JP2558933B2 - Outer lead bonding machine - Google Patents

Description

The present invention relates to a plurality of IC chips bonded to the center of an inner lead wire of a carrier tape having a plurality of inner lead wires and a plurality of outer lead wires. Outer lead bonding apparatus for punching a lead wire and cutting it into individual pieces, and soldering a plurality of external lead wires of the individual pieces in accordance with a wiring pattern formed on a substrate to form an electric circuit Is.

2. Description of the Related Art A conventional outer lead bonding apparatus has a structure in which one type of carrier tape to which an IC chip is bonded is punched into individual pieces, and the one type of individual pieces is soldered in accordance with a wiring pattern formed on a substrate. It was a thing. Therefore, a heating head having a structure in which a transfer mechanism for adsorbing the individual pieces and transferring them to the substrate and a heating mechanism for soldering are integrated and an adsorption nozzle is attached to the center of one or two pairs of heating chips is It was an apparatus configured to adsorb, transfer, and heat individual pieces.

Problems to be Solved by the Invention In recent years, there is a growing demand for outer lead bonding apparatuses capable of soldering different types of IC chips on a substrate. It is difficult and time-consuming to replace the heating head, and because the transfer mechanism and heating mechanism are integrated, it is not possible to move to the next operation such as taking out the individual piece to be soldered until the soldering is completed. It was taking time.

Further, in order to align and solder the individual external lead wires of the IC chip and the wiring pattern on the board using the recognition means, the tip surface of the heating chip is made to follow the inclination of the board, There has been a problem that uniform and stable soldering cannot be obtained unless the contact state between the external lead wire and the wiring pattern is uniform.

The present invention eliminates the above-mentioned conventional drawbacks, and an outer lead bonding that allows individual pieces of various types of IC chips to be soldered on a substrate in a normal and stable state and is excellent in productivity. The purpose is to provide a device.

Means for Solving the Problems To solve the above problems, the present invention provides a plurality of external leads connected to the plurality of internal lead wires of a carrier tape having an IC chip bonded to the center of the plurality of internal lead wires. A plurality of types of dies that are selectably provided for punching lead wires into individual pieces, and the individual pieces punched by the dies are taken out by suction means and conveyed to the position of the recognition camera. A transfer having an individual piece take-out mechanism and further having a suction nozzle for sucking up the individual piece conveyed to the recognition position, and means for rotating the suction nozzle, moving up and down, and transferring to a position of an arbitrary wiring pattern on the substrate. Mechanism, a recognition camera for recognizing the position of the external lead wire of each piece sucked by the suction nozzle at the recognition position, and an XY table for moving the board to an arbitrary position. And a heating mechanism for soldering the wiring patterns on the board transferred to an arbitrary position and the external lead wires of the individual pieces. The heating mechanism individually moves up and down and moves 90 degrees. It has two sets of rotatable heating heads and two heating chips arranged in each heating head so as to face each other, and these two heating chips are closely spaced from each other in synchronization in each heating head. The transfer mechanism and the heating mechanism are movable and independent of each other.

Action With the above configuration, one outer lead bonding device can solder various types of carrier tapes with IC chips onto the substrate in a normal and stable state, and productivity can be improved by shortening the soldering time. It will be possible.

Embodiment An embodiment of the present invention will be described below with reference to the drawings.

5A and 5B are perspective views showing a state in which a part of the carrier tape 1 to which the IC chip 5 is bonded and the punched piece 2 are soldered on the substrate 4. I c
The chip 5 is bonded to the center of the carrier tape 1, and its electrode portion (not shown) is connected to the inner portion of the outer lead wire 3, that is, the inner lead wire. The external lead wire 3 is formed by extending in the direction. The carrier tape 1 is an example, and there are cases where the external lead wires 3 are drawn out only in two directions.

