JP2815471B2 - Electronic component mounting equipment - Google Patents

Description

Description: BACKGROUND OF THE INVENTION The present invention relates to an electronic component mounting apparatus, and more particularly, to observing an electronic component adsorbed by a nozzle of a transfer head and transferred to a substrate during the transfer. Means for doing so.

(Prior art) Electronic component mounting equipment that mounts electronic components, such as ICs, LSIs, resistor chips, and capacitor chips, on a circuit board sucks electronic components from a part feeder, such as a tray or a tape feeder, onto a nozzle of a transfer head. After correcting the positional deviation in the XYθ direction, the substrate is mounted on the substrate positioned at the positioning section.

As shown in FIG. 4, the XYθ direction misalignment correction means includes a misalignment correction stage 104 for the electronic component P between an electronic component supply unit 101 such as a tape feeder or a tray and a positioning unit 103 of the substrate 102. Is known.

The operation will be described. First, the sub-transfer head 105 transfers the electronic component P of the electronic component supply unit 101 to the correction stage 104, and the CCD camera 106 provided on the correction stage 104 moves the electronic component P in the XYθ direction. Observe the displacement. Next, the nozzle 108 of the transfer head 107 lands on the center of the electronic component P, and takes up the electronic component P. The displacement of the electronic component P in the XY direction is determined by the transfer head 107.
Is corrected by adding a correction value based on the displacement in the XY direction to the stroke in the XY direction.
The nozzle 10 is driven by a motor 109 mounted on the transfer head 107.
The correction is made by rotating 8 in the θ direction (rotation direction about the axis of the nozzle 108).

(Problems to be Solved by the Invention) However, such a misalignment correction means is to first place the electronic component P on the correction stage 104 by the sub-transfer head 105, observe the electronic component P by the camera 106, and then observe the transfer head. Since it had to be taken up by 107, the time required for observation was lost and the mounting efficiency was not improved.

Therefore, an object of the present invention is to solve the above-mentioned problems of the conventional means and to provide an electronic component mounting apparatus capable of mounting an electronic component on a substrate at a high speed.

(Means for Solving the Problems) For this purpose, the present invention provides an electronic component supply unit in which parts feeders are juxtaposed in the horizontal direction, a board positioning unit, and a space between the electronic component supply unit and the board positioning unit. And a transfer head for transferring and mounting the electronic components of the parts feeder to the nozzles and transferring and mounting the transfer head on the substrate, an XY table for moving the transfer head in the X and Y directions, and a transfer head. A light source for integrally moving and irradiating the electronic component adsorbed to the nozzle with light from above, an observation device arranged on a side of the transfer head and integrally moving with the transfer head, The moving direction of the transfer head, which moves the electronic component of the electronic component supply unit to the substrate positioned by the positioning unit by sucking the electronic component of the electronic component supply unit between the electronic component supply unit and the positioning unit of the board, is intersected. Move laterally The electronic component mounting apparatus is freely arranged and includes a mirror that reflects the light emitted from the light source toward the observation device at the intersection, and a moving unit that moves the mirror in the lateral direction.

(Operation) In the configuration described above, the transfer head that has attracted the electronic component of the parts feeder to the nozzle transfers the electronic component to the substrate that is positioned at the positioning unit, but the mirror uses the electronic component supply unit and the positioning unit for the substrate. At the intersection, the light emitted from the light source was reflected by the mirror to the observation device side and was absorbed by the nozzle at this intersection. Observe the electronic components.

Embodiment Next, an embodiment of the present invention will be described with reference to the drawings.

FIG. 1 is a plan view of the electronic component mounting apparatus, and FIG. 2 is a side view of the same. Reference numeral 1 denotes an electronic component supply unit. On a table 2, a parts feeder 3 such as a tape unit, a tube feeder, or a tray equipped with electronic components P is arranged in a horizontal direction (X).
Direction). In the present invention, the horizontal direction, which is the direction in which the parts feeders 3 are arranged, is defined as the X direction, and the direction orthogonal thereto is defined as the Y direction.

Reference numeral 4 denotes a positioning portion of the substrate 5, which clamps and positions the substrate 5. Reference numeral 6 denotes a transfer head, which includes a nozzle 7 for sucking the electronic component P, and a motor M for rotating the nozzle 7 by θ around the axis. The transfer head 6
Is provided with a light source 30 and a light-transmitting light diffusion plate 31 (see also FIG. 3).

The light source 30 moves integrally with the transfer head 6 and irradiates the electronic component P sucked by the nozzle 7 with light from above. Reference numerals 10 and 11 denote XY tables for moving the transfer head 6 in the XY directions. The transfer head 6 moves between the electronic component supply unit 1 and the substrate 5, adsorbs the electronic component P of the parts feeder 3 to the nozzle 7, and transfers and mounts the electronic component P on the substrate 5.

In FIG. 3, reference numerals 12 and 35 denote mirrors provided so as to face each other. Go to In FIG. 2, reference numerals 13 and 14 denote a timing belt and a motor as moving means. The timing belt 13 is disposed laterally between the electronic component supply unit 1 and the positioning unit 4 of the substrate 5. Timing belt
A base 15 is mounted on the base 13, and the mirrors 12, 35 are mounted on the support plate 9 above the rod 16 erected on the base 15.
Are provided at an angle. 40 is a storage case for the mirrors 12, 35.

