JPH0330499A - Electronic component mounting device - Google Patents

Abstract

PURPOSE:To enable a chip to be transferred from a chip feed section to a board and mounted on it at a high speed by a method wherein a light source is made to protrude under a chip held by a nozzle while a transfer head is in motion and irradiate the chip from the lower side, and the chip is observed through a vacuum unit by a camera provided above the vacuum unit. CONSTITUTION:A transfer head 10 is moved above a chip feed section 7, a nozzle 17 is made to descend to hold a chip P by suction from the chip feed section, to take up the chip P, and to ascend. The nozzle 17 starts to move toward a board 8 as ascending, a cylinder 41 is operated to make a light source 40 advance under the chip P and turned ON, and the chip P held by the nozzle 17 is observed by a camera 18. A computer computes the positional deviations of the chip P in the directions of X, Y, and theta from the observation result by the camera 18, the nozzle 17 is made to descend, and the chip P is mounted on the board 8.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to an electronic component mounting apparatus, and more particularly to a means for detecting, using a camera, the displacement of a chip attracted to a nozzle of a transfer head.

(Prior art) Electronic component mounting equipment, which mounts electronic components such as IC chips, LSI chips, resistor chips, and capacitor chips, on a board is a device that mounts chips from a chip supply unit such as a tray or tape feeder to a nozzle of a transfer head. After being attracted and correcting the positional deviation in the XYθ directions, the substrate is mounted on the substrate positioned in the positioning section.

As a positional deviation correcting means in the XYθ directions, the one disclosed in Japanese Patent Publication No. 62-3598, particularly in FIG. 15, is known. This device mechanically corrects the positional deviation of the chip by pressing position adjustment claws from four directions against the side wall surface of the chip that is attracted to the nozzle.

Second, as shown in FIG. 4 (plan view), a chip supply unit 101 such as a tape feeder or a tray and a substrate 1
It is known that a stage 104 for correcting the positional deviation of the chip P is provided between the positioning section 103 of the chip P.

To explain the operation, first, the sub-transfer head 105 transfers the chip P from the chip supply section 101 onto the correction stage 104, and the CCD camera 106 provided on the correction stage 104 detects the positional deviation of the chip P in the XYθ directions. Observe. Next, the nozzle 108 of the transfer head 107 lands on the center of the chip P and ticks up the chip P. The positional deviation of the chip P in the XY force direction is corrected by adding a correction value based on the positional deviation in the XY force direction to the XY direction stroke of the transfer head 107. Equipped motor 1
09, the nozzle 108 is corrected by rotating in the θ direction (rotation direction around the axis of the nozzle 108).

(Problem to be Solved by the Invention) However, since the above-mentioned first positional deviation correction means mechanically corrects the position by pressing the positioning claw against the chip, the chip is easily damaged by the impact at that time. There was a problem.

Further, the second positional deviation correction means includes a sub-transfer head 1
05, the chip P must be placed on the correction stage 104, observed with the camera 10G, and then ticked up with the transfer head 107.
The entire time required for observation was lost time, and implementation efficiency was not improved.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting apparatus that eliminates the loss time required for detecting chip positional deviation using a camera and can transfer and mount chips from a chip supply section onto a board at high speed.

(Means for Solving the Problems) For this purpose, the present invention provides an electronic component mounting apparatus of this type, in which the transfer head includes a vacuum unit, and a nozzle vertically disposed below the vacuum unit and communicating therewith. It consists of a camera located above the vacuum unit that observes the positional shift of the chip attracted to the nozzle, and a motor that rotates the nozzle around its axis. A light source section is provided below the transfer head, which is driven by a drive section to protrude and sink below the nozzle, and irradiates light from below to the chips attracted by the nozzle.

(Function) According to the above configuration, while the transfer head is moving, the light source unit is made to protrude below the chip adsorbed by the nozzle, and by irradiating light onto the chip from below, it passes through the vacuum unit and illuminates the chip above the chip. Observe the chip using a camera.