FIG. 1 is a perspective view showing an embodiment of an outer lead bonding apparatus of the present invention, and the structure of the apparatus main body 10 is shown in FIG. The carrier tape 1 is the reel 7 of the cassette 8.
Supplied in the rolled state. The carrier tape 1 is pulled out from the reel 7 by the unwinding roller 9 and sent to the mold 11. It is possible to arrange one or more sets of the cassette 8 and the mold 11 according to the type of the carrier tape 1, and the carrier tape 1 is externally arranged by the mold 11 arbitrarily selected from the plurality of types. The lead wire 3 is punched out to form a piece 2 which is a mold 11
Is sucked up at the top of the. On the other hand, the individual piece take-out mechanism 12 has a suction table 13 at the tip, and after the individual piece take-out mechanism 12 moves to the position of the die 11 that holds the punched piece 2, this suction table 13 is moved to the die 11 side. Inserted in between. Next, the suction table 13 is moved up and down to adsorb and take out the back surface of the individual piece 2,
It moves to the position of the recognition camera 14 and waits. The recognition camera 14 is attached to the slider 15 and allows the position setting to be changed. A slide block 21 that moves back and forth is attached to the transfer mechanism 16 that is driven by the drive motor 18,
Further, the suction nozzle 22 is attached to the tip thereof.
The suction nozzle 22 has a structure capable of moving up and down by a pulse motor 19, and can move in the direction shown by an arrow 17 together with the forward and backward movement of the slide block 21, and has moved to a position above the suction table 13. After that, it descends and sucks the piece 2. On the other hand, the suction table 13 moves to the position of the next mold. Next, recognition work is performed by the recognition camera 14, and the external lead wire 3 of the piece 2 sucked by the suction nozzle 22 is in the X direction, Y direction.
The difference between the direction of rotation and the direction of rotation is measured, and the necessary correction amount is stored as data. If the external lead wire 3 is misaligned in the rotation direction, the suction nozzle 22 is rotated by the rotation motor 20 to make a correction. Next, the suction nozzle 22 moves in the front direction of the arrow 17 to the center 24 of the heating head 23.

The substrate 4 of FIG. 1 is placed on the XY table 45, and an arbitrary wiring pattern 6 and the center 24 of the heating head 23 are provided.
It is conveyed by the XY table 45 to a position where and coincide with each other. At this time, the correction data amount of the external lead wire 3 is added and the XY table 45 moves to correct the deviation.

FIG. 3 is a perspective view showing the heating mechanism 25, which has two heating heads 23 and two sets of heating chips 26. The two sets of heating chips 26 are attached with the tips having different lengths so as to correspond to the width direction of the external lead wire 3 of the individual piece 2. Switching of the heating head 23 used for soldering can be easily performed by moving the entire heating mechanism 25 left and right by the slide shaft 30 and the motor 29.
The heating head 23 has a slider 33 for moving up and down, a drive motor 31, a ball screw 32, a disk 27 rotatable in the heating head 23 by 90 degrees, and a motor 34 for rotating the disk 27.

The two sets of heating chips 26 are arranged at the same distance from the center 24 of the disk 27, that is, the same position as the center 24 of the heating head 23, respectively.
The structure is such that they can move closer to and away from each other in synchronization with 35. That is, the fourth part of the main part of the heating head 23 is enlarged.
Disk 27 with a square through hole formed in the center as shown
A width-shifting motor 35 is mounted on the upper side through a mounting piece 28, and the width-shifting motor 35 rotates a ball screw 38 through gears 36a and 36b to move a U-shaped slide block 39 along a slide shaft 37. It is designed to slide. Further, since one end side of each of the two slide shafts 37 is fixed to the pair of slide blocks 39 facing each other, the two slide shafts are connected to each other by the connecting lever 46 pivotally supported by the support shaft 44. Connect one end of each of 37,
By sliding the two slide shafts 37 in opposite directions with each other by one width-adjusting motor 35, the pair of slide blocks 39 can be moved close to and away from each other in synchronization.

