JPH04107988A - Electronic parts packaging device - Google Patents

Abstract

PURPOSE:To enable electronic parts to be packaged to a substrate at high speed by moving a mirror sideways when carrying a transfer head where the electronic parts are sucked to a nozzle to a substrate and then by observing the electronic parts by allowing light from a light source to be reflected to an observation device side using the mirror at a cross point with a traveling path of the transfer head. CONSTITUTION:A transfer head 6 reaches above a parts feeder 3 of an electronic parts supply part 1 and allows electronic parts P to be sucked to a lower edge part of a nozzle 7. Then, mirrors 12 and 35 travel sideways and wait previously directly below the traveling path of the transfer head 6. Then, the transfer head 6 which sucked the electronic parts P passes an upper part of this mirror 12. Light from a light source 30 is emitted from the upper part to the electronic parts P at the cross point, is further reflected by the mirrors 12 and 35, a half mirror 36, and a mirror 37, and enters cameras 38 and 39. The electronic parts P is observed by the cameras 38 and 39 and the positional deviation is detected.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to an electronic component mounting apparatus, and for details, please refer to 7.
electronic components that are picked up by the nozzle of the board and transferred to the board.
This invention relates to a means for observing during the transfer.

(Prior art) Electronic component mounting equipment, which mounts electronic components such as ICs, LSIs, resistor chips, and capacitor chips on substrates, sucks electronic components from a parts feeder such as a tray or tape feeder to a nozzle of a transfer head. , after correcting the positional deviation in the XYθ directions, it is mounted on the board positioned in the positioning section.

As shown in FIG. 4, as a positional deviation correction means in the XYθ directions, a positional deviation correction stage 104 for electronic components P is provided between an electronic component supply section 101 such as a tape feeder or a tray and a positioning section 103 for the board 102. It is known that there is a

To explain the operation, first, the sub transfer head 105 transfers the electronic component P from the electronic component supply section 101 to the correction stage 104.
The CCD installed on this correction stage 104
The positional shift of the electronic component P in the XYθ directions is observed using the camera 106. Next, the nozzle 108 of the transfer head 107 lands on the center of this electronic component P.
Tick up. The positional deviation of the electronic component P in the XY force direction is caused by the stroke of the transfer head 107 in the XY direction.
The positional deviation in the XY force direction is corrected by adding a correction value, and the positional deviation in the θ direction is corrected by moving the nozzle 108 in the θ direction (
The correction is made by rotating the nozzle 108 in the direction of rotation about the axis of the nozzle 108.

(Intelligence B to be Solved by the Invention) However, in this positional deviation correction means, the electronic component P is once placed on the correction stage 104 by the sub-transfer head 105, and then observed by the camera 106, and then transferred. Since the head 107 must be used for ticking up, the time required for observation results in loss time, and the mounting efficiency is not improved.

Therefore, it is an object of the present invention to solve the problems of the conventional means as described above and to provide an electronic component mounting apparatus that can mount electronic components on a board at high speed.

(Means for Solving the Problems) For this purpose, the present invention provides an electronic component supply section in which parts feeders are arranged in parallel in the horizontal direction, a board positioning section, and a space between the electronic component supply section and the board positioning section. The electronic parts of this parts feeder are moved to the nozzle, and the electronic parts are transferred and loaded onto this board. A light source that irradiates light from the transfer head, an observation device that is disposed on the side of the transfer head and moves integrally with the transfer head, and a light source that irradiates the transfer head between the electronic component supply section and the board positioning section. a mirror that is movably disposed in a lateral direction intersecting the moving direction of the mounting head and that reflects the light emitted from the light source toward the observation device at an intersection; and a moving means that moves the mirror in the lateral direction. An electronic component mounting device is constructed from these components.

(Function) In the above configuration, the transfer head that has sucked the electronic component in the nozzle of the parts feeder transfers the electronic component to the board positioned in the positioning section, but the mirror is connected to the electronic component supply section and the board positioning section. By moving in the horizontal direction between Observe electronic components.

(Example) Next, the present invention will be described in detail with reference to the drawings.

is the same side view. Reference numeral 1 denotes an electronic component supply section, and on a table 2, a large number of parts feeders 3 such as tape units, tube feeders, and trays equipped with electronic components P are arranged side by side in the horizontal direction (X direction).

Reference numeral 4 denotes a positioning section for the substrate 5, which clamps and positions the substrate 5. 6 is a transfer head, and electronic parts P
It is equipped with a nozzle 7 that attracts the nozzle 7, and a motor M that rotates the nozzle 7 by θ around its axis. The transfer head 6 is also provided with a light source 30 and a translucent light diffusing plate 31 (see also FIG. 3).

This light source 30 moves integrally with the transfer head 6 and irradiates light from above toward the electronic component P adsorbed by the nozzle 7. 10.11 is an XY child table that moves the transfer head 6 in the XY force directions. The transfer head 6 moves between the electronic component supply section 1 and the substrate 5, picks up the electronic component P of the parts feeder 3 onto the nozzle 7, and transfers and mounts the electronic component P on the substrate 5.

In FIG. 3, reference numerals 12.35 are mirrors provided to face each other, and by the means described below, a horizontal direction (X
direction).

In FIG. 2, reference numerals 13 and 14 indicate a timing belt and a motor as moving means. This timing belt 1
3 is disposed laterally between the electronic component supply section 1 and the positioning section 4 of the board 5. The timing belt 13 has
A stand 15 is attached, and the mirror 12.
5 is provided at an angle. 40 is mirror 12.35
It is a storage case.