(Example) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is a perspective view of an electronic component mounting apparatus, in which reference numeral 1 denotes a main body box, and a positioning section 4 for clamping and positioning a board 3 is provided on its upper surface. 5.6 is a conveyor that carries the substrate 3 into this positioning section 4 and carries it out from there. A chip supply section 7 consisting of a tray is provided on the side of the positioning section 4. In addition to trays, tape feeders and tube feeders are commonly used as chip supply units.

Reference numeral 8.8 denotes two chip transfer devices installed above the main box 1, each consisting of an XY child table consisting of an X table 9a and a Y table 9b, and a transfer head attached to the tip of the Y table 9b. 10, and a board observation camera 2. The transfer head 10 is driven by an XY child table to reciprocate between the chip supply section 7 and the substrate 3 positioned in the positioning section 4, and transfers and mounts the chips from the chip supply section 7 onto the substrate 3.

Although one chip transfer device 8 may be used, in this embodiment, two chips are provided in order to double the chip mounting efficiency, and the chips P are mounted on the two substrates 3 at the same time. There is. MX.

MY is a motor for driving the X and Y tables 9a and 9b.

FIG. 2 shows the detailed structure of the transfer head 10, in which 11 is a cover case and 12 is an inner case provided inside the cover case. A vacuum unit 13 is provided at the bottom of the inner case 12. This vacuum unit 13 is formed by stacking transparent plates 14 and 15 such as glass plates one above the other, and a suction space T is formed between them. 1
6 is a suction tube connected to the vacuum unit 13, which sucks air in the suction space T. A chip suction nozzle 17 communicating with the suction space T is vertically provided on the lower transparent plate 15 . Further, above the vacuum unit 13, a camera 18 is provided to observe the chip P attracted to the nozzle 17.

A motor Mθ supported by a frame 20 is disposed above the inner case 12. The rotation axis 2 of this motor Mθ
2 is connected to the inner case 12, and when the motor Mθ is driven, the inner case 12 and the nozzle 17 rotate in the θ direction (rotation direction around the axis of the nozzle 17).

MZ is a drive motor in the X direction (vertical direction), and a vertical feed screw 24 is connected to its rotating shaft 23. The frame 20 is connected to this feed screw 24 via a NAND portion 25, and when the motor MZ is driven,
The inner case 12 moves up and down in the vertical direction, and the nozzle 17 adsorbs the chips P from the chip supply section 7 or deposits the adsorbed nitrogen P on the base plate 3.

The support frame 26 of the motor MZ is coupled to a bracket 27. This bracket 27 is slidably attached to Y-direction guide rods 28 and 29 at its upper and lower portions. Further, its central portion is screwed to a Y-direction feed screw 32 via a nut portion 31, and a Y-direction drive motor M
When Y is driven, the bracket 27 and the transfer head 10 coupled thereto slide in the Y direction.

Further, a frame 33 is connected to the bracket 27. A nut portion 34 is attached to the upper part of this frame 33. 35 is a feed screw screwed into the nut portion 34;
MX is a motor for driving in the X direction, and when the motor MX is driven, the frame 33 and the transfer head 1 connected thereto are
0 slides in the X direction.

Reference numeral 40 denotes a light source section disposed below the cover case 11, and is attached to the tip end of the iron 42 of the cylinder 41 as a driving section. This light source section 40 includes a cylinder 41
As a result of the operation, the chip P projects and sinks below the nozzle 17, irradiates the chip P attracted to the lower end of the nozzle 17 with light from below, and the camera 18 observes the positional deviation in the XYθ directions.

This apparatus has the above-mentioned configuration, and the overall operation will be explained next with reference to FIG.

