignment correction stage 7, and the third pressing element 53 is located directly above the substrate positioning section 8. It's above.

When the motor 26 drives and the plate cam 23 rotates, the cam follower 40 rolls on the cam surface, whereby the frame 41 moves forward and backward in the direction of arrow c. Then, the plate 46 is pressed by the roller 43, and the arm 44 swings up and down (arrow d) about the pin 45, and the pressing element 5
1 to 53 also swing in the same direction. As described above, when the first head 1 and the second head 2 reciprocate in the horizontal direction, the nozzle 4 selectively moves directly below the first presser 51 and the second presser 52, The nozzle 5 is the second pressing element 5
It moves selectively under the second and third pressing elements 53. Therefore, when the first head 1 or the second head 2 moves to the chip pick-up position of the supply unit 6 or the substrate positioning unit 8, these pressers 51 to 53 move in the above direction (the direction of arrow d). When swinging, the rollers 13 and 14 at the upper ends of the nozzles 4 and 5 are pressed by any of the pressing elements 51 to 53 and descend. It rises due to the spring force of the spring. As described above, the nozzles 4 and 5 move up and down at predetermined positions to pick up and mount the chip 10. In this case, the reciprocating movement of the first head 1 and the second head 2 and the up and down movement of the nozzles 4 and 5 are mounted on the same rotating shaft (first rotating shaft 21) driven by the same motor 26. Since the rotation is performed by the rotation of the cylindrical cam 22 and the plate cam 23, the operations can be accurately synchronized, and a highly reliable operation can be performed.

FIG. 3 shows the second rotary shaft 30 and the frame 4
1 shows the operation timing. In the figure, A is a timing diagram of the second rotating shaft 30. When the first rotating shaft 21 rotates 0 ° to 180 °, the second rotating shaft 30 rotates 180 ° counterclockwise, Head 1 and second head 2 move rightward (in the direction of arrow a in FIG. 2). First
When the rotary shaft 21 rotates by 180 ° to 360 °, the second rotary shaft 21 rotates clockwise, and the first head 1 and the second head 2 move to the left (the direction of the arrow b in FIG. 2). I do.
In FIG. 3, j and k are the stationary sections of the head. In the section j, the first head 1 is stopped on the chip supply unit 6, the second head 2 is stopped on the displacement correction stage 7, and the section k is stopped. In this case, the first head 1 stops on the displacement correcting stage 7 and the second head 2 stops on the positioning portion 8 of the substrate. The timing diagram B is a timing diagram of the frame 41. When the frame 41 advances by the plate cam 23, the first pressing member 51, the second pressing member 52, and the third pressing member 53 are moved through the arm 44. Then, the nozzle of the stopped head is lowered. The present invention is not limited to the above-described embodiment. For example, a single head is used, and the head picks up a chip in a chip supply unit, directly transfers the chip to a substrate positioned in a positioning unit, and mounts the chip. It can also be applied to a component mounting device.

[0018]

The electronic component mounting apparatus of the present invention has a simple mechanism for causing the head to reciprocate in the horizontal direction and a mechanism for causing the nozzle to perform up and down operations. The operation of transporting and mounting on a board can be performed at high speed and with high mounting accuracy.

[Brief description of the drawings]

FIG. 1 is a perspective view of an electronic component mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a drive system of the electronic component mounting apparatus according to the embodiment of the present invention;

FIG. 3 is a timing chart of an operation of the electronic component mounting apparatus according to the embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 1st head 2 2nd head 4, 5 nozzles 6 Chip supply part 7 Chip misregistration correction stage 8 Substrate positioning part 10 Chip 12 Substrate 21 First rotation axis 22 Cylindrical cam (first cam) Reference Signs List 23 plate cam (second cam) 26 motor 28 cam groove 30 second rotating shaft 31 roller gear 33 lever 40 cam follower 41 frame 44 arm 51 first pressing element 52 second pressing element 53 third pressing element

Claims (1)

[Claims] A first rotating shaft that is driven by the motor and rotates; a first cam and a second cam each including a cylindrical cam mounted on the first rotating shaft; and a first rotating shaft. A second rotation axis arranged in a 90 ° twisted orientation with respect to the axis;
A roller gear mounted on a second rotating shaft and engaged with a cam groove of the first cam, and a roller gear for rotating the second rotating shaft forward / reverse by rotation of the first cam; And a head for moving the chip in a lateral direction by rotating the rotation shafts 2 in a forward and reverse direction to transfer the chip, and arranged above the chip pick-up position and the substrate positioning part, and moved to the pickup position and the positioning part. A presser for pressing the electronic component vacuum suction nozzle provided on the head from above, a cam follower engaging with the second cam, and the cam follower rolling on the cam surface of the second cam. An electronic component mounting apparatus, comprising: a transmission mechanism for causing a pressing element to perform an up-down operation.