JPH10163252A - Flip chip mounter - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a flip chip mounter capable of mountiung flip chips on a board at a high speed and with a high positional precision as well. SOLUTION: The position of a flip chip 1 in a tray 3 is recognized by a first recognition unit 7, and is picked up by a first picking up head 12. The first picking up head 12 conveys the flip chip 1 to a first delivery position S1 while flipping it over, and delivers it to a second picking up head 40. The second picking up head 40 delivers the flip chip 1 onto the arm 32 of a second turntable 30. The second turntable 30 conveys the flip chip 1 to a second delivery position S2, and delivers it to a third picking up head 69. After the positions of the flip chip 1 and a board 61 are recognized, the flip chip 1 is mounted on the board 61, and their bonding it performed heating and pressing it.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flip chip mounting apparatus for mounting a flip chip on a substrate with high speed and high positional accuracy.

[0002]

2. Description of the Related Art In recent years, flip chips having bumps have been widely used as elements mounted on various substrates because they are advantageous for high integration of substrates. For this reason, various flip-chip mounting devices have been proposed (for example, Japanese Patent Application Laid-Open No. 2-36597).

[0003]

In recent years, flip chip bumps have been increasingly miniaturized, and flip chips require that the fine bumps be accurately aligned with the electrodes of the substrate and mounted with high positional accuracy. Is done. In addition, in order to increase productivity, it is also required to mount at high speed with good workability. However, flip chip
The technology for mounting on a substrate with high positional accuracy is not yet established.

Accordingly, an object of the present invention is to provide a flip chip mounting apparatus which can mount a flip chip on a substrate at high speed and with high positional accuracy.

[0005]

According to the present invention, there is provided a flip chip mounting apparatus for recognizing a position of a flip chip supply portion and a position of the flip chip provided with the bumps facing upward in the flip chip supply portion. And a recognition unit for
A first pickup head for picking up the flip chip, a first transfer means for moving the first pickup head to a first delivery position, and a movement of the first pickup head to the first delivery position Upside down inverting means for inverting the first pickup head up and down to flip the bumps of the flip chip during the operation, a second pickup head for receiving a flip chip from the first pickup head at a first transfer position, and a substrate A movable table for moving the flip chip to a predetermined position, and a flip chip for receiving the flip chip held at the first pickup head at the first transfer position, and transferring the flip chip to a second transfer position above the movable table. A second transfer means and a second transfer means at the second delivery position.
A third pickup head for picking up a flip chip transferred from the pickup head to the second transfer means and conveyed to the second transfer position by the second transfer means, and mounting the flip chip on a substrate on a movable table; , Third
And a second recognition unit for recognizing the position of the flip chip picked up by the pickup head and the position of the substrate on the movable table.

[0006]

According to the present invention having the above-described structure, the first
Working units such as a pickup head, a second pickup head, a third pickup head, a first transfer unit, and a second transfer unit share roles and cooperate with each other to prepare for a flip chip supply unit. The flip chip thus obtained can be mounted on the substrate on the movable table with good workability and high positional accuracy.

Hereinafter, an embodiment of the present invention will be described with reference to the drawings. FIG. 1 is a side view of a flip chip mounting apparatus according to an embodiment of the present invention, FIG. 2 is a plan view of the flip chip mounting apparatus, and FIG. 3 is a third pickup head of the flip chip mounting apparatus. Partial sectional view, FIG.
FIG. 4 is an explanatory view of a flip chip transfer process in the flip chip mounting apparatus.

First, the overall structure of a flip chip mounting apparatus will be described with reference to FIGS. The flip chip 1 is stored in the tray 3 with the bumps 2 facing upward. The tray 3 is placed on a holding table 4, and the holding table 4 is placed on a first movable table 5. The above components constitute the flip chip supply unit 6. When the first movable table 5 is driven, the flip chip 1 in the tray 3 moves to the pickup position P. Above the tray 3, the flip chip 1
Recognition unit 7 consisting of a camera for recognizing
Is provided.