When the board 3 is carried into the positioning section 4 and positioned by the conveyor 5, the transfer head 10 moves above the board 3, and the camera 2 observes the positional shift of the circuit pattern printed on the board 3. . Next, the transfer head 10 moves above the chip supply section 7, and as the motor MZ is driven, the nozzle 17 descends to suck the chip P from the chip supply section 7 (Fig. 3 tl, 2). 17 ticks up the chip P and goes up (t2 in the figure). When the nozzle 17 rises to a predetermined height (■ in the same figure), the motor M
X, MY start driving, the nozzle 17 continues to rise and starts moving toward the substrate 8, and the cylinder 4
1 is activated, the light source unit 40 moves forward below the chip P and turns on, and the camera 18 begins to observe the chip P attracted to the nozzle 17 (t3 in the figure). In this case, camera 18
Since the light source unit 40 moves integrally with the nozzle 17, there is no need for the transfer head 10 to stop moving.
can be observed as a still image. When the observation of the chip P is completed, the light source section 40 is moved back so as not to interfere with the vertical movement of the nozzle 17.

On the way, the motor MZ stops driving and the nozzle 17
2), the motors MX and MY are further driven, and the nozzle 17 moves toward the substrate 8 (t).
4). When the nozzle 17 approaches the substrate 8 (■ in the same figure)
, the motor MZ starts driving, the nozzle 17 begins to descend, and the computer (not shown) calculates the positional deviation of the chip P in the XYθ directions based on the observation result of the camera 18 (t5 in the same figure). Next, the drive of motor MZ is stopped (■) in the same figure), and then the above calculation is completed (■) in the same figure). Based on the calculation results, motors MX, MY, and Mθ start to move.
After correctly correcting the positional deviation in the XYθ directions (t6 in the same figure), motors MX and MY stop driving.
is further driven, the nozzle 17 descends, and the chip P is attached to the substrate 8.
(t7■ in the same figure).

In this manner, the series of mounting steps is completed.

The height H of the nozzle 17 from the substrate 3 during chip transfer is set to such a height that the chip P attracted to the light source section 40 or the lower end of the nozzle 17 does not hit the chip P already mounted on the substrate 3. Ru.

(Effects of the Invention) As explained above, the present invention provides a transfer head that includes a vacuum unit, a nozzle that is vertically installed at the bottom of the vacuum unit and communicates with the vacuum unit, and a nozzle that is located above the vacuum unit and is attracted to the nozzle. It consists of a camera that observes the misalignment of the chip and a motor that rotates the nozzle around its axis.
A light source unit is installed below this transfer head, which is driven by a drive unit to protrude and sink below the nozzle, and irradiates light from below onto the chips that are attracted to this nozzle, so that the chips are attracted to the nozzle. Then, while the chip is being transferred to the substrate by the transfer head, the misalignment of the chip can be observed as a still image using the camera installed in the transfer head.Therefore, there is no loss time required for observing the chip, and the chip can be transferred to the substrate at extremely high speed. It can be transported and loaded.

[BRIEF DESCRIPTION OF THE DRAWINGS] The figures show an embodiment of the present invention, in which FIG. 1 is a perspective view of an electronic component mounting apparatus, FIG. 2 is a sectional view of a transfer head,
FIG. 3 is a time chart, and FIG. 4 is a plan view of the conventional means. 3... Substrate 4... Positioning section 7... Chip supply section 10... Transfer head 13... Vacuum unit 17... Nozzle 1B... Camera 40... Light source section 41...・Drive part Mθ...Motor P...Chip Figure 1

Claims (1)

[Scope of Claims] An electronic component mounting apparatus comprising a chip supply section, a substrate positioning section, and a transfer head that transfers and mounts a chip from the chip supply section onto the substrate of the positioning section, wherein the transfer head comprises: A vacuum unit, a nozzle that is vertically installed at the bottom of the vacuum unit and communicates with it, a camera that is located above the vacuum unit to observe the positional deviation of the chip adsorbed by the nozzle, and A light source unit is provided below the transfer head, which is driven by a drive unit and projects below the nozzle, and irradiates light from below to the chips attracted by the nozzle. An electronic component mounting device featuring: