JP3126140B2 - Eutectic bonding apparatus and eutectic bonding method for bare chip - Google Patents

Description

Description: TECHNICAL FIELD The present invention relates to an apparatus and a method for eutectic bonding of bare chips, and more particularly, to a means for cutting a bonding tape and transferring and mounting the same on a substrate.

(Prior Art) As a eutectic bonding device for mounting a bare chip on a substrate heated to a eutectic temperature, a bonding tape is cut into a predetermined length by a cutting device, and a cut piece of tape is cut by a nozzle of a tape transfer head. It is known to take up by suction, transfer this tape piece to a substrate, and then mount a bare chip on the tape piece.

(Problems to be Solved by the Invention) However, the conventional eutectic bonding apparatus has a problem in that the cutting of the bonding tape by the cutting apparatus is not stable, and it is difficult to take up the cut piece of tape with a nozzle. . In particular, when the bonding tape is cut short to accommodate a small bare chip, the cut piece of tape is surely sucked by the nozzle and hardly taken up.

Therefore, an object of the present invention is to provide a eutectic bonding means capable of solving the problems of the conventional means.

Means for Solving the Problems The present invention provides a bare chip supply device, a substrate positioning unit provided with a substrate heating device, a bonding head for bonding the bare chip of the supply device to the substrate, and a bonding tape. Eutectic bonding of bare chips comprising a supply device, a cutting device for cutting the bonding tape derived from the supply device, and a tape transfer head for sucking the cut piece of tape onto a nozzle and transferring it to the substrate. A first holding member and a second holding member for holding the bonding tape led out from a supply reel from above and below, and a first holding member and a second holding member. Forward / backward drive device for moving forward / backward, and holding / releasing the bonding tape between the first holding member and the second holding member And a driving device for holding and releasing the holding tape, wherein the first holding member and the second holding member hold the bonding tape and feed the bonding tape to the cutting device at a pitch. A support block for supporting the bonding tape led from the supply reel from below, a pressing block for pressing the bonding tape against the support block by being driven up and down by driving means, and A cutting block on the side of the block, the cutting block being moved up and down by being driven by up and down moving means, the support block, the pressing block, and the cutting edge being formed at the joining edge of the cutting block; When the nozzle of (1) lands on the bonding tape on the cutting block and rises, this tape transfer Head integrally raised the cutting block the bonding tape is cut by the blade unit,
The cut piece of tape was sucked up by the nozzle and taken up.

(Operation) In the above configuration, the bonding tape led out from the supply reel is pitch-fed to the cutting device while being held / released from above and below by the first holding member and the second holding member. Then, the bonding tape is sandwiched between the support block and the pressing block of the cutting device, and in this state, the nozzle of the tape transfer head lands on the bonding tape on the cutting block provided on the side of the support block, and While raising the tape transfer head integrally, the bonding tape is cut by a blade portion provided at the joining edge of the support block, the pressing block, and the cutting block, and the cut tape piece is sent to the nozzle. It takes up by suction, and is transferred and mounted on the substrate positioned by the positioning unit.

Example Next, an example of the present invention will be described with reference to the drawings.

FIG. 1 is a front view of the eutectic bonding apparatus. A is a basic machine in which a sub-transfer head 7, a bonding head 8, and a tape transfer head 9 are arranged in parallel on the front surface of a main body 20 thereof. Each head 7 ~
Reference numeral 9 denotes the nozzles 22 and 23 for sucking the bare chip P and the tape pieces 5
It has a nozzle 24 for sucking 2a (described later). The nozzle 24 is provided with a stopper 24a that abuts a shoulder of a pressing block 91 (described later).

Reference numeral 13 denotes a drive unit provided below the side of the basic machine A, and 14, 15, and 16 denote rods, rockers, and rods driven by the drive unit 13. When the drive unit 13 is driven, the rod 14 By moving up and down and swinging the rocker 15, the above 3
The heads 7 to 8 slide reciprocally in the horizontal direction along the guide 10 provided on the front surface of the main body 20 at the same time.

At the lower part of the basic machine A, a supply device 1 for the bare chip P, a displacement correction stage 2 for the bare chip P,
The positioning portion 3 of the substrate 11 and the supply device 4 and the cutting device 5 for the bonding tape 52 (described later) are arranged side by side at intervals. As described above, when the three heads 7 to 9 simultaneously reciprocate in the horizontal direction, the sub-transfer head 7 transfers the bare chip P of the supply device 1 to the correction stage 2, and
The bonding head 8 transfers the bare chip P, the position of which has been corrected by the correction stage 2, to the substrate 11, and the tape transfer head 9 transfers the tape piece 52 a (described later) of the supply device 4 to the substrate 11.

The supply device 1 is configured by mounting a rotating device 36 on an XY table 35 and mounting a turntable 37 on the rotating device 36. A plurality of chip supply units equipped with bare chips P such as wafers 38 are mounted on the turntable 37, and each wafer 38 is equipped with a different type of bare chip P. When the XY table 35 operates, the wafer 38
Moves in the XY direction, and the desired bare chip P on the wafer 38 is moved.
Is located immediately below the nozzle 22. When the bare chips P of the wafer 38 are out of stock or the type of the bare chips P is changed, when the rotating device 36 is operated, the turntable 37 rotates and the other wafers 38
To move down. As a chip supplier, wafer 38
In addition, trays and the like are frequently used.

The correction stage 2 includes a correction claw 41. When the correction claw 41 slides in the XY direction by means (not shown), the bare chip P transferred onto the correction stage 2 by the sub-transfer head 7 is formed. Corrects the position shift in XYθ direction.

The positioning unit 3 includes a heating device 19 placed on the XY tables 17 and 18 and a heating box 42 placed on the heating device 19. The substrate 11 is positioned on a heating device 19 and heated to a eutectic temperature (for example, about 400 ° C.). Also XY
The tables 17 and 18 are operated to move the substrate 11 in the X and Y directions, thereby mounting the tape piece transferred by the tape transfer head 9 at a predetermined position. The bare chip P is mounted. Next, the details of the bonding tape supply device 4 will be described with reference to FIGS.

In FIG. 2, reference numeral 51 denotes a supply reel around which a bonding tape 52 (hereinafter, referred to as a tape) is wound. Below the supply reel, a tape 52 which is drawn from the reel 51 and fed therebetween is vertically held. A first holding member 53 and a second holding member 54 are provided. As shown in FIG. 4, a guide groove 54a for guiding the transport of the tape 52 is formed in the upper surface of the holding member 54, and the holding member 53 is fitted into the guide groove 54a to be inserted into the guide groove 54a. The holding portion 53a that presses the protruding portion is provided.

In FIG. 3, 55 is a guide block provided on the side of the holding member 54, 56 is a horizontal guide portion provided on the wall surface thereof, and the holding member 54 is provided with a slider 57 provided on one wall surface thereof. Thus, it is slidably mounted in the front-rear direction along the guide portion 56.

A horizontal guide portion 58 is provided on the other wall surface of the holding member 54, and a slider 59 is mounted on the guide portion 58 via a slider 60 so as to be slidable in the front-rear direction. Slider 59
A vertical guide portion 61 is provided on the wall surface of
The holding member 53 is mounted on the guide portion 61 via a slider 62 so as to be able to move up and down. In FIG. 2, reference numeral 63 denotes a spring member for urging the slider 59 and the first holding member 53 rearward.

At the lower rear portion of the holding member 54, a fitting portion 65 is formed in a recessed manner. Reference numeral 66 denotes a slider, and one end of the
A roller 67 is fitted on the shaft. 68 is a cam provided below the oscillator 66, M1 is a drive motor, and 69 is a cam follower. Reference numeral 71 denotes a lifter on which a cam follower 69 is pivotally mounted. A roller 73, which is pivotally mounted on the other end of the rocker 66, is fitted into a fitting portion 72 on the upper side thereof. 70 is the oscillator 66
It is a rotation axis. In addition, a pin-shaped engaging element 75 that engages with the rear end face of the first holding member 53 is protruded from the second holding member 54.

Therefore, when the motor M1 is driven and the rocker 66 is rocked, the second holding member 54 reciprocates in the front-rear directions N1, N3.
Further, when the holding member 54 moves forward, the second holding member 53 is pushed by the engaging element 75 and advances integrally with the holding member 54, and when the second holding member 54 moves backward, the first holding member 53 moves to the first position. Clamping member
53 retreats integrally with the slider 59 by the spring force of the spring member 63. That is, each of the members 63, 66 to 73 constitutes a forward / backward drive device for moving the holding members 53, 54 forward / backward.

2, reference numeral 100 denotes a position adjusting device for retreating the first holding member 53. The motor 100 has a motor M2, a cam 101 driven by the motor M2 to rotate, a cam follower 102, and a cam follower 102. It comprises a moving element 103 mounted thereon and a stopper 104 formed of a roller which is axially mounted on a front part thereof. The rear surface of the sandwiching member 53 is pressed against the stopper 104 by the spring force of the spring member 63, and the retraction is restricted. When the motor M2 rotates, the stopper 104 moves forward and backward, and the retreat position of the holding member 53 is adjusted. Reference numeral 105 denotes a control device such as a computer that controls the motors M1 and M2.

A roller 82 is mounted on the lower portion of the first holding member 53. 83 is a cam that rotates when driven by the motor M1, 84
Reference numeral 85 denotes a cam follower, and reference numeral 85 denotes a lifter on which a cam follower 84 is axially mounted. A roller 82 fits into a fitting portion 86 at an upper portion of the lifter 85 (see also FIG. 3). Therefore, when the motor M1 is driven, the holding member 53 moves up and down along the vertical guide portion 61, and the tape 52 is held in the state where the holding member 53 is lowered.
When the holding member 53 is held between the guide groove 54a and the guide groove 54a, the holding state is released. That is, the above members 83 to 85
Constitutes a nipping / nipping releasing drive device for raising / lowering the nipping member 53 and nipping or releasing the tape 52. With the tape 52 held as described above, the holding member
As the tapes 53 and 54 advance forward N1, the tape 52 is pitch-forwarded forward.

Next, the details of the cutting device 5 for the tape 52 will be described. In FIG. 2, 90 is a tape 52 provided in front of the holding member 54.
The guide block 90a of the tape 52 is recessed on the upper surface thereof. Reference numeral 91 denotes a pressing block for the tape 52 provided on the upper portion of the support block 90, and a cam follower 92 mounted on the lower portion of the pressing block is in contact with a cam 93 driven by the motor M1. Reference numeral 94 denotes a cutting block provided on the side of the support block 90, which is supported by pins 95. Reference numeral 96 denotes a cam provided below, 97 denotes a cam follower, 98 denotes a lifter, and a pin 95 stands on the lifter 98. Edges of the support block 90, the pressing block 91, and the cutting block 94 that are joined to each other are blade portions a, b, and c for cutting the tape 52.

When the motor M1 is driven, the pressing block 91 descends,
By holding the tape 52 between the support block 90 and the pressing block 91, the cutting block 94 is raised in that state,
The tape 52 is cut by the blades a, b, and c, and the cut tape piece 52a is attached to the nozzle 2 of the tape transfer head 9.
Adsorb to 4 and take up. Ie cam follower 9
The cam 2 and the cam 93 are means for vertically moving the pressing block 91, and the cam 96 and the cam follower 97 are means for vertically moving the cutting block 94.

As described above, this means drives the supply device 4 and the cutting device 5 by the same motor M1 to perform pitch feeding and cutting of the tape 52, so that pitch feeding and cutting are reliably synchronized. be able to.

The present apparatus is configured as described above, and the overall operation will be described next.

When the motor M1 is driven, the oscillator 66 swings, and the holding member
53 and 54 move forward in the N1 direction. At this time, the first holding member 5
3 is in the lowered position, and holds the tape 52 between its holding portion 53a and the guide groove 54a, and in this state, both holding members 53,
As the tape 54 advances, the tape 52 is sent forward N1. Next, the holding member 54 is retracted by the swing of the swing element 66 (arrow N3), and at the same time, the holding member 53 is raised by the rotation of the cam 83 (arrow N2), and the holding state of the tape 52 is released. The stopper 10 by the spring force of the spring material 63.
4 (arrow N3), and further the cam 83 rotates, whereby the holding member 53 is lowered (arrow N4).
The tape 52 is sandwiched again and sent forward. As described above, the tape 52 is intermittently held between the first and second holding members 53 and 54 and is pitch-forward-forwarded.

With the pitch feed of the tape 52 stopped, the cam 93, 96
With the rotation of, the pressing block 91 descends and presses the tape 52 against the support block 90, and the tape transfer head 9.
The nozzle 24 lands on the tape 52 on the cutting block 94 (FIGS. 7 (a) and 7 (b)), and the tape 52 is cut by the nozzle 24 and the cutting block 94 rising integrally in this state. (FIG. 7 (c)), the nozzle 24 further rises, sucks the cut tape piece 52a as it is to take it up (FIG. 7 (d)), and transfers it to the substrate 11 described above. When the nozzle 24 lands on the tape 52 as described above, the lowering limit is regulated by the stopper portion 24 a hitting the shoulder of the pressing block 91.

Next, the bonding head 8 takes up the bare chip P on the correction stage 2 and mounts it on the tape piece 52a, and the bare chip P is eutectic bonded. Fifth
The figure shows the bare chip P bonded on the tape piece 52a.
1 is shown.

When the length of the bare chip P changes, the motor M2 is driven to change the position of the stopper 104. For example, the length of the bare chip P increases, and the tape piece 52a
When lengthening the length, the stopper 104 is retracted (second
(See the chain line in the figure.) Then, the sliding stroke of the first holding member 53 becomes longer, and the length of the tape piece 52a becomes longer. Such position adjustment of the stopper 104 can be freely performed by a program of the control device 105 according to the bonding order of the bare chips P.

FIG. 6 shows a large bare chip P2 bonded. As is clear from the figure, the length of the tape piece 52a is longer than that shown in FIG. 5, and the positioning portion 3 is required to cope with the large width of the bare chip P2.
XY tables 17 and 18 to drive the substrate 11 to bare chips P
In the width direction X, two tape pieces 52a are arranged side by side by the width of the tape piece 52a. Of course, three or more tape pieces 52a may be provided in parallel. As described above, according to the present means, the length and the number of tape pieces 52a can be freely adjusted according to the size of the bare chip P.