In FIG. 2, reference numeral 10 denotes a first turntable as first transfer means, which extends radially.
It has a book arm 11. A horizontal rotating shaft 16 (FIG. 1) is provided inside each arm 11, and a first pickup head 12 is mounted at a tip end thereof. The first pickup head 12 has a nozzle 13 for vacuum-sucking the flip chip 1.

In FIG. 1, a bevel gear 14 is provided at the base end of each rotating shaft 16. Reference numeral 15a denotes a fixed bevel gear that is non-rotatably coupled to the lower end of the vertical fixed shaft 15. Each bevel gear 14 meshes with a fixed bevel gear 15a at a 1: 1 gear ratio. Above the arm 11, a pulley 17 integrated with the arm 11 is provided on a fixed shaft 15 via a bearing so as to be rotatable about the fixed shaft 15. Reference numeral 18 denotes a motor, and a pulley 19 is mounted on a rotating shaft thereof. A timing belt 20 is tuned to the pulleys 17 and 19. Reference numeral 21 denotes a bearing provided at an appropriate position.

Accordingly, when the motor 18 is driven, the arm 11 rotates horizontally about the fixed shaft 15 in the direction of arrow A (FIG. 2). When the arm 11 rotates, the bevel gear 14 mounted on the rotating shaft 16 also rotates while meshing with the fixed bevel gear 15a, and the rotating shaft 16 rotates about its axis (arrow B). Therefore, when the arm 11 rotates by 180 ° about the fixed shaft 15, the nozzle 13 that has vacuum-adsorbed the flip chip 1 of the tray 3 becomes 180 ° around the rotation shaft 16.
The flip chip 1 is turned upside down to turn the bump 2 downward. At the same time, the first pickup head 12 transfers the flip chip to the first transfer position. That is, arm 11, bevel gear 14, fixed shaft 15, fixed bevel gear 15a, rotating shaft 16, pulley 1
7, a first turntable 10 composed of a motor 18, a pulley 19, a timing belt 20, and the like turns the first pickup head 12 upside down to turn the flip chip 1 vacuum-adsorbed to the nozzle 13 upside down. The reversing means also serves as a first transfer means for transferring the flip chip 1 held by the first pickup head 12 to the first transfer position S1.

A second turntable 30, which is a second transfer means, is provided on a side of the first turntable 10. From a vertical rotation axis 31 at the center of the second turntable 30, one flip chip transfer arm 32 and a number of adsorbent transfer arms 33 extend radially. The rotating shaft 31 is driven and rotated by a motor 34, whereby the arms 32 and 33 are horizontally rotated. A holding portion 32 a for holding the flip chip 1 is formed at the tip of the arm 32.

In FIG. 1, a first turntable 10
Above the boundary between the second turntable 30 and the second
Pickup head 40 is provided. The second pickup head 40 has a nozzle 41. Second
Pickup head 40 is vertically movably mounted on a vertical guide rail 43 provided on the front surface of a block 42. A vertical movement mechanism (not shown) built in the Z table 42 by driving a motor 44 is provided. When activated, it moves up and down along the guide rail 43.

In the second pickup head 40,
A motor 45 for rotating the nozzle 41 about its axis is provided. By rotating the nozzle 41 about its axis, the flip chip 1 vacuum-adsorbed to the lower end of the nozzle 41 is horizontally rotated. , The direction of rotation of the flip chip 1 is corrected. The block 42 is held by a moving table 46, and when the motor 47 is driven, the block 42 and the second pickup head 40 move horizontally in the Y direction.

In FIG. 1, a second turntable 30
A block 50 is mounted below the rotary shaft 31. A guide rail 51 is provided on the lower surface of the block 50. Reference numeral 52 denotes a second recognition unit having a built-in camera, and a lens barrel 53 extends forward. The second recognition unit 52 is mounted on a guide rail 51 via a slider 54. When a driving unit (not shown) built in the block 50 is driven, the second recognition unit 52 and the lens barrel 53 are guided. It moves horizontally in the Y direction along the rail 51.

