JPH02280400A - Electronic parts packaging device - Google Patents

Abstract

PURPOSE:To enable four corner edge portions to be simultaneously observed by providing on a chip an optical element for deflecting light illuminated from the upper portion in four directions, and further providing four cameras on the element at four sides of the same. CONSTITUTION:A nozzle 9 of a transfer head is lowered to mount a chip P thereon and transfer the same to the upper portion of an optical element 11. The chip P is illuminated from the upper portion to observe the four corner edge portions of the chip P. In this case, the light illuminating the respective edge portions of the chip is retracted by prisms 11a-11d of a title device 11 in four directions and is incident upon respective cameras 13a-13d, so that positional displacements of the chip P in X, Y, theta directions can be detected with image processing means by simultaneously observing the four edge portions.

Description

Detailed Description of the Invention (Industrial Field of Application) The present invention relates to an electronic component mounting apparatus, in which the four corner edges of a chip that is attracted by a nozzle of a transfer head and transferred and mounted on a board are simultaneously observed. , the positional shift of this chip is detected.

(Prior art) A mounting device for electronic components (hereinafter referred to as chips) such as QFPs, capacitor chips, and resistor chips sucks chips from a chip supply section such as a tray, tape feeder, or tube feeder into a nozzle of a transfer head. Then, the substrate is transferred and mounted on the substrate positioned in the positioning section. In this case, the chip attracted to the nozzle has a positional shift in the XYθ directions, and after correcting this positional shift, the chip is transferred and mounted on the substrate.

FIG. 7 shows a conventional means for observing positional deviation of a chip (QFP) P, in which 100 is a nozzle and 101 is a camera. Nozzle 10 that adsorbs chips P in the chip supply section
0 transports this chip 7P above the camera 101,
Observe the positional shift in the XYθ directions. The positional deviation in the XY force direction is corrected by adjusting the stroke of the nozzle 100 in the XY force direction, and the positional deviation in the θ direction (rotation direction) is corrected by rotating the nozzle 100 around the axis using a motor. Corrected by

By the way, for example, q having a large number of guides L in four directions
Fpl requires extremely high mounting accuracy, and therefore it is desirable to increase the magnification of the camera 101 and observe the four corner edges to accurately detect positional deviations. However, as the magnification increases, the field of view of the camera 101 becomes smaller, making it difficult to observe the four corner edges at the same time.

For this reason, conventionally, if the chip P is transferred above the camera 101, the nozzle 100 and the camera 101 are relatively
By moving in the Y force direction, the four corner edge parts e1~
e4 was placed in the field of view a of the camera 101 and observed (see FIG. 6).

(Problem to be Solved by the Invention) However, as described above, the nozzle 100 and the camera 10
The means for sequentially observing each edge portion e1 to e4 while moving the edge portion 1 in the XY force direction is a transfer head or a camera 101.
Since the movement and stopping of the chip P must be repeated, a considerable amount of observation time is required, and as a result, there is a problem that the mounting speed of the chip P cannot be increased.

SUMMARY OF THE INVENTION Accordingly, an object of the present invention is to provide an electronic component mounting apparatus equipped with a means for simultaneously observing the four corner edge portions of a chip.

(Means for Solving the Problems) For this purpose, the present invention includes a chip supply section, a substrate positioning section, and a transfer head that adsorbs the chips of the chip supply section to a nozzle and transfers and mounts them on the substrate of the positioning section. In the electronic component mounting apparatus, an optical element is provided below the transfer path of the transfer head to refract light irradiated from above onto the chip adsorbed by the nozzle in four directions, and an optical element is provided below the transfer path of the transfer head. Four cameras are provided on four sides to observe the edge portions at the four corners of the chip by the incidence of light refracted in these four directions.

(Function) In the above configuration, the light irradiated from above onto the chip adsorbed by the nozzle is refracted in four directions by the optical element, and by observing the refracted light in each of the four directions with a camera, the four corners of the chip can be detected. At the same time, the edges of the edges are observed and their positional deviations are detected.

(Example 1) Next, the present invention will be described in detail with reference to the drawings.

FIG. 1 is an overall view of an electronic component mounting apparatus, in which 1 is a main body box, and 2 is a drive unit box provided on the top thereof. A positioning section 4 for clamping and positioning the substrate 3 is provided on the upper surface of the main body case 1. 5 and 6 are conveyors that carry the substrate 3 into the positioning section 4 and then carry it out. On the front side of the positioning section 4, a chip supply section 7 consisting of a tray is provided. Reference numeral 10 denotes a transfer head installed vertically in the drive unit box 2, and is driven by an XY direction moving device built in the drive unit box 2 to reciprocate between the chip supply unit 7 and the substrate 30, and moves the transfer head between the chip supply unit 7 and the substrate 30. Chip No. 7 is attracted to the nozzle 9 and transferred and mounted on the substrate 3.