(Effects of the Invention) As described above, according to the present invention, the bonding tape is reliably sent to the cutting device at the pitch while the first holding member and the second holding member hold and release the bonding tape. Further, the tape piece cut into a predetermined length by the cutting device can be attracted to the nozzle and taken up reliably. In particular, after the nozzle lands on the bonding tape, the nozzle and the cutting block are integrally raised, and the cutting of the bonding tape and the take-up of the cut tape piece are continuously performed, so that the short tape piece can be used. Even if there is, reliable cutting and take-up are possible. At the time of cutting, the bonding tape is sucked and fixed by the nozzle, so that the suction hole for sucking and fixing the bonding tape that was conventionally opened in the cutting block can be eliminated. And the problems such as clogging of the suction holes do not occur.

[Brief description of the drawings]

FIG. 1 shows an embodiment of the present invention. FIG. 1 is a front view of a eutectic bonding apparatus, FIG. 2 is a side view of a bonding tape supply apparatus and a cutting apparatus, FIG. FIG. 4 is a partial perspective view, FIGS. 5 and 6 are plan views of a bare chip bonded to a substrate, and FIG. 7 is a side view showing a take-up operation sequence. DESCRIPTION OF SYMBOLS 1 ... Bear chip supply device 3 ... Positioning part 4 ... Bonding tape supply device 5 ... Cutting device 8 ... Bonding head 9 ... Tape transfer head 11 ... Substrates 17, 18 ... XY table 19 ... … Heating device 51… Supply reel 52… Bonding tape 52a… Tape piece 53… First holding member 54… Second holding member 63… Spring material 66… Oscillator 67… Roller 68 … Cam 69… Cam follower 71… Elevator 72… Mating part 73… Roller 83… Cam 84… Cam follower 85… Elevator 90… Support block 91… Press block 92, 93… Vertical movement means of the pressing block 94 ... Cutting block 96, 97 ... Vertical movement means of the cutting block a, b, c ... Blade P ... Bare chip

 ──────────────────────────────────────────────────続 き Continuation of front page (56) References JP-A-1-209732 (JP, A) JP-A-59-105328 (JP, A) JP-A-62-166534 (JP, A) 23926 (JP, U) Fully open sho 59-65532 (JP, U) Fully open sho 60-97294 (JP, U) Fully open sho 60-96829 (JP, U)

Claims (2)

(57) [Claims] 1. A bare chip, a supply device, a substrate positioning portion provided with a substrate heating device, a bonding head for bonding the bare chip of the supply device to the substrate, a bonding tape supply device, and a bonding tape supply device. A bare chip eutectic bonding apparatus comprising: a cutting device that cuts out a derived bonding tape; and a tape transfer head that transfers a cut piece of tape to a substrate by sucking the cut piece of tape, the bonding tape comprising: Supply device for holding the bonding tape led out of the supply reel from above and below
, A second holding member, a forward / backward drive device for moving the first holding member and the second holding member forward and backward, and holding and holding a bonding tape between the first holding member and the second holding member. A first holding member and a second holding member for holding the bonding tape and feeding the bonding tape at a pitch to the cutting device; A tape cutting device, a support block that supports the bonding tape led out from the supply reel from below, and a pressing block that presses the bonding tape against the support block by being driven up and down by driving up and down moving means, A cutting block on the side of the support block, the cutting block being driven up and down to move up and down; The pressure block and the cutting block are formed with a blade portion at the joining edge thereof, and when the nozzle of the tape transfer head lands on the bonding tape on the cutting block and rises, the tape transfer head is integrally formed with the nozzle. A bare chip eutectic bonding apparatus characterized in that the cutting block is raised and the bonding tape is cut by the blade, and the cut piece of tape is sucked up by the nozzle to take up. 2. A bonding tape wound around a supply reel is led out between a first holding member and a second holding member, and a driving device for holding and releasing holding is driven to drive the first holding member and the first holding member. The holding member 2 holds and releases the bonding tape, and drives the forward / backward drive device to move the first
The bonding tape and the second holding member are moved forward and backward to feed the bonding tape to the cutting device at a pitch, and then the bonding tape is held from above and below by the support block and the pressing block of the cutting device. The nozzle of the tape transfer head lands on the bonding tape on the cutting block provided on the side, and the support block, the pressing block, and the cutting block are mutually moved while integrally raising the cutting block and the tape transfer head. This bonding tape is cut by a blade portion provided at an edge to be joined, a cut piece of tape is sucked by the nozzle and taken up, and is transferred and mounted on a substrate positioned at a positioning portion. Characteristic eutectic bonding method for bare chips.