In FIG. 3, reference numeral 33 denotes an observation device provided on the side of the transfer head 6, which is driven by the XY tables 10 and 11 to move integrally with the transfer head 6. Reference numeral 24 denotes a lens barrel, in which a half mirror 36 and a mirror 37 are provided. Cameras 38 and 39 are provided on the side surface of the lens barrel 34. Light emitted from the light source 30 is reflected by mirrors 12, 35
Is reflected by the half mirror 36 and the mirror 37 and enters the cameras 38 and 39. The silhouette of the electronic component P adsorbed by the nozzle 7 is observed by the cameras 38 and 39. The magnification of the cameras 38 and 39 is different, and the electronic components P
The two cameras 38 and 39 are selectively used according to the size and the type of the camera.

In FIG. 2, a cylinder 18 is provided on the base 15. An engaging element 24 is mounted on the rod 19 of the cylinder 18. Reference numeral 25 denotes a slider provided on the back surface of the standing plate 17, and reference numeral 26 denotes a guide rail for guiding the slider 25 in the X direction.

At the tip of the parts feeder 3, a ratchet wheel 22 is provided as a pitch feed means for the electronic component enclosing tape 21. 23 is a pitch feed lever. When the motor 14 is driven, the timing belt 13 rotates, and the mirror 12 on the base 15 is rotated.
The cylinder 18 and the cylinder 18 move integrally in a horizontal direction intersecting the moving direction of the transfer head 6, and the engaging element 24 engages with the engaging portion 20 at the lower end of the lever 23. In this state, when the rod 19 of the cylinder 18 is lowered, the lever 23 rotates clockwise against the spring force of the spring 27, and the ratchet wheel 22 also rotates in the same direction to feed the tape 21 by pitch, The electronic component P is sent to a take-up position by the nozzle 7. The base 15 is provided with a cutting means 29 having a fixed blade 29a and a movable blade 29b, and cuts the empty tape 21 hanging from the ratchet 22 by the pitch feed.

The present apparatus has the above configuration, and the operation will be described next.

In FIG. 1, the transfer head 6 arrives at the parts feeder 3 of the electronic component supply unit 1 and is pitch-fed by the cylinder 18 in advance, and sucks the electronic component P waiting at the take-up position to the lower end of the nozzle 7. I do. Next, the transfer head 6
Moves toward the substrate 5 in order to transfer and mount the electronic component P on the substrate 5, and at the same time, when the motor 14 is driven, the mirrors 12 and 35 move in the lateral direction, and the transfer head 6 (See a chain line in FIG. 1).

Then, the transfer head 6 that has absorbed the electronic component P as described above passes over the mirror 12 while transferring the electronic component P to the substrate 5. At the intersection, the light from the light source 30 irradiates the electronic component P from above, is further reflected by the mirrors 12 and 35, the half mirror 36 and the mirror 37, and enters the cameras 38 and 39. Observed at 39, the displacement is detected. The displacement in the XY direction is caused by the XY movement of the transfer head 6 by the XY tables 10 and 11.
The displacement is corrected by adjusting the stroke in the direction, and the positional deviation in the θ direction is corrected by driving the motor M to rotate the nozzle 7 about its axis.

In this means, since the mirrors 12 and 35 are provided on the same base 15 as the cylinder 18 and the cutting means 29 as the driving means of the ratchet wheel 22 which is the pitch feeding means for the tape 21, the same moving means 13 as these are used. , 14, the mirrors 12, 35 can be moved in the horizontal direction, and the structure can be simplified.

(Effects of the Invention) As described above, according to the present invention, the transfer head is attracted to the electronic components of the parts feeder by driving the moving unit to make the mirror stand by at the intersection with the transfer head in advance. However, if the user has moved to this intersection to transfer to the substrate, the electronic component can be observed immediately there, and therefore, substantially no time is required for observing the electronic component, and the mounting speed can be increased accordingly. .

[Brief description of the drawings]

1 shows an embodiment of the present invention. FIG. 1 is a plan view of an electronic component mounting apparatus, FIG. 2 is a side view, FIG. 3 is a side view of a main part, and FIG. FIG. DESCRIPTION OF SYMBOLS 1 ... Electronic component supply part 3 ... Parts feeder 4 ... Board positioning part 5 ... Substrate 6 ... Transfer head 7 ... Nozzle 12, 35 ... Mirror 13, 14 ... Moving means 30 ... Light source 33 …… Observation device

Claims (1)

(57) [Claims] An electronic component supply unit in which parts feeders are juxtaposed in a horizontal direction, a board positioning unit, and a movement between the electronic components supply unit and the board positioning unit, and the electronic components of the parts feeder are moved. A transfer head that is transferred to and mounted on the substrate by suctioning to the nozzle, an XY table that moves the transfer head in the X and Y directions, and is moved integrally with the transfer head and is suctioned by the nozzle. A light source for irradiating the electronic component with light from above, an observation device disposed on the side of the transfer head and moving integrally with the transfer head, and an electronic component supply unit and a positioning unit for the substrate In the meantime, the electronic component of the electronic component supply unit is disposed so as to be movable in a lateral direction intersecting with the moving direction of the transfer head, which attracts the electronic component to the nozzle and moves toward the substrate positioned by the positioning unit. At the intersection A mirror for the light emitted from the light source is reflected to the observation apparatus, the electronic component mounting apparatus characterized by comprising a moving means for moving the mirror in the horizontal direction.