8 is a monitor camera. 11 is the tray 7 and the board 3
This is an optical element for detecting a positional deviation of a chip, which is provided in the transfer path of the transfer head 10 between the two, and its details will be explained next with reference to FIGS. 2 and 3.

The optical element 11 is constituted by integrally forming four prisms 11a to 1]d, each of which has an integral structure.
d refracts light emitted from above outward. Cameras 13a to 1'3d, through which the refracted light enters, are provided at the lower 4 sides of each prism lla to 11d.
The light irradiated onto the optical element 11 is transmitted to each prism ll.
By refracting the beam in four directions by a to lid, the four corner edges of the chip P can be observed simultaneously. This chip P
is a QFP having a large number of leads L in four directions, and high mounting accuracy is required in order to mount each lead L in exact alignment with the bond applied to the substrate 3. In FIG. 3, reference numeral 12 denotes a ring-shaped light source provided at the bottom of the transfer head 10.

This device has the above-mentioned configuration, and its operation will be explained next.

When the substrate 3 is carried into the positioning section 4 and positioned by the conveyor 5, the transfer head 10 starts moving in the xy force directions. The transfer head 10 first moves above the chip supply unit 7, and the nozzle 9 descends to adsorb and tick up the chip P, and transfers it above the optical element 11. Therefore, by irradiating the Sennobu P with light, the edge part e1 of the chip P is
Observe ~e4 (see Figure 6). In this case, as described above, the light irradiated on the edge portions e1 to e4 of the chip P is refracted in four directions by the prisms lla to 11d and is incident on each of the cameras 13a to 13d. The nozzle parts e1 to e4 are simultaneously observed, and a positional shift of the chip P in the XYθ directions is detected by a well-known image processing means.

Among the positional deviations in the XYθ directions, the positional deviations in the XY force direction are:
This is corrected by adjusting the stroke of the transfer head 10 in the XY directions. In addition, the position in the θ direction is the position of the transfer head 10.
Correction is made by rotating the nozzle 9 in the θ direction using a built-in morph. After correcting the positional deviation in the XYθ directions in this manner, the chip P is mounted on the substrate 3.

(Example 2) In FIGS. 4 and 5, 14 is an optical element. This optical element 14 is constructed by forming four mirror parts 14a to 14d into a quadrangular pyramid shape to reflect light obliquely upward.
a to 13d are provided, respectively. Therefore, this also transfers the chip P above this optical element 14,
By irradiating light from above, the light is transmitted to the cameras 13a to 1.
3d side, and the four corner edges e1 of the chip P
e4 can be observed at the same time.

(Effects of the Invention) As described above, the present invention includes a chip supply section, a substrate positioning section, and a transfer head that adsorbs chips in the chip supply section to a nozzle and transfers and mounts them on the substrate in the positioning section. In the electronic component mounting apparatus, an optical element is provided below the transfer path of the transfer head to refract light irradiated from above onto the chip adsorbed by the nozzle in four directions, and four sides of the optical element are provided. On the other hand, since the four cameras are installed to observe the edges of the four corners of the chip by the incident light refracted in these four directions, the edges of the four corners of the chip attracted by the nozzle can be observed. They can be observed simultaneously, and therefore the time required for observation can be significantly shortened compared to conventional means, and the chip mounting speed can be increased. In particular, the present invention exhibits its advantages as a means for observing positional deviations in QFPs, which requires high mounting accuracy and requires high camera magnification to precisely observe the edges of the four corners of the chip.

[Brief explanation of drawings]

The figures show embodiments of the present invention, in which FIG. 1 is a perspective view of an electronic component mounting apparatus, FIGS. 2 and 3 are perspective views and side views during observation, and FIGS. 4 and 5. 6 is a perspective view and a side view of another embodiment during observation, FIG. 6 is a plan view of the field of view of the camera, and FIG. 7 is a perspective view of a conventional device. 3... Substrate 4... Positioning part 7... Knob supply part 9... Nozzle 10... Transfer head 11.14... Optical element 12... Light source part 133-13d... ·camera

Claims (1)

[Claims] An electronic component mounting apparatus comprising a chip supply section, a substrate positioning section, and a transfer head that adsorbs a chip from the chip supply section to a nozzle and transfers and mounts it on the substrate of the positioning section,
An optical element is provided below the transfer path of the transfer head to refract the light irradiated from above onto the chip adsorbed by the nozzle in four directions. An electronic component mounting apparatus characterized by being provided with four cameras that observe the edges of the four corners of a chip by incident refracted light.