As shown in FIG. 4, FIG. 6 and FIG. 7, a U-shaped parallel leaf spring block is provided at the center of the slide block 39.
47 is fixed and this parallel leaf spring block 47 is a heating chip
Two leaf springs 47a and 47d having a rectangular cross section are provided between the front portion for mounting 26 and the rear portion fixed to the slide block 39, and two leaf springs 47a and 47b are provided above and two leaf springs 47c and 47d are provided below. ), Each of which is connected and mounted in parallel. 6 and 7 are heating chips for soldering.
FIG. 27 is a side view showing the operation of 26.

The heating tip 26 is urged by a pressure cylinder 54 to urge the other end of a pressure lever 48, one end of which is pivotally supported by a slide block 39, through a bearing 55 attached to the center of the pressure lever 48. Pressed downward. Also, the sixth
As shown in FIG. 7 and FIG. 7, the two adjusting bolts 50 are attached to both sides of the front part of the parallel leaf spring block 47 having the heating tip 26 attached thereto, and are brought into contact with the protrusions 51 of the slide block 39 to thereby initialize the initial stage. It is a mechanism to adjust the parallelism. The tip of the heating chip 26 is arranged so as to project below the disc 27 in the portion of the through hole in the center of the disc 27, and at the time of soldering, only the tip of the heating chip 26 is lowered as the heating head 23 descends. Contact the external lead wire 3 and the wiring pattern 6.

A pair of such components are arranged on the disk 27 so as to face each other to form the heating head 23.

At the time of soldering, the two heating chips 26 are automatically moved close to and separated from each other by the suction nozzle 22 according to the size of the piece 2 transferred onto the substrate 4 in accordance with the wiring pattern 6. , Take a predetermined interval. Then, the entire heating head 23 descends, the tip of the heating chip 26 contacts the external lead wire 3 and the wiring pattern 6, and soldering is performed. Thus
After soldering the parts in the two directions of the external leads 3 in the four directions of the piece 2, the entire heating head 23 is raised by a predetermined height, and the two heating chips are rotated by 90 ° of the disk 27.
26 also rotates 90 °. In this state, the whole heating head 23 descends again, and the remaining two-direction portions of the piece 2 are soldered. While performing this soldering work, the suction nozzle 22
Moves to the upper side of the suction table 13 and then moves to the suction operation of the piece 2 to be soldered.

Next, a mechanism for automatically aligning the leaf springs 47a to 47d will be described with reference to FIGS. 6 and 7. Figure 6 shows XY table 4
5 shows a state in which the substrate 4 placed on the substrate 5 is inclined by Δθ due to dust 52 or the like. 53 is an initial pressing point at which the heating head 23 descends and the heating chip 26 first contacts the external lead wire 3 on the substrate 4. At the time of this first contact, the adjusting bolt 50 is the protrusion of the slide block 39. It still hits 51.
FIG. 7 shows a state in which the heating head 23 is further lowered by Δh. The heating chip 26 sequentially presses the other external lead wires 3 while maintaining the contact state at the initial pressing point 53, and the heating chip 26 can perform uniform pressing along the tilted substrate 4. At this time, the leaf springs 47a to 47d move vertically and laterally by a small amount. Therefore, these four leaf springs
47a to 47d are preferably elastic bodies having a rectangular or circular cross section.

EFFECTS OF THE INVENTION As described above, according to the present invention, the transfer mechanism and the heating mechanism are separated from each other in response to the demand for the outer lead bonding apparatus capable of soldering different kinds of IC chips on one substrate. By independently operating the two heating chips and automatically moving the two heating chips close to each other and moving them up and down, the respective operations can be performed in parallel so that the time can be shortened by about 5 seconds. ICs of various sizes
It is possible to deal with individual chips without changing the heating head by selecting a heating chip having a suitable tip length and moving the two heating chips close to each other. Further, by connecting the heating chip and the slide block with four parallel leaf springs, the heating chip can uniformly press along the inclination of the substrate. It can be applied to many kinds of IC chips, and stable soldering can be obtained. Furthermore, it is possible to greatly improve the productivity.