In FIG. 3, reference numeral 33 denotes an observation device provided on the side of the transfer head 6, which is driven by the XY child table 0.11 and moves integrally with the transfer head 6. 34 is a lens barrel, inside which are a half mirror 36 and a mirror 37.
is provided. Furthermore, cameras 38 and 39 are provided on the side surface of this lens barrel 34. The light irradiated from the light source 30 is reflected by the mirror 12.35, further reflected by the half mirror 36 and the mirror 37, and enters the camera 38.39, so that the electronic component P attracted to the nozzle 7 is exposed to the silt. / ) is observed by camera 38.39. The magnifications of the cameras 3839 are different, and both cameras 38 and 39 are selectively used depending on the size and type of electronic component P.

In FIG. 2, a cylinder 18 is disposed on the platform 15. As shown in FIG. A retainer 24 is attached to the mouth 7 door 19 of the cylinder 18.

25 is a slider provided on the back surface of the standing plate 17, and 26 is a guide rail that guides the slider 25 in the X direction.

At the tip of the parts feeder 3, a mold wheel 22 is provided as a pitch feeding means for the electronic component encapsulating tape 21. 23 is a pitch feed lever. When the motor 14 is driven, the timing belt 13 rotates, the mirror 12 on the platform 15 and the cylinder 18 move integrally in the lateral direction intersecting the moving direction of the transfer head 6, and the above-mentioned engager 2
4 engages with the retaining portion 20 at the lower end of the lever 23. In this state, when the rod 19 of the cylinder 18 is lowered, the lever 23 rotates clockwise against the spring force of the spring 27, and the pattern wheel 22 also rotates in the same direction to feed the tape 21 in pitch. The electronic component P is sent to the pick-up position by the nozzle 7. Further, a cutting means 29 having a fixed blade 29a and a movable blade 29b is provided on the platform 15, and cuts the empty tape 21 hanging down from the mold wheel 22 by the above-mentioned pinch feed.

This device has the above-mentioned configuration, and its operation will be explained next.

In FIG. 1, the transfer handle arrives on the parts feeder 3 of the electronic component supply section 1, is pinch-fed in advance by the cylinder 18, and adsorbs the electronic component P waiting at the pick-up position to the lower end of the nozzle 7. . Next, transfer head 6
moves toward the board 5 in order to transfer and mount the electronic component P onto the board 5. At the same time, the mirror 12.35 moves laterally due to the drive of the motor 14. Wait in advance directly below the movement path of 7do6.
(See the chain line in Figure 1).

Then, the transfer head 6 that has picked up the electronic component P as described above passes above the mirror 12 while transferring the electronic component P to the substrate 5. At the intersection, the light from the light source 30 is irradiated onto the electronic component P from above, is further reflected by the mirror 12.35, the half mirror 36, and the mirror 37, and enters the camera 38.39. 39, and its positional deviation is detected. The positional deviation in the XY force direction is 0.
The displacement in the θ direction is corrected by adjusting the stroke of the transfer handle 11 in the X and Y directions, and the positional deviation in the θ direction is corrected by driving the motor M to rotate the nozzle 7 about its axis.

This means connects the mirror 12.35 to a cylinder 18 as a driving means for a model wheel 22 which is a pitch feeding means for the tape 21.
Since the mirror 12.35 and the cutting means 29 are provided on the same table portion 15, the mirror 12.35 can be moved laterally by the same moving means 13.14, and the structure can be simplified.

(Effects of the Invention) As explained above, the present invention includes an electronic component supply section in which parts feeders are arranged in parallel in the horizontal direction, a board positioning section,
Move between this electronic component supply section and the board positioning section,
A transfer head that sucks the electronic components of this parts feeder to a nozzle and transfers and loads them onto this board, and a transfer head that moves together with this transfer head and irradiates light from above onto the electronic components that are sucked by the nozzle. A light source, an observation device that is disposed on the side of the transfer head and moves integrally with the transfer head, and a light source between the electronic component supply section and the substrate positioning section in the direction of movement of the transfer head. A mirror is disposed so as to be movable in the lateral direction intersecting the intersection, and reflects the light emitted from the light source toward the observation device at the intersection, and a moving means for moving the mirror in the lateral direction. Since the device is configured, the electronic components can be observed while the electronic components are being transferred to the board by the transfer head, so the time required to observe the electronic components is not required, and the mounting speed can be increased accordingly. can.

[Brief explanation of the drawing]

The drawings show an embodiment of the present invention, in which Fig. 1 is a plan view of an electronic component mounting apparatus, Fig. 2 is a side view, Fig. 3 is a side view of main parts, and Fig. 4 is a plan view of a conventional means. It is a diagram. 1... Electronic component supply section 3... Parts feeder 4... Board positioning section 5... Board 6... Transfer head 7... Nozzle 12.35... Mirror 13.14. ...Moving means 30...Light source 33...Observation device

Claims (1)

[Claims] A parts feeder has an electronic component supply section and a board positioning section arranged in parallel in the horizontal direction, and moves between the electronic component supply section and the board positioning section, and the electronic components of the parts feeder. a transfer head that adsorbs electronic components onto a nozzle and transfers and loads them onto the board; a light source that moves together with the transfer head and irradiates light from above onto the electronic components adsorbed by the nozzle; An observation device that is disposed on the side of the head and moves integrally with the transfer head, and an observation device that extends in a lateral direction intersecting the moving direction of the transfer head between the electronic component supply section and the board positioning section. Electronic component mounting comprising: a movably arranged mirror that reflects light emitted from the light source toward the observation device at an intersection; and a moving means that moves the mirror laterally. Device.