In FIG. 1, a first turntable 10
The lower part of the second turntable 30 on the opposite side
Movable table 60 is disposed. The second movable table 60 adjusts the position of the substrate 61 by horizontally moving the substrate 61 placed thereon in the X direction or the Y direction. That is, the second movable table 60 serves as a substrate positioning portion.

In FIG. 1, a third pickup head 69 is provided above the second movable table 60. A heater 71 is attached to a nozzle portion 70 projecting downward from the third pickup head 69, and an adsorber 72 is detachably attached to a lower end portion of the nozzle portion 70. In FIG. 3, a first suction path 73 is formed at the center inside the nozzle unit 70. The first suction path 73 communicates with a suction hole 74 formed in the suction element 72. Therefore, the flip chip 1 is vacuum-sucked on the lower surface of the suction element 72 by the suction force of the suction holes 74.

A second suction path 75 is formed inside the nozzle section 70, and the suction element 72 is detachably vacuum-adsorbed to the lower surface of the nozzle section 70 by the suction force of the second suction path 75. You. The first suction path 73 and the second suction path 75
It is connected to a pneumatic device (not shown).

In FIG. 1, a slider 75 is mounted on a side surface of the third pickup head 69. The slider 75 is fitted on a vertical guide rail 76 provided on the front surface of the block 77. When the vertical movement means (not shown) provided in the block 77 is driven, the third pickup head 69 moves up and down along the guide rail. The third pickup head 69 performs only the up-down operation as described above, and does not perform the operation in the horizontal direction. The reason is as follows.

That is, the third pickup head 69
Performs the lowering operation to press and bond the bumps 2 of the flip chip 1 vacuum-adsorbed on the lower surface of the adsorber 72 to the electrodes of the substrate 61. In this case, all the bumps 2 of the flip chip 1 are pressed evenly. Since the pressure must be pressed against the substrate 61, the lower surface of the adsorber 72 needs to have a perfect horizontal surface. Therefore, the third pickup head 69 is required to have strict rigidity and uprightness.
(In the present embodiment, the block 77) of the pickup head 69 must be strong. Therefore, the third pickup head 69 is firmly fixed to a rigid block 77 fixed (that is, not a movable table).

This flip chip mounting apparatus has the above-described configuration. Next, the entire operation will be described. In FIG. 1, a first recognition unit 7 recognizes the position of a predetermined flip chip 1 in the tray 3, and drives the movable table 5 to move the predetermined flip chip 1 to the first pickup head according to the recognition result. 12 to the pickup position P. Note that the first recognition unit 7
The center of the flip chip 1 is detected from the outer shape.
Then, the movable table 5 moves the flip chip 1 in the X direction or the Y direction so that the center M of the flip chip 1 is located immediately below the nozzle 13 of the first pickup head 12 (FIG. 4A). In FIG. 4A, Δ
θ is a shift amount of the flip chip 1 in the rotation direction.

Next, when the first turntable 10 rotates, the first pickup head 12 is moved above the flip chip 1, and the nozzle 13 moves up and down. The flip chip 1 is picked up by vacuum suction. In this case, the movable table 5 is driven as described above to
Is adjusted, the nozzle 13 is connected to the flip chip 1
Vacuum the center correctly. The means for moving the nozzle 13 up and down is built in the first pickup head 12.

Next, when the motor 18 is driven, the turntable 10 is pitch-rotated in the direction of arrow A (FIG. 2).
The flip chip 1 that has been picked up is transported below the second pickup head 40.
By the action of the bevel gear 14 and the fixed bevel gear 15a, the bevel gear 15a is rotated around the axis thereof in the direction of arrow B, the nozzle 13 is turned upward, the flip chip 1 is turned upside down, and the bump 2 is turned downward. FIG. 4B shows the flip chip 1 at this time.
Is a plan view, but Δθ remains at this point.