[Brief description of drawings]

FIG. 1 is a perspective view of an outer lead bonding apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the structure of the main part thereof.
FIG. 3 is a perspective view of the heating mechanism, FIG. 4 is a perspective view of an essential part of the heating head portion, and FIGS. 5 (a) and 5 (b) are punched out with a part of a carrier tape to which an IC chip is bonded. 6 and 7 are side views showing the operation of the heating chip during soldering, in which the individual pieces are soldered to the substrate. 1 ... Carrier tape, 2 ... Piece, 3 ... External lead wire, 4 ... Substrate, 5 ... IC chip, 6 ... Wiring pattern, 7 ... Reel, 8 ... Cassette, 9 ... Winding Take-out roller, 10 ... Device main body, 11 ... Mold, 12 ... Individual pick-out mechanism, 13 ... Suction table, 14 ... Recognition camera, 15 ... Slider, 16 ... Transfer mechanism, 17 ... Arrow , 18 ... Drive motor, 19 ... Pulse motor, 20 ... Rotation motor, 21 ... Slide block, 22 ... Suction nozzle, 23 ... Heating head, 24 ... Center, 25 ... Heating mechanism, 26 ... … Heating tip, 27 …… disc, 28 …… mounting piece, 29 …… motor, 30 ……
Slide shaft, 31 …… Drive motor, 32 …… Ball screw, 33
...... Slider, 34 …… Rotating motor, 35 …… Width adjusting motor, 36a, 36b …… Gear, 37 …… Slide shaft, 38 …… Ball screw, 39 …… Slide block, 44 …… Spindle, 45…
… XY table, 46 …… Coupling lever, 47 …… Parallel leaf spring block, 47a, 47b, 47c, 47d …… Leaf spring, 48 …… Pressure lever, 50 …… Adjustment bolt, 51 …… Protrusion, 52 ……garbage,
53 …… Initial pressing point, 54 …… Pressurizing cylinder, 55 …… Bearing.

 ─────────────────────────────────────────────────── ─── Continuation of front page (56) Reference JP-A-2-226739 (JP, A) JP-A-63-20846 (JP, A) JP-A-63-40328 (JP, A) JP-A-2- 22835 (JP, A) JP-A-2-133938 (JP, A) JP-A-2-186652 (JP, A)

Claims (3)

(57) [Claims] 1. A method of punching out a plurality of external lead wires connected to the plurality of inner lead wires of a carrier tape having an IC chip bonded to the center of the plurality of inner lead wires, and selecting the individual lead wires to separate them. Equipped with a plurality of types of dies that can be provided and an individual piece take-out mechanism for taking out the individual pieces punched by the molds by suction means and conveying them to the position of the recognition camera, and further to the recognition position. A suction nozzle that sucks up the conveyed individual pieces, a transfer mechanism that has a means for rotating the suction nozzle, moving up and down, and transferring to a position of an arbitrary wiring pattern on the substrate, and a suction mechanism that sucks the suction nozzle at the recognition position. A recognition camera that recognizes the position of each external lead wire, an XY table for moving the board to an arbitrary position, and wiring on the board transferred to the arbitrary position. It is composed of a heating mechanism for soldering the pattern and the external lead wires of the above-mentioned individual pieces, and this heating mechanism individually has two sets of heating heads that can move up and down and rotate by 90 degrees, and inside each heating head. Two heating chips are arranged so as to face each other, and these two heating chips can be moved close to and away from each other synchronously in each heating head, and the transfer mechanism and the heating mechanism are mutually arranged. An outer lead bonding device characterized by being separated and independent. 2. The two sets of heating heads are capable of mounting two heating chips of two kinds each having a different tip length corresponding to a plurality of external lead wire widths of the individual pieces. The outer lead bonding apparatus described. 3. Two heating chips arranged facing each other in the heating head and capable of moving close to and away from each other in synchronization are provided with four pins or four pins between a slide block holding each heating chip. A structure in which leaf springs having a rectangular cross section are connected so as to be parallel to each other, and the two heating chips can be independently pressed downward from the upper surface by a cylinder or the like via a pressure lever and a bearing. The outer lead bonding apparatus according to (1) or (2).