Next, referring to FIG. 1, the nozzle 41 of the second pickup head 40 moves up and down to pick up the flip chip 1 at the upper end of the nozzle 13. next,
If the second pickup head 40 picks up the flip chip 1, the motor 45 is driven to rotate the nozzle 41 according to the recognition result of the first recognition unit 7, so that the rotation direction of the flip chip 1 is shifted. The position correction of the amount Δθ is performed. In addition, the second turntable 30 rotates, and the tip of the arm 32 moves directly below the second pickup head 40 (FIG. 4C). Therefore, the second pickup head 40 moves up and down,
The flip chip 1 is delivered on the arm 32. That is, the position of the nozzle 41 of the second pickup head 40 is determined by the flip chip 1 and the first pickup head 12.
From the first pickup head 40 to the second pickup head 40, and from the second pickup head 40 to the arm 32 at the first transfer position S1.

Next, the second turntable 30 is set at 180 °.
After rotating horizontally, the flip chip 1 is transported immediately below the third pickup head 69. The arm 32 indicated by a chain line in FIG. 1 shows this state (FIG. 4C).
See also). Next, the third pickup head 69 moves up and down, and the flip chip 1 is vacuum-adsorbed to the lower surface of the adsorber 72 and picked up. That is, immediately below the third pickup head 69, the armature 32 moves the adsorber 7.
2 where the flip chip 1 is transferred to the second transfer position S2
It has become.

Next, the arm 32 retreats from immediately below the third pickup head 69, and the second recognition unit 52 advances toward the flip chip 1 vacuum-adsorbed by the adsorber 72 to move the tip of the lens barrel 53. The flip chip 1 is moved to a position immediately below the flip chip 1, and the position of the flip chip 1 is recognized. This position recognition is performed by observing a characteristic portion of the flip chip 1 such as the bump 2. The second recognition unit 52 also recognizes the position of the substrate 61 by observing the characteristic portion of the substrate 61.

Next, according to the result of the position recognition, the second movable table 60 is driven to move the substrate 61 in the X direction or the Y direction.
The flip chip 1 is horizontally moved in the direction of FIG. Next, the first pickup head 69 is lowered to land the bump 2 of the flip chip 1 on the electrode of the substrate 61, and in this state, the bump 2
Is pressed against the electrode while being heated, and bonded to the electrode. In this case, as described above, since the third pickup head 69 is firmly mounted on the strong block 77, the horizontal surface of the lower surface of the adsorber 72 is maintained, and all the bumps 2 are pressed against the substrate 61 with an equal pressing force. Can be bonded by pressing against the electrode. Next, the third pickup head 69 is raised, and a series of operations is completed.

When the flip chip 1 on the arm 32 is picked up by the third pickup head 69, the flip chip 1 needs to be correctly positioned directly below the adsorber 72. This is because when the center of the flip chip 1 is displaced from the center of the adsorber 72 and the flip chip 1 is picked up by the adsorber 72, all the bumps 2 of the flip chip 1 are evenly pressed on the electrodes of the substrate 61. This is because bonding cannot be performed by pressing with pressure. Therefore, next, a method for correctly picking up the flip chip 1 by the adsorber 72 without displacement will be described.

The positional deviation between the center M of the flip chip 1 and the center (preliminarily detected) of the flip chip 1 from the position of the flip chip 1 recognized by the second recognition unit 52 after being vacuum-sucked by the suction element 72 is determined. Ask. Since this positional deviation has a certain tendency, the positional deviation of the flip chip 1 currently sucked by the attraction element 72 is fed back when the next flip chip 1 is transferred to the arm 32 by the second pickup head 40. Can be used as data. That is, the above-described positional deviation is fed back to the control units (not shown) of the motor 34 and the motor 47. The displacement in the X direction is corrected by adjusting the rotation angle of the turntable 30 driven by the motor 34, and the displacement in the Y direction is driven by the motor 47 to move the second pickup head 40 in the Y direction. Correct by moving. By this correction, the holding position of the flip chip 1 with respect to the holding portion 32a of the arm 32 is adjusted such that the center of the flip chip 1 held by the arm 32 is attracted when the arm 32 moves below the third pickup head 69. Change to match the center of the child 72. Of course, the X-direction moving table may be combined with the Y-direction moving table 46 to correct the X-direction positional deviation with the X-direction moving table.

As described above, the second recognition unit 52
When the motors 34 and 47 are controlled in accordance with the data obtained in the step (a), the position of the flip chip 1 transferred to the third pickup head 69 is corrected, and the flip chip 1 is correctly picked up by the suction hole 72, and Can be bonded to the substrate 61 with a uniform pressing force.

Incidentally, the size of the flip chip mounted on the substrate varies in size, and it is desirable to replace the adsorber 72 depending on the type (size) of the flip chip. Therefore, next, a method of replacing the adsorber 72 will be described.

In FIG. 2, various types of adsorbents 72 are mounted on the distal ends of a large number of arms 33. When the arms 33 are rotated horizontally, the desired distal ends of the arms 33 are moved to the third position. It can be moved directly below the pickup head 69. Therefore, when replacing the adsorber 72, the empty arm 33 is first moved to a position immediately below the third pickup head 69, and the third pickup head 69 is moved up and down.
The adsorber 72 vacuum-adsorbed to the lower surface of the arm 3
Place on 3 and collect. Next, the arm 33 on which the desired attraction element 72 is mounted is moved to a position immediately below the third pickup head 69, and the third pickup head 69 is again moved there.
Perform upward and downward movements, and attach the adsorbent 72 to the nozzle 70
Vacuum suction on the lower surface of the. As described above, the replacement of the adsorber 72 can be performed skillfully.

[0033]

According to the present invention, the working units such as the first pickup head, the second pickup head, the third pickup head, the first turntable, the second turntable, etc., respectively share the roles. The flip chips provided in the flip chip supply unit can be mounted on the substrate on the movable table with good workability and high positional accuracy while cooperating with each other.

[Brief description of the drawings]

FIG. 1 is a side view of a flip chip mounting apparatus according to an embodiment of the present invention.

FIG. 2 is a plan view of a flip chip mounting apparatus according to an embodiment of the present invention.

FIG. 3 is a partial cross-sectional view of a third pickup head of the flip chip mounting apparatus according to one embodiment of the present invention;

FIG. 4 is an explanatory diagram of a flip chip transfer process in the flip chip mounting apparatus according to one embodiment of the present invention;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Flip chip 2 Bump 5 1st movable table 6 Flip chip supply part 7 1st recognition unit 10 1st turntable 12 1st pickup head 13 Nozzle 30 2nd turntable 32,33 Arm 40 2nd Pickup head 46 Moving table 51 Second recognition unit 60 Second movable table 61 Substrate 69 Third pickup head 72 Adsorber S1 First transfer position S2 Second transfer position

Claims (1)

[Claims] A first recognition unit for recognizing a position of a flip chip provided with a flip-chip supply part with a bump facing upward, and a first pickup for picking up the flip chip. A pickup head, first transfer means for moving the first pickup head to the first delivery position, and a first pickup head for moving the first pickup head to the first delivery position. Upside down means for inverting the flip chip to turn the flip chip bumps downward;
A second pickup head for receiving a flip chip from the first pickup head at the delivery position of
A movable table for moving a substrate to a predetermined position, and a flip chip held by the first pickup head at a first transfer position are received, and the flip chip is transferred to a second transfer position above the movable table. A second transfer unit, and a flip chip that is transferred from the second pickup head to the second transfer unit at the second transfer position and conveyed to the second transfer position by the second transfer unit. A third pickup head that is picked up and mounted on the substrate on the movable table, and a second recognition unit that recognizes a position of the flip chip picked up by the third pickup head and a position of the substrate on the movable table. A flip chip mounting apparatus comprising: